Cooling device and electronic equipment

Abstract

The invention discloses a cooling device and electronic equipment, and relates to the technical field of heat dissipation, the cooling device comprises a radiator with a first flow channel and a second flow channel which are separated from each other, the first flow channel is a part of an internal circulation flow channel, and the internal circulation flow channel is used for allowing a first cooling medium to circularly flow so as to carry out liquid cooling heat dissipation on a heating module of the electronic equipment. The second flow channel is a part of the outer circulation flow channel, and the outer circulation flow channel is used for allowing a second cooling medium to circularly flow so as to bring heat out of the electronic equipment for heat dissipation. And the cold row is used for performing heat exchange on the first cooling medium in the first flow channel and the second cooling medium in the second flow channel. Thus, heat generated by the heating module can be transmitted to the second cooling medium at the cold row through two paths of the first cooling medium and air in the electronic equipment, and is taken out of the electronic equipment through the second cooling medium for heat dissipation, so that the technical problem that the utilization rate of the cooling capacity of the cooling medium supplied into the electronic equipment is relatively low is solved; and high-efficiency and low-energy-consumption heat dissipation can be realized conveniently.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation, and particularly to a cooling device and an electronic device. Background Art

[0002] With the continuous improvement of the performance of electronic devices, more and more heat is generated during the operation of electronic devices. Liquid cooling has advantages such as high heat dissipation efficiency, and the liquid cooling method can be used to dissipate heat from electronic devices with large heat generation.

[0003] However, in the related art, the utilization rate of the cooling capacity of the cooling medium supplied to the electronic device is relatively low, resulting in low heat dissipation efficiency and high energy consumption for the electronic device. Summary of the Invention

[0004] This application provides a cooling device and an electronic device to at least solve the problem of relatively low utilization rate of the cooling capacity of the cooling medium supplied to the electronic device in the related art.

[0005] This application provides a cooling device, which includes a cold plate. The cold plate has a first flow channel and a second flow channel that are separated from each other. The first flow channel is part of a first internal circulation flow channel for circulating a first cooling medium. The second flow channel is part of an external circulation flow channel for circulating a second cooling medium. The cold plate is used to exchange heat between the first cooling medium in the first flow channel and the second cooling medium in the second flow channel.

[0006] This application also provides an electronic device, which includes a chassis and the cooling device in any of the above embodiments. An installation cavity is provided inside the chassis, the cooling device is arranged in the installation cavity, and the first flow channel of the cooling device is part of the first internal circulation flow channel located in the installation cavity. The second flow channel of the cooling device is used to form an external circulation flow channel with a cold source device located outside the chassis.

[0007] Through this application, since the cold radiator has a first flow channel and a second flow channel that are separated from each other, the first flow channel is part of the first internal circulation flow channel located in the installation cavity and used for liquid cooling and heat dissipation of the heat-generating module in the installation cavity, and the second flow channel is part of the external circulation flow channel used to transfer the heat in the installation cavity to the cold source device outside the chassis for heat dissipation. Part of the heat generated by the heat-generating module in the installation cavity can be transferred to the second cooling medium flowing in the external circulation flow channel at the cold radiator through the first cooling medium flowing in the first internal circulation flow channel. Part of the heat generated by the heat-generating module in the installation cavity can be transferred to the second cooling medium flowing in the external circulation flow channel at the cold radiator through the air in the installation cavity. The second cooling medium can take out the heat absorbed from the first cooling medium and the air outside the cold radiator from the chassis for heat dissipation. At this time, the heat generated by the heat-generating module is transferred to the second cooling medium through two paths, namely the first cooling medium and the air in the installation cavity, and the heat dissipation efficiency of the heat generated by the heat-generating module is relatively high. In addition, the heat absorbed by the first cooling medium and the heat absorbed by the air in the installation cavity are both transferred to the second cooling medium at the cold radiator and taken out of the chassis for heat dissipation through the second cooling medium, so that the utilization rate of the cooling capacity of the second cooling medium supplied to the electronic device is relatively high. In this way, it is beneficial to achieve efficient and low-energy consumption heat dissipation of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] To more clearly illustrate the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0009] Figure 1 Schematic connection diagram of an electronic device and a cold source device provided by an embodiment of the present application;

[0010] Figure 2 Explosion diagram of an electronic device provided by an embodiment of the present application;

[0011] Figure 3 Cross-sectional view of a cold radiator provided by an embodiment of the present application;

[0012] Figure 4 Another cross-sectional view of a cold radiator provided by an embodiment of the present application;

[0013] Figure 5 Schematic connection diagram of an external circulation flow channel provided by an embodiment of the present application;

[0014] Figure 6 Schematic connection diagram of a first internal circulation flow channel provided by an embodiment of the present application;

[0015] Figure 7Another connection schematic diagram of the first internal circulation channel provided by the embodiment of the present application;

[0016] Figure 8 An exploded schematic diagram of a chassis provided by the embodiment of the present application;

[0017] Figure 9 Another top view of an electronic device provided by the embodiment of the present application;

[0018] Figure 10 is Figure 9 The sectional view taken along the a-a plane in

[0019] Figure 11 A schematic diagram of an air duct partition plate provided by the embodiment of the present application;

[0020] Figure 12 A schematic diagram of an air guiding structural member provided by the embodiment of the present application.

[0021] Among them, the above-mentioned drawings include the following reference numerals:

[0022] 10, electronic device; 20, cold source device;

[0023] 100, chassis; 110, top plate; 120, bottom plate; 130, front panel; 140, rear panel; 150, left side plate; 160, right side plate; 170, screw; 180, sealing ring;

[0024] 200, cooling device;

[0025] 210, cold row; 211, flow channel structure part; 2111, first interface; 2112, second interface; 2113, third interface; 2114, fourth interface; 212, fin structure;

[0026] 220, cold plate assembly; 221, first cold plate; 222, second cold plate; 223, first bypass pipe; 224, first flow regulating valve; 225, fourth cold plate; 226, fifth cold plate; 227, third flow regulating valve;

[0027] 230, drive pump;

[0028] 300, heating module;

[0029] 400, fan;

[0030] 510, air duct partition plate; 511, first avoidance opening; 512, second avoidance opening; 520, air guiding structural member; 521, third avoidance opening;

[0031] 610, first external joint; 620, second external joint; 630, first connecting pipe; 640, second connecting pipe;

[0032] R1, the first flow channel; R2, the second flow channel;

[0033] S, the installation cavity; S1, the first space; S2, the second space; S3, the third space; S4, the fourth space;

[0034] x, the first direction; y, the second direction; z, the third direction. Detailed implementation manners

[0035] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0036] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. The terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, where the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, where the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of either of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood in specific situations.

[0037] To enable those skilled in the art of the present technology to better understand the solution of this application, the following provides a further detailed description of this application in conjunction with the accompanying drawings and specific embodiments.

[0038] The embodiments of this application provide an electronic device, which includes but is not limited to computing devices, storage devices, switching devices, power supply devices, etc. The computing device can be a server, and the embodiments of this application take the electronic device as a server as an example for illustration.

[0039] Figure 1 It is a schematic connection diagram of an electronic device and a cold source device provided by the embodiments of this application. In the figure, the x - direction is the first direction, the y - direction is the second direction, and the z - direction is the third direction. The first direction is the front - to - back direction, the second direction is the left - to - right direction, and the third direction is the up - and - down direction. Exemplarily, one of the first direction and the second direction is the length direction of the electronic device, the other of the first direction and the second direction is the width direction of the electronic device, and the third direction is the thickness direction of the electronic device. The embodiments of this application take the first direction as the length direction of the electronic device, the second direction as the width direction of the electronic device, and the third direction as the thickness direction of the electronic device as an example for illustration.

[0040] As Figure 1 shown, the electronic device 10 includes a chassis 100. The chassis 100 is provided with a first external connector 610 and a second external connector 620. The first external connector 610 is used to communicate with the outlet of the cold source device 20 located outside the chassis 100, and the second external connector 620 is used to communicate with the inlet of the cold source device 20. The cooling medium provided by the cold source device 20 can flow into the chassis 100 through the first external connector 610. After the cooling medium provided by the cold source device 20 flows into the chassis 100, it can absorb the heat inside the chassis 100, then flow out of the chassis 100 through the second external connector 620, and flow back to the cold source device 20 for heat dissipation.

[0041] Exemplarily, the cold source device 20 is a device independent of the electronic device 10.

[0042] Exemplarily, the cold source device 20 can be a cooling distribution unit (CDU).

[0043] Figure 2 It is an exploded view of an electronic device provided by the embodiments of this application.

[0044] As Figure 2 shown, the electronic device 10 further includes a cooling device 200 and a heat - generating module 300. The chassis 100 has an installation cavity S, and the cooling device 200 and the heat - generating module 300 are arranged in the installation cavity S.

[0045] The heat - generating module 300 is a module that generates heat during operation, and part of the heat generated by the heat - generating module 300 will dissipate into the air within the installation cavity S.

[0046] The cooling device 200 includes a cold plate 210. The cold plate 210 is disposed within the installation cavity S and is connected to the first external connector 610 and the second external connector 620. The cooling medium provided by the cold source device 20 can flow into the cold plate 210. The cold plate 210 can be used to enable heat exchange between the air outside the cold plate 210 and the cooling medium within the cold plate 210, so as to achieve heat dissipation of the air within the installation cavity S. That is to say, the cold plate 210 can be used to dissipate the heat of the air within the installation cavity S, and thus the heat - generating module 300 can be cooled by the air within the installation cavity S.

[0047] Exemplarily, the cold plate 210 is made of a material with good thermal conductivity. For example, the cold plate 210 can be made of metal materials such as copper and aluminum, so as to facilitate efficient heat exchange between the cooling medium within the cold plate 210 and the air outside the cold plate 210.

[0048] Exemplarily, the chassis 100 includes a top plate 110, a bottom plate 120, a front panel 130, a rear panel 140, a left side plate 150, and a right side plate 160. The top plate 110 and the bottom plate 120 are respectively located on the upper and lower sides of the chassis 100. The front panel 130 and the rear panel 140 are respectively located on the front and rear sides of the chassis 100. The left side plate 150 and the right side plate 160 are respectively located on the left and right sides of the chassis 100. The top plate 110, the bottom plate 120, the front panel 130, the rear panel 140, the left side plate 150, and the right side plate 160 enclose to form the installation cavity S. The top plate 110 forms the top wall of the installation cavity S, the bottom plate 120 forms the bottom wall of the installation cavity S, the front panel 130 forms the front wall of the installation cavity S, the rear panel 140 forms the rear wall of the installation cavity S, the left side plate 150 forms the left wall of the installation cavity S, and the right side plate 160 forms the right wall of the installation cavity S.

[0049] Specifically, the front end of the top plate 110 is connected to the upper end of the front panel 130, the rear end of the top plate 110 is connected to the upper end of the rear panel 140, the left end of the top plate 110 is connected to the upper end of the left side plate 150, and the right end of the top plate 110 is connected to the upper end of the right side plate 160. The front end of the bottom plate 120 is connected to the lower end of the front panel 130, the rear end of the bottom plate 120 is connected to the lower end of the rear panel 140, the left end of the bottom plate 120 is connected to the lower end of the left side plate 150, and the right end of the bottom plate 120 is connected to the lower end of the right side plate 160. The left end of the front panel 130 is connected to the front end of the left side plate 150, and the right end of the front panel 130 is connected to the front end of the right side plate 160. The left end of the rear panel 140 is connected to the rear end of the left side plate 150, and the right end of the rear panel 140 is connected to the rear end of the right side plate 160.

[0050] In some examples, the top plate 110, the bottom plate 120, the front plate 130, the rear plate 140, the left side plate 150, and the right side plate 160 can all be flat plates. The top plate 110 and the bottom plate 120 are opposite to each other vertically, the front plate 130 and the rear plate 140 are opposite to each other front and back, and the left side plate 150 and the right side plate 160 are opposite to each other left and right.

[0051] In other examples, at least one of the top plate 110, the bottom plate 120, the front plate 130, the rear plate 140, the left side plate 150, and the right side plate 160 can be a bent plate.

[0052] Exemplarily, the heating module 300 can include a circuit board and heating devices mounted on the circuit board. One or more heating devices can be mounted on the circuit board. Any one of the heating devices can include, but is not limited to, a central processing unit (CPU), a graphics processing unit (GPU), etc.

[0053] Figure 3 This is a cross-sectional view of a cold plate provided by an embodiment of the present application. Among them, Figure 3 The cross-section in is a cross-section perpendicular to the second direction.

[0054] As Figure 3 shown, the cold plate 210 has a first flow channel R1 and a second flow channel R2 that are separated from each other. The first flow channel R1 is part of the first internal circulation flow channel, and the first internal circulation flow channel is used for the first cooling medium to circulate. The first internal circulation flow channel is a circulation flow channel located in the installation cavity S. That is to say, the first flow channel R1 is part of the first internal circulation flow channel located in the installation cavity S. The first internal circulation flow channel is used for liquid cooling and heat dissipation of the heating module 300. That is to say, part of the heat generated by the heating module 300 is absorbed and carried away by the first cooling medium circulating in the first internal circulation flow channel.

[0055] The second flow channel R2 is part of the external circulation flow channel, and the external circulation flow channel is used for the second cooling medium to circulate. Specifically, the second flow channel R2 is used to form an external circulation flow channel with the cold source device 20 located outside the chassis 100. That is to say, the external circulation flow channel is a circulation flow channel that is partially located outside the chassis 100 and where the cold source device 20 is located. The cooling medium provided by the cold source device 20 is the second cooling medium. The external circulation flow channel is used to bring the heat in the installation cavity S to the cold source device 20 outside the chassis 100 for heat dissipation. That is to say, the heat in the installation cavity S can be brought to the cold source device 20 by the second cooling medium circulating in the external circulation flow channel for heat dissipation.

[0056] The cold radiator 210 is used to exchange heat between the first cooling medium in the first flow channel R1 and the second cooling medium in the second flow channel R2, so that the heat absorbed by the first cooling medium can be transferred to the second cooling medium at the cold radiator 210 and taken out of the chassis 100 by the second cooling medium for heat dissipation.

[0057] The cold radiator 210 is also used to exchange heat between the air outside the cold radiator 210 and the second cooling medium in the second flow channel R2, so that the heat absorbed by the air outside the cold radiator 210 can be transferred to the second cooling medium at the cold radiator 210 and taken out of the chassis 100 by the second cooling medium for heat dissipation.

[0058] In this way, part of the heat generated by the heat-generating module 300 in the installation cavity S can be transferred to the second cooling medium flowing in the outer circulation flow channel at the cold radiator 210 through the first cooling medium flowing in the first internal circulation flow channel, and part of the heat generated by the heat-generating module 300 in the installation cavity S can be transferred to the second cooling medium flowing in the outer circulation flow channel at the cold radiator 210 through the air in the installation cavity S. The second cooling medium can take out the heat absorbed from the first cooling medium and the air outside the cold radiator 210 out of the chassis 100 for heat dissipation. At this time, the heat generated by the heat-generating module 300 is transferred to the second cooling medium through two paths, namely the first cooling medium and the air in the installation cavity S, and the heat dissipation efficiency of the heat generated by the heat-generating module 300 is relatively high. The heat absorbed by the first cooling medium and the heat absorbed by the air in the installation cavity S are both transferred to the second cooling medium at the cold radiator 210 and taken out of the chassis 100 by the second cooling medium for heat dissipation, so that the utilization rate of the cold quantity of the second cooling medium supplied to the electronic device 10 is relatively high. In this way, it is beneficial to realize the efficient and low-energy consumption heat dissipation of the electronic device 10.

[0059] Exemplarily, the temperature of the second cooling medium in the second flow channel R2 is lower than the temperature of the first cooling medium in the first flow channel R1.

[0060] Exemplarily, the temperature of the second cooling medium in the second flow channel R2 is lower than the temperature of the air in the installation cavity S.

[0061] Exemplarily, the first cooling medium in the first flow channel R1 and the second cooling medium in the second flow channel R2 exchange heat through the part of the cold radiator 210 that separates the first flow channel R1 and the second flow channel R2.

[0062] In some examples, the first cooling medium can be a single-phase cooling medium, such as cooling water, cooling oil, etc.

[0063] In some examples, the first cooling medium can be a two-phase cooling medium, such as fluorinated liquid, etc.

[0064] In some examples, the second cooling medium may be a single-phase cooling medium, such as cooling water, cooling oil, etc.

[0065] In some examples, the second cooling medium may be a two-phase cooling medium, such as a fluorinated liquid, etc.

[0066] As Figure 2 shown, in some possible implementation manners, the electronic device 10 further includes a fan 400. The fan 400 is disposed in the installation cavity S. The fan 400 is configured to drive the air at the heat generating module 300 to flow toward the cold row 210 of the cooling device 200.

[0067] In this way, it is beneficial to improve the efficiency of the heat generating module 300 transferring heat to the second cooling medium through the air in the installation cavity S, and thus beneficial to improve the heat dissipation efficiency of the heat generating module 300.

[0068] Exemplarily, the electronic device 10 may include a plurality of fans 400 arranged along the extending direction of the cold row 210.

[0069] In some possible implementation manners, the cooling device 200 further includes a cold plate assembly 220. The cold plate assembly 220 is disposed in the installation cavity S. The cold plate assembly 220 is in contact with the heat generating module 300. The cold plate assembly 220 is communicated with the first flow channel R1. The first flow channel R1 and the cold plate assembly 220 are configured to form a first internal circulation flow channel.

[0070] In this way, by making the cold plate assembly 220 in contact with the heat generating module 300, the heat generated by the heat generating module 300 can be transferred to the first cooling medium in the cold plate assembly 220 more efficiently, facilitating liquid cooling heat dissipation of the heat generating module 300 through the first internal circulation flow channel more efficiently.

[0071] Exemplarily, the cold plate assembly 220 may be in contact with the side of the heat generating device facing away from the circuit board.

[0072] As Figure 3 shown, in some possible implementation manners, the cold row 210 includes a flow channel structure part 211 and a fin structure 212. The flow channel structure part 211 has a first flow channel R1 and a second flow channel R2. The fin structure 212 is disposed on the outer surface of the flow channel structure part 211. The flow channel structure part 211 is configured to enable the first cooling medium in the first flow channel R1 to exchange heat with the second cooling medium in the second flow channel R2.

[0073] In this way, by setting the fin structure 212, the heat exchange surface between the cold row 210 and the air outside the cold row 210 can be made larger, which is beneficial to improving the heat exchange efficiency between the air outside the cold row 210 and the second cooling medium in the second flow channel R2, and thus beneficial to improving the heat dissipation efficiency of the heat generating module 300. In addition, both the first flow channel R1 and the second flow channel R2 are provided in the flow channel structure portion 211, and the heat conduction path between the first cooling medium in the first flow channel R1 and the second cooling medium in the second flow channel R2 is short, so that the heat exchange between the first cooling medium in the first flow channel R1 and the second cooling medium in the second flow channel R2 is relatively efficient.

[0074] Exemplarily, the first cooling medium in the first flow channel R1 and the second cooling medium in the second flow channel R2 perform heat exchange through the portion of the flow channel structure portion 211 that separates the first flow channel R1 and the second flow channel R2.

[0075] Exemplarily, both the flow channel structure portion 211 and the fin structure 212 are made of materials with good thermal conductivity. For example, both the flow channel structure portion 211 and the fin structure 212 can be made of metal materials such as copper and aluminum.

[0076] Exemplarily, the fin structure 212 and the flow channel structure portion 211 can be an integral structure.

[0077] Exemplarily, the fin structure 212 and the first flow channel R1 are located on different sides of the second flow channel R2, so that the heat conduction path between the fin structure 212 and the second cooling medium in the second flow channel R2 is short, and the interference of the first cooling medium in the first flow channel R1 on the heat conduction between the fin structure 212 and the second cooling medium in the second flow channel R2 is small, so that the efficiency of transferring the heat in the air in the installation cavity S to the second cooling medium in the second flow channel R2 through the fin structure 212 is high. In addition, the heat conduction between the fin structure 212 and the heat in the second cooling medium is not likely to affect the heat conduction between the first cooling medium and the second cooling medium.

[0078] In some examples, the fin structure 212 and the first flow channel R1 are respectively located on adjacent sides of the second flow channel R2. For example, the fin structure 212 is located below the second flow channel R2, and the first flow channel R1 and the second flow channel R2 are arranged side by side front and back.

[0079] In some examples, the fin structure 212 and the first flow channel R1 can be respectively located on opposite sides of the second flow channel R2.

[0080] Figure 4 This is a cross-sectional view of another cold row provided by the embodiment of the present application. Among them, Figure 4 the cross-section in is a cross-section perpendicular to the first direction.

[0081] Such as Figure 4As shown, in some possible embodiments, the flow channel structure portion 211 extends in the left-right direction, the first flow channel R1 and the second flow channel R2 are arranged side by side vertically, and the fin structure 212 is provided on the side of the second flow channel R2 away from the first flow channel R1.

[0082] In this way, the efficiency of transferring the heat in the air in the installation cavity S to the second cooling medium in the second flow channel R2 through the fin structure 212 is relatively high. While the heat conduction between the fin structure 212 and the heat in the second cooling medium is not likely to affect the heat conduction between the first cooling medium and the second cooling medium, by arranging the first flow channel R1 and the second flow channel R2 side by side vertically, the heat exchange efficiency between the first cooling medium in the first flow channel R1 and the second cooling medium in the second flow channel R2 can be relatively high, which is beneficial to improving the efficiency of dissipating heat from the heat generating module 300 through the first cooling medium. In addition, by arranging the first flow channel R1 and the second flow channel R2 side by side vertically, it is convenient for the first flow channel R1 and the second flow channel R2 to be respectively connected to the first internal circulation flow channel and the external circulation flow channel, making the connection between the cold row 210 and other components relatively convenient.

[0083] Exemplarily, the fin structure 212 includes a plurality of fins arranged side by side in the left-right direction.

[0084] When the electronic device 10 includes a plurality of fans 400, the plurality of fans 400 can be arranged in a row in the left-right direction.

[0085] Exemplarily, the first flow channel R1 is located above the second flow channel R2, and the fin structure 212 is located below the second flow channel R2. At this time, the heat in the first cooling medium in the first flow channel R1 is transferred from top to bottom to the second cooling medium in the second flow channel R2, and the heat in the air in the installation cavity S is transferred from bottom to top to the second cooling medium in the second flow channel R2 through the fin structure 212.

[0086] Exemplarily, the fin structure 212 and the fan 400 are opposite to each other front and back, and the fan 400 is used to blow air or suck air towards the fin structure 212, thereby facilitating driving the flow of the air at the fin structure 212, so as to facilitate the transfer of the heat in the air in the installation cavity S to the second cooling medium in the second flow channel R2 through the fin structure 212.

[0087] The air at the heat generating module 300 flows towards the fin structure 212 under the drive of the fan 400. Along the flow direction of the air in the installation cavity S, the air located between the heat generating module 300 and the fin structure 212 is hot air. After the air dissipates heat to the fin structure 212 at the fin structure 212, the temperature decreases, making the air after passing through the fin structure 212 become cold air.

[0088] Exemplarily, the flow channel structure portion 211 has a first interface 2111 and a second interface 2112 that communicate with the first flow channel R1. The first interface 2111 and the second interface 2112 are respectively located at both ends of the first flow channel R1. The first flow channel R1 communicates with the outlet of the cold plate assembly 220 through the first interface 2111, and the first flow channel R1 communicates with the inlet of the cold plate assembly 220 through the second interface 2112. The first interface 2111 is the inlet of the first flow channel R1, and the second interface 2112 is the outlet of the first flow channel R1.

[0089] Exemplarily, both the first interface 2111 and the second interface 2112 are located on the rear side surface of the flow channel structure portion 211.

[0090] Exemplarily, the flow channel structure portion 211 has a third interface 2113 and a fourth interface 2114 that communicate with the second flow channel R2. The third interface 2113 and the fourth interface 2114 are respectively located at both ends of the second flow channel R2. The second flow channel R2 communicates with the first external connector 610 through the third interface 2113, and the second flow channel R2 communicates with the second external connector 620 through the fourth interface 2114. The third interface 2113 is the inlet of the second flow channel R2, and the fourth interface 2114 is the outlet of the second flow channel R2.

[0091] Exemplarily, both the third interface 2113 and the fourth interface 2114 are located on the rear side surface of the flow channel structure portion 211.

[0092] In some possible implementation manners, both the first flow channel R1 and the second flow channel R2 are straight flow channels.

[0093] In this way, it is relatively easy to form the first flow channel R1 and the second flow channel R2.

[0094] Exemplarily, both the first flow channel R1 and the second flow channel R2 extend in the left - right direction.

[0095] In some possible implementation manners, at least one of the first flow channel R1 and the second flow channel R2 is a bent flow channel.

[0096] In this way, when the first flow channel R1 is a bent flow channel, the heat exchange surface between the first cooling medium in the first flow channel R1 and the channel wall of the first flow channel R1 is larger, and the flow path of the first cooling medium in the first flow channel R1 is longer, which is convenient for the first cooling medium to fully exchange heat with the cold row 210, resulting in a higher utilization rate of the cooling capacity. When the second flow channel R2 is a bent flow channel, the heat exchange surface between the second cooling medium in the second flow channel R2 and the channel wall of the second flow channel R2 is larger, and the flow path of the second cooling medium in the second flow channel R2 is longer, which is convenient for the second cooling medium to fully exchange heat with the cold row 210, resulting in a higher utilization rate of the cooling capacity.

[0097] Exemplarily, at least one of the first flow channel R1 and the second flow channel R2 can be a wavy flow channel or a spiral flow channel.

[0098] In some examples, the flow channel structure portion 211 can also have a third flow channel, which is a part of the second inner circulation flow channel for circulating a third cooling medium. That is to say, the third flow channel is a part of the second inner circulation flow channel located in the installation cavity S, and part of the heat in the installation cavity S can be absorbed and carried away by the third cooling medium circulating in the second inner circulation flow channel.

[0099] The flow channel structure portion 211 is also used to enable the third cooling medium in the third flow channel to exchange heat with the second cooling medium in the second flow channel R2, so that the heat absorbed by the third cooling medium can be transferred to the second cooling medium at the cold radiator 210 and taken out of the chassis 100 by the second cooling medium for heat dissipation.

[0100] The first flow channel R1, the third flow channel and the fin structure 212 are respectively located on different sides of the second flow channel R2.

[0101] In this way, it is convenient to form multiple inner circulation flow channels in the installation cavity S for heat dissipation, so as to further improve the heat dissipation efficiency and the utilization rate of the cooling capacity of the second cooling medium. In addition, the first flow channel R1, the third flow channel and the fin structure 212 are respectively located on different sides of the second flow channel R2, and the heat exchange between the second cooling medium in the second flow channel R2 and the first cooling medium, the third cooling medium and the fin structure 212 is not easily affected by each other, so that the heat exchange efficiency between the first cooling medium, the third cooling medium and the air in the installation cavity S and the second cooling medium is relatively high, and the heat dissipation efficiency through the second cooling medium is relatively high.

[0102] In some examples where the first flow channel R1 and the second flow channel R2 are arranged side by side vertically and the fin structure 212 is arranged on the side of the second flow channel R2 away from the first flow channel R1, the third flow channel and the second flow channel R2 are arranged side by side front and back, which can make the heat exchange efficiency between the third cooling medium in the third flow channel and the second cooling medium in the second flow channel R2 relatively high, and is conducive to improving the heat dissipation efficiency through the third cooling medium. In addition, it is also convenient for the first flow channel R1, the second flow channel R2 and the third flow channel to be connected to the first inner circulation flow channel, the outer circulation flow channel and the second inner circulation flow channel respectively, making the connection between the cold radiator 210 and other components relatively convenient.

[0103] In an example where the flow channel structure portion 211 has a third flow channel, the cooling device 200 may further include a liquid cooling assembly disposed in the installation cavity S. The liquid cooling assembly communicates with the third flow channel. The third flow channel and the liquid cooling assembly are used to form a second internal circulation flow channel. The third cooling medium in the liquid cooling assembly is used to absorb the heat in the installation cavity S through the liquid cooling assembly and transfer the absorbed heat to the cold row 210 to be transferred to the second cooling medium.

[0104] Figure 5 It is a connection schematic diagram of an external circulation flow channel provided by an embodiment of the present application. In the figure, the direction pointed by the solid arrow is the flow direction of the second cooling medium.

[0105] As Figure 5 shown, the inlet of the second flow channel R2 communicates with the first external joint 610 through the first connecting pipe 630, and the outlet of the second flow channel R2 communicates with the second external joint 620 through the second connecting pipe 640. That is to say, one end of the first connecting pipe 630 communicates with the first external joint 610, the other end of the first connecting pipe 630 communicates with the third interface 2113, one end of the second connecting pipe 640 communicates with the second external joint 620, and the other end of the second connecting pipe 640 communicates with the fourth interface 2114. In this way, by providing the first connecting pipe 630 and the second connecting pipe 640, it is convenient to realize the connection between the second flow channel R2 and the first external joint 610 and the second external joint 620, so that the cold row 210 has a high layout flexibility.

[0106] Exemplarily, both the first external joint 610 and the second external joint 620 are quick-sealing joints.

[0107] Exemplarily, the second cooling medium can circulate in the external circulation flow path under the drive of the cold source device 20.

[0108] Figure 6 It is a connection schematic diagram of a first internal circulation flow channel provided by an embodiment of the present application. In the figure, the direction pointed by the dotted joint is the flow direction of the first cooling medium.

[0109] As Figure 6 shown, in some possible implementation manners, the cooling device 200 further includes a driving pump 230 disposed in the installation cavity S. The driving pump 230 is connected in series with the cold plate assembly 220 and the first flow channel R1. The driving pump 230 is used to drive the first cooling medium to circulate in the first internal circulation flow channel.

[0110] In this way, it is convenient to realize the circulation of the first cooling medium in the first internal circulation flow channel, so as to transfer part of the heat generated by the heat generating module 300 to the cold row 210 through the first cooling medium to be transferred to the second cooling medium for heat dissipation.

[0111] In some possible embodiments, the driving pump 230 is connected in series between the outlet of the first flow channel R1 and the inlet of the cold plate assembly 220.

[0112] In this way, the temperature of the first cooling medium at the driving pump 230 is relatively low, making it less likely for the first cooling medium to leak at the driving pump 230. In addition, the driving efficiency of the driving pump 230 for the first cooling medium is also relatively high.

[0113] In some examples where the first cooling medium is a two-phase cooling medium, the cooling device 200 may also not include the driving pump 230, and the first cooling medium can circulate in the first internal circulation flow channel by means of the pressure difference generated by its own phase change.

[0114] As Figure 6 shown, in some possible embodiments, the cold plate assembly 220 includes a first cold plate 221, a second cold plate 222, a first bypass pipe 223, and a first flow rate regulating valve 224. The first cold plate 221 and the second cold plate 222 are connected in series, and the first cold plate 221 is located between the inlet of the second cold plate 222 and the outlet of the first flow channel R1. The first bypass pipe 223 is connected in parallel with the first cold plate 221, and the first flow rate regulating valve 224 is arranged on the first bypass pipe 223. The first flow rate regulating valve 224 is used to regulate the flow rate of the first cooling medium flowing through the first bypass pipe 223.

[0115] In this way, when the cold plate assembly 220 includes the first cold plate 221 and the second cold plate 222 connected in series, the distribution of cooling capacity between the first cold plate 221 and the second cold plate 222 can be achieved through the first bypass pipe 223 and the first flow rate regulating valve 224, facilitating the equalization of the temperatures of the first cold plate 221 and the second cold plate 222.

[0116] Exemplarily, through the first bypass pipe 223, a part of the first cooling medium flowing out of the outlet of the first flow channel R1 can directly flow into the second cold plate 222 through the first bypass pipe 223 without passing through the first cold plate 221. The first flow rate regulating valve 224 can achieve the distribution of the first cooling medium flowing through the first bypass pipe 223 and the first cold plate 221.

[0117] Exemplarily, the first cold plate 221 and the second cold plate 222 can be in contact with different heat generating devices respectively.

[0118] In some possible embodiments, the cold plate assembly 220 further includes a third cold plate, a second bypass pipe, and a second flow rate regulating valve. The third cold plate is connected in series between the first cold plate 221 and the second cold plate 222. The outlet of the first cold plate 221 is communicated with the inlet of the second cold plate 222 through the third cold plate and the second bypass pipe. The second bypass pipe is connected in parallel with the third cold plate, and the second flow rate regulating valve is used to regulate the flow rate of the first cooling medium flowing through the second bypass pipe.

[0119] In this way, when the cold plate assembly 220 includes the first cold plate 221, the second cold plate 222, and the third cold plate connected in series, it is convenient to realize the distribution of the cooling capacity among the first cold plate 221, the second cold plate 222, and the third cold plate, so as to balance the temperatures of the first cold plate 221, the second cold plate 222, and the third cold plate.

[0120] When the cold plate assembly 220 includes more cold plates connected in series, the arrangement can be set with reference to the scheme of connecting the first cold plate 221, the second cold plate 222, and the third cold plate in series above.

[0121] Figure 7 It is a schematic diagram of the connection of another first inner circulation flow channel provided by the embodiment of the present application.

[0122] As Figure 7 shown, in some possible implementation manners, the cold plate assembly 220 includes a fourth cold plate 225, a fifth cold plate 226, and a third flow regulating valve 227. The fourth cold plate 225 is connected in series with the third flow regulating valve 227. The whole after the fourth cold plate 225 is connected in series with the third flow regulating valve 227 is connected in parallel with the fifth cold plate 226. The third flow regulating valve 227 is used to regulate the flow rate of the first cooling medium flowing through the fourth cold plate 225.

[0123] In this way, when the cold plate assembly 220 includes the fourth cold plate 225 and the fifth cold plate 226 connected in parallel, the third flow regulating valve 227 can be used to realize the distribution of the cooling capacity between the fourth cold plate 225 and the fifth cold plate 226, so as to balance the temperatures of the fourth cold plate 225 and the fifth cold plate 226.

[0124] In some possible implementation manners, the cold plate assembly 220 further includes a sixth cold plate and a fourth flow regulating valve, and the sixth cold plate is connected in series with the fourth flow regulating valve. The whole after the fourth cold plate 225 is connected in series with the third flow regulating valve 227 and the whole after the sixth cold plate is connected in series with the fourth flow regulating valve are connected in parallel with the fifth cold plate 226. The fourth flow regulating valve is used to regulate the flow rate of the first cooling medium flowing through the sixth cold plate.

[0125] In this way, when the cold plate assembly 220 includes the fourth cold plate 225, the fifth cold plate 226, and the sixth cold plate connected in parallel, it is convenient to realize the distribution of the cooling capacity among the fourth cold plate 225, the fifth cold plate 226, and the sixth cold plate, so as to balance the temperatures of the fourth cold plate 225, the fifth cold plate 226, and the sixth cold plate.

[0126] When the cold plate assembly 220 includes more cold plates connected in parallel, the arrangement can be set with reference to the scheme of connecting the fourth cold plate 225, the fifth cold plate 226, and the sixth cold plate in parallel above.

[0127] In some possible embodiments, a liquid leakage detection device is provided on the cold row 210 and the cold plate assembly 220, and the liquid leakage detection device is used to detect whether there is liquid leakage at the cold plate assembly 220 and the cold row 210.

[0128] In this way, it is convenient to timely detect the liquid leakage situation of the cold row 210 and the cold plate assembly 220, so as to timely deal with the liquid leakage.

[0129] Exemplarily, a liquid leakage detection device is provided at the cold row 210, the cold plate assembly 220, and the connection between the cold row 210 and the cold plate assembly 220.

[0130] Exemplarily, the liquid leakage detection device may include a liquid leakage induction wire, and the liquid leakage induction wire is wound around the cold row 210 and the cold plate assembly 220.

[0131] Exemplarily, the electronic device 10 further includes a detection circuit, a controller, and a complex programmable logic device (CPLD). The liquid leakage induction wire is electrically connected to the detection circuit, the detection circuit is electrically connected to the complex programmable logic device, and the complex programmable logic device is electrically connected to the controller. The complex programmable logic device can be used to implement functions such as signal debouncing and noise filtering. The controller can adopt a polling mechanism to receive the signals transmitted by the complex programmable logic device.

[0132] When there is liquid leakage in the cold row 210 or the cold plate assembly 220, the liquid leakage will short-circuit the liquid leakage induction wire. After the detection circuit detects the short-circuit of the liquid leakage induction wire, an alarm signal is formed. After the complex programmable logic device identifies the alarm signal, the alarm signal is transmitted to the controller, and the controller is used to form a corresponding control instruction according to the alarm signal.

[0133] Exemplarily, the control instruction can be used to control the display interface to display alarm information to timely report to the operation and maintenance personnel.

[0134] Exemplarily, the control instruction can be used to control the electronic device 10 to power off to protect the electronic device 10. For example, the control instruction can be used to control the power supply of the electronic device 10 to power off.

[0135] Exemplarily, the controller can be a baseboard management controller (BMC).

[0136] In some possible embodiments, the installation cavity S is a non-closed chamber. The chassis 100 has an air inlet and an air outlet communicating with the installation cavity S. The fan 400 is configured to drive air to flow into the installation cavity S from the air inlet, sequentially flow through the heat generating module 300 and the radiator 210, and then flow out from the air outlet. Exemplarily, the heat generating module 300 is disposed between the air inlet and the radiator 210, the radiator 210 is disposed between the heat generating module 300 and the air outlet, and the fan 400 can be disposed at the air inlet or the air outlet.

[0137] In some other possible embodiments, the installation cavity S is a closed chamber, and the fan 400 is configured to drive the air in the installation cavity S to circulate.

[0138] In this way, the influence of the environment outside the chassis 100 on the heat dissipation in the installation cavity S can be reduced, and it is not easy for the heat outside the chassis 100 to flow back into the installation cavity S and affect the heat dissipation in the installation cavity S. The stability and reliability of the heat dissipation of the electronic device 10 are relatively good. In addition, through the circulating flow of the air in the installation cavity S, it is convenient to make the hot air at the heat generating module 300 flow to the radiator 210 for heat dissipation, and the heat dissipation efficiency of the air in the installation cavity S is relatively high. The arrangement positions of the fan 400, the heat generating module 300 and the radiator 210 are relatively flexible.

[0139] Figure 8 An exploded view of a chassis provided by an embodiment of the present application.

[0140] As Figure 8 shown, exemplarily, the chassis 100 includes a bottom case, and the bottom case includes a bottom plate 120, a front panel 130, a rear panel 140, a left side panel 150 and a right side panel 160. The bottom plate 120, the front panel 130, the rear panel 140, the left side panel 150 and the right side panel 160 are of an integral structure. The top plate 110 is connected to the upper ends of the front panel 130, the rear panel 140, the left side panel 150 and the right side panel 160. A sealing ring 180 is provided between the top plate 110 and the front panel 130, the rear panel 140, the left side panel 150 and the right side panel 160. The top plate 110 is detachably connected to the front panel 130, the rear panel 140, the left side panel 150 and the right side panel 160 by screws 170. The sealing ring 180 is used to seal the connection between the top plate 110 and the front panel 130, the rear panel 140, the left side panel 150 and the right side panel 160, so as to form a closed installation cavity S.

[0141] Exemplarily, the components in the installation cavity S can be maintained by removing the top plate 110.

[0142] Figure 9 A top view of another electronic device provided by an embodiment of the present application, Figure 10 is Figure 9 a cross-sectional view taken along the line a-a in

[0143] like Figure 9 , Figure 10 As shown, in some possible embodiments, a duct partition plate 510 is provided in the installation cavity S, and the top wall of the installation cavity S and the bottom wall of the installation cavity S are respectively located on both sides of the thickness direction of the duct partition plate 510. Exemplarily, the third direction is the thickness direction of the duct partition plate 510.

[0144] The installation cavity S includes a first space S1 located above the air duct partition plate 510, a second space S2 located below the air duct partition plate 510, a third space S3 located in front of the air duct partition plate 510, and a fourth space S4 located behind the air duct partition plate 510. That is, the first space S1 is formed between the upper side of the air duct partition plate 510 and the top wall of the installation cavity S, the second space S2 is formed between the lower side of the air duct partition plate 510 and the bottom wall of the installation cavity S, the third space S3 is formed between the front end of the air duct partition plate 510 and the front wall of the installation cavity S, and the fourth space S4 is formed between the rear end of the air duct partition plate 510 and the rear wall of the installation cavity S.

[0145] The first space S1, the third space S3, the second space S2 and the fourth space S4 are connected end to end in sequence to form a circulating air duct. That is, the front end of the first space S1 is connected to the upper part of the third space S3, the front end of the second space S2 is connected to the lower part of the third space S3, the rear end of the first space S1 is connected to the upper part of the fourth space S4, and the rear end of the second space S2 is connected to the lower part of the fourth space S4.

[0146] The heating module 300 , the cold plate assembly 220 , the cold row 210 and the fan 400 are all arranged in the circulating air duct, and the fan 400 is used to drive the air in the circulating air duct to circulate.

[0147] In this way, it is easy to realize the circulation flow of air in the installation cavity S. The air flow in the installation cavity S is more orderly, which is convenient for more efficient heat exchange with the cold row 210, so that the efficiency of heat dissipation of the air in the installation cavity S is higher.

[0148] In some possible implementations, the cold plate assembly 220 and the heating module 300 are disposed in the first space S1 , so that maintenance of the cold plate assembly 220 and the heating module 300 is more convenient.

[0149] Exemplarily, the driving pump 230 is disposed in the first space S1 .

[0150] In some examples where the cold plate assembly 220 includes the first flow regulating valve 224 , a manual knob is provided on the top plate 110 , the manual knob is in transmission connection with the first flow regulating valve 224 , and the manual knob is used to control the first flow regulating valve 224 .

[0151] In some possible embodiments, the fan 400 and the radiator 210 are disposed in the third space S3, and the radiator 210 is disposed between the fan 400 and the heat generating module 300.

[0152] In this way, by disposing the radiator 210 in the third space S3 with a relatively high height, it is convenient to set the radiator 210, and a part of the radiator 210 can be located above the air duct partition plate 510 and a part can be located below the air duct partition plate 510, so as to facilitate the connection between the radiator 210 and the cold plate assembly 220, and the sufficient heat exchange between the radiator 210 and the air flowing in the circulating air duct. In addition, by disposing the radiator 210 between the fan 400 and the heat generating module 300, it is beneficial to drive more air to flow through the radiator 210, which is beneficial to the sufficient heat exchange between the radiator 210 and the air flowing in the circulating air duct.

[0153] After the air in the first space S1 absorbs the heat generated by the heat generating module 300, its temperature rises. The fan 400 can drive the hot air in the first space S1 to flow forward. After the air in the first space S1 flows forward into the third space S3, it turns downward, then flows backward and passes through the radiator 210. After the hot air dissipates heat at the radiator 210, its temperature drops. That is to say, after the radiator 210 absorbs the heat in the hot air, the hot air becomes cold air, and then flows backward into the second space S2. After the air in the second space S2 flows backward into the fourth space S4, it turns upward, then flows forward and flows into the first space S1. The cold air flowing into the first space S1 can be used to absorb the heat of the heat generating module 300 to dissipate heat from the heat generating module 300.

[0154] Exemplarily, the radiator 210 is located behind the fan 400, and the air duct partition plate 510, the heat generating module 300 and the cold plate assembly 220 are all located behind the radiator 210.

[0155] Exemplarily, the fan 400 is an axial flow fan, and there is a spaced space for air flow between the front end of the fan 400 and the front wall of the installation cavity S. That is to say, the fan 400 and the front panel 130 are spaced apart front and back. The fan 400 can drive the air from the first space S1 to flow to the front of the fan 400 and turn downward in front of the fan 400.

[0156] In some examples, the first flow channel R1 and the cold plate assembly 220 are located on the same side in the thickness direction of the air duct partition plate 510, so as to facilitate the connection between the first flow channel R1 and the cold plate assembly 220.

[0157] In some examples where the cold plate assembly 220 and the heat generating module 300 are disposed in the first space S1, the first flow channel R1 is located above the air duct partition plate 510, so that while facilitating the maintenance of the cold plate assembly 220 and the heat generating module 300, it is also convenient for the connection between the first flow channel R1 and the cold plate assembly 220.

[0158] Exemplarily, both the first interface 2111 and the second interface 2112 are located above the air duct partition plate 510.

[0159] In some examples, the fan 400 and the fin structure 212 are located on the same side in the thickness direction of the air duct partition plate 510.

[0160] In some examples where the cold plate assembly 220 and the heat generating module 300 are disposed in the first space S1, the fin structure 212 is located below the air duct partition plate 510. Thus, it is convenient to arrange the fin structure 212 with a larger size, which is beneficial to improving the heat dissipation efficiency of the air in the installation cavity S. When the fin structure 212 is located below the air duct partition plate 510, the fan 400 is also located below the air duct partition plate 510, so that the air pressure at the fin structure 212 is relatively large, which is convenient for driving the air to circulate in the circulation air duct.

[0161] In some possible implementation manners, the first external connector 610 and the second external connector 620 are disposed on the rear wall of the installation cavity S, that is to say, the first external connector 610 and the second external connector 620 are disposed on the rear panel 140. At least part of the second flow channel R2 is located above the air duct partition plate 510, so as to enable the fin structure 212 to have a larger size, so that the heat exchange efficiency between the air in the installation cavity S and the fin structure 212 is relatively high. Part of the first connecting pipe 630 and part of the second connecting pipe 640 are located below the air duct partition plate 510. The first connecting pipe 630 and the second connecting pipe 640 pass through the second space S2, so that the routing of the first connecting pipe 630 and the second connecting pipe 640 has less influence on the arrangement of the cold plate assembly 220 and the heat generating module 300. In addition, when the first connecting pipe 630 and the second connecting pipe 640 leak, it is not easy to cause a short circuit of the heat generating module 300.

[0162] Exemplarily, at least part of the third interface 2113 and at least part of the fourth interface 2114 are located above the air duct partition plate 510.

[0163] Figure 11 It is a schematic diagram of an air duct partition plate provided by an embodiment of the present application.

[0164] As Figure 11 shown, the front end of the air duct partition plate 510 has a first avoidance opening 511 and a second avoidance opening 512. Both the first avoidance opening 511 and the second avoidance opening 512 penetrate through both sides in the thickness direction of the air duct partition plate 510. The first connecting pipe 630 passes through the first avoidance opening 511, and the second connecting pipe 640 passes through the second avoidance opening 512.

[0165] In this way, it is convenient for the first connecting pipe 630 and the second connecting pipe 640 to route through the second space S2, so as to reduce the influence of the first connecting pipe 630 and the second connecting pipe 640 on the layout of the cold plate assembly 220 and the heating module 300, and reduce the risk of short - circuit of the heating module 300 caused by leakage of the first connecting pipe 630 and the second connecting pipe 640. In addition, the gap between the front end of the air duct partition plate 510 and the cold row 210 can be made smaller, so that the amount of air flowing from the first space S1 into the second space S2 through the gap between the front end of the air duct partition plate 510 and the cold row 210 is smaller, which is conducive to making a large amount of air turn downward in front of the cold row 210 and flow below the air duct partition plate 510, and the amount of air flowing through the cold row 210 is larger, which is conducive to the efficient heat dissipation of the air in the installation cavity S.

[0166] Exemplarily, the first avoidance opening 511 penetrates through the left end of the air duct partition plate 510, and the second avoidance opening 512 penetrates through the right end of the air duct partition plate 510.

[0167] Exemplarily, the left end of the air duct partition plate 510 is fixedly connected to the left side plate 150, and the right end of the air duct partition plate 510 is fixedly connected to the right side plate 160, which makes it relatively easy to fix the air duct partition plate 510 to the chassis 100. In addition, there is no need to set up connecting structures such as brackets above or below the air duct partition plate 510 to fix the air duct partition plate 510 to the chassis 100, and it is not easy to affect the air circulation flow in the circulation air duct due to the setting of brackets in the circulation air duct.

[0168] Exemplarily, the left end of the air duct partition plate 510 is formed with a left flanging structure, and the right end of the air duct partition plate 510 is formed with a right flanging structure. The left end of the air duct partition plate 510 is fixedly connected to the left side plate 150 through the left flanging structure, and the right end of the air duct partition plate 510 is fixedly connected to the right side plate 160 through the right flanging structure, so as to facilitate the fixed connection between the air duct partition plate 510 and the left side plate 150 and the right side plate 160, and the stability after connection is better.

[0169] Exemplarily, the left flanging structure can be fixedly connected to the left side plate 150 by means of fastener connection, snap - connection, etc.

[0170] Exemplarily, the right flanging structure can be fixedly connected to the right side plate 160 by means of fastener connection, snap - connection, etc.

[0171] Exemplarily, the heating module 300 can be fixed on the upper surface of the air duct partition plate 510, and the heating module 300 can be carried by the air duct partition plate 510.

[0172] Such as Figure 10As shown, in some possible implementations, the fourth space S4 is provided with an air guide structure 520. The air guide structure 520 is used to guide the air from the first space S1 to the second space S2, or to guide the air from the second space S2 to the first space S1.

[0173] In this way, the air in the circulating air duct can circulate more smoothly, which is conducive to taking away the heat at the heating module 300 and transferring the heat to the second cooling medium through the cold row 210 for heat dissipation.

[0174] Exemplarily, the air guide structure 520 may be a block-shaped structure extending from the left end of the installation cavity S to the right end of the installation cavity S.

[0175] Exemplarily, the side surface of the air guide structure 520 facing the front is an arc surface that is recessed toward the rear, so as to smoothly guide the air from the first space S1 to the second space S2, or guide the air from the second space S2 to the first space S1.

[0176] Figure 12 A schematic diagram of an air guide structure provided in an embodiment of the present application.

[0177] like Figure 12 As shown, the air guide structure 520 has a third avoidance opening 521, and the third avoidance opening 521 runs through the front and rear sides of the air guide structure 520. Figure 10 As shown, the first connecting pipe 630 and the second connecting pipe 640 are disposed through the third avoidance opening 521. In this way, the air circulation in the circulating air duct is made to flow smoothly, and the second flow channel R2 is easily connected with the first external connector 610 and the second external connector 620.

[0178] Exemplarily, the third avoidance opening 521 is located at the left end or the right end of the wind guiding structure 520 , so that the third avoidance opening 521 has less influence on the wind guiding.

[0179] Exemplarily, the third avoidance opening 521 is located below the air duct dividing plate 510 , so that the third avoidance opening 521 has less influence on the wind guiding.

[0180] The cooling device and electronic device provided by the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A cooling device (200), characterized in that, including a cold radiator (210); the cold radiator (210) has a first flow channel (R1) and a second flow channel (R2) that are separated from each other; the first flow channel (R1) is part of a first internal circulation flow channel for circulating a first cooling medium; the second flow channel (R2) is part of an external circulation flow channel for circulating a second cooling medium; the cold radiator (210) is used to effect heat exchange between the first cooling medium in the first flow channel (R1) and the second cooling medium in the second flow channel (R2).

2. The cooling device (200) according to claim 1, characterized in that, the cold radiator (210) includes a flow channel structure part (211) and a fin structure (212); the flow channel structure part (211) has the first flow channel (R1) and the second flow channel (R2), and the fin structure (212) is provided on the outer surface of the flow channel structure part (211); the flow channel structure part (211) is used to effect heat exchange between the first cooling medium in the first flow channel (R1) and the second cooling medium in the second flow channel (R2).

3. The cooling device (200) according to claim 2, characterized in that, the flow channel structure part (211) extends in the left - right direction, the first flow channel (R1) and the second flow channel (R2) are arranged side - by - side vertically, and the fin structure (212) is provided on the side of the second flow channel (R2) away from the first flow channel (R1).

4. The cooling device (200) according to claim 3, characterized in that, the flow channel structure part (211) further has a third flow channel; the third flow channel is arranged side - by - side with the second flow channel (R2) front - to - back, and the third flow channel is part of a second internal circulation flow channel for circulating a third cooling medium; the flow channel structure part (211) is further used to effect heat exchange between the third cooling medium in the third flow channel and the second cooling medium in the second flow channel (R2).

5. The cooling device (200) according to claim 1, characterized in that, both the first flow channel (R1) and the second flow channel (R2) are straight flow channels.

6. The cooling device (200) according to claim 1, characterized in that, at least one of the first flow channel (R1) and the second flow channel (R2) is a bent flow channel.

7. The cooling device (200) according to any one of claims 1-6, characterized in that, further including a cold plate assembly (220), the cold plate assembly (220) is in communication with the first flow channel (R1), and the first flow channel (R1) and the cold plate assembly (220) are used to form the first internal circulation flow channel.

8. The cooling device (200) according to claim 7, characterized in that, the cold plate assembly (220) includes a first cold plate (221), a second cold plate (222), a first bypass pipe (223) and a first flow rate regulating valve (224); the first cold plate (221) is in series with the second cold plate (222), and the first cold plate (221) is located between the inlet of the second cold plate (222) and the outlet of the first flow channel (R1); the first bypass pipe (223) is in parallel with the first cold plate (221), the first flow rate regulating valve (224) is provided on the first bypass pipe (223), and the first flow rate regulating valve (224) is used to regulate the flow rate of the first cooling medium flowing through the first bypass pipe (223).

9. The cooling device (200) according to claim 8, characterized in that, further including a third cold plate, a second bypass pipe and a second flow rate regulating valve; The third cold plate is connected in series between the first cold plate (221) and the second cold plate (222). The outlet of the first cold plate (221) is communicated with the inlet of the second cold plate (222) through the third cold plate and the second bypass pipe. The second bypass pipe is connected in parallel with the third cold plate. The second flow regulating valve is used to regulate the flow rate of the first cooling medium flowing through the second bypass pipe.

10. The cooling device (200) according to claim 7, characterized in that, The cold plate assembly (220) includes a fourth cold plate (225), a fifth cold plate (226) and a third flow regulating valve (227); The fourth cold plate (225) is connected in series with the third flow regulating valve (227); The whole after the fourth cold plate (225) and the third flow regulating valve (227) are connected in series is connected in parallel with the fifth cold plate (226); The third flow regulating valve (227) is used to regulate the flow rate of the first cooling medium flowing through the fourth cold plate (225).

11. The cooling device (200) according to claim 7, characterized in that, It further includes a driving pump (230); The driving pump (230) is connected in series with the cold plate assembly (220) and the first flow channel (R1). The driving pump (230) is used to drive the first cooling medium to circulate in the first internal circulation flow channel.

12. The cooling device (200) according to claim 11, characterized in that, The driving pump (230) is connected in series between the outlet of the first flow channel (R1) and the inlet of the cold plate assembly (220).

13. An electronic device (10), characterized in that, It includes a chassis (100) and the cooling device (200) according to any one of claims 1-12; An installation cavity (S) is provided in the chassis (100). The cooling device (200) is arranged in the installation cavity (S). The first flow channel (R1) of the cooling device (200) is part of the first internal circulation flow channel located in the installation cavity (S); The second flow channel (R2) of the cooling device (200) is used to form an external circulation flow channel with a cold source device (20) located outside the chassis (100).

14. The electronic device (10) according to claim 13, characterized in that, It further includes a heating module (300); The heating module (300) is arranged in the installation cavity (S). The cold plate assembly (220) of the cooling device (200) is in contact with the heating module (300).

15. The electronic device (10) according to claim 14, characterized in that, It further includes a fan (400); The fan (400) is arranged in the installation cavity (S). The fan (400) is used to drive the air at the heating module (300) to flow towards the cold row (210) of the cooling device (200).

16. The electronic device (10) according to claim 15, characterized in that, The installation cavity (S) is a closed chamber; An air duct partition plate (510) is provided in the installation cavity (S). The top wall and the bottom wall of the installation cavity (S) are respectively located on both sides of the thickness direction of the air duct partition plate (510); The installation cavity (S) includes a first space (S1) above the air duct partition plate (510), a second space (S2) below the air duct partition plate (510), a third space (S3) in front of the air duct partition plate (510), and a fourth space (S4) behind the air duct partition plate (510); The first space (S1), the third space (S3), the second space (S2), and the fourth space (S4) are connected end to end in sequence to form a circulating air duct; The heating module (300), the cold plate assembly (220), the cold row (210), and the fan (400) are all arranged in the circulating air duct, and the fan (400) is used to drive the air in the circulating air duct to circulate.

17. The electronic device (10) according to claim 16, characterized in that, The cold plate assembly (220) and the heating module (300) are arranged in the first space (S1), the fan (400) and the cold row (210) are arranged in the third space (S3), and the cold row (210) is arranged between the fan (400) and the heating module (300).

18. The electronic device (10) according to claim 17, characterized in that, The first flow channel (R1) is located above the air duct partition plate (510).

19. The electronic device (10) according to claim 17, characterized in that, The chassis (100) is provided with a first external connector (610) and a second external connector (620), and the first external connector (610) and the second external connector (620) are arranged on the rear wall of the installation cavity (S); At least a part of the second flow channel (R2) is located above the air duct partition plate (510). The inlet of the second flow channel (R2) is connected to the first external connector (610) through a first connecting pipe (630), and the outlet of the second flow channel (R2) is connected to the second external connector (620) through a second connecting pipe (640). The first external connector (610) is used to communicate with the outlet of the cold source device (20), and the second external connector (620) is used to communicate with the inlet of the cold source device (20); A part of the first connecting pipe (630) and a part of the second connecting pipe (640) are located below the air duct partition plate (510); The front end of the air duct partition plate (510) has a first avoidance opening (511) and a second avoidance opening (512). The first connecting pipe (630) passes through the first avoidance opening (511) and the second space (S2), and the second connecting pipe (640) passes through the second avoidance opening (512) and the second space (S2).

20. The electronic device (10) according to claim 19, characterized in that, The fourth space (S4) is provided with a wind guiding structural member (520); The wind guiding structural member (520) is used to guide the air from the first space (S1) to the second space (S2), or guide the air from the second space (S2) to the first space (S1); The wind guiding structural member (520) has a third avoidance opening (521), and the first connecting pipe (630) and the second connecting pipe (640) pass through the third avoidance opening (521).

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