Carrier with anti-rotation feature

Abstract

The carrier includes a carrier body, a finger attached to the carrier body, and an anti-rotation element attached to the carrier body. The fingers are configured to support a treatment kit ring. The anti-rotation element is configured to be disposed adjacent a flat inner surface of the process kit ring to prevent rotation of the process kit ring.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to devices and methods for transporting a content, and more particularly to a carrier for transporting a content, such as a process kit ring in a substrate processing system. Background Art

[0002] In substrate processing and other electronic processing, systems including robotic arms are typically used to transport substrates between chambers. Summary of the Invention

[0003] The following is a simplified summary of the present disclosure to provide a basic understanding of some aspects of the present disclosure. This summary is not an extensive overview of the present disclosure. It is neither intended to identify key or critical elements of the present disclosure nor to delineate any scope of any specific implementation of the present disclosure or any scope of the claims. Its sole purpose is to present some concepts of the present disclosure in a simplified form as a prelude to the more detailed description that is presented later.

[0004] In an aspect of the present disclosure, a carrier includes a carrier body, fingers attached to the carrier body, and an anti-rotation element attached to the carrier body. The fingers are configured to support a process kit ring. The anti-rotation element is configured to be disposed adjacent to a flat inner surface of the process kit ring to prevent the process kit ring from rotating.

[0005] In another aspect of the present disclosure, the anti-rotation element is a carrier. The anti-rotation element includes an attachment portion forming an opening. The attachment portion is configured to receive a corresponding fastener through each opening to attach the attachment portion to the carrier body of the carrier. The anti-rotation element further includes one or more protruding portions extending from the attachment portion. The one or more protruding portions are configured to be disposed adjacent to a flat inner surface of a process kit ring disposed on the carrier to prevent the process kit ring from rotating.

[0006] In another aspect of the present disclosure, a carrier includes fingers configured to support a process kit ring. The carrier further includes an anti-rotation element configured to prevent the process kit ring from rotating. The anti-rotation element includes a first protrusion configured to be disposed adjacent to a first portion of a curved inner surface of the process kit ring on a first side of the flat inner surface. The anti-rotation element further includes a second protrusion configured to be disposed adjacent to a second portion of the curved inner surface of the process kit ring on a second side of the flat inner surface. Brief Description of the Drawings

[0007] The present disclosure is illustrated by way of example and not limitation, in the figures of the accompanying drawings, like reference numerals indicate like elements. It should be noted that different references to "one" or "an" embodiment in the present disclosure do not necessarily refer to the same embodiment, and such references mean at least one.

[0008] Figure 1 A processing system according to certain embodiments is shown.

[0009] Figures 2A - 2C A view of a carrier according to certain embodiments is shown.

[0010] Figures 3A - 3C A view of an anti-rotation element according to certain embodiments is shown.

[0011] Figures 4A - 4B A view of a carrier supporting a processing kit ring according to certain embodiments is shown.

[0012] Figure 5 A carrier supporting a processing kit ring according to certain embodiments is shown. DETAILED DESCRIPTION

[0013] Described herein are techniques related to carriers including anti-rotation features (e.g., semiconductor processing kit carriers having features that prevent rotation during transportation).

[0014] A manufacturing system is used to manufacture products. For example, a substrate processing system is used to process and manufacture finished substrates. Robots are used to move objects into, out of, and within the substrate processing system. Objects include substrates, processing kit rings, etc. The objects are to be correctly positioned (e.g., correctly aligned) within the substrate processing system. For example, a processing kit ring is to be set in a processing chamber in a specific orientation. In traditional systems, objects become incorrectly positioned (e.g., rotated, misaligned) during transfer into, out of, and / or within the substrate processing system. Devices (e.g., aligner devices and local center finder (LCF) devices) are used to attempt to correct the position of the objects (e.g., rotation, alignment). These devices can only correct a threshold number of misalignments. Traditionally, the amount of incorrect positioning (e.g., incorrect rotation, misalignment) of objects (e.g., as a result of transportation) may be greater than the threshold amount of correction that these devices can effect. Incorrectly positioned objects result in non-uniformity of substrate processing, damage to parts, opening of the substrate processing system, and corresponding re-commissioning processes, reduced yield, reduced substrate quality, increased user time, increased energy usage, etc.

[0015] The devices, systems, and methods disclosed herein provide carriers including anti-rotation features.

[0016] The carrier includes a carrier body, fingers attached to the carrier body, and a rotation blocking element attached to the carrier body. The fingers are configured to support a processing kit ring (e.g., the lower surface of the processing kit ring will be disposed on the upper surface of the fingers). The anti-rotation element (e.g., anti-rotation feature) is configured to be disposed adjacent to the flat inner surface of the processing kit ring to prevent the processing kit ring from rotating.

[0017] The devices, systems, and methods disclosed herein have advantages over traditional solutions. The carrier of the present disclosure prevents an object disposed on the carrier from rotating. Compared with traditional solutions, this enables more correct positioning of the object. This results in increased substrate processing uniformity, less damage to components, less opening of the substrate processing system, less re-adjustment processing, increased throughput, improved substrate quality, reduced user time, reduced energy consumption, and so on.

[0018] The carrier of the present disclosure

[0019] Although some portions of this specification relate to a processing kit ring, this specification can be applied to different types of contents (e.g., applied to different types of chamber components such as edge rings, showerheads, masks, mask processors, half-rings, etc. outside the processing kit ring). Although some portions of this specification relate to a substrate processing system, this specification can be applied to other types of systems.

[0020] Figure 1 A processing system 100 (e.g., a substrate processing system, a semiconductor manufacturing system, etc.) according to certain embodiments is shown. The processing system 100 includes a factory interface 101 and load ports 128 (e.g., load ports 128A-D). In some embodiments, the load ports 128A-D are directly mounted to (e.g., sealed to) the factory interface 101. A cassette system 130 (e.g., a cassette, a front-opening unified pod (FOUP), a processing kit cassette system, etc.) is configured to be detachably coupled (e.g., docked) to the load ports 128A-D. Refer to Figure 1, the enclosure system 130A is coupled to the load port 128A, the enclosure system 130B is coupled to the load port 128B, the enclosure system 130C is coupled to the load port 128C, and the enclosure system 130D is coupled to the load port 128D. In some embodiments, one or more enclosure systems 130 are coupled to the load port 128 to transfer wafers and / or other substrates into and out of the processing system 100. Each enclosure system 130 seals the corresponding load port 128. In some embodiments, the first enclosure system 130A docks to the load port 128A (e.g., for replacing a used process kit ring). Once one or more such operations are performed, the first enclosure system 130A then disengages from the load port 128A, and then the second enclosure system 130 (e.g., a FOUP containing wafers) docks to the same load port 128A. In some embodiments, a carrier (e.g., including an anti-rotation element attached to the carrier body) is used to transfer contents between the enclosure system 130 and other parts of the processing system 100.

[0021] In some embodiments, the load port 128 includes a front interface that forms a vertical opening (or a substantially vertical opening). The load port 128 further includes a horizontal surface for supporting the enclosure system 130 (e.g., a cassette, a process kit enclosure system). Each enclosure system 130 (e.g., a FOUP for wafers, a process kit enclosure system) has a front interface that forms a vertical opening. The size of the front interface of the enclosure system 130 is designed to engage (e.g., seal) with the front interface of the load port 128 (e.g., the vertical opening of the enclosure system 130 is substantially the same size as the vertical opening of the load port 128). The enclosure system 130 is placed on the horizontal surface of the load port 128, and the vertical opening of the enclosure system 130 is aligned with the vertical opening of the load port 128. The front interface of the enclosure system 130 is interconnected with the front interface of the load port 128 (e.g., clamping, fixing, sealing the front interface). The bottom plate (e.g., the base plate) of the enclosure system 130 has features (e.g., load features that engage with load port movement pin features, such as recesses or sockets, load port features for pin clearance, and / or docking tray latch clamping features of the enclosure system), and the features engage with the horizontal surface of the load port 128. The same load port 128 is used for different types of enclosure systems 130 (e.g., process kit enclosure systems, cassettes containing wafers, etc.).

[0022] In some embodiments, the enclosure system 130 (e.g., the process kit enclosure system) includes one or more of the contents 110 (e.g., one or more of a process kit ring, an empty process kit ring carrier, a process kit ring disposed on the process kit ring carrier, a placement verification wafer, components of the processing system 100, etc.). In some examples, the enclosure system 130 is coupled to the factory interface 101 (e.g., via the load port 128) to enable automatic transfer of the process kit ring on the process kit ring carrier into the processing system 100 for replacement of a used process kit ring.

[0023] In some embodiments, the processing system 100 also includes first vacuum ports 103a, 103b that couple the factory interface 101 to corresponding degassing chambers 104a, 104b. Second vacuum ports 105a, 105b are coupled to the corresponding degassing chambers 104a, 104b and are disposed between the degassing chambers 104a, 104b and the transfer chamber 106 to facilitate transfer of wafers and contents 110 (e.g., process kit rings) into the transfer chamber 106. In some embodiments, the processing system 100 includes and / or uses one or more degassing chambers 104 and a corresponding number of vacuum ports 103, 105 (e.g., the processing system 100 includes a single degassing chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transfer chamber 106 includes a plurality of processing chambers 107 (e.g., four processing chambers 107, six processing chambers 107, etc.) disposed around and coupled thereto. The processing chambers 107 are coupled to the transfer chamber 106 through respective ports 108, such as slit valves, etc. In some embodiments, the factory interface 101 is at a higher pressure (e.g., atmospheric pressure), while the transfer chamber 106 is at a lower pressure (e.g., vacuum). Each degassing chamber 104 (e.g., load lock, pressure chamber) has a first door (e.g., the first vacuum port 103) that seals the degassing chamber 104 from the factory interface 101 and a second door (e.g., the second vacuum port 105) that seals the degassing chamber 104 from the transfer chamber 106. When the first door is open and the second door is closed, the contents are transferred from the factory interface 101 into the degassing chamber 104, the first door is closed, the pressure in the degassing chamber 104 is reduced to match that of the transfer chamber 106, the second door is opened, and the contents are transferred out of the degassing chamber 104. A local center finding (LCF) device is used to align the contents in the transfer chamber 106 (e.g., before entering the processing chamber 107, after leaving the processing chamber 107).

[0024] In some embodiments, the processing chamber 107 includes one or more of an etch chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or a plasma enhanced version thereof), an annealing chamber, etc.

[0025] The factory interface 101 includes a factory interface robot 111. The factory interface robot 111 includes a robotic arm, such as a Selective Compliance Assembly Robot Arm (SCARA) robot. Examples of SCARA robots include 2-link SCARA robots, 3-link SCARA robots, 4-link SCARA robots, etc. The factory interface robot 111 includes an end effector at the end of the robotic arm. The end effector is configured to pick up and process specific objects, such as wafers. Alternatively or additionally, the end effector is configured to process objects such as carriers and / or process kit rings (edge rings). The robotic arm has one or more links or members (e.g., wrist member, upper arm member, forearm member, etc.) that are configured to be moved to move the end effector to different positions in different directions.

[0026] The factory interface robot 111 is configured to transfer objects between a housing system 130 (e.g., cassette, FOUP) and degassing chambers 104a, 104b (or load ports). Although conventional systems are associated with opening (e.g., disassembling, breaking seals, contaminating) the processing system (e.g., factory interface, transfer chamber, processing chamber) to replace different types of contents, the processing system 100 is configured to facilitate the transfer and replacement of contents without the operator having to open (e.g., disassemble, break seals, contaminate) the processing system 100. Thus, in some embodiments, a sealed environment of the interior space including the housing system 130 and the interior space of the factory interface 101 is maintained during the replacement of contents (e.g., via a carrier including anti-rotation elements).

[0027] The transfer chamber 106 includes a transfer chamber robot 112. The transfer chamber robot 112 includes a robotic arm with an end effector at the end of the robotic arm. The end effector is configured to process specific objects, such as wafers. In some embodiments, the transfer chamber robot 112 is a SCARA robot, but in some embodiments has fewer links and / or fewer degrees of freedom than the factory interface robot 111.

[0028] The controller 109 controls various aspects of the processing system 100. The controller 109 is and / or includes a computing device such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc. The controller 109 includes one or more processing devices, which are general-purpose processing devices in some embodiments, such as a microprocessor, a central processing unit, etc. More specifically, in some embodiments, the processing device is a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word set (VLIW) microprocessor, or a processor implementing other instruction sets or a combination of implemented instruction sets. In some embodiments, the processing device is one or more dedicated processing devices such as an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc. In some embodiments, the controller 109 includes a data storage device (e.g., one or more disk drives and / or solid state drives), a main memory, a static memory, a network interface, and / or other elements. In some embodiments, the controller 109 executes instructions to perform any one or more of the methods or processes described herein. The instructions may be stored on a computer-readable storage medium, which may include one or more of the main memory, the static memory, the secondary storage, and / or the processing device (during the execution of the instructions). In some embodiments, the controller 109 receives signals from the factory interface manipulator 111 and the wafer transfer chamber robot arm 112 and sends controls thereto.

[0029] Figure 1 Schematically shows the transfer of the contents 110 (e.g., a carrier supporting a processing kit ring) into the processing chamber 107. According to one aspect of the present disclosure, the contents 110 are removed from the enclosure system 130 by the factory interface robot 111 located in the factory interface 101. The factory interface robot 111 transfers the contents 110 through one of the first vacuum ports 103a, 103b to the corresponding degassing chamber 104a, 104b. The transfer chamber robot 112 located in the transfer chamber 106 removes the contents 110 from one of the degassing chambers 104a, 104b through the second vacuum port 105a or 105b. The transfer chamber robot 112 moves the contents 110 into the transfer chamber 106, where the contents 110 are transferred to the processing chamber 107 through the corresponding port 108. Although not shown for clarity in Figure 1 the transfer of the contents 110 includes the transfer of the processing kit ring provided on the processing kit ring carrier, the transfer of the empty processing kit ring carrier, the transfer of the placement verification wafer, etc.

[0030] Figure 1Illustrated is an example of the transfer of the contents 110. However, other examples are also conceivable. In some examples, it is contemplated that the enclosure system 130 is coupled to the transfer chamber 106 (e.g., via a load port mounted to the transfer chamber 106). The contents 110 will be loaded from the transfer chamber 106 into the processing chamber 107 by the transfer chamber robot 112. Additionally, in some embodiments, the contents 110 are loaded in a substrate support pedestal (SSP). In some embodiments, an additional SSP is positioned in communication with the factory interface 101 opposite the illustrated SSP. The processed contents 110 (e.g., used processing kit rings) will be removed from the processing system 100 in a manner opposite to any of the ways described herein. When using multiple enclosure systems 130 or a combination of an enclosure system 130 and SSPs, in some embodiments, one SSP or enclosure system 130 will be used for the unprocessed contents 110 (e.g., new processing kit rings), while another SSP or enclosure system 130 will be used for receiving the processed contents 110 (e.g., used processing kit rings).

[0031] The processing system 100 includes chambers such as the factory interface 101 (e.g., equipment front end module (EFEM)) and adjacent chambers (e.g., load port 128, enclosure system 130, SSP, degassing chamber 104 such as load lock, etc.) that are adjacent to the factory interface 101. One or more chambers are sealed (e.g., each chamber is sealed). The adjacent chambers are sealed to the factory interface 101. In some embodiments, an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is provided into one or more chambers (e.g., the factory interface 101 and / or adjacent chambers) to provide one or more inert environments. In some examples, the factory interface 101 is an inert EFEM that maintains an inert environment within the factory interface 101 (e.g., inert EFEM microenvironment) such that the user does not need to enter the factory interface 101 (e.g., the processing system 100 is configured to have no manual access within the factory interface 101).

[0032] In some embodiments, a gas flow (e.g., an inert gas, nitrogen) is provided into one or more chambers (e.g., the factory interface 101) of the processing system 100. In some embodiments, the gas flow is greater than the leakage through the one or more chambers to maintain a positive pressure within the one or more chambers. In some embodiments, the inert gas within the factory interface 101 is recycled. In some embodiments, a portion of the inert gas is exhausted. In some embodiments, the gas flow of the non-recycled gas entering the factory interface 101 is greater than the exhausted gas flow and the gas leakage to maintain a positive pressure of the inert gas within the factory interface 101. In some embodiments, the factory interface 101 is coupled to one or more valves and / or pumps to provide the gas flow into and out of the factory interface 101. A processing device (e.g., of the controller 109) controls the gas flow into and out of the factory interface 101. In some embodiments, the processing device receives sensor data from one or more sensors (e.g., an oxygen sensor, a humidity sensor, a motion sensor, a door actuation sensor, a temperature sensor, a pressure sensor, etc.) and determines the flow rate of the inert gas flowing into and / or out of the factory interface 101 based on the sensor data.

[0033] The enclosure system 130 allows the transfer and replacement of different types of contents 110 (e.g., via a carrier including an anti-rotation element) without opening the sealed environment within the factory interface 101 and the adjacent chambers. The enclosure system 130 seals to the load port 128 in response to docking on the load port 128. The enclosure system 130 provides purge port access such that the interior of the enclosure system 130 can be purged before opening the enclosure system 130 to minimize interference with the inert environment within the factory interface 101.

[0034] Figure 2A -C shows a view of the carrier 200 according to certain embodiments. Figure 2A The carrier 200 showing the support processing kit ring 250 according to certain embodiments is shown. Figure 2B The carrier 200 without the processing kit ring 250 according to certain embodiments is shown. Figure 2C The carrier 200 without the fingers 220 and without the anti-rotation element 230 is shown.

[0035] The carrier 200 includes a carrier body 210 (e.g., a substantially rigid body), fingers 220, an anti-rotation element 230, and a fastener 240 (e.g., a screw, a bolt, a rivet, etc.). The fingers 220 are attached (e.g., each finger is fastened by the fastener 240) to the carrier body 210. The fingers 220 are configured to support a processing kit ring 250. In some embodiments, the carrier 200 includes at least three fingers 220. In some embodiments, the carrier 200 includes three fingers 220. Each finger 220 may form a lip and the lower surface of the processing kit ring 250 may be disposed on the lip. In some embodiments, the fingers 220 are configured to horizontally align the processing kit ring 250 relative to the carrier body 210.

[0036] The anti-rotation element 230 is attached (e.g., fastened by the fastener 240) to the carrier body 210. The anti-rotation element 230 is configured to be disposed adjacent to the flat inner surface 252 of the processing kit ring 250 to prevent the processing kit ring 250 from rotating. In some embodiments, the anti-rotation element 230 includes a thermoplastic. In some embodiments, the anti-rotation element 230 includes polybenzimidazole (PBI) fibers.

[0037] The carrier body 210 may form an opening 212 (e.g., a window, a slot, etc.). In some embodiments, the opening 212 is used by tool automation (e.g., by an aligner device, by an LCF device) to look through the carrier 200 (e.g., to observe an object on the other side of the carrier 200) to ensure placement accuracy. In some embodiments, the opening 212 is used to reduce the mass of the carrier 200 (e.g., the carrier body 210).

[0038] Reducing the mass of the carrier 200, allowing observation through the carrier body 210, allowing a light path for light or an object to pass through the carrier body 210, etc.

[0039] The processing kit ring 250 may be circular in shape (e.g., a ring) having a substantially flat upper surface, a substantially flat lower surface, a curved outer surface, a curved inner surface, and a flat inner surface 252. The flat inner surface 252 may be used to position the processing kit ring 250.

[0040] Refer to Figure 2C, the carrier body 210 can form an opening 216 configured to receive a fastener 240. In some embodiments, the opening 216 is threaded to removably receive the fastener 240. In some embodiments, the fastener 240 is threaded to be fixed to the threaded opening 216. In some embodiments, the fastener 240 has threads to be fixed to the threaded fingers 220 and / or anti-rotation elements 230. In some embodiments, each fastener 240 includes a first portion and a second portion (e.g., a bolt and a nut, etc.), and the first portion and the second portion are configured to be fixed to each other to fix the fingers 220 and / or anti-rotation elements 230 to the carrier body 210.

[0041] The fingers 220 and / or anti-rotation elements 230 are configured to be detachably attached to the carrier body 210 through the fastener 240 and the opening 216. In some embodiments, each of the fingers 220 and / or anti-rotation elements 230 forms an opening, and the fastener 240 is configured to detachably attach the fingers 220 and / or anti-rotation elements 230 to the carrier body 210 by passing through the opening of the fingers 220 and / or anti-rotation elements 230 inserted and the opening 216 of the carrier body 210.

[0042] In some embodiments, different groups of fingers 220 are used for different types of contents. In some examples, different types of contents include new contents and used contents (e.g., a first group of fingers 220 fixed to the carrier body 210 for transporting used contents and a second group of fingers 220 fixed to the same carrier body 210 for transporting new contents). In some examples, different types of contents include contents of different sizes and / or shapes (e.g., a first group of fingers 220 fixed to the carrier body 210 for transporting contents of a first size and / or shape, and a second group of fingers 220 fixed to the same carrier body 210 for transporting contents of different sizes and / or shapes). In some examples, different types of contents include one or more of the following: a processing kit ring, a chamber element of a substrate processing system, a used chamber element of a substrate processing system, a showerhead, an element having a substantially circular perimeter (e.g., an inner perimeter, an outer perimeter), etc.

[0043] In some embodiments, different groups of fingers 220 are used for different conditions. In some embodiments, each finger 220 in the first group of fingers 220 includes a first material configured for a first condition, and each finger in the second group of fingers includes a second material configured for a second condition different from the first condition. In some examples, the materials of the fingers 220 include one or more of the following: polyethylene terephthalate (PET), ceramic materials, polytetrafluoroethylene (PTFE) (e.g., Teflon TM)、Ultra-High Molecular Weight (UHMW) polyethylene, absorbent materials, non-absorbent materials, coating materials, deformable materials, electrostatic dissipation materials, etc. In some embodiments, the finger 220 has a specific conductivity (e.g., below perfect conductivity, allowing dissipation at a controlled rate, preventing high arc discharge conduction paths, some conductivity such as a dissipation range from about 10 5 ohms to about 10 9 ohms). In some examples, the different conditions include one or more of the following: corrosion conditions, cleaning conditions, electrostatic conditions, specific processes (e.g., substrate manufacturing processes, atomic layer deposition, chemical vapor deposition, physical vapor deposition, their plasma-enhanced versions, etc.), specific chemicals (e.g., fluorine, acids, bases, etc.), specific temperature ranges (e.g., high temperature), specific pressure ranges (e.g., high pressure), atmospheric pressure, vacuum pressure, etc.

[0044] In some embodiments, the carrier 200 is a customized mechanical adapter to allow automated handling of the process kit ring, moving through tools designed for wafer processing. The finger 220 allows maintenance of the carrier 200 and replacement with different finger material types according to the needs of a specific process kit ring. The carrier 200 with replaceable fingers 220 enables the current process kit ring and allows future compatibility with process kit rings of various sizes and material types.

[0045] In some embodiments, different rigid bodies 210 are used for different contents and / or different conditions. In some embodiments, each carrier body 210 is made of a different type of material. In some examples, the carrier body 210 is made of one or more of the following: carbon fiber, aluminum, aluminum casting plates (e.g., ), hard anodized aluminum, ceramic materials, titanium, etc. In some embodiments, the carrier body 210 is the same or similar material as a robotic blade (e.g., end effector). In some embodiments, the carrier 200 does not have any gluing elements (e.g., no adhesives). In some embodiments, the carrier 200 does not have any press-fit elements. In some embodiments, all features of the carrier 200 are mechanically joined (e.g., through fasteners 240) or machined into the carrier body 210.

[0046] In some embodiments, the carrier 200 has pads for anti-slip interfaces (e.g., automated interfaces) (e.g., mushroom pads, perfluoroelastomer pads, 8475 friction pads, nine Kalrez mushroom pads, calibration mushrooms, pads integral with the carrier body 210) with atmospheric robotic end effectors (e.g., Figure 1 of the factory interface robot 111) and vacuum robotic end effectors (e.g.,Figure 1 transfer chamber robot 112). In some embodiments, the pads are used for anti-slip connection with one or more of the LCF device, the aligner device, etc. In some embodiments, the carrier 200 has pads (e.g., aluminum pads, pads integral with the carrier body 210) for positioning the carrier 200 in the enclosure system (e.g., Figure 1 enclosure system 130, FOUP) and load lock (e.g., Figure 1 degassing chamber 104).

[0047] In some embodiments, the carrier body 210 has a substantially flat (e.g., essentially flat) lower surface. In some embodiments, except for the pads on the lower surface of the carrier body 210, the lower surface of the carrier body 210 is substantially flat. In some embodiments, the carrier 200 (e.g., the carrier body 210) does not have movement positioning features (e.g., does not have movement positioning features on the lower surface of the carrier body 210). In some embodiments, the carrier body 210, the anti-rotation element 230, and / or the fingers 220 have one or more coatings. In some examples, the fingers 220 and / or the anti-rotation element 230 have coatings configured for transporting contents under specific conditions (e.g., suitable for certain chemicals and / or processes). In some embodiments, the fingers 220 and / or have one or more coatings providing one or more coefficients of friction to allow the contents to align on the fingers. In some examples, the sidewalls of each finger 220 have a lower coefficient of friction than the first upper surface of each finger to allow the contents to slide down along the sidewalls and stop at the first upper surface. In some examples, the upper portion of the sidewall of each finger 220 has a lower coefficient of friction than the lower portion of the sidewall of each finger 220 to allow the contents to slide down along the upper portion of each sidewall and decelerate at the lower portion of each sidewall.

[0048] In some embodiments, the profile of the carrier body 210 is different from Figures 2A - 2C the profile shown. In some embodiments, the size, shape, number, etc. of the opening 212 and / or the opening 216 are different from those shown in Figures 2A - 2C .

[0049] In some embodiments, the different fasteners 240 have one or more of different sizes, different shapes, different materials, etc. In some embodiments, the materials of the fasteners 240 include one or more of aluminum, ceramic, stainless steel, electropolished (EP) stainless steel, etc.

[0050] In some embodiments, the fingers 220 have lips that support the contents downward. In some embodiments, the fingers 220 are disposed around the carrier body 210 to support contents having a circular perimeter, such as a process kit ring, a nozzle, etc. In some embodiments, the fingers 220 are replaceable to support contents with different perimeter sizes. In some embodiments, the fingers 220 are attached to the carrier body 210 through slots that allow the position of the fingers 220 to be adjustable (e.g., radially from the central portion of the carrier body 210) to support contents with different perimeter sizes. In some embodiments, when the fingers 220 wear over time, the position of the fingers 220 is adjustable (e.g., radially from the central region 280 of the carrier body 210) to continue to support contents with the same perimeter size. In some embodiments, once the fingers 220 are worn and can no longer support contents with the same perimeter size, the worn fingers 220 are replaced with new fingers 220.

[0051] The carrier 200 includes one or more lower surfaces (e.g., pads) that are configured to engage with the end effector of a robotic arm. The carrier 200 (e.g., the carrier body 210) includes one or more lower surfaces (e.g., the solid planar central region 214) that are configured to engage with a vacuum chuck.

[0052] In some embodiments, the carrier body 210 forms a protrusion (e.g., a boss) around each opening 216. In some embodiments, the boss is a prominent feature of the carrier body 210. In some embodiments, the protrusion is used to position the fingers 220 on the carrier body 210. In some embodiments, the fingers 220 have recesses that match the protrusions. In some embodiments, the protrusion enables the fingers 220 to be attached to the carrier body 210 in the correct orientation.

[0053] In some embodiments, the size and shape of the carrier 200 are designed to provide one or more gaps between the process kit ring 250 and one or more portions of the perimeter of the carrier 200. In some embodiments, the aligner device and / or the LCF device use one or more gaps to align the carrier 200 and / or the process kit ring 250. In some examples, one or more gaps enable a light beam to be used to detect the flat inner surface 252 of the process kit ring 250 or other registration features. In some embodiments, the lift rod uses one or more gaps to be able to lift the process kit ring 250 away from the carrier 200 (e.g., within a processing chamber). In some embodiments, the perimeter of the carrier 200 is configured to engage with the shelf of an enclosure system (e.g., a FOUP) of a substrate processing system.

[0054] In some embodiments, the carrier 200 is a semiconductor processing kit carrier to prevent rotation during transportation. The carrier 200 may have features (e.g., anti-rotation element 230) to prevent rotation during transportation (e.g., rotation of the processing kit ring). The carrier 200 including the anti-rotation element 230 may prevent the processing kit ring 250 from rotating relative to the carrier 200 within the FOUP during transportation through the facility. The anti-rotation element 230 may fix the processing kit ring 250 during transportation.

[0055] Alignment of the processing kit ring 250 in the processing chamber may be used for proper operation of the processing chamber. An aligner device may be used to correct minor alignment errors (e.g., within a few degrees) of the processing kit ring 250 on the carrier 200. The processing kit ring 250 may be closely aligned relative to the robot end effector and the transfer station on the carrier 200 such that the aligner device can correct small rotational misalignments between the processing kit ring 250 and the carrier 200.

[0056] Protrusions (e.g., two fingers) of the anti-rotation element 230 may contact the inner diameter of the processing kit ring 250 on the flat inner surface (e.g., flat alignment feature) of the processing kit ring 250. The protrusions (e.g., two fingers) may prevent the processing kit ring 250 from rotating.

[0057] The anti-rotation element 230 may assist in aligning the processing kit ring with the carrier and may prevent the processing kit ring from rotating relative to the carrier 200 during transportation. The alignment of the processing kit ring with the carrier may be less than or equal to plus or minus 2.5 degrees. The alignment of the processing kit ring with the processing chamber may be less than or equal to approximately plus or minus 0.6 degrees.

[0058] The anti-rotation element 230 may be referred to as a rotation blocker (e.g., made of PBI). In some embodiments, the carrier body 210 is made of aluminum and the anti-rotation element 230 is made of PBI.

[0059] The flat inner surface 252 of the processing kit ring 250 may be similar to features (e.g., notches, flats, etc.) of a substrate (e.g., silicon wafer, notch of the substrate), an electrostatic chuck (e.g., flat portion of the electrostatic chuck), etc. with alignment of components and contents.

[0060] Figures 3A - 3C A view of an anti-rotation element 330 (e.g., Figures 2A - 2B of the anti-rotation element 230) according to certain embodiments is shown.

[0061] In some embodiments, the anti-rotation element includes a first protrusion and a second protrusion. The first protrusion may be configured to be disposed near the processing kit ring 350 (e.g., Figure 2A of the processing kit ring 250, Figure 1The first portion of the curved inner surface of the content 110). The second protrusion may be configured to be disposed on the second side of the flat inner surface 252 near the second portion of the curved inner surface of the processing kit ring 250.

[0062] In some embodiments, the anti-rotation element 330 includes an outer surface and a lower surface. The outer surface is configured to be disposed near the curved inner surface of the processing kit ring 350, and the lower surface is configured to be disposed below the processing kit ring 350 to block light between the curved inner surface and the outer surface of the processing kit ring 350.

[0063] In some embodiments, the anti-rotation element 330 includes a lower surface forming a recess, and the recess is configured to engage with a protrusion on the upper surface of the carrier body 310 (e.g., Figures 2A - 2C the upper surface of the carrier body 210).

[0064] In some embodiments, one or more protrusions are formed on the upper surface of the carrier body 310, and the protrusions are disposed near the corresponding outer surface of the anti-rotation element 330 to prevent the anti-rotation element 330 from rotating relative to the carrier body 310.

[0065] In some embodiments, the anti-rotation element 330 maintains alignment between one or more of the following: maintaining the processing kit ring 350 and the carrier 300 (e.g., Figures 2A - 2C the carrier 200) within approximately plus or minus 2.5 degrees, or maintaining the processing kit ring 350 and the processing chamber within approximately plus or minus 0.6 degrees.

[0066] In some embodiments, the anti-rotation element 330 is configured to be disposed near the flat inner surface of the processing kit ring 350 without blocking the flat inner surface 352.

[0067] In some embodiments, the anti-rotation element 330 includes an attachment portion 334 forming an opening, and the attachment portion 334 is configured to receive a corresponding fastener 340 (e.g., Figures 2A - 2B the fastener 240) through each of the plurality of openings to attach the attachment portion 334 to the carrier body 310 of the carrier 300. The anti-rotation element 330 may include one or more protruding portions 332 extending from the attachment portion 334, and the one or more protruding portions 332 are configured to be disposed near the flat inner surface of the processing kit ring 350 disposed on the carrier 300 to prevent the processing kit ring 350 from rotating.

[0068] In some embodiments, the carrier 300 includes fingers configured to support the processing kit ring 350. The carrier 300 may further include an anti-rotation element 330 configured to prevent the processing kit ring 350 from rotating. The anti-rotation element 330 may include a first protrusion and a second protrusion. The first protrusion may be configured to be disposed on a first side of the flat inner surface of the processing kit ring 350 adjacent to a first portion of the curved inner surface of the processing kit ring 350. The second protrusion may be configured to be disposed on a second side of the flat inner surface adjacent to a second portion of the curved inner surface of the processing kit ring 350.

[0069] In some embodiments, at least one of the anti-rotation element 330 or the fingers is integrally formed with the carrier body 310 of the carrier 300.

[0070] The carrier 300 may allow the flat inner surface 352 to be visible (e.g., scanned for alignment). The carrier 300 may limit the rotation of the processing kit ring 350 to about plus or minus one degree. A protrusion (e.g., a side surface) on the upper surface of the carrier body 310 may prevent the rotation of the anti-rotation element 330. A portion of the anti-rotation element 330 may be configured to be located below the processing kit ring 350 to block light (e.g., a light-blocking feature that does not contact the processing kit ring 350, blocking light at an aligner device and / or an LCF device).

[0071] The carrier 300 may align the processing kit ring 350 and the carrier 300 at plus / minus one degree (e.g., from the central axis of the carrier 300). The processing kit ring 350 and the carrier 300 may be aligned on the same axis (e.g., through the center of the anti-rotation element 330). The aligner device can rotate the processing kit ring 350 and the carrier 300 about plus or minus 2.5 degrees along the same axis.

[0072] In some embodiments, the processing kit ring 350 does not contact the anti-rotation element 330 (e.g., there is a space between the inner surface of the processing kit ring and the outer surface of the anti-rotation element 330, and there is a space between the lower surface of the processing kit ring 350 and the upper surface of the anti-rotation element 330).

[0073] As Figure 3C shown, the distal end of the anti-rotation element 330 may have an inclined outer surface that is inclined toward the upper surface on which the processing kit ring 350 is disposed.

[0074] Figures 4A - 4B A carrier 400 (e.g., Figure 2A the carrier 200 of Figure 3B the processing kit ring 350 of Figures 2A - 2C the carrier 200 of Figures 3A - 3CThe carrier 400 may have an anti-rotation element 430 including multiple parts (e.g., a first anti-rotation element 430 disposed on a first side of the flat inner surface 452 and a second anti-rotation element 430 disposed on a second side of the flat inner surface 452).

[0075] The carrier 400 may allow the flat inner surface 452 on the process kit ring 450 to be visible (eg, for scanning for alignment).

[0076] Figure 5 A support processing kit ring 550 (e.g., Figure 2A Processing kit ring 250, Figure 3B The processing kit ring 350, Figures 4A - 4B of one or more of the processing kit rings 450, etc.) of the carrier 500 (e.g., Figures 2A - 2C The carrier 200, Figures 3A - 3C The carrier 300, Figures 4A - 4B 4. The carrier 500 may include an anti-rotation element 530 disposed against the flat inner surface 552. The carrier 500 may be basic and easy to manufacture.

[0077] The foregoing description sets forth many specific details, such as examples of specific systems, elements, methods, etc., in order to provide a good understanding of many embodiments of the present disclosure. However, it will be apparent to those skilled in the art that at least some embodiments of the present disclosure can be practiced without these specific details. In other cases, well-known elements or methods are not described in detail, or well-known elements or methods are presented in a simple drawing format to avoid unnecessary confusion of the present disclosure. Therefore, the specific details set forth are merely exemplary. Specific embodiments may be different from these example details, and are still contemplated to be within the scope of the present disclosure.

[0078] Throughout the specification, reference to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in at least one embodiment. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing in various places throughout the specification do not necessarily refer to the same embodiment. In addition, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or". When the term "about" or "approximately" is used herein, this is intended to mean that the nominal value given is accurate to within ±10%.

[0079] Although the operations of the methods herein are shown and described in a particular order, the order of operations of each method may be changed so that certain operations are performed in a reverse order, so that certain operations are performed at least in part concurrently with other operations. In another embodiment, the instructions or sub-operations of the different operations are performed in an intermittent and / or alternating manner.

[0080] As used herein, the terms "above", "beneath", "between", "disposed on", and "on" refer to the relative position of one layer or element of material with respect to other layers or elements. For example, a layer disposed above, over, or beneath another layer may be in direct contact with the other layer or may have one or more intervening layers. Additionally, a layer disposed between two layers may be in direct contact with the two layers or may have one or more intervening layers. Similarly, unless otherwise expressly stated, a feature disposed between two features may be in direct contact with the adjacent features or may have one or more intervening layers.

[0081] It should be understood that the above description is intended to be illustrative and not restrictive. Many other embodiments will be apparent to those of skill in the art upon reading and understanding the above description. Accordingly, the scope of the disclosure should be determined with reference to the appended claims and to the full scope of equivalents to which such claims are entitled.

Claims

1. A carrier, the carrier comprising: A carrier body; A plurality of fingers attached to the carrier body, wherein the plurality of fingers are configured to support a processing kit ring; And An anti-rotation element attached to the carrier body, wherein the anti-rotation element is configured to be disposed adjacent to a flat inner surface of the processing kit ring to prevent the processing kit ring from rotating.

2. The carrier according to claim 1, wherein, The anti-rotation element comprises: A first protrusion configured to be disposed adjacent to a first portion of a curved inner surface of the processing kit ring on a first side of the flat inner surface; and A second protrusion configured to be disposed adjacent to a second portion of the curved inner surface of the processing kit ring on a second side of the flat inner surface.

3. The carrier according to claim 1, wherein, The anti-rotation element comprises: An outer surface configured to be disposed adjacent to a curved inner surface of the processing kit ring; and A lower surface configured to be disposed below the processing kit ring to block light between the curved inner surface and the outer surface.

4. The carrier according to claim 1, wherein, The anti-rotation element comprises a lower surface forming a recess, the recess being configured to engage with a protrusion on an upper surface of the carrier body.

5. The carrier according to claim 1, wherein, One or more protrusions are formed on an upper surface of the carrier body, the one or more protrusions being disposed adjacent to corresponding outer surfaces of the anti-rotation element to prevent the anti-rotation element from rotating relative to the carrier body.

6. The carrier according to claim 1, wherein the anti-rotation element maintains alignment between one or more of the following: Between the processing kit ring and the carrier within about plus or minus 2.5 degrees; or Between the processing kit ring and a processing chamber within about plus or minus 0.6 degrees.

7. The carrier according to claim 1, wherein, The plurality of fingers are configured to horizontally align the processing kit ring relative to the carrier body.

8. The carrier according to claim 1, wherein, The anti-rotation element comprises a thermoplastic.

9. The carrier according to claim 1, wherein The anti-rotation element comprises polybenzimidazole (PBI) fibers.

10. The carrier according to claim 1, wherein the anti-rotation element is configured to be disposed adjacent to the flat inner surface of the processing kit ring without blocking the flat inner surface.

11. An anti-rotation element for a carrier, the anti-rotation element comprising: An attachment portion forming a plurality of openings, wherein the attachment portion is configured to receive a corresponding fastener through each of the plurality of openings to attach the attachment portion to a carrier body of the carrier; And One or more protruding portions extending from the attachment portion, wherein the one or more protruding portions are configured to be disposed adjacent to a flat inner surface of a processing kit ring disposed on the carrier to prevent the processing kit ring from rotating.

12. The anti-rotation element according to claim 11, wherein, The one or more protruding portions comprise: A first protrusion configured to be disposed adjacent to a first portion of a curved inner surface of the processing kit ring on a first side of the flat inner surface; and A second protrusion configured to be disposed adjacent to a second portion of the curved inner surface of the processing kit ring on a second side of the flat inner surface.

13. The anti-rotation element according to claim 11, wherein, Each of the one or more protrusions includes: an outer surface configured to be disposed adjacent to the curved inner surface of the processing kit ring; and a lower surface configured to be disposed below the processing kit ring to block light between the curved inner surface and the outer surface.

14. The anti-rotation element according to claim 11, wherein, The anti-rotation element includes a lower surface forming a recess, the recess being configured to engage a protrusion on the upper surface of the carrier body.

15. The anti-rotation element according to claim 11, wherein the anti-rotation element maintains alignment between: the processing kit ring and the carrier within about plus or minus 2.5 degrees; or the processing kit ring and the processing chamber within about plus or minus 0.6 degrees.

16. The anti-rotation element according to claim 11, wherein, The anti-rotation element includes a thermoplastic.

17. The anti-rotation element according to claim 11, wherein, The anti-rotation element includes polybenzimidazole (PBI) fibers.

18. The anti-rotation element according to claim 11, wherein the anti-rotation element is configured to be disposed adjacent to the flat inner surface of the processing kit ring without blocking the flat inner surface.

19. A carrier, the carrier comprising: a plurality of fingers configured to support a processing kit ring; and an anti-rotation element configured to prevent rotation of the processing kit ring, the anti-rotation element including: a first protrusion configured to be disposed adjacent to a first portion of the curved inner surface of the processing kit ring on a first side of the flat inner surface of the processing kit ring; and a second protrusion configured to be disposed adjacent to a second portion of the curved inner surface of the processing kit ring on a second side of the flat inner surface.

20. The carrier according to claim 19, wherein at least one of the anti-rotation element or the plurality of fingers is integrally formed with the carrier body of the carrier.

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