Miniature LED chip and manufacturing method thereof
By designing the groove structure on the electrode pads of the micro LED chip, the problem of conductive ball flow in the hot pressing process is solved, ensuring the stability and reliability of the electrical connection.
CN120345375APending Publication Date: 2025-07-18SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202480005855.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-01-30
- Filing Date
- 2024-01-29
- Publication Date
- 2025-07-18
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Figure CN120345375A_ABST
Abstract
The micro LED chip includes: a first semiconductor layer doped with an N-type dopant; a second semiconductor layer disposed under the first semiconductor layer and doped with a P-type dopant; an active layer disposed between the first semiconductor layer and the second semiconductor layer to generate light; and electrode pads disposed on a lower surface of the second semiconductor layer, in which each electrode pad has a recessed structure in which a recessed depth increases from an edge of the electrode pad toward a center thereof.
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