An automatic assembling device for computer mainboard accessories

Abstract

This invention belongs to the field of motherboard assembly technology and discloses an automatic assembly equipment for computer motherboard components, including an ultrasonic cleaner. Above the ultrasonic cleaner are an inner and outer distributed guide mechanism and a drive mechanism. The guide mechanism is a ring structure, and multiple clamping mechanisms are suspended at equal intervals on the guide mechanism. The drive mechanism controls the clamping mechanisms to move along a predetermined direction, with the bottom of some clamping mechanisms submerged in the ultrasonic cleaner. This invention sets up a drive mechanism and a guide mechanism, and the tops of the multiple clamping mechanisms are simultaneously connected to both. During the slow reciprocating movement of the multiple clamping mechanisms controlled by the drive mechanism, the structural characteristics of the guide mechanism are used to achieve undulating movement of the clamping mechanisms. This allows the PCB substrate clamped at the bottom of the clamping mechanisms to be submerged in the ultrasonic cleaner for cleaning, and achieves automated loading and unloading of the PCB substrate, further improving the overall efficiency of computer motherboard assembly.

Description

Technical Field

[0001] This invention relates to the field of motherboard assembly technology, specifically to an automatic assembly device for computer motherboard components. Background Technology

[0002] In modern electronics manufacturing, the computer motherboard, as the core hub of electronic devices, directly determines product performance and market competitiveness through the precision and efficiency of its manufacturing process. The installation process of computer motherboard components involves multiple precision steps, including motherboard pretreatment, surface mounting, component installation, and testing and calibration, each requiring the coordinated operation of various specialized equipment. For example, in the motherboard pretreatment stage, a cleaning machine is used to clean the PCB substrate surface, removing dust, oil, oxide layers, and other impurities. Then, a solder paste printer precisely applies solder paste to the substrate pads, laying the foundation for subsequent component soldering. In the surface mounting process, a high-speed, high-precision pick-and-place machine is used to precisely solder surface-mount components such as resistors, capacitors, and chips onto the substrate surface.

[0003] Currently, some production processes still employ a combination of manual labor and semi-automatic equipment. Taking the PCB substrate cleaning process as an example, the traditional procedure is as follows: operators must strictly follow cleaning protocols, manually placing the PCB substrate at a specific angle and spacing in a cleaning basket or fixture. Then, the cleaning basket or fixture is slowly immersed manually into a cleaning tank containing chemical cleaning agents. During the cleaning process, operators must manually control the immersion time according to the degree of substrate contamination and intermittently shake the cleaning basket to enhance the cleaning effect. After cleaning, a special tool is used to remove the substrate from the cleaning solution.

[0004] While this manual intervention method can achieve substrate cleaning, it has significant drawbacks. Firstly, the efficiency of manual operation is limited by the operator's skill level and physical condition. Industry statistics show that a single person can process approximately 300-500 PCB substrates per day, which is insufficient to meet the demands of large-scale, batch production. Secondly, during manual operation, the grease and skin flakes carried by the operator's hands, as well as dust particles from the external environment, can easily introduce secondary contamination when frequently touching the substrate. Furthermore, improper control of clamp installation force or non-standard handling can lead to 8%-12% of damage to the substrate surface, such as scratches and component displacement, severely impacting product yield. In addition, the positional accuracy error of manual loading and unloading is typically greater than ±0.5mm, significantly lower than the ±0.1mm accuracy standard required by subsequent automated equipment. This results in problems such as board jamming and identification errors during equipment connection, restricting the automation level and production cycle of the entire production line. Summary of the Invention

[0005] The purpose of this invention is to provide an automated assembly device for computer motherboard components, which aims to improve the problem of high manual involvement and low efficiency in substrate cleaning.

[0006] The present invention is implemented as follows: an automatic assembly device for computer motherboard components includes an ultrasonic cleaner. A guide mechanism and a drive mechanism are arranged inside and outside the ultrasonic cleaner. The guide mechanism is a ring structure. Multiple clamping mechanisms are suspended at equal intervals on the guide mechanism. The drive mechanism controls the clamping mechanisms to move along a predetermined direction, and the bottom of some clamping mechanisms is submerged in the ultrasonic cleaner. An adjustment mechanism is provided at both ends of the ultrasonic cleaner, and the adjustment mechanism is sequentially connected to the multiple clamping mechanisms.

[0007] Preferably, the drive mechanism includes a rectangular chain and four sprockets distributed at the corners of the chain. The four sprockets are connected by bearing seats and evenly mounted on two brackets. The brackets are L-shaped and the bottom of the brackets is connected to the ultrasonic cleaner. The central shaft of one of the sprockets is connected to the power output shaft of the first motor. A tension wheel is also engaged on the side of the chain and is connected to the bracket.

[0008] Preferably, the guiding mechanism includes two rings of support rails distributed vertically, with a support frame connected to the sides of the two rings of support rails, and the ends of the support frames connected to the bracket; a first guide rail and a second guide rail connected end to end are provided on the inner side of the support rails, with the first guide rail located below the second guide rail, and a connecting rod installed at the end of the second guide rail connected to the bracket.

[0009] Preferably, the first guide rail and the second guide rail are located on the inner side of the chain, the support guide rail is located on the outer side of the chain, and multiple clamping mechanisms are distributed along the circumference of the chain, and the clamping mechanisms contact the guide rail and the support guide rail simultaneously.

[0010] Preferably, the clamping mechanism includes a support tube, a lifting plate that passes through the support tube, and multiple first clamping plates and second clamping plates disposed at the bottom of the lifting plate. The lifting plate is configured as an inverted T-shaped structure. The multiple first clamping plates and second clamping plates are alternately installed at the horizontal section of the lifting plate, and the second clamping plates are stationary relative to the lifting plate. The first clamping plates are movably connected to the lifting plate.

[0011] Preferably, a connecting plate is fixedly installed on one side of the support tube, and two pulleys distributed vertically are connected to the other side via a bearing seat. The connecting plate is connected to a chain, and the two pulleys are respectively fitted to two rings of support guide rails. Limiting plates are provided on the side of the two pulleys that are far apart from each other. The ends of the two limiting plates that are close to each other are in contact with their respective adjacent support guide rails, and the ends of the two limiting plates that are far apart from each other are respectively sleeved on their respective threaded columns. At the same time, the limiting rod installed on the threaded column is installed through the limiting groove of the limiting plate.

[0012] Preferably, a connecting column is fixedly installed at the vertical section of the lifting plate, a sleeve is fitted at the end of the connecting column, and an arc-shaped column is fixedly installed at the end of the sleeve. The central angle of the arc-shaped column is greater than or equal to 180° and is fitted on the guide rail. A slot is provided at the bottom of the support tube, the bottom of the slot is set as an opening, and the connecting column is set through the slot.

[0013] Preferably, the horizontal section of the lifting plate is provided with a snap-fit ​​groove with an end opening along its length. A first snap-fit ​​frame and a second snap-fit ​​frame are fixedly installed on the top of the first clamping plate and the second clamping plate, respectively, and the first snap-fit ​​frame and the second snap-fit ​​frame are sleeved on the horizontal section of the lifting plate. Multiple first clamping plates are threaded onto the same threaded rod, the end of the threaded rod is connected to a worm gear, and a worm is meshed on the side of the worm gear. The worm gear and the worm are installed on the same frame, which is connected to the lifting plate. A driven gear is installed at the end of the worm. Multiple second clamping plates are connected by bolts and sleeved on the same brake plate. A fixed end plate installed at the end of the brake plate is connected to the brake plate.

[0014] Preferably, the adjusting mechanism includes a drive gear and a second motor. The drive gear is connected to the connecting frame via a bearing housing and is mounted on the connecting frame. The second motor is also mounted on the connecting frame, and the power output shaft of the second motor is connected to the central shaft of the drive gear. A bottom frame is fitted at the bottom of the connecting frame. A locking pin installed on the inner side wall of the bottom frame extends into a locking groove on the side wall of the connecting frame. The telescopic end of the telescopic cylinder installed on the bottom frame is connected to the connecting frame. The drive gear can mesh with the driven gear.

[0015] Preferably, multiple paired first baffles and second baffles are provided at both ends of the upper side of the ultrasonic cleaner. The multiple first baffles are fixedly installed on the same base plate, which is installed on the ultrasonic cleaner and has a sliding groove. The multiple second baffles are fixedly installed on the same sliding plate, which is installed in the sliding groove and has an adjusting screw threaded through a threaded hole in the base plate at the end of the sliding plate.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. This invention sets up a driving mechanism and a guiding mechanism, and the tops of multiple clamping mechanisms are simultaneously connected to the driving mechanism and the guiding mechanism. During the process of the driving mechanism controlling the multiple clamping mechanisms to move slowly back and forth, the structural characteristics of the guiding mechanism are used to realize the undulating movement of the clamping mechanisms. In this way, the PCB substrate clamped at the bottom of the clamping mechanism can be immersed in the ultrasonic cleaning machine for cleaning. This realizes the automated loading and unloading of PCB substrate cleaning, further improving the overall efficiency of computer motherboard assembly and reducing the labor intensity of workers.

[0018] 2. The clamping mechanism of the present invention includes a pair of first clamping plates and second clamping plates, with the second clamping plates fixedly installed relative to the lifting plate and the first clamping plates movably sleeved on the lifting plate. This allows multiple first clamping plates to move synchronously under external force, and the distance between the first clamping plates and the second clamping plates to be adjusted, thereby achieving the clamping and releasing of the PCB substrate.

[0019] 3. The present invention provides two sets of adjustment mechanisms distributed at both ends of the ultrasonic cleaner. After the clamping mechanism moves to the side of the adjustment mechanism, the two sets of adjustment mechanisms work to adjust the clamping mechanism to two opposite states, that is, to reduce or increase the distance between the first clamping plate and the second clamping plate. This facilitates the picking up or placing of the PCB substrate from the fixture or neatly on the fixture, and realizes the automatic loading and unloading of the PCB substrate.

[0020] 4. The tooling of the present invention includes a first baffle and a second baffle respectively mounted on a base plate and a sliding plate. The sliding plate is movably mounted on the base plate. At the same time, the sliding plate can be moved relative to the base plate by rotating the adjusting screw, so as to realize the adjustment of the relative position of the first baffle and the second baffle, thereby making the tooling adaptable to PCB substrates of different thicknesses. Attached Figure Description

[0021] Figure 1 This is a first structural schematic diagram of the entire invention;

[0022] Figure 2 This is a second structural schematic diagram of the entire invention;

[0023] Figure 3 This is a first structural schematic diagram of the ultrasonic cleaner, drive mechanism, clamping mechanism, and guide mechanism of the present invention;

[0024] Figure 4 This is a second structural schematic diagram of the ultrasonic cleaner, drive mechanism, clamping mechanism, and guide mechanism of the present invention;

[0025] Figure 5 This is a third structural schematic diagram of the ultrasonic cleaner, drive mechanism, clamping mechanism, and guide mechanism of the present invention;

[0026] Figure 6 This is a schematic diagram of the ultrasonic cleaning machine of the present invention;

[0027] Figure 7 This is a schematic diagram of the drive mechanism of the present invention;

[0028] Figure 8 This is a schematic diagram of the guiding mechanism of the present invention;

[0029] Figure 9 This is a schematic diagram of the clamping mechanism of the present invention;

[0030] Figure 10This is a schematic diagram of the first structure of the support tube of the present invention;

[0031] Figure 11 This is a schematic diagram of the second structure of the support tube of the present invention;

[0032] Figure 12 This is a schematic diagram of the lifting plate of the present invention;

[0033] Figure 13 This is a schematic diagram of the structure of the first clamping plate and the second clamping plate of the present invention;

[0034] Figure 14 This is a schematic diagram of the structure of the first clamping plate of the present invention;

[0035] Figure 15 This is a schematic diagram of the structure of the second clamping plate of the present invention;

[0036] Figure 16 This is a schematic diagram of the adjustment mechanism of the present invention;

[0037] Figure 17 This is a structural schematic diagram of the connecting frame and bottom frame of the present invention;

[0038] Figure 18 This is a schematic diagram of the structure of the first baffle and the second baffle of the present invention;

[0039] Figure 19 This is a schematic diagram of the structure of the first baffle of the present invention;

[0040] Figure 20 This is a schematic diagram of the structure of the second baffle of the present invention.

[0041] In the diagram: 1. Ultrasonic cleaning machine; 11. Mesh plate; 12. First baffle; 13. Second baffle; 14. Sliding clamp; 15. Base plate; 16. Sliding groove; 17. Adjusting screw; 2. Robotic arm; 3. Fully automatic solder paste printing machine; 4. Piece mounter; 5. Insertion machine; 6. Drive mechanism; 61. Chain; 62. Bracket; 63. Sprocket; 64. Tensioner; 65. First motor; 7. Clamping mechanism; 71. Support tube; 711. Connecting plate; 712. Slot; 713. Limiting rod; 714. Stud; 72. Lifting plate; 721. Connecting column; 722. Sleeve; 723. Arc-shaped column; 724. Clamp 73. First clamping plate; 731. Threaded rod; 732. First snap-fit ​​frame; 733. Worm gear; 734. Driven gear; 735. Worm wheel; 74. Second clamping plate; 741. Brake plate; 742. Second snap-fit ​​frame; 743. Fixed end plate; 75. Pulley; 751. Limiting plate; 752. Limiting groove; 8. Guide mechanism; 81. Support guide rail; 82. Support frame; 83. First guide rail; 84. Second guide rail; 85. Connecting rod; 9. Adjustment mechanism; 91. Second motor; 92. Drive gear; 93. Connecting frame; 94. Base frame; 95. Telescopic cylinder; 96. Slot; 97. Snap-fit ​​post. Detailed Implementation

[0042] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0043] The following description, in conjunction with the accompanying drawings and specific embodiments, provides further details: Example 1

[0044] like Figure 1 , Figure 2As shown in the publicly available technology, the automatic assembly of computer motherboards and components generally involves several steps: First, a cleaning machine cleans the PCB substrate to remove dust, oil, and oxide layers. The PCB substrate removed from the cleaning machine then enters a dryer for drying. A fully automatic solder paste printer (3) precisely applies solder paste to the pads, preparing for component soldering. A pick-and-place machine (4) precisely solders SMD components onto the PCB surface or mounts high-pin-density chips in BGA, QFP, or other packages. A reflow oven melts the solder paste, soldering the components to the PCB. An automatic insertion machine (5) picks up memory slots, PCIe slots, etc., aligns them with PCB holes, and inserts the components, with the pins soldered by molten solder waves. The automatic assembly of the computer motherboard is achieved through the above and other equipment (such as a multi-axis automatic screw fastening machine). If two sets of equipment are placed close together, a robotic arm (2) can be installed between adjacent machines to transfer the motherboard. The fully automatic solder paste printer (3), pick-and-place machine (4), insertion machine (5), and dryer are all publicly available and will not be described in detail here.

[0045] In order to further improve the overall efficiency of computer motherboard assembly and reduce the labor intensity of workers, this embodiment adds a corresponding structure to the existing ultrasonic cleaning machine 1 to realize continuous cleaning and automatic loading and unloading of batch PCB substrates.

[0046] Before introducing the added structure, let's briefly introduce the already disclosed ultrasonic cleaning machine 1, which includes an ultrasonic generator, ultrasonic transducer, cleaning tank, heating and temperature control system, liquid level sensor, PLC controller, and touch screen. The ultrasonic generator converts 220V / 380V AC power into high-frequency electrical signals (typically 20-130kHz) to drive the transducer; the ultrasonic transducer converts the high-frequency electrical signals into mechanical vibrations (ultrasound), exciting the cleaning fluid to generate a cavitation effect; the heating and temperature control system includes heating elements, temperature sensors, etc., to increase the temperature of the cleaning fluid (typically 40-70℃), enhancing the oil dissolving ability and cavitation effect efficiency; the PLC controller and touch screen integrate the setting of parameters such as cleaning time, temperature, and power, and support multiple program storage. Some ultrasonic cleaning machines 1 can even be equipped with a circulating filtration system, including a centrifugal pump, filter tank, backwashing device, etc., to filter impurities in the cleaning fluid, extend service life, and improve cleaning accuracy. A detachable mesh plate 11 can also be installed on the bottom inner side of the ultrasonic cleaner 1, which can support and hold the PCB substrate when manually cleaning the PCB substrate.

[0047] like Figure 3-5As shown, the added structure includes a drive mechanism 6, a guide mechanism 8, an adjustment mechanism 9, and multiple clamping mechanisms 7. The guide mechanism 8 and the drive mechanism 6 are distributed internally and externally above the ultrasonic cleaner 1. The guide mechanism 8 is a ring structure, and the multiple clamping mechanisms 7 are suspended at equal intervals on the guide mechanism 8. At the same time, the clamping mechanisms 7 are connected to the drive mechanism 6. Therefore, when the drive mechanism 6 is working, it controls the clamping mechanisms 7 to move slowly and cyclically in a predetermined direction. That is, after the clamping mechanisms 7 clamp multiple PCB substrates from one end of the ultrasonic cleaner 1, they drive the multiple PCB substrates to move up and down, thereby controlling the PCB substrates to be immersed in the ultrasonic cleaner 1 and allowing sufficient time to complete the cleaning. After cleaning, they are removed from the ultrasonic cleaner 1 and then neatly placed at the other end of the ultrasonic cleaner 1 under the operation of the clamping mechanisms 7, thus completing the cleaning of the PCB substrates.

[0048] In order to adjust the state of the clamping mechanism 7 and realize the clamping and releasing of the PCB substrate, an adjustment mechanism 9 is provided at both ends of the ultrasonic cleaner 1. The adjustment mechanism 9 is connected to multiple sets of clamping mechanisms 7 one by one through transmission, so that the same set of clamping mechanisms 7 can be adjusted to two opposite states with the cooperation of two sets of adjustment mechanisms 9.

[0049] In addition, in order to place multiple PCB substrates that have not been cleaned side by side at one end of the ultrasonic cleaner 1, or to place multiple cleaned PCB substrates neatly at the other end of the ultrasonic cleaner 1, fixtures are provided at both ends of the upper side of the ultrasonic cleaner 1. The fixtures are provided with multiple parallel grooves. After the bottom of the PCB substrate is inserted into the groove, it can be stably placed on the fixture.

[0050] like Figure 9 As shown, in order to stably clamp the PCB substrate using the clamping mechanism 7, the clamping mechanism 7 includes a support tube 71, a lifting plate 72, and multiple first clamping plates 73 and second clamping plates 74. The lifting plate 72 is configured with an inverted T-shaped structure, and its vertical section passes through the support tube 71. The support tube 71 is connected to the drive mechanism 6 and the guide mechanism 8, enabling the support tube 71 to be stably installed while simultaneously controlling the synchronous movement of the support tube 71 and the lifting plate 72. The structural characteristics of the guide mechanism 8 are used to force the lifting plate 72 to move up and down, facilitating the immersion of the PCB substrate in the cleaning solution for cleaning. The number of first clamping plates 73 and second clamping plates 74 is equal, and they are alternately installed on the horizontal section of the lifting plate 72. Therefore, the first clamping plates 73 and second clamping plates 74 are paired in pairs to form a clamp. In addition, the first clamping plate 73 is movably connected to the lifting plate 72, that is, the first clamping plate 73 can move relative to the second clamping plate 74 under the action of external force, so as to adjust the distance between the first clamping plate 73 and the second clamping plate 74, and provide support for clamping and releasing the PCB substrate.

[0051] like Figure 13-15As shown, a buckle groove 724 with an end opening is provided on the horizontal section of the lifting plate 72 along its length direction. A first buckle frame 732 and a second buckle frame 742 are fixedly provided on the top of the first clamping plate 73 and the second clamping plate 74, respectively. The first buckle frame 732 and the second buckle frame 742 are sleeved on the horizontal section of the lifting plate 72.

[0052] like Figure 15 As shown, multiple second clamping plates 74 can be connected by bolts and fitted onto the same brake plate 741. The fixed end plate 743 installed at the end of the brake plate 741 is connected to the brake plate 741 by bolts. Alternatively, the second snap-fit ​​frame 742 can be directly connected to the bottom of the lifting plate 72 by bolts. Both of these methods can achieve a relatively static installation of the second clamping plates 74 and the lifting plate 72.

[0053] like Figure 14 As shown, multiple first clamping plates 73 are threaded onto the same threaded rod 731. The end of the threaded rod 731 is connected to a worm gear 735. A worm 733 is meshed on the side of the worm gear 735. The worm gear 735 and the worm 733 are mounted on the same frame, which is connected to a lifting plate 72. When the worm gear 735 and the worm 733 are stably installed, the rotation of the worm gear 733 can control the rotation of the worm gear 735, which in turn drives the threaded rod 731 to rotate. This forces the multiple first clamping plates 73 to move synchronously relative to the lifting plate 72, thereby achieving the clamping and releasing of multiple PCB substrates.

[0054] like Figure 14 , Figure 16 As shown, a driven gear 734 is installed at the end of the worm 733 to control its rotation. The adjusting mechanism 9 includes a driving gear 92 and a second motor 91. The driving gear 92 is connected to the power output shaft of the second motor 91, and the driving gear 92 can mesh with the driven gear 734. Therefore, after the clamping mechanism 7 moves to the side of the adjusting mechanism 9, the second motor 91 controls the driving gear 92 to rotate, thereby driving the worm 733 to rotate. To facilitate the starting of the second motor 91, an inductive switch is required, which can control the adjusting mechanism 9 to operate after the clamping mechanism 7 moves to the adjusting mechanism 9.

[0055] like Figure 17 As shown, in order to enable the driving gear 92 and the driven gear 734 to mesh, the driving gear 92 is connected to the connecting frame 93 via a bearing housing, and the second motor 91 is also mounted on the connecting frame 93. A base frame 94 is fitted at the bottom of the connecting frame 93, and a locking pin 97 mounted on the inner side wall of the base frame 94 extends into a locking groove 96 on the side wall of the connecting frame 93. The telescopic end of the telescopic cylinder 95 mounted on the base frame 94 is connected to the connecting frame 93. After the clamping mechanism 7 moves to the adjusting mechanism 9, the telescopic cylinder 95 operates to control the movement of the connecting frame 93, thereby controlling the driving gear 92 to move closer to or further away from the driven gear 734, and thus adjusting the state of the clamping mechanism 7.

[0056] like Figure 7 As shown, to enable multiple clamping mechanisms 7 to reciprocate cyclically, the drive mechanism 6 includes a chain 61, two supports 62, and four sprockets 63. The chain 61 is rectangular, and the four sprockets 63 are located on the inner side of the chain 61 and distributed at the four corners of the chain 61. The four sprockets 63 are connected by bearing seats and evenly mounted on the two supports 62. The bottom of the supports 62 is connected to the ultrasonic cleaner 1, allowing for stable installation of the chain 61 under the action of the supports 62 and sprockets 63. To adjust the tension of the chain 61, a tensioning wheel 64 is also engaged on the side of the chain 61. The tensioning wheel 64 is connected to the supports 62, and the tension of the chain 61 can be adjusted by changing the position of the tensioning wheel 64.

[0057] like Figure 7 , Figure 10 As shown, in addition, the central shaft of a certain sprocket 63 is connected to the power output shaft of the first motor 65, and the first motor 65 is mounted on the bracket 62, so that the chain 61 can be controlled to rotate under the operation of the first motor 65. A connecting plate 711 is fixedly provided on one side of the support tube 71, and the connecting plate 711 is connected to the chain 61. When the chain 61 moves, it can drive the support tube 71 to move along a preset direction.

[0058] like Figure 8 , Figure 10 , Figure 11 As shown, to ensure stable movement of the clamping mechanism 7, the guide mechanism 8 includes two vertically distributed support rails 81. Support frames 82 are connected to the sides of both support rails 81, and the ends of the support frames 82 are connected to the bracket 62. Two vertically distributed pulleys 75 are connected to the other side of the support tube 71 via bearing seats. The two pulleys 75 are respectively positioned to fit against the two support rails 81. Limiting plates 751 are provided on the sides of the pulleys 75 that are far apart from each other. The ends of the two limiting plates 751 that are close to each other contact their respective adjacent support rails 81. Thus, the support tube 71 is stably installed on the side of the support rails 81 with the cooperation of the limiting plates 751 and the pulleys 75. Furthermore, because there is a gap between the ends of the two limiting plates 751 that are close to each other, the presence of the support frame 82 will not affect the movement of the support tube 71. To ensure stable installation of the limiting plates 751, the ends of the two limiting plates 751 that are far apart from each other are respectively fitted onto their respective threaded posts 714, while the limiting rods 713 installed on the threaded posts 714 pass through the limiting grooves 752 of the limiting plates 75.

[0059] like Figure 8 , Figure 12As shown, a first guide rail 83 and a second guide rail 84 are connected end to end on the inner side of the support guide rail 81. The first guide rail 83 is located below the second guide rail 84, and a connecting rod 85 installed at the end of the second guide rail 84 is connected to the bracket 62. A connecting column 721 is fixedly installed at the vertical section of the lifting plate 72. A sleeve 722 is sleeved at the end of the connecting column 721, and an arc-shaped column 723 is fixedly installed at the end of the sleeve 722. The central angle of the arc-shaped column 723 is greater than or equal to 180° and is sleeved on the guide rail. During the movement of the support tube 71 along the preset direction of the support guide rail 81, the lifting plate 72 can be controlled to rise and fall with the cooperation of the first guide rail 83, the second guide rail 84 and the connecting column 721, thereby adjusting the height of the PCB substrate and providing support for the cleaning of the PCB substrate and its entry and exit from the ultrasonic cleaning machine 1.

[0060] like Figure 10 , Figure 12 As shown, in order to achieve a large range of lifting and lowering of the lifting plate 72, a slot 712 is provided at the bottom of the support tube 71. The bottom of the slot 712 is set to be open, and the connecting column 721 is set through the slot 712.

[0061] To ensure the proper functioning of the added structure, appropriate control devices are required. These include programmable logic controllers (PLCs), relay control modules, motor drive systems (such as contactors and thermal relays), hydraulic / pneumatic telescopic cylinders (such as solenoid directional valves), and signal conditioning modules installed in the electrical control box. These devices control the operation of the motors and telescopic cylinders and receive signals from sensors such as inductive switches. Other components can also be installed as needed. Example 2

[0062] like Figure 18-20 As shown in Example 1, to adapt the fixture for neatly placing PCB substrates to PCB substrates of different thicknesses, the fixture includes multiple paired first baffles 12 and second baffles 13. The multiple first baffles 12 are fixedly mounted on the same base plate 15, which is mounted on the ultrasonic cleaner 1. A sliding groove 16 is provided on the base plate 15. The multiple second baffles 13 are fixedly mounted on the same sliding clamping plate 14, which is installed within the sliding groove 16, enabling the first baffles 12 and second baffles 13 to move and be stably connected. Furthermore, an adjusting screw 17 is connected to the end of the sliding clamping plate 14 via a bearing. The end of the adjusting screw 17 is inserted into the sliding clamping plate 14, and the adjusting screw 17 is threaded through a threaded hole in the base plate 15. The adjusting screw 17 can be rotated as needed to adjust the distance between the first baffles 12 and second baffles 13, thereby adapting to the thickness of the PCB substrate and providing support for the neat and stable placement of the PCB substrate.

[0063] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An automatic assembly device for computer motherboard components, characterized in that, The ultrasonic cleaner includes an ultrasonic cleaner (1), and a guide mechanism (8) and a drive mechanism (6) are arranged above the ultrasonic cleaner (1) and distributed inside and outside. The guide mechanism (8) is set as a ring structure, and multiple clamping mechanisms (7) are suspended at equal intervals on the guide mechanism (8). The drive mechanism (6) controls the clamping mechanism (7) to move along a predetermined direction, and the bottom of part of the clamping mechanism (7) is submerged in the ultrasonic cleaner (1). An adjustment mechanism (9) is provided at both ends of the ultrasonic cleaner (1), and the adjustment mechanism (9) is connected to the multiple clamping mechanisms (7) one by one through transmission. The drive mechanism (6) includes a rectangular chain (61) and four sprockets (63) distributed at the corners of the chain (61). The four sprockets (63) are connected by bearing seats and evenly mounted on two brackets (62). The brackets (62) are configured as L-shaped structures, and the bottom of the brackets (62) is connected to the ultrasonic cleaner (1). The central axis of one of the sprockets (63) is connected to the power output shaft of the first motor (65). A tension wheel (64) is also meshed on the side of the chain (61), and the tension wheel (64) is connected to the bracket (62). The guiding mechanism (8) includes two rings of support rails (81) distributed vertically. The two rings of support rails (81) are connected to a support frame (82) on their sides. The end of the support frame (82) is connected to the bracket (62). A first guide rail (83) and a second guide rail (84) connected end to end are provided on the inner side of the support rails (81). The first guide rail (83) is located below the second guide rail (84). A connecting rod (85) installed at the end of the second guide rail (84) is connected to the bracket (62). The clamping mechanism (7) includes a support tube (71), a lifting plate (72) that passes through the support tube (71), and a plurality of first clamping plates (73) and second clamping plates (74) disposed at the bottom of the lifting plate (72). The lifting plate (72) is configured as an inverted T-shaped structure. The plurality of first clamping plates (73) and second clamping plates (74) are alternately installed at the horizontal section of the lifting plate (72), and the second clamping plate (74) is stationary relative to the lifting plate (72). The first clamping plate (73) is movably connected to the lifting plate (72).

2. The automatic assembly equipment for computer motherboard components according to claim 1, characterized in that, The first guide rail (83) and the second guide rail (84) are located on the inner side of the chain (61), the support guide rail (81) is located on the outer side of the chain (61), and multiple clamping mechanisms (7) are distributed along the circumference of the chain (61), and the clamping mechanism (7) contacts the guide rail and the support guide rail (81) simultaneously.

3. The automatic assembly equipment for computer motherboard components according to claim 1, characterized in that, A connecting plate (711) is fixedly installed on one side of the support tube (71), and two pulleys (75) are connected to it on the other side via a bearing seat. The connecting plate (711) is connected to the chain (61), and the two pulleys (75) are respectively fitted to two rings of support guide rails (81). Limiting plates (751) are provided on the side of the two pulleys (75) that are far apart from each other. The ends of the two limiting plates (751) that are close to each other are in contact with their respective adjacent support guide rails (81), and the ends of the two limiting plates (751) that are far apart from each other are respectively sleeved on their respective threaded columns. At the same time, the limiting rod (713) installed on the threaded column passes through the limiting groove (752) of the limiting plate (751).

4. The automatic assembly equipment for computer motherboard components according to claim 3, characterized in that, A connecting column (721) is fixedly installed at the vertical section of the lifting plate (72). A sleeve (722) is sleeved at the end of the connecting column (721). An arc-shaped column (723) is fixedly installed at the end of the sleeve (722). The central angle of the arc-shaped column (723) is greater than or equal to 180° and is sleeved on the guide rail. A slot (712) is provided at the bottom of the support tube (71). The bottom of the slot (712) is set as an opening, and the connecting column (721) is set through the slot (712).

5. The automatic assembly equipment for computer motherboard components according to claim 1, characterized in that, The lifting plate (72) has a latching groove (724) with an end opening along its length on the horizontal section. A first latching frame (732) and a second latching frame (742) are fixedly installed on the top of the first clamping plate (73) and the second clamping plate (74), respectively. The first latching frame (732) and the second latching frame (742) are sleeved on the horizontal section of the lifting plate (72). Multiple first clamping plates (73) are threaded onto the same threaded rod (731). The threaded rod (731)... The end is connected to a worm gear (735), and a worm (733) is meshed on the side of the worm gear (735). The worm gear (735) and the worm (733) are mounted on the same frame, which is connected to the lifting plate (72). A driven gear (734) is installed at the end of the worm (733). Multiple second clamping plates (74) are connected by bolts and sleeved on the same brake plate (741). A fixed end plate (743) installed at the end of the brake plate (741) is connected to the brake plate (741).

6. The automatic assembly equipment for computer motherboard components according to claim 5, characterized in that, The adjustment mechanism (9) includes a drive gear (92) and a second motor (91). The drive gear (92) is connected to the connecting frame (93) via a bearing seat. The second motor (91) is also installed on the connecting frame (93), and the power output shaft of the second motor (91) is connected to the central shaft of the drive gear (92). A bottom frame (94) is fitted at the bottom of the connecting frame (93). A locking pin (97) installed on the inner side wall of the bottom frame (94) extends into a locking groove (96) on the side wall of the connecting frame (93). The telescopic end of the telescopic cylinder (95) installed on the bottom frame (94) is connected to the connecting frame (93). The drive gear (92) is meshed with the driven gear (734).

7. The automatic assembly equipment for computer motherboard components according to claim 1, characterized in that, Multiple first baffles (12) and second baffles (13) are provided at both ends of the upper side of the ultrasonic cleaner (1). Multiple first baffles (12) are fixedly installed on the same base plate (15). The base plate (15) is installed on the ultrasonic cleaner (1) and a sliding groove (16) is provided on the base plate (15). Multiple second baffles (13) are fixedly installed on the same sliding plate (14). The sliding plate (14) is installed in the sliding groove (16) and the adjusting screw (17) at the end of the sliding plate (14) is threaded through the threaded hole of the base plate (15).

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