ROPN-based vacuum lock in-out control method, device and equipment and storage medium

Abstract

The invention relates to the technical field of semiconductors, in particular to an ROPN-based vacuum lock in-out control method, device and equipment and a storage medium, and the method comprises the steps: obtaining the total number of process modules, and constructing an ROPN model to obtain real-time cleaning information; based on the real-time cleaning information, the total number of the process modules and a control rule of the ROPN model, judging whether a new wafer is allowed to be transmitted in; if so, acquiring multi-batch working information and real-time occupation information to confirm sequencing batch information; according to the sequencing batch information, the real-time occupation information and the control rule, the batch of wafers to be transmitted is confirmed; according to the method disclosed by the invention, dynamic scheduling of wafer batches is realized based on the sequencing batch information and the resource state, multi-batch parallel processing is supported, and meanwhile, the blocking phenomenon in the processing process is avoided; the residence time of the wafer in the system and the idling phenomenon of the equipment are effectively reduced by accurately controlling the in-out time of the vacuum lock, so that the utilization rate of the process module and the manipulator is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular, to a method, device, equipment and storage medium for controlling the entry and exit of a vacuum lock based on ROPN. Background Art

[0002] In the field of semiconductor manufacturing, the production process of chips is extremely complex and involves numerous precise process steps. As the core production equipment in this process, the cluster tool plays a crucial role. The design of the cluster tool aims to achieve continuous processing of wafers through a series of modular process chambers. These process chambers usually include key components such as atmospheric modules, vacuum modules, and load locks. As the transition area connecting the atmospheric end and the vacuum end, the main function of the load lock is to ensure that the wafer can be safely isolated from the atmospheric environment before entering the process chamber in the vacuum environment, and at the same time, return the wafer safely to the atmospheric environment after processing.

[0003] Although the cluster tool has played an important role in improving production efficiency and ensuring product quality, the prior art still faces two major challenges: First, there is a problem of low efficiency in load lock scheduling. During the wafer processing, the scheduling efficiency of the load lock directly affects the throughput of the entire production line. If the wafer stays on the load lock or the robot arm for too long, it will not only cause waste of production capacity, but also make it difficult to ensure the "first in, first out" principle of the wafer. In this case, the processing of subsequent wafers may be delayed, thus affecting the smooth progress of the entire production process.

[0004] Second, there is a problem of the risk of multi-process deadlock. In semiconductor manufacturing, in order to improve equipment utilization and production flexibility, multiple wafer batches are usually processed simultaneously. However, when multiple batches are processed simultaneously, the problem of resource contention becomes particularly prominent, and these resources include key components such as load lock ports and process modules. If the resource allocation is improper, it is easy to cause the occurrence of deadlock, that is, two or more wafer batches wait for each other to release resources, resulting in the interruption of the entire production process. This interruption will not only reduce production efficiency, but also may affect the quality of the wafers.

[0005] It can be seen that the prior art still needs to be improved. Summary of the Invention

[0006] To overcome the deficiencies of the prior art, the purpose of the present invention is to provide a method for controlling the entry and exit of a vacuum lock based on ROPN, which can coordinate the wafer flow between the atmospheric end and the vacuum end, and avoid the problems of wafer retention and batch blockage.

[0007] The first aspect of the present invention provides a method for controlling the entry and exit of a vacuum lock based on ROPN, including: obtaining the total number of process modules and constructing an ROPN model, and obtaining the real-time cleaning information of the process modules based on the constructed ROPN model; judging whether to allow the incoming of new wafers based on the real-time cleaning information, the total number of process modules, and the control rules of the constructed ROPN model; when allowing the incoming of new wafers, obtaining multi-batch work information and obtaining the real-time occupancy information of the process modules based on the constructed ROPN model, and confirming the sorting batch information based on the multi-batch work information and the real-time occupancy information of the process modules; confirming the wafer batch to be transmitted based on the sorting batch information, the real-time occupancy information of the process modules, and the control rules of the constructed ROPN model.

[0008] Optionally, in the first implementation manner of the first aspect of the present invention, the judging whether to allow the incoming of new wafers based on the real-time cleaning information, the total number of process modules, and the control rules of the constructed ROPN model includes: when the real-time cleaning information indicates that all process modules do not need to be cleaned, allowing the incoming of new wafers; when the real-time cleaning information indicates that some process modules need to be cleaned, obtaining the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end manipulator, and judging whether to allow the incoming of new wafers based on the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end manipulator; when the real-time cleaning information indicates that all process modules need to be cleaned, not allowing the incoming of new wafers.

[0009] Optionally, in the second implementation manner of the first aspect of the present invention, the judging whether to allow the incoming of new wafers based on the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end manipulator includes: when the real-time wafer information in the vacuum lock indicates that there is no wafer in the vacuum lock, and when the real-time working information of the vacuum end manipulator indicates that the vacuum end manipulator is not holding a wafer, allowing the incoming of new wafers; when the real-time wafer information in the vacuum lock indicates that there is a wafer in the vacuum lock, or when the real-time working information of the vacuum end manipulator indicates that the vacuum end manipulator is holding a wafer, not allowing the incoming of new wafers.

[0010] Optionally, in the third implementation manner of the first aspect of the present invention, when allowing new wafers to be introduced, obtaining multi-batch work information and obtaining real-time occupancy information of process modules based on the constructed ROPN model, and confirming sorted batch information based on the multi-batch work information and the real-time occupancy information of process modules, includes: when allowing new wafers to be introduced, obtaining multi-batch work information, where the multi-batch work information includes work information of multiple wafer batches, and the work information of each wafer batch includes process information corresponding to the wafer batch, and the process information includes priority, type of process module to be occupied, and cleaning requirements; obtaining real-time occupancy information of process modules based on the constructed ROPN model, where the real-time occupancy information includes the earliest completion time of the wafer batch in the processing state and the type of process module occupied by the wafer batch corresponding to the earliest completion time; sorting each wafer batch based on the process information corresponding to the wafer batch and the real-time occupancy information of the process module to obtain sorted batch information.

[0011] Optionally, in the fourth implementation manner of the first aspect of the present invention, sorting each wafer batch based on the process information corresponding to the wafer batch and the real-time occupancy information of the process module to obtain sorted batch information, includes: performing a first sorting on the multi-batch work information according to the priority corresponding to the wafer batch in the order from high to low to obtain first-sorted batch information; for wafer batches with the same priority, performing a second sorting on the first-sorted batch information according to the type of process module to be occupied corresponding to the wafer batch and the type of work module occupied by the wafer batch corresponding to the earliest completion time to obtain second-sorted information; and then performing a third sorting on the second-sorted information according to the cleaning requirements corresponding to the wafer batch to obtain sorted batch information.

[0012] Optionally, in the fifth implementation manner of the first aspect of the present invention, obtaining the real-time occupied quantity of process modules, and confirming the wafer batch to be transmitted based on the sorted batch information, the real-time occupancy information of process modules, and the control rules of the constructed ROPN model, includes: the real-time occupancy information of the process module further includes the real-time available quantity of the process module; based on the sorted batch information, comparing one by one the quantity of process modules to be occupied by the wafer batch and the real-time available quantity of the process module; when the quantity of process modules to be occupied by the wafer batch ≤ the real-time available quantity of the process module, then confirm that this wafer batch is the wafer batch to be introduced; obtaining the estimated arrival time of the vacuum lock of the wafer batch to be introduced, comparing the obtained estimated arrival time of the vacuum lock and the earliest completion time of the wafer batch in the processing state, and confirming the wafer batch to be transmitted based on the comparison result and the control rules of the constructed ROPN model.

[0013] Optionally, in the sixth implementation manner of the first aspect of the present invention, after confirming that the wafer batch is the to-be-transferred wafer batch, the method further includes: obtaining the real-time occupancy of the vacuum lock; and confirming the transfer position of the to-be-transferred wafer batch based on the real-time occupancy of the vacuum lock.

[0014] The second aspect of the present invention provides a vacuum lock in-and-out control device based on ROPN, including: an obtaining module, configured to obtain the total number of process modules and construct an ROPN model, and obtain the real-time cleaning information of the process modules based on the constructed ROPN model; a judging module, configured to judge whether to allow the incoming of new wafers based on the real-time cleaning information, the total number of process modules, and the control rules of the constructed ROPN model; a processing module, configured to, when allowing the incoming of new wafers, obtain multi-batch working information and obtain the real-time occupancy information of the process modules based on the constructed ROPN model, and confirm sorting batch information based on the multi-batch working information and the real-time occupancy information of the process modules; and a confirming module, configured to confirm the wafer batch to be transferred based on the sorting batch information, the real-time occupancy information of the process modules, and the control rules of the constructed ROPN model.

[0015] The third aspect of the present invention provides a vacuum lock in-and-out control device based on ROPN. The vacuum lock in-and-out control device based on ROPN includes: a memory and at least one processor, wherein instructions are stored in the memory; and at least one of the processors calls the instructions in the memory, so that the vacuum lock in-and-out control device based on ROPN executes each step of the vacuum lock in-and-out control method described in any one of the above.

[0016] The fourth aspect of the present invention provides a computer-readable storage medium, on which instructions are stored, and when the instructions are executed by a processor, each step of the vacuum lock in-and-out control method described in any one of the above is implemented.

[0017] In the technical solution of the present invention, the dynamic scheduling of wafer batches is realized based on sorting batch information and the resource status of semiconductor combined equipment, supporting multi-batch parallel processing, while avoiding blocking phenomena during the processing, and being adaptable to complex process paths; by precisely controlling the in-and-out timing of the vacuum lock, the residence time of wafers in the system and the idling phenomenon of the equipment are effectively reduced, thereby improving the utilization rate of process modules and manipulators; in addition, the frequent vacuum pumping and gas charging operations of the vacuum lock are also avoided, thereby reducing the overall energy consumption. Description of the Drawings

[0018] Figure 1 It is a schematic structural diagram of a semiconductor combined equipment applicable to the vacuum lock in-and-out control method provided by an embodiment of the present invention; Figure 2Schematic diagram of the structure of the vacuum lock provided by the embodiment of the present invention; Figure 3 Logic flow chart of the method for controlling the entry and exit of the vacuum lock based on ROPN provided by the embodiment of the present invention; Figure 4 Schematic diagram of the structure of the device for controlling the entry and exit of the vacuum lock based on ROPN provided by the embodiment of the present invention; Figure 5 Schematic diagram of the structure of the device for controlling the entry and exit of the vacuum lock based on ROPN provided by the embodiment of the present invention. Detailed implementation manners

[0019] The present invention provides a method, device, equipment and storage medium for controlling the entry and exit of a vacuum lock based on ROPN. In the present invention, the terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments described herein can be implemented in an order different from that shown or described herein. In addition, the terms "comprising" or "having" and any variation thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or equipment comprising a series of steps or units does not have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or equipment.

[0020] For ease of understanding, the semiconductor combination equipment applicable to the embodiment of the present invention is described below. Please refer to Figure 1 , in the semiconductor manufacturing process, the handling and processing of wafers are crucial links. The entire process is divided into two parts: the atmospheric end and the vacuum end to ensure the efficient transmission and processing of wafers in different process modules; at the atmospheric end, the storage and preliminary processing of wafers are carried out through storage units (Foup), and these storage units are grouped into "Sequences" according to the process path to ensure that the wafers are processed in the correct order; the EFEM, as the atmospheric end manipulator, is responsible for precisely transmitting wafers between the Foup, the aligner, the load lock, and the cooler; the efficient operation of the EFEM ensures the seamless docking of wafers between different devices, thereby improving the efficiency of the entire production line; the load lock is a key component connecting the atmospheric end and the vacuum end, and it has various structural designs, such as Figure 2 a) The upper and lower layer design (each port includes a first slot and a second slot arranged up and down) or Figure 2The left and right layer design of (b) (each port includes a first slot and a second slot arranged left and right) supports multiple modes such as "simultaneous in and out" and "bottom in and top out"; the main function of the vacuum lock is to evacuate (Pump, inlet vacuum end) or fill with air (Vent, outlet vacuum end) when transporting wafers to ensure air pressure isolation at both ends, thereby protecting the process environment at the vacuum end from contamination; after entering the vacuum end, the wafers will be sent to different process modules (PMs), such as thin film deposition, etching, etc., and these modules can be processed in parallel to improve production efficiency; the vacuum end manipulator (TM) is responsible for transporting wafers between the vacuum lock and each process module to ensure the safe and accurate transfer of wafers in the vacuum environment.

[0021] The design of the entire system aims to reduce the risk of wafer contamination during transportation, while improving production efficiency and process quality; through precise control and automated operation, each link of semiconductor manufacturing has been optimized, thus ensuring the high performance and reliability of the final product.

[0022] The processing flow of the semiconductor combination equipment disclosed in this embodiment is as follows: the atmospheric end manipulator is responsible for transporting the wafers to be processed from the storage unit to the calibration table for calibration, and then transporting them to the vacuum lock; after receiving the wafers in the atmosphere, the vacuum lock performs a vacuum evacuation operation. After the vacuum evacuation is completed, the vacuum end manipulator takes out the unprocessed wafers from the vacuum lock and places them into the process module for processing; if the wafer path recipe specifies that the processing chamber needs to be cleaned before processing, a cleaning wafer must be used for cleaning first, and then the wafer can enter the processing chamber of the process module; after the wafer is processed according to the recipe path, the vacuum end manipulator takes it out of the processing chamber and puts it back into the vacuum lock; after the vacuum lock receives the wafer, it performs an air filling operation; finally, the atmospheric end manipulator places the processed wafers into the cooling table for cooling and finally into the wafer loader. If there are unprocessed wafers for this task in the wafer loader, the wafers need to be placed in the storage unit for caching first, and then transferred to the wafer loader when there are no unprocessed wafers in the wafer loader.

[0023] Furthermore, for better understanding, the specific process of the embodiment of the present invention will be described below. Please refer to Figure 3 An embodiment of the ROPN-based vacuum lock in-and-out control method in the embodiment of the present invention includes: 101. Obtain the total number of process modules and construct an ROPN model, and obtain the real-time cleaning information of the process modules based on the constructed ROPN model; In this embodiment, the ROPN model is used to formally describe resources such as the atmospheric end manipulator EFEM, the vacuum end manipulator TM, and the process module PM in the combined device; ROPN is a discrete event system modeling tool that describes the scheduling process of the combined device through places and transitions. Among them, places represent system states, such as whether the process module is being cleaned or whether the wafer is in the vacuum lock, etc.; while transitions represent operations for state switching, such as the atmospheric end manipulator transferring a wafer to the vacuum lock or the vacuum end manipulator taking a wafer from within the vacuum lock, etc.; transitions and places are connected by tokens, and the number of tokens represents the number of resources or the number of activated states; in the ROPN model constructed in this embodiment, the token n1 represents the available quantity of parallel PMs, and the token c2 represents the cleaning state of the PM; the control place c is introduced as the key logic. The control place C dynamically adjusts the wafer transfer strategy of the vacuum lock by monitoring in real time the available quantity (token n1) and the cleaning state (token c2) of the process module, that is, according to the values of n1 and c2, it controls whether the transition "Vent wafer transfer" is triggered to determine whether to allow the EFEM to transfer a new wafer to the LoadLock.

[0024] 102. Determine whether to allow the incoming of new wafers based on the real-time cleaning information, the total number of process modules, and the control rules of the constructed ROPN model; In this embodiment, when multiple parallel process modules (such as PM1, PM2, PM3) need to be cleaned after completing the processing tasks, if the vacuum lock continues to allow new wafers to enter, a series of retention problems may be caused; specifically, for the vacuum lock with an upper and lower layer structure design, the vacuum lock slot where the new wafer is located may be occupied as the wafer output port, resulting in frequent pumping and venting (Pump / Vent) operations for this slot, which not only reduces production efficiency but also may increase equipment wear; in the vacuum lock with a left and right layer structure design, the new wafer may be retained on the transfer manipulator because the process module (PM) being cleaned has not yet released resources, which will cause delays in the production process and potential bottlenecks; to solve the foregoing problems, it is necessary to determine whether to allow the incoming of new wafers based on the real-time cleaning information, the total number of process modules, and the preset control rules to ensure the smooth and efficient production process.

[0025] 103. When allowing the incoming of new wafers, obtain multi-batch work information and obtain the real-time occupancy information of the process module based on the constructed ROPN model, and confirm the sorted batch information based on the multi-batch work information and the real-time occupancy information of the process module; 104. Confirm the wafer batch to be transferred based on the sorted batch information, the real-time occupancy information of the process module, and the control rules of the constructed ROPN model; In this embodiment, when two or more wafer batches use the vacuum lock simultaneously, due to the contention for ports or process modules, a deadlock phenomenon may occur. Specifically, taking the 2-Sequence deadlock and the vacuum lock of the upper and lower layer structures as examples, assume that Sequence1 needs to enter from the upper layer (the first slot) of the vacuum lock and then exit from the lower layer (the second slot), while Sequence2 is the opposite. It needs to enter from the second slot and exit from the first slot. In this case, if the two sequences proceed simultaneously, they will wait for each other to release the required ports, resulting in a deadlock because neither sequence can continue without relying on the other to release resources. For the case of 3-Sequence or more sequences, the deadlock problem becomes more complex. Multiple batches may cross-occupy the slots or process modules of the vacuum lock, forming a circular waiting situation. In this circular waiting, each wafer batch is waiting for another wafer batch to release resources, and the latter is waiting for a third wafer batch, and so on, until the last batch is waiting for the first batch, forming a closed loop. In this situation, no wafer batch can continue to execute, resulting in the stagnation of the entire production process. To avoid this deadlock situation, it is necessary to confirm the wafer batch to be introduced based on the sorted batch information, the real-time occupancy quantity of the process module, and the preset control rules, ensuring that resources can be reasonably allocated when multiple wafer batches proceed simultaneously, thereby avoiding the occurrence of deadlocks and ensuring the smooth progress of the production process.

[0026] The ROPN-based vacuum lock in-and-out control method disclosed in this application, by solving the wafer retention problem and eliminating the deadlock problem caused by batch blockage, not only reduces the waiting time of wafers, releases the LoadLock and robot resources, but also enables parallel processing of more batches, making full use of the parallel capabilities of the PM module. This synergistic effect enables the combined equipment to achieve an ideal balance between rapid single-batch turnover and multi-batch concurrent processing, significantly improving the production capacity. At the same time, by controlling the retention problem to prevent a single batch from slowing down the overall situation, and by controlling the deadlock problem to avoid multi-batch mutual blockage, it ensures that the combined equipment can operate continuously and stably under complex working conditions, such as multi-PM cleaning and multi-process paths, realizing the efficient and stable operation of the combined equipment and providing a solid foundation for the improvement of production efficiency.

[0027] In this embodiment, the control rule based on the real-time cleaning information, the total number of process modules, and the constructed ROPN model to judge whether to allow the incoming of new wafers includes: 201. When the real-time cleaning information indicates that all process modules do not require cleaning, allow the incoming of new wafers; 202. When the real-time cleaning information indicates that some process modules need to be cleaned, obtain the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end robot, and determine whether to allow the incoming of new wafers based on the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end robot; 203. When the real-time cleaning information indicates that all process modules need to be cleaned, do not allow the incoming of new wafers.

[0028] In this embodiment, the determination of whether to allow the incoming of new wafers based on the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end robot includes: 301. When the real-time wafer information in the vacuum lock indicates that there is no wafer in the vacuum lock, and when the real-time working information of the vacuum end robot indicates that the vacuum end robot is not holding a wafer, allow the incoming of new wafers; 302. When the real-time wafer information in the vacuum lock indicates that there is a wafer in the vacuum lock, or when the real-time working information of the vacuum end robot indicates that the vacuum end robot is holding a wafer, do not allow the incoming of new wafers.

[0029] In this embodiment, based on the ROPN model, the empirical rules for avoiding stagnation are transformed into computable token flow logic. Through the comprehensive judgment of the real-time cleaning information, the wafer information in the vacuum lock, and the working information of the vacuum end robot, the incoming time of new wafers can be accurately controlled, ensuring that each operation conforms to the actual load of resources, avoiding production interruptions caused by cleaning requirements, thus ensuring the continuous and stable operation of the production line, improving the overall production efficiency, and avoiding unnecessary wafer waiting and resource waste, and enhancing the resource utilization efficiency.

[0030] For example, the total number of process modules is 3, namely PM1, PM2, and PM3. When PM1 or PM2 finishes processing and needs to be cleaned, and the vacuum end robot is about to load the fourth wafer to be processed into PM3 and unload the third wafer that has been processed, if there is an unprocessed wafer on the TM (such as the fifth wafer to be processed), the vacuum lock will not allow new wafers to enter until PM3 finishes processing or the cleaning operation of PM1 or PM2 is completed, so as to avoid the fifth wafer to be processed waiting for a long time in the vacuum lock or on the vacuum end robot.

[0031] In this embodiment, when allowing the incoming of new wafers, obtain multi-batch working information and obtain the real-time occupancy information of the process modules based on the constructed ROPN model, and confirm the sorting batch information based on the multi-batch working information and the real-time occupancy information of the process modules, including: 401. When new wafers are allowed to be introduced, obtain multi-batch job information, where the multi-batch job information includes job information of multiple wafer batches, and the job information of each wafer batch includes process information corresponding to the wafer batch. The process information includes priority, type of process module to be occupied, and cleaning requirements. 402. Based on the constructed ROPN model, obtain the real-time occupancy information of process modules. The real-time occupancy information includes the earliest completion time of the wafer batch in the processing state and the type of process module occupied by the wafer batch corresponding to the earliest completion time. 403. Sort each wafer batch based on the process information corresponding to the wafer batch and the real-time occupancy information of the process module to obtain sorted batch information.

[0032] In this embodiment, sorting each wafer batch based on the process information corresponding to the wafer batch and the real-time occupancy information of the process module to obtain sorted batch information includes: 501. According to the priority corresponding to the wafer batch, perform a first sorting on the multi-batch job information in descending order of priority to obtain first-sorted batch information. 502. For wafer batches with the same priority, perform a second sorting on the first-sorted batch information according to the type of process module to be occupied corresponding to the wafer batch and the type of working module occupied by the wafer batch corresponding to the earliest completion time to obtain second-sorted information. In this embodiment, according to the priority of Sequence and the PM status, determine which Sequence enters and exits the vacuum lock first. For example, if the associated PM of Sequence1 is about to complete the process and release resources, allow it to complete first, and then allow Sequence2 to enter; ensure that the wafers of all Sequences can complete the process within a reasonable time.

[0033] 503. Then perform a third sorting on the second-sorted information according to the cleaning requirements corresponding to the wafer batch to obtain sorted batch information. In this embodiment, it is assumed that the vacuum lock system includes two slots: the first slot (inlet) and the second slot (outlet); at a certain moment, two production sequences Sequence1 and Sequence2 with the same processing priority but different processing paths simultaneously apply to enter the vacuum lock. Among them, the two PMs associated with Sequence1 need to be cleaned, while for these two PMs, Sequence2 does not need to be cleaned; without considering the cleaning status, if both sequences are allowed to enter simultaneously, it may lead to serious production problems; specifically, the wafers of Sequence1 will be stuck on the transfer robot because the PMs are being cleaned, while the wafers of Sequence2 may not be able to be transferred because the first slot and the second slot are occupied; in this case, neither sequence can proceed smoothly, resulting in a deadlock and affecting the efficiency of the entire production line; however, by considering the cleaning requirements of each sequence, a more reasonable decision can be made; in this case, the cleaning requirement of Sequence2 is 0, indicating that its PM cleaning status is better and all PMs are available; therefore, Sequence2 is given priority to pass through, that is, Sequence2 is sorted before Sequence1; in this way, the wafers of Sequence2 can be immediately processed by the PMs and the second slot can be quickly released after completion. After Sequence2 releases the resources, Sequence1 then enters the vacuum lock, thus avoiding the problem of both sides competing for the first slot and the second slot and ensuring the smooth progress of the production process.

[0034] In this embodiment, by sorting according to the priority of the wafer batches, it is ensured that the wafer batches with high priority can be processed first, meeting the urgent production requirements, thus improving the production efficiency and shortening the production cycle; secondly, for the wafer batches with the same priority, a secondary sorting is further carried out according to the types of process modules to be occupied and the types of working modules occupied by the wafer batches corresponding to the earliest completion time, which helps to optimize the utilization of process modules, reduce the waiting time and resource idleness, improve the overall utilization rate of the production line, thus reducing the situation where multiple batches wait for scarce process modules simultaneously, and also allowing the available process modules to process new wafers first; finally, by sorting according to the cleaning requirements of the wafer batches for the third time, the global blockage caused by the cleaning backlog of process modules is avoided; through the multi-level and multi-dimensional sorting strategy, the efficiency of wafer production and the resource utilization rate of process modules are effectively improved.

[0035] In this embodiment, the real-time occupancy information of the process module further includes the real-time available quantity of the process module; the confirmation of the wafer batch to be transferred based on the sorted batch information, the real-time occupancy information of the process module, and the control rules of the constructed ROPN model includes: 601. Compare the number of process modules required for each wafer lot with the real-time available number of process modules one by one based on the sorted lot information. 602. When the number of process modules required for the wafer lot ≤ the real-time available number of process modules, confirm that the wafer lot is the wafer lot to be transferred in. In this embodiment, first, by real-time monitoring the occupancy of process modules and accurately calculating the instant available number of process modules based on the total number and the real-time occupied number, the accuracy and timeliness of production scheduling are ensured; second, according to the sorted lot information, compare the number of process modules required for each wafer lot with the instant available number one by one, which effectively avoids the situation where the wafer lot waits due to insufficient process modules and improves production efficiency; finally, when the number of process modules required for the wafer lot is less than or equal to the instant available number, confirm that the wafer lot is the wafer lot to be transferred in, realizing the automation and intelligence of production scheduling, avoiding the deadlock problem caused by resource exhaustion, not only reducing the cost of manual intervention, but also improving the accuracy and efficiency of production scheduling.

[0036] 603. Obtain the estimated arrival time of the vacuum lock for the wafer lot to be transferred in, compare the obtained estimated arrival time of the vacuum lock with the earliest completion time of the wafer lot in the processing state, and confirm the wafer lot to be transferred based on the comparison result and the control rules of the constructed ROPN model. In this embodiment, in the constructed ROPN model, multiple places are introduced to represent the states of different Sequences, and the competition for resources by Sequences is simulated through the transition triggering conditions, such as the competition for vacuum lock ports and the competition for PM modules; according to the priority of the Sequences and the PM status, decide which Sequence enters and exits the vacuum lock preferentially; for example, when a wafer of a new Sequence attempts to enter the vacuum lock, the system will estimate its arrival time and compare it with the earliest completion time of the Sequence in the processing state; if the entry of the new Sequence may cause a deadlock, its entry will be postponed; by converting the fuzzy strategy of coordinating multiple batches, such as preferentially transmitting the batches that are about to complete, into an accurate decision based on the state of the ROPN model, it is ensured that there is no circular waiting during multi-task concurrency.

[0037] In this embodiment, after confirming that the wafer lot is the wafer lot to be transferred in, it further includes: 701. Obtain the real-time occupancy of the vacuum lock. In this embodiment, the real-time occupancy of the vacuum lock refers to the current usage and the to-be-used situation of specific slots in the vacuum lock.

[0038] 702. Confirm the transfer-in position of the wafer lot to be transferred in based on the real-time occupancy of the vacuum lock. In this embodiment, please refer to Figure 2 , for example, Sequence1 is entering the system through the first slot and is scheduled to leave through the second slot, and is currently in the processing stage of PM1; at the same time, Sequence2 also intends to enter through the first slot, but the first slot is currently occupied by Sequence1; at this time, it is detected that the cleaning work of Sequence1 in PM1 still needs 5 minutes to complete, and the processing of Sequence2 in PM2 does not require cleaning and is expected to be completed in only 3 minutes. In this case, if the second slot is available, Sequence2 can choose to enter the combined device through the second slot.

[0039] The above describes the method for controlling the entry and exit of the vacuum lock based on ROPN in the embodiment of the present invention. Next, the device for controlling the entry and exit of the vacuum lock based on ROPN in the embodiment of the present invention will be described. Please refer to Figure 4 , an embodiment of the device for controlling the entry and exit of the vacuum lock based on ROPN in the embodiment of the present invention includes: An acquisition module 801, configured to acquire the total number of process modules and construct a ROPN model, and acquire the real-time cleaning information of the process modules based on the constructed ROPN model; A judgment module 802, configured to judge whether to allow the incoming of new wafers based on the real-time cleaning information, the total number of process modules, and the control rules of the constructed ROPN model; A processing module 803, configured to, when allowing the incoming of new wafers, acquire multi-batch work information and acquire the real-time occupancy information of the process modules based on the constructed ROPN model, and confirm the sorting batch information based on the multi-batch work information and the real-time occupancy information of the process modules; A confirmation module 804, configured to confirm the wafer batch to be transmitted based on the sorting batch information, the real-time occupancy information of the process modules, and the control rules of the constructed ROPN model.

[0040] Based on the same idea as the method in the above embodiment, the device provided in this application can implement the method in the above embodiment.

[0041] Above Figure 4 The device for controlling the entry and exit of the vacuum lock based on ROPN in the embodiment of the present invention is described in detail from the perspective of modular functional entities. Next, the device for controlling the entry and exit of the vacuum lock based on ROPN in the embodiment of the present invention will be described in detail from the perspective of hardware processing.

[0042] Figure 5FIG. 0 is a schematic structural diagram of a vacuum lock in-and-out control device based on ROPN provided by an embodiment of the present invention. The vacuum lock in-and-out control device 900 based on ROPN may vary greatly due to different configurations or performances, and may include one or more processors (central processing units, CPUs) 910 and a memory 920, and one or more storage media 930 (such as one or more mass storage devices) for storing application programs 933 or data 932. Among them, the memory 920 and the storage media 930 may be transient storage or persistent storage. The program stored in the storage media 930 may include one or more modules (not shown in the figure), and each module may include a series of instruction operations on the vacuum lock in-and-out control device 900 based on ROPN. Further, the processor 910 may be configured to communicate with the storage media 930 and execute a series of instruction operations in the storage media 930 on the vacuum lock in-and-out control device 900 to implement the steps of the vacuum lock in-and-out control method provided by the above method embodiments.

[0043] The vacuum lock in-and-out control device 900 based on ROPN may further include one or more power supplies 940, one or more wired or wireless network interfaces 950, one or more input / output interfaces 960, and / or one or more operating systems 931, such as Windows Serve, Mac OS X, Unix, Linux, FreeBSD, and so on. Those skilled in the art can understand that Figure 5 the shown structural diagram of the vacuum lock in-and-out control device based on ROPN does not constitute a limitation on the vacuum lock in-and-out control device based on ROPN, and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0044] The present invention also provides a computer-readable storage medium, which may be a non-volatile computer-readable storage medium or a volatile computer-readable storage medium. Instructions are stored in the computer-readable storage medium. When the instructions are run on a computer, the computer is made to execute the steps of the vacuum lock in-and-out control method based on ROPN.

[0045] Those skilled in the art can clearly understand that for the convenience and conciseness of description, the specific working processes of the above-described system or device and unit can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein.

[0046] When the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store program codes.

[0047] Finally, it should be noted that the above are only preferred examples of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for controlling the access of a vacuum lock based on ROPN, characterized in that, Including: Obtain the total number of process modules and construct an ROPN model, and obtain the real-time cleaning information of the process modules based on the constructed ROPN model; Judge whether to allow the incoming of new wafers based on the real-time cleaning information, the total number of process modules, and the control rules of the constructed ROPN model; When allowing the incoming of new wafers, obtain multi-batch work information and obtain the real-time occupancy information of the process modules based on the constructed ROPN model, and confirm the sorting batch information based on the multi-batch work information and the real-time occupancy information of the process modules; Confirm the wafer batches to be transferred based on the sorting batch information, the real-time occupancy information of the process modules, and the control rules of the constructed ROPN model.

2. The vacuum lock in-out control method based on ROPN according to claim 1, wherein, The judging whether to allow the incoming of new wafers based on the real-time cleaning information, the total number of process modules, and the control rules of the constructed ROPN model includes: When the real-time cleaning information indicates that all process modules do not need cleaning, allow the incoming of new wafers; When the real-time cleaning information indicates that some process modules need cleaning, obtain the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end manipulator, and judge whether to allow the incoming of new wafers based on the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end manipulator; When the real-time cleaning information indicates that all process modules need cleaning, do not allow the incoming of new wafers.

3. The vacuum lock in-out control method based on ROPN according to claim 2, characterized in that, The judging whether to allow the incoming of new wafers based on the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end manipulator includes: When the real-time wafer information in the vacuum lock indicates that there is no wafer in the vacuum lock, and when the real-time working information of the vacuum end manipulator indicates that the vacuum end manipulator is not holding a wafer, allow the incoming of new wafers; When the real-time wafer information in the vacuum lock indicates that there is a wafer in the vacuum lock, or when the real-time working information of the vacuum end manipulator indicates that the vacuum end manipulator is holding a wafer, do not allow the incoming of new wafers.

4. The method for controlling the entry and exit of a vacuum lock based on ROPN according to claim 1, wherein The obtaining multi-batch work information and obtaining the real-time occupancy information of the process modules based on the constructed ROPN model, and confirming the sorting batch information based on the multi-batch work information and the real-time occupancy information of the process modules when allowing the incoming of new wafers includes: When allowing the incoming of new wafers, obtain multi-batch work information, where the multi-batch work information includes the work information of multiple wafer batches, and the work information of each wafer batch includes process information corresponding to the wafer batch, and the process information includes priority, the type of process module to be occupied, and cleaning requirements; Obtain the real-time occupancy information of the process modules based on the constructed ROPN model, where the real-time occupancy information includes the earliest completion time of the wafer batch in the processing state and the type of process module occupied by the wafer batch corresponding to the earliest completion time; Sort each wafer batch based on the process information corresponding to the wafer batch and the real-time occupancy information of the process modules to obtain sorting batch information.

5. The vacuum lock in-out control method based on ROPN according to claim 4, characterized in that, The sorting each wafer batch based on the process information corresponding to the wafer batch and the real-time occupancy information of the process modules to obtain sorting batch information includes: Sort the multi-batch work information once according to the priority corresponding to the wafer batch, in descending order of priority, to obtain the once-sorted batch information; For wafer batches with the same priority, sort the once-sorted batch information twice according to the type of process module to be occupied corresponding to the wafer batch and the type of work module occupied by the wafer batch corresponding to the earliest completion time, to obtain the twice-sorted information; Then sort the twice-sorted information three times according to the cleaning requirements corresponding to the wafer batch to obtain the sorted batch information.

6. The vacuum lock in-out control method based on ROPN according to claim 5, characterized in that The confirmation of the wafer batch to be transmitted based on the sorted batch information, the real-time occupancy information of the process module, and the control rules of the constructed ROPN model includes: The real-time occupancy information of the process module also includes the real-time available quantity of the process module; Based on the sorted batch information, compare one by one the quantity of the process module to be occupied by the wafer batch and the real-time available quantity of the process module; When the quantity of the process module to be occupied by the wafer batch ≤ the real-time available quantity of the process module, then confirm that this wafer batch is the wafer batch to be introduced; Obtain the estimated arrival time of the vacuum lock for the wafer batch to be introduced, compare the obtained estimated arrival time of the vacuum lock and the earliest completion time of the wafer batch in the processing state, and confirm the wafer batch to be transmitted based on the comparison result and the control rules of the constructed ROPN model.

7. The vacuum lock in-out control method based on ROPN according to claim 6, characterized in that, After confirming that this wafer batch is the wafer batch to be introduced, it further includes: Obtain the real-time occupancy situation of the vacuum lock; Based on the real-time occupancy situation of the vacuum lock, confirm the introduction position of the wafer batch to be introduced.

8. A vacuum lock in-out control device based on ROPN, characterized in that, It includes: An acquisition module, configured to acquire the total quantity of the process module and construct an ROPN model, and acquire the real-time cleaning information of the process module based on the constructed ROPN model; A judgment module, configured to judge whether to allow the introduction of new wafers based on the real-time cleaning information, the total quantity of the process module, and the control rules of the constructed ROPN model; A processing module, configured to, when allowing the introduction of new wafers, acquire the multi-batch work information and acquire the real-time occupancy information of the process module based on the constructed ROPN model, and confirm the sorted batch information based on the multi-batch work information and the real-time occupancy information of the process module; A confirmation module, configured to confirm the wafer batch to be transmitted based on the sorted batch information, the real-time occupancy information of the process module, and the control rules of the constructed ROPN model.

9. A vacuum lock in-out control device based on ROPN, characterized in that, The ROPN-based vacuum lock access control device includes: a memory and at least one processor, and instructions are stored in the memory; At least one of the processors calls the instructions in the memory, so that the ROPN-based vacuum lock access control device executes each step of the ROPN-based vacuum lock access control method according to any one of claims 1-7.

10. A computer-readable storage medium having instructions stored thereon, characterized in that, When the instructions are executed by the processor, each step of the ROPN-based vacuum lock access control method according to any one of claims 1-7 is implemented.

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