Processing method of camera window, camera window and camera

Abstract

The invention relates to a processing method of a camera window, the camera window and a camera. The processing method of the camera window comprises the following steps: providing a sapphire piece; processing a transparent metal oxide layer on one side surface of the sapphire piece; providing a glass piece; the glass piece is attached to the side face, away from the sapphire piece, of the transparent metal oxide layer; and carrying out bonding treatment on the sapphire piece, the transparent metal oxide layer and the glass piece. The transparent metal oxide layer serves as a bonding middle layer, the reliability of connection between the sapphire piece and the glass piece can be guaranteed, the overall light transmittance of the camera window is not affected, and it can be guaranteed that the camera window has excellent optical performance; under the condition that the size of the camera window is fixed, the sapphire piece enables the camera window to meet the anti-corrosion requirement, and the glass piece can reduce the size of the sapphire piece, so that the processing mode of the camera window is simple, and the cost can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of cameras, in particular to a processing method for a camera window, a camera window and a camera. Background Art

[0002] When a camera is used in a special scenario, there may be other anti-corrosion requirements such as anti-hydrofluoric acid corrosion, and ordinary glass usually cannot meet the anti-corrosion requirements.

[0003] In the related prior art, some cameras use sapphire glass as the camera window to meet the anti-hydrofluoric acid corrosion requirements. However, the preparation process of sapphire glass is complex, the cost is high, and it is difficult to prepare large-size sapphire. Summary of the Invention

[0004] Based on this, it is necessary to provide a processing method for a camera window, a camera window and a camera for the above problems, so as to reduce the cost while meeting the anti-corrosion requirements of the camera window.

[0005] The present invention first provides a processing method for a camera window, including the steps of:

[0006] Providing a sapphire part;

[0007] Processing a transparent metal oxide layer on one side surface of the sapphire part;

[0008] Providing a glass part;

[0009] Bonding the glass part to the side surface of the transparent metal oxide layer facing away from the sapphire part;

[0010] Performing a bonding treatment on the transparent metal oxide layer and the glass part.

[0011] In the above processing method for a camera window, a transparent metal oxide layer is first processed on one side surface of the sapphire part, and then the glass part is bonded to the side surface of the transparent metal oxide facing away from the sapphire part, so that the sapphire part, the transparent metal oxide layer and the glass part are arranged in a stacked manner. Finally, a bonding treatment is performed on the sapphire part, the transparent metal oxide layer and the glass part, so that the sapphire part, the transparent metal oxide layer and the glass part are stably and reliably connected together; the transparent metal oxide layer serves as a bonding intermediate layer, which can ensure the reliability of the connection between the sapphire part and the glass part, and does not affect the overall light transmittance of the camera window, and can ensure that the camera window has better optical performance; the sapphire part enables the camera window to meet the anti-corrosion requirements. When the size of the camera window is fixed, the glass part can reduce the size of the sapphire part, so that the processing method of the camera window is simple and the cost is low.

[0012] In one embodiment, in the step of bonding the transparent metal oxide layer and the glass member, the following steps are further included:

[0013] Place the sapphire member, the transparent metal oxide layer, and the glass member in a bonding cavity;

[0014] Perform a vacuum pumping process on the bonding cavity so that the vacuum degree in the bonding cavity is 1×10 -5 Pa to 1×10 -3 Pa;

[0015] Introduce an inert gas into the bonding cavity;

[0016] Perform a bonding process on the transparent metal oxide layer and the glass member, wherein the bonding pressure is 1 MPa to 10 MPa, the bonding temperature is 300 °C to 450 °C, and the bonding time is 5 min to 60 min;

[0017] Perform a cooling process on the bonding cavity, wherein the cooling rate is 2 °C / min to 20 °C / min.

[0018] With such settings, the bonding effect between the transparent metal oxide layer and the glass member can be ensured, and the stability and reliability of the connection between the two can be guaranteed.

[0019] In one embodiment, in the step of processing a transparent metal oxide layer on one side surface of the sapphire member, the following steps are further included:

[0020] Process a transparent metal oxide layer on one side surface of the sapphire member by physical vapor deposition or chemical vapor deposition.

[0021] With such settings, the adhesion, uniformity, and durability of the transparent metal oxide layer on the sapphire member can be improved, and the thickness of the transparent metal oxide layer can be precisely controlled. The processing method is simple and the cost is relatively low.

[0022] In one embodiment, in the step of processing a transparent metal oxide layer on one side surface of the sapphire member by physical vapor deposition or chemical vapor deposition, the following steps are further included:

[0023] Process a transparent metal oxide layer on one side surface of the sapphire member by magnetron sputtering, wherein the thickness of the transparent metal oxide layer is 50 nm to 500 nm.

[0024] With such settings, the situation of bonding failure can be avoided, and at the same time, the stability and reliability of the connection between the sapphire member, the transparent metal oxide layer, and the glass member can be guaranteed.

[0025] In one embodiment, in the step of processing a transparent metal oxide layer on one side of the sapphire piece by magnetron sputtering, the following steps are further included:

[0026] Place the sapphire piece in the magnetron cavity;

[0027] Perform a vacuum pumping process on the magnetron cavity so that the vacuum degree in the magnetron cavity is 1×10 -5 Pa to 1×10 -3 Pa;

[0028] Introduce argon gas into the magnetron cavity. Among them, the flow rate of the argon gas is 10 ml / min to 100 ml / min, and the air pressure in the magnetron cavity is 0.1 Pa to 2 Pa;

[0029] Apply an electric field to the magnetron cavity so that the target material undergoes sputtering, and deposit a transparent metal oxide layer on one side of the sapphire piece. Among them, the temperature of the magnetron cavity is 300°C to 400°C, the sputtering power is 60 W to 100 W, and the sputtering time is 30 min to 300 min.

[0030] With such settings, the stability and reliability of the bonding between the transparent metal oxide layer and the surface of the sapphire piece can be ensured.

[0031] In one embodiment, in the step of processing a transparent metal oxide layer on one side of the sapphire piece by magnetron sputtering, the following steps are further included:

[0032] Use titanium dioxide or indium oxide as the target material; or,

[0033] Use titanium dioxide and indium oxide as the target materials, and the distance between the two target materials is 8 mm to 12 mm.

[0034] With such settings, the sputtering effect and the thickness uniformity of the transparent metal oxide layer can be ensured, and at the same time, the interference or collision between the two target materials can be prevented.

[0035] In one embodiment, in the step of providing the sapphire piece, the following steps are further included:

[0036] Grind and / or polish the surface of the sapphire piece so that the surface roughness of the sapphire piece is 50 nm to 100 nm;

[0037] Clean and dry the sapphire piece; and / or,

[0038] In the step of providing the glass piece, the following steps are further included:

[0039] Grind the edge of the glass piece;

[0040] The glass piece is cleaned and dried.

[0041] Such a configuration makes the overall thickness of the sapphire piece more uniform, improves the flatness of the surface of the sapphire piece, and ensures the adhesion between the transparent metal oxide layer and the surface of the sapphire piece; removes sharp thorns and burrs on the edges of the glass piece, and improves the overall aesthetics and safety of the glass piece and the camera window.

[0042] The present invention also provides a camera window, which is prepared by the camera window processing method as described above, comprising:

[0043] Sapphire pieces;

[0044] a transparent metal oxide layer, stacked on one side of the sapphire piece; and

[0045] The glass member is stacked on a side of the transparent metal oxide layer away from the sapphire member.

[0046] In this arrangement, the transparent metal oxide layer serves as a bonding intermediate layer, which can ensure the reliability of the connection between the sapphire component and the glass component, and will not affect the overall light transmittance of the camera window, thereby ensuring that the camera window has better optical properties; the sapphire component enables the camera window to meet the anti-corrosion requirements, and when the size of the camera window is certain, the glass component can reduce the size of the sapphire component, thereby making the processing method of the camera window simple and low-cost.

[0047] In one embodiment, the transparent metal oxide layer is titanium dioxide and / or indium oxide; and / or,

[0048] The transparent metal oxide layer has a thickness of 50 nm to 500 nm.

[0049] Such an arrangement avoids bonding failure and also ensures the stability and reliability of the connection between the sapphire component, the transparent metal oxide layer and the glass component.

[0050] The present invention also provides a camera, comprising the camera window as described above.

[0051] With this arrangement, the camera can be used in special scenarios where anti-corrosion is required, has a wide range of applications, and has low production and processing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0053] Figure 1 It is a flowchart of a processing method for a camera window according to an embodiment of the present invention;

[0054] Figure 2 Provided by the present invention Figure 1 It is a specific flowchart of step S100 in

[0055] Figure 3 Provided by the present invention Figure 1 It is a specific flowchart of step S200 in

[0056] Figure 4 Provided by the present invention Figure 1 It is a specific flowchart of step S300 in

[0057] Figure 5 Provided by the present invention Figure 1 It is a specific flowchart of step S500 in Specific Embodiments

[0058] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the specific embodiments of the present application in detail with reference to the accompanying drawings. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein. Those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0059] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly on the other component or there may also be an intermediate component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right", and similar expressions used in the specification of the present application are only for the purpose of illustration and do not represent the only implementation manner.

[0060] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this application, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0061] In this application, unless otherwise clearly specified and defined, the first feature may be in direct contact with the second feature or the first and second features may be in indirect contact through an intermediate medium when the first feature is "on" or "under" the second feature. Moreover, when the first feature is "above", "over" or "on top of" the second feature, the first feature may be directly above or diagonally above the second feature, or it may simply indicate that the first feature has a higher horizontal height than the second feature. When the first feature is "below", "beneath" or "underneath" the second feature, the first feature may be directly below or diagonally below the second feature, or it may simply indicate that the first feature has a lower horizontal height than the second feature.

[0062] Unless otherwise defined, all technical and scientific terms used in the description of this application have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in the description of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" used in the description of this application includes any and all combinations of one or more of the related listed items.

[0063] When a camera is used in a special scenario, there may be other anti-corrosion requirements such as resistance to hydrofluoric acid corrosion, and ordinary glass usually cannot meet the anti-corrosion requirements. In related prior art, some cameras use sapphire glass as the camera window to meet the requirement of resistance to hydrofluoric acid corrosion, but the preparation process of sapphire glass is complex, the cost is high, and it is difficult to prepare large-size sapphire.

[0064] To solve the above problems, as Figures 1 to 5 shown, the present invention first provides a processing method for a camera window to reduce costs while meeting the anti-corrosion requirements of the camera window.

[0065] As Figure 1 shown, specifically, the processing method for the camera window includes the steps of:

[0066] S100. Provide a sapphire piece;

[0067] S200. Process a transparent metal oxide layer on one side of the sapphire piece;

[0068] S300. Provide a glass piece;

[0069] S400. Bond the glass part to the side of the transparent metal oxide layer facing away from the sapphire part;

[0070] S500. Perform a bonding process on the transparent metal oxide layer and the glass part.

[0071] In the processing method of the camera window provided by the embodiment of the present invention, first, a transparent metal oxide layer is processed on one side of the sapphire part, and then the glass part is bonded to the side of the transparent metal oxide facing away from the sapphire part, so that the sapphire part, the transparent metal oxide layer, and the glass part are arranged in a stacked manner. Finally, a bonding process is performed on the sapphire part, the transparent metal oxide layer, and the glass part, so that the sapphire part, the transparent metal oxide layer, and the glass part are stably and reliably connected together. The transparent metal oxide layer serves as a bonding intermediate layer, which can ensure the reliability of the connection between the sapphire part and the glass part, and will not affect the overall light transmittance of the camera window, and can ensure that the camera window has excellent optical performance; the sapphire part enables the camera window to meet the anti-corrosion requirements. When the size of the camera window is fixed, the glass part can reduce the size of the sapphire part, so that the processing method of the camera window is simple and the cost is low.

[0072] As Figure 2 shown, in step S100, it further includes the steps:

[0073] S110. Grind and polish the surface of the sapphire part so that the surface roughness of the sapphire part is 50 nm to 100 nm;

[0074] S120. Clean and dry the sapphire part.

[0075] In step S110, since the thickness of the sapphire component may be uneven during the previous processing such as growth and cutting, before processing the transparent metal oxide layer, the surface of the sapphire component can be ground and polished so that the surface roughness of the sapphire component meets less than or equal to 100 nm. In this way, the overall thickness of the sapphire component is more uniform, which can improve the flatness of the surface of the sapphire component, and at the same time prevent the surface of the sapphire component from being too rough, resulting in gaps between the transparent metal oxide layer and the sapphire component, ensuring the stability of the surface bonding between the transparent metal oxide layer and the sapphire component. And the surface roughness of the sapphire component also meets greater than or equal to 50 nm. In this way, it is prevented that the surface of the sapphire component is too smooth, resulting in insufficient bite force between the transparent metal oxide layer and the sapphire component, ensuring the adhesion between the surface of the transparent metal oxide layer and the sapphire component. Among them, the surface roughness of the sapphire component can be set to any value within the range of 50 nm to 100 nm, such as 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, 100 nm, etc. according to actual needs. Of course, according to the needs, only the surface of the sapphire component can be ground, or only the surface of the sapphire component can be polished.

[0076] In step S120, since there will be impurities such as grinding powder and particles remaining on the surface of the sapphire component after grinding and polishing the surface of the sapphire component, the sapphire component needs to be cleaned and dried. Specifically, the sapphire component can be ultrasonically cleaned with solvents such as acetone and ethanol for 10 min to 30 min, then cleaned with plasma water, and finally the sapphire component is placed in a drying chamber for drying. In this way, cleaning the sapphire component can remove impurities such as grinding powder and particles remaining on the surface of the sapphire component, ensuring the stability of the surface bonding between the transparent metal oxide layer and the sapphire component; drying the sapphire component can remove the moisture on the surface of the sapphire component, preventing water stains from forming on the surface of the sapphire component and affecting its light transmission effect.

[0077] In step S200, it further includes the steps:

[0078] Process a transparent metal oxide layer on one side of the sapphire component by physical vapor deposition or chemical vapor deposition.

[0079] In this way, processing by physical vapor deposition or chemical vapor deposition can improve the adhesion, uniformity and durability of the transparent metal oxide layer on the sapphire component, and can precisely control the thickness of the transparent metal oxide layer. The processing method is simple and the cost is low. Among them, the physical vapor deposition method can be magnetron sputtering, evaporation plating, etc.

[0080] In one embodiment, when processing a transparent metal oxide layer on one side of a sapphire component by physical vapor deposition, the method further includes the steps of:

[0081] Processing a transparent metal oxide layer on one side of the sapphire component by magnetron sputtering, wherein the thickness of the transparent metal oxide layer is 50 nm to 500 nm.

[0082] In this way, the thickness of the transparent metal oxide layer satisfies being greater than or equal to 50 nm, preventing the thickness of the transparent metal oxide layer from being too thin and resulting in easy bonding failure when subsequently bonding the sapphire component, the transparent metal oxide layer, and the glass component; and the thickness of the transparent metal oxide layer satisfies being less than or equal to 500 nm, preventing the thickness of the transparent metal oxide layer from being too thick and resulting in too low bonding strength between the sapphire component, the transparent metal oxide layer, and the glass component, ensuring the stability and reliability of the connection between the sapphire component, the transparent metal oxide layer, and the glass component. Among them, the thickness of the transparent metal oxide layer can be set to any value within the range of 50 nm to 500 nm, such as 50 nm, 60 nm... 100 nm, 200 nm... 500 nm, etc. according to actual needs. Of course, in other embodiments, the physical vapor deposition method can also be other methods such as evaporation coating.

[0083] As Figure 3 shown, when processing a transparent metal oxide layer on one side of the sapphire component by magnetron sputtering, the method further includes the steps of:

[0084] S210. Place the sapphire component in the magnetron cavity;

[0085] S220. Perform a vacuum pumping process on the magnetron cavity so that the vacuum degree in the magnetron cavity is 1×10 -5 Pa to 1×10 -3 Pa;

[0086] S230. Introduce argon gas into the magnetron cavity, wherein the flow rate of the argon gas is 10 ml / min to 100 ml / min, and the air pressure in the magnetron cavity is 0.1 Pa to 2 Pa;

[0087] S240. Apply an electric field to the magnetron cavity to cause the target to sputter and deposit a transparent metal oxide layer on one side of the sapphire component, wherein the temperature of the magnetron cavity is 300 °C to 400 °C, the sputtering power is 60 W to 100 W, and the sputtering time is 30 min to 300 min.

[0088] Among them, the magnetron sputtering method means that electrons collide with argon atoms during the process of flying towards the sapphire part under the action of an electric field, ionizing a large number of argon ions and electrons. The electrons fly towards the sapphire part, and the argon ions are accelerated by the electric field to bombard the target, sputtering a large number of target atoms. The neutral target atoms or molecules are deposited on one side of the sapphire part to form a film, so as to form a transparent metal oxide layer.

[0089] In step S220, since a certain amount of argon gas needs to be introduced into the magnetron cavity during the magnetron sputtering process, the vacuum degree in the magnetron cavity satisfies less than or equal to 1×10 -3 Pa, to prevent the vacuum degree from being too large, resulting in too few gas molecules in the magnetron cavity and affecting the sputtering efficiency of the target or the deposition efficiency and quality of the transparent metal oxide layer; and, the vacuum degree in the magnetron cavity also satisfies greater than or equal to 1×10 -5 Pa, to prevent the vacuum degree from being too small, resulting in impurities in the magnetron cavity and avoiding the influence of impurities on the deposition efficiency and quality of the transparent metal oxide layer. Among them, the vacuum degree in the magnetron cavity can be set to 1×10 -5 Pa, 1×10 -4 Pa, 1×10 -3 Pa, etc., any value within the range of 1×10 -5 Pa to 1×10 -3 Pa.

[0090] In step S230, when the capacity of the magnetron cavity is fixed, the greater the vacuum degree in the magnetron cavity, the smaller the flow rate of argon gas, and the smaller the air pressure in the magnetron cavity; on the contrary, the smaller the vacuum degree in the magnetron cavity, the greater the flow rate of argon gas, and the greater the air pressure in the magnetron cavity. The flow rate of argon gas satisfies less than or equal to 100 ml / min, and the air pressure in the magnetron cavity satisfies less than or equal to 2 Pa, to prevent the flow rate of argon gas and the air pressure in the magnetron cavity from being too large, resulting in strong collisions of the sputtered atoms before reaching the sapphire part, reducing the number of atoms deposited on the sapphire part and affecting the deposition efficiency and quality of the transparent metal oxide layer; and, the flow rate of argon gas satisfies greater than or equal to 10 ml / min, and the air pressure in the magnetron cavity satisfies greater than or equal to 0.1 Pa, to prevent the flow rate of argon gas and the air pressure in the magnetron cavity from being too small, resulting in difficult gas ionization and difficult sputtering. Among them, the flow rate of argon gas can be set to 10 ml / min, 20 ml / min, 30 ml / min... 90 ml / min, 100 ml / min, etc., any value within the range of 10 ml / min to 100 ml / min, and the air pressure in the magnetron cavity can be set to 0.1 Pa, 0.2 Pa... 1 Pa, 2 Pa, etc., any value within the range of 0.1 Pa to 2 Pa according to actual needs.

[0091] In step S240, the temperature of the magnetron cavity satisfies being less than or equal to 400 °C to prevent excessive internal stress of the transparent metal oxide layer due to excessive temperature of the magnetron cavity, which may easily cause cracks or detachment from the sapphire component. Moreover, the temperature of the magnetron cavity satisfies being greater than or equal to 300 °C to prevent the adhesion of the transparent metal oxide layer from decreasing due to too low temperature of the magnetron cavity, ensuring the stability and reliability of the surface bonding between the transparent metal oxide layer and the sapphire component. The sputtering power satisfies being less than or equal to 100 W to prevent overheating of the target due to too high sputtering power, avoiding affecting the stability of target sputtering and the uniformity of deposition of the transparent metal oxide layer. Also, the sputtering power satisfies being greater than or equal to 60 W to prevent the deposition efficiency and adhesion of the transparent metal oxide layer from decreasing due to too low sputtering power, ensuring the stability and reliability of the surface bonding between the transparent metal oxide layer and the sapphire component. The sputtering time satisfies being greater than or equal to 30 min and less than or equal to 300 min, enabling the thickness of the transparent metal oxide layer to meet the range of 50 nm to 500 nm. Moreover, when the temperature, sputtering power, and sputtering time of the magnetron cavity all meet the above ranges, it can also ensure the roughness of the transparent metal oxide layer, preventing excessive roughness from affecting the optical properties of the transparent metal oxide layer. Among them, the temperature of the magnetron cavity can be set to any temperature within the range of 300 °C to 400 °C, such as 300 °C, 310 °C, 320 °C... 400 °C according to actual needs; the sputtering power can be set to any value within the range of 60 W to 100 W, such as 60 W, 70 W, 80 W, 90 W, 100 W according to actual needs; the sputtering time can be set to any duration within the range of 30 min to 300 min, such as 30 min, 40 min... 100 min, 200 min, 300 min according to actual needs.

[0092] In one embodiment, when fabricating a transparent metal oxide layer on one side of a sapphire component by means of magnetron sputtering, the method further includes the steps of:

[0093] Using titanium dioxide or indium oxide as the target.

[0094] In another embodiment, when fabricating a transparent metal oxide layer on one side of a sapphire component by means of magnetron sputtering, the method further includes the steps of:

[0095] Using titanium dioxide and indium oxide as the targets, and the distance between the two targets is 8 mm to 12 mm.

[0096] Thus, the distance between the two target materials satisfies being greater than or equal to 8 mm, preventing the distance between the two target materials from being too small and causing interference or collision between the two target materials, thereby ensuring the stability during the sputtering process; and, the distance between the two target materials satisfies being less than or equal to 12 mm, preventing the distance between the two target materials from being too large and affecting the sputtering effect or resulting in uneven thickness of the transparent metal oxide layer. Among them, the distance between the two target materials can be set to any value within the range of 8 mm to 12 mm, such as 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, etc., according to actual needs.

[0097] As Figure 4 shown, in step S300, it further includes the steps:

[0098] S310. Grind the edge of the glass part;

[0099] S320. Clean and dry the glass part.

[0100] In step S310, since the edge of the glass part may have sharp thorns, burrs, etc. during the cutting process, before the glass part is attached to the side of the transparent metal oxide layer facing away from the sapphire part, the edge of the glass part can be ground. In this way, the sharp thorns, burrs, etc. on the edge of the glass part can be removed, improving the overall aesthetic degree and use safety of the glass part and the camera window.

[0101] In step S320, since after cutting and grinding the glass part, there will be impurities such as abrasive powder and particles remaining on the surface of the glass part, it is necessary to clean and dry the glass part. Specifically, the glass part can be ultrasonically cleaned with solvents such as acetone and ethanol for 10 min to 30 min, then cleaned with plasma water, and finally placed in a drying chamber for drying treatment. In this way, cleaning the glass part can remove the impurities such as abrasive powder and particles remaining on the surface of the glass part, ensuring that the surfaces of the glass part and the transparent metal oxide layer can be completely attached; drying the glass part can remove the moisture on the surface of the glass part, preventing water stains from forming on the surface of the glass part and affecting its light transmission effect.

[0102] As Figure 5 shown, in step S500, it further includes the steps:

[0103] S510. Place the sapphire part, the transparent metal oxide layer and the glass part in a bonding cavity;

[0104] S520. Evacuate the bonding cavity to make the vacuum degree in the bonding cavity be 1×10 -5 Pa to 1×10 -3 Pa;

[0105] S530. Introduce an inert gas into the bonding cavity;

[0106] S540. Perform a bonding process on the transparent metal oxide layer and the glass part, where the bonding pressure is from 1 MPa to 10 MPa, the bonding temperature is from 300 °C to 450 °C, and the bonding time is from 5 min to 60 min;

[0107] S550. Cool down the bonding cavity, where the cooling rate is from 2 °C / min to 20 °C / min.

[0108] Among them, performing a bonding process on the transparent metal oxide layer and the glass part refers to eutectic bonding, that is, the process in which the transparent metal oxide layer transforms from a solid to a liquid at a certain temperature and a eutectic phase is formed on the bonding surface between the transparent metal oxide layer and the glass part through metal recrystallization.

[0109] In step S520, the vacuum degree in the bonding cavity satisfies less than or equal to 1×10 -3 Pa, preventing the vacuum degree from being too large and resulting in a decrease in the activity of the bonding surface and avoiding affecting the bonding strength; and, the vacuum degree in the bonding cavity also satisfies greater than or equal to 1×10 -5 Pa, preventing the vacuum degree from being too small and resulting in impurities in the bonding cavity and avoiding the bonding surface being contaminated by impurities and resulting in a decrease in the bonding strength, thereby ensuring the stability and reliability of the connection between the transparent metal oxide layer and the glass part. Among them, the vacuum degree in the bonding cavity can be set to 1×10 -5 Pa, 1×10 -4 Pa, 1×10 -3 Pa, etc., any value within the range of 1×10 -5 Pa to 1×10 -3 Pa.

[0110] In step S530, during the bonding process, the inert gas can ensure that the metal is not contaminated and oxidized and can increase the reaction rate. Among them, the inert gas can be argon, helium, etc.

[0111] In step S540, the bonding pressure satisfies being less than or equal to 10 MPa to prevent damage to the sapphire component, the transparent metal oxide layer, and the glass component due to excessive bonding pressure; moreover, the bonding pressure satisfies being greater than or equal to 1 MPa to prevent weak bonding caused by too low bonding pressure, thereby ensuring the stability and reliability of the connection between the transparent metal oxide layer and the glass component. The bonding temperature satisfies being less than or equal to 450 °C to prevent the alloy from accelerating diffusion to the non-bonding area due to too high bonding temperature, resulting in uneven thickness of the transparent metal oxide layer; moreover, the bonding temperature satisfies being greater than or equal to 300 °C to prevent unsuccessful or weak bonding caused by too low bonding temperature. The bonding time satisfies being less than or equal to 60 min to prevent the liquid alloy from accelerating diffusion to the non-bonding area due to too long bonding time, resulting in uneven thickness of the transparent metal oxide layer; moreover, the bonding time satisfies being greater than or equal to 5 min to prevent low bonding strength caused by too short bonding time. Among them, the bonding pressure can be set to any value within the range of 1 MPa to 10 MPa, such as 1 MPa, 2 MPa, 3 MPa... 10 MPa, according to actual needs. The bonding temperature can be set to any temperature within the range of 300 °C to 450 °C, such as 300 °C, 310 °C... 400 °C, 410 °C... 450 °C, according to actual needs. The bonding time can be set to any duration within the range of 5 min to 60 min, such as 5 min, 6 min... 10 min, 20 min... 60 min, according to actual needs.

[0112] In step S550, the bonding cavity is cooled so that the liquid metal gradually solidifies during the cooling process, thereby ensuring the bonding strength and stability between the transparent metal oxide layer and the glass component. The cooling rate satisfies being less than or equal to 20 °C / min to prevent the overall camera window from bending or cracking due to too high cooling rate, avoiding affecting the optical performance of the camera window; moreover, the cooling rate satisfies being greater than or equal to 2 °C / min to prevent the production efficiency from decreasing and the energy consumption from increasing due to too low cooling rate, avoiding cost increase. The cooling rate can be set to any value within the range of 2 °C / min to 20 °C / min, such as 2 °C / min, 3 °C / min... 10 °C / min, 20 °C / min, according to actual needs.

[0113] An embodiment of the present invention further provides a camera window, which is prepared by using the above-mentioned processing method of the camera window, and includes a sapphire component, a transparent metal oxide layer, and a glass component, wherein: the transparent metal oxide layer is stacked on one side surface of the sapphire component, and the glass component is stacked on the side surface of the transparent metal oxide layer facing away from the sapphire component. In this way, the transparent metal oxide layer serves as a bonding intermediate layer, which can ensure the reliability of the connection between the sapphire component and the glass component, and does not affect the overall light transmittance of the camera window, and can ensure that the camera window has excellent optical performance; the sapphire component enables the camera window to meet the anti-corrosion requirements, and when the size of the camera window is fixed, the glass component can reduce the size of the sapphire component, thereby making the processing method of the camera window simple and the cost low.

[0114] In one embodiment, the transparent metal oxide layer is titanium dioxide and indium oxide. Of course, in other embodiments, the transparent metal oxide layer is titanium dioxide or indium oxide alone. Moreover, the thickness of the transparent metal oxide layer is 50 nm to 500 nm. This can avoid the occurrence of bonding failure, and at the same time ensure the stability and reliability of the connection between the sapphire component, the transparent metal oxide layer, and the glass component.

[0115] An embodiment of the present invention further provides a camera, including the above-mentioned camera window. This camera can be used in special scenarios with anti-corrosion requirements, has a wide range of applications, and has low production and processing costs.

[0116] The technical features of the above-mentioned embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0117] The above-mentioned embodiments only represent several implementation manners of the present application, and their descriptions are relatively specific and detailed, but they should not be construed as limitations on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A processing method for a camera window, characterized in that, Including the steps: Providing a sapphire piece; Processing a transparent metal oxide layer on one side of the sapphire piece; Providing a glass piece; Bonding the glass piece to the side of the transparent metal oxide layer facing away from the sapphire piece; Performing a bonding treatment on the transparent metal oxide layer and the glass piece.

2. The processing method of the camera window according to claim 1, characterized in that, In the step of performing the bonding treatment on the transparent metal oxide layer and the glass piece, it further includes the steps: Placing the sapphire piece, the transparent metal oxide layer, and the glass piece in a bonding cavity; The bonding cavity is evacuated so that the vacuum degree in the bonding cavity is 1×10 -5 Pa to 1×10 - 3 Pa; Introducing an inert gas into the bonding cavity; Performing a bonding treatment on the transparent metal oxide layer and the glass piece, wherein the bonding pressure is 1 MPa to 10 MPa, the bonding temperature is 300 °C to 450 °C, and the bonding time is 5 min to 60 min; Performing a cooling treatment on the bonding cavity, wherein the cooling rate is 2 °C / min to 20 °C / min.

3. The processing method of the camera window according to claim 1, characterized in that, In the step of processing the transparent metal oxide layer on one side of the sapphire piece, it further includes the steps: Processing the transparent metal oxide layer on one side of the sapphire piece by physical vapor deposition or chemical vapor deposition.

4. The processing method of the camera window according to claim 3, characterized in that, In the step of processing the transparent metal oxide layer on one side of the sapphire piece by physical vapor deposition or chemical vapor deposition, it further includes the steps: Processing the transparent metal oxide layer on one side of the sapphire piece by magnetron sputtering, wherein the thickness of the transparent metal oxide layer is 50 nm to 500 nm.

5. The processing method of the camera window according to claim 4, characterized in that, In the step of processing the transparent metal oxide layer on one side of the sapphire piece by magnetron sputtering, it further includes the steps: Placing the sapphire piece in a magnetron cavity; The magnetron cavity is evacuated so that the vacuum degree in the magnetron cavity is 1×10 -5 Pa to 1×10 - 3 Pa; Introducing argon gas into the magnetron cavity, wherein the flow rate of the argon gas is 10 ml / min to 100 ml / min, and the air pressure in the magnetron cavity is 0.1 Pa to 2 Pa; Applying an electric field to the magnetron cavity to cause sputtering of the target and depositing a transparent metal oxide layer on one side of the sapphire piece, wherein the temperature of the magnetron cavity is 300 °C to 400 °C, the sputtering power is 60 W to 100 W, and the sputtering time is 30 min to 300 min.

6. The processing method of the camera window according to claim 4, characterized in that, In the step of processing the transparent metal oxide layer on one side of the sapphire piece by magnetron sputtering, it further includes the steps: Using titanium dioxide or indium oxide as the target; or, Using titanium dioxide and indium oxide as the targets, and the distance between the two targets is 8 mm to 12 mm.

7. The processing method of the camera window according to claim 1, characterized in that, In the step of providing the sapphire piece, it further includes the steps: Grinding and / or polishing the surface of the sapphire piece so that the surface roughness of the sapphire piece is 50 nm to 100 nm; Cleaning and drying the sapphire piece; and / or, In the step of providing the glass piece, it further includes the steps: Grinding the edge of the glass piece; Cleaning and drying the glass piece.

8. A camera window is prepared by using the processing method of the camera window according to any one of claims 1 to 7, characterized in that, Including: A sapphire piece; A transparent metal oxide layer, stacked on one side of the sapphire piece; And, A glass piece, stacked on the side of the transparent metal oxide layer facing away from the sapphire piece.

9. The camera window according to claim 8, wherein, The transparent metal oxide layer is titanium dioxide and / or indium oxide; and / or, The thickness of the transparent metal oxide layer is 50 nm to 500 nm.

10. A camera, characterized in that, Comprising a camera window according to claim 8 or claim 9.

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