Electroplating hole filling process and hole filling equipment

Abstract

The invention discloses an electroplating hole filling process and hole filling equipment, and relates to the technical field of circuit board electroplating hole filling, the equipment comprises a supporting base, an electroplating box and a lifting clamping mechanism, the lifting clamping mechanism is used for clamping a circuit board to be subjected to electroplating hole filling, the lifting clamping mechanism comprises a lifting transverse plate and a conductive clamp movably arranged on the lifting transverse plate, and further comprises a bubble auxiliary discharging mechanism and a piston type liquid spraying mechanism. When a clamped circuit board is driven by a lifting transverse plate to descend and enter the electroplating box, an arranged rolling gear rolls along a fixed rack which is fixedly arranged, so that the missing gear rotates synchronously, a sliding rack is continuously shifted, and the circuit board is clamped by the lifting transverse plate. The sliding rack depends on the first linkage rod to enable the lifting square rod to drive the lifting transverse plate, relatively descending, of the circuit board to continuously vibrate up and down in a reciprocating mode, air in micropores in the circuit board can be discharged easily, the follow-up electroplating hole filling quality is prevented from being affected, micropore exhaust treatment does not need to be conducted independently, and the operation process is simplified.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating via filling for circuit boards, and particularly relates to an electroplating via filling process and a via filling device. Background Art

[0002] Electroplating via filling is a core process in electronic manufacturing for achieving high-density interconnects. Its core objective is to uniformly fill microholes with metal (such as copper) through electrochemical deposition, avoiding defects such as voids and crevices.

[0003] The existing electroplating via filling treatment process mainly immerses the clamped circuit board in the electroplating solution through a conductive fixture, and then applies electricity, so that the anode, electroplating solution, circuit board, conductive fixture, and external power supply in the electroplating tank form a conductive path. By controlling the current in stages and simultaneously driving the circuit board to reciprocate to a certain extent in the electroplating solution, the microholes on the circuit board are filled with deposited metal.

[0004] The deficiencies of the existing electroplating via filling devices are as follows: When the existing electroplating via filling devices perform electroplating via filling, it is generally necessary to expel the air in the microholes of the circuit board to avoid the generation of bubble holes during subsequent electroplating via filling. At present, before the circuit board enters the electroplating tank, it is necessary to pre-spray the circuit board through a spraying device for a period of time to expel the air in the microholes, or to suck the circuit board separately through a negative pressure suction device to suck out the air in the microholes, and then perform the electroplating via filling operation, that is, it is necessary to separately exhaust the air in the microholes of the circuit board, resulting in inconvenient operation; at the same time, after the existing circuit board is immersed in the electroplating solution, it is also necessary to separately drive the circuit board to reciprocate up and down in the electroplating solution through a lifting drive mechanism, further resulting in inconvenient operation and use. Summary of the Invention

[0005] The purpose of the present invention is to provide an electroplating via filling process and a via filling device to solve the technical problem of inconvenient exhaust treatment of the microholes of the circuit board by the existing electroplating via filling devices.

[0006] The technical problem to be solved by the present invention can be achieved through the following technical solutions:

[0007] An electroplating via filling device includes a support base, an electroplating tank, and a lifting clamping mechanism. The lifting clamping mechanism is used to clamp the circuit board to be electroplated via filling. The lifting clamping mechanism includes a lifting cross plate and a conductive fixture movably arranged on the lifting cross plate, and further includes:

[0008] A bubble-assisted discharge mechanism. The bubble-assisted discharge mechanism includes a reciprocating drive mechanism. The reciprocating drive mechanism is arranged on the lifting cross plate, and the reciprocating drive mechanism is used to drive the conductive fixture to reciprocate longitudinally relative to the lifting cross plate;

[0009] Piston-type liquid spraying mechanism, the piston-type liquid spraying mechanism includes a piston liquid delivery mechanism and a nozzle mechanism. The nozzle mechanism is arranged at the inner bottom of the electroplating tank. The piston liquid delivery mechanism is used to suck the electroplating liquid in the electroplating tank and convey it to the nozzle mechanism. A linkage push-top mechanism linked to the piston liquid delivery mechanism is arranged at the inner bottom of the electroplating tank, and the linkage push-top mechanism is used to push the circuit board clamped on the conductive fixture to move longitudinally back and forth.

[0010] Preferably, the reciprocating drive mechanism includes a lifting square rod, a gear transmission mechanism, a missing gear, and a sliding rack. The lifting square rod longitudinally penetrates the lifting cross plate. The conductive fixture is arranged at the bottom of the lifting square rod. A connecting sliding groove is formed on the lifting cross plate. The sliding rack is slidably connected to the connecting sliding groove. A first linkage rod is movably connected between the sliding rack and the lifting square rod through a hinge. A linkage shaft is rotatably arranged on the lifting cross plate. The missing gear is coaxially and fixedly connected to the linkage shaft, and the missing gear meshes with the sliding rack.

[0011] Preferably, the gear transmission mechanism includes a fixed rack and a driving gear. The fixed rack is vertically arranged on one side of the lifting cross plate. The driving gear is rotatably connected to the lifting cross plate, and a one-way transmission mechanism is arranged between the driving gear and the linkage shaft. The driving gear also meshes with the fixed rack.

[0012] Preferably, the one-way transmission mechanism includes a ratchet ring and a ratchet pawl. The ratchet ring is coaxially and fixedly connected to the driving gear. The ratchet pawl is movably connected to the linkage shaft through a return hinge, and the ratchet pawl is in butt joint with the ratchet ring.

[0013] Preferably, a sliding frame is horizontally and slidably inserted through the bottom of the lifting square rod. The conductive fixture is installed on the sliding frame. A second spring is connected between one end of the sliding frame and the lifting square rod. The other end of the sliding frame is movably connected to a second linkage rod through a hinge, and the end of the second linkage rod away from the sliding frame is movably connected to the lifting cross plate through a hinge.

[0014] Preferably, the piston liquid delivery mechanism includes a piston cylinder and an electric push rod. The piston cylinder is fixedly installed at the bottom of the support base. A piston block is slidably fitted inside the piston cylinder. The electric push rod is fixedly connected to the support base, and the telescopic end of the electric push rod is fixedly connected to the piston block. The telescopic end of the electric push rod is connected to the linkage push-top mechanism. A one-way liquid inlet pipe and a one-way liquid outlet pipe are arranged on one side of the piston cylinder close to the electroplating tank. The piston cylinder is internally communicated with the electroplating tank through the one-way liquid inlet pipe, and the piston cylinder is communicated with the nozzle mechanism through the one-way liquid outlet pipe.

[0015] Preferably, the linkage ejection mechanism includes a docking base, a lifting support rod and a ejection rod, the docking base is arranged at the inner bottom of the electroplating box, the lifting support rod is fixedly connected to the bottom of the docking base, and the lifting support rod passes through the bottom of the electroplating box, the ejection rod is fixedly connected to the telescopic end of the electric push rod, and the end of the ejection rod is aligned under the lifting support rod, and a third spring is also connected between the ejection rod and the lifting support rod.

[0016] Preferably, a first steering bevel gear is coaxially fixedly connected to the linkage shaft, a stirring member is rotatably connected below the lifting horizontal plate, and a second steering bevel gear meshing with the first steering bevel gear is coaxially fixedly connected to the stirring member.

[0017] Preferably, the conductive clamp comprises a clamping plate and an electric telescopic rod, two electric telescopic rods are provided and symmetrically fixedly arranged on both sides of the slide, and the telescopic end of each electric telescopic rod is fixedly connected to the clamping plate.

[0018] Preferably, the lifting and clamping mechanism further comprises a vertical driving guide rail, the vertical driving guide rail is arranged vertically on the supporting base, and the lifting cross plate is slidably connected to the vertical driving guide rail, and the fixed rack is fixedly connected to the top of the vertical driving guide rail.

[0019] An electroplating hole filling process comprises the following steps:

[0020] The first step is to clamp the drilled circuit board on a conductive fixture and hang it vertically;

[0021] Step 2: The clamped circuit board is driven down by the lifting horizontal plate to be immersed in the electroplating liquid in the electroplating box;

[0022] The third step is to start the piston infusion mechanism, suck the plating liquid in the plating box through the piston infusion mechanism, and transport it to the nozzle mechanism, and then spray it to the end face of the circuit board through the nozzle mechanism.

[0023] Beneficial effects of the present invention:

[0024] 1. When the clamped circuit board is driven to descend into the electroplating box by the lifting horizontal plate of the present invention, the rolling gear is rolled along the fixed rack, so that the missing gear rotates synchronously and continuously moves the sliding rack. The sliding rack relies on the first linkage rod to make the lifting square rod drive the lifting horizontal plate that the circuit board is relatively lowered to oscillate back and forth continuously. In the process of the longitudinal reciprocating oscillation of the lifting square rod, the second linkage rod cooperates with the slide frame to transmit the circuit board horizontally, so that the circuit board can be easily immersed in the electroplating solution. The process realizes multi-directional reciprocating swing, which is beneficial to the discharge of air in the micropores on the circuit board, avoids affecting the quality of subsequent electroplating hole filling, and does not require separate micropore exhaust treatment, thereby simplifying the operation process.

[0025] 2. The present invention transports the electroplating solution to the nozzle mechanism through the piston infusion mechanism, and relies on the nozzle mechanism to spray the electroplating solution onto the circuit board to promote the completion of electroplating via holes. During the process of the piston infusion mechanism transporting the electroplating solution, it supports the docking base of the circuit board through the continuous pushing action of the push rod, facilitating the automatic up-and-down reciprocating movement of the circuit board during the electroplating via hole process, which is conducive to the continuous exchange of metal ions inside and outside the micro-holes, facilitating electroplating via holes, and eliminating the need for separate control of driving the circuit board for lifting movement.

[0026] 3. During the process of the docking base of the present invention continuously pushing the circuit board immersed in the electroplating solution up and down, the lifting square rod also drives the missing gear to rotate in the reverse direction through the sliding rack at the same time. The missing gear drives the stirring member to rotate through the first steering bevel gear and the second steering bevel gear, thus facilitating the auxiliary stirring of the electroplating solution and making the distribution of metal ions and additives uniform. Brief Description of the Drawings

[0027] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 is a schematic diagram of the relative position distribution of the lifting horizontal plate, vertical driving guide rail and fixed rack in the present invention;

[0029] Figure 3 is Figure 2 the enlarged structural schematic diagram at A in

[0030] Figure 4 is a schematic diagram of the cooperative connection structure of the lifting square rod, missing gear and carriage in the present invention;

[0031] Figure 5 is a partial structural schematic diagram of the cooperative connection between the driving gear and the fixed rack in the present invention;

[0032] Figure 6 is a schematic diagram of the cooperative setting structure of the linkage shaft and the driving gear in the present invention;

[0033] Figure 7 is a schematic diagram of the cooperative connection structure of the sliding rack and the connecting chute in the present invention;

[0034] Figure 8 is a schematic diagram of the connection structure between the nozzle mechanism and the electroplating tank in the present invention;

[0035] Figure 9 is a schematic diagram of the connection structure between the piston cylinder and the nozzle mechanism in the present invention;

[0036] Figure 10 is a schematic diagram of the state after the clamping plate clamps the circuit board and descends into the electroplating tank in the present invention.

[0037] Explanation of Reference Numerals:

[0038] 1. Support base; 2. Electroplating tank; 3. Vertical drive guide rail; 4. Horizontal drive guide rail; 5. Anode part; 6. Lifting cross plate; 7. Fixed rack; 8. Clamping plate; 9. Electric telescopic rod; 10. Sliding carriage; 11. Second spring; 12. Stirring part; 13. Second steering bevel gear; 14. First steering bevel gear; 15. Missing gear; 16. First linkage rod; 17. Second linkage rod; 18. Lifting square rod; 19. Limit stop block; 20. Sliding rack; 21. Connecting chute; 22. Driving gear; 23. Ratchet ring; 24. Linkage shaft; 25. First spring; 26. Pawl; 27. Nozzle mechanism; 28. Docking base; 29. Piston cylinder; 30. Piston block; 31. Electric push rod; 32. Pushing rod; 33. Third spring; 34. Lifting support rod; 35. Unidirectional liquid outlet pipe; 36. Unidirectional liquid inlet pipe. Detailed implementation manners

[0039] The following will describe the detailed implementation manners of the present invention in detail, but it should be understood that the protection scope of the present invention is not limited by the detailed implementation manners.

[0040] As Figures 1-10 shown, an electroplating hole filling device includes a support base 1, an electroplating tank 2 and a lifting clamping mechanism. The electroplating tank 2 is fixedly installed on the support base 1, and the electroplating tank 2 is filled with electroplating solution. At the same time, anode parts 5 for conducting electricity are distributed on both sides of the inner bottom of the electroplating tank 2. The anode parts 5 are electrically connected to the positive electrode of an external power supply through wires. The lifting clamping mechanism is used to clamp a circuit board to be electroplated and filled with holes. The lifting clamping mechanism includes a lifting cross plate 6 and a conductive clamp movably arranged on the lifting cross plate 6. The conductive clamp is used to directly clamp the circuit board, and the lifting cross plate 6 moves longitudinally; conductive bodies for contacting the conductive contacts of the circuit board are distributed on the conductive clamp. The conductive bodies are electrically connected to the negative electrode of the external power supply through wires. When the lifting clamping mechanism clamps the circuit board and descends into the electroplating solution in the electroplating tank 2, the positive electrode of the power supply, the anode part 5, the circuit board, the conductive body and the negative electrode of the power supply form a complete closed circuit to realize power-on; the device also includes a bubble auxiliary discharge mechanism and a piston type liquid spraying mechanism;

[0041] The bubble auxiliary discharge mechanism includes a reciprocating drive mechanism. The reciprocating drive mechanism is arranged on the lifting cross plate 6, and the reciprocating drive mechanism is used to drive the conductive clamp to move longitudinally back and forth relative to the lifting cross plate 6. In this way, the clamped circuit board can be reciprocated up and down separately during the process of descending and submerging into the electroplating solution, which is convenient for discharging the air deep in the micro-holes and avoiding the air hindering the electroplating solution from contacting the deep part of the micro-holes during subsequent electroplating hole filling, resulting in holes;

[0042] The piston-type liquid spraying mechanism includes a piston liquid delivery mechanism and a nozzle mechanism 27. There are two sets of nozzle mechanisms 27, which are symmetrically distributed on both sides of the inner bottom of the electroplating tank 2. The nozzle mechanism 27 includes a plurality of nozzles inclined upward and a main pipeline communicated with each nozzle. The main pipeline is communicated with the piston liquid delivery mechanism. The piston liquid delivery mechanism is used to suck the electroplating liquid in the electroplating tank 2 and deliver it to the nozzle mechanism 27, and rely on the nozzle mechanism 27 to spray onto the end face of the circuit board, so as to facilitate the electroplating liquid to enter the micro-holes on the circuit board, realize electroplating hole filling, and at the same time facilitate the continuous ion exchange of the electroplating liquid inside and outside the micro-holes, avoid too large concentration difference inside and outside, and affect the electroplating hole filling effect; and during the electroplating hole filling process, the current size is controlled step by step; a linkage push-top mechanism linked with the piston liquid delivery mechanism is arranged on the inner bottom of the electroplating tank 2. The linkage push-top mechanism is used to push the circuit board clamped on the conductive fixture to move back and forth longitudinally. In this way, it is beneficial to generate electroplating liquid disturbance during the electroplating hole filling process of the circuit board, at the same time reduce the spraying dead angle of the nozzle mechanism 27, and reduce the adhesion of bubbles on the surface of the circuit board, preventing abnormal local deposition.

[0043] In some specific implementation schemes, in combination with Figures 2 to 4As shown, the reciprocating drive mechanism includes a lifting square rod 18, a gear transmission mechanism, a missing gear 15, and a sliding rack 20. The lifting square rod 18 longitudinally penetrates the lifting cross plate 6, and the lifting square rod 18 can slide up and down relative to the lifting cross plate 6. The conductive fixture is arranged at the bottom of the lifting square rod 18. A limit stop block 19 is fixedly connected to the lifting square rod 18 near the top position. The limit stop block 19 is used to prevent the lifting square rod 18 from completely falling off relative to the lifting cross plate 6. A connecting chute 21 is formed on the lifting cross plate 6. The connecting chute 21 is a T-shaped groove. The sliding rack 20 is slidably connected to the connecting chute 21. A first linkage rod 16 is movably connected between the sliding rack 20 and the lifting square rod 18 by a hinge, that is, one end of the first linkage rod 16 is movably connected to the lifting square rod 18 by a hinge, and the other end is movably connected to the sliding rack 20 by a hinge. The lifting square rod 18 can descend by its own gravity and push the sliding rack 20 to slide along the connecting chute 21 to the farthest position through the first linkage rod 16. A linkage shaft 24 is rotatably connected to the lifting cross plate 6 through a shaft bracket. The missing gear 15 is coaxially and fixedly connected to the linkage shaft 24, and the missing gear 15 is engaged with the sliding rack 20. During the descent of the lifting cross plate 6, the gear transmission mechanism drives the missing gear 15 to rotate clockwise. The missing gear 15 can then push the sliding rack 20 to slide along the connecting chute 21 and approach the lifting square rod 18. During this process, the sliding rack 20 pushes the lifting square rod 18 to rise through the first linkage rod 16. When the effective tooth part of the missing gear 15 disengages from the sliding rack 20, the lifting square rod 18 quickly falls by gravity and pushes the sliding rack 20 to slide back to the reset position through the first linkage rod 16. Then, when the effective tooth part of the rotating missing gear 15 rotates to the position of the reset sliding rack 20 again, the missing gear 15 just meshes with the sliding rack 20 again. Repeating like this, the lifting square rod 18 drives the conductive fixture clamping the circuit board to continuously move up and down.

[0044] In some specific implementation schemes, the gear transmission mechanism includes a fixed rack 7 and a driving gear 22. The fixed rack 7 is vertically arranged on one side of the lifting cross plate 6, and the longitudinal position of the fixed rack 7 relative to the electroplating tank 2 is fixed, that is, during the descent of the lifting cross plate 6, the fixed rack 7 remains in place. The driving gear 22 is rotatably connected to the lifting cross plate 6 through a rotating shaft, and a one-way transmission mechanism is arranged between the driving gear 22 and the linkage shaft 24. The driving gear 22 is also engaged with the fixed rack 7.

[0045] During the process of the lifting cross plate 6 descending uniformly with the clamped circuit board, the driving gear 22 rolls clockwise along the fixed rack 7. During this process, the driving gear 22 drives the linkage shaft 24 to rotate through the one-way transmission mechanism, and the linkage shaft 24 drives the missing gear 15 to rotate synchronously, so as to facilitate the reciprocating lifting and oscillation of the lifting square rod 18 with the clamped circuit board during the descent of the lifting cross plate 6.

[0046] In some specific implementation schemes, such asFigure 6 As shown in the figure, the one-way transmission mechanism includes a ratchet ring 23 and a pawl 26. The ratchet ring 23 is coaxially and fixedly connected to the driving gear 22, and the two rotate synchronously. The inner ring of the ratchet ring 23 is distributed with inclined card slots that cooperate with the pawl 26. The pawl 26 is movably connected to the linkage shaft 24 through a resilient hinge, and the pawl 26 is docked with the ratchet ring 23. It should be noted that the connecting end of the pawl 26 is attached to the outer wall of the end of the linkage shaft 24, and one side edge of the connecting end of the pawl 26 close to the lifting square rod 18 is movably connected to the linkage shaft 24 through a resilient hinge;

[0047] During the process of the driving gear 22 descending with the lifting cross plate 6, the driving gear 22 rolls clockwise along the fixed rack 7. The driving gear 22 drives the ratchet ring 23 to rotate synchronously. The ratchet ring 23 then drives the linkage shaft 24 to rotate through the engaged pawl 26, and the linkage shaft 24 drives the missing gear 15 to rotate. After the electroplating filling of the holes is completed, the lifting cross plate 6 drives the clamped circuit board to rise. At this time, the driving gear 22 rolls counterclockwise along the fixed rack 7, and the ratchet ring 23 rotates synchronously. However, the pawl 26 deflects relative to the linkage shaft 24 due to extrusion. In this way, the missing gear 15 cannot rotate, thus preventing the circuit board from making longitudinal reciprocating movements relative to the lifting cross plate 6 during the rising process.

[0048] It should be noted that when the lifting cross plate 6 drives the circuit board to be completely immersed in the electroplating solution and reaches the descending position, the driving gear 22 is disengaged from the fixed rack 7. At this time, it can prevent interfering with the piston infusion mechanism from continuously pushing and lifting the circuit board through the linkage pushing mechanism.

[0049] In addition, it should be noted that the driving gear 22 is not connected to the linkage shaft 24.

[0050] Meanwhile, a counterweight can be installed on the part of the missing gear 15 close to the effective tooth body to ensure that when the driving gear 22 is separated from the fixed rack 7, the effective tooth body of the missing gear 15 can always deflect downward, thus facilitating the docking with the sliding rack 20.

[0051] In some specific implementation schemes, in order to further enhance the movement degree of the circuit board when descending and immersing in the electroplating solution, improve the micropore air discharge effect, and the subsequent electroplating filling effect, as shown in Figure 3 and Figure 4 A sliding frame 10 is horizontally and slidably inserted through the bottom of the lifting square rod 18. The conductive fixture is installed on the sliding frame 10. One end of the sliding frame 10 is connected to the lifting square rod 18 by a second spring 11. The second spring 11 can be compressed. The other end of the sliding frame 10 is movably connected to a second linkage rod 17 through a hinge, and the end of the second linkage rod 17 away from the sliding frame 10 is movably connected to the lifting cross plate 6 through a hinge, and the second linkage rod 17 is inclined between the sliding frame 10 and the lifting cross plate 6.

[0052] Whenever the lifting square rod 18 rises relative to the lifting cross plate 6, the second linkage rod 17 is subjected to a squeezing effect, thereby pushing the carriage 10 to move horizontally relative to the lifting square rod 18 and compressing the second spring 11. In this way, the conductive fixture holding the circuit board can be driven to move horizontally while moving longitudinally along with the lifting square rod 18, which is beneficial to the discharge of air in the micro-holes at different angles.

[0053] In some specific embodiments, as Figure 9 shown, when the nozzle mechanism 27 is set to two groups, two groups of piston infusion mechanisms are provided, which are respectively arranged in corresponding cooperation with the nozzle mechanism 27. Each group of piston infusion mechanisms includes a piston cylinder 29 and an electric push rod 31. The piston cylinder 29 is fixedly installed at the bottom of the support base 1. A piston block 30 is slidably fitted inside the piston cylinder 29. The electric push rod 31 is fixedly connected to the support base 1 through a bracket, and the telescopic end of the electric push rod 31 is fixedly connected to the piston block 30. The telescopic end of the electric push rod 31 is connected to the linkage pushing mechanism in cooperation. A one-way inlet pipe 36 and a one-way outlet pipe 35 are arranged on one side of the piston cylinder 29 close to the electroplating tank 2. The piston cylinder 29 is internally connected to the electroplating tank 2 through the one-way inlet pipe 36, and the piston cylinder 29 is connected to the nozzle mechanism 27 through the one-way outlet pipe 35. Here, both the one-way inlet pipe 36 and the one-way outlet pipe 35 include a pipe body and a one-way valve installed on the pipe body. The one-way valve of the one-way inlet pipe 36 enables the electroplating solution to only enter the piston cylinder 29 through the electroplating tank 2 and cannot flow backward. The one-way valve of the one-way outlet pipe 35 enables the electroplating solution to only flow from the piston cylinder 29 to the nozzle mechanism 27 and cannot flow backward;

[0054] When the electric push rod 31 is started, it continuously reciprocates and telescopes, thereby continuously driving the piston block 30 to reciprocate inside the piston cylinder 29, continuously sucking the electroplating solution from the electroplating tank 2 through the one-way inlet pipe 36, and sending it to the nozzle mechanism 27 through the one-way outlet pipe 35. The nozzle mechanism 27 then sprays the electroplating solution onto the circuit board.

[0055] In some specific embodiments, the linkage pushing mechanism comprises a docking base 28, a lifting support rod 34 and a pushing rod 32. The docking base 28 is arranged at the inner bottom of the electroplating tank 2. When the circuit board descends, the docking base 28 is used to support the bottom of the circuit board. The lifting support rod 34 is fixedly connected to the bottom of the docking base 28, and the lifting support rod 34 penetrates through the bottom of the electroplating tank 2 and extends below the support base 1. The lifting support rod 34 can slide up and down. To avoid liquid leakage, a rubber sealing sleeve is installed at the penetration position of the lifting support rod 34, or an elastic membrane is arranged at the position where the lifting support rod 34 passes through below the support base 1, so that the elastic membrane is connected around the lifting support rod 34 and its edge is connected to the bottom side wall of the support base 1 to ensure sealing. The pushing rod 32 is fixedly connected to the telescopic end of the electric push rod 31, and the end of the pushing rod 32 is aligned below the lifting support rod 34. A compressible third spring 33 is also connected between the pushing rod 32 and the lifting support rod 34.

[0056] When the electric push rod 31 extends to push the piston block 30, it drives the pushing rod 32 to rise synchronously, and pushes the lifting support rod 34 through the third spring 33 to make it rise synchronously. The lifting support rod 34 drives the docking base 28 to rise synchronously, and the docking base 28 then pushes the circuit board upward. At this time, the circuit board rises relative to the lifting cross plate 6 by relying on the lifting square rod 18. There is a limit block at the bottom of the lifting support rod 34, and it stops after rising a certain height. At this time, the piston block 30 has not moved in place yet. At this time, the pushing rod 32 continues to move synchronously with the telescopic end of the electric push rod 31, thereby compressing the third spring 33. When the electric push rod 31 contracts, the pushing rod 32 pulls the docking base 28 downward through the third spring 33. In this way, it can be realized that after the circuit board is immersed in the electroplating solution, it can continue to reciprocate up and down, which is convenient for completing electroplating of vias.

[0057] It should be noted that a first spring 25 is connected between the connecting chute 21 and the sliding rack 20. When the lifting square rod 18 is kept at the lowest position by the action of gravity, that is, when the limit stop block 19 fits on the lifting cross plate 6, the first spring 25 is in a stretched state, and the sliding rack 20 is at a position away from the lifting square rod 18. The lifting square rod 18 can overcome the restoring force of the first spring 25 by its own gravity and push the sliding rack 20 to slide along the connecting chute 21 to the farthest position through the first linkage rod 16, resulting in the stretching of the first spring 25. Then when the docking base 28 pushes the circuit board upward each time, causing the lifting square rod 18 to rise, the set sliding rack 20 can slide close to the lifting square rod 18 by relying on the restoring force of the first spring 25. In this way, it is convenient for the first linkage rod 16 to deflect coordinately as the lifting square rod 18 rises, avoiding movement obstruction.

[0058] In some specific embodiments, in order to further ensure the uniform distribution of ions in the electroplating solution and improve the electroplating via filling effect, a first steering bevel gear 14 is coaxially and fixedly connected to the linkage shaft 24. A stirring member 12 is rotatably connected to the lower side of the lifting cross plate 6 through a rotating shaft, and a second steering bevel gear 13 meshing with the first steering bevel gear 14 is coaxially and fixedly connected to the stirring member 12.

[0059] During the lifting process of the circuit board relying on the docking base 28 to push, the lifting square rod 18 continuously rises and falls. During the continuous rising and falling process of the lifting square rod 18, it will also drive the sliding rack 20 to reciprocate through the first linkage rod 16. In this way, the missing gear 15 can be deflected back and forth. The missing gear 15 drives the first steering bevel gear 14 to deflect back and forth through the linkage shaft 24. The first steering bevel gear 14 drives the stirring member 12 to continuously deflect back and forth through the second steering bevel gear 13, so as to facilitate the stirring of the electroplating solution and promote the uniform distribution of relevant metal ions or subsequent added additives in the electroplating solution.

[0060] In some specific embodiments, as Figure 4 shown, the conductive fixture includes clamping plates 8 and electric telescopic rods 9. There are two electric telescopic rods 9, which are symmetrically and fixedly arranged on both sides of the sliding frame 10. The telescopic end of each electric telescopic rod 9 is fixedly connected to a clamping plate 8, and the conductors are distributed on the clamping plates 8. When it is necessary to clamp the circuit board, the circuit board is made to be in a vertical state, and the top edge is located between the two clamping plates 8. Then, the electric telescopic rods 9 on both sides are started simultaneously. Here, the two electric telescopic rods 9 can be controlled to start and stop through the same control switch. Finally, the circuit board is vertically fixed and clamped by the clamping plates 8.

[0061] In some specific embodiments, the lifting and clamping mechanism further includes a vertical driving guide rail 3. The vertical driving guide rail 3 is vertically supported on the base 1, and the lifting cross plate 6 is slidably connected to the vertical driving guide rail 3. Driven by the vertical driving guide rail 3, the lifting cross plate 6 is controlled to rise and fall. Here, a driving lead screw can be arranged inside the vertical driving guide rail 3. The driving lead screw is threadedly connected to the lifting cross plate 6, and the driving lead screw is driven to rotate by a motor. In addition, two groups of vertical driving guide rails 3 are provided, and the driving sources of the two groups are controlled to start and stop through the same control switch;

[0062] And the provided fixed rack 7 can be fixedly connected to the top of the vertical driving guide rail 3 through a bracket.

[0063] In some other specific embodiments, in order to facilitate the translation of the circuit board away from above the electroplating tank 2, a horizontal driving guide rail 4 can also be installed on the support base 1. The vertical driving guide rail 3 is slidably arranged on the horizontal driving guide rail 4, so that the clamped circuit board can be horizontally translated by relying on the horizontal driving guide rail 4.

[0064] An electroplating via filling process includes the following steps:

[0065] First step: Clamp the circuit board after drilling treatment on the conductive fixture and hang it vertically.

[0066] Second step: Drive the clamped circuit board to descend through the lifting cross plate 6 and immerse it in the plating solution in the plating tank 2.

[0067] Third step: Start the piston liquid delivery mechanism, suck the plating solution in the plating tank 2 through the piston liquid delivery mechanism, and convey it to the nozzle mechanism 27. Rely on the nozzle mechanism 27 to spray it onto the end face of the circuit board, so as to facilitate the plating solution to enter the micropores on the circuit board and achieve electroplating filling of holes.

[0068] For the convenience of those skilled in the art to understand the embodiments of this solution, the working principle of this solution will be briefly described in combination with a specific application scenario:

[0069] First, place the circuit board in a vertical state and make the top edge between the two clamping plates 8. Then start the electric telescopic rods 9 on both sides at the same time. Rely on the clamping plates 8 to vertically fix and clamp the circuit board, and the conductor contacts the conductive position of the circuit board.

[0070] Then drive the lifting cross plate 6 through the vertical drive guide rail 3 to drive the clamped circuit board to transport and descend into the plating tank 2. During this process, the driving gear 22 rolls clockwise along the fixed rack 7. The driving gear 22 drives the ratchet ring 23 to rotate synchronously. The ratchet ring 23 then drives the linkage shaft 24 to rotate through the engaged ratchet pawl 26. The linkage shaft 24 drives the missing gear 15 to rotate. The missing gear 15 can then move the sliding rack 20 along the connecting chute 21 and slide closer to the lifting square rod 18. During this process, the sliding rack 20 pushes the lifting square rod 18 to rise through the first linkage rod 16. When the effective tooth part of the missing gear 15 disengages from the sliding rack 20, the lifting square rod 18 quickly falls by gravity and pushes the sliding rack 20 to slide back to its original position through the first linkage rod 16. Then when the effective tooth part of the rotating missing gear 15 rotates to the position of the reset sliding rack 20 again, the missing gear 15 just meshes with the sliding rack 20 again. Repeating like this, the lifting square rod 18 drives the circuit board held to oscillate up and down reciprocally.

[0071] And whenever the lifting square rod 18 rises relative to the lifting cross plate 6, the second linkage rod 17 is subjected to a squeezing effect, thus pushing the carriage 10 to move horizontally relative to the lifting square rod 18 and compressing the second spring 11. In this way, the clamped circuit board can perform a transverse reciprocating movement while moving longitudinally with the lifting square rod 18, realizing that the circuit board swings reciprocally in multiple directions during the process of descending and immersing in the plating solution, which is beneficial to the discharge of air in the micropores at different angles on the circuit board and avoids affecting or perhaps the quality of electroplating hole filling.

[0072] When the lifting and horizontal plate 6 drives the circuit board to descend and stops completely after being fully immersed in the electroplating solution, at this time, the bottom of the circuit board contacts the docking base 28, and at this time, the driving gear 22 and the fixed rack 7 have been separated. When the electric push rod 31 starts, it continuously reciprocates and expands and contracts, thus continuously driving the piston block 30 to reciprocate in the piston cylinder 29, continuously sucking the electroplating solution from the electroplating tank 2 through the one-way liquid inlet pipe 36, and sending it to the nozzle mechanism 27 through the one-way liquid outlet pipe 35. The nozzle mechanism 27 then sprays the electroplating solution onto the circuit board;

[0073] And when the electric push rod 31 extends to push the piston block 30, it drives the push rod 32 to rise synchronously, and pushes the lifting support rod 34 through the third spring 33, causing it to rise synchronously. The lifting support rod 34 drives the docking base 28 to rise synchronously, and the docking base 28 then pushes the circuit board upward. At this time, the circuit board rises relative to the lifting and horizontal plate 6 by relying on the lifting square rod 18. There is a limit block at the bottom of the lifting support rod 34, and it stops after rising a certain height. At this time, the piston block 30 has not moved in place yet. At this time, the push rod 32 continues to move synchronously with the telescopic end of the electric push rod 31, thus compressing the third spring 33. When the electric push rod 31 contracts, the push rod 32 pulls the docking base 28 downward through the third spring 33. In this way, it can be realized that after the circuit board is immersed in the electroplating solution, it can continue to move longitudinally and horizontally, which is beneficial to generating electroplating solution disturbance during the electroplating via filling process of the circuit board, while reducing the spraying dead angle of the nozzle mechanism 27, and reducing the attachment of bubbles on the surface of the circuit board, preventing abnormal local deposition, and facilitating the continuous exchange of metal ions in the micro-holes, avoiding too large internal and external concentration differences and affecting the electroplating via filling effect;

[0074] During the process of the circuit board being pushed up and down by the docking base 28, the lifting square rod 18 continuously rises and falls. During the continuous rising and falling process of the lifting square rod 18, it will also drive the sliding rack 20 to reciprocate through the first linkage rod 16. In this way, the missing gear 15 can be deflected back and forth. The missing gear 15 drives the first steering bevel gear 14 to deflect back and forth through the linkage shaft 24. The first steering bevel gear 14 drives the stirring member 12 to deflect back and forth through the second steering bevel gear 13, so as to facilitate the stirring of the electroplating solution and promote the uniform distribution of relevant metal ions or subsequent additives in the electroplating solution.

[0075] The above discloses only several specific embodiments of the present invention. However, the embodiments of the present invention are not limited thereto, and any changes that can be thought of by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. An electroplating via filling device, comprising a support base (1), an electroplating tank (2) and a lifting clamping mechanism for clamping a circuit board to be electroplated and filled with vias. The lifting clamping mechanism includes a lifting cross plate (6) and a conductive fixture movably arranged on the lifting cross plate (6), characterized in that, Further comprising: A bubble-assisted discharge mechanism, the bubble-assisted discharge mechanism includes a reciprocating drive mechanism, the reciprocating drive mechanism is arranged on the lifting cross plate (6), and the reciprocating drive mechanism is used to drive the conductive fixture to move longitudinally back and forth relative to the lifting cross plate (6); A piston-type liquid spraying mechanism, the piston-type liquid spraying mechanism includes a piston liquid delivery mechanism and a spray pipe mechanism (27), the spray pipe mechanism (27) is arranged at the inner bottom of the electroplating tank (2), the piston liquid delivery mechanism is used to suck the electroplating liquid in the electroplating tank (2) and deliver it to the spray pipe mechanism (27), and a linkage push mechanism linked with the piston liquid delivery mechanism is arranged at the inner bottom of the electroplating tank (2), and the linkage push mechanism is used to push the circuit board clamped on the conductive fixture to move longitudinally back and forth.

2. The electroplating via-hole filling device according to claim 1, wherein The reciprocating drive mechanism includes a lifting square rod (18), a gear transmission mechanism, a missing gear (15) and a sliding rack (20), the lifting square rod (18) longitudinally penetrates through the lifting cross plate (6), the conductive fixture is arranged at the bottom of the lifting square rod (18), a connecting chute (21) is opened on the lifting cross plate (6), the sliding rack (20) is slidably connected with the connecting chute (21), a first linkage rod (16) is movably connected between the sliding rack (20) and the lifting square rod (18) through a hinge, a linkage shaft (24) is rotatably arranged on the lifting cross plate (6), the missing gear (15) is coaxially and fixedly connected to the linkage shaft (24), and the missing gear (15) is meshed with the sliding rack (20).

3. The electroplating via-hole filling device according to claim 2, characterized in that, The gear transmission mechanism includes a fixed rack (7) and a driving gear (22), the fixed rack (7) is vertically arranged on one side of the lifting cross plate (6), the driving gear (22) is rotatably connected to the lifting cross plate (6), and a one-way transmission mechanism is arranged between the driving gear (22) and the linkage shaft (24), and the driving gear (22) is also meshed with the fixed rack (7).

4. The electroplating via-hole filling device according to claim 3, characterized in that, The one-way transmission mechanism includes a ratchet ring (23) and a ratchet pawl (26), the ratchet ring (23) is coaxially and fixedly connected to the driving gear (22), the ratchet pawl (26) is movably connected to the linkage shaft (24) through a return hinge, and the ratchet pawl (26) is docked with the ratchet ring (23).

5. The electroplating via hole filling device according to claim 2, wherein A sliding frame (10) is horizontally and slidably inserted through the bottom of the lifting square rod (18), the conductive fixture is installed on the sliding frame (10), a second spring (11) is connected between one end of the sliding frame (10) and the lifting square rod (18), the other end of the sliding frame (10) is movably connected with a second linkage rod (17) through a hinge, and the end of the second linkage rod (17) far away from the sliding frame (10) is movably connected with the lifting cross plate (6) through a hinge.

6. The electroplating via hole filling device according to claim 1, wherein, The piston infusion mechanism includes a piston cylinder (29) and an electric push rod (31). The piston cylinder (29) is fixedly installed at the bottom of the support base (1). A piston block (30) is slidably fitted inside the piston cylinder (29). The electric push rod (31) is fixedly connected to the support base (1), and the telescopic end of the electric push rod (31) is fixedly connected to the piston block (30). The telescopic end of the electric push rod (31) is connected to the linkage push-top mechanism in a cooperative manner. One side of the piston cylinder (29) close to the electroplating tank (2) is provided with a one-way liquid inlet pipe (36) and a one-way liquid outlet pipe (35). The piston cylinder (29) is internally connected to the electroplating tank (2) through the one-way liquid inlet pipe (36), and the piston cylinder (29) is connected to the spray pipe mechanism (27) through the one-way liquid outlet pipe (35).

7. The electroplating via-hole filling equipment according to claim 6, characterized in that, The linkage push-top mechanism includes a docking base (28), a lifting support rod (34) and a push rod (32). The docking base (28) is arranged at the inner bottom of the electroplating tank (2). The lifting support rod (34) is fixedly connected to the bottom of the docking base (28), and the lifting support rod (34) penetrates through the bottom of the electroplating tank (2). The push rod (32) is fixedly connected to the telescopic end of the electric push rod (31), and the end of the push rod (32) is aligned below the lifting support rod (34). A third spring (33) is also connected between the push rod (32) and the lifting support rod (34).

8. The electroplating via hole filling device according to claim 2, characterized in that, A first steering bevel gear (14) is coaxially and fixedly connected to the linkage shaft (24). A stirring member (12) is rotatably connected below the lifting horizontal plate (6), and a second steering bevel gear (13) meshing with the first steering bevel gear (14) is coaxially and fixedly connected to the stirring member (12).

9. The electroplating via-hole filling equipment according to claim 3, characterized in that, The lifting clamping mechanism further includes a vertical driving guide rail (3). The vertical driving guide rail (3) is vertically arranged with respect to the support base (1), and the lifting horizontal plate (6) is slidably connected to the vertical driving guide rail (3). The fixed rack (7) is fixedly connected to the top of the vertical driving guide rail (3).

10. An electroplating via filling process, implemented by an electroplating via filling device as described in claim 1, characterized in that, It includes the following steps: First step: Clamp the circuit board after drilling on the conductive fixture and hang it vertically. Second step: Drive the clamped circuit board to descend through the lifting horizontal plate (6) and immerse it in the electroplating solution in the electroplating tank (2). Third step: Start the piston infusion mechanism, suck the electroplating solution in the electroplating tank (2) through the piston infusion mechanism, and convey it to the spray pipe mechanism (27), and rely on the spray pipe mechanism (27) to spray it on the end face of the circuit board.

Images