Packaging assembly

Abstract

The embodiment of the invention provides a packaging assembly. The packaging assembly comprises a box body and a buffering piece. The buffering piece is arranged in the box body and used for separating the box body from the piece to be packaged. The buffering piece comprises a bottom buffering layer and a side wall buffering layer, and the bottom buffering layer and the side wall buffering layer jointly define a containing space used for containing a piece to be packaged. The side wall buffer layer extends from the bottom buffer layer to the direction far away from the bottom buffer layer and is fixedly connected with the box body; at least one first communication structure is arranged between the bottom buffer layer and each side wall buffer layer; the buffer piece has an initial state and a first use state; when the buffer piece is in an initial state, the bottom buffer layer is filled with gas, and the first communication structure is closed; when the buffer part is in the first use state, the first communication structure is opened, so that part of gas in the bottom buffer layer enters the side wall buffer layer to limit displacement of the to-be-packaged part in the first direction and the second direction, the same packaging assembly can contain display modules with more boundary dimensions, and the compatibility of the packaging assembly is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging, and particularly to a packaging component. Background Art

[0002] In the related art, display modules are usually transported in packaging boxes, and the display modules are vertically inserted into the packaging boxes. In order to ensure that the display modules will not be deformed during transportation or testing, the gap between the display modules and the packaging boxes needs to be very small, which results in that display modules with greatly different external dimensions cannot be adapted to the same packaging box, and the compatibility of the packaging box is low. Multiple packaging boxes need to be designed to meet display modules with different external dimensions, and each packaging box needs to be re-molded, thus resulting in high costs. Summary of the Invention

[0003] The purpose of the embodiments of the present invention is to provide a packaging component to improve the compatibility of the packaging component. The specific technical solution is as follows:

[0004] An embodiment of the present application provides a packaging component, including a box body and a buffer member; the buffer member is arranged in the box body and is used to separate the box body and the item to be packaged; the buffer member includes a bottom buffer layer and at least one sidewall buffer layer, and the two jointly enclose an accommodation space for accommodating the item to be packaged; the sidewall buffer layer extends away from the bottom buffer layer and is fixedly connected to the box body; at least one first communication structure is arranged between the bottom buffer layer and each sidewall buffer layer; the buffer member has an initial state and a first use state; when the buffer member is in the initial state, the bottom buffer layer is filled with gas and the first communication structure is closed; when the buffer member is in the first use state, the first communication structure is opened, so that part of the gas in the bottom buffer layer enters the sidewall buffer layer, and the sidewall buffer layer is inflated to form an elastic sidewall to limit the displacement of the item to be packaged in a first direction and a second direction; the first direction, the second direction and the height direction of the box body are perpendicular to each other.

[0005] In some embodiments of the present application, the bottom buffer layer includes: a first bottom buffer layer; the first bottom buffer layer is connected to the sidewall buffer layer, and the first communication structure is arranged between the two;

[0006] When the buffer member is in the initial state, the first bottom buffer layer is filled with gas and the first communication structure is closed; when the buffer member is in the first use state, the first communication structure is opened, so that part of the gas in the first bottom buffer layer enters the sidewall buffer layer to limit the displacement of the item to be packaged in the first direction and the second direction.

[0007] In some embodiments of the present application, the first bottom buffer layer has a plurality of first air cavities, and each of the first air cavities is correspondingly arranged with a side wall buffer layer and a first communication structure.

[0008] In some embodiments of the present application, the bottom buffer layer includes: a first bottom buffer layer and a second bottom buffer layer;

[0009] The first bottom buffer layer is connected to the side wall buffer layer, and the first communication structure is provided therebetween;

[0010] The second bottom buffer layer is arranged on a side of the first bottom buffer layer away from the side wall buffer layer and is connected to the side wall buffer layer; a plurality of second communication structures are provided between the second bottom buffer layer and the side wall buffer layer;

[0011] The buffer member further has a second use state;

[0012] When the buffer member is in the initial state, the first bottom buffer layer and the second bottom buffer layer are filled with gas, and the first communication structure and the second communication structure are closed; when the buffer member is in the first use state, the first communication structure is opened and the second communication structure is closed, so that at least part of the gas in the first bottom buffer layer enters the side wall buffer layer to limit the displacement of the item to be packaged in the first direction and the second direction; when the buffer member is in the second use state, the first communication structure and at least part of the second communication structures are opened, so that at least part of the gas in the second bottom buffer layer enters the side wall buffer layer through the second communication structures.

[0013] In some embodiments of the present application, the first bottom buffer layer has a plurality of first air cavities, and each of the first air cavities is correspondingly arranged with at least one side wall buffer layer and at least one first communication structure;

[0014] The second bottom buffer layer has a plurality of second air cavities, and each of the second air cavities is correspondingly arranged with at least one side wall buffer layer and at least one second communication structure.

[0015] In some embodiments of the present application, the at least one side wall buffer layer includes: a first side wall buffer layer, a second side wall buffer layer, a third side wall buffer layer, and a fourth side wall buffer layer;

[0016] The first bottom buffer layer has a first side and a second side opposite to each other in the first direction, and a third side and a fourth side opposite to each other in the second direction; at least one of the first side wall buffer layers is provided on the first side, at least one of the second side wall buffer layers is provided on the second side, at least one of the third side wall buffer layers is provided on the third side, and at least one of the fourth side wall buffer layers is provided on the fourth side;

[0017] The buffer member has a dimension in the second direction that is greater than its dimension in the first direction;

[0018] The sum of the lengths of all the first side wall buffer layers and all the second side wall buffer layers in the second direction is greater than or equal to one-third of the length of the buffer member in the second direction.

[0019] In some embodiments of the present application, the lengths of the first side wall buffer layer and the second side wall buffer layer in the second direction are equal;

[0020] and / or, the lengths of the third side wall buffer layer and the fourth side wall buffer layer in the first direction are equal.

[0021] In some embodiments of the present application, the number of the second side wall buffer layers is two, and there is a gap between the two second side wall buffer layers in the second direction;

[0022] The number of the first side wall buffer layers is one, and the first side wall buffer layer is disposed opposite to the gap between the two second side wall buffer layers.

[0023] In some embodiments of the present application, the first communication structure includes:

[0024] A first channel, which is respectively connected to the bottom buffer layer and the side wall buffer layer;

[0025] A first repeatedly reattachable solvent-based glue coating is disposed in the first channel; the first repeatedly reattachable solvent-based glue coating can paste all the inner walls of the first channel together to close the first communication structure, and can also separate from a part of the inner walls of the first channel under gas pressure to open the first communication structure.

[0026] In some embodiments of the present application, the first communication structure includes:

[0027] A first channel, which is respectively connected to the first bottom buffer layer and the side wall buffer layer;

[0028] A first reusable solvent-based adhesive coating is disposed within the first channel; the first reusable solvent-based adhesive coating is capable of adhering all inner walls of the first channel together to close the first communication structure, and is also capable of separating from a partial inner wall of the first channel under gas pressure to open the first communication structure;

[0029] The second communication structure includes:

[0030] A second channel, respectively connected to the second bottom buffer layer and the side wall buffer layer;

[0031] A second reusable solvent-based adhesive coating is disposed within the second channel; the second reusable solvent-based adhesive coating is capable of adhering all inner walls of the second channel together to close the second communication structure, and is also capable of separating from a partial inner wall of the second channel under gas pressure to open the second communication structure.

[0032] In some embodiments of the present application, the viscosity of the first reusable solvent-based adhesive coating is lower than that of the second reusable solvent-based adhesive coating.

[0033] In some embodiments of the present application, the material of the box body is foam; the buffer member is prepared from an elastic film layer.

[0034] In some embodiments of the present application, the box body includes: a buckled upper box body and a lower box body;

[0035] A plurality of lower accommodation grooves are provided within the lower box body, and one of the buffer members is provided within each of the lower accommodation grooves, and the side wall buffer layer of the buffer member is fixedly connected to the side wall of the lower accommodation groove;

[0036] A plurality of upper accommodation grooves are provided within the upper box body, and each of the upper accommodation grooves is provided corresponding to each of the lower accommodation grooves one by one to jointly accommodate the item to be packaged with the lower accommodation groove.

[0037] Advantageous effects of the embodiments of the present invention:

[0038] In the packaging assembly of the embodiment of the present application, since the buffer part is in elastic contact with the display module, the buffer part has a buffering effect. During transportation, the display module can be allowed to shake to a certain extent in the packaging assembly, and the display module and the buffer part will not be damaged or deformed when colliding, so that the gap between the display module and the side wall buffer layer does not need to be designed to be very small, and the gap between the two can be larger than the gap between the display module and the inner wall of the packaging box in the related art, so that the same packaging assembly can accommodate display modules of more external dimensions, thereby improving the compatibility of the packaging assembly, and can directly be compatible with display modules with similar product sizes; for display modules with large differences in product sizes, by adjusting the amount of gas in the bottom buffer layer, the amount of gas entering the side wall buffer layer in the first use state can be adjusted, thereby adjusting the thickness of the side wall buffer layer; by adjusting the buffer part to be compatible with products in a wider size range, the compatibility of the packaging assembly is improved, and display modules with large differences in external dimensions can also be adapted to the same packaging box, and there is no need to design multiple boxes to meet the needs of display modules with different external dimensions, and there is no need to re-open the mold, thereby reducing costs.

[0039] Of course, it is not necessary to achieve all of the advantages described above at the same time to implement any product or method of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0041] Figure 1a This is a schematic diagram of assembling a packaging component and a display module according to an embodiment of the present application;

[0042] Figure 1b for Figure 1a Exploded diagram of

[0043] Figure 1c for Figure 1a AA section view;

[0044] Figure 2a This is a schematic diagram of the installation of the lower box and the buffer member in the embodiment of the present application;

[0045] Figure 2b for Figure 2a BB cross-sectional view;

[0046] Figure 2c for Figure 2a CC section view;

[0047] Figure 2d forFigure 2a D-D cross-sectional view;

[0048] Figure 3a Front view of the buffer member in the embodiment of the present application;

[0049] Figure 3b is Figure 3a Top view of the buffer member shown;

[0050] Figure 3c is Figure 3a Side view of the buffer member shown;

[0051] Figure 3d is Figure 3a E-E cross-sectional view of the buffer member shown;

[0052] Figure 4a is Figure 3a Schematic diagram of the installation relationship between the buffer member and the display module shown;

[0053] Figure 4b is Figure 4a Top view;

[0054] Figure 4c is Figure 4a Side view;

[0055] Figure 4d is Figure 4a H-H cross-sectional view;

[0056] Figure 5a is Figure 2a Top view of the lower box of the packaging assembly shown after loading the display module (the buffer member is in the first use state);

[0057] Figure 5b is Figure 5a F-F cross-sectional view;

[0058] Figure 5c is Figure 5a G-G cross-sectional view;

[0059] Figure 5d Schematic diagram of the installation of the lower box, buffer member and display module in the embodiment of the present application (the buffer member is in the first use state);

[0060] Figure 6 Schematic diagram of the installation of the lower box, buffer member and display module in the embodiment of the present application (the buffer member is in the second use state);

[0061] Figure 7a is Figure 3a Schematic diagram of the connection relationship between the first bottom buffer layer and the side wall buffer layer of the buffer member shown;

[0062] Figure 7b is Figure 7a a schematic structural view of the first communication structure of the buffer member shown;

[0063] Figure 8 is Figure 3a a schematic view of the connection relationship between the second bottom buffer layer and the side wall buffer layer of the buffer member shown;

[0064] Figure 9a a schematic structural view of the box body in the embodiment of the present application;

[0065] Figure 9b is Figure 1a the I-I sectional view of;

[0066] Figure 9c a schematic structural view of the upper box body in the embodiment of the present application;

[0067] Figure 9d a schematic structural view of the lower box body in the embodiment of the present application;

[0068] Figure 9e is Figure 9d the top view of;

[0069] Figure 9f is Figure 9d the side view of;

[0070] Figure 9g is Figure 9d the front view after the lower box body shown is loaded with the display module;

[0071] Figure 10 is Figure 2a the J-J sectional view of;

[0072] Figure 11 a schematic structural view of the buffer member in another embodiment of the present application.

[0073] Explanation of reference numerals:

[0074] Packaging assembly 1; Box body 100; Upper box body 110; Upper accommodation groove 111; Concave structure 112; First opening 113; Lower box body 120; Lower accommodation groove 121; Groove bottom 1211; First groove wall 1212; First side wall buffer layer accommodation groove 1212a; Second groove wall 1213; Second side wall buffer layer accommodation groove 1213a; Third groove wall 1214; Third side wall buffer layer accommodation groove 1214a; Fourth groove wall 1215; Fourth side wall buffer layer accommodation groove 1215a; Lower accommodation groove partition wall 122; Protrusion structure 123; Second opening 124; Third opening 125;

[0075] Buffer member 200; bottom buffer layer 210; first bottom buffer layer 211; first air cavity 2111; first air cavity one 2111a; first air cavity two 2111b; first air cavity three 2111c; first air cavity four 2111d; first air cavity five 2111e; second bottom buffer layer 212; second air cavity 2121; second air cavity one 2121a; second air cavity two 2121b; second air cavity three 2121c; side wall buffer layer 220; first side wall buffer layer 221; second side wall buffer layer 222; third side wall buffer layer 223; fourth side wall buffer layer 224; first communication structure 230; first channel 231; first repeatedly reattachable solvent-based glue coating 232; first side 240; second side 250; third side 260; fourth side 270; second communication structure 280; second channel 281;

[0076] Item to be packaged 2; display module 21. Specific implementation mode

[0077] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art based on this application belong to the protection scope of the present invention.

[0078] In the related art, display modules are usually transported in packaging boxes, and the display modules are inserted vertically into the packaging boxes. In order to ensure that the display modules will not be deformed during transportation or testing, the gap between the display modules and the packaging boxes needs to be very small, which results in that display modules with significantly different external dimensions cannot be adapted to the same packaging box, and the compatibility of the packaging boxes is low. Multiple packaging boxes need to be designed to meet different external dimensions of display modules, and each packaging box needs to be molded again, thus resulting in high costs. The external dimensions of the display module are affected by product characteristics and component layout. Fine-tuning the external dimensions or changing the height of the components may cause the packaging boxes not to be shared, and new molds or repaired molds need to be corresponding. There may be multiple packaging boxes for 27-inch displays of the same model product. The cost of multiple moldings is high and there are many materials, and the factory management cost is high.

[0079] To solve the above technical problems, the embodiments of the present application provide a packaging component, which will be described in detail below:

[0080] As Figures 1a to 4d shown, the embodiments of the present application propose a packaging component 1. As Figures 1a to 1c shown, Figure 1a is the assembly diagram of the packaging component 1 of the embodiments of the present application and the display module 21. Figure 1b For Figure 1a exploded view,Figure 1c As Figure 1a shown in the sectional view taken along line A-A, the packaging assembly 1 includes a box body 100 and a buffer member 200. Specifically, the buffer member 200 is disposed within the box body 100 and is used to separate the box body 100 from the item to be packaged 2; as Figures 1c to 2d shown Figure 2a is the installation schematic diagram of the lower box body 120 and the buffer member 200 in the embodiment of the present application, Figure 2b as Figure 2a shown in the sectional view taken along line B-B, Figure 2c as Figure 2a shown in the sectional view taken along line C-C, Figure 2d as Figure 2a shown in the sectional view taken along line D-D, the buffer member 200 includes a bottom buffer layer 210 and at least one side wall buffer layer 220, and the two jointly enclose a receiving space for receiving the item to be packaged 2; the side wall buffer layer 220 extends away from the bottom buffer layer 210 and is fixedly connected to the box body 100; as Figures 3a to 3d shown Figure 3a is the front view of the buffer member 200 in the embodiment of the present application, Figure 3b as Figure 3a shown in the top view of the buffer member 200, Figure 3c as Figure 3a shown in the side view of the buffer member 200, Figure 3d as Figure 3a shown in the sectional view taken along line E-E of the buffer member 200, at least one first communication structure 230 is provided between the bottom buffer layer 210 and each side wall buffer layer 220.

[0081] The buffer member 200 has an initial state and a first use state; as Figures 3a to 3d shown, when the buffer member 200 is in the initial state, the bottom buffer layer 210 is filled with gas and the first communication structure 230 is closed; as Figures 4a to 4d shown Figure 4a as Figure 3a shown in the installation relationship schematic diagram of the buffer member 200 and the display module 21, Figure 4b as Figure 4a shown in the top view, Figure 4c as Figure 4a shown in the side view, Figure 4d as Figure 4a shown in the sectional view taken along line H-H, when the buffer member 200 is in the first use state, the first communication structure 230 is opened so that a part of the gas in the bottom buffer layer 210 enters the side wall buffer layer 220, and the side wall buffer layer 220 is inflated to form an elastic side wall to limit the displacement of the item to be packaged 2 in the first direction X and the second direction Y; the first direction X, the second direction Y and the height direction of the box body 100 are perpendicular to each other. The first direction X can be the width direction of the box body 100, and the second direction Y can be the length direction of the box body 100.

[0082] The packaging component 1 according to the embodiment of the present application includes a box body 100 and a buffer member 200. The buffer member 200 is disposed inside the box body 100 and is used to separate the box body 100 and the item to be packaged 2. The item to be packaged 2 may be a display module 21, a display device, etc. Taking the display module 21 as an example; the buffer member 200 includes a bottom buffer layer 210 and at least one sidewall buffer layer 220. The two jointly enclose an accommodation space for accommodating the item to be packaged 2. The sidewall buffer layer 220 extends from the bottom buffer layer 210 in a direction away from the bottom buffer layer 210 and is fixedly connected to the box body 100 to prevent the buffer member 200 from shifting in position during use. At least one first communication structure 230 is provided between the bottom buffer layer 210 and each sidewall buffer layer 220. The first communication structure 230 is used to communicate or separate the inner cavities of the bottom buffer layer 210 and the sidewall buffer layer 220; when the buffer member 200 is in an initial state and there is no display module 21 in the packaging structure 1, the bottom buffer layer 210 is filled with gas and the first communication structure 230 is closed; when the display module 21 is installed in the packaging component 1, the buffer member 200 is in a first use state. Under the action of the gravity of the display module 21, the display module 21 presses the bottom buffer layer 210, and the air pressure causes the first communication structure 230 to open. Part of the gas in the bottom buffer layer 210 enters the sidewall buffer layer 220, and the sidewall buffer layer 220 is inflated to form an elastic sidewall to limit the displacement of the display module 21 in the first direction X and the second direction Y. The display module 21 is in elastic contact with the sidewall buffer layer 220. At the same time, there is still part of the gas in the bottom buffer layer 210, so that the buffer member 200 can play a good buffering role for the display module 21 on the sidewall and the bottom.

[0083] Compared with the packaging solution in the related art where the display module is directly inserted vertically into the packaging box and the display module is in rigid contact with the packaging box, in the packaging component 1 according to the embodiment of the present application, since the buffer member 200 is in elastic contact with the display module 21 and the buffer member 200 has a buffering effect, during transportation, the display module 21 can be allowed to have a certain degree of shaking in the packaging component 1. The display module 21 and the buffer member 200 will not be damaged or deformed when they collide, so that the gap between the display module 21 and the sidewall buffer layer 220 does not need to be designed very small, and the gap between them can be larger than the gap between the display module and the inner wall of the packaging box in the related art, so that the same packaging component 1 can accommodate more display modules 21 with different outer dimensions, improving the compatibility of the packaging component 1 and directly compatible with display modules 21 with similar product sizes; the unilateral gap between the display module and the inner wall of the packaging box in the related art is 0.5 - 0.8 mm; when the buffer member 200 in the embodiment of the present application is in the first use state, such as Figure 1cAs shown, the unilateral gap a between the display module 21 and the sidewall buffer layer 220 is 0 - 3 mm, which can be compatible with the difference in external dimensions of 0 - 6 mm. The unilateral gap refers to the distance between any side of the display module and the corresponding sidewall buffer layer 220 in the embodiment of the present application or the inner wall of the packaging box in the related art.

[0084] For the display module 21 with a large difference in product size, such as a product size difference greater than 6 mm, by adjusting the amount of gas in the bottom buffer layer 210, the amount of gas entering the sidewall buffer layer 220 in the first use state can be adjusted, thereby adjusting the thickness of the sidewall buffer layer 220. For example, the amount of gas in the bottom buffer layer 210 can be reduced to thin the sidewall buffer layer 220 to accommodate a display module 21 with a larger external dimension, or the amount of gas in the bottom buffer layer 210 can be increased to thicken the sidewall buffer layer 220 to accommodate a display module 21 with a smaller external dimension. By adjusting the buffer member 200 to be compatible with products in a wider size range, the compatibility of the packaging assembly 1 is improved. Display modules 21 with a large difference in external dimensions can also be adapted to the same packaging box, eliminating the need to design multiple types of boxes 100 to meet different external dimensions of display modules 21, and thus eliminating the need for re - tooling, which reduces costs.

[0085] Moreover, compared with the packaging solution in the related art where the display module is in direct contact with the sidewall of the packaging box, in the packaging assembly 1 of the embodiment of the present application, the display module 21 is limited by the buffer member 200, and the buffer performance is greatly improved, which can prevent the backplane (not shown in the figure) in the display module 21 from deforming.

[0086] In addition, before the display module 21 is loaded into the packaging assembly 1, the first communication structure 230 is closed, and there is no gas in the sidewall buffer layer 220, making the accommodation space of the packaging assembly 1 larger. This facilitates the operator to place the display module 21 into the accommodation space of the packaging assembly 1, enabling rapid operation and corresponding, reducing the operation man - hours, and improving the operation efficiency. Compared with the unilateral gap of 0.5 - 0.8 mm between the display module and the inner wall of the packaging box in the related art, the unilateral gap a of the packaging assembly 1 in the embodiment of the present application is larger. When the buffer member 200 is in the first use state, the unilateral gap a between the sidewall buffer layer 220 and the side of the display module 21 can be 0 - 3 mm, with a larger movable gap, which is more convenient for the operator to take out the display module 21 from the accommodation space of the packaging assembly 1. The operator can perform rapid operation and corresponding, reduce the operation man - hours, and improve the operation efficiency.

[0087] Optionally, the side of the sidewall buffer layer 220 close to the box body 100 can be adhesively fixed to the box body 100.

[0088] In some embodiments of the present application, as Figures 3a to 6 shown, Figure 5a forFigure 2a Top view of the lower box body 120 of the packaging component 1 shown after the display module 21 is installed (the buffer member 200 is in the first use state), Figure 5b is Figure 5a F-F cross-sectional view of Figure 5c is Figure 5a G-G cross-sectional view of Figure 5d Installation schematic diagram of the lower box body 120, the buffer member 200 and the display module 21 according to an embodiment of the present application (the buffer member 200 is in the first use state), Figure 6 Installation schematic diagram of the lower box body 120, the buffer member 200 and the display module 21 according to an embodiment of the present application (the buffer member 200 is in the second use state). The bottom buffer layer 210 includes a first bottom buffer layer 211 and a second bottom buffer layer 212; the first bottom buffer layer 211 is connected to the side wall buffer layer 220, and a first communication structure 230 is provided therebetween; the second bottom buffer layer 212 is disposed on a side of the first bottom buffer layer 211 away from the side wall buffer layer 220 and is connected to the side wall buffer layer 220; a plurality of second communication structures 280 are provided between the second bottom buffer layer 212 and the side wall buffer layer 220. The buffer member 200 further has a second use state; when the buffer member 200 is in the initial state, the first bottom buffer layer 211 and the second bottom buffer layer 212 are filled with gas, and the first communication structure 230 and the second communication structure 280 are closed. The structure of the buffer member 200 in the initial state is as shown in Figures 3a to 3d shown; when the buffer member 200 is in the first use state, the first communication structure 230 is opened and the second communication structure 280 is closed, so that at least part of the gas in the first bottom buffer layer 211 enters the side wall buffer layer 220 to limit the displacement of the item to be packaged 2 in the first direction X and the second direction Y. The positional relationship between the buffer member 200 in the first use state and the display module 21 is as shown in Figures 4a to 5d shown; when the buffer member 200 is in the second use state, the first communication structure 230 and at least part of the second communication structure 280 are opened, so that at least part of the gas in the second bottom buffer layer 212 enters the side wall buffer layer 220 through the second communication structure 280. The positional relationship between the buffer member 200 in the second use state and the display module 21 is as shown in Figure 6 shown.

[0089] When the buffer member 200 is in the initial state, that is, before the display module 21 is installed in the packaging component 1, the first bottom buffer layer 211 and the second bottom buffer layer 212 are filled with gas, and the first communication structure 230 and the second communication structure 280 are closed; at this time, the gas in the first bottom buffer layer 211 and the second bottom buffer layer 212 cannot enter the side wall buffer layer 220, and there is no gas in the side wall buffer layer 220.

[0090] When the buffer member 200 is in the first usage state, that is, after the display module 21 is loaded into the packaging assembly 1, due to the gravity of the display module 21 itself, the display module 21 is placed on the first bottom buffer layer 211, squeezing the gas in the first bottom buffer layer 211, causing the gas in the first bottom buffer layer 211 to squeeze the first communication structure 230, so that the first communication structure 230 is opened. At this time, the second communication structure 280 is still closed, and at least part of the gas in the first bottom buffer layer 211 enters the side wall buffer layer 220 to limit the displacement of the display module 21 in the first direction X and the second direction Y. The positional relationship between the display module 21 and the buffer member 200 is as Figure 4d shown. The first communication structure 230 always remains open. All the gas in the first bottom buffer layer 211 can enter the side wall buffer layer 220, and the second bottom buffer layer 212 serves as the bottom buffer; or part of the gas in the first bottom buffer layer 211 can enter the side wall buffer layer 220, and the first bottom buffer layer 211 and the second bottom buffer layer 212 jointly serve as the bottom buffer.

[0091] When the buffer member 200 is in the second usage state, that is, when the packaging assembly 1 with the display module 21 is subjected to large bumps and strong vibration impact intensity during transportation, the display module 21 bouncing violently up and down in the packaging assembly 1 will cause the second bottom buffer layer 212 to be subjected to a large impact. The gas in the second bottom buffer layer 212 squeezes the second communication structure 280, so that at least part of the second communication structure 280 is impacted and opened. At least part of the gas in the second bottom buffer layer 212 enters the side wall buffer layer 220 through the second communication structure 280, further limiting the displacement of the display module 21 in the first direction X and the second direction Y to provide secondary protection for the display module 21. The positional relationship between the display module 21 and the buffer member 200 is as Figure 6As shown. When the display module 21 is being transported normally, the gas in the second bottom buffer layer 212 can serve as bottom buffering. When the buffer member 200 is in the second usage state, the gas in the second bottom buffer layer 212 enters the sidewall buffer layer 220 through the second communication structure 280, and the sidewall buffer layer 220 expands until there is a 0-gap between it and the display module 21, or further expands on the basis of a 0-gap between the buffer layer 220 and the display module 21 to squeeze and fix the display module 21, so that the sidewall buffer layer 220 and the display module 21 are in close contact. That is, when the buffer member 200 is in the first usage state and the unilateral gap a between the sidewall buffer layer 220 and the display module 21 is 0 mm, the expansion of the sidewall buffer layer 220 in the second usage state can further limit the display module 21; when the buffer member 200 is in the first usage state and the unilateral gap a between the sidewall buffer layer 220 and the display module 21 is greater than 0 mm and less than 3 mm, the sidewall buffer layer 220 in the second usage state expands until there is a 0-gap between it and the display module 21, completely limiting the display module 21 in the front, back, left, and right directions. At the same time, the remaining gas in the second bottom buffer layer 212 serves as bottom buffering, preventing the vibration or impact during transportation from causing external forces on the display module 21, providing secondary protection for the display module 21, preventing the display module 21 from being damaged and deformed due to impact during transportation, and providing a higher level of protection for the display module 21.

[0092] In some embodiments of the present application, return to reference Figures 3a to 3c , at least one sidewall buffer layer 220 includes a first sidewall buffer layer 221, a second sidewall buffer layer 222, a third sidewall buffer layer 223, and a fourth sidewall buffer layer 224; the first bottom buffer layer 211 has a first side 240 and a second side 250 opposite to each other in the first direction X, and a third side 260 and a fourth side 270 opposite to each other in the second direction Y; at least one first sidewall buffer layer 221 is provided on the first side 240, at least one second sidewall buffer layer 222 is provided on the second side 250, at least one third sidewall buffer layer 223 is provided on the third side 260, and at least one fourth sidewall buffer layer 224 is provided on the fourth side 270; the first sidewall buffer layer 221 and the second sidewall buffer layer 222 are arranged on the first side 240 and the second side 250 opposite to each other in the first direction X of the first bottom buffer layer 211, and the third sidewall buffer layer 223 and the fourth sidewall buffer layer 224 are arranged on the third side 260 and the fourth side 270 opposite to each other in the second direction Y of the first bottom buffer layer 211, thereby realizing the formation of buffer structures around and at the bottom of the display module 21 to provide a better buffering effect on the display module 21.

[0093] The dimension L1 of the buffer member 200 in the second direction Y is greater than its dimension L2 in the first direction X; the sum of the lengths of all the first sidewall buffer layers 221 and all the second sidewall buffer layers 222 in the second direction Y is greater than or equal to one-third of the length L1 of the buffer member 200 in the second direction Y. That is, as Figure 3a shown, the sum of the lengths d1 of all the first sidewall buffer layers 221 in the second direction Y, added to the sum of the lengths d2 of all the second sidewall buffer layers 222 in the second direction Y, results in a length that is greater than or equal to one-third of the length L1 of the buffer member in the second direction, which can ensure a better buffering effect and protective effect on the display module 21.

[0094] In some embodiments of the present application, as Figure 3a and Figure 3b shown, at least one sidewall buffer layer 220 includes a first sidewall buffer layer 221, a second sidewall buffer layer 222, a third sidewall buffer layer 223, and a fourth sidewall buffer layer 224; among them, the number of the second sidewall buffer layers 222 is two, and there is a gap between the two second sidewall buffer layers 222 in the second direction Y; the number of the first sidewall buffer layers 221 is one, and the gap between the first sidewall buffer layer 221 and the two second sidewall buffer layers 222 is arranged opposite to each other, that is, the two second sidewall buffer layers 222 are arranged staggeredly with the first sidewall buffer layer 221. On the one hand, it can better limit the displacement of the display module 21 in the first direction X and the second direction Y, and thus better protect the display module 21 during transportation; on the other hand, it can also save the material of the buffer member 200 and reduce the manufacturing cost.

[0095] Figure 3a In the embodiment shown, the shapes of the sidewall buffer layers 220 are all L-shaped, the number of the sidewall buffer layers 220 is five, and the second sidewall buffer layers 222 are arranged staggeredly with the first sidewall buffer layer 221.

[0096] In some other embodiments of the present application, the buffer member 200 may also have only one sidewall buffer layer 220, and the sidewall buffer layer 220 is annular and connected to the edge of the first bottom buffer layer 211 to isolate the display module 21 and the box body 100; the number of the sidewall buffer layers 220 may also be two, three, four or other numbers; the second sidewall buffer layer 222 and the first sidewall buffer layer 221 may also be arranged opposite to each other or partially overlapped, as long as the usage requirements can be met, and the present application does not make any limitations in this regard.

[0097] As Figure 3a and Figure 3bAs shown, the lengths of the first sidewall buffer layer 221 and the second sidewall buffer layer 222 in the second direction Y are equal; and / or, the lengths of the third sidewall buffer layer 223 and the fourth sidewall buffer layer 224 in the first direction X are equal. The shape is more regular, which is beneficial to processing, making the forces on each side of the display module 21 more uniform, and can play a better buffering and protective role for the display module 21.

[0098] In some embodiments of the present application, as Figures 3a to 3c shown, the first bottom buffer layer 211 has a plurality of first air cavities 2111, and each first air cavity 2111 is correspondingly arranged with at least one sidewall buffer layer 220 and at least one first communication structure 230; the second bottom buffer layer 212 has a plurality of second air cavities 2121, and each second air cavity 2121 is correspondingly arranged with at least one sidewall buffer layer 220 and at least one second communication structure 280. That is, the gas in each first air cavity 2111 of the first bottom buffer layer 211 can enter a corresponding sidewall buffer layer 220 through the corresponding first communication structure 230, and the gas in each second air cavity 2121 of the second bottom buffer layer 212 can enter at least one corresponding sidewall buffer layer 220 through the corresponding at least one second communication structure 280, so as to accurately control the amount of gas entering each sidewall buffer layer 220, thereby ensuring that there is enough gas in each sidewall buffer layer 220, and the gas in each sidewall buffer layer 220 is more uniform, so as to limit the displacement of the display module 21 in the first direction X and the second direction Y, and prevent the situation that the display module 21 collides with the box body 100 due to insufficient gas amount in the sidewall buffer layer 220 resulting in insufficient limiting of the display module 21.

[0099] Specifically, as Figure 3a and Figure 3b shown, the first bottom buffer layer 211 may be provided with five first air cavities 2111, and the five first air cavities 2111 are arranged in parallel in the second direction Y of the buffer member 200 in sequence, namely: the first air cavity one 2111a, the first air cavity two 2111b, the first air cavity three 2111c, the first air cavity four 2111d and the first air cavity five 2111e. The second bottom buffer layer 212 may be provided with three second air cavities 2121, and the three second air cavities 2121 are arranged in parallel in the second direction Y of the buffer member 200 in sequence, namely: the second air cavity one 2121a, the second air cavity two 2121b and the second air cavity three 2121c.

[0100] The first air cavity 2111a is connected to the third sidewall buffer layer 223 through a first communication structure 230 provided on the third side 260 of the first bottom buffer layer 211; the second air cavity 2111b and the fourth air cavity 2111d are respectively connected to a second sidewall buffer layer 222 through a first communication structure 230 provided on the second side 250 of the first bottom buffer layer 211; the third air cavity 2111c is connected to the first sidewall buffer layer 221 through a first communication structure 230 provided on the first side 240 of the first bottom buffer layer 211; the fifth air cavity 2111e is connected to the fourth sidewall buffer layer 224 through a first communication structure 230 provided on the fourth side 270 of the first bottom buffer layer 211.

[0101] The second air cavity 2121a is connected to a third sidewall buffer layer 223 through a second communication structure 280 provided on the third side 260 of the first bottom buffer layer 211, and is connected to a second sidewall buffer layer 222 through a second communication structure 280 provided on the second side 250 of the first bottom buffer layer 211; the second air cavity 2121b is connected to the first sidewall buffer layer 221 through a second communication structure 280 provided on the first side 240 of the first bottom buffer layer 211; the second air cavity 2121c is connected to a second sidewall buffer layer 222 through a second communication structure 280 provided on the second side 250 of the first bottom buffer layer 211, and is connected to the fourth sidewall buffer layer 224 through a second communication structure 280 provided on the fourth side 270 of the first bottom buffer layer 211.

[0102] In some other embodiments of the present application, the first bottom buffer layer 211 and the second bottom buffer layer 212 may not be divided into air cavities, that is, both the first bottom buffer layer 211 and the second bottom buffer layer 212 have only one air cavity. The first bottom buffer layer 211 conveys gas to each sidewall buffer layer 220 through one air cavity, and the second bottom buffer layer 212 also conveys gas to each sidewall buffer layer 220 through one air cavity.

[0103] Such as Figure 7a and Figure 7b shown, Figure 7a is Figure 3a a schematic diagram of the connection relationship between the first bottom buffer layer 211 of the buffer member 200 and the sidewall buffer layer 220 as shown, Figure 7b is Figure 7aSchematic diagram of the first connection structure 230 of the buffer member 200 shown. The first connection structure 230 includes a first channel 231 and a first repeatedly reattachable solvent-based adhesive coating 232. The first channel 231 is respectively connected to the first bottom buffer layer 211 and the side wall buffer layer 220. The first repeatedly reattachable solvent-based adhesive coating 232 is disposed within the first channel 231 and can paste all the inner walls of the first channel 231 together to close the first connection structure 230. It can also separate from a part of the inner wall of the first channel 231 under gas pressure to open the first connection structure 230, so as to realize the opening and closing of the first connection structure 230.

[0104] Before the display module 21 is loaded into the packaging assembly 1, the buffer member 200 is in an initial state. The first repeatedly reattachable solvent-based adhesive coating 232 pastes all the inner walls of the first channel 231 together, and the first connection structure 230 is closed. At this time, the gas in the first bottom buffer layer 211 cannot enter the side wall buffer layer 220, and there is no gas in the side wall buffer layer 220.

[0105] After the display module 21 is loaded into the packaging assembly 1, the buffer member 200 is in a first use state. The display module 21 squeezes the gas in the first bottom buffer layer 211 under the action of gravity, causing the gas in the first bottom buffer layer 211 to squeeze the first connection structure 230. The first repeatedly reattachable solvent-based adhesive coating 232 separates from a part of the inner wall of the first channel 231 to open the first connection structure 230.

[0106] The first repeatedly reattachable solvent-based adhesive coating 232 can be repeatedly reattached and used. When the display module 21 is taken out of the packaging assembly 1, without the gravity of the display module 21, the first repeatedly reattachable solvent-based adhesive coating 232 re-pastes all the inner walls of the first channel 231 together, and the first connection structure 230 is closed. By manually squeezing the side wall buffer layer 220, the gas therein can be returned to the first bottom buffer layer 211 to make the buffer member 200 return to the initial state, so as to realize the reuse of the packaging assembly 1. The packaging assembly 1 can be reused, which is more cost-saving. Moreover, the setting of the buffer member 200 makes the display module 21 not directly contact the box body 100, and the box body 100 will not be damaged by the display module 21, which further facilitates the recycling and repeated use of the packaging assembly 1.

[0107] As Figure 8 shown, Figure 8 is Figure 3aSchematic diagram of the connection relationship between the second bottom buffer layer 212 and the side wall buffer layer 220 of the buffer member 200 shown. The second communication structure 280 includes a second channel 281 and a second repeatedly reattachable solvent-based adhesive coating (not shown in the figure), which are respectively connected to the second bottom buffer layer 212 and the side wall buffer layer 220; the second repeatedly reattachable solvent-based adhesive coating is disposed in the second channel 281; the second repeatedly reattachable solvent-based adhesive coating can paste all the inner walls of the second channel 281 together to close the second communication structure 280, and can also separate from a part of the inner wall of the second channel 281 under gas pressure to open the second communication structure 280, so as to realize the opening and closing of the second communication structure 280. The connection method of the second channel 281 and the second repeatedly reattachable solvent-based adhesive coating is the same as that of the first channel 231 and the first repeatedly reattachable solvent-based adhesive coating 232.

[0108] After the display module 21 is loaded into the packaging assembly 1, the buffer member 200 is in the first use state. The second repeatedly reattachable solvent-based adhesive coating pastes all the inner walls of the second channel 281 together, and the second communication structure 280 is closed. At this time, the gas in the second bottom buffer layer 212 cannot enter the side wall buffer layer 220.

[0109] When the display module 21 is subjected to large bumps and strong vibration impact intensity during transportation, the display module 21 jumps violently up and down in the packaging assembly 1, causing the second bottom buffer layer 212 to be subjected to a large impact. The gas in the second bottom buffer layer 212 squeezes the second communication structure 280, and the second repeatedly reattachable solvent-based adhesive coating separates from a part of the inner wall of the second channel 281 to open the second communication structure 280.

[0110] The second repeatedly reattachable solvent-based adhesive coating can be repeatedly reattached and used. When the display module 21 is taken out of the packaging assembly 1, without the gravity of the display module 21, the second repeatedly reattachable solvent-based adhesive coating can paste all the inner walls of the second channel 281 together again, and the second communication structure 280 is closed. The gas in it can be returned to the first bottom buffer layer 211 and the second bottom buffer layer 212 by manually squeezing the side wall buffer layer 220, so that the buffer member 200 returns to the initial state, realizing the reuse of the packaging assembly 1.

[0111] In some embodiments of the present application, the viscosity of the first re - adherable solvent - based adhesive coating 232 is lower than that of the second re - adherable solvent - based adhesive coating. That is, the first re - adherable solvent - based adhesive coating 232 has low viscosity, and the second re - adherable solvent - based adhesive coating has high viscosity. There is a viscosity difference between the first re - adherable solvent - based adhesive coating 232 and the second re - adherable solvent - based adhesive coating, enabling the first communication structure 230 and the second communication structure 280 to open when subjected to different pressures. The opening pressure of the second communication structure 280 is greater than that of the first communication structure 230. Thus, when the buffer member 200 is in the first use state, the first communication structure 230 can be opened under the self - weight of the product after the display module 21 is placed, and the second communication structure 280 remains closed. The second communication structure 280 opens only when the packaging assembly 1 is subjected to a large impact.

[0112] Optionally, the first re - adherable solvent - based adhesive coating 232 and the second re - adherable solvent - based adhesive coating can be rubber - based adhesives, such as polyimide, etc. Different viscosities of the same adhesive can be achieved by changing the proportion of chemical components.

[0113] In some embodiments of the present application, the material of the box body 100 is foam; the buffer member 200 is prepared from an elastic film layer and can be an integrally formed structure. Foam has the advantages of light weight and certain buffering properties; the buffer member 200 is prepared from an elastic film layer, so that after the buffer member 200 is inflated, it forms an air - bag structure, and the buffer member 200 elastically contacts the display module 21 to buffer the display module 21.

[0114] Optionally, the elastic film layer can be a PE (polyethylene) or a composite film material of PE and PA (nylon, Polyamide).

[0115] As Figures 9a to 9c shown, Figure 9a is a schematic structural view of the box body 100 in the embodiment of the present application, Figure 9b is Figure 1a the I - I cross - sectional view of Figure 9cThis is a schematic structural diagram of the upper box body 110 in the embodiment of the present application. The box body 100 includes a snap-fitted upper box body 110 and a lower box body 120. A plurality of lower receiving grooves 121 are provided in the lower box body 120, and a buffer member 200 is provided in each lower receiving groove 121. The side wall buffer layer 220 of the buffer member 200 is fixedly connected to the side wall of the lower receiving groove 121. A plurality of upper receiving grooves 111 are provided in the upper box body 110, and each upper receiving groove 111 is arranged in one-to-one correspondence with each lower receiving groove 121 to jointly receive the item to be packaged 2 with the lower receiving groove 121. When the display module 21 is loaded into the lower box body 120 equipped with the buffer member 200, a part of the display module 21 will protrude from the top of the lower box body 120, that is, a part of the display module 21 is exposed outside the lower box body 120. When the upper box body 110 is fastened to the lower box body 120 equipped with the display module 21, the part of the display module 21 that protrudes from the lower box body 120 will be received by the upper receiving groove 111 of the upper box body 110 to complete the packaging of the display module 21.

[0116] As Figure 9a and Figure 9b shown, the shape of each lower receiving groove 121 of the lower box body 120 is adapted to the outer shape of the buffer member 200; as Figure 3b 、 Figure 9d and Figure 9e shown, Figure 9d This is a schematic structural diagram of the lower box body in the embodiment of the present application, Figure 9e is Figure 9d a top view of it. The lower receiving groove 121 has: a groove bottom 1211, a first groove wall 1212 and a second groove wall 1213 opposite to each other in the first direction X, and a third groove wall 1214 and a fourth groove wall 1215 opposite to each other in the second direction Y.

[0117] Specifically, at the position corresponding to the first sidewall buffer layer 221 on the first groove wall 1212, there is a first sidewall buffer layer receiving groove 1212a. The first sidewall buffer layer 221 is placed in the first sidewall buffer layer receiving groove 1212a, and the two are fixedly connected. At the position corresponding to the second sidewall buffer layer 222 on the second groove wall 1213, there is a second sidewall buffer layer receiving groove 1213a. The second sidewall buffer layer 222 is placed in the second sidewall buffer layer receiving groove 1213a, and the two are fixedly connected. The number of the second sidewall buffer layer receiving grooves 1213a is two, and there is a gap between the two second sidewall buffer layer receiving grooves 1213a in the second direction Y; the number of the first sidewall buffer layer receiving grooves 1212a is one, and the gap between the first sidewall buffer layer receiving groove 1212a and the two second sidewall buffer layer receiving grooves 1213a is arranged opposite to each other. At the position corresponding to the third sidewall buffer layer 223 on the third groove wall 1214, there is a third sidewall buffer layer receiving groove 1214a. The third sidewall buffer layer 223 is placed in the third sidewall buffer layer receiving groove 1214a, and the two are fixedly connected. At the position corresponding to the fourth sidewall buffer layer 224 on the fourth groove wall 1215, there is a fourth sidewall buffer layer receiving groove 1215a. The fourth sidewall buffer layer 224 is placed in the fourth sidewall buffer layer receiving groove 1215a, and the two are fixedly connected.

[0118] As Figure 9a and Figure 9b shown, between two adjacent lower receiving grooves 121, there is a lower receiving groove partition wall 122. The height of the lower receiving groove partition wall 122 is higher than the height of the sidewall buffer layer 220 and lower than the height of the lower box body 120, so as to save the material of the lower box body 120 and reduce the manufacturing cost while effectively separating the adjacent lower receiving grooves 121.

[0119] When the buffer member 200 is in the first use state, part of the gas in the first bottom buffer layer 211 enters the sidewall buffer layer 220, and each sidewall buffer layer 220 is expanded, and the expanded thickness is greater than the depth of the corresponding sidewall buffer layer receiving groove, so that the sidewall buffer layer 220 protrudes from the sidewall buffer layer receiving groove toward the inner side of the packaging assembly 1, so as to be able to separate the lower box body 120 from the display module 21, thereby playing a buffering role.

[0120] As Figure 9b 、 Figure 9f and Figure 9g shown, Figure 9f is Figure 9d a side view of Figure 9g is Figure 9dThe front view of the lower box body 120 after the display module 21 is installed. There is a convex structure 123 at the edge of the lower box body 120, and a concave structure 112 at the edge of the upper box body 110. The convex structure 123 is inserted into the concave structure 112, and the two are in contact with each other to realize the upper box body 110 being buckled on the top of the lower box body 120.

[0121] As Figure 9a shown, on the two opposite sides of the upper box body 110 in the second direction Y, there are first openings 113. An operator can take the upper box body 110 through the first openings 113 to remove the upper box body 110 from the lower box body 120 or buckle the upper box body 110 on the lower box body 120. On the two opposite sides of the lower box body 120 in the second direction Y, there are second openings 124. An operator can carry the lower box body 120 alone through the second openings 124, or carry the packaging assembly 1 after the display module 21 is installed through the second openings 124. On the two opposite sides of the lower box body 120 in the first direction X, there are two third openings 125 respectively. An operator can carry the lower box body 120 alone through the third openings 125, or carry the packaging assembly 1 after the display module 21 is installed through the third openings 125.

[0122] As Figure 6 and Figure 10 shown, Figure 10 is Figure 2a the J-J cross-sectional view of. When the display module 21 is placed in the buffer member 200, the height H1 of the side wall buffer layer 220 can be greater than or equal to one-third of the size H2 of the display module 21 in the height direction of the box body 100 and less than the depth H3 of the side wall buffer receiving groove, so as to better limit the display module 21.

[0123] The above embodiment is a double-layer gas buffer layer packaging solution. In another embodiment of the present application, as Figure 11 shown, Figure 11 is the structural schematic diagram of the buffer member 200 in another embodiment of the present application, which is a single-layer gas buffer layer packaging solution. The difference from the previous embodiment is that the bottom buffer layer 210 can also only have the first bottom buffer layer 211 and does not have the second bottom buffer layer 212, and the structure of the corresponding lower receiving groove 121 is somewhat different.

[0124] In another embodiment of the present application, as Figure 11As shown, the bottom buffer layer 210 includes a first bottom buffer layer 211; the first bottom buffer layer 211 is connected to the sidewall buffer layer 220, and a first communication structure 230 (not shown in FIG. 11) is provided therebetween; when the buffer member 200 is in the initial state, the first bottom buffer layer 211 is filled with gas and the first communication structure 230 is closed; when the buffer member 200 is in the first use state, the first communication structure 230 is opened so that some of the gas in the first bottom buffer layer 211 enters the sidewall buffer layer 220 to limit the displacement of the article to be packaged 2 in the first direction X and the second direction Y. The working principle of the buffer member 200 in this embodiment is only different from that of the buffer member 200 in the foregoing embodiment in that, in the foregoing embodiment, when the buffer member 200 is in the first use state, some or all of the gas in the first bottom buffer layer 211 can enter the sidewall buffer layer 220. In this embodiment, when the buffer member 200 is in the first use state, only some of the gas in the first bottom buffer layer 211 enters the sidewall buffer layer 220. Since there is no second bottom buffer layer 212 in this embodiment, when all the gas in the first bottom buffer layer 211 enters the sidewall buffer layer 220, the bottom will not have a buffering effect. The remaining working principles are the same as those in the foregoing embodiment and will not be elaborated here.

[0125] In another embodiment of the present application, the first bottom buffer layer 211 has a plurality of first air cavities 2111, and each first air cavity 2111 is correspondingly provided with a sidewall buffer layer 220 and a first communication structure 230. The first communication structure 230 includes a first channel 231 and a first repeatedly re-adhesive solvent-based glue coating 232. The first channel 231 is respectively connected to the bottom buffer layer 210 and the sidewall buffer layer 220; the first repeatedly re-adhesive solvent-based glue coating 232 is disposed in the first channel 231 and can paste all the inner walls of the first channel 231 together to close the first communication structure 230, and can also separate from some of the inner walls of the first channel 231 under gas pressure to open the first communication structure 230.

[0126] The setting manners of the first bottom buffer layer 211, the sidewall buffer layer 220, and the first communication structure 230 in this embodiment are the same as those in the foregoing embodiment and will not be elaborated here.

[0127] The structure of the box body 100 in this embodiment is only different from that of the box body 100 in the foregoing embodiment in the specific structure of the lower accommodation groove 121. The structure of the lower accommodation groove 121 in this embodiment is adapted to the outer shape of the buffer member 200 in this embodiment.

[0128] The packaging component 1 with high compatibility proposed in the embodiments of the present application is a packaging solution for a box 100 + a gas buffer 200 that can be compatible with multiple product sizes and a wider range of product sizes. The buffer 200 inside the box 100 can improve the cushioning performance; the gap between the display module 21 and the buffer 200 does not need to be designed very small, and the gap between them can be larger than the gap between the display module and the packaging box in the related art, so that the same packaging component 1 can accommodate more display modules 21 with different external dimensions. The display module 21 can be a liquid crystal display module or an OLED display module, etc., and the present application does not make a limitation in this regard. Even if the external dimensions of the product are slightly adjusted or the height of the components is changed, the same packaging component 1 can still be shared, which can be compatible with the change of the product size of the same model from 0 to 6 mm. For products with similar sizes, they can be directly compatible, improving the compatibility of the packaging component 1; for products with large size differences, such as product size differences greater than 6 mm, the amount of gas in the bottom buffer layer 210 can be adjusted, and the thickness of the side wall buffer layer 220 can be adjusted to control the inner diameter of the buffer 200, so as to be compatible with a wider range of product sizes. By adjusting the buffer 200, more product size ranges can be compatible. The external packaging box 100 does not need to be designed by mold opening, and the size of the internal buffer 200 does not need to be adjusted either. Only by adjusting the amount of gas in the bottom buffer layer 210, higher compatibility and versatility can be achieved without mold costs. At the same time, the working gap is increased. When taking and placing products, the gap is relatively large, which can quickly perform corresponding operations, reduce the working hours and improve the working efficiency. Moreover, it is a recyclable gas buffer packaging component.

[0129] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0130] Each embodiment in this specification is described in a related manner. For the same or similar parts between the embodiments, reference can be made to each other. The key point of each embodiment is to illustrate the differences from other embodiments.

[0131] The above are only the preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention are all included within the protection scope of the present invention.

Claims

1. A packaging component, characterized in that, Comprising: A box body and a buffer member; The buffer member is disposed within the box body and is used to separate the box body from the item to be packaged; The buffer member includes a bottom buffer layer and at least one sidewall buffer layer, and the two jointly enclose an accommodation space for accommodating the item to be packaged; the sidewall buffer layer extends away from the bottom buffer layer and is fixedly connected to the box body; at least one first communication structure is provided between the bottom buffer layer and each sidewall buffer layer; The buffer member has an initial state and a first use state; when the buffer member is in the initial state, the bottom buffer layer is filled with gas and the first communication structure is closed; when the buffer member is in the first use state, the first communication structure is opened so that a part of the gas in the bottom buffer layer enters the sidewall buffer layer, and the sidewall buffer layer is inflated to form an elastic sidewall to limit the displacement of the item to be packaged in a first direction and a second direction; The first direction, the second direction and the height direction of the box body are perpendicular to each other.

2. The packaging assembly according to claim 1, wherein The bottom buffer layer includes: a first bottom buffer layer; the first bottom buffer layer is connected to the sidewall buffer layer, and the first communication structure is provided therebetween; When the buffer member is in the initial state, the first bottom buffer layer is filled with gas and the first communication structure is closed; when the buffer member is in the first use state, the first communication structure is opened so that a part of the gas in the first bottom buffer layer enters the sidewall buffer layer to limit the displacement of the item to be packaged in the first direction and the second direction.

3. The packaging assembly according to claim 2, wherein The first bottom buffer layer has a plurality of first air cavities, and each first air cavity is correspondingly provided with a sidewall buffer layer and a first communication structure.

4. The packaging assembly according to claim 1, wherein The bottom buffer layer includes: a first bottom buffer layer and a second bottom buffer layer; The first bottom buffer layer is connected to the sidewall buffer layer, and the first communication structure is provided therebetween; The second bottom buffer layer is disposed on the side of the first bottom buffer layer away from the sidewall buffer layer and is connected to the sidewall buffer layer; a plurality of second communication structures are provided between the second bottom buffer layer and the sidewall buffer layer; The buffer member further has a second use state; When the buffer is in the initial state, the first bottom buffer layer and the second bottom buffer layer are filled with gas, and the first communication structure and the second communication structure are closed; when the buffer is in the first use state, the first communication structure is opened and the second communication structure is closed, so that at least part of the gas in the first bottom buffer layer enters the side wall buffer layer to limit the displacement of the package to be packaged in the first direction and the second direction; when the buffer is in the second use state, the first communication structure and at least part of the second communication structure are opened, so that at least part of the gas in the second bottom buffer layer enters the side wall buffer layer through the second communication structure.

5. The packaging assembly according to claim 4, wherein the first bottom buffer layer has a plurality of first air cavities, and each first air cavity is correspondingly arranged with at least one side wall buffer layer and at least one first communication structure; the second bottom buffer layer has a plurality of second air cavities, and each second air cavity is correspondingly arranged with at least one side wall buffer layer and at least one second communication structure.

6. The packaging assembly according to any one of claims 2-5, wherein the at least one side wall buffer layer includes: a first side wall buffer layer, a second side wall buffer layer, a third side wall buffer layer and a fourth side wall buffer layer; the first bottom buffer layer has a first side and a second side opposite to each other in the first direction, and a third side and a fourth side opposite to each other in the second direction; at least one first side wall buffer layer is provided on the first side, at least one second side wall buffer layer is provided on the second side, at least one third side wall buffer layer is provided on the third side, and at least one fourth side wall buffer layer is provided on the fourth side; the size of the buffer in the second direction is greater than its size in the first direction; the sum of the lengths of all the first side wall buffer layers and all the second side wall buffer layers in the second direction is greater than or equal to one-third of the length of the buffer in the second direction.

7. The packaging assembly according to claim 6, wherein the lengths of the first side wall buffer layer and the second side wall buffer layer in the second direction are equal; and / or, the lengths of the third side wall buffer layer and the fourth side wall buffer layer in the first direction are equal.

8. The packaging assembly according to claim 7, wherein the number of the second side wall buffer layers is two, and there is a gap between the two second side wall buffer layers in the second direction; the number of the first side wall buffer layers is one, and the first side wall buffer layer is arranged opposite to the gap between the two second side wall buffer layers.

9. The packaging assembly according to claim 1, wherein the first communication structure includes: a first channel, which is respectively connected to the bottom buffer layer and the side wall buffer layer; A first re - attachable solvent - based adhesive coating is provided inside the first channel. The first re - attachable solvent - based adhesive coating can paste all the inner walls of the first channel together to close the first communication structure, and can also separate from a part of the inner wall of the first channel under gas pressure to open the first communication structure.

10. The packaging assembly according to claim 4 or 5, wherein The first communication structure includes: A first channel, which is respectively connected to the first bottom buffer layer and the side - wall buffer layer; A first re - attachable solvent - based adhesive coating is provided inside the first channel. The first re - attachable solvent - based adhesive coating can paste all the inner walls of the first channel together to close the first communication structure, and can also separate from a part of the inner wall of the first channel under gas pressure to open the first communication structure; The second communication structure includes: A second channel, which is respectively connected to the second bottom buffer layer and the side - wall buffer layer; A second re - attachable solvent - based adhesive coating is provided inside the second channel. The second re - attachable solvent - based adhesive coating can paste all the inner walls of the second channel together to close the second communication structure, and can also separate from a part of the inner wall of the second channel under gas pressure to open the second communication structure.

11. The packaging assembly according to claim 10, wherein The viscosity of the first re - attachable solvent - based adhesive coating is lower than that of the second re - attachable solvent - based adhesive coating.

12. The packaging assembly according to claim 1, wherein The material of the box body is foam; the buffer member is made of an elastic film layer.

13. The packaging assembly according to claim 1, wherein The box body includes: a buckled upper box body and a lower box body; A plurality of lower receiving grooves are provided inside the lower box body, and each lower receiving groove is provided with a buffer member. The side - wall buffer layer of the buffer member is fixedly connected to the side wall of the lower receiving groove; A plurality of upper receiving grooves are provided inside the upper box body, and each upper receiving groove is arranged in one - to - one correspondence with each lower receiving groove to jointly receive the item to be packaged with the lower receiving groove.

Images