Vacuum lock access control method, device, equipment and storage medium based on ROPN

Abstract

The present invention relates to the field of semiconductor technology, and in particular to a vacuum lock entry and exit control method, device, equipment and storage medium based on ROPN. The method comprises: obtaining the total number of process modules and constructing an ROPN model to obtain real-time cleaning information; judging whether new wafers are allowed to be introduced based on the real-time cleaning information, the total number of process modules and the control rules of the ROPN model; if allowed, obtaining multiple batches of work information and real-time occupancy information to confirm sorting batch information; confirming the wafer batch to be transferred based on the sorting batch information, real-time occupancy information and control rules; the method disclosed in the present application realizes dynamic scheduling of wafer batches based on sorting batch information and resource status, supports multi-batch parallel processing, and avoids blocking of the processing process; by accurately controlling the entry and exit timing of the vacuum lock, the residence time of wafers in the system and the idling phenomenon of the equipment are effectively reduced, thereby improving the utilization rate of process modules and robots.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a vacuum lock entry and exit control method, device, equipment and storage medium based on ROPN. Background Art

[0002] In the field of semiconductor manufacturing, the chip production process is extremely complex and involves numerous precise process steps. Cluster tools, as the core production equipment in this process, play a vital role. Cluster tools are designed to achieve continuous processing of wafers through a series of modular process chambers. These process chambers usually include key components such as atmospheric modules, vacuum modules, and load locks. The vacuum lock is the transition area connecting the atmospheric and vacuum ends. Its main function is to ensure that the wafer can be safely isolated from the atmospheric environment before entering the process chamber with a vacuum environment, and to safely return the wafer to the atmospheric environment after processing is completed.

[0003] Although combined equipment plays an important role in improving production efficiency and ensuring product quality, existing technologies still face two major challenges:

[0004] First, there is the problem of low efficiency in vacuum lock scheduling. During the wafer processing process, the scheduling efficiency of the vacuum lock directly affects the throughput of the entire production line. If the wafer stays in the vacuum lock or robot for too long, it will not only lead to waste of production capacity, but also make it difficult to ensure the "first in, first out" principle of the wafer. In this case, the processing of subsequent wafers may be delayed, thus affecting the smooth progress of the entire production process.

[0005] Secondly, there is the risk of multi-process deadlock. In semiconductor manufacturing, in order to improve equipment utilization and production flexibility, multiple wafer batches (Sequences) are usually processed simultaneously. However, when multiple batches are processed simultaneously, the problem of resource competition becomes particularly prominent. These resources include key components such as vacuum lock ports and process modules. If resources are not allocated properly, it can easily lead to deadlock, that is, two or more wafer batches wait for each other to release resources, resulting in the interruption of the entire production process. This interruption not only reduces production efficiency, but may also affect the quality of the wafers.

[0006] It can be seen that the existing technology still needs to be improved and enhanced. Summary of the Invention

[0007] In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide a vacuum lock entry and exit control method based on ROPN, which can coordinate the wafer flow between the atmospheric end and the vacuum end to avoid wafer retention problems and batch blocking problems.

[0008] The first aspect of the present invention provides a vacuum lock entry and exit control method based on ROPN, including: obtaining the total number of process modules and constructing a ROPN model, obtaining real-time cleaning information of the process modules based on the constructed ROPN model; judging whether to allow the entry of new wafers based on the real-time cleaning information, the total number of process modules and the control rules of the constructed ROPN model; when allowing the entry of new wafers, obtaining multiple batches of work information and obtaining real-time occupancy information of the process modules based on the constructed ROPN model, confirming the sorting batch information based on the multiple batches of work information and the real-time occupancy information of the process modules; confirming the wafer batch to be transferred based on the sorting batch information, the real-time occupancy information of the process modules and the control rules of the constructed ROPN model.

[0009] Optionally, in a first implementation method of the first aspect of the present invention, the control rules based on real-time cleaning information, the total number of process modules and the constructed ROPN model determine whether the introduction of new wafers is allowed, including: when the real-time cleaning information indicates that all process modules do not need to be cleaned, the introduction of new wafers is allowed; when the real-time cleaning information indicates that some process modules need to be cleaned, the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end manipulator are obtained, and whether the introduction of new wafers is allowed is determined based on the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end manipulator; when the real-time cleaning information indicates that all process modules need to be cleaned, the introduction of new wafers is not allowed.

[0010] Optionally, in a second implementation of the first aspect of the present invention, the judgment of whether to allow the introduction of new wafers based on the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end manipulator includes: when the real-time wafer information in the vacuum lock indicates that there are no wafers in the vacuum lock, and when the real-time working information of the vacuum end manipulator indicates that the vacuum end manipulator does not clamp the wafer, the introduction of new wafers is allowed; when the real-time wafer information in the vacuum lock indicates that there are wafers in the vacuum lock, or when the real-time working information of the vacuum end manipulator indicates that the vacuum end manipulator clamps the wafer, the introduction of new wafers is not allowed.

[0011] Optionally, in a third implementation of the first aspect of the present invention, when new wafers are allowed to be transferred in, multiple batches of work information are obtained and the real-time occupancy information of the process modules is obtained based on the constructed ROPN model, and the sorting batch information is confirmed based on the multiple batches of work information and the real-time occupancy information of the process modules, including: when new wafers are allowed to be transferred in, multiple batches of work information are obtained, the multiple batches of work information include the work information of multiple wafer batches, the work information of each wafer batch includes the process information corresponding to the wafer batch, the process information includes priority, the type of process module to be occupied, and cleaning requirements; based on the constructed ROPN model, the real-time occupancy information of the process module is obtained, the real-time occupancy information includes the earliest completion time of the wafer batch in the processing state and the type of process module occupied by the wafer batch corresponding to the earliest completion time; each wafer batch is sorted based on the process information corresponding to the wafer batch and the real-time occupancy information of the process module to obtain sorting batch information.

[0012] Optionally, in a fourth implementation method of the first aspect of the present invention, each wafer batch is sorted based on the process information corresponding to the wafer batch and the real-time occupancy information of the process module to obtain sorted batch information, including: sorting multiple batches of work information once in descending order of priority according to the priority corresponding to the wafer batch to obtain first-ordered batch information; for wafer batches with the same priority, sorting the first-ordered batch information twice according to the type of process module to be occupied corresponding to the wafer batch and the type of work module occupied by the wafer batch corresponding to the earliest completion time to obtain second-ordered information; and sorting the second-ordered information three times according to the cleaning requirements corresponding to the wafer batch to obtain sorted batch information.

[0013] Optionally, in a fifth implementation of the first aspect of the present invention, the real-time occupied number of process modules is obtained, and the wafer batch to be transmitted is confirmed based on the sorting batch information, the real-time occupied information of the process modules and the control rules of the constructed ROPN model, including: the real-time occupancy information of the process modules also includes the real-time available number of process modules; based on the sorting batch information, the number of process modules to be occupied and the real-time available number of process modules of the wafer batch are compared one by one; when the process modules to be occupied of the wafer batch ≤ the real-time available number of process modules, the wafer batch is confirmed to be the wafer batch to be transmitted; the estimated arrival time of the vacuum lock of the wafer batch to be transmitted is obtained, the obtained estimated arrival time of the vacuum lock is compared with the earliest completion time of the wafer batch in the processing state, and the wafer batch to be transmitted is confirmed based on the comparison result and the control rules of the constructed ROPN model.

[0014] Optionally, in a sixth implementation of the first aspect of the present invention, the step of confirming that the wafer batch is a wafer batch to be transferred in further includes: obtaining the real-time occupancy status of the vacuum lock; and confirming the transfer position of the wafer batch to be transferred in based on the real-time occupancy status of the vacuum lock.

[0015] The second aspect of the present invention provides a vacuum lock entry and exit control device based on ROPN, including: an acquisition module, used to obtain the total number of process modules and construct a ROPN model, and obtain real-time cleaning information of the process modules based on the constructed ROPN model; a judgment module, used to judge whether to allow the entry of new wafers based on the real-time cleaning information, the total number of process modules and the control rules of the constructed ROPN model; a processing module, used to obtain multiple batches of work information and obtain real-time occupancy information of the process modules based on the constructed ROPN model when allowing the entry of new wafers, and confirm the sorting batch information based on the multiple batches of work information and the real-time occupancy information of the process modules; a confirmation module, used to confirm the wafer batch to be transferred based on the sorting batch information, the real-time occupancy information of the process modules and the control rules of the constructed ROPN model.

[0016] A third aspect of the present invention provides a ROPN-based vacuum lock access control device, the ROPN-based vacuum lock access control device comprising: a memory and at least one processor, the memory storing instructions; at least one processor calling the instructions in the memory so that the ROPN-based vacuum lock access control device performs each step of any one of the above-mentioned ROPN-based vacuum lock access control methods.

[0017] A fourth aspect of the present invention provides a computer-readable storage medium having instructions stored thereon, which, when executed by a processor, implement the various steps of any of the above-mentioned ROPN-based vacuum lock access control methods.

[0018] In the technical solution of the present invention, dynamic scheduling of wafer batches is achieved based on sorting batch information and the resource status of semiconductor combination equipment, supporting multi-batch parallel processing, while avoiding blocking during the processing process, and adapting to complex process paths; by precisely controlling the entry and exit timing of the vacuum lock, the residence time of the wafer in the system and the idling phenomenon of the equipment are effectively reduced, thereby improving the utilization rate of the process module and the robot; in addition, frequent vacuuming and inflation operations of the vacuum lock are avoided, thereby reducing overall energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic structural diagram of a semiconductor assembly device to which the ROPN-based vacuum lock access control method provided in an embodiment of the present invention is applicable;

[0020] Figure 2 A schematic structural diagram of a vacuum lock provided in an embodiment of the present invention;

[0021] Figure 3 A logic flow chart of a vacuum lock entry and exit control method based on ROPN provided in an embodiment of the present invention;

[0022] Figure 4 A schematic diagram of the structure of a vacuum lock access control device based on ROPN provided in an embodiment of the present invention;

[0023] Figure 5 A schematic structural diagram of a vacuum lock access control device based on ROPN provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The present invention provides a vacuum lock access control method, apparatus, device, and storage medium based on ROPN. In the present invention, the terms "first," "second," "third," "fourth," and so on (if any) in the specification and claims of the present invention and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to those steps or units expressly listed, but may include other steps or units not expressly listed or inherent to such process, method, product, or apparatus.

[0025] For ease of understanding, the following describes a semiconductor assembly device to which the present invention is applicable. Figure 1 In the semiconductor manufacturing process, wafer handling and processing are crucial links. The entire process is divided into two parts: the atmospheric end and the vacuum end to ensure efficient transmission and processing of wafers in different process modules. At the atmospheric end, wafer storage and preliminary processing are carried out through storage units (Foup). These storage units are grouped into "Sequences" according to the process path to ensure that wafers are processed in the correct order. EFEM, as the atmospheric end manipulator, is responsible for accurately transferring wafers between Foup, Aligner, LoadLock and Cooler. The efficient operation of EFEM ensures seamless connection of wafers between different equipment, thereby improving the efficiency of the entire production line. LoadLock is the key component connecting the atmospheric end and the vacuum end. It has a variety of structural designs, such as Figure 2 a) Upper and lower layer design (each port includes the first slot and the second slot arranged in an upper and lower manner) or Figure 2 b) The left-right layer design (each port includes the first and second slots set on the left and right) supports multiple modes such as "simultaneous entry and exit" and "bottom-in and top-out"; the main function of the vacuum lock is to first evacuate (Pump, vacuum inlet) or fill (Vent, vacuum outlet) the wafers during transfer, ensuring air pressure isolation at both ends and protecting the process environment of the vacuum end from contamination; after entering the vacuum end, the wafers will be sent to different process modules (PMs), such as thin film deposition and etching, which can be processed in parallel to improve production efficiency; the vacuum end robot (TM) is responsible for transporting wafers between the vacuum lock and various process modules, ensuring the safe and accurate transfer of wafers in the vacuum environment.

[0026] The entire system is designed to reduce the risk of wafer contamination during transportation while improving production efficiency and process quality; through precise control and automated operation, every link in semiconductor manufacturing is optimized, ensuring the high performance and reliability of the final product.

[0027] The processing flow of the semiconductor assembly equipment disclosed in this embodiment is as follows: the atmospheric end robot is responsible for transporting the wafer to be processed from the storage unit to the calibration table for calibration, and then transporting it to the vacuum lock; after the vacuum lock receives the wafer in the atmosphere, it performs a vacuum operation. After the vacuum operation is completed, the vacuum end robot takes out the unprocessed wafer from the vacuum lock and places it into the process module for processing; if the wafer path recipe specifies that the processing chamber needs to be cleaned before processing, it must first be cleaned with a cleaning sheet before the wafer can enter the processing chamber of the process module; after the wafer is processed according to the recipe path, the vacuum end robot takes it out of the processing chamber and puts it back into the vacuum lock; after the vacuum lock receives the wafer, it performs an air filling operation; finally, the atmospheric end robot places the processed wafer into the cooling table for cooling, and finally places it into the wafer loader and unloader. If there are unprocessed wafers for this task in the wafer loader and unloader, the wafer must first be placed in the storage unit for buffering, and then transferred to the wafer loading and unloading when there are no unprocessed wafers in the wafer loader and unloader.

[0028] Further, for ease of understanding, the specific process of the embodiment of the present invention is described below. Figure 3 In one embodiment of the present invention, a vacuum lock access control method based on ROPN includes:

[0029] 101. Obtain the total number of process modules and construct a ROPN model, and obtain real-time cleaning information of the process modules based on the constructed ROPN model;

[0030] In this embodiment, the ROPN model is used to formally describe resources in the assembly equipment, such as the atmospheric robot EFEM, vacuum robot TM, and process module PM. ROPN is a discrete event system modeling tool that describes the assembly equipment scheduling process using places and transitions. Places represent system states, such as whether a process module is being cleaned or a wafer is in a load lock. Transitions represent state switching operations, such as transferring a wafer from the atmospheric robot to the load lock or removing a wafer from the load lock by the vacuum robot. Transitions and places are connected by tokens, where the number of tokens represents the number of resources or the number of active states. In the ROPN model constructed in this embodiment, token n1 represents the available number of parallel PMs, and token c2 represents the clean status of the PM. Control place c is introduced as the key logic. Control place C dynamically adjusts the wafer transfer strategy of the load lock by monitoring the available number of process modules (token n1) and their clean status (token c2) in real time. Specifically, based on the values ​​of n1 and c2, control place C triggers the "Vent transfer wafer" transition to determine whether to allow the EFEM to transfer a new wafer to the load lock.

[0031] 102. Determine whether to allow the incoming new wafer based on the real-time cleaning information, the total number of process modules, and the control rules of the constructed ROPN model;

[0032] In this embodiment, when multiple parallel process modules (such as PM1, PM2, and PM3) need to be cleaned after completing their processing tasks, if the vacuum lock continues to allow new wafers to enter, it may cause a series of retention problems; specifically, for vacuum locks with upper and lower layer structure designs, the vacuum lock slot where the new wafer is located may be occupied as a wafer outlet, resulting in the slot needing to be frequently vacuumed and filled with air (Pump / Vent) operations, which not only reduces production efficiency but may also increase equipment wear; in vacuum locks with left and right layer structure designs, new wafers may be retained on the transfer robot because the process module (PM) being cleaned has not yet released resources, which will cause delays in the production process and potential bottlenecks; in order to solve the aforementioned problems, it is necessary to determine whether to allow the entry of new wafers based on real-time cleaning information, the total number of process modules, and preset control rules to ensure a smooth and efficient production process.

[0033] 103. When a new wafer is allowed to be transferred in, obtain multiple batches of work information and obtain real-time occupancy information of the process modules based on the constructed ROPN model, and confirm the sorting batch information based on the multiple batches of work information and the real-time occupancy information of the process modules;

[0034] 104. Confirm the wafer batch to be transferred based on the sorting batch information, the real-time occupancy information of the process modules, and the control rules of the constructed ROPN model;

[0035] In this embodiment, when two or more wafer batches use the vacuum lock at the same time, deadlock may occur due to competition for ports or process modules. Specifically, taking a 2-sequence deadlock and a vacuum lock with an upper and lower structure as an example, assume that Sequence 1 needs to enter from the upper layer (first slot) of the vacuum lock and then exit from the lower layer (second slot), while Sequence 2 is the opposite, it needs to enter from the second slot and exit from the first slot. In this case, if the two sequences are carried out at the same time, they will wait for each other to release the required ports, resulting in deadlock because no sequence can continue to move forward without relying on the other to release resources. For the case of 3 or more sequences, the deadlock problem will become more serious. To make the process more complicated, multiple batches may cross-occupy the slots or process modules of the vacuum lock, forming a circular waiting situation; in this circular waiting, each wafer batch is waiting for another wafer batch to release resources, and the latter is waiting for the third wafer batch, and so on, until the last batch is waiting for the first batch, forming a closed loop. In this case, no wafer batch can continue to execute, causing the entire production process to stagnate; in order to avoid this deadlock situation, it is necessary to confirm the wafer batch to be incoming based on the sorting batch information, the real-time occupancy number of the process module and the preset control rules, to ensure that when multiple wafer batches are carried out at the same time, resources can be reasonably allocated, thereby avoiding the occurrence of deadlock and ensuring the smooth progress of the production process.

[0036] The ROPN-based vacuum lock in-and-out control method disclosed in the present application solves the wafer retention problem and eliminates the deadlock problem caused by batch blocking, which not only reduces the waiting time of wafers and releases LoadLock and robot resources, but also realizes parallel processing of more batches, and fully utilizes the parallel capability of the PM module; this synergistic effect enables the combination equipment to achieve an ideal balance between the rapid flow of a single batch and the concurrent processing of multiple batches, significantly improving production capacity; at the same time, by controlling the retention problem to prevent a single batch from slowing down the overall situation, and by controlling the deadlock problem to avoid multiple batches from blocking each other, it ensures that the combination equipment can operate continuously and stably under complex working conditions, such as multi-PM cleaning and multi-process paths, and realizes efficient and stable operation of the combination equipment, providing a solid foundation for improving production efficiency.

[0037] In this embodiment, the control rules based on the real-time cleaning information, the total number of process modules, and the constructed ROPN model determine whether to allow the incoming new wafer, including:

[0038] 201. When the real-time cleaning information indicates that all process modules do not need to be cleaned, the new wafer is allowed to be introduced;

[0039] 202. When the real-time cleaning information indicates that some process modules need to be cleaned, obtain the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end robot, and determine whether to allow the introduction of new wafers based on the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end robot;

[0040] 203. When the real-time cleaning information indicates that all process modules need to be cleaned, the input of new wafers is not allowed.

[0041] In this embodiment, the determination of whether to allow the introduction of a new wafer based on the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end robot includes:

[0042] 301. When the real-time wafer information in the vacuum lock indicates that there is no wafer in the vacuum lock, and when the real-time working information of the vacuum end manipulator indicates that the vacuum end manipulator is not holding a wafer, the introduction of a new wafer is allowed;

[0043] 302. When the real-time wafer information in the vacuum lock indicates that there is a wafer in the vacuum lock, or when the real-time working information of the vacuum end robot indicates that the vacuum end robot is clamping a wafer, the introduction of new wafers is not allowed.

[0044] In this embodiment, based on the ROPN model, the empirical rules for avoiding detention are converted into computable token flow logic. Through comprehensive judgment of real-time cleaning information, wafer information in the vacuum lock, and working information of the vacuum-end robot, the timing of the introduction of new wafers can be accurately controlled to ensure that each step of the operation meets the actual load of the resources, avoid production interruptions caused by cleaning needs, thereby ensuring the continuous and stable operation of the production line, improving overall production efficiency, avoiding unnecessary wafer waiting and resource waste, and improving resource utilization efficiency.

[0045] For example, the total number of process modules is 3, namely PM1, PM2 and PM3. When PM1 or PM2 completes processing and needs to be cleaned, and the vacuum end robot is preparing to load the fourth wafer to be processed into PM3 and unload the third wafer that has completed processing, if there is an unprocessed wafer on TM (for example, the fifth wafer to be processed), the vacuum lock will not allow new wafers to enter until PM3 completes processing or PM1 or PM2 is cleaned, so as to avoid the fifth wafer to be processed waiting for a long time on the vacuum lock or vacuum end robot.

[0046] In this embodiment, when allowing new wafers to be transferred in, obtaining multiple batches of work information and obtaining real-time occupancy information of process modules based on the constructed ROPN model, and confirming sorting batch information based on the multiple batches of work information and the real-time occupancy information of the process modules include:

[0047] 401. When allowing a new wafer to be transferred in, obtain multiple batches of work information, where the multiple batches of work information include work information of multiple wafer batches, and the work information of each wafer batch includes process information corresponding to the wafer batch, where the process information includes priority, type of process module to be occupied, and cleaning requirements;

[0048] 402. Acquire real-time occupancy information of process modules based on the constructed ROPN model, wherein the real-time occupancy information includes the earliest completion time of a wafer batch in processing and the type of process module occupied by the wafer batch corresponding to the earliest completion time;

[0049] 403 . Sort each wafer batch based on process information corresponding to the wafer batch and real-time occupancy information of the process modules to obtain sorted batch information.

[0050] In this embodiment, the process information corresponding to the wafer batch and the real-time occupancy information of the process modules are used to sort each wafer batch to obtain sorted batch information, including:

[0051] 501. According to the priorities corresponding to the wafer batches, the multiple batches of work information are sorted in descending order of priority to obtain sorted batch information;

[0052] 502. For wafer batches with the same priority, perform a secondary sort on the first-order batch information based on the type of process modules required to be occupied by the wafer batch and the type of work modules occupied by the wafer batch corresponding to the earliest completion time to obtain secondary sort information.

[0053] In this embodiment, the priority of each sequence and the PM status are used to determine which sequence has priority in entering and exiting the vacuum lock. For example, if the PM associated with Sequence 1 is about to complete its process and release resources, it is allowed to complete its process first, and then Sequence 2 is allowed to enter. This ensures that the wafers of all sequences can complete their processes within a reasonable time.

[0054] 503. Then, the secondary sorting information is sorted a third time according to the cleaning requirements corresponding to the wafer batch to obtain sorting batch information;

[0055] In this embodiment, it is assumed that the vacuum lock system includes two slots: the first slot (entry) and the second slot (exit). At a certain moment, two production sequences, Sequence 1 and Sequence 2, with the same processing priority but different processing paths, apply to enter the vacuum lock at the same time. Among them, the two PMs associated with Sequence 1 both need to be cleaned, while Sequence 2 does not need to be cleaned for these two PMs. Without considering the cleaning status, if these two sequences are allowed to enter at the same time, serious production problems may occur. Specifically, the wafers of Sequence 1 will be stranded on the transfer robot because the PMs are being cleaned, while the wafers of Sequence 2 may not be transferred because the first and second slots are occupied. In this case, neither sequence can proceed smoothly, resulting in a deadlock and affecting the efficiency of the entire production line. However, by considering the cleaning requirements of each sequence, a more reasonable decision can be made. In this case, Sequence 2's cleaning requirement is 0, indicating that its PM cleaning status is better and all PMs are available. Therefore, Sequence 2 is prioritized and placed before Sequence 1. This allows Sequence 2's wafers to be processed immediately by the PM, and the second slot is quickly released after completion. After Sequence 2 releases its resources, Sequence 1 can enter the vacuum lock, avoiding the problem of competition between the two parties for the first and second slots and ensuring the smooth progress of the production process.

[0056] In this embodiment, by sorting according to the priority of wafer batches, it is ensured that high-priority wafer batches can be processed first, meeting urgent production needs, thereby improving production efficiency and shortening the production cycle; secondly, for wafer batches with the same priority, a second sorting is further performed according to the type of process module to be occupied and the type of work module occupied by the wafer batch corresponding to the earliest completion time, which helps to optimize the utilization of process modules, reduce waiting time and idle resources, and improve the overall utilization rate of the production line, thereby reducing the situation where multiple batches wait for scarce process modules at the same time, and allowing available process modules to process new wafers first; finally, by sorting three times according to the cleaning requirements of the wafer batches, global blockage caused by cleaning backlog of process modules is avoided; through multi-level and multi-dimensional sorting strategies, the efficiency of wafer production and the resource utilization rate of process modules are effectively improved.

[0057] In this embodiment, the real-time occupancy information of the process modules also includes the real-time available number of process modules; the control rules based on the sorting batch information, the real-time occupancy information of the process modules, and the constructed ROPN model determine the wafer batch to be transferred, including:

[0058] 601. Based on the sorting batch information, compare the number of process modules required for each wafer batch with the real-time available number of process modules one by one;

[0059] 602. When the number of process modules required by the wafer batch is less than or equal to the real-time available number of process modules, the wafer batch is confirmed as the wafer batch to be transferred;

[0060] In this embodiment, firstly, the occupancy of process modules is monitored in real time, and the immediately available number of process modules is accurately calculated based on the total number and the real-time occupied number, thereby ensuring the accuracy and timeliness of production scheduling; secondly, based on the sorting batch information, the number of process modules required for the wafer batch is compared with the immediately available number one by one. This step effectively avoids the situation where the wafer batch has to wait due to insufficient process modules, thereby improving production efficiency; finally, when the number of process modules required for the wafer batch is less than or equal to the immediately available number, the wafer batch is confirmed to be the wafer batch to be transferred, thereby realizing the automation and intelligence of production scheduling, avoiding the deadlock problem caused by resource exhaustion, not only reducing the cost of manual intervention, but also improving the accuracy and efficiency of production scheduling.

[0061] 603. Obtain an estimated vacuum lock arrival time of the wafer batch to be transferred, compare the obtained estimated vacuum lock arrival time with the earliest completion time of the wafer batch in the processing state, and confirm the wafer batch to be transferred based on the comparison result and the control rules of the constructed ROPN model;

[0062] In this embodiment, multiple libraries are introduced into the constructed ROPN model to represent the states of different sequences, and the competition among sequences for resources, such as the competition for the vacuum lock port and the competition for the PM module, is simulated through transition trigger conditions. The priority of the sequence and the PM state are used to determine which sequence has priority in entering and exiting the vacuum lock. For example, when a wafer of a new sequence attempts to enter the vacuum lock, the system estimates its arrival time and compares it with the earliest completion time of the sequence in the processing state. If the entry of the new sequence may cause a deadlock, its entry is temporarily suspended. By converting fuzzy strategies for coordinating multiple batches, such as giving priority to transmitting batches that are about to be completed, into precise decisions based on the state of the ROPN model, it is ensured that there is no circular waiting during multi-tasking concurrency.

[0063] In this embodiment, the step of confirming that the wafer batch is the wafer batch to be transferred further includes:

[0064] 701. Get the real-time occupancy status of the vacuum lock;

[0065] In this embodiment, the real-time occupancy status of the vacuum lock refers to the current usage and pending usage status of a specific slot in the vacuum lock.

[0066] 702. Confirm the incoming location of the wafer batch to be incoming based on the real-time occupancy status of the vacuum lock;

[0067] In this example, see Figure 2 For example, Sequence 1 is entering the system through slot 1 and plans to leave through slot 2, currently processing PM1. At the same time, Sequence 2 also intends to enter through slot 1, but slot 1 is currently occupied by Sequence 1. At this time, it is detected that Sequence 1's cleaning work on PM1 will take 5 minutes to complete, while Sequence 2's processing on PM2 does not require cleaning and is expected to complete in only 3 minutes. In this case, if slot 2 is available, Sequence 2 can choose to enter the combined device from slot 2.

[0068] The above describes the vacuum lock access control method based on ROPN in the embodiment of the present invention. The following describes the vacuum lock access control device based on ROPN in the embodiment of the present invention. Figure 4 In one embodiment of the present invention, a vacuum lock access control device based on ROPN includes:

[0069] An acquisition module 801 is used to acquire the total number of process modules and construct a ROPN model, and acquire real-time cleaning information of the process modules based on the constructed ROPN model;

[0070] A judgment module 802 is configured to judge whether to allow the introduction of a new wafer based on the real-time cleaning information, the total number of process modules, and the control rules of the constructed ROPN model;

[0071] Processing module 803 is configured to obtain multiple batches of work information and obtain real-time occupancy information of process modules based on the constructed ROPN model when allowing new wafers to be transferred in, and confirm sorting batch information based on the multiple batches of work information and the real-time occupancy information of process modules;

[0072] The confirmation module 804 is used to confirm the wafer batch to be transferred based on the sorting batch information, the real-time occupancy information of the process modules and the control rules of the constructed ROPN model.

[0073] Based on the same idea as the method in the above embodiment, the device provided in this application can implement the method in the above embodiment.

[0074] above Figure 4 The ROPN-based vacuum lock access control device in the embodiment of the present invention is described in detail from the perspective of modular functional entities. The ROPN-based vacuum lock access control device in the embodiment of the present invention is described in detail from the perspective of hardware processing.

[0075] Figure 5 This is a schematic diagram of the structure of a ROPN-based vacuum lock access control device provided by an embodiment of the present invention. This ROPN-based vacuum lock access control device 900 may vary significantly depending on configuration or performance. It may include one or more processors (central processing units, CPUs) 910, a memory 920, and one or more storage media 930 (e.g., one or more mass storage devices) storing application programs 933 or data 932. The memory 920 and storage medium 930 may be either transient or persistent storage. The program stored in the storage medium 930 may include one or more modules (not shown), each of which may include a series of instructions and operations within the ROPN-based vacuum lock access control device 900. Furthermore, the processor 910 may be configured to communicate with the storage medium 930, executing the series of instructions and operations stored in the storage medium 930 on the ROPN-based vacuum lock access control device 900 to implement the steps of the ROPN-based vacuum lock access control method provided in the aforementioned method embodiments.

[0076] The ROPN-based vacuum lock access control device 900 may further include one or more power supplies 940, one or more wired or wireless network interfaces 950, one or more input and output interfaces 960, and / or one or more operating systems 931, such as Windows Server, Mac OS X, Unix, Linux, FreeBSD, etc. It will be understood by those skilled in the art that Figure 5 The illustrated structure of the ROPN-based vacuum lock access control device does not constitute a limitation on the ROPN-based vacuum lock access control device, and may include more or fewer components than illustrated, or a combination of certain components, or a different arrangement of components.

[0077] The present invention also provides a computer-readable storage medium, which can be a non-volatile computer-readable storage medium or a volatile computer-readable storage medium. The computer-readable storage medium stores instructions, which, when executed on a computer, cause the computer to execute the steps of a vacuum lock entry and exit control method based on ROPN.

[0078] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described systems, devices, and units can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0079] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the portion that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes various media that can store program code, such as a USB flash drive, a mobile hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0080] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A vacuum lock access control method based on ROPN, characterized in that: include: Obtaining the total number of process modules and constructing a ROPN model, and obtaining real-time cleaning information of the process modules based on the constructed ROPN model; Determine whether to allow the incoming new wafer based on real-time cleaning information, the total number of process modules, and the control rules of the constructed ROPN model; When new wafers are allowed to be transferred in, multiple batches of work information are obtained and the real-time occupancy information of the process modules is obtained based on the constructed ROPN model. The sorting batch information is confirmed based on the multiple batches of work information and the real-time occupancy information of the process modules. The wafer batch to be transferred is confirmed based on the sorting batch information, the real-time occupancy information of the process modules and the control rules of the constructed ROPN model.

2. The vacuum lock access control method based on ROPN according to claim 1 is characterized in that: The control rules based on the real-time cleaning information, the total number of process modules and the constructed ROPN model determine whether to allow the incoming new wafer, including: When real-time cleaning information indicates that all process modules do not need to be cleaned, new wafers are allowed to enter; When real-time cleaning information indicates that some process modules need to be cleaned, the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end robot are obtained, and based on the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end robot, it is determined whether to allow the entry of new wafers; When real-time cleaning information indicates that all process modules need to be cleaned, no new wafers are allowed to be introduced.

3. The vacuum lock access control method based on ROPN according to claim 2, characterized in that: The determination of whether to allow the transfer of a new wafer based on the real-time wafer information in the vacuum lock and the real-time working information of the vacuum end robot includes: When the real-time wafer information in the vacuum lock indicates that there is no wafer in the vacuum lock, and when the real-time working information of the vacuum end robot indicates that the vacuum end robot is not holding a wafer, the new wafer is allowed to be transferred; When the real-time wafer information in the vacuum lock indicates that there is a wafer in the vacuum lock, or when the real-time working information of the vacuum end robot indicates that the vacuum end robot is clamping a wafer, the input of new wafers is not allowed.

4. The vacuum lock access control method based on ROPN according to claim 1, characterized in that: When allowing new wafers to be transferred in, obtaining multiple batches of work information and obtaining real-time occupancy information of process modules based on the constructed ROPN model, and confirming sorting batch information based on the multiple batches of work information and the real-time occupancy information of the process modules, including: When allowing a new wafer to be transferred in, obtaining multiple batches of work information, the multiple batches of work information including work information of multiple wafer batches, the work information of each wafer batch including process information corresponding to the wafer batch, the process information including priority, type of process module to be occupied, and cleaning requirements; Acquiring real-time occupancy information of process modules based on the constructed ROPN model, wherein the real-time occupancy information includes the earliest completion time of a wafer batch in a processing state and the type of process module occupied by the wafer batch corresponding to the earliest completion time; Each wafer batch is sorted based on process information corresponding to the wafer batch and real-time occupancy information of the process modules to obtain sorted batch information.

5. The vacuum lock access control method based on ROPN according to claim 4 is characterized in that: The step of sorting each wafer batch based on the process information corresponding to the wafer batch and the real-time occupancy information of the process modules to obtain sorted batch information includes: According to the priorities corresponding to the wafer batches, the multiple batches of work information are sorted in descending order of priority to obtain sorted batch information; For wafer batches with the same priority, the first-order batch information is re-sorted according to the type of process modules required to be occupied by the wafer batch and the type of work modules occupied by the wafer batch corresponding to the earliest completion time to obtain the second-order batch information; The secondary sorting information is then sorted a third time according to the cleaning requirements corresponding to the wafer batch to obtain sorting batch information.

6. The vacuum lock access control method based on ROPN according to claim 5, characterized in that: The wafer batch to be transferred is confirmed based on the sorting batch information, the real-time occupancy information of the process modules and the control rules of the constructed ROPN model, including: The real-time occupancy information of the process modules also includes the real-time available number of process modules; Based on the sorting batch information, the number of process modules required for each wafer batch is compared with the real-time available number of process modules. When the number of process modules required by a wafer batch is less than or equal to the real-time available number of process modules, the wafer batch is confirmed as the wafer batch to be transferred; Obtain the estimated arrival time of the vacuum lock of the wafer batch to be transferred, compare the obtained estimated arrival time of the vacuum lock with the earliest completion time of the wafer batch in the processing state, and confirm the wafer batch to be transferred based on the comparison result and the control rules of the constructed ROPN model.

7. The ROPN-based vacuum lock access control method according to claim 6, characterized in that: The step of confirming that the wafer lot is the wafer lot to be transferred further includes: Get real-time occupancy status of vacuum locks; The incoming location of the incoming wafer batch is confirmed based on the real-time occupancy of the vacuum lock.

8. A vacuum lock access control device based on ROPN, characterized in that: include: An acquisition module is used to obtain the total number of process modules and construct a ROPN model, and obtain real-time cleaning information of the process modules based on the constructed ROPN model; A judgment module is used to judge whether to allow the input of a new wafer based on real-time cleaning information, the total number of process modules and the control rules of the constructed ROPN model; A processing module is used to obtain multi-batch work information and real-time occupancy information of process modules based on the constructed ROPN model when allowing new wafers to be transferred in, and confirm the sorting batch information based on the multi-batch work information and the real-time occupancy information of the process modules; The confirmation module is used to confirm the wafer batch to be transferred based on the sorting batch information, the real-time occupancy information of the process module and the control rules of the constructed ROPN model.

9. A vacuum lock access control device based on ROPN, characterized in that: The ROPN-based vacuum lock access control device includes: a memory and at least one processor, wherein the memory stores instructions; At least one of the processors calls the instructions in the memory to enable the ROPN-based vacuum lock access control device to execute each step of the ROPN-based vacuum lock access control method according to any one of claims 1 to 7.

10. A computer-readable storage medium having instructions stored thereon, characterized in that: When the instructions are executed by the processor, the various steps of the ROPN-based vacuum lock entry and exit control method as described in any one of claims 1 to 7 are implemented.

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