Semiconductor process chamber and tray assembly

Abstract

The invention discloses a semiconductor process chamber and a tray assembly, and belongs to the technical field of semiconductor processing. The semiconductor process chamber comprises a chamber body and a rotating assembly, the rotating assembly is rotatably connected with the chamber body, the rotating assembly comprises a tray clamping support and a positioning piece, the positioning piece is connected with the tray clamping support, and the positioning piece can rotate to a preset angle and is kept at the preset angle so as to position the tray clamping support. The tray card holder can be connected with or separated from a tray assembly used for bearing a substrate.

Description

[0001] This application is a divisional application of a Chinese patent application filed with the China National Intellectual Property Administration on July 1, 2024, with the application number 202410873892.X and the invention title "Semiconductor Process Chamber and Tray Assembly". Technical Field

[0002] This application belongs to the field of semiconductor processing technology, and particularly relates to a semiconductor process chamber and a tray assembly. Background Art

[0003] In semiconductor processes, epitaxial growth of semiconductor materials (such as Si, Ge, SiGe, GaAs, AlN, GaN, SiC, etc.) on a substrate is often required. Chemical vapor deposition (CVD) is currently the main technical means for the epitaxial process. Generally, the epitaxial surface of the substrate is placed face up on a tray, transferred to a semiconductor process chamber by a robot, and then process gases are introduced into the semiconductor process chamber and react at a certain temperature to achieve the purpose of epitaxially growing a thin film on the surface of the substrate. While a thin film is growing on the surface of the substrate, particulate matter will simultaneously form on the inner wall of the semiconductor process chamber, and these particulate matters are likely to fall onto the surface of the substrate, resulting in drop defect formation on the substrate. Especially for a semiconductor process chamber with horizontal gas inlet, drop defects are more likely to form on the substrate.

[0004] In an existing horizontal gas inlet type semiconductor process chamber, process gases enter the semiconductor process chamber horizontally from the process gas inlet end of the semiconductor process chamber, flow through the substrate in the semiconductor process chamber, and then flow out from the process gas outlet end of the semiconductor process chamber. During the epitaxial growth process, particulate matter will deposit on the inner wall of the semiconductor process chamber. Due to the loose structure of the particulate matter, the particulate matter on the upper wall surface of the semiconductor process chamber is likely to fall onto the surface of the substrate, resulting in drop defects on the thin film on the substrate or triangular defects caused by the dropped matter.

[0005] Therefore, there is a problem that drop defects are likely to form on the substrate during the process of processing the substrate in the existing semiconductor process chamber. Summary of the Invention

[0006] The purpose of the embodiments of this application is to provide a semiconductor process chamber and a tray assembly, which can solve the problem that drop defects are likely to form on the substrate during the epitaxial growth of the substrate in the existing semiconductor process chamber in the related art.

[0007] In a first aspect, the embodiments of this application provide a semiconductor process chamber, including: A chamber body; A rotating component, the rotating component includes a rotating shaft and a tray holder connected to the rotating shaft, the rotating shaft is rotatably connected to the top of the chamber body, and when the rotating component rotates to a preset angle, the tray holder can be connected to or separated from a tray component for carrying a substrate.

[0008] In a second aspect, an embodiment of the present application further provides a tray component applicable to a semiconductor process chamber. The bottom of the tray component is used to fix a substrate, and the tray component is provided with a card slot, and the card slot is adapted to the tray holder of the semiconductor process chamber. The tray component is further provided with a sliding groove, the sliding groove is communicated with the card slot, and the tray holder can extend into the sliding groove and slide along the sliding groove to the card slot.

[0009] In the embodiment of the present application, after the tray component is transferred into the inner cavity of the chamber body, it is rotatably connected to the top of the chamber body through the rotating component, and the tray component is used to fix the substrate so that the process surface of the substrate faces downwards, so that the substrate is suspended at the top of the inner cavity. In this way, since the substrate is suspended at the top of the inner cavity and the process surface of the substrate is arranged facing downwards, the particulate matter formed on the inner wall of the inner cavity cannot fall onto the process surface of the substrate, and it is not easy to form defects such as falling objects on the process surface of the substrate, thereby greatly improving the maintenance cycle of the semiconductor process equipment. Description of the Drawings

[0010] Figure 1 is the front view of the semiconductor process chamber disclosed in the embodiment of the present application; Figure 2 is the sectional view of the semiconductor process chamber disclosed in the embodiment of the present application; Figure 3 is the exploded view of the upper cavity disclosed in the embodiment of the present application; Figure 4 is the top view of the upper horizontal heating part disclosed in the embodiment of the present application; Figure 5 is the distribution schematic diagram of the rotating flow path disclosed in the embodiment of the present application; Figure 6 is the distribution schematic diagram of the positioning flow path disclosed in the embodiment of the present application; Figure 7 is the partial schematic diagram of the upper cavity disclosed in the embodiment of the present application; Figure 8 is the front view of the rotating component disclosed in the embodiment of the present application; Figure 9 is the side view of the rotating component disclosed in the embodiment of the present application; Figure 10 is the bottom view of the rotating component disclosed in the embodiment of the present application; Figure 11It is a connection relationship diagram of a rotating cover and a rotating shaft disclosed in an embodiment of the present application; Figure 12 It is a bottom view of the rotating cover disclosed in an embodiment of the present application; Figure 13 It is a partial schematic diagram of the rotating cover in an inverted state disclosed in an embodiment of the present application; Figure 14 It is a front view of the rotating assembly with the rotating cover and the rotating shaft hidden, disclosed in an embodiment of the present application; Figure 15 It is a top view of the rotating assembly with the rotating cover and the rotating shaft hidden, disclosed in an embodiment of the present application; Figure 16 It is a side view of the positioning member disclosed in an embodiment of the present application; Figure 17 It is a top view of the positioning member disclosed in an embodiment of the present application; Figure 18 It is a top view of the tray disclosed in an embodiment of the present application; Figure 19 It is a side view of the tray disclosed in an embodiment of the present application; Figure 20 It is an axonometric schematic diagram of the tray disclosed in an embodiment of the present application; Figure 21 It is a top view of the substrate support member disclosed in an embodiment of the present application; Figure 22 It is a partial schematic diagram of the substrate support member disclosed in an embodiment of the present application; Figure 23 It is a schematic diagram of the tray assembly being transferred into the inner cavity, disclosed in an embodiment of the present application; Figure 24 It is a schematic diagram when the tray assembly is snap-connected to the tray caddy, disclosed in an embodiment of the present application; Figure 25 It is a schematic diagram of the rotating assembly in an air-floating rotation state, disclosed in an embodiment of the present application; Figure 26 It is a schematic diagram of the state after the tray assembly is connected to the substrate, disclosed in an embodiment of the present application.

[0011] Explanation of reference numerals: 100 - Chamber body; 110 - Upper cavity; 111 - Upper horizontal heating part; 1110 - Cavity; 112 - Upper arc-shaped heating part; 113 - Boss; 114 - Positioning cavity forming member; 1141 - Tray slot; 115 - Positioning flow channel; 1151 - First fluid inflow channel; 1152 - Positioning rotation cavity; 11521 - Positioning rotation slot; 1153 - First fluid outflow channel; 1154 - First flare; 1155 - Second flaring; 116 - Rotating flow path; 1161 - Main flow path; 1162 - Branch flow path; 1613 - Connecting flow path; 117 - Mounting groove; 120 - Lower cavity; 121 - Lower horizontal heating part; 122 - Lower arc heating part; 130 - Side support block; 140 - Inner cavity; 200 - Tray assembly; 210 - Tray; 211 - Chute; 2111 - First through slot; 2112 - Second through slot; 212 - Card slot; 220 - Substrate support; 221 - Support protrusion; 222 - Opening; 300 - Rotating assembly; 310 - Rotating cover; 311 - Top plate; 312 - Annular side plate; 313 - First rotating slot; 314 - Second rotating slot; 320 - Rotating shaft; 321 - Rotating axis; 322 - Sliding column; 323 - Threaded hole; 324 - Connecting screw; 330 - Tray cato; 331 - Cato body; 332 - Connecting part; 340 - Positioning part; 341 - First part; 342 - Second part; 343 - Square hole; 400 - Substrate. Detailed implementation mode

[0012] Next, the technical solutions in the embodiments of the present application will be clearly described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0013] The terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. generally belong to the same category, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / ", generally represents an "or" relationship between the associated objects before and after.

[0014] Next, in conjunction with the accompanying drawings, the semiconductor process chamber provided by the embodiments of the present application will be described in detail through specific embodiments and their application scenarios.

[0015] Refer to Figure 1-26, a semiconductor process chamber provided by an embodiment of the present application may include a chamber body 100 and a rotating assembly 300. The rotating assembly 300 includes a rotating shaft 320 and a tray holder 330. The tray holder 330 can be connected to the rotating shaft 320, and the rotating shaft 320 is rotatably connected to the top of the chamber body 100. When the rotating assembly 300 rotates to a preset angle, the tray holder 330 can be connected to or separated from the tray assembly 200. Here, the tray assembly 200 is used to carry the substrate 400. In this way, the tray assembly 200 can be suspended at the top of the chamber body 100 through the rotating assembly 300, that is, the substrate 400 can be suspended at the top of the inner cavity 140.

[0016] Optionally, the bottom of the tray assembly 200 has an opening 222 arranged downward, and at least part of the process surface of the substrate 400 can be exposed through the opening 222 to facilitate processing of the process surface of the substrate 400. Here, the tray assembly 200 can be transferred into the inner cavity 140 of the chamber body 100 to be able to process the substrate 400 in the inner cavity 140 of the chamber body 100.

[0017] It should be noted that the semiconductor process chamber of the embodiment of the present application can be, for example, a Chemical Vapor Deposition (CVD) process chamber, and can perform an epitaxial process on substrates such as SiC, for example.

[0018] Here, since the substrate 400 is suspended at the top of the inner cavity 140 and the process surface of the substrate 400 is arranged downward, the particles formed on the inner wall of the inner cavity 140 cannot fall onto the process surface of the substrate 400, and it is not easy for the process surface of the substrate 400 to form defects such as falling objects, thereby greatly improving the maintenance cycle of the semiconductor process equipment.

[0019] In an alternative embodiment of the present application, the rotating assembly 300 is arranged on the chamber body 100 in a liftable manner, and the rotating assembly 300 can move between a first position and a second position. Here, the first position can be lower than the second position.

[0020] Among them, when the rotating assembly 300 is in the first position and the rotating assembly 300 rotates to a preset angle, the tray holder 330 can be connected to or separated from the tray assembly 200; when the rotating assembly 300 is in the second position, the tray holder 330 can drive the tray assembly 200 to rotate.

[0021] Here, the rotating assembly 300 is disposed on the chamber body 100 in a liftable manner. Compared with the rotating assembly 300 being disposed on the chamber body 100 in a non-liftable manner, on the one hand, it is convenient to disassemble and assemble the tray assembly 200. On the other hand, when processing the substrate 400, the tray assembly 200 can be located at a high position, which can not only make the process gas act on the substrate 400 more easily, but also reduce the deposition amount of particulate matter on the tray assembly 200.

[0022] In other embodiments, the rotating assembly 300 is disposed on the chamber body 100 in a non-liftable manner.

[0023] In an alternative embodiment of the present application, a positioning flow channel 115 may be provided on the chamber body 100. The positioning flow channel 115 can be used for a first fluid to pass through, so that the first fluid drives the rotating assembly 300 to rotate to a preset angle. The first fluid can be, for example, a gas or a liquid. When the first fluid is a gas, the gas can be an inert gas such as Ar. In this way, the first fluid can play a positioning role on the rotating assembly 300, so that the rotating assembly 300 can be maintained at a preset angle, thereby facilitating the connection or separation of the tray assembly 200 and the tray holder 330.

[0024] In other embodiments, when the positioning flow channel 115 is not provided on the chamber body 100, the connection or separation of the tray assembly 200 and the tray holder 330 can be achieved when the rotating assembly 300 is in a fixed state, or the rotating assembly 300 can be fixed at a preset angle with the help of an external tool and then the connection or separation of the tray assembly 200 and the tray holder 330 can be achieved.

[0025] In an alternative embodiment, the rotating assembly 300 may further include a positioning member 340. The positioning member 340 is connected to the rotating shaft 320. The positioning flow channel 115 may include a connected positioning rotation cavity 1152, a first fluid inlet channel 1151, and a first fluid outlet channel 1153. The first fluid inlet channel 1151 and the first fluid outlet channel 1153 may be respectively located on opposite sides of the positioning rotation cavity 1152. The positioning member 340 is rotatably disposed in the positioning rotation cavity 1152. The first fluid can drive the positioning member 340 to rotate to a preset angle, so that the rotating assembly 300 rotates to a preset angle. Here, the first fluid inlet channel 1151 and the first fluid outlet channel 1153 may be horizontally offset.

[0026] The method of driving the rotating assembly 300 to rotate by the first fluid driving the positioning member 340 located in the positioning rotation cavity 1152 to rotate is more convenient for driving the rotating assembly 300 to rotate and for keeping the rotating assembly 300 at a preset angle compared with the method of the first fluid directly driving the rotating assembly 300 to rotate.

[0027] Of course, the rotating assembly 300 may not include the positioning member 340. The positioning flow channel 115 may only include the first fluid inlet channel 1151 and the first fluid outlet channel 1153, and the rotating assembly 300 is located between the first fluid inlet channel 1151 and the first fluid outlet channel 1153.

[0028] Optionally, in order to ensure that the first fluid can drive the positioning member 340 to rotate and keep the positioning member 340 at a preset angle, the outlet of the first fluid inlet channel 1151 may have a first center point, the inlet of the first fluid outlet channel 1153 may have a second center point, and the connection line between the first center point and the second center point intersects with the rotation axis of the positioning member 340. At this time, the first fluid can contact the positioning member 340 in a large amount, so as to more reliably drive the positioning member 340 to rotate.

[0029] Of course, the connection line between the first center point and the second center point may not intersect with the rotation axis of the positioning member 340.

[0030] Further optionally, a first flared opening 1154 may be provided at the outlet of the first fluid inlet channel 1151, a second flared opening 1155 may be provided at the inlet of the first fluid outlet channel 1153. The first flared opening 1154 and the second flared opening 1155 may be centrosymmetric about the rotation axis of the positioning member 340. And along the direction from the outlet of the first fluid inlet channel 1151 to the rotation axis of the positioning member 340, the flow-through area of the first flared opening 1154 gradually increases. Along the direction from the inlet of the first fluid outlet channel 1153 to the rotation axis of the positioning member 340, the flow-through area of the second flared opening 1155 gradually increases. In this way, the driving area of the first fluid can be increased, and it is easier to drive the positioning member 340 to rotate, so that the positioning member 340 can be quickly driven to the preset angle.

[0031] In other embodiments, the first flared opening 1154 may not be provided at the outlet of the first fluid inlet channel 1151, and the second flared opening 1155 may not be provided at the inlet of the first fluid outlet channel 1153, that is, the flow-through areas at the outlet of the first fluid inlet channel 1151 and the inlet of the first fluid outlet channel 1153 are both constant values.

[0032] In this embodiment, the angles of the first flared opening 1154 and the second flared opening 1155 may both be 90 degrees, and the angles between the connection line of the center points of the first flared opening 1154 and the second flared opening 1155 and the first fluid inlet channel 1151 and the first fluid outlet channel 1153 may both be 45 degrees.

[0033] In an alternative embodiment, the positioning member 340 may include a first portion 341 and a second portion 342. The second portion 342 may be horizontally connected to the first portion 341, and the first portion 341 may be coaxially connected to the rotating shaft 320. Along the direction from the first portion 341 to the second portion 342, the longitudinal sectional area of the second portion 342 gradually decreases. Here, the longitudinal section may be parallel to the axis of the rotating assembly 300. Thus, due to the gradual decrease in the longitudinal sectional area of the second portion 342, its weight is smaller, and the first fluid can more easily drive the second portion 342 to rotate, thereby more easily achieving the rotation of the positioning member 340. Moreover, the second portion 342 can guide the first fluid, enabling the first fluid to flow more smoothly in the positioning flow channel.

[0034] In this embodiment, the positioning member 340 may have a water-drop-shaped structure.

[0035] Of course, along the direction from the first portion 341 to the second portion 342, the longitudinal sectional area of the second portion 342 may also remain unchanged.

[0036] In an alternative embodiment of the present application, the positioning member 340 may be sleeved outside the rotating shaft 320 and be in circumferential limiting cooperation with the rotating shaft 320. In this way, the positioning member 340 does not affect the lifting of the rotating assembly 300, and thus does not affect the disassembly and assembly of the tray assembly 200. Here, when the rotating assembly 300 moves between the first position and the second position, the positioning member 340 can slide up and down relative to the rotating shaft 320.

[0037] In other embodiments, the positioning member 340 and the rotating shaft 320 are of an integral structure and are relatively fixed to each other.

[0038] In an alternative embodiment, the rotating shaft 320 may include a rotating shaft 321 and a sliding column 322. The bottom of the sliding column 322 may be connected to the tray caddy 330, the top of the sliding column 322 may be detachably connected to the rotating shaft 321, and the positioning member 340 is sleeved outside the sliding column 322 and is in circumferential limiting cooperation with the sliding column 322. In this way, the tray caddy 330 and the rotating shaft 320 do not affect the installation of the positioning member 340 and the positioning cavity forming member 114 described below.

[0039] Of course, the rotating shaft 321 and the sliding column 322 may be fixedly connected in a non-detachable manner. Specifically, the rotating shaft 321 and the sliding column 322 may be of an integral structure.

[0040] In this embodiment, a threaded hole 323 is provided at the bottom of the rotating shaft 321, and a connecting screw 324 is provided at the top of the sliding column 322. The connecting screw 324 can extend into the threaded hole 323 and be connected to the threaded hole 323 to achieve the detachable connection between the sliding column 322 and the rotating shaft 321.

[0041] Here, the sliding post 322 can be a square post, and a square hole 343 matching the square post is provided on the positioning member 340. Of course, the sliding post 322 and the positioning member 340 can also achieve circumferential positioning and cooperation through a triangular structure, an elliptical structure, etc.

[0042] In an alternative embodiment, a positioning rotation groove 11521 and a mounting groove 117 can be provided at the top of the chamber body 100. The mounting groove 117 can be located below the positioning rotation groove 11521 and can communicate with the positioning rotation groove 11521; and the semiconductor process chamber can further include a positioning cavity forming member 114. The positioning cavity forming member 114 can be embedded in the mounting groove 117 and detachably connected to the groove wall of the mounting groove 117. A positioning rotation cavity 1152 can be formed between the positioning cavity forming member 114 and the positioning rotation groove 11521. In this way, it is convenient to install the positioning member 340 in the positioning rotation cavity 1152.

[0043] Here, a through hole through which a part of the rotating shaft 320 or the tray holder 330 passes can be provided on the positioning cavity forming member 114 to avoid affecting the installation of the rotating assembly 300.

[0044] In this embodiment, the positioning cavity forming member 114 can be threadedly connected to the groove wall of the mounting groove 117.

[0045] In other embodiments, the semiconductor process chamber may not include the positioning cavity forming member 114. A positioning rotation cavity 1152 can be directly formed at the top of the chamber body 100, and the positioning member 340 and the rotating assembly 300 can be formed by machining a part of the structure of the chamber body 100.

[0046] Optionally, a tray groove 1141 can be provided on a side of the positioning cavity forming member 114 away from the positioning rotation groove 11521. In the case where the rotating assembly 300 is in the second position, the tray groove 1141 can be used to accommodate at least a part of the tray assembly 200. In this way, it is possible to prevent particulate matter, etc. in the inner cavity 140 of the chamber body 100 from depositing on the side of the tray assembly 200, or reduce the deposition amount of particulate matter deposited on the side of the tray assembly 200.

[0047] Of course, the tray groove 1141 may not be provided on a side of the positioning cavity forming member 114 away from the positioning rotation groove 11521.

[0048] In an alternative embodiment of the present application, a rotating flow channel 116 may be further provided on the chamber body 100. The rotating flow channel 116 may be used for the second fluid to pass through. The rotating assembly 300 may further include a rotating cover 310. One end of the rotating shaft 320 is connected to the rotating cover 310, and the other end may be connected to the tray assembly 200. Moreover, the outlet of the rotating flow channel 116 may face the rotating cover 310, so that the second fluid can drive the rotating assembly 300 to move to the second position and drive the rotating assembly 300 to rotate. In this way, compared with the way of not providing the rotating flow channel 116 on the chamber body 100, by providing the rotating flow channel 116 on the chamber body 100, the rotating assembly 300 can be driven to rotate by the second fluid, without the need to rely on a power component to drive the rotating assembly 300 to rotate, which is beneficial to cost reduction and is not affected by temperature. Furthermore, in the embodiment of the present application, the second fluid can make the rotating assembly 300 rotate in suspension without entering the inner cavity 140, effectively avoiding the influence of the second fluid on the process gas flow field and ensuring process uniformity. The second fluid may be, for example, a gas or a liquid. When the second fluid is a gas, the gas may include, for example, at least one of Ar and H2.

[0049] In other embodiments, the rotating flow channel 116 may not be provided on the chamber body 100, and the rotating assembly 300 may be driven to rotate by a driving component such as a motor.

[0050] In this embodiment, the rotating flow channel 116 may be located above the positioning flow channel 115, and the rotating flow channel 116 is not communicated with the positioning flow channel 115 to avoid mutual interference.

[0051] In an alternative embodiment, the rotating cover 310 may be provided with a plurality of rotating grooves. The plurality of rotating grooves may be distributed circumferentially along the rotating shaft 320, and the outlet of the rotating flow channel 116 may be opposite to at least one rotating groove, so that the second fluid can drive the rotating assembly 300 to move to the second position and drive the rotating assembly 300 to rotate. In this way, the second fluid can flow along the rotating groove, which is beneficial to applying a circumferential acting force to the rotating cover 310, thereby facilitating driving the rotating cover 310 to rotate.

[0052] Of course, the rotating cover 310 may not be provided with rotating grooves.

[0053] Optionally, the rotating cover 310 may include a top plate 311 and an annular side plate 312. The annular side plate 312 may be disposed around the edge of the top plate 311. The top end of the rotating shaft 320 may be connected to the top plate 311. Each rotating groove may include a first rotating groove 313 and a second rotating groove 314. The first rotating groove 313 may communicate with the second rotating groove 314. The first rotating groove 313 may be disposed on the top plate 311, and each first rotating groove 313 may be distributed along the circumferential direction of the top plate 311. Each first rotating groove 313 may extend away from the rotating shaft 320. Here, each first rotating groove 313 may be an arc-shaped groove and bend towards the same circumferential direction. The outlet of the rotating flow channel 116 may be opposite to at least one first rotating groove 313. In this way, the second fluid may enter at least one first rotating groove 313, and since the first rotating groove 313 is an arc-shaped groove, the second fluid may apply a circumferential force to the top plate 311, so as to rotate the top plate 311. The second rotating groove 314 may be disposed on the annular side plate 312. Each second rotating groove 314 may extend spirally along the direction from the top to the bottom of the annular side plate 312, and the bending direction of the second rotating groove 314 may be the same as the bending direction of the first rotating groove 313. In this way, after the second fluid enters the second rotating groove 314, it may apply a force in the same direction as the top plate 311 to the annular side plate 312, so as to more reliably drive the rotation of the rotating cover 310.

[0054] In other embodiments, the rotating groove may only include the first rotating groove 313, and the first rotating groove 313 may not be an arc-shaped groove.

[0055] In an alternative embodiment, the rotating flow channel 116 may include a main flow channel 1161 and at least two branch flow channels 1162. Each branch flow channel 1162 may be distributed along the circumferential direction of the rotating shaft 320. The inlet of each branch flow channel 1162 may communicate with the outlet of the main flow channel 1161, and the outlet of each branch flow channel 1162 may be opposite to at least one rotating groove. In this way, through each branch flow channel 1162, the second fluid may drive the rotating assembly 300 from multiple positions, which is more conducive to driving the rotation of the rotating assembly 300 and improving the stability of the rotating assembly 300 during rotation.

[0056] Of course, the rotating flow channel 116 may only include one flow channel, and the outlet of this flow channel is opposite to at least one rotating groove.

[0057] Here, in order to connect the main runner 1161 with each branch runner 1162, the rotating runner 116 may further include at least two connecting runners 1613. The two ends of the connecting runner 1613 may be respectively communicated with the outlet of the main runner 1161 and the inlet of the branch runner 1162, and the connecting runner 1613 may be on the same horizontal plane as the main runner 1161. In this embodiment, at least one branch runner 1162 may be directly communicated with the main runner 1161.

[0058] Optionally, a boss 113 may be provided on the top of the chamber body 100. The rotating shaft 320 may penetrate through the boss 113 and may be rotatably connected to the boss 113. At least part of the boss 113 may be located within the rotating cover 310, and each branch runner 1162 may be provided on the boss 113. In this way, it is convenient to arrange the branch runners 1162 and convenient for the second fluid to enter the rotating cover 310.

[0059] Certainly, the boss 113 may not be provided on the top of the chamber body 100.

[0060] In this embodiment, the rotating runner 116 may include three branch runners 1162. The three branch runners 1162 are evenly distributed along the circumferential direction of the boss 113, and the three branch runners 1162 may be parallel to the rotating shaft 320 and extend upward to penetrate through the top of the boss 113, that is, the outlets of the three branch runners 1162 are located at the top of the boss 113. Here, the boss 113 may be an annular boss.

[0061] In an alternative embodiment of the present application, the process gas inlet and the process gas outlet of the chamber body 100 may be respectively located on both sides of the inner cavity 140, and the process gas inlet and the process gas outlet may be on the same horizontal plane. In this way, the process gas can flow horizontally in the inner cavity 140. Here, since the substrate 400 is suspended at the top of the inner cavity 140 of the chamber body 100, the particulate matter in the inner cavity 140 of the chamber body 100 will not fall onto the process surface of the substrate 400, and no drop defect will be formed on the substrate 400. Moreover, the process gas flows horizontally, which is more likely to contact the process surface of the substrate 400, so it is easier to process the process surface of the substrate 400.

[0062] Certainly, the process gas inlet and the process gas outlet of the chamber body 100 may also be located on the same vertical plane, or the process gas inlet and the process gas outlet may be arranged in a staggered manner.

[0063] In an alternative embodiment, a heating element may be provided on the chamber body 100, or at least part of the chamber body 100 is a heating body. In this way, the process gas entering the inner cavity 140 of the chamber body 100 can be heated to facilitate the processing of the substrate 400. For example, a semiconductor process chamber can implement the epitaxial process of the substrate.

[0064] In this embodiment, the chamber body 100 may include an upper cavity 110, a lower cavity 120, and a side support block 130. The upper cavity 110, the side support block 130, and the lower cavity 120 are connected in sequence, and an inner cavity 140 may be formed between the upper cavity 110, the lower cavity 120, and the side support block 130. Here, the side support block 130 may be of an annular structure, and both the process gas inlet and the process gas outlet may be provided on the side support block 130.

[0065] The upper cavity 110 may include an upper horizontal heating part 111 and an upper arc heating part 112 connected to the upper horizontal heating part 111. A cavity 1110 is formed between the upper horizontal heating part 111 and the upper arc heating part 112. The rotating cover 310 and the boss 113 are located in the cavity 1110. Here, the cavity 1110 may provide a rotating space for the rotating cover 310.

[0066] It should be noted that the second fluid can be discharged through the above-mentioned cavity 1110, and the second fluid will not enter the inner cavity 140 of the chamber body 100. In this way, the influence of the air floating airflow on the process airflow field can be effectively avoided.

[0067] The lower cavity 120 may include a lower horizontal heating part 121 and a lower arc heating part 122 connected to the lower horizontal heating part 121.

[0068] In this embodiment, both the upper cavity 110 and the lower cavity 120 are heating elements, which can improve the heating effect on the process gas, thereby facilitating the improvement of the process efficiency.

[0069] Optionally, both the upper cavity 110 and the lower cavity 120 may be made of graphite material, and a silicon carbide coating (SiC coating) or a tantalum carbide coating (TaC coating) is provided on the lower surface of the upper cavity 110, and a silicon carbide coating (SiC coating) or a tantalum carbide coating (TaC coating) is provided on the upper surface of the lower cavity 120. The side support block 130 may be made of silicon carbide ceramic material.

[0070] The embodiment of the present application also provides a tray assembly 200. The tray assembly 200 may be applicable to a semiconductor process chamber. The bottom of the tray assembly 200 may be used to fix the substrate 400. The tray assembly 200 may be provided with a card slot 212, and the card slot 212 may be adapted to the tray holder 330 of the semiconductor process chamber. When the rotating assembly 300 is in the first position and rotates to a preset angle, the tray holder 330 may be engaged with or separated from the card slot 212. In this way, it is convenient to realize the connection or separation between the rotating assembly 300 and the tray assembly 200, which is convenient for operation.

[0071] In other embodiments, the tray assembly 200 may not be provided with the card slot 212. When the rotating assembly 300 is in the first position and rotated to a preset angle, the rotating assembly 300 may be connected to or separated from the tray assembly 200 by a fixing member.

[0072] The tray assembly 200 may further be provided with a sliding groove 211. The sliding groove 211 may communicate with the card slot 212, and the tray holder 330 may extend into the sliding groove 211 and slide along the sliding groove 211 to the card slot 212. After such a setting, the sliding groove 211 may provide a guiding function for the relative movement between the tray holder 330 and the tray assembly 200, thereby facilitating improving the stability of the connection between the tray holder 330 and the tray assembly 200 and enhancing the connection efficiency.

[0073] In this embodiment, the card slot 212 may be located at the central position of the tray assembly 200.

[0074] Of course, the tray assembly 200 may not be provided with the sliding groove 211, and the tray holder 330 may be directly snap-connected to the card slot 212.

[0075] Optionally, the sliding groove 211 may include a first through groove 2111 and a second through groove 2112. Both the first through groove 2111 and the second through groove 2112 may penetrate through the tray assembly 200 in a direction perpendicular to the thickness direction of the tray assembly 200. In this way, the tray holder 330 may enter or slide out of the sliding groove 211 from either end of the sliding groove 211, which is convenient for operation. And the first through groove 2111 may penetrate through the top of the tray assembly 200 in the thickness direction of the tray assembly 200 and communicate with the second through groove 2112. The width of the first through groove 2111 may be smaller than the width of the second through groove 2112. Both the first through groove 2111 and the second through groove 2112 may communicate with the card slot 212. Here, the width of the first through groove 2111 being smaller than the width of the second through groove 2112 may prevent the tray holder 330 from being separated from the tray assembly 200 by slipping out from the top of the first through groove 2111 after the tray holder 330 extends into the sliding groove 211.

[0076] The above-mentioned tray assembly 200 can be applicable to the semiconductor process chamber described in any of the above embodiments. The tray carrier 330 of the semiconductor process chamber may include a carrier body 331 and a connecting portion 332 connected to the carrier body 331. The first through groove 2111 can allow the connecting portion 332 to extend into and slidably cooperate with the connecting portion 332, that is, the connecting portion 332 can extend into the first through groove 2111 and slide along the first through groove 2111. The second through groove 2112 can slidably cooperate with the carrier body 331 so that the carrier body 331 can be embedded in the card slot 212, that is, the carrier body 331 can extend into the second through groove 2112 and slide along the second through groove 2112, and the carrier body 331 can be embedded in the card slot 212, thereby realizing the connection between the tray carrier 330 and the tray assembly 200. Similarly, the tray carrier 330 can be disengaged from the card slot 212, and the connecting portion 332 can slide along the first through groove 2111 in a direction away from the card slot 212 and slide out, and the carrier body 331 can slide along the second through groove 2112 in a direction away from the card slot 212 and slide out, thereby realizing the separation between the tray carrier 330 and the tray assembly 200.

[0077] In other embodiments, the chute 211 may only include the first through groove 2111.

[0078] Further optionally, the card slot 212 may be located above the second through groove 2112, and the card slot 212 is opened on the side wall of the first through groove 2111. In this way, during the process of the rotating assembly 300 driving the tray assembly 200 to rotate, the separation between the tray carrier 330 and the tray assembly 200 can be avoided, and during the process of the tray assembly rising relative to the chamber body, the tray carrier 330 can cooperate with the card slot 212, and the whole action process is smoother. In addition, the card slot 212 is opened on the side wall of the first through groove 2111, so that the card slot 212 and the first through groove 2111 are at the same height, and the space occupied by the whole tray carrier 330 is smaller. Of course, the card slot 212 may also be at the same height as the second through groove 2112.

[0079] In an alternative embodiment of the present application, the tray assembly 200 may include a tray 210 and a substrate support 220. The tray 210 may be connected to the tray carrier 330, and the top of the substrate support 220 may be connected to the tray 210. Specifically, the substrate support 220 may be threadedly connected to the tray 210. A receiving space for receiving the substrate 400 may be formed between the substrate support 220 and the tray 210. An opening 222 may be provided at the bottom of the substrate support 220. The opening 222 may communicate with the receiving space and allow at least a part of the process surface of the substrate 400 to be exposed, so as to facilitate the processing of the process surface of the substrate 400.

[0080] Here, a support protrusion 221 may be provided at the bottom of the substrate support 220. The support protrusion 221 can be used to support the substrate 400, and the support protrusion 221 can be arranged around the opening 222 and protrude toward the opening 222.

[0081] In this way, it is convenient to disassemble and assemble the substrate 400 so that the tray assembly 200 can be reused.

[0082] In this embodiment, the above-described chute 211 and the card slot 212 may be provided on the tray 210.

[0083] In other embodiments, the tray assembly 200 may only include the tray 210. An adsorption device may be provided on the lower end surface of the tray 210, and the substrate 400 can be adsorbed on the lower end surface of the tray 210 through the adsorption device.

[0084] In this embodiment, the above-described rotating assembly 300 may be made of graphite material, the tray assembly 200 may be made of graphite material, and a silicon carbide coating (SiC coating) or a tantalum carbide coating (TaC coating) is provided on the surface of the substrate support 220.

[0085] A semiconductor process chamber provided in the present application can be used in cooperation with the tray assembly 200. Before use, first install the rotating assembly 300 on the upper cavity 110, and cover the rotating cover 310 of the rotating assembly 300 outside the boss 113 so that the rotating assembly 300 is in the first position, that is, the rotating assembly 300 is in the low position. Introduce a certain amount of the first fluid into the positioning channel 115, for example, introduce 1 - 20 slm (standard liters per minute) of argon gas (Ar gas) into the positioning channel 115, and blow the second part 342 of the positioning member 340 to the center line position of the second flare 1155 of the first fluid outflow channel 1153. At this time, the rotating assembly 300 rotates in this direction following the positioning member 340, and the tray caddy 330 of the rotating assembly 300 rotates a preset angle. Here, the preset angle can be 45 degrees. Continuously introduce the first fluid, and the rotating assembly 300 can be fixed at the preset angle.

[0086] Then, the tray assembly 200 equipped with the substrate 400 is transferred into the inner cavity 140 of the chamber body 100 by a manipulator. When transferring, make the chute 211 of the tray assembly 200 parallel to the extending direction of the rotating channel 116, and make the height of the second through slot 2112 of the chute 211 consistent with the height of the caddy body 331 of the tray caddy 330. As the tray assembly 200 moves, the tray caddy 330 is inserted into the chute 211. When the tray caddy 330 is aligned with the center of the tray assembly 200, stop the transfer. The manipulator moves downward to make the tray caddy 330 snap into the card slot 212 of the tray assembly 200, and then retract the manipulator.

[0087] Stop introducing the first fluid. The positioning member 340 is no longer affected by the fluid and can rotate freely, that is, the rotating assembly 300 can resume the rotating state. At this time, a certain amount of the second fluid is introduced into the rotating flow channel 116. Here, the second fluid can be argon or hydrogen or a mixture of argon and hydrogen. Specifically, 2 - 50 slm of the second fluid can be introduced into the rotating flow channel 116. Under the action of the second fluid, the rotating cover 310 floats upward to the second position and forms an air flow layer with the boss 113. At this time, the positioning member 340 slides to the lower side of the sliding column 322, and the tray assembly 200 enters the tray groove 1141. Since the rotating cover 310 is provided with a rotating groove, under the action of the spiral air flow, the rotating assembly 300 drives the tray assembly 200 to achieve air floating rotation. After the rotation is stable, the epitaxial process can be started.

[0088] After the epitaxial process is completed, stop introducing the second fluid and introduce the first fluid into the positioning flow channel 115. The first fluid drives the positioning member 340 to drive the rotating assembly 300 to rotate to a preset angle, that is, to rotate the rotating assembly 300 to the initial position. At this time, the end of the second part 342 of the positioning member 340 far from the first part 341 is on the center line of the second flare 1155 of the first fluid outflow channel 1153 and forms a 45-degree angle with the first fluid outflow channel 1153 to ensure that the extending direction of the chute 211 of the tray assembly 200 is parallel to the extending direction of the rotating flow channel 116, so that when the manipulator picks up the tray assembly 200, the tray cato 330 can slide in the chute 211.

[0089] Insert the manipulator to lift the tray assembly 200. The tray cato 330 enters the chute 211 from the card slot 212. As the tray assembly 200 moves outwards, the tray cato 330 is withdrawn from the chute 211, realizing the separation of the tray assembly 200 from the rotating assembly 300.

[0090] Finally, the manipulator transfers the tray assembly 200 to the loading chamber.

[0091] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them belong to the protection scope of the present application.

Claims

1. A semiconductor process chamber, characterized in that, Comprising: A chamber body (100); A rotating assembly (300), the rotating assembly (300) is rotatably connected to the chamber body (100), the rotating assembly (300) includes a tray holder (330) and a positioning member (340), the positioning member (340) is connected to the tray holder (330), and the positioning member (340) can be rotated to a preset angle and held at the preset angle to position the tray holder (330), so that the tray holder (330) can be connected to or separated from a tray assembly (200) for carrying a substrate (400).

2. The semiconductor process chamber according to claim 1, wherein A positioning flow channel (115) is provided on the chamber body (100), and the positioning flow channel (115) is used for a first fluid to pass through, so that the first fluid drives the positioning member (340) to rotate to the preset angle.

3. The semiconductor process chamber according to claim 2, wherein, The positioning flow channel (115) includes a connected positioning rotation cavity (1152), a first fluid inlet channel (1151) and a first fluid outlet channel (1153). The first fluid inlet channel (1151) and the first fluid outlet channel (1153) are respectively located on opposite sides of the positioning rotation cavity (1152), and the positioning member (340) is rotatably arranged in the positioning rotation cavity (1152).

4. The semiconductor process chamber according to claim 3, wherein, The outlet of the first fluid inlet channel (1151) has a first center point, the inlet of the first fluid outlet channel (1153) has a second center point, and the line connecting the first center point and the second center point intersects the rotation axis of the positioning member (340).

5. The semiconductor process chamber according to claim 3, wherein A first flared opening (1154) is provided at the outlet of the first fluid inlet channel (1151), a second flared opening (1155) is provided at the inlet of the first fluid outlet channel (1153), the first flared opening (1154) and the second flared opening (1155) are centrosymmetric about the rotation axis of the positioning member (340), and along the direction from the outlet of the first fluid inlet channel (1151) to the rotation axis of the positioning member (340), the flow area of the first flared opening (1154) gradually increases, and along the direction from the inlet of the first fluid outlet channel (1153) to the rotation axis of the positioning member (340), the flow area of the second flared opening (1155) gradually increases.

6. The semiconductor process chamber according to claim 3, wherein A positioning rotation groove (11521) and a mounting groove (117) are provided at the top of the chamber body (100), and the mounting groove (117) is located below the positioning rotation groove (11521) and communicates with the positioning rotation groove (11521); The semiconductor process chamber further includes a positioning cavity forming member (114), the positioning cavity forming member (114) is embedded in the mounting groove (117) and is detachably connected to the groove wall of the mounting groove (117), and the positioning cavity forming member (114) and the positioning rotation groove (11521) form the positioning rotation cavity (1152) therebetween. Wherein, a through hole for a part of the tray holder (330) to pass through is provided on the positioning cavity forming member (114); or, The rotating assembly (300) further includes a rotating shaft (320). A through hole for the rotating shaft (320) to pass through is provided on the positioning cavity forming member (114). Both the tray holder (330) and the positioning member (340) are connected to the rotating shaft (320), and the rotating shaft (320) is rotatably connected to the top of the chamber body (100).

7. The semiconductor process chamber according to claim 6, wherein A tray slot (1141) is provided on a side of the positioning cavity forming member (114) away from the positioning rotation slot (11521). The tray slot (1141) is used to accommodate at least a part of the tray assembly (200).

8. The semiconductor process chamber according to any one of claims 1-7, characterized in that, The rotating assembly (300) further includes a rotating shaft (320). Both the tray holder (330) and the positioning member (340) are connected to the rotating shaft (320), and the rotating shaft (320) is rotatably connected to the top of the chamber body (100).

9. The semiconductor process chamber according to claim 8, wherein, The positioning member (340) includes a first part (341) and a second part (342) horizontally connected to the first part (341). The first part (341) is coaxially connected to the rotating shaft (320). Along the direction from the first part (341) to the second part (342), the longitudinal cross-sectional area of the second part (342) gradually decreases, and the longitudinal cross-section is parallel to the axis of the rotating assembly (300).

10. The semiconductor process chamber according to claim 8, wherein The positioning member (340) is sleeved outside the rotating shaft (320) and is in circumferential limit fit with the rotating shaft (320).

11. The semiconductor process chamber according to claim 10, wherein, The rotating shaft (320) includes a rotating shaft body (321) and a sliding column (322). The bottom of the sliding column (322) is connected to the tray holder (330), the top of the sliding column (322) is detachably connected to the rotating shaft body (321), and the positioning member (340) is sleeved outside the sliding column (322) and is in circumferential limit fit with the sliding column (322).

12. The semiconductor process chamber according to any one of claims 1-7, wherein, When the positioning member (340) rotates to the preset angle and remains at the preset angle: the tray holder (330) can slide relative to the tray assembly (200) until their centers coincide, and the tray assembly (200) falls under its own gravity and is in snap-fit with the tray holder (330); or, the tray assembly (200) rises to release the snap-fit with the tray holder (330) and slides relative to the tray holder (330) to separate the two.

13. The semiconductor process chamber according to any one of claims 1-7, characterized in that, The rotating assembly (300) is liftably arranged on the chamber body (100). The rotating assembly (300) can move between a first position and a second position, and the first position is lower than the second position; When the rotating assembly (300) is at the first position and the rotating assembly (300) rotates to the preset angle, the tray holder (330) can be connected to or separated from the tray assembly (200); When the rotating assembly (300) is at the second position, the tray holder (330) can drive the tray assembly (200) to rotate.

14. The semiconductor process chamber according to claim 13, wherein, A rotating flow channel (116) is further provided on the chamber body (100), and the rotating flow channel (116) is used for allowing a second fluid to pass through; The rotating assembly (300) further includes a rotating cover (310) and a rotating shaft (320). The rotating shaft (320) is rotatably connected to the chamber body (100). The rotating cover (310) is connected to the rotating shaft (320). The rotating cover (310) is provided with a plurality of rotating grooves. The plurality of rotating grooves are circumferentially distributed along the rotating shaft (320), and the outlet of the rotating flow channel (116) faces at least one of the rotating grooves, so that the second fluid can drive the rotating assembly (300) to move to the second position and drive the rotating assembly (300) to rotate.

15. The semiconductor process chamber according to claim 14, wherein, The rotating cover (310) includes a top plate (311) and an annular side plate (312). The annular side plate (312) is disposed around the edge of the top plate (311). The top end of the rotating shaft (320) is connected to the top plate (311); Each of the rotating grooves includes a first rotating groove (313) and a second rotating groove (314) communicating with the first rotating groove (313). The first rotating groove (313) is disposed on the top plate (311). The first rotating grooves (313) are circumferentially distributed along the top plate (311), and each of the first rotating grooves (313) extends away from the rotating shaft (320). Each of the first rotating grooves (313) is an arc-shaped groove and bends in the same circumferential direction. The outlet of the rotating flow channel (116) faces at least one of the first rotating grooves (313). The second rotating groove (314) is disposed on the annular side plate (312). Each of the second rotating grooves (314) spirally extends along the direction from the top to the bottom of the annular side plate (312). The bending direction of the second rotating groove (314) is the same as the bending direction of the first rotating groove (313).

16. The semiconductor process chamber according to claim 14, wherein, The rotating flow channel (116) includes a main flow channel (1161) and at least two branch flow channels (1162). The branch flow channels (1162) are circumferentially distributed along the rotating shaft (320). The inlet of each branch flow channel (1162) is communicated with the outlet of the main flow channel (1161), and the outlet of each branch flow channel (1162) faces at least one of the rotating grooves.

17. The semiconductor process chamber according to claim 16, wherein A boss (113) is provided on the top of the chamber body (100). The rotating shaft (320) penetrates through the boss (113) and is rotatably connected to the boss (113). At least a part of the boss (113) is located inside the rotating cover (310), and each branch flow channel (1162) is disposed on the boss (113).

18. The semiconductor process chamber according to any one of claims 1-7, characterized in that, The process gas inlet and the process gas outlet of the chamber body (100) are respectively located on both sides of the inner cavity (140) of the chamber body (100). The process gas inlet and the process gas outlet are on the same horizontal plane, and a heating element is provided on the chamber body (100), or at least part of the chamber body (100) is a heating body.

19. A tray assembly, applicable to the semiconductor process chamber according to any one of claims 1-18, characterized in that, The bottom of the tray assembly (200) is used to fix the substrate (400). The tray assembly (200) is provided with a card slot (212), and the card slot (212) is adapted to the tray holder (330) of the semiconductor process chamber. The tray assembly (200) is further provided with a sliding groove (211). The sliding groove (211) communicates with the card slot (212). When the positioning member (340) rotates to a preset angle and remains at the preset angle, the tray holder (330) rotates to the preset angle and remains at the preset angle, so that the tray holder (330) can extend into the sliding groove (211) and slide along the sliding groove (211) to the card slot (212).

20. The tray assembly according to claim 19, wherein, The sliding groove (211) includes a first through groove (2111) and a second through groove (2112). Both the first through groove (2111) and the second through groove (2112) penetrate the tray assembly (200) along the direction perpendicular to the thickness direction of the tray assembly (200), and the first through groove (2111) penetrates the top of the tray assembly (200) along the thickness direction of the tray assembly (200) and communicates with the second through groove (2112). The width of the first through groove (2111) is smaller than the width of the second through groove (2112). Both the first through groove (2111) and the second through groove (2112) communicate with the card slot (212).

21. The tray assembly according to claim 20, characterized in that, The tray holder (330) of the semiconductor process chamber includes a connecting portion (332) and a holder body (331) connected to the connecting portion (332). The first through groove (2111) can allow the connecting portion (332) to extend into and slidably cooperate with the connecting portion (332), and the second through groove (2112) can slidably cooperate with the holder body (331), so that the holder body (331) can be embedded in the card slot (212).

22. The tray assembly according to claim 20, characterized in that, The card slot (212) is located above the second through groove (2112), and the card slot (212) is opened on the side wall of the first through groove (2111).

23. The tray assembly according to claim 19, wherein, The tray assembly (200) includes a tray (210) and a substrate support (220). The tray (210) can be connected to the tray holder (330). The top of the substrate support (220) is connected to the tray (210). An accommodation space for accommodating the substrate (400) is formed between the substrate support (220) and the tray (210). An opening (222) is provided at the bottom of the substrate support (220), and the opening (222) communicates with the accommodation space and allows at least a part of the process surface of the substrate (400) to be exposed. A support protrusion (221) is provided at the bottom of the substrate support (220). The support protrusion (221) is used for supporting the substrate (400). The support protrusion (221) is arranged around the opening (222) and protrudes towards the opening (222).

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