Multi-layer circuit board pressing device and method

Abstract

The invention discloses a multilayer circuit board pressing device and method, and belongs to the technical field of circuit board pressing equipment. The device mainly comprises a bottom box, a top box and a pressing mechanism, the loading mechanism is slidably arranged at the upper end of the bottom box and is provided with a placing plate; at least two groups of sliding rods are horizontally arranged in the accommodating cavity; the first sliding sleeve and the second sliding sleeve are arranged on the sliding rod in a sliding manner; the first spring is arranged between the first sliding sleeve and the second sliding sleeve; the first supporting arm is hinged to the first sliding sleeve; and the second support arm is hinged on the second sliding sleeve. According to the multi-layer circuit board pressing device and method, accurate alignment of the multi-layer circuit board in the pressing process is ensured and interlayer dislocation is avoided by arranging the positioning pin for fixing or arranging the high-precision positioning structure module, and meanwhile, the stripping mechanism is arranged, so that after the circuit board is subjected to long-time hot pressing, the circuit board can be accurately aligned, and the quality of the circuit board is improved. And the auxiliary tool can be easily separated from the placing plate and is matched with the notch formed in the placing plate, so that the auxiliary tool can conveniently enter the placing plate.

Description

Technical Field

[0001] This application relates to the technical field of circuit board lamination equipment, and specifically provides a multi-layer circuit board lamination device and method. Background Art

[0002] A multilayer printed circuit board (PCB for short) refers to a printed circuit board with three or more conductive pattern layers and insulating material layers arranged alternately, and electrical interconnection between layers is achieved through conductive vias. As a key basic component of modern electronic devices, multilayer printed circuit boards are widely used in fields such as communication, computers, consumer electronics, industrial control, automotive electronics, and aerospace due to their high integration, small size, and excellent performance.

[0003] Multilayer printed circuit boards are usually stacked by multiple thin sheet materials (such as glass fiber reinforced resin), with copper foil layers sandwiched in between, and they are laminated together through a high-temperature and high-pressure process to form a complete multilayer circuit board structure. During the processing of multilayer printed circuit boards, it is necessary to laminate the inner layer board, prepreg, and copper foil. Currently, a lamination device is often used to complete this work.

[0004] For example, the patent with the publication number CN218603740U specifically discloses a multilayer circuit board lamination device. Through the design of a buffer component, when the pressure value exceeds the preset pressure value, the pressure sensor sends a signal, and the piston rod and the second spring will drive the bottom plate to descend and move away from the pressure block, avoiding damage to the circuit board caused by excessive pressure and reducing the scrap rate of the circuit board.

[0005] However, after the circuit board is laminated, the multilayer printed circuit board will adhere to the plane on the top of the support table and is not easy to pick up. At this time, additional operation steps or tools may be required to safely remove the circuit board. Therefore, it is necessary to provide a multilayer circuit board lamination device and method to solve the above problems.

[0006] It should be noted that the above information disclosed in this background art section is only used to understand the background art of the concept of this application, and therefore, it may include information that does not constitute prior art. Summary of the Invention

[0007] Based on the above problems existing in the prior art, the problems to be solved by this application are: to provide a multilayer circuit board lamination device and method, achieving the effect that the multilayer printed circuit board can be quickly taken out after lamination.

[0008] The technical solution adopted by this application to solve its technical problems is as follows: A multi-layer circuit board pressing device and method, including a bottom box, with a top box arranged at the upper end of the bottom box; a pressing mechanism installed on the top box, the pressing mechanism having a pressing plate for pressing the circuit board; a loading mechanism slidably arranged at the upper end of the bottom box, the loading mechanism having a carrying frame for placing the circuit board, and an accommodating cavity is arranged inside the carrying frame; a placing plate arranged in the accommodating cavity; a blanking mechanism arranged between the bottom of the placing plate and the bottom surface of the accommodating cavity, and the blanking mechanism includes: at least two groups of sliding rods horizontally arranged in the accommodating cavity; a first sliding sleeve and a second sliding sleeve, both the first sliding sleeve and the second sliding sleeve are slidably arranged on the sliding rods; a first spring installed between the first sliding sleeve and the second sliding sleeve; a first arm hinged on the first sliding sleeve; a second arm hinged on the second sliding sleeve; wherein, both the first arm and the second arm are hinged to the bottom of the placing plate, the placing plate is adapted to vertically move downward under the action of pressure to support the pressing of the circuit board, and the placing plate is adapted to reset under the action of the first spring to blank the circuit board.

[0009] Furthermore, a notch is arranged on the placing plate.

[0010] Furthermore, a guide rod is fixedly arranged at the bottom of the placing plate, and a through hole is arranged at the bottom of the accommodating cavity, and the guide rod is adapted to cooperate with the through hole.

[0011] Furthermore, the loading mechanism includes a slide rail fixedly installed on the top of the bottom box, a slider is slidably installed on the slide rail, the carrying frame is fixedly installed with the slider, and a locking mechanism for limiting the position of the carrying frame is arranged between the carrying frame and the bottom box.

[0012] Furthermore, the pressing mechanism includes a hydraulic cylinder fixedly installed on the upper end of the top box, the output end of the hydraulic cylinder is fixedly installed with a top seat, the bottom of the top seat is fixedly installed with a pressing seat, and the pressing plate is fixedly installed at the bottom of the pressing seat.

[0013] Furthermore, a guide sleeve is arranged on the top box, a guide post is fixedly installed at the upper end of the pressing seat, and the guide post slidably penetrates through the guide sleeve.

[0014] Further, a plurality of heating holes are evenly formed in the placement plate, and a heating mechanism is arranged in each heating hole; the heating mechanism includes a stepped hole formed inside the heating hole, a housing is arranged inside the stepped hole, there is a first gap between the housing and the inner wall of the stepped hole, and a second spring is installed between the bottom of the housing and the bottom of the stepped hole; an inclined block is fixedly installed inside the heating hole, the lower end of the inclined block is adapted to the stepped hole, the inside of the inclined block is a through tapered setting that is smaller at the top and larger at the bottom, and a first inclined surface is formed, and a second inclined surface matching the first inclined surface is arranged at the upper end of the housing. When the inclined block and the housing approach each other, they are in close contact and sealed, and when the inclined block and the housing move away from each other, a second gap is formed.

[0015] Further, a mating hole is arranged at the lower end of the housing, an air inlet pipe is installed in the mating hole, a first air hole is formed in the housing at the upper end of the mating hole, the first air hole communicates with the stepped hole, a second air hole is arranged at the upper end of the air inlet pipe, and the second air hole is communicated with the first air hole; the lower end of the air inlet pipe is communicated with a joint, and one end of the joint away from the air inlet pipe is communicated with an air pump, and the air pump is communicated with an external hot air storage tank.

[0016] Further, a communication hole is arranged inside the housing at the upper end of the first air hole, the communication hole is communicated with the first air hole, a ball groove is arranged inside the housing at the upper end of the communication hole, the ball groove is open at the upper end, and a sealing ball is arranged inside the ball groove. The diameter of the sealing ball is larger than the diameter of the communication hole, and the diameter of the sealing ball is smaller than the opening size of the upper end of the ball groove.

[0017] A method for laminating a multi-layer printed circuit board includes the following steps:

[0018] First step, load the printed circuit board, stack the inner core board, PP, and copper foil in sequence, and fix them with rivets or positioning pins;

[0019] Second step, the pressing mechanism (3) starts pre-pressing operation, control the temperature at 80 - 120 °C, the pressure at 5 - 10 kg / cm 2 , and the time is 30 - 60 minutes;

[0020] Third step, the pressing mechanism (3) starts full-pressing operation, slowly raise the temperature to the resin melting temperature (160 - 180 °C) to avoid short circuits caused by the rapid flow of the resin. After the temperature reaches the peak value, apply the maximum pressure (20 - 40 kg / cm 2 ), and keep it for 60 - 120 minutes, maintain the temperature and pressure to completely cure the resin;

[0021] Fourth step, cool the laminated printed circuit board.

[0022] A multi-layer circuit board lamination device and method provided by the present application have the following beneficial effects:

[0023] 1. By providing positioning pins for fixation or being equipped with a high-precision positioning structure module, the precise alignment of the multi-layer circuit board during the lamination process is ensured, avoiding interlayer misalignment, ensuring the symmetry of the laminated structure, and avoiding warping after lamination. At the same time, by providing a stripping mechanism, the circuit board can be easily removed from the placement board after long-term hot pressing, and in cooperation with the notch provided on the placement board, it is convenient for auxiliary tools to enter.

[0024] 2. By providing a heating mechanism, the bottom of the circuit board can be uniformly heated, avoiding quality problems caused by uneven heating of the circuit board.

[0025] 3. By providing a loading mechanism, the circuit board can be loaded outside the lamination area, facilitating the loading and unloading of the circuit board, and the operator does not need to put his hand into the dangerous area of lamination, ensuring the safety of the operation.

[0026] In addition to the purposes, features, and advantages described above, the present application has other purposes, features, and advantages. The following will refer to the drawings for a further detailed description of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings forming a part of this application are used to provide a further understanding of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation of the present application.

[0028] In the drawings:

[0029] Figure 1 is the overall schematic of a multi-layer circuit board lamination device and method in the present application Figure 1 ;

[0030] Figure 2 is the overall schematic of a multi-layer circuit board lamination device and method in the present application Figure 1 ;

[0031] Figure 3 is Figure 1 the partial structural schematic diagram at A in

[0032] Figure 4 is Figure 2 the partial structural schematic diagram at B in

[0033] Figure 5 is Figure 3 the exploded schematic diagram of the internal structure of the bearing frame in

[0034] Figure 6 is Figure 5Schematic cross-section of the internal structure of the through-hole of the middle placement plate Figure 1 ;

[0035] Figure 7 is Figure 5 Schematic cross-section of the internal structure of the through-hole of the middle placement plate Figure 2 ;

[0036] Figure 8 is Figure 7 Schematic diagram of the structure at position C in the middle;

[0037] Figure 9 is Figure 7 Schematic cross-section of the internal structure in the middle;

[0038] Figure 10 is Figure 9 Schematic diagram of the local structure at position D in the middle;

[0039] Figure 11 Schematic diagram of the overall structure of the pressure relief circuit in this application;

[0040] Among them, the reference numerals in the figure:

[0041] 1. Bottom box; 11. Wheel body; 12. Control console; 13. Button;

[0042] 2. Top box; 21. Indicator light; 22. Display and control screen;

[0043] 3. Pressing mechanism; 31. Hydraulic cylinder; 32. Guide sleeve; 33. Guide post; 34. Top seat; 35. Pressing seat; 36. Pressing plate;

[0044] 4. Loading mechanism; 41. Slide rail; 42. Carrying frame; 421. Accommodation cavity; 43. Placement plate; 431. Heating hole; 432. Guide rod; 433. Inclined block; 434. Step hole; 435. First inclined surface; 44. Fixed column;

[0045] 5. Unloading mechanism; 51. First sliding sleeve; 52. First support arm; 53. First spring; 54. Slide bar; 55. Second sliding sleeve; 56. Second support arm;

[0046] 6. Heating mechanism; 61. Shell; 611. First air hole; 612. Second inclined surface; 613. Communication hole; 62. Second spring; 63. Connector; 64. Sealing ball; 65. Air inlet pipe; 651. Second air hole;

[0047] 7. Air pump; 8. Pressure valve; 9. Pressure relief circuit; 91. Storage tank. Specific implementation mode

[0048] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The following will describe the present application in detail with reference to the drawings and in combination with the embodiments.

[0049] In order to enable those skilled in the art to better understand the solution of the present application, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0050] Embodiment 1:

[0051] This embodiment mainly elaborates on the basic structure and working principle of the multi-layer circuit board lamination device. Specifically:

[0052] As Figures 1 - 4 shown, the present application provides a multi-layer circuit board lamination device, including a bottom box 1. A PLC control system is placed inside the bottom box 1 to facilitate the coordinated work of each electrical component;

[0053] At the same time, a wheel body 11 is provided at the bottom of the bottom box 1. The wheel body 11 is used to drive the bottom box 1 to move in the production workshop, so as to adapt to different workstations and processing requirements;

[0054] A fixing column 44 is fixedly installed at the upper end of the bottom box 1. A top box 2 is fixedly arranged at the upper end of the fixing column 44. The inside of the top box 2 is hollow, so a region for laminating the circuit board is formed between the inside of the top box 2 and the bottom box 1. The lamination action of the circuit board is carried out in this region;

[0055] Continue to refer to Figures 1 - 4 , a loading mechanism 4 is provided at the upper end of the bottom box 1. The loading mechanism 4 is used to load the circuit board externally and transport it to the lamination area for lamination after loading. The loading mechanism 4 includes a slide rail 41 fixedly installed on the top of the bottom box 1. A slider (not shown in the figure) is slidably installed on the slide rail 41. A bearing frame 42 is fixedly installed on the slider. Thus, the bearing frame 42 can move on the slide rail 41 to enter the lamination area and move outside the lamination area, facilitating the staff to load the circuit board into the bearing frame 42;

[0056] It should be noted that a locking mechanism for limiting the position of the carrying frame 42 is provided between the carrying frame 42 and the bottom box 1. This locking mechanism can lock the carrying frame 42 when it is in the above position to prevent it from moving. In this embodiment, the locking mechanism can be simply fixed with bolts or other quick-release methods, and no more limitations are made here;

[0057] Furthermore, the sliding of the carrying frame 42 on the slide rail 41 can be manually controlled or driving components such as electric cylinders can be set to facilitate the movement of the carrying frame 42;

[0058] As Figures 3 - 5 shown, an accommodation cavity 421 is provided inside the carrying frame 42, and a placement plate 43 is arranged in the accommodation cavity 421 for placing circuit boards;

[0059] As Figures 1 - 4 shown, a pressing mechanism 3 is arranged on the top box 2. The pressing mechanism 3 is adapted to press the circuit board placed on the placement plate 43. The pressing mechanism 3 includes a hydraulic cylinder 31 fixedly installed at the upper end of the top box 2. The output end of the hydraulic cylinder 31 is fixedly installed with a top seat 34. The top seat 34 is adapted to move along the vertical direction under the drive of the hydraulic cylinder 31;

[0060] At the same time, a pressing seat 35 is fixedly installed at the bottom of the top seat 34, and a pressing plate 36 is fixedly installed at the bottom of the pressing seat 35. The pressing plate 36 is adapted to contact the circuit board for pressing operations;

[0061] In order to ensure the stability of the vertical movement of the pressing seat 35, a guide sleeve 32 is arranged on the top box 2. At the same time, a guide post 33 is fixedly installed at the upper end of the pressing seat 35. The guide post 33 slidably penetrates through the guide sleeve 32. Thus, during the vertical movement of the pressing seat 35, through the cooperation of the guide post 33 and the guide sleeve 32, the movement of the pressing seat 35 is made more stable;

[0062] As Figure 1 shown, a control console 12 is arranged on the bottom box 1. Buttons 13 are arranged on the control console 12 for controlling the pressing mechanism 3. At the same time, an indicator light 21 for displaying the pressing state and a display control screen 22 for presenting the pressing image are arranged on the top box 2 to enable better control of the pressing operation of the circuit board;

[0063] In summary, when performing a lamination operation on a multi-layer circuit board, first pull out the carrier frame 42 from the lamination area. Then, after the operator places the circuit board on the placement plate 43, push the carrier frame 42 back into the lamination area and fix it. In this step, the inner core board, PP, and copper foil need to be stacked in sequence, and positioning pins are used for fixation or a high-precision positioning structure module is equipped to ensure the precise alignment of the multi-layer circuit board during the lamination process, avoid interlayer misalignment, ensure the symmetry of the stacked structure, and avoid warping after lamination;

[0064] Then, the lamination mechanism 3 starts to press down and performs pre-pressing to expel the air between the layers and initially fix the stacked structure. In this step, the temperature is 80 - 120 °C, the pressure is 5 - 10 kg / cm 2 , and the time is 30 - 60 minutes;

[0065] Subsequently, a full-pressure operation is carried out. In this step, the temperature is slowly raised to the resin melting temperature (160 - 180 °C) to avoid short circuits caused by the rapid flow of the resin. After the temperature reaches the peak value, the maximum pressure (20 - 40 kg / cm 2 ) is applied for 60 - 120 minutes, and the temperature and pressure are maintained to completely cure the resin;

[0066] Finally, cooling is carried out by natural cooling or water cooling. In this step, the cooling rate needs to be controlled to avoid delamination or warping caused by thermal stress.

[0067] After the circuit board is hot-pressed, due to long-term pressing, the circuit board adheres to the placement plate 43 and is not easily detached. To solve this problem, as Figure 5 shown, a stripping mechanism 5 is provided between the bottom of the carrier frame 42 and the placement plate 43. The stripping mechanism 5 includes two groups of sliding rods 54 horizontally arranged inside the carrier frame 42. At the four corners of the placement plate 43 corresponding to the sliding rods 54, a first sliding sleeve 51 and a second sliding sleeve 55 are slidably arranged. At the same time, a first spring 53 is fixedly installed between the first sliding sleeve 51 and the second sliding sleeve 55. In the initial state, the first spring 53 is in a free state, and at this time, the first sliding sleeve 51 and the second sliding sleeve 55 are in a position close to each other;

[0068] At the same time, a first arm 52 is hinged to the upper end of the first sliding sleeve 51, and a second arm 56 is hinged to the upper end of the second sliding sleeve 55. The upper ends of the first arm 52 and the second arm 56 are both hinged to the bottom of the placement plate 43;

[0069] It can be understood that the placement plate 43 is adapted to the accommodation cavity 421, so that the placement plate 43 can only move vertically along the inner wall of the accommodation cavity 421;

[0070] In summary, in the initial state, the upper end of the placement plate 43 protrudes from the upper surface of the bearing frame 42, so that the circuit board can be more easily placed on the placement plate 43 in the initial state;

[0071] When the pressing operation is performed, the pressing seat 35 applies pressure to the circuit board and drives the placement plate 43 to approach the bottom of the accommodating cavity 421. At this time, the first arm 52 and the second arm 56 separate from each other to both sides and stretch the first spring 53;

[0072] It can be understood that the separation distance between the first arm 52 and the second arm 56 is related to the pressure applied by the pressing seat 35, so that during the pressing process of the circuit board, the placement plate 43 never contacts the bottom of the accommodating cavity 421, and thus the pressing action of the circuit board can be buffered by the first spring 53;

[0073] After the circuit board pressing is completed, the pressure applied by the pressing seat 35 to the circuit board disappears, and the first spring 53 starts to reset and drives the placement plate 43 to reset to the initial position. At this time, the circuit board is located above the bearing frame 42 to facilitate the unloading of the circuit board. At this time, even if the circuit board adheres to the placement plate 43, since the bottom of the circuit board is in an operable position, it is also convenient to use auxiliary tools for unloading;

[0074] Furthermore, a notch (not shown in the figure) can be provided on the placement plate 43 to facilitate the entry of auxiliary tools;

[0075] In this embodiment, in order to ensure the stability of the vertical movement of the placement plate 43, as Figure 5 shown, a guide rod 432 is fixedly provided at the bottom of the placement plate 43. At the same time, a through hole (not marked in the figure) is provided at the bottom of the accommodating cavity 421, and the guide rod 432 is adapted to cooperate with the through hole to guide the movement of the placement plate 43.

[0076] Embodiment Two:

[0077] During the pressing process of the circuit board, it is necessary to heat the circuit board to melt the resin. In order to uniformly heat the circuit board, as Figure 5 shown, a plurality of groups of heating holes 431 are uniformly formed in the placement plate 43, and a heating mechanism 6 is arranged in the heating holes 431. The heating mechanism 6 is used to uniformly heat the bottom of the circuit board;

[0078] As Figures 6 - 9 shown, the heating mechanism 6 includes a stepped hole 434 arranged inside the heating hole 431. A housing 61 is arranged inside the stepped hole 434. There is a first gap between the inner wall of the housing 61 and the stepped hole 434, and a second spring 62 is installed between the bottom of the housing 61 and the bottom of the stepped hole 434. Thus, the housing 61 can move up and down in the stepped hole 434 under the action of an external force;

[0079] An inclined block 433 is fixedly installed inside the heating hole 431. The lower end of the inclined block 433 is adapted to the stepped hole 434. At the same time, the inside of the inclined block 433 is provided with a through conical shape that is smaller at the top and larger at the bottom, thereby forming a first inclined surface 435. And a second inclined surface 612 that matches the first inclined surface 435 is provided at the upper end of the housing 61. Thus, when the inclined block 433 and the housing 61 are close to each other, they are mutually attached and sealed. When the inclined block 433 and the housing 61 are away from each other, a second gap is formed;

[0080] As Figure 8 shown, a mating hole (not marked in the figure) is provided at the lower end of the housing 61. An intake pipe 65 is installed in the mating hole. At the same time, a first air hole 611 is opened at the upper end of the housing 61 located at the mating hole. The first air hole 611 communicates with the stepped hole 434. And a second air hole 651 is provided at the upper end of the intake pipe 65. The second air hole 651 is in communication with the first air hole 611;

[0081] It can be understood that a joint 63 is connected to the lower end of the intake pipe 65. One end of the joint 63 away from the intake pipe 65 is connected to an air pump 7. The air pump 7 is connected to an external hot air flow storage tank 91. Thus, the air pump 7 is adapted to introduce hot air flow through the joint 63 and the intake pipe 65 into the first air hole 611;

[0082] In this embodiment, the upper end of the housing 61 is in a closed state, and the upper end of the housing 61 always protrudes from the placement plate 43 to support the circuit board;

[0083] To sum up, in the initial state, the second spring 62 is in a free state. At this time, due to the action of the second spring 62, the housing 61 is in the upper position. The first inclined surface 435 and the second inclined surface 612 are mutually attached and sealed. And the upper end of the housing 61 protrudes from the placement plate 43 for supporting the circuit board. This position can be called the first position of the housing 61;

[0084] At this time, because only the circuit board is placed and the weight of the circuit board is relatively light and cannot exert a large pressure on the housing 61, the housing 61 still remains in the initial state. The first inclined surface 435 and the second inclined surface 612 are mutually attached and sealed. The hot air flow introduced by the air pump 7 cannot be output after entering the intake pipe 65. Therefore, a pressure relief circuit 9 needs to be connected to the output end of the air pump 7 (as Figure 11 shown) to prevent the pressure in the intake pipe 65 from being too high. At the same time, a pressure valve 8 is provided on the pressure relief circuit 9 for setting the pressure of pressure relief as needed. Therefore, when in the above-mentioned first position, the hot air flow pumped out by the air pump 7 can only flow back through the pressure relief circuit 9;

[0085] When the circuit board is pressed, due to the action of pressure, the circuit board will move downward and exert a relatively large pressure on the housing 61. Under the action of the pressure, the housing 61 moves vertically downward, causing the second inclined surface 612 to move downward, thereby creating a gap between the first inclined surface 435 and the second inclined surface 612;

[0086] At this time, after the hot air flow introduced by the air pump 7 enters the air inlet pipe 65, it will enter the stepped hole 434 through the second air hole 651 and the first air hole 611, and reach the bottom of the circuit board through the gap between the first inclined surface 435 and the second inclined surface 612, thereby uniformly heating the bottom of the circuit board;

[0087] After the circuit board pressing is completed, the housing 61 will reset under the action of the second spring 62 to facilitate the next pressing operation.

[0088] As Figure 8 shown, a communication hole 613 is provided at the upper end of the first air hole 611 inside the housing 61. The communication hole 613 is communicated with the first air hole 611. At the same time, a ball groove (not marked in the figure) is provided at the upper end of the communication hole 613 inside the housing 61. The upper end of the ball groove is open, and a sealing ball 64 is provided inside the ball groove. At the same time, the diameter of the sealing ball 64 is larger than the diameter of the communication hole 613. Thus, when the sealing ball 64 is at the lower end of the ball groove, the communication hole 613 can be blocked, and the diameter size of the sealing ball 64 is smaller than the size of the upper end of the ball groove. Thus, when the sealing ball 64 is at the upper end of the ball groove, it will not fall off from the ball groove;

[0089] At the same time, there is a gap between the sealing ball 64 and the ball groove to facilitate the smooth rolling of the sealing ball 64 within the ball groove;

[0090] Thus, when the circuit board is placed on the placement board 43, it will directly contact the sealing ball 64. Since the sealing ball 64 can roll at this time, it is convenient to adjust the position of the circuit board, and at the same time, it will not cause wear to the circuit board. Moreover, the circuit board and the sealing ball 64 are in arc point contact, so that during the subsequent material removal process, it will not adhere to the placement board 43, thereby facilitating the subsequent material removal operation.

[0091] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A multi-layer circuit board lamination device, characterized in that: Comprising: A bottom box (1), with a top box (2) provided at the upper end of the bottom box (1); A pressing mechanism (3), which is installed on the top box (2), and the pressing mechanism (3) has a pressing plate (36) for pressing the circuit board; A loading mechanism (4), which is slidably arranged at the upper end of the bottom box (1), the loading mechanism (4) has a carrying frame (42) for placing the circuit board, and an accommodating cavity (421) is arranged inside the carrying frame (42); A placing plate (43), which is arranged in the accommodating cavity (421); A blanking mechanism (5), which is arranged between the bottom of the placing plate (43) and the bottom surface of the accommodating cavity (421), and the blanking mechanism (5) includes: At least two groups of sliding rods (54), which are horizontally arranged in the accommodating cavity (421); A first sliding sleeve (51) and a second sliding sleeve (55), both the first sliding sleeve (51) and the second sliding sleeve (55) are slidably arranged on the sliding rod (54); A first spring (53), which is installed between the first sliding sleeve (51) and the second sliding sleeve (55); A first arm (52), which is hinged to the first sliding sleeve (51); A second arm (56), which is hinged to the second sliding sleeve (55); Wherein, both the first arm (52) and the second arm (56) are hinged to the bottom of the placing plate (43), the placing plate (43) is adapted to vertically move downward under the action of pressure to support the pressing of the circuit board, and the placing plate (43) is adapted to reset under the action of the first spring (53) to blank the circuit board.

2. The multi-layer circuit board laminating device according to claim 1, characterized in that: A notch is provided on the placing plate (43).

3. A multi-layer circuit board pressing device according to claim 2, characterized in that: A guide rod (432) is fixedly arranged at the bottom of the placing plate (43), a through hole is arranged at the bottom of the accommodating cavity (421), and the guide rod (432) is adapted to cooperate with the through hole.

4. A multi-layer circuit board pressing device according to claim 1, characterized in that: The loading mechanism (4) includes a slide rail (41) fixedly installed on the top of the bottom box (1), a slider is slidably installed on the slide rail (41), the carrying frame (42) is fixedly installed with the slider, and a locking mechanism for limiting the position of the carrying frame (42) is arranged between the carrying frame (42) and the bottom box (1).

5. A multi-layer circuit board pressing device according to claim 1, characterized in that: The pressing mechanism (3) includes a hydraulic cylinder (31) fixedly installed at the upper end of the top box (2), a top seat (34) is fixedly installed at the output end of the hydraulic cylinder (31), a pressing seat (35) is fixedly installed at the bottom of the top seat (34), and the pressing plate (36) is fixedly installed at the bottom of the pressing seat (35).

6. The multi-layer circuit board lamination device according to claim 5, wherein: A guide sleeve (32) is provided on the top box (2), a guide post (33) is fixedly installed at the upper end of the pressing seat (35), and the guide post (33) slidably penetrates through the guide sleeve (32).

7. A multi-layer circuit board lamination device according to claim 1, characterized in that: A plurality of groups of heating holes (431) are uniformly arranged on the placing plate (43), and a heating mechanism (6) is arranged in the heating holes (431); The heating mechanism (6) includes a stepped hole (434) disposed inside the heating hole (431). A housing (61) is arranged inside the stepped hole (434). There is a first gap between the housing (61) and the inner wall of the stepped hole (434). A second spring (62) is installed between the bottom of the housing (61) and the bottom of the stepped hole (434). An inclined block (433) is fixedly installed inside the heating hole (431). The lower end of the inclined block (433) is adapted to the stepped hole (434). The inside of the inclined block (433) is arranged in a through conical shape that is smaller at the top and larger at the bottom, forming a first inclined surface (435). A second inclined surface (612) matching the first inclined surface (435) is arranged at the upper end of the housing (61). When the inclined block (433) and the housing (61) approach, they fit and seal with each other. When the inclined block (433) and the housing (61) move away from each other, a second gap is formed.

8. A multi-layer circuit board lamination device according to claim 7, characterized in that: A mating hole is arranged at the lower end of the housing (61). An air inlet pipe (65) is installed in the mating hole. A first air hole (611) is opened at the upper end of the housing (61) located at the mating hole. The first air hole (611) communicates with the stepped hole (434). A second air hole (651) is arranged at the upper end of the air inlet pipe (65). The second air hole (651) is in communication with the first air hole (611). The lower end of the air inlet pipe (65) is connected to a joint (63). One end of the joint (63) away from the air inlet pipe (65) is connected to an air pump (7). The air pump (7) is connected to an external hot air storage tank.

9. A multi-layer circuit board laminating device according to claim 8, characterized in that: A communication hole (613) is arranged inside the housing (61) above the first air hole (611). The communication hole (613) communicates with the first air hole (611). A ball groove is arranged inside the housing (61) above the communication hole (613). The ball groove is open at the upper end. A sealing ball (64) is arranged inside the ball groove. The diameter of the sealing ball (64) is larger than the diameter of the communication hole (613), and the diameter of the sealing ball (64) is smaller than the opening size of the upper end of the ball groove.

10. A method for laminating a multi-layer circuit board, characterized in that: Including the following steps: First step, load the circuit board, stack the inner core board, PP, and copper foil in sequence, and fix them with rivets or positioning pins. Second step, the lamination mechanism (3) starts the pre-lamination operation, controlling the temperature at 80 - 120 °C, the pressure at 5 - 10 kg / cm 2 , and the time for 30 - 60 minutes; Third step, the pressing mechanism (3) starts full pressing operation, slowly heats up to the resin melting temperature (160 - 180 °C) to avoid short circuits caused by the rapid flow of the resin. After the temperature reaches the peak value, apply the maximum pressure (20 - 40 kg / cm2) and maintain it for 60 - 120 minutes, keeping the temperature and pressure to fully cure the resin. Fourth step, cool the pressed circuit board.

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