Flexible perovskite photovoltaic device packaging structure and preparation method thereof

Abstract

The invention belongs to the technical field of solar cell packaging, and particularly relates to a flexible perovskite photovoltaic device packaging structure and a preparation method thereof. The PI layer is arranged on the glass substrate, so that the technical risk that the substrate is separated due to static dissipation in the technological process is solved; the barrier layer is arranged between the PI layer and the first electrode layer, so that the problem of water and oxygen barrier stability of perovskite is solved; the glass substrate is used as the substrate for preparing the photovoltaic module, so that the precision of the photovoltaic module during preparation is improved; when the packaging layer is prepared, a position for attaching an electrode is reserved in advance, so that subsequent printing or attaching of the electrode is facilitated; the preparation method has relatively mature process route matching materials and equipment, and is easy for large-scale production.

Description

Technical Field

[0001] The present invention belongs to the technical field of solar cell packaging, and particularly relates to a packaging structure for a flexible perovskite photovoltaic device and a preparation method thereof. Background Art

[0002] At present, most of the substrates of flexible perovskite photovoltaic modules are prepared by the roll-to-roll process of flexible plastic substrates. Due to multiple precision laser etchings in the roll-to-roll process, there are technical problems such as poor repeat accuracy, difficult electrode lead-out, few packaging supporting equipment materials, and high implementation difficulty.

[0003] In this regard, in the existing Chinese patent literature (Publication No.: CN116761485A, Publication Date: September 15, 2023), a preparation method of a flexible perovskite battery is disclosed, and it is disclosed that a flexible substrate is attached to a glass substrate by means of electrostatic adsorption, and after the process is completed, the flexible substrate is peeled off by means of electrostatic elimination. However, the above operations do not consider how to avoid the technical risk of substrate detachment after electrostatic dissipation in the process, nor do they consider the problem of packaging accuracy, and there is no mature mass production case.

[0004] In view of this, the present invention is specifically proposed. Summary of the Invention

[0005] The purpose of the present invention is to overcome the above-mentioned disadvantages of the prior art and provide a packaging structure for a flexible perovskite photovoltaic device and a preparation method thereof to solve the problems of electrostatic dissipation and packaging accuracy in the process.

[0006] To achieve the above purpose, the present invention provides the following technical solutions:

[0007] On the one hand, the present invention provides a packaging structure for a flexible perovskite photovoltaic device, which includes a PI layer, a barrier layer, a functional layer, and a packaging layer stacked in sequence on a glass substrate. A first protective film is attached to the lower surface of the PI layer, and a second protective film is attached to the upper surface of the packaging layer; the functional layer includes a first electrode layer, a hole transport layer HTL, a perovskite layer, an electron transport layer ETL, and a second electrode layer stacked from bottom to top above the barrier layer;

[0008] Electrode leads are respectively arranged on two opposite sides of the first electrode layer for connecting and conducting electricity with a perovskite solar cell.

[0009] Specifically, the area of the second protective film is larger than the area of the packaging layer and smaller than the area of the first electrode layer;

[0010] The area of the encapsulation layer is larger than the area of the second electrode layer; the area of the second electrode layer is larger than the areas of the electron transport layer (ETL), the perovskite layer, and the hole transport layer (HTL), and the shapes and areas of the electron transport layer (ETL), the perovskite layer, and the hole transport layer (HTL) are the same;

[0011] Any side of the second electrode layer overlaps with the first electrode layer, and electrodes are led out through electrode leads on both sides of the first electrode layer; the area of the barrier layer is greater than or equal to the area of the PI layer; the area of the PI layer is greater than or equal to the area of the first electrode layer; the area of the first protective film is the same as the area of the barrier layer.

[0012] Specifically, the electrode leads are led out from opposite sides of the first electrode layer by means of printing or attaching auxiliary electrodes.

[0013] On the other hand, the present invention provides a method for preparing a flexible perovskite photovoltaic device encapsulation structure, and the specific method is as follows:

[0014] Step 1: Preparation of the PI layer: First, a polyamic acid solution (PAA) is coated on a glass substrate, and then annealed by heating to 300 °C to 450 °C to form a glass substrate with a transparent PI layer;

[0015] Step 2: Preparation of the barrier layer: At least one layer of a barrier layer to prevent water and oxygen penetration is deposited on the basis of the PI layer, and the thickness of the barrier layer is 100 nm to 500 nm;

[0016] Step 3: Preparation of the functional layer: The first electrode layer, the hole transport layer (HTL), the perovskite layer, the electron transport layer (ETL), and the second electrode layer are sequentially prepared on the basis of the barrier layer;

[0017] Step 4: Preparation of the encapsulation layer: First, an organic layer and an inorganic layer are alternately laminated on the basis of the functional layer by a thin film encapsulation method to prepare a thin film; and a position for printing or attaching electrode leads is reserved on the first electrode layer; then, a second protective film is attached to the upper surface of the prepared encapsulation layer; the materials of the inorganic layer include but are not limited to silicon nitride, silicon dioxide, and aluminum oxide, and the materials of the organic layer include but are not limited to epoxy resin, silicone, propyl acetate, and acrylate; the materials of the second protective film include but are not limited to TPT, TPE, TPC, CPC, PET, PA / PO, and ultra-thin glass;

[0018] Step 5: Preparation of the flexible substrate: The glass substrate and the PI layer are peeled off by laser irradiation, and the wavelength of the laser is 308 nm or 354 nm to obtain a flexible substrate and attach a first protective film to the lower surface of the PI layer. The peeled-off glass substrate can be reused after cleaning and polishing; the materials of the first protective film include but are not limited to TPT, TPE, TPC, CPC, PET, PA / PO, and ultra-thin glass;

[0019] Step 6. Extraction of electrode leads: The electrode leads are extracted from the opposite sides of the first electrode layer by means of printing or attaching the electrode leads, and the preparation of the encapsulation structure of the flexible perovskite photovoltaic device is completed.

[0020] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0021] By providing a PI layer on the glass substrate, the present invention solves the technical risk of the substrate detaching due to electrostatic dissipation during the process; by providing a barrier layer between the PI layer and the first electrode layer, the perovskite water and oxygen barrier stability problem is solved; by using a glass substrate as the substrate for preparing the photovoltaic module, the accuracy of the photovoltaic module during preparation is improved; when preparing the encapsulation layer, by reserving the position for attaching the electrode in advance, it is convenient for subsequent printing or attaching the electrode; the process route, supporting materials and equipment of this preparation method are relatively mature and are easy to scale up production. Description of the Drawings

[0022] The drawings herein are incorporated into the specification and form a part of the specification, and are used together with the specification to explain the principles of the present invention.

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0024] Figure 1 It is a schematic diagram of the preparation process flow of the encapsulation structure of the flexible perovskite photovoltaic device of the present invention. Detailed Embodiments

[0025] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present invention. On the contrary, they are only examples consistent with some aspects of the present invention detailed in the appended claims.

[0026] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to the drawings and embodiments.

[0027] Embodiment 1

[0028] This embodiment provides a packaging structure for a flexible perovskite photovoltaic device, which includes a PI layer, a barrier layer, a functional layer, and a packaging layer stacked in sequence on a glass substrate. A first protective film is attached to the lower surface of the PI layer, and a second protective film is attached to the upper surface of the packaging layer; the functional layer includes a first electrode layer, a hole transport layer (HTL), a perovskite layer, an electron transport layer (ETL), and a second electrode layer stacked from bottom to top above the barrier layer;

[0029] Electrode leads are respectively arranged on two opposite sides of the first electrode layer for connecting and conducting electricity with a perovskite solar cell.

[0030] Specifically, the area of the second protective film is larger than that of the packaging layer and smaller than that of the first electrode layer;

[0031] The area of the packaging layer is larger than that of the second electrode layer; the area of the second electrode layer is larger than those of the electron transport layer (ETL), the perovskite layer, and the hole transport layer (HTL), and the electron transport layer (ETL), the perovskite layer, and the hole transport layer (HTL) have the same shape and area;

[0032] One side of the second electrode layer overlaps with the first electrode layer, and electrodes are led out through the electrode leads on both sides of the first electrode layer; the area of the barrier layer is greater than or equal to that of the PI layer; the area of the PI layer is greater than or equal to that of the first electrode layer; the area of the first protective film is the same as that of the barrier layer.

[0033] Specifically, the electrode leads are led out from two opposite sides of the first electrode layer by means of printing or attaching auxiliary electrodes.

[0034] Embodiment 2

[0035] See Figure 1 As shown, on the basis of Embodiment 1, this embodiment provides a preparation method for a packaging structure of a flexible perovskite photovoltaic device. The specific method is as follows:

[0036] Step 1: Preparation of the PI layer: First, a polyamic acid (PAA) solution is coated on a glass substrate, and then heated to polymerize the polyamic acid (PAA) at 300°C to 450°C to form a PI layer (transparent thin film layer). After annealing, a glass substrate with a transparent PI layer is formed;

[0037] Step 2: Preparation of the barrier layer: A silicon nitride / aluminum oxide is deposited on the upper surface of the PI layer by other thin film deposition methods such as CVD / ALD / RPVD to form a barrier layer for preventing water and oxygen permeation, blocking water and oxygen from the PI layer or from the air, and avoiding water and oxygen from entering the perovskite layer and causing the failure of the perovskite layer. The thickness of the barrier layer is 100 nm to 500 nm;

[0038] Step 3, Preparation of the functional layer: On the basis of the barrier layer, a first electrode layer, a hole transport layer (HTL), a perovskite layer, an electron transport layer (ETL), and a second electrode layer are sequentially prepared;

[0039] Step 4, Preparation of the encapsulation layer: First, on the basis of the functional layer, an organic layer and an inorganic layer are alternately laminated by a thin-film encapsulation method to prepare a thin film, and a position for printing or attaching electrode leads is reserved on the first electrode layer; Then, a second protective film is attached to the upper surface of the prepared encapsulation layer to protect the entire component; Among them, the method of alternately laminating an organic layer and an inorganic layer by a thin-film encapsulation method can be: First, a polyacrylate polymer layer is formed on the second electrode layer, then a silicon nitride inorganic layer is formed, and then another polyacrylate polymer layer is formed. The purpose of this design is to better protect the basic device, prevent external water and oxygen from entering, and also better improve the flexibility of the perovskite solar cell. The materials of the inorganic layer include but are not limited to silicon nitride, silicon dioxide, and aluminum oxide. The materials of the organic layer include but are not limited to epoxy resin, silicone, polyacrylate, and acrylate; The material of the second protective film includes but is not limited to TPT, TPE, TPC, CPC, PET, PA / PO, and ultra-thin glass;

[0040] Step 5, Preparation of the flexible substrate: The glass substrate and the PI layer are peeled off by laser irradiation. The wavelength of the laser is 308 nm or 354 nm; A flexible substrate is obtained and a first protective film is attached to the lower surface of the PI layer to achieve upper and lower protection. The peeled glass substrate can be reused after cleaning and grinding; The material of the first protective film includes but is not limited to TPT, TPE, TPC, CPC, PET, PA / PO, and ultra-thin glass;

[0041] Step 6, Extraction of electrode leads: The electrode leads are extracted from the opposite sides of the first electrode layer by printing or attaching electrode leads, which is convenient for series connection with adjacent perovskite solar cell devices to prepare a flexible component, and a flexible perovskite photovoltaic device encapsulation structure is obtained.

[0042] In summary, the preparation method of the present application solves the problem that the accuracy of the existing roll-to-roll process cannot be guaranteed, and solves the technical problem that the substrate is easily detached during the electrostatic adsorption process.

[0043] The above are only specific embodiments of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention.

[0044] It should be understood that the present invention is not limited to the above-described content and various modifications and changes can be made without departing from its scope. The scope of the present invention is only limited by the appended claims.

Claims

1. A flexible perovskite photovoltaic device packaging structure, characterized in that, It includes a PI layer, a barrier layer, a functional layer, and a packaging layer that are sequentially stacked on a glass substrate. A first protective film is attached to the lower surface of the PI layer, and a second protective film is attached to the upper surface of the packaging layer; the functional layer includes a first electrode layer, a hole transport layer, a perovskite layer, an electron transport layer, and a second electrode layer that are stacked from bottom to top above the barrier layer; Electrode leads are respectively arranged on two opposite sides of the first electrode layer for connecting and conducting electricity with a perovskite solar cell.

2. The flexible perovskite photovoltaic device packaging structure according to claim 1, wherein The area of the second protective film is larger than that of the packaging layer and smaller than that of the first electrode layer; The area of the packaging layer is larger than that of the second electrode layer; the area of the second electrode layer is larger than those of the electron transport layer, the perovskite layer, and the hole transport layer, and the electron transport layer, the perovskite layer, and the hole transport layer have the same shape and area; One side of the second electrode layer overlaps with the first electrode layer, and electrodes are led out through the electrode leads on both sides of the first electrode layer; the area of the barrier layer is greater than or equal to that of the PI layer; the area of the PI layer is greater than or equal to that of the first electrode layer; the area of the first protective film is the same as that of the barrier layer.

3. The flexible perovskite photovoltaic device packaging structure according to claim 1, characterized in that The electrode leads are led out from two opposite sides of the first electrode layer by means of printing or attaching auxiliary electrodes.

4. The preparation method of the flexible perovskite photovoltaic device packaging structure according to any one of claims 1-3, characterized in that, The specific method is as follows: Step 1: Preparation of the PI layer: First, a polyamic acid solution is coated on a glass substrate, and then it is annealed after being heated to a specified temperature to form a glass substrate with a transparent PI layer; Step 2: Preparation of the barrier layer: At least one barrier layer for preventing water and oxygen permeation is deposited on the basis of the PI layer; Step 3: Preparation of the functional layer: The first electrode layer, the hole transport layer, the perovskite layer, the electron transport layer, and the second electrode layer are sequentially prepared on the basis of the barrier layer; Step 4: Preparation of the packaging layer: First, a film is prepared by alternately compounding an organic layer and an inorganic layer on the basis of the functional layer by means of thin-film encapsulation, and a position for printing or attaching electrode leads is reserved on the first electrode layer; then a second protective film is attached to the upper surface of the prepared packaging layer; Step 5: Preparation of the flexible substrate: The glass substrate and the PI layer are peeled off to obtain a flexible substrate, and a first protective film is attached to the lower surface of the PI layer; Step 6: Leading out of the electrode leads: The electrode leads are led out from two opposite sides of the first electrode layer by means of printing or attaching electrode leads to complete the preparation of the packaging structure of the flexible perovskite photovoltaic device.

5. The preparation method of the flexible perovskite photovoltaic device packaging structure according to claim 4, wherein, In Step 1, the specified temperature is 300 °C to 450 °C.

6. The preparation method of the flexible perovskite photovoltaic device encapsulation structure according to claim 4, characterized in that, In Step 2, the thickness of the barrier layer is 100 nm to 500 nm.

7. The preparation method of the flexible perovskite photovoltaic device packaging structure according to claim 4, characterized in that, In Step 4, the materials of the inorganic layer include but are not limited to silicon nitride, silicon dioxide, and aluminum oxide, and the materials of the organic layer include but are not limited to epoxy resin, silicone, propyl acetate, and acrylate.

8. The preparation method of the flexible perovskite photovoltaic device packaging structure according to claim 4, characterized in that, In Step 4, the materials of the second protective film include but are not limited to TPT, TPE, TPC, CPC, PET, PA / PO, and ultra-thin glass.

9. The preparation method of the flexible perovskite photovoltaic device packaging structure according to claim 4, wherein, In Step 5, the glass substrate and the PI layer are peeled off by means of laser irradiation.

10. The preparation method of the flexible perovskite photovoltaic device packaging structure according to claim 4, characterized in that In step 5, the material of the first protective film includes but is not limited to TPT, TPE, TPC, CPC, PET, PA / PO, and ultra-thin glass.

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