Automatic chip welding and positioning device based on machine vision

Abstract

The invention relates to the technical field of chip welding, in particular to an automatic chip welding and positioning device based on machine vision. The automatic chip welding and positioning device based on machine vision comprises a support, a conveying assembly, a mechanical arm, an outer frame, a controller, a visual system, an adjusting frame, a visual sensor, a first frame strip, a second frame strip, a moving assembly, an adjusting assembly and a lifting limiting assembly, the conveying assembly is installed at the top of the support, and the outer frame is connected to the middle of the top of the support; a mechanical arm is installed on the top of the support and located on the right side of the outer frame, and a controller is installed on the front side wall of the outer frame. The visual system obtains initial coordinates of a circuit board bonding pad through three-dimensional modeling, the visual sensor monitors position deviation of the frame strips and the bonding pad in real time, the linkage moving assembly achieves accurate adjustment of the first frame strip and the second frame strip in a three-dimensional space, mechanical errors and batch difference influences are effectively eliminated, and high precision of chip welding is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of chip soldering, and particularly to an automatic chip soldering positioning device based on machine vision. Background Art

[0002] In the fields of semiconductor packaging and electronics manufacturing, the high-precision soldering of chips and printed circuit boards is a core link determining the performance and reliability of products. With the development of electronic products towards miniaturization and integration, the chip packaging size has been continuously reduced (such as 01005 chip components, BGA packaging with a 0.3 mm pitch), posing higher requirements for soldering positioning accuracy. Traditional soldering positioning methods mostly rely on manual operations or mechanical limiting mechanisms, suffering from problems such as low positioning efficiency, insufficient accuracy (the error is usually > 0.1 mm), and difficulty in adapting to multi-specification chips, and thus unable to meet the stringent standards of current intelligent manufacturing for soldering processes.

[0003] In recent years, although the automatic soldering technology based on machine vision has been widely applied, there are still many technical bottlenecks in existing equipment. Some devices adopt a single vision detection system, unable to effectively distinguish the individual differences of printed circuit boards and mechanical installation errors, resulting in the accumulation of positioning deviations; some devices have adjustment functions, but the adjustment mechanism has a slow response speed and a limited adjustment range, making it difficult to quickly adapt to the soldering requirements of different-sized chips. In addition, during the soldering process, the surface tension generated by the melting of solder balls is likely to cause chip displacement, and existing positioning devices lack effective dynamic limiting measures, seriously affecting the soldering yield.

[0004] Therefore, the research and development of an automatic chip soldering positioning device capable of achieving high-precision three-dimensional positioning, adaptive size adjustment, and dynamic limiting has become a key technical requirement for improving the quality and efficiency of electronic manufacturing. Summary of the Invention

[0005] In order to overcome the disadvantages mentioned in the background art, the present invention provides an automatic chip soldering positioning device based on machine vision.

[0006] The technical solution of the present invention is as follows: An automatic chip welding positioning device based on machine vision, which includes a bracket, a conveying component, a robotic arm, an outer frame, a controller, a vision system, an adjustment frame, a vision sensor, a first frame bar, a second frame bar, a moving component, an adjustment component and a lifting limit component. The conveying component is installed at the top of the bracket. The middle of the top of the bracket is connected to the outer frame. The robotic arm is installed at the position on the right side of the outer frame at the top of the bracket. The controller is installed on the front side wall of the outer frame. The vision system is installed on the left side wall of the outer frame. A moving component is arranged inside the outer frame. The adjustment frame is installed on the moving component. The vision sensor is installed at the upper end of the adjustment frame, and the lower end is connected to the first frame bar. The second frame bar is slidably connected to the first frame bar, and the two are in an L-shaped structure, jointly forming a square frame. The conveying component, the robotic arm, the vision system and the vision sensor are all electrically connected to the controller. An adjustment component is arranged on the adjustment frame, and a lifting limit component is arranged on the outer frame.

[0007] In one embodiment, the surfaces of the first frame bar and the second frame bar are coated with a nano-scale high-temperature resistant insulating coating, and the coating thickness is 5-10 μm.

[0008] In one embodiment, light bars are connected to the tops of the first frame bar and the second frame bar to assist the vision sensor in identifying the contours and positions of the first frame bar and the second frame bar.

[0009] In one embodiment, the moving component includes a vertical slide rail, a lifting frame, a moving frame, a driving motor and a transmission belt. Vertical slide rails are symmetrically connected to the front and rear sides inside the outer frame in the left-right direction. A lifting frame is slidably connected between each pair of front and rear symmetric vertical slide rails. A moving frame is slidably connected between the two lifting frames. The adjustment frame is slidably connected to the moving frame. A driving motor and a transmission belt are installed on the moving frame. The output shaft of the driving motor is connected to the driving wheel of the transmission belt. The adjustment frame is connected to the lower belt of the transmission belt. A driving motor and a transmission belt are also installed on the right lifting frame. The output shaft of this driving motor is connected to the driving wheel of this transmission belt. The moving frame is connected to the upper belt of this transmission belt. Both driving motors are electrically connected to the controller.

[0010] In one embodiment, the adjustment component includes a micro electric cylinder, a moving block, a horizontal rack, a vertical rack and a gear. The micro electric cylinder is installed at the lower end of the adjustment frame. The micro electric cylinder is electrically connected to the controller. The micro electric cylinder is connected to the first frame bar. A moving block is connected to the telescopic rod of the micro electric cylinder. The moving block is slidably connected to the first frame bar. The second frame bar is also slidably connected to the moving block. A gear is rotatably connected inside the moving block. A vertical rack is connected to the right side wall of the second frame bar. A horizontal rack is connected to the front side wall of the first frame bar. Both the horizontal rack and the vertical rack are engaged with the gear.

[0011] In one of the embodiments, the lifting and limiting assembly includes a transverse slide rail, a slide rod, a clamping plate, an isolation plate and a power assembly. The front and rear ends of the lifting frame on the right side are respectively slidably connected to the transverse slide rail, the slide rods are connected to the transverse slide rails, the clamping plate is connected between the left ends of the two slide rods, the bottoms of the two lifting frames are connected to isolation plates, and a power assembly is provided on the outer frame.

[0012] In one of the embodiments, the power assembly includes a cylinder, a pushing frame and an elastic telescopic rod. The cylinder is symmetrically connected to the top of the outer frame, and the cylinder is electrically connected to the controller. The two cylinder telescopic rods pass through the interior of the outer frame and are commonly connected to a pushing frame. The bottom of the pushing frame is symmetrically rotatably connected to the elastic telescopic rod, and a spring is installed in the elastic telescopic rod. The lower ends of the elastic telescopic rods are rotatably connected to the corresponding sliding rods.

[0013] In one of the embodiments, it also includes a storage barrel, a cylinder, a piston rod, a return spring, a delivery pipe, a hose, a discharge gun and a guide rod. A storage barrel is fixed on the left front part of the movable frame, a cylinder is connected to the position on the left side of the storage barrel on the movable frame, a piston rod is slidably connected in the cylinder, a return spring is connected between the piston rod and the inside of the cylinder, the pushing frame is in contact with the piston rod, a delivery pipe is connected between the bottom of the storage barrel and the bottom of the cylinder, a one-way valve is installed at the left end of the delivery pipe, a hose is connected and communicated with the right end of the cylinder, a discharge gun is connected to the right end of the hose, the discharge gun is installed on the adjustment frame in a through-type manner, and its muzzle faces the welding area enclosed by frame bar one and frame bar two, a one-way valve is also installed at the left end of the hose, a guide rod is connected to the front side of the movable frame, and the excess length of the hose is wound around the guide rod.

[0014] The beneficial effects are: 1. The visual system obtains the initial coordinates of the circuit board pad through 3D modeling, the visual sensor monitors the position deviation between the frame bar and the pad in real time, and the linked mobile components realize the precise adjustment of frame bar 1 and frame bar 2 in 3D space, effectively eliminating the influence of mechanical errors and batch differences, and ensuring high-precision chip welding.

[0015] 2. Frame bar 1 and frame bar 2 form physical limits for the chip during welding, effectively suppressing chip displacement caused by surface tension generated by melting solder balls, significantly improving welding accuracy and finished product quality.

[0016] 3. The micro-electric cylinder in the adjustment component drives the gear-rack linkage mechanism, which can accurately control the synchronous translation of frame bar 2 along the X and Y axis directions according to the welding area size data fed back by the visual sensor, so that the square outer frame enclosed by frame bar 1 and frame bar 2 can be scaled proportionally, compatible with chips of multiple specifications, and greatly improve the versatility of the equipment and production flexibility.

[0017] 4. The lifting limit component adopts a flexible clamping method that combines cylinder drive and elastic telescopic rod. Through the adaptive adjustment of the spring, it can firmly clamp circuit boards of different thicknesses, avoid damaging the circuit boards due to rigid extrusion, and ensure the position stability of the circuit boards during the welding process.

[0018] 5. Based on the storage bucket, the discharging gun, and the linkage structure (the pushing frame and the piston rod), automatic solder paste addition, quantitative conveying, and cyclic replenishment are realized, reducing manual intervention and improving welding efficiency; at the same time, enhancing the bonding strength between the chip and the circuit board and reducing the risk of chip cracking. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional structure schematic diagram of the present invention.

[0020] Figure 2 It is a three-dimensional structure schematic diagram of components such as the robotic arm, the outer frame, and the lifting frame of the present invention.

[0021] Figure 3 It is a three-dimensional structure schematic diagram of components such as the vertical slide rail, the lifting frame, and the moving frame of the present invention.

[0022] Figure 4 It is a three-dimensional structure schematic diagram of components such as the adjusting frame, the vision sensor, and the frame bar 1 of the present invention.

[0023] Figure 5 It is a three-dimensional structure schematic diagram of components such as the moving frame, the driving motor, and the transmission belt of the present invention.

[0024] Figure 6 It is a three-dimensional structure schematic diagram of components such as the frame bar 1, the frame bar 2, and the micro electric cylinder of the present invention.

[0025] Figure 7 It is a three-dimensional structure schematic diagram of components such as the moving block, the horizontal rack, and the vertical rack of the present invention.

[0026] Figure 8 It is an exploded view of components such as the vertical rack, the gear, and the frame bar 2 of the present invention.

[0027] Figure 9 It is a three-dimensional structure schematic diagram of components such as the horizontal slide rail, the slide bar, and the clamping plate of the present invention.

[0028] Figure 10 It is a three-dimensional structure schematic diagram of components such as the clamping plate, the isolation plate, and the cylinder of the present invention.

[0029] Figure 11 It is a planar structure schematic diagram of components such as the elastic telescopic rod, the slide bar, and the clamping plate of the present invention.

[0030] Figure 12 It is a three-dimensional structure schematic diagram of components such as the clamping plate, the isolation plate, and the lifting frame of the present invention.

[0031] Figure 13 This is a three-dimensional structural schematic diagram of components such as the cylinder body, piston rod, and conveying pipe of the present invention.

[0032] Figure 14 This is a three-dimensional structural schematic diagram of components such as the flexible hose, discharge gun, and guide rod of the present invention.

[0033] Figure 15 This is a three-dimensional structural schematic diagram of components such as the cylinder body, piston rod, and return spring of the present invention.

[0034] The markings in the figure are: 1 - support, 101 - conveying assembly, 102 - robotic arm, 103 - outer frame, 104 - controller, 105 - vision system, 106 - adjusting frame, 107 - vision sensor, 108 - first frame bar, 109 - second frame bar, 201 - vertical slide rail, 202 - lifting frame, 203 - moving frame, 204 - driving motor, 205 - transmission belt, 301 - micro electric cylinder, 302 - moving block, 303 - horizontal rack, 304 - longitudinal rack, 305 - gear, 401 - horizontal slide rail, 402 - slide bar, 403 - clamping plate, 404 - isolation plate, 501 - air cylinder, 502 - pushing frame, 503 - elastic telescopic rod, 601 - storage barrel, 602 - cylinder body, 603 - piston rod, 6031 - return spring, 604 - conveying pipe, 605 - flexible hose, 606 - discharge gun, 607 - guide rod. Detailed implementation manners

[0035] The present invention will be further described below with reference to the embodiments shown in the drawings.

[0036] Embodiment 1: An automatic chip welding positioning device based on machine vision, as Figures 1 - 12As shown in the figure, it includes a bracket 1, a conveying component 101, a robotic arm 102, an outer frame 103, a controller 104, a vision system 105, an adjusting frame 106, a vision sensor 107, a first frame bar 108, a second frame bar 109, a moving component, an adjusting component and a lifting limit component. The conveying component 101 is installed at the top of the bracket 1, and its function is to continuously convey the circuit board to provide a stable material supply for subsequent welding operations. The middle of the top of the bracket 1 is bolted to the outer frame 103. The robotic arm 102 is installed at the position on the right side of the outer frame 103 at the top of the bracket 1 to realize chip picking and placing and precise control of the hot air gun for welding. The controller 104 is bolted to the front side wall of the outer frame 103, and the vision system 105 is bolted to the left side wall of the outer frame 103. The latter completes the contour scanning of the circuit board and the pad coordinate positioning, and the former serves as the system control center to realize the collaborative operation of multiple components. A moving component is provided inside the outer frame 103. The adjusting frame 106 is installed on the moving component. The vision sensor 107 is installed at the upper end of the adjusting frame 106, and the lower end is connected to the first frame bar 108. The second frame bar 109 is slidably connected to the first frame bar 108, and the two are in an L-shaped structure, jointly forming a square frame. By sliding and adjusting the second frame bar 109, the size of this square frame can be flexibly adjusted to adapt to the welding requirements of different specifications of chips. The surfaces of the first frame bar 108 and the second frame bar 109 are coated with a nano-level high-temperature resistant insulating coating with a coating thickness of 5-10 μm, which has the characteristics of anti-oxidation, anti-solder adhesion, is easy to clean and can extend the service life of the components. The conveying component 101, the robotic arm 102, the vision system 105 and the vision sensor 107 are all electrically connected to the controller 104, so as to realize data transmission and instruction execution. An adjusting component is provided on the adjusting frame 106, and a lifting limit component is provided on the outer frame 103.

[0037] To improve the detection effect of the vision sensor 107, light bars are connected to the tops of the first frame bar 108 and the second frame bar 109. The uniform light emitted by the light bars can provide good lighting conditions for the vision sensor 107, assisting it to more clearly identify the contours and positions of the first frame bar 108 and the second frame bar 109, and then more accurately detect their alignment with the circuit board pads, improving the positioning accuracy.

[0038] As Figures 2 - 5As shown, the moving component includes a vertical slide rail 201, a lifting frame 202, a moving frame 203, a driving motor 204, and a transmission belt 205. Vertical slide rails 201 are symmetrically connected to the front and rear sides inside the outer frame 103 by bolts. A lifting frame 202 is slidably connected between each pair of front and rear symmetric vertical slide rails 201. The lifting frame 202 can slide in the Z-axis (up and down) direction along the vertical slide rail 201. A moving frame 203 is slidably connected between the two lifting frames 202. The moving frame 203 can slide in the front and rear direction along the lifting frame 202. The adjusting frame 106 is slidably connected to the moving frame 203 and can slide in the left and right direction along the moving frame 203. A driving motor 204 and a transmission belt 205 are installed on the moving frame 203 by bolts. The output shaft of the driving motor 204 is connected to the driving wheel of the transmission belt 205. The adjusting frame 106 is connected to the lower belt of the transmission belt 205. When the driving motor 204 drives the transmission belt 205 to rotate forward or backward, it can drive the adjusting frame 106 to move and adjust in the left and right direction along the moving frame 203. Similarly, a driving motor 204 and a transmission belt 205 are installed on the right lifting frame 202 by bolts. The output shaft of this driving motor 204 is connected to the driving wheel of this transmission belt 205. The moving frame 203 is connected to the upper belt of this transmission belt 205. By the forward or backward rotation of the transmission belt 205, it can drive the moving frame 203 to move and adjust in the front and rear direction along the lifting frame 202. In this way, through the coordinated work of the moving component, the overall position adjustment of the first frame bar 108 and the second frame bar 109 in the X-axis (left and right) and Y-axis (front and rear) directions can be realized to meet the requirements of different chip welding positions. The two driving motors 204 are both electrically connected to the controller 104, and the controller 104 precisely controls their operation to ensure the accuracy and stability of the position adjustment.

[0039] As Figures 6 - 8As shown in the figure, the adjustment component includes a micro electric cylinder 301, a moving block 302, a horizontal rack 303, a vertical rack 304 and a gear 305. The lower end of the adjustment frame 106 is installed with a micro electric cylinder 301 through bolts. The micro electric cylinder 301 is electrically connected to the controller 104. The micro electric cylinder 301 is connected to the first frame bar 108. A moving block 302 is connected to the telescopic rod of the micro electric cylinder 301. The moving block 302 is slidably connected to the first frame bar 108. The second frame bar 109 is also slidably connected to the moving block 302. A gear 305 is rotatably connected inside the moving block 302. A vertical rack 304 is welded to the right side wall of the second frame bar 109. A horizontal rack 303 is welded to the front side wall of the first frame bar 108. Both the horizontal rack 303 and the vertical rack 304 are meshed with the gear 305. When the visual sensor 107 completes the detection of the relative position relationship between the circuit board pads and the first frame bar 108 and the second frame bar 109, it will transmit the detection data to the controller 104. The controller 104 drives the micro electric cylinder 301 to accurately adjust the size of the square frame enclosed by the first frame bar 108 and the second frame bar 109 to match the pad area of the circuit board. When the micro electric cylinder 301 is started and its telescopic rod extends, it will drive the moving block 302 and the gear 305 to move to the left. The moving block 302 pushes the second frame bar 109 to slide to the left. Since the gear 305 and the horizontal rack 303 are meshed with each other, the gear 305 will rotate under the action of the horizontal rack 303. The rotating gear 305 drives the vertical rack 304 to move, and then makes the second frame bar 109 slide forward. In this way, the second frame bar 109 is translated synchronously along the X and Y axes, so as to increase the size of the frame enclosed by the second frame bar 109 and the first frame bar 108. On the contrary, when the telescopic rod of the micro electric cylinder 301 is retracted, a reverse effect will be generated to reduce the size of the frame enclosed by the second frame bar 109 and the first frame bar 108.

[0040] When performing the soldering process of the circuit board and the chip, the circuit board is loaded onto the conveying component 101, and the conveying component 101 conveys the circuit board one by one to the right. When the circuit board enters the detection area of the vision system 105, the industrial camera uses sub-pixel level image recognition technology to perform 3D modeling on the outer contour of the circuit board, and accurately extracts the position coordinates of the pads through the edge detection algorithm. The vision system 105 converts the pose data of the circuit board into Cartesian coordinate system instructions recognizable by the robotic arm 102 and synchronously transmits them to the controller 104 to complete the initial calibration of the welding target position. After the circuit board continues to be conveyed to the right and enters the processing area inside the outer frame 103, the conveying component 101 accurately pauses according to the instructions of the controller 104. At this time, the vision sensor 107 scans the relative positions of the first frame bar 108, the second frame bar 109 and the pads of the circuit board in real time at a frequency of 20 frames per second, and calculates the offsets of the two in the X, Y, and Z axes through the image matching algorithm. Based on the deviation data, the controller 104 synchronously drives the two drive motors 204 of the moving component: drives the adjustment frame 106 to perform precise displacement compensation in the horizontal plane (X-Y plane) to achieve the preliminary alignment of the first frame bar 108, the second frame bar 109 and the pads of the circuit board. Subsequently, the vision sensor 107 further analyzes the size of the welding area, and the controller 104 triggers the micro cylinder 301 of the adjustment component to execute the dynamic scaling instruction, driving the second frame bar 109 to translate synchronously along the X and Y axes to achieve the proportional adjustment of the size of the square frame. After positioning is completed, the controller 104 starts the lifting and limiting component, drives the first frame bar 108 and the second frame bar 109 to reach the preset distance from the pads of the circuit board, and realizes the dynamic clamping and welding protection of the circuit board through the precise coordination of the power component. Subsequently, based on the guidance of the vision system 105, the robotic arm 102 picks up the chip through the vacuum adsorption device and accurately places it on the pads of the circuit board. The square frame formed by the first frame bar 108 and the second frame bar 109 effectively limits the chip. The robotic arm 102 switches to the hot air gun to perform the soldering process, controls the hot air gun to uniformly heat the chip, so that the solder balls at the bottom of the chip are heated and melted, and under the action of surface tension, the solder balls are well combined with the pads on the circuit board to achieve soldering. During the heating process, since a certain surface tension will be generated when the solder balls melt, it may cause the chip to shift. The setting of the first frame bar 108 and the second frame bar 109 can limit the position of the chip on the circuit board and ensure the accuracy of chip soldering. After soldering is completed, the controller 104 controls the lifting and limiting component to drive the first frame bar 108 and the second frame bar 109 to reset, the conveying component 101 restarts, removes the soldered circuit board from the processing area, and sends in the next circuit board to be processed. For products of the same batch, the system automatically calls the preset parameters and only performs the rapid lifting positioning and soldering operations to improve production efficiency.

[0041] Such as Figure 2 And Figures 9 - 12As shown in the figure, the lifting limit component includes a horizontal slide rail 401, a slide bar 402, a clamping plate 403, an isolation plate 404 and a power component. The front and rear ends of the right lifting frame 202 are respectively slidably connected to the horizontal slide rail 401. Slide bars 402 are welded on the horizontal slide rails 401. A clamping plate 403 is connected between the left ends of the two slide bars 402. Isolation plates 404 are bolted to the bottoms of the two lifting frames 202. A power component is provided on the outer frame 103.

[0042] As Figure 2 and Figures 9 - 12 As shown in the figure, the power component includes a cylinder 501, a push frame 502 and an elastic telescopic rod 503. Cylinders 501 are symmetrically bolted to the front and rear of the top of the outer frame 103. The cylinders 501 are electrically connected to the controller 104. The telescopic rods of the two cylinders 501 penetrate the inside of the outer frame 103 and are jointly connected to a push frame 502. Elastic telescopic rods 503 are symmetrically rotatably connected to the front and rear of the bottom of the push frame 502. Springs are assembled in the elastic telescopic rods 503 to provide a reset force. The lower ends of the elastic telescopic rods 503 are respectively rotatably connected to the corresponding slide bars 402.

[0043] When the square frame enclosed by the first frame bar 108 and the second frame bar 109 is precisely aligned with the welding area of the circuit board through the visual feedback system, the lifting limit component is activated under the command of the controller 104, and the dynamic clamping and welding protection of the circuit board are realized through the precise coordination of the power components. The specific working process is as follows: The controller 104 triggers the cylinder 501 to start. The telescopic rod of the cylinder 501 extends downward, driving the push frame 502 and the elastic telescopic rod 503 connected thereto to move downward synchronously. The elastic telescopic rod 503 drives the slide rod 402, the clamping plate 403 and the horizontal slide rail 401 to move downward, and then pushes components such as the lifting frame 202 and the isolation plate 404 to slide downward along the vertical slide rail 201 until the first frame bar 108, the second frame bar 109 and the surface of the circuit board reach a preset distance. At this time, the right isolation plate 404 first closely abuts against the right edge of the circuit board, and the two isolation plates 404 form a physical barrier, effectively isolating the welding operation area to prevent the splashing of solder balls and chips and the diffusion of heat. At this time, the cylinder 501 continues to extend to push the push frame 502 to move further downward. The elastic telescopic rod 503 rotates due to the obstruction of the lower slide rod 402. Based on the lever principle, this rotation transmits a horizontal component force through the hinge point, pushing the slide rod 402 to drive the horizontal slide rail 401 to translate to the right along the lifting frame 202, and then driving the clamping plate 403 to move toward the left edge of the circuit board. The spring built into the elastic telescopic rod 503 has an adaptive adjustment characteristic and can dynamically adjust the clamping force according to the actual thickness of the circuit board: when the size of the circuit board is small, the spring pre-tightening force ensures reliable contact of the clamping plate 403; when the circuit board is thicker, the spring provides buffering through compression deformation at the limit rotation angle, avoiding damage to the circuit board caused by rigid extrusion, and finally realizing the flexible clamping of the left and right sides of the circuit board to ensure that the circuit board remains in a zero-displacement state during the welding process. After the lifting limit component fixes the circuit board, the robotic arm 102 accurately places the chip in the welding area according to the coordinates calibrated by the vision system 105. At this time, the square frame formed by the first frame bar 108 and the second frame bar 109 just encloses the chip, and uses physical limits to constrain the displacement of the chip caused by the surface tension during the melting of the solder balls, ensuring the welding alignment accuracy. Subsequently, the robotic arm 102 switches to a hot air gun to perform gradient heating on the chip, and realizes the uniform melting and reliable welding of the solder balls through the closed-loop temperature control system. After the welding process is completed, the controller 104 controls the telescopic rod of the cylinder 501 to retract upward, and the push frame 502 drives the elastic telescopic rod 503 to rotate in the reverse direction. The spring releases elastic potential energy, driving the slide rod 402 and the clamping plate 403 to translate to the left along the lifting frame 202 to reset, releasing the clamping of the circuit board. As the cylinder 501 continues to retract, the elastic telescopic rod 503 drives the liftable overall component to move upward along the vertical slide rail 201. The first frame bar 108, the second frame bar 109 and the isolation plate 404 are separated from the surface of the circuit board and return to the standby position. At this time, the conveying component 101 restarts, moves the welded circuit board out of the processing area, and the device enters the next welding cycle.

[0044] Embodiment 2: On the basis of Embodiment 1, as Figure 10 , Figure 11 , Figure 13 , Figure 14 and Figure 15 shown, it further includes a storage barrel 601, a cylinder body 602, a piston rod 603, a return spring 6031, a delivery pipe 604, a hose 605, a discharging gun 606 and a guide rod 607. A storage barrel 601 is fixed to the left front of the moving frame 203 for storing solder paste raw materials. A cylinder body 602 is connected to the position on the left side of the storage barrel 601 on the moving frame 203. A piston rod 603 is slidably connected inside the cylinder body 602. A return spring 6031 is connected between the piston rod 603 and the interior of the cylinder body 602. The pushing frame 502 is in contact and cooperation with the piston rod 603. A delivery pipe 604 is connected between the bottom of the storage barrel 601 and the bottom of the cylinder body 602. A one-way valve is assembled at the left port of the delivery pipe 604. The solder paste in the storage barrel 601 can enter the cylinder body 602 through the delivery pipe 604, while the solder paste in the cylinder body 602 cannot flow back to the storage barrel 601 through the delivery pipe 604. The right end of the cylinder body 602 is connected and communicated with a hose 605. The right end of the hose 605 is connected to a discharging gun 606. The discharging gun 606 is installed on the adjusting frame 106 in a penetrating manner, and its muzzle faces the welding area enclosed by the frame bar one 108 and the frame bar two 109. A one-way valve is also assembled at the left port of the hose 605. The solder paste in the cylinder body 602 can enter the hose 605, while the solder paste in the hose 605 cannot flow back into the cylinder body 602. A guide rod 607 is welded to the front side of the moving frame 203. The excess length part of the hose 605 is wound around the guide rod 607. When the adjusting frame 106 adjusts its position in the left-right direction along the moving frame 203, the discharging gun 606 moves synchronously. The function of the guide rod 607 can ensure that the hose 605 will not be entangled and knotted with each other.

[0045] When the cylinder 501 drives the push frame 502 to move downward, it will first drive the first frame bar 108 and the second frame bar 109 to move downward until they reach a preset distance from the circuit board pad. As the push frame 502 continues to move downward, it contacts the top of the piston rod 603 and applies pressure, overcoming the elastic force of the return spring 6031 to push the piston rod 603 downward. During this process, the inner cavity volume of the cylinder body 602 decreases, and the internal solder paste is sequentially pushed open the one-way valve of the hose 605 under the action of pressure and flows to the welding area of the circuit board through the dispensing gun 606, completing the solder paste pre-filling process. After the welding process is started, the robotic arm 102 accurately places the chip in the area coated with the solder paste, and then the hot air gun heats the chip. The high temperature causes the solder paste to quickly melt and evenly infiltrate the chip pins and the circuit board pads. Using the soldering aid characteristics and bonding effect of the solder paste, the bonding strength of the welding interface is significantly enhanced, effectively preventing the chip from cracking due to thermal stress. After the welding operation is completed, the cylinder 501 drives the push frame 502 to move upward and reset. When the push frame 502 disengages from the piston rod 603, the return spring 6031 releases its elastic potential energy, driving the piston rod 603 to move upward and reset, creating a negative pressure environment inside the cylinder body 602. At this time, the solder paste in the storage barrel 601 pushes open the one-way valve of the delivery pipe 604 under the action of atmospheric pressure and refills the inner cavity of the cylinder body 602, completing the automatic replenishment cycle of the solder paste and preparing for the next welding operation.

Claims

1. An automatic chip welding positioning device based on machine vision, characterized in that: It includes a bracket (1), a conveying assembly (101), a robotic arm (102), an outer frame (103), a controller (104), a vision system (105), an adjusting frame (106), a vision sensor (107), a first frame bar (108), a second frame bar (109), a moving assembly, an adjusting assembly and a lifting limit assembly. At the top of the bracket (1), a conveying assembly (101) is installed. In the middle of the top of the bracket (1), an outer frame (103) is connected. At the position on the right side of the outer frame (103) at the top of the bracket (1), a robotic arm (102) is installed. On the front side wall of the outer frame (103), a controller (104) is installed. On the left side wall of the outer frame (103), a vision system (105) is installed. Inside the outer frame (103), a moving assembly is provided. An adjusting frame (106) is installed on the moving assembly. At the upper end of the adjusting frame (106), a vision sensor (107) is installed, and at the lower end, it is connected to a first frame bar (108). A second frame bar (109) is slidably connected to the first frame bar (108), and the two are in an L-shaped structure, jointly forming a square frame. The conveying assembly (101), the robotic arm (102), the vision system (105) and the vision sensor (107) are all electrically connected to the controller (104). An adjusting assembly is provided on the adjusting frame (106), and a lifting limit assembly is provided on the outer frame (103).

2. The automatic welding positioning device for chips based on machine vision according to claim 1, wherein: The surfaces of the first frame bar (108) and the second frame bar (109) are coated with a nano-scale high-temperature resistant insulating coating, and the coating thickness is 5 - 10 μm.

3. The automatic welding positioning device for chips based on machine vision according to claim 1, characterized in that: Light bars are connected to the tops of the first frame bar (108) and the second frame bar (109) to assist the vision sensor (107) in identifying the contours and positions of the first frame bar (108) and the second frame bar (109).

4. The automatic welding positioning device for chips based on machine vision according to claim 1, wherein: The moving assembly includes a vertical slide rail (201), a lifting frame (202), a moving frame (203), a driving motor (204) and a transmission belt (205). On the front and rear sides inside the outer frame (103), vertical slide rails (201) are symmetrically connected left and right. A lifting frame (202) is slidably connected between each pair of front and rear symmetric vertical slide rails (201). A moving frame (203) is slidably connected between the two lifting frames (202). The adjusting frame (106) is slidably connected to the moving frame (203). On the moving frame (203), a driving motor (204) and a transmission belt (205) are installed. The output shaft of the driving motor (204) is connected to the driving wheel of the transmission belt (205). The adjusting frame (106) is connected to the lower belt of the transmission belt (205). On the right lifting frame (202), a driving motor (204) and a transmission belt (205) are also installed. The output shaft of this driving motor (204) is connected to the driving wheel of this transmission belt (205). The moving frame (203) is connected to the upper belt of this transmission belt (205). Both driving motors (204) are electrically connected to the controller (104).

5. The automatic welding positioning device for chips based on machine vision according to claim 1, characterized in that: The adjustment component includes a micro electric cylinder (301), a moving block (302), a transverse rack (303), a longitudinal rack (304) and a gear (305). A micro electric cylinder (301) is installed at the lower end of the adjustment frame (106). The micro electric cylinder (301) is electrically connected to the controller (104). The micro electric cylinder (301) is connected to the first frame bar (108). A moving block (302) is connected to the telescopic rod of the micro electric cylinder (301). The moving block (302) is slidably connected to the first frame bar (108). The second frame bar (109) is also slidably connected to the moving block (302). A gear (305) is rotatably connected inside the moving block (302). A longitudinal rack (304) is connected to the right side wall of the second frame bar (109). A transverse rack (303) is connected to the front side wall of the first frame bar (108). Both the transverse rack (303) and the longitudinal rack (304) are meshed with the gear (305).

6. The automatic welding positioning device for chips based on machine vision according to claim 1, wherein: The lifting limit component includes a transverse slide rail (401), a slide rod (402), a clamping plate (403), a partition plate (404) and a power component. The front and rear ends of the right lifting frame (202) are respectively slidably connected to the transverse slide rails (401). Slide rods (402) are connected to the transverse slide rails (401). A clamping plate (403) is connected between the left ends of the two slide rods (402). Partition plates (404) are connected to the bottoms of both lifting frames (202). A power component is provided on the outer frame (103).

7. The automatic welding positioning device for chips based on machine vision according to claim 1, wherein: The power component includes a cylinder (501), a pushing frame (502) and an elastic telescopic rod (503). Cylinders (501) are symmetrically connected to the top of the outer frame (103). The cylinders (501) are electrically connected to the controller (104). The telescopic rods of the two cylinders (501) penetrate inside the outer frame (103) and are jointly connected to a pushing frame (502). Elastic telescopic rods (503) are symmetrically rotatably connected to the bottom of the pushing frame (502). Springs are assembled inside the elastic telescopic rods (503). The lower ends of the elastic telescopic rods (503) are respectively rotatably connected to the corresponding slide rods (402).

8. The automatic welding positioning device for chips based on machine vision according to claim 1, characterized in that: It also includes a storage bucket (601), a cylinder body (602), a piston rod (603), a return spring (6031), a delivery pipe (604), a hose (605), a discharging gun (606) and a guide rod (607). A storage bucket (601) is fixed to the left front of the moving frame (203). A cylinder body (602) is connected to the position on the left side of the storage bucket (601) on the moving frame (203). A piston rod (603) is slidably connected inside the cylinder body (602). A return spring (6031) is connected between the piston rod (603) and the interior of the cylinder body (602). The pushing frame (502) is in contact and cooperation with the piston rod (603). A delivery pipe (604) is connected between the bottom of the storage bucket (601) and the bottom of the cylinder body (602). A one-way valve is assembled at the left port of the delivery pipe (604). The right end of the cylinder body (602) is connected and communicated with a hose (605). The right end of the hose (605) is connected with a discharging gun (606). The discharging gun (606) is installed on the adjusting frame (106) in a penetrating manner, and its muzzle faces the welding area enclosed by the first frame bar (108) and the second frame bar (109). A one-way valve is also assembled at the left port of the hose (605). A guide rod (607) is connected to the front side of the moving frame (203). The excess length part of the hose (605) is wound around the guide rod (607).

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