Mobile phone radiator

Abstract

The invention discloses a mobile phone radiator, which belongs to the technical field of semiconductor refrigeration and mainly comprises a lithium battery, a semiconductor refrigeration sheet, a small radiating fan, a PCB (printed circuit board) and a 3D (three-dimensional) printing shell. The radiator is small, portable, good and lasting in heat dissipation effect, capable of overcoming the defects that a mainstream air cooling radiator fan in the current market is large in size, has noise and is prone to dust accumulation to affect heat dissipation, and a water cooling radiator is complex to use, not portable and not suitable for traveling and other scenes, attractive, practical and easy to popularize. According to the heat dissipation principle, heat generated at a CPU in a mobile phone is diffused and transmitted to the first-layer heat pipe, and primary heat dissipation is completed through the phase change effect of the phase change liquid in the heat pipe; the heat is transmitted to the cold end of the semiconductor chilling plate through the heat pipe and is absorbed by the cold end of the semiconductor chilling plate, so that secondary heat dissipation is completed; and the other part of heat generated by the CPU and heat generated by the hot end of the semiconductor chilling plate are subjected to heat exchange with surrounding air under the forced convection action of the small heat dissipation fan, so that three-stage heat dissipation is completed.

Description

Technical Field

[0001] This patent relates to a mobile phone radiator, specifically to a mobile phone radiator based on semiconductor refrigeration, belonging to the technical field of semiconductor refrigeration. Background Art

[0002] With the development of technology, people's demands for mobile phones are increasing, and the requirements for mobile phone performance are also getting higher and higher. However, along with the improvement of mobile phone performance, the processing power of the mobile phone CPU is getting stronger and stronger, the battery power consumption of the mobile phone is getting faster and faster, and the heat generation of the mobile phone is also getting larger and larger. When the mobile phone is used excessively, the internal temperature will continue to rise, which is likely to cause damage to components such as the CPU and battery, and even cause explosion accidents in severe cases.

[0003] Currently, most mainstream air-cooled radiators are based on heat pipes. When the device temperature rises instantaneously, multiple heat pipes may malfunction, which may cause multiple heat pipes to take away most of the heat instantaneously and cannot dissipate heat fundamentally. Therefore, it cannot ensure sufficient heat dissipation effect. Air-cooled radiators need to be continuously powered on to provide power for devices such as fans. They have a large shape, the fan has a large volume, is not easy to carry, and will generate noise during use, which reduces the user experience. Air-cooled radiators are prone to dust accumulation during use. These flocculent dusts accumulating inside the fan will affect heat dissipation.

[0004] In water-cooled radiators, the water pump is the core of the entire device. Once a failure occurs, it cannot be used normally. Some water-cooled radiators are not tight enough, so they will seep water during application, which has certain risks. Secondly, after using a water-cooled radiator for a long time, the water inside will evaporate due to heat dissipation. Many users will disassemble and configure the water liquid. Therefore, the dielectric strength of the water-cooled liquid cannot be guaranteed, which will pose a threat to the use of mobile phone heat dissipation. Split water-cooling requires users to assemble components such as the cold head, water pump, water-cooled liquid, and fan water tank by themselves. It is more troublesome to use, and users also need a higher budget and certain skills to complete the installation and use. Water-cooled radiators require a series of related equipment such as water pumps, have a large volume, are complex to use, are not conducive to portability, and are not suitable for scenarios such as travel and daily life use. Summary of the Invention

[0005] A mobile phone radiator includes a lithium battery, a semiconductor refrigeration chip, a micro cooling fan, a PCB circuit board, and a 3D printed housing. The housing has upper and lower layers, which can be set according to the shapes of different mobile phones. The upper layer of the housing is provided with a lithium battery and a PCB circuit board. The rear end of the upper layer of the housing is provided with a micro charging socket and a main switch connected to the PCB circuit board; the lower layer of the housing is provided with a semiconductor refrigeration chip and a micro cooling fan.

[0006] Working principle of the semiconductor refrigeration chip: When an electric current passes through a circuit composed of different conductors, in addition to generating irreversible Joule heat, heat absorption and heat release phenomena will occur at the joints of different conductors respectively with the change of the current direction, namely the Peltier effect.

[0007] The semiconductor refrigeration unit includes a semiconductor chip and a switch, and the switch controls the opening and closing of the semiconductor chip. In principle, the semiconductor refrigeration chip is a heat transfer tool. When an N-type semiconductor material and a P-type semiconductor material are connected into an electric couple, an electron flow that provides the required energy is provided by a DC power supply. After the power is turned on, electrons start from the negative electrode and first pass through the P-type semiconductor, absorbing heat here. When reaching the N-type semiconductor, the heat is released again. Every time an NP module is passed through, heat is transferred from one side to the other side to form a temperature difference, resulting in the formation of a cold and a hot end, and the transfer of energy. That is, the joint where the current flows from the N-type semiconductor to the P-type semiconductor absorbs heat and becomes the cold end; the joint where the current flows from the P-type semiconductor to the N-type semiconductor releases heat and becomes the hot end. The cold end of the semiconductor chip is attached to the mobile phone, and the hot end is in contact with the air. When the mobile phone gets hot, the switch is turned on, and the semiconductor chip will transfer the heat generated by the mobile phone from the cold end to the hot end, and then the heat is dissipated into the air through the convective heat transfer between the hot end and the air, thereby reducing the temperature of the mobile phone.

[0008] The working principle of the present invention: The heat generated at the CPU inside the mobile phone first diffuses to the back of the mobile phone; then it is transferred to the first-layer heat pipe, and the first-stage heat dissipation is completed after passing through the heat pipe; then the heat is transferred to the cold end of the semiconductor refrigeration chip through the heat pipe and is absorbed by the cold end of the semiconductor refrigeration chip, completing the second-stage heat dissipation; there is still a part of the heat generated by the CPU, and the heat generated by the hot end of the semiconductor refrigeration chip are exchanged with the surrounding air through the forced convection of the small cooling fan, completing the third-stage heat dissipation.

[0009] The power supply of the semiconductor refrigeration chip is supplied by a lithium battery placed inside the flip part at the upper part of the mobile phone case. The PCB circuit board consists of an AD module, a DA module, two small lights, a switch and a Mirco charging port. Among them, the switch controls the start and stop of the semiconductor refrigeration chip and the cooling fan.

[0010] The present invention has excellent performance and is convenient to carry. With its characteristics of high efficiency, quietness and small volume, it has become an ideal solution to solve the heat dissipation deficiencies of the current two mainstream mobile phone coolers, namely air cooling and water cooling. Brief Description of the Drawings

[0011] Figure 1 It is a schematic plan view of the overall structure of the present invention.

[0012] Figure 2 It is a schematic side view of the present invention.

[0013] In the figure: 1. Lithium battery; 2. PCB circuit board; 201. Micro charging port; 202. Micro switch; 3. Charging port and main switch on the circuit board; 4. Semiconductor refrigeration chip; 5. Miniature cooling fan; 6. 3D printed housing. Detailed implementation mode

[0014] For the convenience of those skilled in the art, the present patent will be described in detail below in conjunction with the attached drawings and specific examples.

[0015] As Figure 1 shown, the present patent provides a mobile phone radiator based on semiconductor refrigeration, including a lithium battery 1, a PCB circuit board 2, a Micro charging port 201 and a main switch 202 are arranged on the PCB circuit board, a charging port and a main switch 3 on the circuit board, a semiconductor refrigeration chip 4, a miniature cooling fan 5, and a 3D printed housing 6.

[0016] During use, the user first places the mobile phone into the 3D printed housing 6, and then turns on the main switch. The heat generated at the CPU inside the mobile phone first diffuses to the back of the mobile phone; then it is transmitted to the first layer of heat pipe, and after the phase change of the liquid inside the heat pipe, the first-level heat dissipation is completed; then the heat is transmitted through the heat pipe to the cold end of the semiconductor refrigeration chip 4 and is absorbed by the cold end of the semiconductor refrigeration chip 4 to complete the second-level heat dissipation; the remaining part of the heat generated by the CPU and the heat generated by the hot end of the semiconductor refrigeration chip 4 are exchanged with the surrounding air through the forced convection of the miniature cooling fan 5 to complete the third-level heat dissipation, so as to achieve the purpose of cooling and heat dissipation.

[0017] The power supply of the semiconductor refrigeration chip is supplied by the lithium battery 1 filled in the upper flip part of the mobile phone case, and the entire radiator is controlled by the PVCB circuit board 2. The semiconductor and the fan operate simultaneously. While the fan cools the surface of the mobile phone, it can also cool the hot end of the semiconductor. The temperature of the hot end of the semiconductor decreases, resulting in the decrease of the temperature of the cold end, so as to achieve a better cooling effect.

[0018] The PCB circuit board 2 is composed of an AD module, a DA module, two small lights, a switch and a Micro charging port. Among them, the main switch controls the power supply of the lithium battery; switch 1 controls the start and stop of the semiconductor refrigeration chip. When switch 1 is turned on, the semiconductor refrigeration chip starts and the small light 1 lights up red; switch 2 controls the start and stop of the cooling fan. When switch 2 is turned on, the cooling fan starts.

[0019] The present invention has excellent performance and is convenient to carry. It completes three-level heat dissipation through the cold end of the heat pipe, the semiconductor refrigeration chip and the miniature cooling fan, so as to achieve the purpose of cooling and heat dissipation. Its characteristics of high efficiency, quietness and small volume make it an ideal solution to solve the heat dissipation problems of the two mainstream radiators, air cooling and water cooling, for mobile phones at present.

[0020] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of this patent, several improvements and refinements can be made. Any simple improvements and refinements made in accordance with the scope of this patent application and the content of the creation specification shall still fall within the scope of protection of this patent.

Claims

1. A mobile phone cooler, mainly composed of a lithium battery (1), a PCB circuit board (2), a heat pipe (3), a semiconductor refrigeration chip (4), a cooling small fan (5), and a 3D printed housing (6).

2. The mobile phone cooler according to claim 1, characterized in that the semiconductor refrigerators are combined into a refrigeration system by the method of series and parallel connection of the same type of battery stacks.

3. The mobile phone cooler according to claim 1, characterized in that the USB power socket is arranged on the PCB circuit board, and a Micro charging port (201) and a switch (202) are arranged thereon.

4. The mobile phone cooler according to claim 1, characterized in that the mobile phone housing is composed of a 3D printed housing.

5. The mobile phone cooler according to claim 1, characterized in that the lithium battery is placed in the cavity on the flip side of the 3D printed mobile phone housing.

6. The mobile phone cooler according to claim 1, characterized in that the semiconductor refrigeration chip, the PCB circuit board, and the cooling small fan are all placed close to the mobile phone on the 3D printed mobile phone housing.

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