Probe pin test equipment of integrated circuit test socket

Abstract

The invention provides a probe pin testing device of an integrated circuit testing seat, which comprises a testing device, a pressing block and a sealing device, and is characterized in that the pressing block is arranged on the testing device, and the sealing device comprises a mounting plate, a plurality of connecting rods, a sealing plate, a moving plate, a plurality of through holes, eight first reset pieces, four moving grooves and eight moving blocks, the mounting plate is slidably connected into the testing device, the connecting rods are rotatably connected to the bottom of the mounting plate, the sealing plate is arranged at one end of each connecting rod, and the moving plate is arranged at the bottom of the sealing plate. According to the probe pin test equipment of the integrated circuit test seat, the plurality of probes in the test device are sealed and protected through the sealing device, so that dust is prevented from being attached to the surfaces of the probes to influence the use of the probes, and meanwhile, the probe pin test equipment can be opened during use to enable the probes to be in contact with pins of an integrated circuit, so that the service life of the integrated circuit test seat is prolonged. The use is convenient.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit testing, and particularly to a probe foot testing device for an integrated circuit test socket. Background Art

[0002] An integrated circuit is a microelectronic device or component. Using a certain process, components such as transistors, resistors, capacitors, and inductors required in a circuit, as well as the wiring, are interconnected and fabricated on a small piece or a few small pieces of semiconductor wafers or dielectric substrates, and then encapsulated in a package to form a micro-structure with the required circuit functions.

[0003] Now, in order to facilitate the detection of integrated circuits, a test socket is used to limit the integrated circuit, thus replacing the traditional manual soldering chip testing method.

[0004] However, the probes inside the test socket are exposed to the air when not in use, resulting in dust, debris, etc. adhering to the surface of the probes. When the probes come into contact with the pins or other components of the integrated circuit, an increase in contact resistance may cause unstable signal transmission, problems such as signal attenuation, distortion, or transmission errors, affecting the normal operation of the integrated circuit.

[0005] Therefore, it is necessary to provide a probe foot testing device for an integrated circuit test socket to solve the above technical problems. Summary of the Invention

[0006] The present invention provides a probe foot testing device for an integrated circuit test socket, which solves the problem that the probes inside the current test socket are exposed to the air when not in use, causing dust to adhere to their surfaces.

[0007] To solve the above technical problems, a probe foot testing device for an integrated circuit test socket provided by the present invention includes: a testing device, a pressing block, and a sealing device;

[0008] The extrusion block is arranged on the testing device;

[0009] The sealing device includes a mounting plate, a plurality of connecting rods, a sealing plate, a moving plate, a plurality of through holes, eight first resetting members, four moving grooves, and eight moving blocks. The mounting plate is slidably connected to the inside of the testing device. A plurality of the connecting rods are rotatably connected to the bottom of the mounting plate. The sealing plate is arranged at one end of the connecting rods. The moving plate is arranged at the bottom of the sealing plate. A plurality of the through holes are respectively opened in the sealing plate and the moving plate. Four of the moving grooves are respectively opened in the testing device. Eight of the first resetting members are respectively arranged inside the four moving grooves. Eight of the moving blocks are respectively slidably connected to the inside of the four moving grooves.

[0010] Preferably, one end of each of the plurality of connecting rods is rotatably connected to the bottom of the mounting plate, and the other end is rotatably connected to the inside of the sealing plate.

[0011] Preferably, one side of each of the eight moving blocks is fixedly connected to both ends of both sides of the mounting plate and the moving plate.

[0012] Preferably, a guiding device is provided inside the moving block. The guiding device includes a guiding hole and a guiding rod. The guiding hole is formed inside the moving block, and the guiding rod is slidably connected to the inside of the guiding hole.

[0013] Preferably, a sliding assembly is provided inside the moving plate. The sliding assembly includes a sliding groove and a sliding block. The sliding groove is formed inside the moving plate, and the sliding block is slidably connected to the inside of the sliding groove.

[0014] Preferably, four filter nets are fixedly installed inside the testing device. The four filter nets are grouped in pairs and installed on opposite faces inside the testing device respectively.

[0015] Preferably, two first baffles are fixedly connected to one side of the plurality of moving blocks. Two connecting rods are fixedly connected to the bottom of both of the two first baffles. One end of each of the plurality of connecting rods is fixedly connected to two second baffles.

[0016] Preferably, a cleaning device is provided inside the testing device. The cleaning device includes a plurality of cleaning parts and a plurality of storage holes. The plurality of cleaning parts are all arranged inside the testing device, and the plurality of storage holes are respectively formed inside the plurality of cleaning parts.

[0017] Preferably, a reset device is provided inside the testing device. The reset device includes a plurality of support rods, a plurality of second reset parts, a plurality of mounting frames, a plurality of separation grooves and a plurality of separation blocks. One end of each of the plurality of support rods is fixedly connected to the bottom of the moving plate. The plurality of second reset parts are respectively arranged on one side of the plurality of support rods. The plurality of mounting frames are respectively located on one side of the plurality of second reset parts. The plurality of separation grooves are respectively located inside the plurality of mounting frames. One end of each of the plurality of separation blocks is fixedly connected to the inside of the testing device.

[0018] Preferably, one side of each of the plurality of cleaning parts is fixedly installed on one side of each of the plurality of mounting frames.

[0019] Compared with the related art, a probe pin testing device for an integrated circuit test socket provided by the present invention has the following beneficial effects:

[0020] The present invention provides a probe foot testing device for an integrated circuit test socket, which seals and protects a plurality of probes inside the test device through a sealing device, thereby preventing dust from adhering to the surface of the probes and affecting their use. At the same time, it can be opened during use to make the probes contact the pins of the integrated circuit, facilitating its use. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 FIG. 6 is a schematic structural diagram of a first embodiment of a probe foot testing device for an integrated circuit test socket provided by the present invention;

[0022] Figure 2 is Figure 1 a schematic cross-sectional structural diagram of the test device shown in FIG. 6;

[0023] Figure 3 is Figure 2 an enlarged schematic diagram of part A shown in FIG. 6;

[0024] Figure 4 FIG. 22 is a schematic structural diagram of a second embodiment of a probe foot testing device for an integrated circuit test socket provided by the present invention;

[0025] Figure 5 is Figure 1 a schematic structural diagram of the first baffle shown in FIG. 22;

[0026] Figure 6 FIG. 32 is a schematic structural diagram of a third embodiment of a probe foot testing device for an integrated circuit test socket provided by the present invention;

[0027] Figure 7 is Figure 6 a schematic structural diagram of the cleaning member shown in FIG. 32;

[0028] Figure 8 is Figure 6 an enlarged schematic diagram of part B shown in FIG. 32.

[0029] Reference numerals in the figures: 1, test device; 2, pressing block;

[0030] 3, sealing device; 31, mounting plate; 32, connecting rod; 33, sealing plate; 34, moving plate; 35, through hole; 36, first reset member; 37, moving groove; 38, moving block;

[0031] 4, guiding device; 41, guiding hole; 42, guiding rod;

[0032] 5, sliding assembly; 51, sliding groove; 52, sliding block;

[0033] 6, filter screen; 7, first baffle; 8, connecting rod; 9, second baffle;

[0034] 10. Cleaning device, 101. Cleaning part, 102. Storage hole

[0035] 11. Reset device, 111. Support rod, 112. Second reset part, 113. Mounting bracket, 114. Separation groove, 115. Separation block Detailed implementation mode

[0036] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0037] First embodiment

[0038] Please refer to Figure 1 、 Figure 2 and Figure 3 wherein, Figure 1 is a schematic structural diagram of the first embodiment of a probe pin test device for an integrated circuit test socket provided by the present invention; Figure 2 is Figure 1 a schematic cross-sectional structural diagram of the test device shown; Figure 3 is Figure 2 a schematic enlarged view of part A shown. A probe pin test device for an integrated circuit test socket includes: a test device 1, a pressing block 2, and a sealing device 3;

[0039] The pressing block 2 is arranged on the test device 1;

[0040] The sealing device 3 includes a mounting plate 31, a plurality of connecting rods 32, a sealing plate 33, a moving plate 34, a plurality of through holes 35, eight first reset parts 36, four moving grooves 37, and eight moving blocks 38. The mounting plate 31 is slidably connected to the inside of the test device 1. The plurality of connecting rods 32 are all rotatably connected to the bottom of the mounting plate 31. The sealing plate 33 is arranged at one end of the connecting rods 32. The moving plate 34 is arranged at the bottom of the sealing plate 33. The plurality of through holes 35 are respectively opened in the sealing plate 33 and the moving plate 34. The four moving grooves 37 are all opened in the test device 1. The eight first reset parts 36 are respectively arranged in the four moving grooves 37. The eight moving blocks 38 are respectively slidably connected to the four moving grooves 37.

[0041] A storage groove adapted to the integrated circuit is opened inside the mounting plate 31 for storing the integrated circuit.

[0042] The first reset part 36 is a leaf spring or a spring for pushing the moving block 38 to reset.

[0043] One ends of the plurality of connecting rods 32 are all rotatably connected to the bottom of the mounting plate 31, and the other ends are all rotatably connected to the inside of the sealing plate 33.

[0044] One side of each of the eight moving blocks 38 is fixedly connected to both ends of both sides of the mounting plate 31 and the moving plate 34 respectively.

[0045] The elastic force of the first reset member 36 at the bottom of the four moving blocks 38 connected to both sides of the mounting plate 31 is smaller than the elastic force of the first reset member 36 at the bottom of the four moving blocks 38 connected to both sides of the moving plate 34. When the mounting plate 31 moves downward to squeeze the first reset member 36, the first reset member 36 that supports the moving plate 34 will not be squeezed and deformed. When the mounting plate 31 moves to a proper position and drives the moving plate 34 to move, the first reset member 36 that supports the moving plate 34 will be squeezed and deformed.

[0046] A guiding device 4 is arranged inside the moving block 38. The guiding device 4 includes a guiding hole 41 and a guiding rod 42. The guiding hole 41 is opened inside the moving block 38, and the guiding rod 42 is slidably connected inside the guiding hole 41.

[0047] When the first reset member 36 is a spring and the spring is sleeved on the surface of the guiding rod 42, when the moving block 38 moves, it drives the guiding hole 41 to move on the surface of the guiding rod 42, thereby increasing the stability when the moving block 38 moves and preventing the spring from bending.

[0048] The guiding rods 42 are fixedly connected inside multiple moving grooves 37.

[0049] A sliding assembly 5 is arranged inside the moving plate 34. The sliding assembly 5 includes a sliding groove 51 and a sliding block 52. The sliding groove 51 is opened inside the moving plate 34, and the sliding block 52 is slidably connected inside the sliding groove 51.

[0050] Multiple sliding grooves 51 are opened inside the moving plate 34. Multiple sliding blocks 52 are slidably connected inside multiple sliding grooves 51. The tops of the multiple sliding blocks 52 are fixedly connected to the four corners of the bottom of the sealing plate 33 respectively, and are used to drive the multiple sliding blocks 52 to move inside the multiple sliding grooves 51 respectively when the sealing plate 33 moves to one side and separates, thereby increasing the stability when the sealing plate 33 moves.

[0051] The sealing plate 33 is composed of two halves. Multiple through holes 35 are opened inside both the sealing plate 33 and the moving plate 34. When the through holes 35 inside the sealing plate 33 are staggered from the through holes 35 inside the moving plate 34, the inside of the testing device 1 is sealed. When they overlap, multiple probes pass through the through holes 35 to contact the pins of the integrated motor inside the mounting plate 31.

[0052] The working principle of a probe pin testing device for an integrated circuit test socket provided by the present invention is as follows:

[0053] When in use, after placing the integrated circuit on the mounting plate 31, the lid of the test device 1 is rotated to one side to close, so that the pressing block 2 squeezes the integrated circuit, causing the mounting plate 31 to move downward, driving one end of the plurality of connecting rods 32 to move downward, and thus causing the other ends of the plurality of connecting rods 32 to move to one side, driving the sealing plate 33 to move and separate on the surface of the moving plate 34. When the mounting plate 31 moves downward, while driving the plurality of moving blocks 38 to move inside the plurality of moving grooves 37 respectively, the plurality of first reset members 36 are squeezed.

[0054] After the plurality of through holes 35 inside the sealing plate 33 overlap with the plurality of through holes 35 inside the moving plate 34, when the mounting plate 31 moves downward, it drives the moving plate 34 to move downward, so that the plurality of probes pass through the through holes 35 and contact the pins of the integrated circuit. When the moving plate 34 moves downward, while driving the plurality of moving blocks 38 to move inside the plurality of moving grooves 27 respectively, the plurality of first reset members 36 are squeezed respectively.

[0055] When the lid of the test device 1 is opened, the plurality of first reset members 36 respectively push the plurality of moving blocks 38 to reset, thereby driving the mounting plate 31 and the moving plate 34 to reset.

[0056] Compared with the related art, a probe foot test device for an integrated circuit test socket provided by the present invention has the following beneficial effects:

[0057] The present invention provides a probe foot test device for an integrated circuit test socket, which seals and protects the plurality of probes inside the test device 1 through a sealing device 3, thereby preventing dust from adhering to the surface of the probes and affecting their use. At the same time, it can be opened during use to make the probes contact the pins of the integrated circuit, facilitating its use.

[0058] Second Embodiment

[0059] Please refer to Figure 4 and Figure 5 , based on a probe foot test device for an integrated circuit test socket provided in the first embodiment of the present application, the second embodiment of the present application proposes another probe foot test device for an integrated circuit test socket. The second embodiment is only a preferred manner of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0060] Specifically, the difference of a probe pin testing device for an integrated circuit test socket provided by the second embodiment of the present application lies in that a probe pin testing device for an integrated circuit test socket has four filter nets 6 fixedly installed inside the testing device 1, and the four filter nets 6 are divided into two groups and respectively installed on the opposite faces inside the testing device 1.

[0061] One side of a plurality of the moving blocks 38 is fixedly connected with two first baffles 7, and two connecting rods 8 are fixedly connected to the bottoms of the two first baffles 7. One ends of the plurality of connecting rods 8 are fixedly connected with two second baffles 9.

[0062] Two sides of the two first baffles 7 are respectively fixedly connected to one side of four moving blocks 38 connected to both sides of the moving plate 34, and are used to drive the two first baffles 7 to move when the four moving blocks 38 move.

[0063] The two first baffles 7 and the two second baffles 9 respectively block and seal the four filter nets 6, so that when the testing device 1 is no longer in use, the two first baffles 7 and the two second baffles 9 seal the four filter nets 6.

[0064] The working principle of a probe pin testing device for an integrated circuit test socket provided by the present invention is as follows:

[0065] During use, the air outside the testing device 1 enters through one side of the filter nets 6 and then is discharged through the filter nets 6 on the other side through the plurality of filter nets 6, so as to dissipate heat from the inside of the testing device 1.

[0066] When the moving block 38 moves downward, it drives the first baffle 7 connected to the connecting rod 8 to drive the second baffle 9 to move, so that the filter net 6 is opened for use, and when the moving block 38 resets, it drives the first baffle 7 and the second baffle 9 to reset.

[0067] Compared with the related art, a probe pin testing device for an integrated circuit test socket provided by the present invention has the following beneficial effects:

[0068] The present invention provides a probe pin testing device for an integrated circuit test socket. Through a plurality of filter nets 6, the inside of the testing device 1 is cooled, so as to prevent its temperature from being too high and affecting its use.

[0069] Third Embodiment

[0070] Please refer to Figure 6 、 Figure 7 and Figure 8, A probe foot testing device for an integrated circuit test socket provided by the first embodiment of the present application, and another probe foot testing device for an integrated circuit test socket is proposed in the third embodiment of the present application. The third embodiment is only the preferred manner of the first embodiment, and the implementation of the third embodiment will not affect the independent implementation of the first embodiment.

[0071] Specifically, the difference of a probe foot testing device for an integrated circuit test socket provided by the third embodiment of the present application is that in a probe foot testing device for an integrated circuit test socket, a cleaning device 10 is provided inside the testing device 1. The cleaning device 10 includes a plurality of cleaning members 101 and a plurality of storage holes 102. A plurality of the cleaning members 101 are all arranged inside the testing device 1, and a plurality of the storage holes 102 are respectively opened inside a plurality of the cleaning members 101.

[0072] A plurality of the storage holes 102 are respectively sleeved on the surfaces of a plurality of probes inside the testing device 1 and are in contact with the surfaces of the probes.

[0073] A reset device 11 is provided inside the testing device 1. The reset device 11 includes a plurality of support rods 111, a plurality of second reset members 112, a plurality of mounting frames 113, a plurality of separation grooves 114 and a plurality of separation blocks 115. One ends of a plurality of the support rods 111 are fixedly connected to the bottom of the moving plate 34. A plurality of the second reset members 112 are respectively arranged on one side of a plurality of the support rods 111. A plurality of the mounting frames 113 are respectively located on one side of a plurality of the second reset members 112. A plurality of the separation grooves 114 are respectively located inside a plurality of the mounting frames 113. One ends of a plurality of the separation blocks 115 are fixedly connected to the inside of the testing device 1.

[0074] The second reset member 112 is a spring piece. Two ends of a plurality of the spring pieces are respectively fixedly connected to one side of a plurality of the support rods 111 and one side of a plurality of the mounting frames 113, and are used for automatically resetting a plurality of the cleaning members 101.

[0075] One sides of the separation groove 114 and the separation block 115 are both inclined surfaces. Thus, when the mounting frame 113 moves downward and drives the inclined surface of the separation groove 114 to contact the inclined surface of the separation block 115, the mounting frame 113 connected to the cleaning member 101 is extruded to move to one side and separate from the surface of the probe.

[0076] One sides of a plurality of the cleaning members 101 are respectively fixedly installed on one side of a plurality of the mounting frames 113.

[0077] The cleaning member 101 is a cleaning sponge or cleaning cotton and is used for cleaning the probes inside the testing device 1.

[0078] The working principle of a probe pin testing device for an integrated circuit test socket provided by the present invention is as follows:

[0079] When in use, when the mounting plate 31 moves downward, it drives a plurality of cleaning members 101 to move, thereby driving a plurality of support rods 111 connected to the plurality of cleaning members 101 to move downward, so that the plurality of cleaning members 101 move on the surfaces of the plurality of probes to clean them.

[0080] And when the separation grooves 114 of the plurality of mounting frames 113 move to contact the surfaces of the plurality of separation blocks 115, the plurality of mounting frames 113 move to one side, so that the plurality of mounting frames 113 drive the plurality of cleaning members 101 to move to one side to squeeze the plurality of second reset members 112, and when the plurality of cleaning members 101 are separated from the plurality of probes.

[0081] And when the moving mounting plate 31 is reset, the plurality of second reset members 112 push the plurality of mounting frames 113 connected to the plurality of cleaning members 101 to be reset.

[0082] Compared with the related art, a probe pin testing device for an integrated circuit test socket provided by the present invention has the following beneficial effects:

[0083] The present invention provides a probe pin testing device for an integrated circuit test socket. Through the cooperation of the cleaning device 10 and the reset device 11, when the mounting plate 31 moves downward, the probes are cleaned to prevent dust from adhering to the surfaces of the probes during use and affecting the next use.

[0084] The above are only the embodiments of the present invention, and thus do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present invention.

Claims

1. A probe pin testing device for an integrated circuit test socket, characterized in that Comprising: A testing device, a pressing block, and a sealing device; The extrusion block is arranged on the testing device; The sealing device includes a mounting plate, a plurality of connecting rods, a sealing plate, a moving plate, a plurality of through holes, eight first reset members, four moving grooves, and eight moving blocks. The mounting plate is slidably connected to the inside of the testing device. The plurality of connecting rods are all rotatably connected to the bottom of the mounting plate. The sealing plate is arranged at one end of the connecting rods. The moving plate is arranged at the bottom of the sealing plate. The plurality of through holes are respectively opened in the sealing plate and the moving plate. The four moving grooves are all opened in the inside of the testing device. The eight first reset members are respectively arranged in the four moving grooves. The eight moving blocks are respectively slidably connected to the inside of the four moving grooves.

2. The probe foot testing device for an integrated circuit test socket according to claim 1, characterized in that, One end of each of the plurality of connecting rods is rotatably connected to the bottom of the mounting plate, and the other end is rotatably connected to the inside of the sealing plate.

3. The probe foot testing device for an integrated circuit test socket according to claim 1, characterized in that, One side of each of the eight moving blocks is fixedly connected to both ends of both sides of the mounting plate and the moving plate.

4. The probe foot testing device for an integrated circuit test socket according to claim 3, characterized in that, A guiding device is arranged inside the moving block. The guiding device includes a guiding hole and a guiding rod. The guiding hole is opened in the moving block, and the guiding rod is slidably connected to the inside of the guiding hole.

5. The probe pin testing device for an integrated circuit test socket according to claim 1, wherein, A sliding component is arranged inside the moving plate. The sliding component includes a sliding groove and a sliding block. The sliding groove is opened in the moving plate, and the sliding block is slidably connected to the inside of the sliding groove.

6. The probe foot testing device for an integrated circuit test socket according to claim 1, characterized in that, Four filter nets are fixedly installed inside the testing device. The four filter nets are grouped in pairs and are respectively installed on the opposite surfaces inside the testing device.

7. The probe foot testing device for an integrated circuit test socket according to claim 1, characterized in that, Two first baffles are fixedly connected to one side of the plurality of moving blocks. Two connecting rods are fixedly connected to the bottom of both of the two first baffles. One end of the plurality of connecting rods is fixedly connected to two second baffles.

8. The probe foot testing device for an integrated circuit test socket according to claim 1, characterized in that, A cleaning device is arranged inside the testing device. The cleaning device includes a plurality of cleaning members and a plurality of storage holes. The plurality of cleaning members are all arranged inside the testing device. The plurality of storage holes are respectively opened in the plurality of cleaning members.

9. The probe pin testing device for an integrated circuit test socket according to claim 8, wherein, A reset device is arranged inside the testing device. The reset device includes a plurality of support rods, a plurality of second reset members, a plurality of mounting frames, a plurality of separation grooves, and a plurality of separation blocks. One end of each of the plurality of support rods is fixedly connected to the bottom of the moving plate. The plurality of second reset members are respectively arranged on one side of the plurality of support rods. The plurality of mounting frames are respectively located on one side of the plurality of second reset members. The plurality of separation grooves are respectively located inside the plurality of mounting frames. One end of each of the plurality of separation blocks is fixedly connected to the inside of the testing device.

10. The probe foot testing device for an integrated circuit test socket according to claim 9, characterized in that, One side of each of the plurality of cleaning members is fixedly installed on one side of the plurality of mounting frames.

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