Substrate lift assemblies, systems including same, and methods of using same

Abstract

A substrate lift pin assembly, systems including the assembly, and methods of using the same are disclosed. The assembly may include one or more lifting pins and a sensor for determining one or more of the presence and condition information of the one or more lifting pins. The system may be configured to provide alerts and / or stop operations based on the presence and / or condition information.

Description

Technical Field

[0001] The present disclosure generally relates to substrate processing systems, and more particularly, to methods and apparatuses for detecting the presence and / or condition of one or more lift pins in such systems. Background Art

[0002] Substrate processing equipment can be used for various applications. For example, substrate processing equipment can be used during the manufacture of electronic devices such as semiconductor devices, photovoltaic devices, and the like.

[0003] Typical electronic device manufacture includes chemical vapor deposition, etching, and / or cleaning of substrates. During such processing, the substrate is typically placed on a pedestal in a reaction chamber of a reactor system.

[0004] In some reactor system designs that include multiple ALD reactor systems or apparatuses, when the pedestal is in the load / unload position, the substrate is loaded onto the pedestal, and then the pedestal is moved to the processing position for processing using a pedestal lifter or elevator. When the processing is complete, the pedestal can be moved to the load / unload position.

[0005] To facilitate loading of the substrate onto the pedestal and unloading of the substrate from the pedestal, lift pins can be used to raise the substrate above the pedestal surface when the pedestal is in the load / unload position.

[0006] Due to several factors, the lift pins can become stuck, damaged, or even broken, which can lead to substrate damage or breakage or displacement of the substrate, which can affect substrate processing - for example, resulting in higher non-uniformity in etching, cleaning, and / or deposition processes. Typically, a stuck or damaged lift pin may go undetected for some time. Thus, multiple substrates can be affected before the problem is detected.

[0007] Existing design methods for detecting damaged or broken lift pins may not be widely adopted or effective. Therefore, there is a need for equipment and methods that accurately and cost-effectively detect the occurrence of displaced or damaged lift pins and warn the user of the reactor system and / or automatically stop production until the problem can be identified and resolved.

[0008] Any discussion of problems and solutions involved in the related art has been included in the present disclosure merely to provide the background of the present disclosure and should not be regarded as an admission that any or all of the discussion was known at the time of making the present invention. Summary of the Invention

[0009] This Summary of the Invention is provided to introduce a selection of concepts in a simplified form. These concepts are further described in detail in the detailed description of example embodiments of the present disclosure below. This Summary of the Invention is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0010] The present disclosure generally relates to substrate lift assemblies that use lift pins to facilitate loading of a substrate (such as a wafer) onto a pedestal within a reaction chamber and unloading from the pedestal. Although embodiments of the invention are discussed in more detail below in terms of how they solve various problems of conventional assemblies, generally speaking, the present invention provides an assembly that can detect the presence (e.g., absence or out of position) and / or condition (e.g., breakage) of a lift pin during operation of a system that includes such an assembly.

[0011] According to an exemplary embodiment of the present disclosure, a substrate lift assembly is provided. The substrate lift assembly includes a pedestal, a plurality of lift pins extending through a body of the pedestal, a plate, a sensor, and a lift mechanism for moving the pedestal relative to the plate. According to examples of these embodiments, the sensor is configured to determine one or more of presence information and condition information associated with one or more (e.g., each) of the plurality of lift pins. According to additional examples, the plate includes a plurality of lift pin pads corresponding to each of the plurality of lift pins. According to additional examples, the substrate lift assembly includes a plurality of sensors including the sensor. In such a case, each of the plurality of sensors may be formed on or within a lift pin pad of the plurality of lift pin pads. The sensor may be or include, for example, a magnetic sensor, an optical sensor, a diffuse sensor, a resistance temperature detector, a linear variable differential transducer, a pressure gauge, a voltmeter, a strain gauge, a piezoelectric device, etc. In some cases, one or more sensors may be coupled to a bottom surface of the plate. In some cases, the plate includes an opening or a feedthrough, and at least a portion of the sensor is within the feedthrough. According to additional examples, the assembly includes a controller coupled to one or more of the sensors. The controller may be configured to stop operation of the assembly and / or the reactor system based on one or more of the presence information and condition information associated with each of the lift pins.

[0012] According to additional examples of the present disclosure, a method for determining one or more of the presence and condition of one or more lift pins is provided. The method may include: disposing one or more lift pins within a pedestal; disposing a sensor near the one or more lift pins; moving the pedestal; and sensing one or more of the presence and condition of each of the one or more lift pins. One or more of the presence and condition may be detected using, for example: a force applied by one or more lift pins; light transmission; resistance; linear movement of one or more lift pins; contact and / or release times of lift pin pads associated with each or the one or more lift pins; voltage; strain; etc.

[0013] In accordance with still other embodiments of the present disclosure, a system is provided. According to an example of the present invention, a system includes a reaction chamber, a lifting assembly (e.g., a lifting assembly as described above and elsewhere herein), and a controller. The controller may be configured to move the susceptor and stop the operation of the component or system based on one or more of the lift pin presence information and lift pin condition information.

[0014] All such embodiments are intended to fall within the scope of the present disclosure. These and other embodiments will become apparent to those skilled in the art from a detailed description of certain embodiments with reference to the following drawings, and the present disclosure is not limited to any particular embodiment discussed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Although this specification ends with claims that particularly point out and distinctly claim the embodiments that are regarded as the present disclosure, the advantages of the embodiments of the present disclosure may be more readily ascertained from a description of certain examples of the embodiments of the present disclosure when read in conjunction with the drawings.

[0016] Figure 1 A simplified cross-sectional view of a system according to an example of the present disclosure is shown, wherein the substrate is in a raised position.

[0017] Figure 2 A simplified cross-sectional view of a Figure 1 system according to an example of the present disclosure is shown, wherein the substrate is on the susceptor.

[0018] Figure 3 A component according to an example of the present disclosure is shown.

[0019] Figure 4 A component according to other examples of the present disclosure is shown.

[0020] Figure 5 and Figure 6 Another component according to an example of the present disclosure is shown.

[0021] Figures 7 to 10 Another exemplary component according to an example of the present disclosure is shown.

[0022] Figure 11 Another component according to other examples of the present disclosure is shown.

[0023] Figure 12 Another component according to still other examples of the present disclosure is shown.

[0024] Figure 13 Another component according to still other examples of the present disclosure is shown.

[0025] Figure 14 Another component according to still other examples of the present disclosure is shown.

[0026] Figure 15 Shows yet another component according to yet further examples of the present disclosure.

[0027] Figure 16 Shows yet another component according to yet further examples of the present disclosure.

[0028] It should be understood that the elements in the drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the dimensions of some elements in the drawings may be exaggerated relative to other elements to help improve the understanding of the illustrated embodiments of the present disclosure. Detailed Description

[0029] Although certain embodiments and examples are described below, those skilled in the art will understand that the present disclosure extends beyond the specifically disclosed embodiments and / or uses of the present disclosure and its obvious modifications and equivalents. Accordingly, it is intended that the scope of the present disclosure not be limited by the specific embodiments described herein.

[0030] As described in more detail below, the various details and embodiments of the present disclosure can be used in conjunction with a reactor system used in the manufacture of electronic devices. For example, the components and systems can be used in conjunction with a reactor system having one or more reaction chambers configured to deposit materials on a substrate, etch materials from the substrate, clean the surface of the substrate, and / or process the surface of the substrate.

[0031] The inventors recognize the importance of sensing or detecting one or more of the presence information and condition information (such as breakage or damage) associated with lift pins that are used to raise a substrate from a pedestal surface. The presence information and / or condition information can be used to alert an operator of the reactor system to address problems and / or stop the operation of the components and / or system.

[0032] As used herein, the term substrate can refer to any one or more underlying materials that can be used to form or on which a device, circuit, or film can be formed. The substrate can comprise a bulk material, such as silicon (e.g., single-crystalline silicon), other Group IV materials (e.g., germanium), or compound semiconductor materials (e.g., GaAs), and can comprise one or more layers overlying or underlying the bulk material. Additionally, the substrate can include various topologies, such as recesses, lines, etc., formed within or on at least a portion of the layers of the substrate.

[0033] In addition, in the present disclosure, any two numbers of a variable can form a workable range of the variable, and any indicated range can include or exclude endpoints. Additionally, any value of the indicated variable (whether or not indicated by "about") can refer to an exact value or an approximate value and include equivalents, and can refer to an average value, a median value, a representative value, a majority value, etc. Further, in the present disclosure, the terms "comprising", "consisting of", and "having" can independently refer to "generally or broadly including", "including", "substantially consisting of", or "consisting of" in some embodiments. The term comprising includes substantially consisting of and consisting of. "Substantially" can mean within about ±10 or ±5 relative or absolute percentage. In the present disclosure, the meaning of any defined term does not necessarily exclude the ordinary and customary meaning in some embodiments.

[0034] Turning now to the drawings, Figure 1 and Figure 2 illustrates an exemplary system 100 according to an example of the present disclosure. More specifically, Figure 1 illustrates the system 100 in a load / unload configuration, and Figure 2 illustrates the system 100 in a processing position.

[0035] In the example shown, the system 100 includes a reactor or reaction chamber 101, which includes an upper chamber 102 and a lower chamber 104; a separator plate 106 between the upper chamber 102 and the lower chamber 104; a substrate lift assembly 103, a controller 105, a gas distribution assembly 120, and an exhaust source 121.

[0036] The reaction chamber 101 can be or include a reaction chamber suitable for gas-phase reactions. The reaction chamber 101 can be formed of a suitable material, such as quartz, metal, etc., and can be configured to hold one or more substrates for processing. The system 100 can include any suitable number of reaction chambers 101, and can optionally include one or more substrate handling systems. The reaction chamber 101 can be configured as a CVD reactor, a cyclic deposition process reactor (such as a cyclic CVD reactor), an ALD reactor, a PEALD reactor, etc., any of which can include plasma equipment, such as direct and / or remote plasma equipment. The system 100 can be used to process substrates. Generally, the processing of substrates occurs within the upper chamber 102, while the loading and unloading of substrates occur within the lower chamber 104.

[0037] The separator plate 106 can be configured as a substantially annular ring. According to an example of the present disclosure, the separator plate 106 can be used to isolate the gas between the upper chamber 102 and the lower chamber 104 during substrate processing or to provide a tortuous path for the gas between the upper chamber 102 and the lower chamber 104.

[0038] The substrate lifting assembly 103 includes a base 108; a plurality of lift pins 125, 126; a plate 107 (which may form the inner lower surface of the reaction chamber); one or more sensors 128, 130; and a lifting mechanism 112, such as a vertically movable elevator. As described in more detail below, one or more of the sensors 128, 130 can be used to determine one or more of the presence information and condition information associated with each of the plurality of lift pins 125, 126. In some cases, the system 100 includes a plurality of lift pin pads 148, 150 that correspond to each of the plurality of lift pins 125, 126. As discussed in more detail below, the lift pin pads 148, 150 can be formed on the plate 107, integral with the plate 107, or a raised portion of the plate 107. In some cases, one or more of the sensors 128, 130 can be incorporated into the respective lift pin pads 148, 150. Alternatively, as described below, the sensors 128, 130 can be separated from the pin pads 148, 150. In these cases, the system can include the sensors 128, 130 and not include the lift pin pads 148, 150.

[0039] The base 108 includes a base top surface 110, a base bottom surface 111, and a base body 113 that spans between the base top surface 110 and the base bottom surface 111. The base body 113 can be formed of any suitable material, such as aluminum, aluminum alloy, stainless steel, or a ceramic, such as aluminum nitride. The thickness of the base body 113 between the top surface 110 and the bottom surface 111 can be between about 1 and about 22 mm or between about 16 and about 22 mm. The substrate 114 can be positioned on the top surface 110, and when the base 108 moves upward in the direction of arrow 118, the substrate 114 can be located in the processing area 116, as Figure 2 shown. In some embodiments of the present disclosure, a first seal member 122 can be positioned on the base 108 and removable from the base 108, while a second seal member 124 can be positioned between the upper chamber 102 and the lower chamber 104. In some embodiments, the second seal member 124 can be positioned to at least partially rest on the interface plate 106, or can be connected to the interface plate 106 or any other suitable part of the reaction chamber 101.

[0040] The lift pins 125, 126 extend through the body 113 of the base 108. As shown, each lift pin 125, 126 may include a top portion or head 127, 129, a lift pin body 131, 133, and a bottom portion or base 135, 137. The lift pin bodies 131, 133 span between the respective heads 127, 129 and bases 135, 137. In the illustrated example, the cross-sections of the heads 127, 129 and the cross-sections of the bases 135, 137 are larger than the cross-sections of the lift pin bodies 131, 133. In some cases, only the cross-section of the heads 127, 129 may be larger than the cross-section of the lift pin bodies 131, 133. As shown, the top portions 127, 129 may be received within recesses 139 within the base 108 such that the tops of the top portions 127, 129 are at or below the surface 110 during substrate processing. The bottom portions / bases 135, 137 may be weighted and / or functionalized, as described in more detail below. The number of lift pins 125, 126 may vary. However, according to an example of the present disclosure, the substrate lift assembly 103 includes a plurality of lift pins. The plurality of lift pins may include, for example, three or more lift pins.

[0041] When used in combination with the lift pin pads 148, 150, the lift pins 125, 126 may be relatively short. For example, the height of the lift pins 125, 126 from the top of the heads 127, 129 to the bottom of the bases 135, 137 or to the bottom of the bodies 131, 133 may be between about 45 mm and about 75 mm or between about 50 mm and 70 mm. The cross-sectional dimensions of the heads 127, 129 may be between about 2 mm and about 6 mm or between about 2 mm and about 4 mm. The cross-sectional dimensions of the bases 135, 137 may be between about 15 mm and about 30 mm or between about 20 mm and about 25 mm.

[0042] The lift pins 125, 126 may be formed of any suitable material. For example, the lift pins 125, 126 may be formed of stainless steel or a ceramic material. In some cases, the lift pins 125, 126 may be formed of a material with high flexural strength and fracture resistance, such as Sialon (a ceramic alloy based on the elements silicon (Si), aluminum (Al), oxygen (O), and nitrogen (N)), Si3N4, SiC, etc.

[0043] The plate 107 includes a plate top surface 141 and a plate bottom surface 143. The plate top surface 141 may be accessible to the base bottom surface 111 (e.g., directly opposite thereto). The plate bottom surface 143 is opposite the plate top surface 141.

[0044] When the pin pads 148, 150 are included, the pin pads 148, 150 can have a height H of from about 75 mm to about 125 mm or from about 80 mm to about 120 mm. As described above, in some cases, the pin pads 148, 150 include sensors, such as the sensors described herein. In other cases, the pin pads do not include sensors, but can be present and used in combination with other sensors described herein. The use of the pin pads 148, 150 can be advantageous because the pin pads 148, 150 can allow for shorter lift pins 125, 126, which can reduce the risk of breakage of the lift pins 125, 126.

[0045] The sensors 128, 130 can generally be configured to determine one or more of the presence information and condition information associated with each of the plurality of lift pins 125, 126. As explained in more detail below, the sensors 128, 130 can be configured in various ways. In some cases, the system 100 can include one sensor for each lift pin 125, 126. In other configurations, the system 100 includes two or more sensors for each lift pin 125, 126. Additionally, as described below, in some cases, the sensors 128, 130 reside within the reaction chamber 101 / lower chamber 104; in other cases, the sensors 128, 130 reside outside the reaction chamber 101 / lower chamber 104.

[0046] When the pin pads 148, 150 include sensors (e.g., sensors 128, 130), the sensors 128, 130 can be or include, for example, magnetic sensors, capacitive sensors, optical sensors (such as the sensor 302 described below), manometers, voltmeters, piezoelectric devices, or other sensors, such as another sensor described herein.

[0047] According to an example of the present disclosure, the bases 135, 137 can include magnets or magnetic materials. In such cases, the sensors 128, 130 can include magnets, and the force between the sensors 128, 130 and the corresponding lift pins 125, 126 can be used to determine one or more of the lift pin conditions (e.g., stuck or broken) and / or lift pin position information. Alternatively, the bases 135, 137 can include conductive materials, and the sensors 128, 130 can use changes in capacitance to determine one or more of the lift pin conditions and / or lift pin position information.

[0048] According to other examples, sensors 128, 130 can be or include manometers. Using manometer sensors (e.g., as part of or separate from pin pads 148, 150) can allow determination of whether two or more (e.g., all) of lift pins 125, 126 are lifted by the base substantially simultaneously. When the pins are lifted, the manometer will return a zero value, no load. If the manometers all return zero values within a given threshold (e.g., less than about 2 seconds or less than about 3 seconds), there is high confirmation that none of the lift pins are stuck. In the case where a lift pin is stuck, it will be seen that the manometer / sensor returns a zero value earlier than other manometers / sensors. The chance that all lift pins 125, 126 are stuck simultaneously is very low, and the chance that all three lift pins 125, 126 are stuck at substantially the same height is even lower.

[0049] In some cases, the sensor can be or include a piezoelectric device. For example, the manometer as described above can include a piezoelectric device.

[0050] According to other examples of the present disclosure, an electromagnetic field is applied to pin pads 148, 150, and a voltage is measured using sensors 128, 130 to determine whether lift pins 125, 126 are at a desired position / distance from the respective sensors 128, 130. In this case, sensors 128, 130 can be or include voltmeters. During operation, when lift pins 125, 126 are lifted by base 108, an induced voltage will be generated. The induced voltage can be based on the distance of lift pins 125, 126 (e.g., bases 135, 137) from the respective sensors 128, 130. In an ideal situation, when lift pins 125, 126 move relative to the sensors, the same output from all sensors 128, 130 will be expected. If there is a deviation from the baseline data, it will indicate that the pins are stuck or damaged.

[0051] The lift mechanism 112 can include, for example, a shaft 142 and a motor 115. The motor 115 can be used to move the shaft 142 and the base 108 from the Figure 1 loading / unloading position as shown to the Figure 2 processing position as shown.

[0052] The gas distribution assembly 120 can be or include a showerhead assembly. For example, the gas distribution assembly 120 can include a showerhead plate 123, which includes a gas chamber region 152 and a plurality of holes 154.

[0053] The exhaust source 121 can include, for example, one or more vacuum sources. Exemplary vacuum sources include one or more dry vacuum pumps and / or one or more turbomolecular pumps.

[0054] The controller 105 can be configured to perform the operations of the system 100 and the substrate lift assembly 103. Additionally, the controller 105 can be wired or wirelessly connected to one or more sensors, such as the sensors 128, 130 described herein. As described above, the controller 105 can be configured to implement actions (such as sending a warning signal and / or stopping the operation) based on one or more of the presence information and condition information associated with each lift pin. In some cases, the controller 105 can be or include a programmable logic controller as described herein.

[0055] Figure 3 A substrate lift assembly 300 according to an example of the present disclosure is shown. Although not shown, the assembly 300 can include a base, such as the base 108. The assembly 300 includes lift pins 125, (optionally) lift pin pads 148, a plate 107, and a sensor 302, where the sensor 302 includes a transmitter 304 and a detector 306. The sensor 302 can be an optical sensor. The transmitter 304 and the detector 306 can be configured to detect the presence or absence of the lift pin 125—for example when the base 108 is in the load / unload position. According to an example of the present disclosure, the transmitter 304 is a light transmitter, such as a laser. The detector 306 can be a light detector, such as a laser detector. The sensor 302 can be configured to determine whether the lift pin 125 is between the transmitter 304 and the detector 306—when the lift pin 125 should be present (e.g., during the load / unload process), or when the lift pin 125 should not be present (e.g., during the processing of the substrate 114). According to an example of the present disclosure, at least one sensor 302 (i.e., one transmitter 304 and one detector 306) is provided for each lift pin of a system (such as the system 100). As shown, the sensor 302 is within the reaction chamber 101 / lower chamber 104. The assembly 300 can also include feedthroughs and / or flanges, as described below in conjunction with Figure 4 、 Figure 8 、 Figure 11 and Figure 12 described.

[0056] Figures 4 to 6 A substrate lift assembly 400 according to an example of the present disclosure is shown. The substrate lift assembly 400 includes lift pins 404, a plate 412, and one or more sensors 402—for example, one or more sensors 402, 506, 508 for each of the lift pins 404, 502, 504, where the lift pins 404, 502, 504 can be the same as or similar to the lift pins 125, 126. The lift pin 404 is shown as having a base 405, which can be the same as or similar to the base 135 described above. According to the example, the base 405 can be or include a reflective material, such as polished stainless steel, a chrome plating, or other materials having a mirror finish.

[0057] Sensors 402, 506, 508 can be or include diffuse sensors, which can include background suppression. Sensors 402, 506, 508 can be optical sensors. As Figure 4 shown, sensor 402 can include a light emitter 406 and a light detector 408. The light emitter 406 can be or include, for example, a light-emitting diode. The light detector 408 can be or include, for example, an infrared (IR) detector, a red light detector, a photodetector, or a reflector / diffuser sensor. As shown, the optical axis of the light emitter 406 and the optical axis of the light detector 408 can be offset. In operation, light can be emitted toward the lift pin base 405 and reflected back to the light detector 408. Information received by the light detector 408 can be transmitted to the programmable logic controller 410 to determine the presence, absence, or distance of the base 405 relative to the plate 412 or the sensor 402. In operation, when the distance of the base 405 changes, the position of the received light on the receiver element changes. This change is converted by the PLC 410 into a displacement reading. According to a specific example, when the lift pin 404 approaches or departs from the sensor 402, the sensor 402 detects the displacement of the lift pin 404 and provides an output to the PLC 410, and the PLC 410 generates a signal when the lift pin 404 is determined to be jammed or otherwise not in the proper position or condition.

[0058] In Figures 4 to 6 the example shown, sensors 402, 506, 508 are positioned outside the reaction chamber (such as reaction chamber 101 / lower chamber 104). Figure 4 Sensor 402 is shown completely outside the reaction chamber (such as reaction chamber 101) or the plate 412, and Figure 6 and Figure 7 sensors 402, 506, 508 are shown partially within the plate 507 (which can be the same as or similar to the plate 107). Thus, the lift pin condition can be determined non-invasively from outside the reaction chamber. In this case, the flange 414 can be used to couple the transparent window 416 to the opening 411 in the plate 412, and the plate 412 can be the same as or similar to the plate 107. The window 416 can be formed of, for example, quartz.

[0059] Figure 7 Another substrate lift assembly 700 according to an example of the present disclosure is shown. The substrate lift assembly 700 includes a lift pin 702, a plate 704, and one or more sensors 706.

[0060] The lift pin 702 can be the same as or similar to the lift pin 125 described above. In the illustrated example, the lift pin 702 includes a base 710. The base 710 can be or include a magnet, such as a real magnet or a permanent magnet.

[0061] The plate 704 can be the same as or similar to the above-described plate 107, except that the plate 704 can optionally include a raised portion or region 708 that can receive at least a portion of the sensor 706. In some cases, the sensor 706 is coupled to the plate 704 within the raised portion 708. The raised portion 708 can be the same as or similar to the above-described pin pad 148.

[0062] The sensor 706 can be or include a magnetic proximity sensor. The magnetic proximity sensor detects a magnetic field and is capable of detecting a permanent magnet through a non-ferromagnetic material (e.g., non-ferrous metal such as aluminum, stainless steel, quartz, etc.). During operation of the substrate lift assembly 700, when the lift pin 702 approaches the sensor 706, the sensor 706 detects the magnetic field and optionally outputs a signal to the programmable logic controller 714 through an amplifier 716. The amplifier 716 can amplify the signal from the sensor 706 to the PLC 714. The PLC 714 can in turn generate and / or transmit a signal indicating the distance, presence, and / or condition of the lift pin 702. In some cases, a signal can be generated or transmitted when the distance determined for the operating conditions is outside a preset value. According to an example of the present disclosure, the lift assembly 700 includes one sensor for each lift pin.

[0063] In the illustrated example, the sensor 706 is outside the reaction chamber - i.e., the sensor 706 is positioned on the outer surface of the plate 704 relative to the lower chamber 712, which can be the same as or similar to the lower chamber 104.

[0064] In the illustrated example, the lift assembly 700 includes an insulating material 718 inserted between the plate 704 and the sensor 706 (e.g., in direct contact with one or more of the plate 704 and the sensor 706). The insulating material 718 can reduce heat transfer between the lower chamber 712 and the sensor 706. When the sensor 706 is outside the reaction chamber, the insulating material 718 can include a plastic (e.g., PTFE), etc.

[0065] Figure 8 Another substrate lift assembly 800 according to an example of the present disclosure is shown. The substrate lift assembly 800 is similar to the substrate lift assembly 700, except that the substrate lift assembly 800 includes a sensor 806 that is exposed to the interior region of the reactor (such as the lower chamber 812) of the reactor chamber. Similar to the substrate lift assembly 700, the substrate lift assembly 800 includes lift pins 802, a plate 804, and one or more sensors 806. The lift pins 802 can be the same as or similar to the lift pins 702, and the sensors 806 can be the same as or similar to the sensors 706.

[0066] The plate 804 can be similar to the plate 704, except that the plate 804 includes a raised portion 808 which includes an opening 811 therein. At least a portion of the sensor 706 can be inserted into the opening 811 such that a portion of the sensor 806 is exposed to the interior portion of the reactor (e.g., the lower chamber 812).

[0067] The feedthrough 814 and the flange 816 can be used to seal the sensor 806 from the environmental conditions while allowing the signal line 818 to be connected to the PLC 820 and an optional amplifier 822. The PLC 820 and the amplifier 822 can be the same as or similar to the above-mentioned PLC 714 and amplifier 716.

[0068] Figure 9 and Figure 10 The operation of the substrate lift assemblies 700 and 800 is shown. Figure 9 The assemblies 700, 800 are shown in the load / unload position where the substrate 114 is in the raised position. In this case, the bases 710, 810 can contact the sensors 706, 806 or be close to the sensors 706, 806 (at a certain distance therefrom). This distance can be based on the type of sensor used. Some sensors will have a shorter sensing field than others. Figure 10 The assemblies 700, 800 are shown in the processing position where the substrate 114 is in the raised position.

[0069] Figure 11 Another substrate lift assembly 1100 according to an example of the present disclosure is shown. The assembly 1100 includes lift pins 1102, a plate 1104 and a sensor 1106.

[0070] The lift pins 1102 can be as described above. According to an example of the present disclosure, the lift pins 1102 include a base 1103. The base 1103 can be formed of a metal, such as stainless steel.

[0071] The plate 1104 can be the same as or similar to the above-mentioned base 810. As shown, the plate 1104 includes an opening 1108 in which at least a portion of the sensor 1106 is disposed. According to an example of the present disclosure, at least a portion of the sensor 1106 is exposed to the interior space 1120 of the reaction chamber.

[0072] The sensor 1106 is or includes a resistive temperature detector (RTD), such as platinum. The sensor 1106 may have a resistance of, for example, 100 Ω at 0 °C. The resistance of the sensor 1106 varies with temperature. Thus, as the temperature changes (e.g., increases), the resistance of the RTD also changes (e.g., increases). Therefore, by measuring the resistance of the sensor 1106, the temperature can be determined. During operation, when the lift pin 1102 contacts or approaches the sensor 1106, the sensor 1106 detects a change in temperature. The change in temperature can be used to detect the presence and / or condition of the lift pin 1102 and provide a signal.

[0073] The feedthrough 1112 and the flange 1114 can be used to seal the sensor 1106 from the ambient conditions. The wire 1118 from the sensor 1106 to the programmable logic controller 1116 can be fed through the feedthrough 1112.

[0074] The programmable logic controller 1116 can be similar to other PLCs described herein. For example, the PLC 1116 can receive signals from the sensor 1106 (and optionally an amplifier), and determine the condition and / or presence of the lift pin 1102, and send a corresponding signal or perform operations as described herein.

[0075] Figure 12 Another substrate lift assembly 1200 according to an example of the present disclosure is shown. The substrate lift assembly 1200 is similar to the substrate lift assembly 1100, except that the substrate lift assembly 1200 includes a lift pin 1202, a sensor 1206, an amplifier 1208, and a programmable logic controller 1210. The substrate lift assembly 1200 also includes a plate 1204, a feedthrough 1212, and a flange 1214. The feedthrough 1212 and the flange 1214 can be the same as or similar to the feedthrough 1112 and the flange 1114 described above. The plate 1204 can be the same as or similar to the plate 1104 described above.

[0076] The lift pin 1202 can be the same as or similar to the lift pin 125 described above. In some cases, the lift pin 1202 includes a base 1203; in some cases, the base 1203 can have a diameter substantially the same as the diameter of the body 1205. According to an example of the present disclosure, the lift pin 1202 and particularly the lift pin body 1205 is or includes stainless steel or other conductive material.

[0077] The sensor 1206 is or includes a linear variable differential transducer (LVDT) sensor. The sensor 1206 is configured to convert the linear movement of the lift pin 1202 into a variable corresponding to an electrical signal proportional to such movement. The amount or magnitude of the displacement can be proportional to the differential output of the sensor 1206. The greater the output voltage, the greater the displacement of the object. The signal from the sensor 1206 can be used to detect the presence and / or condition information of the lift pin 1202.

[0078] In the illustrated example, sensor 1206 includes a primary winding 1207, secondary windings 1209, 1211, and a (e.g., soft) iron core 1213. The iron core 1213 may receive a portion of the lift pin 1202. Using, for example, the primary winding 1207, secondary windings 1209, 1211, and the soft iron core 1213, the sensor 1206 can measure the position of the lift pin 1202 in real time and provide signals to an amplifier 1208 and a PLC 1210 to determine the presence and / or condition information corresponding to the lift pin 1202.

[0079] Figure 13 Another substrate lift assembly 1300 according to an example of the present disclosure is shown. The substrate lift assembly 1300 is similar to the substrate lift assembly 300, except that the substrate lift assembly 1300 includes a sensor 1306, where components are located inside and outside a reaction chamber having a lower chamber 1301.

[0080] More specifically, the substrate lift assembly 1300 includes a lift pin 1302, a plate 1304, and a sensor 1306. The lift pin 1302 may be the same as or similar to the lift pin 125. The lift pin 1302 may include a lift pin head 1307, optionally a lift pin base 1303, and a lift pin body 1305, such as those described above in connection with Figure 1 and Figure 2 the lift pin components described.

[0081] The plate 1304 may be or include a material that is transparent (e.g., greater than 80% or 90% transparent) to light emitted and / or detected by the sensor 1306. As an example, the plate 1304 may be or include a quartz material, which may form a window in, for example, the above-described plate 107.

[0082] The sensor 1306 includes a source 1308, a detector 1310, a first prism 1312, and a second prism 1314. The sensor 1306 may be an optical sensor. In operation, light emitted from the source 1308 is directed toward the first prism 1312, which directs the light toward the second prism 1314, which in turn directs the light toward the detector 1310.

[0083] The source 1308 may be or include, for example, a light source, such as a laser. The detector 1310 can detect light of the wavelength emitted by the source 1308. The detector 1310 is electrically coupled to a programmable logic controller 1316 to provide a signal indicating the presence and / or condition of the lift pin 1302 to the programmable logic controller 1316.

[0084] In the illustrated example, prisms 1312 and 1314 are configured to bend light by, for example, approximately 90 degrees. The distance between prisms 1312 and 1314 can be, for example, between approximately 3 mm (e.g., the diameter of the pin) and the diameter inside the reaction chamber or other cross-sectional measurements (e.g., between approximately 350 and approximately 400 mm).

[0085] PLC 1316 can be coupled to source 1308 and / or detector 1310 such that PLC 1316 can supply power to source 1308 and / or receive signals from detector 1310. In some cases, PLC 1316 can be configured to continuously monitor signals from 1310 and correlate the received signals with the expected position of lift pin 1302.

[0086] Although one source 1308 and one detector 1310 are shown for lift pin 1302, in some cases, the assembly can include multiple lift pins for each source and / or detector. In such cases, multiple prisms such as prisms 1312, 1314 can be in series.

[0087] Figure 14 Another substrate lift assembly 1400 is shown in accordance with another example. Substrate lift assembly 1400 includes lift pin 1402, plate 1404, and sensor 1406.

[0088] Lift pin 1402 includes lift pin body 1405 and lift pin base 1403. Lift pin 1402 can be the same as or similar to the above-mentioned lift pin 125.

[0089] Plate 1404 can be the same as or similar to the above-mentioned plate 107. Sensor 1406 can be (e.g., directly) mounted on plate 1404.

[0090] According to an example of the present disclosure, sensor 1406 is or includes a (e.g., light) source 1408 and a (e.g., light) detector 1410. According to an example of the illustrated embodiment, lift assembly 1400 is configured to determine lift pin presence and / or condition information by measuring the distance between sensor 1406 and lift pin 1402. More specifically, sensor 1406 can be configured to measure the time it takes for a signal emitted from source 1408 to be reflected (or not reflected) from lift pin 1402 and return to detector 1410.

[0091] The sensor 1406 can be coupled to a programmable logic controller 1412, which can receive signals from the sensor 1406 to determine conditions and / or presence information related to the lift pin 1402. For example, in some cases, the PLC 1412 can determine the distance between the lift pin 1402 and the sensor 1406 and correlate that distance with the expected distance of the lift pin 1402. If the distance is above or below the expected value, the PLC 1412 can generate and send a signal to stop the operation of the component 1400 and / or the system (such as the system described herein).

[0092] Figure 15 Another substrate lift assembly 1500 is shown in accordance with another embodiment. The substrate lift assembly 1500 includes a lift pin 1502, a plate 1504, a sensor 1506, and a shaft 1508.

[0093] The lift pin 1502 can be the same as or similar to the lift pin 125. Similarly, the plate 1504 can be the same as or similar to the plate 107.

[0094] The sensor 1506 is coupled to (e.g., movable) shaft 1508. The shaft 1508 can be the same as or similar to the shaft 142. Referring Figure 1 and Figure 15 , when the shaft 1508 / 142 moves, the lift pin 1502 can move within the base - e.g., from a raised load / unload position to a lowered processing position. The sensor 1506 can include a transmitter and a detector as described above in connection with, for example, Figure 3 described, or can include another suitable sensor, such as another sensor described herein. The sensor 1506 can be coupled to a programmable logic controller to determine presence, distance, and / or condition information and send a corresponding signal to stop the operation of the component 1500 or a system including such a component.

[0095] In some cases, the component 1500 can include two or more sensors 1506 for one or more lift pins 1502 to determine the position and / or condition of the lift pin 1502.

[0096] Figure 16 Yet another substrate lift assembly 1600 is shown in accordance with another exemplary embodiment. The substrate lift assembly 1600 includes a lift pin 1602, a plate 1604, and a sensor 1606 on or within an opening in the plate 1604.

[0097] The lift pin 1602 can be the same as or similar to the lift pin 125. Similarly, the plate 1604 can be the same as or similar to the plate 107. Although not shown separately, the substrate lift assembly 1600 can suitably include flanges and feedthroughs, such as the flanges and feedthroughs described above in connection with Figure 4 described.

[0098] The sensor 1606 can be or include a strain gauge. In some cases, the sensor 1606 can be or form part of a lift pin pad, such as the lift pin pads described herein. In the illustrated example, the sensor 1606 includes a sensor plate 1608 and a strain gauge 1610 (e.g., directly) attached to the sensor plate 1608 - e.g., using an adhesive. One or more wires 1612 from the strain gauge 1610 can be fed through the feedthroughs and flanges as described above. Signals from the strain gauge 1610 can be transmitted to a programmable logic controller 1614 to determine the presence (or absence) and / or condition of the lift pin 1602. For example, the PLC 1614 can compare the expected strain and the measured strain to determine whether the lift pin 1602 is stuck (e.g., within the base), broken, or missing.

[0099] According to further embodiments of the present disclosure, a method is provided. In aspects according to these embodiments, a method of determining one or more of the presence and condition of one or more lift pins includes: disposing one or more lift pins within a base; disposing a sensor near the one or more lift pins; moving the base; and determining (i.e., sensing) one or more of the presence of the lift pin, distance (e.g., from the sensor), and condition (e.g., stuck or damaged). The determining step can include measuring the force exerted by one or more lift pins, light transmission, resistance, linear movement of one or more lift pins, lift pin pad contact and / or release times associated with each or the one or more lift pins, voltage, strain, etc. For example, the determining or measuring step can include emitting light and detecting the presence or absence of the light. In some cases, the determining or measuring step includes emitting light and measuring the amount of light or the time amount of received reflected light. In other cases, the determining or measuring step includes measuring magnetic force. Other examples of determining lift pin condition, distance, and / or presence are described above.

[0100] Benefits, other advantages, and solutions to problems have been described herein with respect to specific embodiments. However, these benefits, advantages, solutions to problems, and any elements that may cause any benefit, advantage, or solution to occur or become more pronounced should not be construed as critical, required, or essential features or elements of the present disclosure.

[0101] References throughout the specification to features, advantages, or similar language do not imply that all features and advantages that can be realized by the present disclosure should be in any single embodiment of the invention. Rather, language referring to features and advantages is understood to mean that a particular feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the subject matter disclosed herein. Thus, the discussion of features and advantages throughout this specification and similar language can, but does not necessarily, refer to the same embodiment.

[0102] In addition, the features, advantages, and characteristics of the present disclosure may be combined in any suitable manner in one or more embodiments. Those skilled in the relevant art will recognize that the subject matter of this application may be practiced without one or more of the specific features or advantages of a particular embodiment. In other instances, additional features and advantages may be recognized in certain embodiments that may not be present in all embodiments of the present disclosure. Further, in some cases, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the subject matter of the present disclosure. No claim element is intended to invoke 35 U.S.C. 112(f) unless the element expressly recites the phrase "means for".

[0103] The scope of the present disclosure is limited only by the appended claims, in which, unless expressly stated otherwise, the singular forms of elements are not meant to mean "one and only one" but rather "one or more". It should be understood that unless otherwise specifically stated, references to "a", "an", and / or "the" may include one or more than one, and references to singular items may also include plural items. Additionally, the term "plurality" may be defined as "at least two". As used herein, when used in conjunction with a list of items, the phrase "at least one" means that different combinations of one or more of the listed items may be used and that only one item from the list may be required. The item may be a particular object, thing, or category. Further, when a phrase such as "at least one of A, B, and C" is used in a claim, the phrase is intended to be interpreted to mean that A may exist alone in an embodiment, B may exist alone in an embodiment, C may exist alone in an embodiment, or any combination of elements A, B, and C may exist in a single embodiment; for example, A and B, A and C, B and C, or A, B, and C. In some cases, "at least one of item A, item B, and item C" may mean, for example but not limited to, two of item A, one of item B, and ten of item C; four of item B and seven of item C; or some other suitable combination.

[0104] All ranges and ratio limits disclosed herein may be combined. Unless otherwise noted, the terms "first", "second", etc. are used herein only as labels and are not intended to impose an order, position, or ranking requirement on the items to which these terms refer. Further, reference to, for example, a "second" item does not require or preclude the existence of, for example, a "first" or lower-numbered item, and / or, for example, a "third" or higher-numbered item.

[0105] Any reference to attachment, fixation, connection, etc. may include permanent, removable, temporary, partial, complete, and / or any other possible attachment options. Additionally, any reference to non-contact (or similar phrases) may also include reduced contact or minimal contact. In the above description, certain terms may be used, such as "upper", "lower", "upper part", "lower part", "horizontal", "vertical", "left", "right", etc. When dealing with relative relationships, these terms are used, where applicable, to provide some clarity in the description. However, these terms do not imply absolute relationships, positions, and / or orientations. For example, for an object, the "upper" surface can simply become the "lower" surface by flipping the object. Nevertheless, it is still the same object.

[0106] In addition, instances where one element "couples" to another element in this specification may include direct and indirect couplings. Direct coupling may be defined as one element coupling to another element and having some contact with the other element. Indirect coupling may be defined as a coupling between two elements that do not directly contact each other, but having one or more additional elements between the coupled elements. Additionally, as used herein, fixing one element to another element may include direct fixing and indirect fixing. Additionally, as used herein, "adjacent" does not necessarily mean in contact. For example, one element may be adjacent to another element without contacting that element.

[0107] Although exemplary embodiments of the present disclosure are set forth herein, it should be understood that the present disclosure is not limited thereto. For example, although the reactor system is described in connection with various specific configurations, the present disclosure is not necessarily limited to these examples. Various modifications, variations, and enhancements can be made to the systems and methods set forth herein without departing from the spirit and scope of the present disclosure.

[0108] The subject matter of the present disclosure includes all novel and non-obvious combinations and sub-combinations of various systems, components, and configurations, as well as other features, functions, actions, and / or properties disclosed herein, and any and all equivalents thereof.

Claims

1. A substrate lifting assembly, comprising: A base, which includes a base top surface, a base bottom surface, and a base body spanning between the base top surface and the base bottom surface; A plurality of lifting pins, each of the plurality of lifting pins extending through the body; A plate, which includes a plate top surface close to the base bottom surface and a plate bottom surface opposite to the plate top surface; A sensor; And A lifting mechanism for moving the base relative to the plate, Wherein the sensor determines one or more of the presence information and condition information associated with each of the plurality of lifting pins.

2. The substrate lifting assembly according to claim 1, including a plurality of lifting pin pads corresponding to each of the plurality of lifting pins.

3. The substrate lifting assembly according to claim 2, wherein, The substrate lifting assembly includes a plurality of sensors, which includes the sensor, and wherein each of the plurality of sensors is formed on or within a lifting pin pad among the plurality of lifting pin pads.

4. The substrate lifting assembly according to claim 1, wherein, The sensor includes one or more of the following: a magnetic proximity sensor, an optical sensor, a diffuse sensor, a resistance temperature detector, a linear variable differential transducer, a manometer, a piezoelectric device, a voltmeter, or a strain gauge.

5. The substrate lifting assembly according to claim 1, wherein, Each lifting pin includes a head, a base, and a lifting pin body spanning between the head and the base, wherein the cross-sectional area of the head and the cross-sectional area of the base are greater than the cross-sectional area of the lifting pin body.

6. The substrate lifting assembly according to claim 1, wherein The sensor is coupled to the plate bottom surface.

7. The substrate lifting assembly according to claim 1 further includes a feedthrough coupled to the plate, wherein, At least a portion of the sensor is within an opening of the plate.

8. The substrate lifting assembly according to claim 1, further including a controller coupled to the sensor.

9. The substrate lifting assembly according to claim 8, further including an amplifier coupled between the sensor and the controller.

10. The substrate lifting assembly according to claim 1, wherein, The plate includes a raised portion, and wherein the sensor is coupled to the plate within the raised portion.

11. The substrate lifting assembly according to claim 1, wherein, The sensor includes a light emitter and a light detector.

12. The substrate lifting assembly according to claim 1, wherein, The sensor includes a manometer.

13. The substrate lifting assembly according to claim 1, wherein, The lifting pin comprises Sialon, Si3N4, or SiC.

14. The substrate lifting assembly according to claim 1, further including a prism.

15. The substrate lifting assembly according to claim 1, further including a prism coupled to the plate.

16. A method for determining one or more of the presence and condition of one or more lifting pins, the method comprising: Disposing one or more lifting pins within a base; Disposing a sensor near the one or more lifting pins; Moving the base; And Sensing one or more of the following: The force exerted by one or more lifting pins; Light transmission; Resistance; The linear movement of one or more lifting pins; The contact and / or release time of the lifting pin pads associated with each of the one or more lifting pins; Voltage; And Strain.

17. The method according to claim 16, wherein, The sensing step includes emitting light and detecting the presence or absence of light.

18. The method according to claim 16, wherein The sensing step includes emitting light and measuring the amount of light.

19. The method according to claim 16, wherein, The sensing step includes measuring magnetic force.

20. A system, comprising: A reaction chamber; A lifting assembly, including: A base, which includes a base top surface, a base bottom surface, and a base body spanning between the base top surface and the base bottom surface; A plurality of lifting pins, each of the plurality of lifting pins extending through the base body; A plate, which includes a plate top surface adjacent to the bottom surface of the base and a plate bottom surface opposite to the plate top surface; A sensor; and A lifting mechanism for moving the base relative to the plate, wherein the sensor determines one or more of presence information and condition information associated with each of a plurality of lifting pins; and A controller configured to move the base and stop the operation of the system based on one or more of the presence information and the condition information.

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