Solar thin film cell packaging structure and packaging method

Abstract

The invention provides a solar thin film cell packaging structure and packaging method, and belongs to the technical field of solar cells, the packaging structure comprises a solar thin film cell, a cover plate, a first packaging layer, a second packaging layer and a stress release layer, a second packaging layer and a stress release layer are arranged in an accommodating space formed by a first packaging layer, a cover plate and a solar thin film cell in a surrounding manner, and the stress release layer releases local stress generated by the second packaging layer or the first packaging layer in the packaging or using process of the solar thin film cell. The film layer stripping phenomenon between the first packaging layer and the solar thin film cell and between the film layers in the solar thin film cell is improved, stable carrier transmission between the film layers in the cell is ensured, the probability of interface defects is reduced, the second packaging layer and the first packaging layer are prevented from tilting due to film layer stripping, and the service life of the solar thin film cell is prolonged. Therefore, the solar thin film cell is prevented from being exposed in the environment of water vapor, oxygen or pollution particles as much as possible.

Description

Technical Field

[0001] The present application relates to the technical field of solar cell packaging, and particularly relates to a packaging structure and a packaging method for a thin-film solar cell. Background Art

[0002] A thin-film solar cell is a photovoltaic device that converts sunlight into electrical energy using thin-film semiconductor materials (such as amorphous silicon, copper indium gallium selenide, cadmium telluride, perovskite, etc.). Its core structure is to deposit one or more photoactive layers with a thickness of several micrometers to dozens of micrometers on a substrate by physical or chemical methods to form a PN junction or a PIN junction, thereby realizing the separation of photo-generated carriers (electron-hole pairs) and the output of current. Specifically, based on the photoelectric effect, when sunlight irradiates the surface of the thin-film solar cell, the photon energy is absorbed, exciting electrons in the photoactive layer to transition from the valence band to the conduction band, forming photo-generated carriers. The photo-generated carriers are separated under the action of the built-in electric field, and the electrons and holes move towards the positive and negative electrodes of the thin-film solar cell respectively, forming a current.

[0003] Although thin-film solar cells have excellent performance and potential, thin-film solar cells are prone to degradation under environmental conditions such as humidity, ultraviolet rays, and high temperatures. For example, for perovskite thin-film solar cells, the lead halide perovskite material exposed to air may undergo structural changes due to the influence of moisture, oxygen, etc., resulting in a decrease in the performance of the solar thin-film cell. Therefore, it is necessary to package the thin-film solar cell to protect it from external environmental factors.

[0004] However, in related technologies, when multiple packaging film layers are used to package a thin-film solar cell together, due to the differences in the physical properties of various packaging film layers, film layer peeling is likely to occur at the junction of adjacent packaging film layers. Film layer peeling will lead to problems such as poor contact between layers and incomplete packaging, weakening the sealing performance of the packaging structure, thereby reducing the performance of the thin-film solar cell and bringing more serious negative impacts on the working efficiency and working stability of the thin-film solar cell. Summary of the Invention

[0005] The present application provides a packaging structure and a packaging method for a thin-film solar cell, aiming to solve the technical problem of film layer peeling that is likely to occur in the packaging structure of a thin-film solar cell.

[0006] In a first aspect, the packaging structure for a thin-film solar cell provided by the present application includes:

[0007] A thin-film solar cell;

[0008] A cover plate, the cover plate being disposed on the backlight side of the thin-film solar cell;

[0009] A first encapsulation layer, which is disposed around the periphery of the thin-film solar cell, and extends along the thickness direction of the thin-film solar cell onto the cover plate. The first encapsulation layer, the cover plate, and the thin-film solar cell together enclose a receiving space;

[0010] A second encapsulation layer, which is disposed within the receiving space; and

[0011] A stress release layer, which is disposed within the receiving space, and the stress release layer and the second encapsulation layer are stacked on the thin-film solar cell along the thickness direction.

[0012] Further, the stress release layer is disposed between the thin-film solar cell and the second encapsulation layer, or the second encapsulation layer is disposed between the thin-film solar cell and the stress release layer.

[0013] Further, the stress release layer includes at least one of a polytetrafluoroethylene material layer, an ethylene-tetrafluoroethylene copolymer material layer, a polyethylene terephthalate material layer, a polyimide material layer, a fluorinated ethylene propylene copolymer material layer, a perfluoroalkoxy ethylene material layer, a polyvinylidene fluoride material layer, a polychlorotrifluoroethylene material layer, a polyacrylonitrile material layer. The stress release layer is in the form of a solid thin film, a liquid coating, or powder particles.

[0014] Further, the thin-film solar cell includes a first electrode layer, a second electrode layer, and a photoelectric conversion layer along the thickness direction. The photoelectric conversion layer is disposed between the first electrode layer and the second electrode layer. Among them, the first encapsulation layer is disposed around the periphery of the photoelectric conversion layer and the periphery of the second electrode layer.

[0015] Further, the first electrode layer has a first region and a second region connected to the periphery of the first region;

[0016] Among them, the second electrode layer and the photoelectric conversion layer are both located in the first region. The first encapsulation layer and the photoelectric conversion layer are on the same side of the first electrode layer, and the first encapsulation layer is located in the second region.

[0017] Further, the cover plate has a third region and a fourth region connected to the periphery of the third region;

[0018] Among them, along the thickness direction, the third region coincides with the first region, the fourth region coincides with the second region. The first end of the first encapsulation layer is located in the second region, the second end of the first encapsulation layer is disposed on the side of the cover plate close to the first electrode layer, and the second end is located in the fourth region. The first end and the second end are opposite to each other.

[0019] Further, the encapsulation structure further includes:

[0020] a positive current guiding factor, which is attached to the first side of the second electrode layer;

[0021] a negative current guiding factor, which is attached to the second side of the second electrode layer, and the second side is opposite to the first side; and

[0022] a wiring factor, which is disposed on the side of the cover plate away from the thin-film solar cell, and the wiring factor is electrically connected to the positive current guiding factor and the negative current guiding factor respectively.

[0023] In a second aspect, the thin-film solar cell encapsulation method provided by the present application includes:

[0024] providing a thin-film solar cell;

[0025] providing a first encapsulation layer and disposing the first encapsulation layer around the circumference of the thin-film solar cell;

[0026] providing a second encapsulation layer and a stress release layer, and disposing the second encapsulation layer and the stress release layer on the thin-film solar cell;

[0027] providing a cover plate and disposing the cover plate on the backlight side of the thin-film solar cell, so that the cover plate, the first encapsulation layer and the thin-film solar cell jointly enclose a containing space, and the second encapsulation layer and the stress release layer are located in the containing space, thereby obtaining a thin-film solar cell encapsulation structure.

[0028] Another thin-film solar cell encapsulation method provided by the present application includes:

[0029] providing a cover plate;

[0030] providing a second encapsulation layer and a stress release layer, and disposing the second encapsulation layer and the stress release layer on the cover plate;

[0031] providing a first encapsulation layer and disposing the first encapsulation layer around the circumference of the second encapsulation layer and the circumference of the stress release layer;

[0032] providing a thin-film solar cell and disposing the cover plate on the backlight side of the thin-film solar cell, so that the thin-film solar cell, the first encapsulation layer and the cover plate jointly enclose a containing space, and the second encapsulation layer and the stress release layer are located in the containing space, thereby obtaining a thin-film solar cell encapsulation structure.

[0033] Further, the thin-film solar cell includes a first electrode layer, a second electrode layer, and a photoelectric conversion layer disposed between the first electrode layer and the second electrode layer. The first electrode layer has a first region and a second region connected to the periphery of the first region. Before the step of providing a thin-film solar cell, the method further includes:

[0034] Performing an edge cleaning process on the thin-film solar cell so that both the second electrode layer and the photoelectric conversion layer are located in the first region.

[0035] Further, after the step of performing an edge cleaning process on the thin-film solar cell, the method further includes:

[0036] Providing a positive current guiding factor, attaching the positive current guiding factor to a first side of the second electrode layer, and making a part of the positive current guiding factor extend outside the thin-film solar cell;

[0037] Providing a negative current guiding factor, attaching the negative current guiding factor to a second side of the second electrode layer, and making a part of the negative current guiding factor extend outside the thin-film solar cell, where the second side is opposite to the first side.

[0038] Further, the method further includes:

[0039] Performing a vacuum lamination process on the thin-film solar cell encapsulation structure to obtain the laminated thin-film solar cell encapsulation structure;

[0040] Providing a wiring factor and disposing the wiring factor on a side of the cover plate away from the thin-film solar cell;

[0041] Electrically connecting the wiring factor to the negative current guiding factor extending outside the thin-film solar cell and the positive current guiding factor extending outside the thin-film solar cell respectively.

[0042] In the solar thin-film battery packaging structure and packaging method provided in the present application, a second packaging layer and a stress release layer are arranged in the accommodating space enclosed by the first packaging layer, the cover plate and the solar thin-film battery. The first packaging layer is used to package the peripheral side of the solar thin-film battery to block external water vapor, oxygen and pollution particles from entering from the peripheral side of the solar thin-film battery. The second packaging layer is used to package the side of the solar thin-film battery facing the cover plate to block external water vapor, oxygen or pollution particles from entering from the side of the solar thin-film battery facing the cover plate. The stress release layer releases the local stress generated by the second packaging layer or the first packaging layer in the solar thin-film battery during the packaging process or the use process, improves the peeling phenomenon between the first packaging layer and the second packaging layer and the solar thin-film battery and between the various film layers inside the solar thin-film battery, ensures the stability of carrier transmission between the various film layers inside the battery, reduces the probability of interface defects, and avoids the second packaging layer and the first packaging layer from warping due to film peeling, thereby avoiding the solar thin-film battery from being exposed to water vapor, oxygen or pollution particles as much as possible. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 A schematic diagram of a solar thin-film battery packaging structure provided for the first embodiment of the present application;

[0044] Figure 2 A schematic diagram of a solar thin-film battery packaging structure provided for a second embodiment of the present application;

[0045] Figure 3 This is a sample efficiency test diagram of a solar thin-film battery packaging structure without a stress release layer in the related art;

[0046] Figure 4 Sample efficiency test diagram of the solar thin-film battery packaging structure provided in this application;

[0047] Figure 5 A comparison chart of thermal cycle aging of the solar thin-film battery packaging structure provided in this application;

[0048] Figure 6 A comparison chart of dry heat aging of the solar thin-film battery packaging structure provided in this application;

[0049] Figure 7 A double 85 aging comparison diagram of the solar thin-film battery packaging structure provided in this application;

[0050] Figure 8 Outdoor aging comparison diagram of the solar thin-film battery packaging structure provided in this application;

[0051] Figure 9 A schematic diagram of a solar thin-film battery packaging structure provided for a third embodiment of the present application;

[0052] Figure 10 Schematic diagram of the encapsulation structure of the thin-film solar cell provided for the fourth embodiment of the present application;

[0053] Figure 11 For Figure 1 、 Figure 2 、 Figure 9 And Figure 10 Top view of the thin-film solar cells in

[0054] Figure 12 For Figure 11 A schematic diagram showing the thin-film solar cell provided with a positive current-drawing factor and a negative current-drawing factor;

[0055] Figure 13 For Figure 11 Another schematic diagram showing the thin-film solar cell provided with a positive current-drawing factor and a negative current-drawing factor;

[0056] Figure 14 For Figure 12 Schematic diagram of the connection between the structure shown and the wiring factor provided on the cover plate;

[0057] Figure 15 Schematic diagram of the steps of the thin-film solar cell encapsulation method provided for the first embodiment of the present application;

[0058] Figure 16 Schematic diagram of the steps of the thin-film solar cell encapsulation method provided for the second embodiment of the present application;

[0059] Figure 17 For Figure 1 Schematic diagram of the thin-film solar cell encapsulation structure before vacuum lamination;

[0060] Figure 18 For Figure 2 Schematic diagram of the thin-film solar cell encapsulation structure before vacuum lamination.

[0061] Reference numerals:

[0062] Solar thin-film battery packaging structure 100, gap L1, solar thin-film battery 10, first electrode layer 11, photo-electric conversion layer 12, hole transport layer 121, light absorption layer 122, electron transport layer 123, second electrode layer 13, first side 131, second side 132, third side 133, fourth side 134, buffer layer 14, cover plate 20, first encapsulation layer 30, first end 30a, second end 30b, second encapsulation layer 40, stress relief layer 50, first region S1, second region S2, third region S3, fourth region S4, positive current-draining factor 61, negative current-draining factor 62, wiring factor 63, first current-carrying bar 611, first bus bar 612, first lead 613, first current-draining bar 614, second current-carrying bar 621, second bus bar 622, second lead 623, second current-draining bar 624. Detailed implementation manners

[0063] The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application. The described embodiments are only used to explain the idea of the present invention and should not be regarded as a limitation on the protection scope of the present application.

[0064] It should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Without further statement, the above terms have no special meanings and therefore should not be construed as a limitation on the protection scope of the present application.

[0065] In the first aspect of the present application, a solar thin-film battery packaging structure 100 is provided. As Figure 1 and Figure 2 shown, the solar thin-film battery packaging structure 100 includes a solar thin-film battery 10, a cover plate 20, a first encapsulation layer 30, a second encapsulation layer 40, and a stress relief layer 50.

[0066] Among them, the cover plate 20 is disposed on the backlight side of the solar thin-film battery 10.

[0067] Specifically, the solar thin-film battery 10 has a light-incident side and a backlight side opposite to the light-incident side. When sunlight irradiates the surface of the light-incident side of the solar thin-film battery 10, the photon energy of the sunlight is absorbed by the photo-electric conversion layer 12 (described later) of the solar thin-film battery 10, exciting electrons in the photo-electric conversion layer 12 to transition from the valence band to the conduction band, forming electron-hole pairs. The electron-hole pairs are separated under the action of the built-in electric field of the solar thin-film battery 10. The electrons move towards the positive electrode of the solar thin-film battery 10, and the holes move towards the negative electrode of the solar thin-film battery 10, thereby forming a current inside the solar thin-film battery 10.

[0068] Among them, the first encapsulation layer 30 is disposed around the peripheral side of the thin-film solar cell 10, and the first encapsulation layer 30 extends along the thickness direction of the thin-film solar cell 10 onto the cover plate 20. The first encapsulation layer 30, the cover plate 20, and the thin-film solar cell 10 together enclose a receiving space.

[0069] It is worth mentioning that the peripheral side of the thin-film solar cell 10 is between the light-incident side and the backlight side of the thin-film solar cell 10.

[0070] The cover plate 20 can specifically be made of tempered glass material or non-tempered glass material. The thickness range of the cover plate 20 is from 0.1 mm to 10 mm.

[0071] The first encapsulation layer 30 is a pressure-sensitive adhesive, and specifically can be composed of one or more of materials with good waterproof performance such as butyl rubber, epoxy adhesive, silicone rubber, and polyurethane.

[0072] The first encapsulation layer 30 is disposed around the peripheral side of the thin-film solar cell 10, and the peripheral side of the thin-film solar cell 10 is encapsulated by the first encapsulation layer 30 to block water vapor, oxygen, and pollution particles from the outside from entering the inside of the thin-film solar cell 10 through the peripheral side of the thin-film solar cell 10, thereby causing the electrical characteristics of the thin-film solar cell 10 to deteriorate.

[0073] Among them, the second encapsulation layer 40 and the stress release layer 50 are both disposed in the receiving space, and the second encapsulation layer 40 and the stress release layer 50 are stacked on the thin-film solar cell 10 along the thickness direction of the thin-film solar cell 10.

[0074] Specifically, in one embodiment, as Figure 1 shown, the second encapsulation layer 40 is disposed on the thin-film solar cell 10, and the stress release layer 50 is disposed on the second encapsulation layer 40. In another embodiment, as Figure 2 shown, the stress release layer 50 is disposed on the thin-film solar cell 10, and the second encapsulation layer 40 is disposed on the stress release layer 50.

[0075] The second encapsulation layer 40 is a hot-melt adhesive, and specifically can be composed of one or more of ethylene-vinyl acetate copolymer (EVA), polyolefin elastomer (POE), thermoplastic olefin elastomer (TPO), polyvinyl butyral (PVB), and thermoplastic polyurethane elastomer (TPU), etc. The hot-melt adhesive material has good chemical resistance and electrical insulation.

[0076] The stress relief layer 50 can be composed of one or more of materials capable of achieving local stress relief, such as Polytetrafluoroethylene (PTFE), Ethylene-terafluoroethlene (ETFE), Polyethylene Terephthalate (PET), Polyimide (PI), Fluorinated Ethylene Propylene (FEP), Perfluoroalkoxyethylene (PFA), Polyvinylidene Fluoride (PVDF), Polychlorotrifluoroethylene (PCTFE), and Polyacrylonitrile (PNA). The stress relief layer 50 can exist in the form of a liquid coating, a solid film, or powder particles.

[0077] The second encapsulation layer 40 is disposed on the backlight side of the thin-film solar cell 10 and is disposed within the accommodation space. The second encapsulation layer 40 encapsulates the backlight side of the thin-film solar cell 10 to prevent moisture, oxygen, and pollution particles from the outside from entering the accommodation space through the junction of the cover plate 20 and the first encapsulation layer 30 and then invading the inside of the thin-film solar cell 10, thereby causing a decline in the electrical characteristics of the thin-film solar cell 10.

[0078] By disposing the stress relief layer 50 on the backlight side of the thin-film solar cell 10 and within the accommodation space, the local stress generated during the preparation of the thin-film solar cell encapsulation structure by the second encapsulation layer 40 is released based on the stress relief layer 50.

[0079] Specifically, the preparation process of the solar thin-film battery packaging structure 100 includes an edge cleaning step, a conductive drainage step, and a lamination packaging step. In the lamination packaging step, due to the difference in the relative positions between the first packaging layer 30 and the second packaging layer 40 and the solar thin-film battery 10, the shrinkage rates of the two are inconsistent during cooling, resulting in different stresses in the two. Without the stress release layer 50, the second packaging layer 40 will stick to the second electrode layer 13, causing delamination between the second electrode layer 13 and other contacting film layers (the first packaging layer 30, the optoelectronic conversion layer 12), and further causing the failure of the solar thin-film battery itself. When the stress release layer 50 is provided, based on the good release force of the stress release layer 50 itself, when the stress release layer 50 is provided between the second electrode layer 13 and the second packaging layer 40, it prevents the second packaging layer 40 from sticking to the second electrode layer 13, thus avoiding delamination between the second electrode layer 13 and other contacting film layers. When the stress release layer 50 is provided between the cover plate 20 and the second packaging layer 40, the stress release layer 50 separates the second packaging layer 40 from the cover plate 20, so that no stress is generated between the second packaging layer 40 and the cover plate 20. Furthermore, the various film layers inside the solar thin-film battery will not show delamination due to this stress, and the charge transfer efficiency between the film layers of the solar thin-film battery will not be reduced.

[0080] It should be noted that the present application does not limit the specific type of the solar thin-film battery 10. The solar thin-film battery 10 referred to in the present application may specifically be an amorphous silicon thin-film battery, a copper indium gallium selenide thin-film battery, a cadmium telluride thin-film battery, a perovskite thin-film battery, etc.

[0081] As Figure 3 shown, in the solar thin-film battery packaging structure 100, if the stress release layer 50 is not provided, the delamination phenomenon during the packaging process will cause a significant decrease in the efficiency of the solar thin-film battery 10 after packaging, and may even lead to the failure of the solar thin-film battery 10. However, as Figure 4 shown, in the solar thin-film battery packaging structure 100, if the stress release layer 50 is provided, the stress release layer 50 effectively prevents the occurrence of delamination, and the optoelectronic conversion efficiency of the solar thin-film battery 10 is steadily improved.

[0082] Furthermore, the inventor of the present application also conducted thermal cycle aging verification, dry heat aging verification, double 85 aging verification, and outdoor aging verification on the solar thin-film battery packaging structure 100 with and without the stress release layer 50.

[0083] As Figure 5As shown, in the thermal cycling aging verification, as the number of thermal cycles increases, the sample efficiency retention rate of the solar thin-film battery packaging structure 100 provided with the stress relief layer 50 remains at about 100%. However, for the solar thin-film battery packaging structure 100 without the stress relief layer 50, the sample efficiency gradually decreases. When the number of thermal cycles reaches 200, the sample efficiency retention rate of the solar thin-film battery packaging structure 100 without the stress relief layer 50 is less than 80%.

[0084] It should be noted that in any embodiment of the present application, the sample efficiency retention rate describes the relative change rate of the photoelectric conversion efficiency of the solar thin-film battery packaging structure sample. The relative change rate of the sample efficiency refers to the percentage of the photoelectric conversion efficiency of the solar thin-film battery packaging structure sample at the current time period relative to the photoelectric conversion efficiency at the initial time period under the set conditions.

[0085] Thermal cycling aging verification, also known as TC aging verification, refers to controlling the ambient temperature of the solar thin-film battery 10 to vary periodically between low and high temperatures, generally between -40 degrees Celsius and +85 degrees Celsius, to verify whether the solar thin-film battery 10 can withstand long-term temperature fluctuations and the performance changes of the solar thin-film battery 10 under temperature changes. The number of thermal cycling tests is generally not less than 200 times. If the attenuation amplitude of the sample efficiency retention rate is within the range of 0% to 5%, the thermal cycling aging verification result is qualified.

[0086] As Figure 6 shown, in the dry heat aging verification, as the dry heat aging time increases, the sample efficiency retention rate of the solar thin-film battery packaging structure 100 provided with the stress relief layer 50 remains at about 100%. For the solar thin-film battery packaging structure 100 without the stress relief layer 50, the sample efficiency gradually decreases. After the dry heat aging time reaches 1000 hours, the sample efficiency retention rate of the solar thin-film battery packaging structure without the stress relief layer 50 is less than 80%, and the attenuation amplitude of the sample efficiency retention rate of the solar thin-film battery packaging structure with the stress relief layer is still within the range of 0% to 5%.

[0087] Dry heat aging verification is usually carried out in an environment with high temperature and low humidity. The ambient temperature is generally not less than 85 degrees Celsius, and the relative humidity of the environment is generally not higher than 20%. The test time for dry heat aging verification is not less than 1000 hours. If the relative efficiency attenuation amplitude of the sample is within 5%, the dry heat aging verification result is qualified, indicating that the solar thin-film battery packaging structure can maintain good performance in an extremely high-temperature and dry environment.

[0088] As Figure 7As shown, in the double 85 aging verification, with the increase of the double 85 aging time, the sample efficiency retention rate of the solar thin film battery packaging structure with a stress release layer is maintained at about 100%, while the sample efficiency of the solar thin film battery packaging structure without a stress release layer gradually decreases. After the double 85 aging time reaches 1073 hours, the sample efficiency retention rate of the solar thin film battery packaging structure 100 without a stress release layer 50 is less than 80%.

[0089] The double 85 aging verification is usually carried out in an environment of 85 degrees Celsius and a relative humidity of 85% to simulate the degradation process of the solar thin film battery packaging structure under humid and high-temperature conditions. The test time of the double 85 aging verification is not less than 1000 hours. If the attenuation amplitude of the sample efficiency retention rate is within 5%, the double 85 aging verification result is qualified, indicating that the solar thin film battery packaging structure can have stable electrical performance and a long service life in a high-humidity and high-temperature environment.

[0090] As Figure 8 shown, in the outdoor aging verification, with the increase of the outdoor aging time, the sample efficiency retention rate of the solar thin film battery packaging structure with a stress release layer is maintained at about 100%, while the sample efficiency retention rate of the solar thin film battery packaging structure without a stress release layer gradually decreases. After the outdoor aging time reaches 1000 hours, the sample efficiency retention rate of the solar thin film battery packaging structure without a stress release layer is less than 80%. The outdoor aging verification is carried out in the natural environment.

[0091] Furthermore, as Figure 1 shown, in one embodiment, the stress release layer 50 is disposed between the solar thin film battery 10 and the second encapsulation layer 40. In another embodiment, the second encapsulation layer 40 is disposed between the solar thin film battery 10 and the stress release layer 50.

[0092] Specifically, as Figure 9 shown, the solar thin film battery 10 includes a first electrode layer 11, a second electrode layer 13, and a photoelectric conversion layer 12 along the thickness direction. The photoelectric conversion layer 12 is disposed between the first electrode layer 11 and the second electrode layer 13. The first encapsulation layer 30 is disposed around the circumferences of the photoelectric conversion layer 12 and the second electrode layer 13.

[0093] The first electrode layer 11 is made of one or more of transparent and conductive oxide materials such as indium-doped tin oxide (ITO) and fluorine-doped tin dioxide (FTO). Since the first electrode layer 11 is a transparent material, the first electrode layer 11 has good light transmittance. In this way, sunlight is incident on the photoelectric conversion layer 12 from the first electrode layer 11, which is conducive to a large amount of sunlight being absorbed by the photoelectric conversion layer 12. Since the first electrode layer 11 has electrical conductivity, the first electrode layer 11 can provide good electrical conductivity for collecting and transporting holes.

[0094] The second electrode layer 13 is made of one or more of materials with good electrical conductivity such as metallic gold (Au), metallic copper (Cu), metallic aluminum (Al), ITO, and graphite. Based on the good electrical conductivity of the first electrode layer 11 and the second electrode layer 13, it is convenient to form an electric field between the first electrode layer 11 and the second electrode layer 13.

[0095] Exemplarily, the photoelectric conversion layer 12 includes a hole transport layer 121, a light absorption layer 122, and an electron transport layer 123 stacked in sequence away from the first electrode layer 11.

[0096] The hole transport layer 121 is used to collect the holes generated in the light absorption layer 122 and transport the holes to the anode (i.e., the first electrode layer 11). At the same time, the hole transport layer 121 also blocks electrons to prevent electrons from diffusing back from the anode to the light absorption layer 122, reducing the recombination of photo-generated carriers. In addition, the hole transport layer 121 also has the function of interface protection to protect the light absorption layer 122 from water and oxygen erosion, ensuring the long-term stability of the solar thin film battery 10.

[0097] The electron transport layer 123 is used to collect the electrons generated in the light absorption layer 122 and transport the electrons to the cathode (i.e., the second electrode layer 13). At the same time, the electron transport layer 123 also blocks holes to prevent holes from diffusing back from the cathode to the light absorption layer 122, reducing the recombination of photo-generated carriers.

[0098] The light absorption layer 122 absorbs sunlight and generates electron-hole pairs, promotes the separation of electrons and holes, and matches the energy levels of the electron transport layer 123 and the hole transport layer 121. When the solar thin film battery 10 is specifically a perovskite thin film battery, the light absorption layer 122 is specifically a perovskite active layer. When the solar thin film battery 10 is an amorphous silicon thin film battery, the light absorption layer 122 is specifically an amorphous silicon active layer. When the solar thin film battery 10 is specifically a copper indium gallium selenide thin film battery, the light absorption layer 122 is specifically a compound semiconductor active layer composed of elements such as copper, indium, gallium, and selenium. When the solar thin film battery 10 is specifically a cadmium telluride thin film battery, the light absorption layer 122 is specifically a cadmium telluride active layer.

[0099] It is worth mentioning that in another embodiment, the optoelectronic conversion layer includes an electron transport layer, a light absorption layer, and a hole transport layer stacked in sequence away from the first electrode layer. In this case, an electron injection material needs to be provided on the first electrode layer to help electrons smoothly enter the optoelectronic conversion layer from the first electrode layer. In this case, a hole injection material needs to be provided on the second electrode layer to help holes smoothly enter the optoelectronic conversion layer from the second electrode layer.

[0100] In this embodiment, by providing the first encapsulation layer 30 around the circumferences of the optoelectronic conversion layer 12 and the second electrode layer 13, it is ensured that external water, oxygen, and contaminant particles are difficult to erode into the interior of the optoelectronic conversion layer 12 through the circumferences of the optoelectronic conversion layer 12 and the second electrode layer 13. In addition, since the first electrode layer 11 is not blocked by the first encapsulation layer 30, the first electrode layer 11 still has a relatively large area for sunlight to enter, ensuring that the overall solar thin-film battery 10 has good light absorption.

[0101] Furthermore, in one embodiment, as Figure 10 shown, the solar thin-film battery 10 further includes a buffer layer 14. The buffer layer 14 is disposed between the optoelectronic conversion layer 12 and the second electrode layer 13. The buffer layer 14 is disposed on the optoelectronic conversion layer 12 to prevent damage to the optoelectronic conversion layer 12 when the second electrode layer 13 is fabricated. In another embodiment, the buffer layer may not be provided in the solar thin-film battery 10.

[0102] The buffer layer 14 is made of one or more of 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline (Bathocuproine, BCP), molybdenum oxide (MoO2), tin dioxide (SnO2), and titanium dioxide (TiO2).

[0103] Furthermore, in one embodiment, please continue to refer to Figure 1 、 Figure 2 、 Figures 9 to 11 shown, the first electrode layer 11 has a first region S1 and a second region S2 connected to the periphery of the first region S1.

[0104] The second electrode layer 13 and the optoelectronic conversion layer 12 are both located in the first region S1. The first encapsulation layer 30 is disposed on the side of the first electrode layer 11 close to the optoelectronic conversion layer 12, and the first encapsulation layer 30 is located in the second region S2.

[0105] Furthermore, the width range of the second region S2 is from 1 millimeter to 30 millimeters. Controlling the width range of the second region S2 to be from 1 millimeter to 30 millimeters enables the first encapsulation layer 30 to be stably disposed on the side of the first electrode layer 11 close to the optoelectronic conversion layer 12.

[0106] It is worth mentioning that in the edge cleaning step, the first electrode layer 11 in the second region S2 can be partially removed along the thickness direction of the solar thin film battery 10, or it can not be removed.

[0107] In this embodiment, by disposing the first encapsulation layer 30 on the side of the first electrode layer 11 close to the photo - electric conversion layer 12 and disposing the first encapsulation layer 30 in the second region S2, the side of the first electrode layer 11 facing away from the photo - electric conversion layer 12 will not be blocked by the first encapsulation layer 30, thereby increasing the incident area of sunlight from the first electrode layer 11 to the photo - electric conversion layer 12.

[0108] Furthermore, in one embodiment, please continue to refer to Figure 1 、 Figure 2 、 Figure 9 and Figure 10 , the cover plate 20 has a third region S3 and a fourth region S4 connecting to the periphery of the third region S3.

[0109] Along the thickness direction of the solar thin film battery 10, the third region S3 coincides with the first region S1, and the fourth region S4 coincides with the second region S2.

[0110] The first end 30a of the first encapsulation layer 30 is located in the second region S2, the second end 30b of the first encapsulation layer 30 is disposed on the side of the cover plate 20 close to the first electrode layer 11, and the second end 30b of the first encapsulation layer 30 is located in the fourth region S4. The first end 30a and the second end 30b of the first encapsulation layer 30 are the two opposite ends of the first encapsulation layer 30 along the thickness direction of the solar thin film battery 10.

[0111] In this embodiment, the first encapsulation layer 30 is clamped between the first electrode layer 11 and the cover plate 20, and in the top view of the solar thin film battery encapsulation structure 100, the cover plate 20 and the first electrode layer 11 coincide, that is, the size of the cover plate 20 is the same as the size of the first electrode layer 11, avoiding the deposition of external dust at the junction of the first encapsulation layer 30 and the first electrode layer 11 and at the junction of the first encapsulation layer 30 and the cover plate 20.

[0112] Furthermore, in one embodiment, as Figures 12 to 14 shown, the solar thin film battery encapsulation structure 100 further includes a positive current - guiding factor 61, a negative current - guiding factor 62, and a wiring factor 63.

[0113] The positive current guiding factor 61 is disposed on the first side 131 of the second electrode layer 13, and the negative current guiding factor 62 is disposed on the second side 132 of the second electrode layer 13. The second side 132 is opposite to the first side 131. In this way, the positive current guiding factor 61 is between the first encapsulation layer 30 and the first side 131 of the second electrode layer 13, and the negative current guiding factor 62 is between the first encapsulation layer 30 and the second side 132 of the second electrode layer 13.

[0114] The wiring factor 63 is disposed on the side of the cover plate 20 away from the solar thin film battery 10, and the wiring factor 63 is electrically connected to the positive current guiding factor 61 and the negative current guiding factor 62 respectively.

[0115] The wiring factor 63 is the junction box. The specific position of the wiring factor 63 on the cover plate 20 can be set according to the encapsulation requirements.

[0116] In one embodiment, a through hole is further opened in the area of the cover plate 20 corresponding to the wiring factor 63, so that the positive current guiding factor 61 and the negative current guiding factor 62 are electrically connected to the wiring factor 63 through the through hole opened on the cover plate 20.

[0117] In another embodiment, as Figure 14 shown, the positive current guiding factor 61 and the negative current guiding factor 62 are respectively led out along the side of the second electrode layer 20 to the outside of the solar thin film battery, so that the positive current guiding factor 61 can be electrically connected to the wiring factor 63 and the negative current guiding factor 62 can be electrically connected to the wiring factor 63 without opening a through hole on the cover plate 20.

[0118] In the second aspect of the present application, a method for encapsulating a solar thin film battery is further provided. As Figure 15 shown, the encapsulation method 200 includes step S2130, step S2140, step S2150 and step S2160.

[0119] Step S2130: Provide a solar thin film battery 10.

[0120] In this step S2130, the solar thin film battery 10 is cleaned to remove impurities on the surface of the solar thin film battery 10.

[0121] Step S2140: Provide a first encapsulation layer 30 and dispose the first encapsulation layer 30 around the periphery of the solar thin film battery 10.

[0122] In this step S2140, the first encapsulation layer 30 is uniformly pasted on the periphery of the solar thin film battery 10 so that the first encapsulation layer 30 and the solar thin film battery 10 together form a bin-shaped structure.

[0123] Step S2150: Provide a second encapsulation layer 40 and a stress relief layer 50, and dispose the second encapsulation layer 40 and the stress relief layer 50 on the thin-film solar cell 10.

[0124] In this step S2150, before disposing the second encapsulation layer 40 and the stress relief layer 50 on the thin-film solar cell 10, it is necessary to cut the second encapsulation layer 40 and the stress relief layer 50 to dimensions matching the bin-shaped structure, so that when the second encapsulation layer 40 and / or the stress relief layer 50 is disposed on the thin-film solar cell 10, the peripheral side of the second encapsulation layer 40 is adhered to the first encapsulation layer 30, and the peripheral side of the stress relief layer 50 is adhered to the first encapsulation layer 30. The process of laying the second encapsulation layer 40 and the stress relief layer 50 on the thin-film solar cell 10 includes but is not limited to any one of spraying, printing, and dispensing.

[0125] It is worth mentioning that in this step, it can be that the second encapsulation layer 40 is disposed on the thin-film solar cell 10 and the stress relief layer 50 is disposed on the second encapsulation layer 40. Or it can be that the stress relief layer 50 is disposed on the thin-film solar cell 10 and the second encapsulation layer 40 is disposed on the stress relief layer 50.

[0126] Step S2160: Provide a cover plate 20, and dispose the cover plate 20 on the backlight side of the thin-film solar cell 10. So that the cover plate 20, the first encapsulation layer 30, and the thin-film solar cell 10 jointly enclose a receiving space, and the second encapsulation layer 40 and the stress relief layer 50 are located in the receiving space, obtaining the thin-film solar cell encapsulation structure 100.

[0127] In this step S260, by disposing the cover plate 20 on the backlight side of the thin-film solar cell 10, the cover plate 20 seals the bin opening of the bin-shaped structure, so that the cover plate 20, the first encapsulation layer 30, and the thin-film solar cell 10 jointly enclose a receiving space.

[0128] The first encapsulation layer 30 encapsulates the peripheral side of the thin-film solar cell 10 to block water vapor, oxygen, and pollution particles from the outside from entering the inside of the thin-film solar cell 10 from the peripheral side of the thin-film solar cell 10.

[0129] The second encapsulation layer 40 encapsulates the backlight side of the thin-film solar cell 10 to block water vapor, oxygen, and pollution particles from the outside from invading the inside of the thin-film solar cell 10 after entering the receiving space through the junction of the cover plate 20 and the first encapsulation layer 30.

[0130] The stress release layer 50 releases the local stress generated during the preparation of the encapsulation structure 100 of the thin-film solar cell, avoiding the phenomenon of film layer peeling between the first encapsulation layer 30 and the second encapsulation layer 40, between the thin-film solar cell 10 and among the various film layers inside the thin-film solar cell 10, and improving the overall airtightness of the encapsulation structure 100 of the thin-film solar cell.

[0131] As Figure 16 shown, in another embodiment, the encapsulation method 200 of the thin-film solar cell 10 includes step S2230, step S2240, step S2250, and step S2260.

[0132] Step S2230, provide a cover plate 20.

[0133] In this step S2230, the provided cover plate 20 is a cover plate 20 that has been cleaned. There are various ways to achieve the cleaning process, including but not limited to purging the cover plate 20 with nitrogen to remove impurities on the surface of the cover plate 20, facilitating the subsequent steps of setting the second encapsulation layer 40, the stress release layer 50, and the first encapsulation layer 30 on the cover plate 20.

[0134] Step S2240, provide a second encapsulation layer 40 and a stress release layer 50, and set the second encapsulation layer 40 and the stress release layer 50 on the cover plate 20.

[0135] In this embodiment S2240, before setting the second encapsulation layer 40 and the stress release layer 50 on the cover plate 20, it is necessary to cut the second encapsulation layer 40 and the stress release layer 50 to dimensions that match a specific area of the cover plate 20, facilitating that in the subsequent steps, when setting the second encapsulation layer 40 and / or the stress release layer 50 on the thin-film solar cell 10, the peripheral side of the second encapsulation layer 40 fits with the first encapsulation layer 30, and the peripheral side of the stress release layer 50 fits with the first encapsulation layer 30. The process of laying the second encapsulation layer 40 and the stress release layer 50 on the cover plate 20 includes but is not limited to any one of spraying, printing, and dispensing.

[0136] It is worth mentioning that in this step, it can be that the second encapsulation layer 40 is set on the cover plate 20 and the stress release layer 50 is set on the second encapsulation layer 40. It can also be that the stress release layer 50 is set on the cover plate 20 and the second encapsulation layer 40 is set on the stress release layer 50.

[0137] Step S2250, provide a first encapsulation layer 30, and set the first encapsulation layer 30 around the peripheral side of the second encapsulation layer 40 and the peripheral side of the stress release layer 50.

[0138] In this step S2250, the first encapsulation layer 30 is evenly pasted on the peripheral sides of the second encapsulation layer 40 and the stress relief layer 50. Both the second encapsulation layer 40 and the stress relief layer 50 are disposed on the cover plate 20, such that the first encapsulation layer 30 and the cover plate 20 together form a bin-shaped structure, and both the second encapsulation layer and the stress relief layer 50 are located inside the bin-shaped structure.

[0139] Step S2260: Provide a thin-film solar cell 10, and dispose the cover plate 20 on the backlight side of the thin-film solar cell 10, so that the thin-film solar cell 10, the first encapsulation layer 30, and the cover plate 20 together enclose a containing space, and the second encapsulation layer 40 and the stress relief layer 50 are located inside the containing space, thus obtaining a thin-film solar cell encapsulation structure 100.

[0140] In this step S2260, the cover plate 20 is disposed on the backlight side of the thin-film solar cell 10, so that the thin-film solar cell 10 is buckled at the opening of the bin-shaped structure, such that the cover plate 20, the first encapsulation layer 30, and the thin-film solar cell 10 together enclose a containing space. The second encapsulation layer 40 and the stress relief layer 50 are located inside the enclosed containing space. Thus, the second encapsulation layer 40 encapsulates the backlight side of the thin-film solar cell 10, preventing water vapor, oxygen, and contaminant particles from the outside from entering the containing space through the junction of the cover plate 20 and the first encapsulation layer 30 and then invading the inside of the thin-film solar cell 10.

[0141] Further, in an embodiment, as shown in Figure 9 the thin-film solar cell 10 includes a first electrode layer 11, a second electrode layer 13, and a photoactive layer 12 disposed between the first electrode layer 11 and the second electrode layer 13. The first electrode layer 11 has a first region S1 and a second region S2 connected to the periphery of the first region S1.

[0142] Before step S2260 or step S2130, the encapsulation method 200 further includes:

[0143] Step S210: Perform an edge cleaning process on the thin-film solar cell 10, so that both the second electrode layer 13 and the photoactive layer 12 are located in the first region S1.

[0144] In step S210, the edge cleaning process can be achieved by physical edge cleaning or chemical edge cleaning, so that the second electrode layer 13 located in the second region S2 is separated from the second electrode layer 13 located in the first region S1, and the photoactive layer 12 located in the second region S2 is separated from the photoactive layer 12 located in the first region S1.

[0145] Exemplarily, for physical edge cleaning, a laser can be specifically used to cut the second electrode layer 13 and the photoelectric conversion layer 12. For chemical edge cleaning, at least one of a DMF solution, an acetonitrile solution, or an ethanol solution can be specifically used to etch the second electrode layer 13 and the photoelectric conversion layer 12 located in the second region S2, so as to remove the second electrode layer 13 and the photoelectric conversion layer 12 located in the second region S2.

[0146] Further, in step S210, during the edge cleaning process of the solar thin film battery 10, a part of the first electrode layer 11 in the second region S2 can also be removed along the thickness direction of the solar thin film battery 10, so that the surface of the first electrode layer 11 in the second region S2 close to the photoelectric conversion layer 12 is lower than the surface of the first electrode layer 11 in the first region S1 close to the photoelectric conversion layer 12.

[0147] Further, after step S210 and before step S2130, the encapsulation method 200 further includes step S221 and step S222. Alternatively, after step S210 and before step S2260, the encapsulation method 200 further includes step S221 and step S222.

[0148] Among them, in step S221, a positive electrode current-carrying factor 61 is provided, and the positive electrode current-carrying factor 61 is attached to the first side edge 131 of the second electrode layer 13, and a part of the positive electrode current-carrying factor 61 extends outside the solar thin film battery 10.

[0149] Among them, in step S222, a negative electrode current-carrying factor 62 is provided, and the negative electrode current-carrying factor 62 is attached to the second side edge 132 of the second electrode layer 13, and a part of the negative electrode current-carrying factor 62 extends outside the solar thin film battery 10. The second side edge 132 is opposite to the first side edge 131.

[0150] In step S221 and step S222, a bus bar current-carrying method or a string bar current-carrying method can be used.

[0151] As Figure 12 shown, if the bus bar current-carrying method is adopted, the positive electrode current-carrying factor 61 includes a first string bar 611, a first bus bar 612, and a first lead 613, and the negative electrode current-carrying factor 62 includes a second string bar 621, a second bus bar 622, and a second lead 623.

[0152] The first current-carrying strip 611 is attached to the first side 131 of the second electrode layer 13, and the second current-carrying strip 621 is attached to the second side 132 of the second electrode layer 13. The first bus bar 612 and the second bus bar 622 are both located in the second region S2 and are close to the third side 133 of the second electrode layer 13. The third side 133 is between the first side 131 and the second side 132, and the third side 133 is opposite to the fourth side 134.

[0153] One end of the first bus bar 612 is connected to the first current-carrying strip 611, and the other end of the first bus bar 612 is connected to the first lead 613. The first lead 613 extends from the second region S2 to the outside of the thin-film solar cell 10. One end of the second bus bar 622 is connected to the second current-carrying strip 621, and the other end of the second bus bar 622 is connected to the second lead 623. The second lead 623 extends from the second region S2 to the outside of the thin-film solar cell 10.

[0154] The first bus bar 612, the second bus bar 622, the first current-draining strip 614, the second current-draining strip 624, the first lead 613, and the second lead 623 all have electrical conductivity.

[0155] As Figure 13 shown, if current-carrying strips are used for current drainage, the positive current-draining factor 61 includes the first current-draining strip 614, and the negative current-draining factor 62 includes the second current-draining strip 624. The first current-draining strip 614 is attached to the first side 131, and the first current-draining strip 614 extends from the first region S1 to the second region S2, and then extends from the second region S2 to the outside of the thin-film solar cell 10. The second current-draining strip 624 is attached to the second side 132, and the second current-draining strip 624 extends from the first region S1 to the second region S2, and then extends from the second region S2 to the outside of the thin-film solar cell 10.

[0156] After step S2160 or step S2260, the encapsulation method 200 further includes step S270, step S280, and step S290.

[0157] Step S270: Perform vacuum lamination on the thin-film solar cell encapsulation structure to obtain a laminated thin-film solar cell encapsulation structure.

[0158] It is worth mentioning that before performing vacuum lamination on the thin-film solar cell encapsulation structure, in the thin-film solar cell encapsulation structure, if the stress release layer 50 is provided between the thin-film solar cell 10 and the second encapsulation layer 40, then as Figure 17 shown, there is a gap L1 between the second encapsulation layer 40 and the cover plate 20 in the thickness direction of the thin-film solar cell 10. During the execution of step S270, as Figure 1As shown, when the first encapsulation layer 30 is under the external pressure provided by the lamination process, it is compressed in the thickness direction of the solar thin-film battery encapsulation structure, and the gap L1 gradually shrinks, causing the surface of the first encapsulation layer 30 in contact with the cover plate 20 and the surface of the second encapsulation layer 40 close to the cover plate 20 to tend to be in the same plane.

[0159] Similarly, if the second encapsulation layer 40 is provided between the solar thin-film battery 10 and the stress relief layer 50, that is, if the stress relief layer 50 is provided between the cover plate 20 and the second encapsulation layer 40, then as Figure 18 shown, there is a gap L1 between the stress relief layer 50 and the cover plate 20 in the thickness direction of the solar thin-film battery 10. During the execution of step S270, as Figure 2 shown, when the first encapsulation layer 30 is under the external pressure provided by the lamination process, it is compressed in the thickness direction of the solar thin-film battery encapsulation structure, and the gap L1 gradually shrinks, causing the surface of the first encapsulation layer 30 in contact with the cover plate 20 and the surface of the stress relief layer 50 close to the cover plate 20 to tend to be in the same plane.

[0160] It is worth mentioning that when the thickness of the first encapsulation layer is reduced by 10% to 50% after the lamination process, the sealing effect is the best. The thickness of the second encapsulation layer is close before and after lamination.

[0161] In step S270, the solar thin-film battery encapsulation structure 100 obtained in step S260 is laminated and formed. Specifically, first, the ambient temperature of the solar thin-film battery encapsulation structure 100 is adjusted to between 90 degrees Celsius and 160 degrees Celsius, and the solar thin-film battery encapsulation structure 100 is subjected to a vacuum treatment, and the duration of the vacuum treatment is controlled between 60 seconds and 2000 seconds. The vacuum-treated solar thin-film battery encapsulation structure 100 is subjected to a lamination process, and the duration of the lamination process is controlled between 60 seconds and 2000 seconds, and the lamination parameter value is controlled between 5 kPa and 100 kPa.

[0162] Step S280, provide a wiring factor 63 and dispose the wiring factor 63 on the surface of the cover plate 20 away from the solar thin-film battery 10.

[0163] In this step S280, the wiring factor 63 is disposed on the laminated solar thin-film battery 10, that is, the wiring factor 63 is disposed on the surface of the cover plate 20 of the laminated solar thin-film battery 10 away from the solar thin-film battery 10.

[0164] Step S290, electrically connect the wiring factor 63 to the negative current-carrying factor 62 extending outside the solar thin-film battery 10 and the positive current-carrying factor 61 extending outside the solar thin-film battery 10 respectively.

[0165] In this step S290, a soldering process can be used between the negative electrode current guiding factor 62 and the wiring factor 63 to achieve electrical connection between the negative electrode current guiding factor 62 and the wiring factor 63, and a soldering process can be used between the positive electrode current guiding factor 61 and the wiring factor 63 to achieve electrical connection between the positive electrode current guiding factor 61 and the wiring factor 63.

[0166] Certainly, there can be many other embodiments of this application. Without departing from the spirit and essential points of this application, those skilled in the art can make various corresponding changes and deformations according to this application. However, these corresponding changes and deformations should all fall within the protection scope of the appended claims of this application.

Claims

1. A packaging structure for a thin-film solar cell, characterized in that, Comprising: A thin-film solar cell; A cover plate disposed on the backlight side of the thin-film solar cell; A first encapsulation layer disposed around the circumferential side of the thin-film solar cell and extending in the thickness direction of the thin-film solar cell onto the cover plate. The first encapsulation layer, the cover plate, and the thin-film solar cell jointly enclose a containing space; A second encapsulation layer disposed within the containing space; And A stress release layer disposed within the containing space, and the stress release layer and the second encapsulation layer are stacked on the thin-film solar cell in the thickness direction.

2. The encapsulation structure according to claim 1, characterized in that The stress release layer is disposed between the thin-film solar cell and the second encapsulation layer, or the second encapsulation layer is disposed between the thin-film solar cell and the stress release layer.

3. The encapsulation structure according to claim 1, wherein The stress release layer includes at least one of a polytetrafluoroethylene material layer, an ethylene-tetrafluoroethylene copolymer material layer, a polyethylene terephthalate material layer, a polyimide material layer, a fluorinated ethylene propylene copolymer material layer, a perfluoroalkoxyethylene material layer, a polyvinylidene fluoride material layer, a polychlorotrifluoroethylene material layer, a polyacrylonitrile material layer, and the stress release layer is in the form of a solid thin film, a liquid coating, or a powder-like particle.

4. The encapsulation structure according to claim 1, wherein The thin-film solar cell includes a first electrode layer, a second electrode layer, and a photoactive conversion layer in the thickness direction. The photoactive conversion layer is disposed between the first electrode layer and the second electrode layer. Among them, the first encapsulation layer is disposed around the circumferential side of the photoactive conversion layer and the circumferential side of the second electrode layer.

5. The encapsulation structure according to claim 4, wherein The first electrode layer has a first region and a second region connected to the periphery of the first region; Among them, the second electrode layer and the photoactive conversion layer are both located in the first region. The first encapsulation layer and the photoactive conversion layer are on the same side of the first electrode layer, and the first encapsulation layer is located in the second region.

6. The encapsulation structure according to claim 5, characterized in that The cover plate has a third region and a fourth region connected to the periphery of the third region; Among them, in the thickness direction, the third region coincides with the first region, the fourth region coincides with the second region, the first end of the first encapsulation layer is located in the second region, the second end of the first encapsulation layer is disposed on the side of the cover plate close to the first electrode layer, and the second end is located in the fourth region. The first end and the second end are opposite to each other.

7. The encapsulation structure according to claim 4, characterized in that The encapsulation structure further includes: A positive current-drawing factor attached to the first side of the second electrode layer; A negative current-drawing factor attached to the second side of the second electrode layer, and the second side is opposite to the first side; and A wiring factor disposed on the side of the cover plate away from the thin-film solar cell, and the wiring factor is electrically connected to the positive current-drawing factor and the negative current-drawing factor respectively.

8. A method for encapsulating a thin-film solar cell, characterized in that, The method includes: Providing a thin-film solar cell; Providing a first encapsulation layer and disposing the first encapsulation layer around the circumferential side of the thin-film solar cell; Provide a second encapsulation layer and a stress release layer, and dispose the second encapsulation layer and the stress release layer on the thin-film solar cell; Provide a cover plate, and dispose the cover plate on the backlight side of the thin-film solar cell, so that the cover plate, the first encapsulation layer and the thin-film solar cell jointly enclose a containing space, and the second encapsulation layer and the stress release layer are located in the containing space, thereby obtaining a thin-film solar cell encapsulation structure.

9. A method for encapsulating a thin-film solar cell, characterized in that, The method includes: Provide a cover plate; Provide a second encapsulation layer and a stress release layer, and dispose the second encapsulation layer and the stress release layer on the cover plate; Provide a first encapsulation layer, and dispose the first encapsulation layer around the periphery of the second encapsulation layer and the periphery of the stress release layer; Provide a thin-film solar cell, and dispose the cover plate on the backlight side of the thin-film solar cell, so that the thin-film solar cell, the first encapsulation layer and the cover plate jointly enclose a containing space, and the second encapsulation layer and the stress release layer are located in the containing space, thereby obtaining a thin-film solar cell encapsulation structure.

10. The method according to claim 8 or 9, characterized in that, The thin-film solar cell includes a first electrode layer, a second electrode layer and a photoelectric conversion layer disposed between the first electrode layer and the second electrode layer. The first electrode layer has a first region and a second region connected to the periphery of the first region. Before the step of providing a thin-film solar cell, the method further includes: Perform an edge cleaning process on the thin-film solar cell, so that both the second electrode layer and the photoelectric conversion layer are located in the first region.

11. The method according to claim 10, wherein After the step of performing an edge cleaning process on the thin-film solar cell, the method further includes: Provide a positive current-carrying factor, and attach the positive current-carrying factor to the first side of the second electrode layer, and make part of the positive current-carrying factor extend outside the thin-film solar cell; Provide a negative current-carrying factor, and attach the negative current-carrying factor to the second side of the second electrode layer, and make part of the negative current-carrying factor extend outside the thin-film solar cell, and the second side is opposite to the first side.

12. The method according to claim 11, wherein The method further includes: Perform a vacuum lamination process on the thin-film solar cell encapsulation structure to obtain the laminated thin-film solar cell encapsulation structure; Provide a wiring factor, and dispose the wiring factor on the side of the cover plate away from the thin-film solar cell; Electrically connect the wiring factor to the negative current-carrying factor extending outside the thin-film solar cell and the positive current-carrying factor extending outside the thin-film solar cell respectively.

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