Component for power conversion device

By bonding the capacitor to the metal case using a metal case and an adhesive resin part in the power conversion device, the thermal dissipation problem of capacitors is solved, the heat dissipation is improved, and the equivalent series inductance is reduced, and the thermal management and electrical performance of the power conversion device are improved.

CN120341037APending Publication Date: 2025-07-18PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
CN202510055408.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-01-17
Filing Date
2025-01-14
Publication Date
2025-07-18

AI Technical Summary

Technical Problem

In the existing power conversion device, heat is difficult to escape from the parts in which the casting material is contacted, resulting in insufficient heat dissipation.

Method used

The capacitor is bonded to the metal case by using a metal case and an adhesive resin portion so that the heat generated by the capacitor escapes to the metal case through the adhesive resin portion, and the electrodes between the capacitors are separated by the partition wall to reduce the equivalent series inductance.

Benefits of technology

Improves the heat dissipation of the power conversion device and reduces the equivalent series inductance, improving thermal management and electrical performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a component for a power conversion device. A component for a power conversion device is provided with: a plurality of capacitors; a metal case having a plurality of accommodation parts for individually accommodating the plurality of capacitors; and an adhesive resin part which is filled in the plurality of accommodating parts and which adheres the plurality of capacitors and the metal case to each other. Each of the plurality of capacitors includes: a capacitor element having a first electrode and a second electrode; a first bus bar connected to the first electrode; and a second bus bar connected to the second electrode. Each of the plurality of accommodating parts has an opening, an inner bottom surface facing the opening, and an inner peripheral surface connecting the opening and the inner bottom surface. Each of the plurality of capacitors faces the inner peripheral surface with the adhesive resin portion interposed therebetween.
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Description

Technical Field

[0001] The present disclosure generally relates to a component for a power conversion device, and more particularly, to a component for a power conversion device including a plurality of capacitors. Background Art

[0002] Patent Document 1 discloses a power conversion device. The power conversion device includes: a case body with an upper opening; a capacitor unit housed in a portion of the case body; and a potting material that seals the capacitor unit.

[0003] The shell body comprises: a unit accommodating space which accommodates the capacitor unit so as to surround the capacitor unit from the bottom surface and the side surface and is filled with the casting material; and a connecting space which is connected to the unit accommodating space and has a bottom surface at a position higher than the bottom surface of the unit accommodating space.

[0004] The integrated space formed by the unit accommodating space and the connecting space is entirely surrounded by space side surfaces extending to a position higher than an upper end of the capacitor unit.

[0005] Prior Art Literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2016-054592

[0008] Problems that the invention aims to solve

[0009] However, in the power conversion device of Patent Document 1, there are portions where a plurality of capacitor units are in contact with each other via the potting material, but it is considered that heat generated in such portions is difficult to dissipate to the housing body. Therefore, the power conversion device of Patent Document 1 still has room for improvement in terms of heat dissipation. Summary of the invention

[0010] An object of the present disclosure is to provide a component for a power conversion device that can improve heat dissipation.

[0011] A component for a power conversion device according to one embodiment of the present disclosure comprises: a plurality of capacitors; a metal shell having a plurality of receiving portions for individually receiving the plurality of capacitors; and an adhesive resin portion filled in the plurality of receiving portions to bond the plurality of capacitors to the metal shell. Each of the plurality of capacitors comprises: a capacitor element having a first electrode and a second electrode; a first bus bar connected to the first electrode; and a second bus bar connected to the second electrode. Each of the plurality of receiving portions has an opening, surrounded by an inner bottom surface opposite to the opening, and an inner peripheral surface connecting the opening and the inner bottom surface. Each of the plurality of capacitors faces the inner peripheral surface via the adhesive resin portion.

[0012] Effect of the Invention

[0013] According to the present disclosure, heat dissipation performance can be improved. Description of the Drawings

[0014] Figure 1 It is a perspective view showing a component for a power conversion device according to the first embodiment.

[0015] Figure 2 It is a cross-sectional view perpendicular to the front-back direction of the same component for a power conversion device.

[0016] Figure 3 It is a cross-sectional view perpendicular to the left-right direction of the same component for a power conversion device.

[0017] Figure 4 It is a perspective view showing the state of accommodating a capacitor in a metal case.

[0018] Figure 5 A in it is a front view of the capacitor. Figure 5 B in it is a right side view of the capacitor. Figure 5 C in it is a left side view of the capacitor. Figure 5 D in it is a top view of the capacitor.

[0019] Figure 6 It is an exploded perspective view of the capacitor (sealing resin part omitted).

[0020] Figure 7 A in it is a cross-sectional view perpendicular to the front-back direction of the capacitor. Figure 7 B in it is a cross-sectional view perpendicular to the left-right direction of the capacitor.

[0021] Figure 8 It is a block diagram showing a power conversion device according to the first embodiment.

[0022] Figure 9 It is a cross-sectional view perpendicular to the front-back direction of a component for a power conversion device according to the second embodiment.

[0023] Description of Reference Numerals

[0024] 1 Component for power conversion device

[0025] 2 Capacitor

[0026] 20 Capacitor element

[0027] 201 First electrode

[0028] 202 Second electrode

[0029] 3 Metal case

[0030] 30 Housing section

[0031] 31 Opening

[0032] 32 Inner bottom surface

[0033] 33 Inner peripheral surface

[0034] 34 Partition wall

[0035] 4 Adhesive resin section

[0036] 51 First bus bar

[0037] 52 Second bus bar

[0038] 6 Exterior body

[0039] 61 Sealing resin section

[0040] 62 Exterior housing. Detailed implementation mode

[0041] 1. Outline

[0042] In the power conversion device of Patent Document 1, four capacitor units are housed in one unit housing space, and a casting material is further filled. When viewed from above, the four capacitor units are arranged in two rows and two columns. The casting material separates the four capacitor units. Specifically, the casting material forms a cross shape when viewed from above to separate the four capacitor units. Here, when the four capacitor units generate heat, for example, it is considered that the heat near the center of the casting material forming the above cross shape is difficult to dissipate.

[0043] For this reason, in accordance with the above points, the inventors of the present invention have advanced intensive research, and as a result, a component 1 for a power conversion device as follows has been developed. That is, in the present embodiment, only one capacitor 2 is housed in one housing section 30. That is, a metal housing 3 exists around each capacitor 2 with an adhesive resin section 4 interposed therebetween. In this way, each capacitor 2 can dissipate the heat generated in the capacitor 2 to the metal housing 3 through the adhesive resin section 4 by contacting the metal housing 3 with the adhesive resin section 4 interposed therebetween.

[0044] Therefore, according to the present embodiment, the heat dissipation performance can be improved.

[0045] 2. Details

[0046] (1) First embodiment

[0047] <Component for power conversion device>

[0048] Hereinafter, with reference to Figures 1 to 7Component 1 for a power conversion device according to the first embodiment will be described with reference to B. The drawings are schematic, and the ratios of the sizes and thicknesses of the respective components in the drawings are not necessarily limited to reflecting the actual size ratios.

[0049] The arrows indicating directions in the drawings (arrows indicating the up-down direction, left-right direction, and front-back direction) do not mean to define the direction of use of the power conversion device component 1. They are only marked for easy understanding of the description and do not accompany the entity. Sometimes, the direction in which the metal housing 3 opens is referred to as the "up-down direction", the direction in which the plurality of capacitors 2 are arranged side by side is referred to as the "left-right direction", and the direction orthogonal to the up-down direction and the left-right direction is referred to as the "front-back direction". Observing along the up-down direction is called "top view observation", and observing along the left-right direction is called "side view observation". The same applies to the second embodiment described later.

[0050] The component 1 for a power conversion device according to the first embodiment is a component used in the power conversion device 10 (reference Figure 8 ). In addition, the power conversion device 10 will be described later.

[0051] As Figure 1 ~ As Figure 4 shown, the component 1 for a power conversion device according to the first embodiment includes a plurality of (five in the first embodiment) capacitors 2, a metal housing 3, and an adhesive resin portion 4. Hereinafter, each component will be described in turn.

[0052] ≪Capacitor≫

[0053] As Figure 6 shown, the capacitor 2 includes a capacitor element 20, a first bus bar 51, a second bus bar 52, a bus bar holder 53, and an outer package 6.

[0054] 〔Capacitor Element〕

[0055] The capacitor element 20 is not particularly limited. For example, a wound capacitor element, a stacked capacitor element, etc. can be cited.

[0056] Specifically, as Figure 5 A to Figure 5 D shown, the capacitor element 20 has an element body 21, a first electrode 201, and a second electrode 202.

[0057] The shape of the element body 21 is not particularly limited. For example, a cylindrical shape, an elliptical cylindrical shape, a rectangular parallelepiped shape, etc. can be cited. In the first embodiment, the element body 21 forms a rectangular shape extending in the front-back direction in top view observation (reference Figure 5 D), and forms a rounded rectangle in side view observation (referenceFigure 5 B of Figure 5 C).

[0058] The element body 21 has a first surface 211 (left side surface), a second surface 212 (right side surface), and an outer peripheral surface 213. The first surface 211 is a surface perpendicular to the left - right direction. The second surface 212 is a surface on the opposite side of the first surface 211 and is parallel to the first surface 211. The outer peripheral surface 213 is a surface connecting the outer peripheral edge of the first surface 211 and the outer peripheral edge of the second surface 212.

[0059] The element body 21 includes a dielectric film, a first internal electrode, and a second internal electrode. Inside the element body 21, the first internal electrode and the second internal electrode are opposed to each other with the dielectric film interposed therebetween. The first internal electrode and the second internal electrode are vapor - deposited on the dielectric film. Thus, the capacitor 2 is a thin - film capacitor. In addition, the illustration of the first internal electrode and the second internal electrode is omitted.

[0060] In the first embodiment, the dielectric film also forms the outer peripheral surface 213 of the element body 21. As the material of the dielectric film, there is no particular limitation, and for example, polypropylene (PP), polyethylene terephthalate (PET), etc. can be cited.

[0061] A part of the first internal electrode is exposed on the first surface 211 and is not exposed on the second surface 212. A part of the second internal electrode is exposed on the second surface 212 and is not exposed on the first surface 211. As the material of the first internal electrode and the second internal electrode, there is no particular limitation, and for example, aluminum (Al), magnesium (Mg), their alloys, etc. can be cited.

[0062] The first electrode 201 is formed by thermally spraying a metal on the first surface 211. Thus, the first electrode 201 is electrically connected to the first internal electrode. As the metal for thermal spraying, there is no particular limitation, and for example, zinc (Zn), tin (Sn), their alloys, etc. can be cited.

[0063] The second electrode 202 is also formed in the same manner as the first electrode 201 by thermally spraying a metal on the second surface 212. Thus, the second electrode 202 is electrically connected to the second internal electrode.

[0064] [First bus bar]

[0065] The first bus bar 51 is a conductive member. As the material of the first bus bar 51, there is no particular limitation, and for example, copper (Cu), aluminum (Al), their alloys, etc. can be cited.

[0066] The first bus bar 51 is connected to the first electrode 201. Specifically, the first bus bar 51 is electrically connected and physically connected to the first electrode 201 by, for example, brazing, etc., and extends upward. In addition, the first bus bar 51 is not connected to the second electrode 202.

[0067] [Second Bus Bar]

[0068] The second bus bar 52 is also a conductive member. The material of the second bus bar 52 is the same as that of the first bus bar 51.

[0069] The second bus bar 52 is connected to the second electrode 202. Specifically, the second bus bar 52 is located at a position further back than the first bus bar 51, and is electrically and physically connected to the second electrode 202, for example, by soldering, and extends upward. In addition, the second bus bar 52 is not connected to the first electrode 201.

[0070] [Bus Bar Holder]

[0071] The bus bar holder 53 holds the first bus bar 51 and the second bus bar 52. Specifically, the first bus bar 51 and the second bus bar 52 penetrate the bus bar holder 53 in the vertical direction and are fixed to the bus bar holder 53.

[0072] The bus bar holder 53 is disposed on the upper surface (a part of the outer peripheral surface 213) of the capacitor element 20. There are element-side fitting portions 54 on the left and right sides of the bus bar holder 53 (refer to Figure 5 B to Figure 5 D and Figure 6 ).

[0073] The overall width (in the left-right direction) of the bus bar holder 53 is slightly wider than the overall width (in the left-right direction) of the capacitor element 20. The overall length (in the front-rear direction) of the bus bar holder 53 is slightly longer than the overall length (in the front-rear direction) of the capacitor element 20.

[0074] The bus bar holder 53 has electrical insulation. There is no particular limitation on the material of the bus bar holder 53, and examples thereof include polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), and epoxy resin (EP).

[0075] [Outer Package]

[0076] As shown in Figure 7 A of Figure 7 and

[0077] B of

[0078] The outer package 6 seals the capacitor element 20. Thereby, moisture absorption of the capacitor element 20 can be suppressed.

[0079] The sealing resin portion 61 is a cured product of a sealing resin. That is, the sealing resin is an electrically insulating resin used to form the sealing resin portion 61. The sealing resin is not particularly limited, and for example, epoxy resin (EP) etc. can be cited.

[0080] The exterior housing 62 houses the capacitor element 20 and the sealing resin portion 61. Thereby, moisture absorption of the capacitor element 20 can be further suppressed by the sealing resin portion 61 and the exterior housing 62.

[0081] The exterior housing 62 is open upward. Inside the exterior housing 62, the capacitor element 20 is buried in the sealing resin portion 61. A part (substantially the upper half) of the first bus bar 51 and a part (substantially the upper half) of the second bus bar 52 are not sealed and are exposed to the outside. In this way, a part of the first bus bar 51 and a part of the second bus bar 52 are led out to the outside from the exterior body 6. Therefore, the capacitor 2 can be electrically connected to an external device through the first bus bar 51 and the second bus bar 52.

[0082] As Figure 7 shown in A of, the distance between the inner surfaces facing each other in the left - right direction inside the exterior housing 62 is slightly longer than the overall width (left - right direction) of the capacitor element 20. Thereby, spaces for filling the sealing resin portion 61 can be ensured on both the left and right sides of the capacitor element 20.

[0083] As Figure 7 shown in B of, the distance between the inner surfaces facing each other in the front - rear direction inside the exterior housing 62 is slightly longer than the overall length (front - rear direction) of the capacitor element 20. Thereby, spaces for filling the sealing resin portion 61 can be ensured on both the front and rear sides of the capacitor element 20.

[0084] The depth (up - down direction) of the exterior housing 62 is slightly deeper than the thickness (up - down direction) of the capacitor element 20. Thereby, spaces for filling the sealing resin portion 61 can be ensured on both the upper and lower sides of the capacitor element 20.

[0085] The distance between the inner surfaces facing each other in the left - right direction inside the exterior housing 62 is substantially equal to the overall width (left - right direction) of the bus bar holding tool 53. By the left end of the bus bar holding tool 53 abutting against the left inner surface of the exterior housing 62, or the right end of the bus bar holding tool 53 abutting against the right inner surface of the exterior housing 62, alignment of the capacitor element 20 in the left - right direction is facilitated.

[0086] As Figure 7As shown in FIG. B of , the distance between the inner surfaces of the outer housing 62 facing each other in the front-rear direction is approximately equal to the overall length (in the front-rear direction) of the bus bar holding tool 53. By the front end of the bus bar holding tool 53 abutting against the front inner surface of the outer housing 62, or the rear end of the bus bar holding tool 53 abutting against the rear inner surface of the outer housing 62, it is easy to align the capacitor element 20 in the front-rear direction.

[0087] As Figure 6 shown, housing-side receiving portions 63 are present on the inner surfaces on the left and right sides of the outer housing 62. By fitting the element-side fitting portion 54 of the bus bar holding tool 53 to the housing-side receiving portion 63 of the outer housing 62, the capacitor element 20 can be slightly lifted from the inner bottom surface of the outer housing 62 (refer to FIGS. A and B of ). Figure 7 of and Figure 7 of ). Thus, a space for filling the sealing resin portion 61 can be ensured below the capacitor element 20.

[0088] The material of the outer housing 62 is not particularly limited, and examples thereof include polyphenylene sulfide (PPS), polybutylene terephthalate (PBT), and epoxy resin (EP).

[0089] ≪Metal Housing≫

[0090] The metal housing 3 opens upward. As Figure 4 shown, the metal housing 3 has a plurality of (five in the first embodiment) receiving portions 30 and a preliminary receiving portion 37.

[0091] The metal housing 3 is made by die casting, preferably by aluminum die casting. The metal housing 3 is more thermally conductive than the adhesive resin portion 4 and the outer body 6 (the sealing resin portion 61 and the outer housing 62).

[0092] 〔Receiving Portion〕

[0093] The plurality of receiving portions 30 are located at a position more rearward than the preliminary receiving portion 37. The plurality of receiving portions 30 occupy approximately the rear half of the metal housing 3.

[0094] The plurality of receiving portions 30 are arranged side by side in the left-right direction. The plurality of receiving portions 30 are arranged adjacent to each other with a partition wall 34 therebetween. The partition wall 34 is a part of the metal housing 3.

[0095] The plurality of receiving portions 30 individually receive the plurality of capacitors 2. That is, the plurality of receiving portions 30 and the plurality of capacitors 2 correspond one-to-one. That is, one capacitor 2 is received in one receiving portion 30.

[0096] The housing portion 30 opens upward. The housing portion 30 has an opening 31. The opening 31 is located at the boundary between the housing portion 30 and the outside. The opening 31 forms a rounded rectangular shape extending in the front-rear direction when viewed from above.

[0097] When viewed from above, the overall width (in the left-right direction) of the opening 31 is slightly wider than the overall width (in the left-right direction) of the capacitor 2. Thus, as Figure 2 shown, spaces for filling the adhesive resin portion 4 can be ensured on both the left and right sides of the capacitor 2.

[0098] When viewed from above, the overall length (in the front-rear direction) of the opening 31 is slightly longer than the overall length (in the front-rear direction) of the capacitor 2. Thus, as Figure 3 shown, spaces for filling the adhesive resin portion 4 can be ensured on both the front and rear sides of the capacitor 2.

[0099] The housing portion 30 is a space surrounded by an inner bottom surface 32 and an inner peripheral surface 33. The inner bottom surface 32 faces upward and is opposed to the opening 31. The inner peripheral surface 33 connects the opening 31 and the inner bottom surface 32. The depth of the housing portion 30 (the distance between the opening 31 and the inner bottom surface 32 in the up-down direction) is slightly shallower than the height of the capacitor 2 (in the up-down direction) (refer to Figure 2 and Figure 3 ). For this reason, if the lower surface of the capacitor 2 (the lower surface of the outer package 6 (outer package case 62) in the first embodiment) contacts the inner bottom surface 32, the upper surface of the capacitor 2 exists at a position slightly higher than the housing portion 30.

[0100] As Figure 2 and Figure 3 shown, the capacitor 2 is opposed to the inner peripheral surface 33 with the adhesive resin portion 4 interposed therebetween. In the first embodiment, the capacitor 2 contacts the inner bottom surface 32 directly, but the capacitor 2 may also be opposed to the inner bottom surface 32 with the adhesive resin portion 4 interposed therebetween.

[0101] As Figure 2 shown, the first electrode 201 of one capacitor 2 and the second electrode 202 of another capacitor 2 among a plurality of capacitors 2 are opposed to each other with a partition wall 34 interposed therebetween. If a plurality of capacitors 2 adjacent in the left-right direction are electrically connected (for example, connected in series) and these capacitors 2 are energized, the first electrode 201 and the second electrode 202 become different polarities. In this way, when energized, the first electrode 201 and the second electrode 202 having different polarities are opposed to each other with the partition wall 34 interposed therebetween.

[0102] 〔Reserve housing portion〕

[0103] The reserve housing portion 37 houses components other than the capacitor 2 as needed. There is no particular limitation on the components other than the capacitor 2, and for example, a semiconductor module or the like can be cited.

[0104] The preliminary housing part 37 is located more forward than the plurality of housing parts 30. The preliminary housing part 37 occupies substantially the front half of the metal housing 3.

[0105] ≪Adhesive resin part≫

[0106] The adhesive resin part 4 is filled in the plurality of housing parts 30. That is, the adhesive resin part 4 fills the gap between the inner surface of the housing part 30 and the outer surface of the capacitor 2. In the first embodiment, the adhesive resin part 4 fills the gap between the inner bottom surface 32 and the inner circumferential surface 33 of the housing part 30 and the outer bottom surface and the outer circumferential surface of the outer package body 6 (outer package housing 62) of the capacitor 2. Thus, the adhesive resin part 4 bonds the plurality of capacitors 2 and the metal housing 3.

[0107] The adhesive resin part 4 is a cured product of the adhesive resin 40. That is, the adhesive resin 40 is an electrically insulating resin for forming the adhesive resin part 4. As the adhesive resin 40, the same resin as the sealing resin can be cited.

[0108] The adhesive resin 40 may be a TIM (Thermal Interface Material). TIM is a heat dissipation material, especially a material for reducing contact thermal resistance. As TIM, there is no particular limitation, and for example, thermal paste, heat conduction sheet, PCM (Phase Change Material), gel, high thermal conductivity adhesive, heat conduction tape, etc. can be cited.

[0109] <Housing of capacitor in metal housing>

[0110] Next, with reference to Figure 4 the housing of the capacitor 2 in the metal housing 3 will be described.

[0111] First, the adhesive resin 40 is applied to the inner bottom surface 32 of the housing part 30 of the metal housing 3. In Figure 4 the adhesive resin 40 is indicated by dotted shading.

[0112] Next, the capacitor 2 is housed in the housing part 30. That is, when the capacitor 2 is sunk into the housing part 30, the adhesive resin 40 is pushed away by the bottom surface of the capacitor 2, and the adhesive resin 40 continuously raises the space between the outer circumferential surface of the capacitor 2 and the inner circumferential surface 33 of the housing part 30. Then, when the adhesive resin 40 is cured, as shown in Figure 2 and Figure 3 the adhesive resin part 4 is formed.

[0113] <Power conversion device>

[0114] Next, with reference to Figure 8 the power conversion device 10 (inverter) according to the first embodiment will be described.

[0115] The power conversion device 10 includes a component 1 for a power conversion device, a converter circuit 71, and an inverter circuit 72. In addition, Figures 1 to 3 Although not shown in the figure, in the component 1 for a power conversion device, the first bus bar 51 of one capacitor and the second bus bar 52 of another capacitor among two adjacent capacitors 2 are electrically connected (for example, connected in series) by an appropriate means.

[0116] The converter circuit 71 is a circuit that converts alternating current into direct current and is electrically connected to a plurality of capacitors 2 of the component 1 for a power conversion device.

[0117] The inverter circuit 72 is a circuit that changes the voltage and / or frequency of alternating current when converting direct current into alternating current and is electrically connected to a plurality of capacitors 2 of the component 1 for a power conversion device.

[0118] The power conversion device 10 is used as follows, for example. That is, the converter circuit 71 of the power conversion device 10 is connected to a power source 73, and the inverter circuit 72 of the power conversion device 10 is connected to a motor 74. In addition, the power source 73 and the motor 74 are included in external devices.

[0119] Then, first, the alternating current from the power source 73 is converted into direct current by the converter circuit 71 of the power conversion device 10. While the plurality of capacitors 2 of the component 1 for a power conversion device are repeatedly charged and discharged, the converted direct current is rectified into a stable direct current. Next, this direct current is changed into alternating current at an arbitrary voltage and frequency by the inverter circuit 72 of the power conversion device 10 and output.

[0120] <Function and effect>

[0121] If the component 1 for a power conversion device according to the first embodiment is incorporated into the power conversion device 10 for use, the plurality of capacitors 2 are repeatedly charged and discharged. As a result, each of the plurality of capacitors 2 generates heat.

[0122] Here, in the first embodiment, there is neither a portion where only the adhesive resin portion 4 is interposed between two adjacent capacitors 2, nor a portion where only the adhesive resin portion 4 and the exterior body 6 are interposed between two adjacent capacitors 2. That is, in the first embodiment, as Figure 2 shown, each of the plurality of capacitors 2 faces the inner peripheral surface 33 with the adhesive resin portion 4 interposed therebetween. In this way, by each capacitor 2 contacting the metal case 3 with the adhesive resin portion 4 interposed therebetween, the heat generated in the capacitor 2 can be dissipated to the metal case 3 through the adhesive resin portion 4.

[0123] Therefore, according to the component 1 for a power conversion device according to the first embodiment, the heat dissipation performance can be improved.

[0124] Furthermore, in the first embodiment, as Figure 2 shown, the first electrode 201 of one capacitor and the second electrode 202 of another capacitor among two adjacent capacitors 2 among the plurality of capacitors 2 face each other with a partition wall 34 therebetween. For this reason, since the first electrode 201 and the second electrode 202 have different polarities during energization, ESL (Equivalent Series Inductance) can be reduced.

[0125] (2) Second Embodiment

[0126] Next, with reference to Figure 9 the component 1 for a power conversion device according to the second embodiment will be described. In the second embodiment, the same reference numerals as those in the first embodiment are given to the same components as those in the first embodiment, and detailed descriptions may be omitted.

[0127] In the second embodiment, the housing portion 30 of the metal housing 3 is different from that in the first embodiment. That is, in the first embodiment, the area S31 of the opening 31 and the area S32 of the inner bottom surface 32 are the same, but in the second embodiment, the area S31 of the opening 31 is larger than the area S32 of the inner bottom surface 32. In other words, in the second embodiment, when viewed from above, the periphery of the opening 31 exists more outside than the periphery of the inner bottom surface 32.

[0128] Specifically, in the second embodiment, a step is provided in the middle of the inner peripheral surface 33 of the housing portion 30, and the housing portion 30 is divided into an opening-side space 35 and an inner-bottom-surface-side space 36 by this step. The inner peripheral length of the inner peripheral surface 33 of the opening-side space 35 is longer than the inner peripheral length of the inner peripheral surface 33 of the inner-bottom-surface-side space 36. That is, the volume of the opening-side space 35 is larger than the volume of the inner-bottom-surface-side space 36.

[0129] As described above, in the second embodiment, a step is provided in the middle of the inner peripheral surface 33 of the housing portion 30, but the inner peripheral length of the inner peripheral surface 33 may continuously increase as going from the inner bottom surface 32 to the opening 31.

[0130] <Effect>

[0131] As Figure 4 shown, when a plurality of capacitors 2 are individually housed in a plurality of housing portions 30, a certain amount of adhesive resin 40 is mostly pre-coated on the inner bottom surfaces 32 of the plurality of housing portions 30. However, in the case of manufacturing a plurality of capacitors 2, there may be deviations in the dimensions of the plurality of capacitors 2 within the manufacturing tolerances. For this reason, depending on the dimensional deviation of the capacitor 2, the degree to which the adhesive resin 40 raises the outer peripheral surface of the capacitor 2 and the inner peripheral surface 33 of the housing portion 30 above will be different.

[0132] That is, if the capacitor 2 with the minimum size is accommodated in the accommodation portion 30 within the tolerance, the possibility of the adhesive resin 40 overflowing from the opening 31 of the accommodation portion 30 is low. However, if the capacitor 2 with the maximum size is accommodated in the accommodation portion 30 within the tolerance, the possibility of the adhesive resin 40 overflowing from the opening 31 of the accommodation portion 30 becomes high.

[0133] Therefore, in the second embodiment, as Figure 9 shown, the area S31 of the opening 31 is made larger than the area S32 of the inner bottom surface 32. Thus, compared with the inner bottom surface 32 side, a larger gap can be formed between the outer peripheral surface of the capacitor 2 and the inner peripheral surface 33 of the accommodation portion 30 on the opening 31 side.

[0134] Therefore, when the capacitor 2 is accommodated in the accommodation portion 30, the overflow of the adhesive resin 40 from the accommodation portion 30 can be suppressed.

[0135] On the other hand, since the gap between the outer peripheral surface of the capacitor 2 and the inner peripheral surface 33 of the accommodation portion 30 is smaller on the inner bottom surface 32 side than on the opening 31 side, good thermal conductivity can be ensured.

[0136] 3. Modification

[0137] In the first and second embodiments, the capacitor 2 is a thin-film capacitor, but it may also be a ceramic capacitor, an electrolytic capacitor, or the like.

[0138] In the first and second embodiments, five capacitors 2 are individually accommodated in five accommodation portions 30, but the number of capacitors 2 is not particularly limited as long as it is plural.

[0139] In the first and second embodiments, the number of capacitors 2 is the same as the number of accommodation portions 30, but the number of accommodation portions 30 may also be more than the number of capacitors 2. That is, some of the accommodation portions 30 may be empty.

[0140] In the first and second embodiments, the capacitor 2 includes the exterior body 6, but the capacitor 2 may also not include the exterior body 6. That is, the capacitor 2 may not include either the sealing resin portion 61 or the exterior housing 62.

[0141] In the first and second embodiments, the exterior body 6 includes the sealing resin portion 61 and the exterior housing 62, but the exterior body 6 may also not include the exterior housing 62. That is, the exterior body 6 may be composed only of the sealing resin portion 61.

[0142] In the first and second embodiments, the capacitor 2 includes the bus bar holding tool 53, but the capacitor 2 may also not include the bus bar holding tool 53.

[0143] In the first and second embodiments, the metal housing 3 has a preliminary housing portion 37, but the metal housing 3 may not have the preliminary housing portion 37.

[0144] 4. Mode

[0145] As is clear from the above embodiments and modified examples, the present disclosure includes the following modes. Hereinafter, reference numerals are enclosed in parentheses only for clarifying the correspondence with the embodiments.

[0146] The first mode is a component (1) for a power conversion device, including: a plurality of capacitors (2); a metal housing (3) having a plurality of housing portions (30) for individually housing the plurality of capacitors (2); and an adhesive resin portion (4) filled in the plurality of housing portions (30) to bond the plurality of capacitors (2) and the metal housing (3). Each of the plurality of capacitors (2) includes: a capacitor element (20) having a first electrode (201) and a second electrode (202); a first bus bar (51) connected to the first electrode (201); and a second bus bar (52) connected to the second electrode (202). Each of the plurality of housing portions (30) has an opening (31) and is surrounded by an inner bottom surface (32) opposed to the opening (31) and an inner peripheral surface (33) connecting the opening (31) and the inner bottom surface (32). Each of the plurality of capacitors (2) is opposed to the inner peripheral surface (33) with the adhesive resin portion (4) interposed therebetween.

[0147] According to this mode, by bringing each capacitor (2) into contact with the metal housing (3) with the adhesive resin portion (4) interposed therebetween, heat generated in the capacitor (2) can be dissipated to the metal housing (3) through the adhesive resin portion (4), and thus heat dissipation performance can be improved.

[0148] The second mode is a component (1) for a power conversion device based on the first mode. In the second mode, each of the plurality of capacitors (2) further includes an outer package (6) that seals the capacitor element (20). A part of the first bus bar (51) and a part of the second bus bar (52) are led out of the outer package (6) to the outside.

[0149] According to this mode, moisture absorption of the capacitor element (20) can be suppressed by the outer package (6). The capacitor (2) can be electrically connected to an external device through the first bus bar (51) and the second bus bar (52) led out to the outside.

[0150] The third mode is a component (1) for a power conversion device based on the second mode. In the third mode, the outer package (6) includes a sealing resin portion (61) that directly seals the capacitor element (20).

[0151] According to this method, moisture absorption of the capacitor element (20) can be suppressed by the sealing resin portion (61).

[0152] The fourth method is a component (1) for a power conversion device based on the third method. In the fourth method, the exterior body (6) further includes an exterior housing (62) that houses the capacitor element (20) and the sealing resin portion (61).

[0153] According to this method, moisture absorption of the capacitor element (20) can be further suppressed by the sealing resin portion (61) and the exterior housing (62).

[0154] The fifth method is a component (1) for a power conversion device based on any one of the first to fourth methods. In the fifth method, a partition wall (34) that is part of the metal housing (3) is disposed between two adjacent ones of the plurality of housing portions (30). The first electrode (201) of one capacitor and the second electrode (202) of another capacitor among the plurality of capacitors (2) face each other with the partition wall (34) therebetween.

[0155] According to this method, by having the first electrode (201) and the second electrode (202) face each other with the partition wall (34) therebetween, ESL (Equivalent Series Inductance) can be reduced.

[0156] The sixth method is a component (1) for a power conversion device based on any one of the first to fifth methods. In the sixth method, the area (S31) of the opening (31) is larger than the area (S32) of the inner bottom surface (32).

[0157] According to this method, when the capacitor (2) is housed in the housing portion (30), it is possible to suppress the adhesive resin (40) for forming the adhesive resin portion (4) from overflowing from the housing portion (30).

Claims

1. A component for a power conversion device, comprising: a plurality of capacitors; a metal housing having a plurality of accommodating portions for individually accommodating the plurality of capacitors; and an adhesive resin portion filled in the plurality of accommodating portions to bond the plurality of capacitors and the metal housing, each of the plurality of capacitors includes: a capacitor element having a first electrode and a second electrode; a first bus bar connected to the first electrode; and a second bus bar connected to the second electrode, each of the plurality of accommodating portions has an opening and is surrounded by an inner bottom surface opposed to the opening and an inner peripheral surface connecting the opening and the inner bottom surface, each of the plurality of capacitors faces the inner peripheral surface with the adhesive resin portion therebetween.

2. The component for a power conversion device according to claim 1, wherein each of the plurality of capacitors further includes an outer package for sealing the capacitor element, a part of the first bus bar and a part of the second bus bar are led out of the outer package to the outside.

3. The component for a power conversion device according to claim 2, wherein the outer package includes a sealing resin portion for directly sealing the capacitor element.

4. The component for a power conversion device according to claim 3, wherein the outer package further includes an outer package housing for accommodating the capacitor element and the sealing resin portion.

5. The component for a power conversion device according to claim 1, wherein a partition wall, which is a part of the metal housing, is disposed between two adjacent accommodating portions among the plurality of accommodating portions, the first electrode of one capacitor and the second electrode of another capacitor among the plurality of capacitors face each other with the partition wall therebetween.

6. The component for a power conversion device according to claim 1, wherein the area of the opening is larger than the area of the inner bottom surface.

Citation Information

Patent Citations

  • Electric power conversion system

    JP2016054592A