Miniaturized ultrahigh-temperature water-cooled high-temperature pressure sensor

Abstract

The invention discloses a miniaturized superhigh-temperature water-cooled high-temperature pressure sensor, which belongs to the technical field of pressure sensors and comprises a lead column, a shell, a conduction beam, a ceramic circuit board and a pressure-sensitive unit, and the conduction beam, the ceramic circuit board and the pressure-sensitive unit are arranged in the shell. The shell comprises a pressure sensing metal diaphragm, a threaded base, a protective sleeve and a packaging bottom cover which are fixedly connected in sequence; the pressure sensitive beam comprises a conduction beam base, the two sides of the conduction beam base are fixedly connected with a supporting beam base through beam island structures, pressure sensitive units are arranged on the beam island structures, and a supporting beam is fixedly connected with a threaded base. The pressure sensing metal diaphragm is fixedly connected with the conduction beam base through the conduction beam; the voltage-sensitive unit is electrically connected with the ceramic circuit board; the lead columns penetrate through the packaging bottom cover and the ceramic circuit board and are fixedly connected with the ceramic circuit board. The temperature tolerance of the pressure sensor is improved, and the defects that a high-temperature pressure sensor is poor in anti-interference capacity, low in response frequency, low in measurement sensitivity and the like are overcome.

Description

Technical Field

[0001] The present invention belongs to the technical field of pressure sensors, and particularly relates to a miniaturized ultra-high temperature water-cooled high temperature pressure sensor. Background Art

[0002] There is a large demand for pressure measurement applications in high temperature and high pressure environments in fields such as aerospace, petrochemical, etc. Currently, the mainstream high temperature pressure sensors on the market include piezoresistive, piezoelectric, fiber optic and strain types. Piezoresistive high temperature pressure sensors mainly include SOI (silicon on insulation) high temperature pressure sensors and SiC (silicon carbide) high temperature pressure sensors, both of which prepare silicon thin film resistors on an insulating layer and detect pressure by using the resistance value change caused by the piezoresistive effect of silicon. SOI high temperature pressure sensors have been the most studied, with the most mature technology and wide application fields. However, due to the plastic deformation of the silicon substrate material at a high temperature environment of 500 °C, as well as factors such as its structural creep and piezoresistive coefficient degradation, the measurement performance of the sensor is greatly reduced; compared with Si piezoresistive sensors, SiC high temperature pressure sensors have higher resistance to thermoplastic deformation and high temperature leakage, and can still maintain excellent piezoresistive effect performance in extremely high temperature environments, but their processing difficulty is large and the preparation technology is not yet mature. Piezoelectric high temperature pressure sensors are prepared from ceramic materials that can generate piezoelectric effects, and the upper temperature limit of resistance can reach 1000 °C. Its disadvantage is that the pressure tolerance range is small, the decoupling relationship between pressure and output signal is complex, and the reliability and stability of practical applications need to be further studied. Fiber optic high temperature pressure sensors use high temperature resistant materials to prepare a pressure sealing cavity, and convert the pressure signal into an optical signal for measurement by using the principle of optical signal interference and modulation. Due to its complex structure and poor anti-interference ability, the measurement accuracy is low, and it is not convenient to use in practice, so it has not been widely used.

[0003] In existing strain type high temperature pressure sensors, the pressure sensitive unit is generally directly exposed to the high temperature measurement environment, with poor anti-interference performance and reliability. At the same time, the sensitivity of metal strain resistors is low. These factors all limit the application and development of strain type high temperature pressure sensors. Summary of the Invention

[0004] Aiming at the deficiencies of existing strain type high temperature pressure sensors, the purpose of the present invention is to provide a miniaturized ultra-high temperature water-cooled high temperature pressure sensor, which can be used for pressure measurement in a high temperature environment exceeding 500 °C, solves the problem of failure of existing high temperature pressure sensors in ultra-high temperature environments, and overcomes the disadvantages of poor anti-interference ability, low response frequency, and low measurement sensitivity of high temperature pressure sensors.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions: A miniaturized ultra-high temperature water-cooled high temperature pressure sensor, comprising lead posts, a housing, and a conduction beam, a pressure-sensitive beam, a ceramic circuit board, and a piezoresistive unit disposed in the housing; the housing includes a pressure-sensing metal diaphragm, a fixedly connected threaded base, a protective sleeve, and a packaging bottom cover that are fixedly connected in sequence; the pressure-sensitive beam includes a conduction beam base, and both sides of the conduction beam base are fixedly connected to a support beam base through a beam island structure, and a piezoresistive unit is arranged on the beam island structure, and the support beam base is fixedly connected to the threaded base through a support beam; the pressure-sensing metal diaphragm is fixedly connected to the conduction beam base through the conduction beam; an installation groove is formed on the ceramic circuit board, the pressure-sensitive beam is installed in the installation groove, and the piezoresistive unit is electrically connected to the ceramic circuit board; the lead posts pass through the packaging bottom cover and the ceramic circuit board and are fixedly connected to the ceramic circuit board.

[0006] Further, the piezoresistive unit includes four strain resistors.

[0007] Further, a necking groove is provided between the support beam base and the beam island structure, and between the conduction beam base and the beam island structure, and strain resistors are arranged on both end surfaces of the beam island structure.

[0008] Further, the pressure-sensing metal diaphragm includes a central flat film and a sinusoidal corrugated structure located on the outer periphery of the central flat film, and the central flat film is fixedly connected to the conduction beam.

[0009] Further, the diameters of the central flat film, the conduction beam, and the conduction beam base are equal.

[0010] Further, a coordination step is provided on the support beam base, and the stepped surface at the lower end of the support beam is clamped with the coordination step.

[0011] Further, the pressure-sensing metal diaphragm, the threaded base, and the protective sleeve are all made of the same material of stainless steel.

[0012] Further, the front end of the pressure-sensing metal diaphragm and the threaded base, the front end of the threaded base and the protective sleeve, and the rear end of the protective sleeve and the packaging bottom cover are all fixed by welding.

[0013] Further, a pressure-introducing through hole is formed on the packaging bottom cover.

[0014] Further, a sealing groove is provided at the rear end of the threaded base, and a sealing washer is arranged in the sealing groove.

[0015] Compared with the prior art, the present invention has at least the following beneficial technical effects: In the present invention, the pressure-sensitive unit is arranged inside the pressure sensor. By utilizing the excellent high-temperature resistance and corrosion resistance characteristics of the housing, the pressure-sensitive unit is isolated from the high-temperature and high-pressure environment, enabling the pressure sensor to withstand temperatures above 500 °C, improving the temperature tolerance of the pressure sensor, and expanding the application range of the pressure sensor. At the same time, direct contact between the pressure-sensitive unit of the sensor and the outside world is avoided, enhancing the anti-interference ability and reliability of the sensor.

[0016] In the present invention, a welding method is used to realize the connection between the pressure-sensing metal diaphragm, the conduction beam, and the pressure-sensitive beam. This mechanical hard connection method can establish a closer coupling relationship between the structures, enabling the pressure on the pressure-sensing metal diaphragm to be transmitted to the pressure-sensitive beam faster, improving the response frequency of the pressure sensor, and enhancing the applicability of the pressure sensor in measuring high-frequency pressure signals such as shock wave pressure and pulsating pressure.

[0017] In the present invention, designs such as the beam island structure and the necking groove structure are adopted to achieve stress concentration, reducing the structural size of the sensor while obtaining sufficient sensitivity. 3D printing and microfabrication techniques are used to microfabricate and process each structural part of the sensor, and low-power segmented welding is used for sequential assembly to complete the production of the sensor, realizing the miniaturization of the pressure sensor.

[0018] In the present invention, a corrugated diaphragm and a beam island structure are designed to increase the elastic deformation of the diaphragm and the sensitive beam when the sensor is pressurized, realizing the linear conduction of the diaphragm pressure to the beam structure. The necking groove further enhances the stress concentration and improves the sensitivity of the sensor. The coordination step provides a reference benchmark and fixed support for the installation of the ceramic circuit board, enhancing the reliability of the sensor and reducing the assembly difficulty.

[0019] In the present invention, a patch-type silicon strain resistor is used as the pressure-sensitive unit, improving the sensitivity of the strain resistor.

[0020] In the present invention, the reference pressure cavity can circulate a liquid cooling medium through two pressure-introducing through-holes to reduce the internal temperature of the pressure sensor, enabling the pressure sensor to operate in a relatively low-temperature constant-temperature environment, which helps improve the thermal stability and high-temperature resistance performance of the sensor, and at the same time reduces the accuracy degradation caused by temperature drift of the sensor. Description of the Drawings

[0021] Figure 1 is the overall external view schematic diagram of the pressure sensor of the present invention; Figure 2 is the structural cross-sectional view of the sensor provided in Embodiment 1 of the present invention; Figure 3 is the schematic diagram of the disassembled state of the pressure sensor structure of the present invention; Figure 4 is the schematic diagram of the pressure-sensing diaphragm in the pressure sensor of the present invention; Figure 5 It is a cross-sectional view of the pressure-sensitive diaphragm in the pressure sensor of the present invention; Figure 6 It is a schematic diagram of the threaded base in the pressure sensor of the present invention; Figure 7 It is a schematic diagram of the sensitive beam structure in the pressure sensor of the present invention; Figure 8 It is a schematic diagram of the assembly of the coordination step of the pressure sensor of the present invention; Figure 9 It is a schematic diagram of the ceramic circuit board in the pressure sensor of the present invention; Figure 10 It is a cross-sectional view of the water-cooled sensor structure provided in Embodiment 2 of the present invention.

[0022] In the drawings: 1 - pressure-sensitive metal diaphragm, 11 - sinusoidal corrugated structure, 12 - central flat film, 2 - conduction beam, 3 - threaded base, 31 - coordination groove, 4 - support beam, 5 - pressure-sensitive beam, 51 - strain resistor, 52 - support beam base, 53 - coordination step, 54 - beam island structure, 55 - conduction beam base, 56 - necking groove, 6 - sealing gasket, 7 - ceramic circuit board, 71 - mounting groove, 72 - first lead through hole, 8 - lead post, 9 - protective sleeve, 10 - encapsulation bottom cover, 101 - pressure-introducing through hole. Detailed Description of the Invention

[0023] The present invention will be described in detail below with reference to the drawings and specific embodiments.

[0024] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or there may also be another intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be another intermediate element at the same time. The terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. used herein indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present invention.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this invention belongs. The terms used in the description of the present invention herein are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items.

[0027] Embodiment 1 A miniaturized ultra-high temperature water-cooled high temperature pressure sensor can be applied to a temperature environment above 500 °C.

[0028] Refer to Figures 1 to 9 , a miniaturized ultra-high temperature water-cooled high temperature pressure sensor, comprising a pressure-sensing metal diaphragm 1, a conduction beam 2, a threaded base 3, two support beams 4, a pressure-sensitive beam 5, a metal sealing washer 6, a ceramic circuit board 7, a lead post 8, a protection sleeve 9 and a packaging bottom cover 10.

[0029] The pressure-sensing metal diaphragm 1 is fixedly connected to the front end of the threaded base 3 by sealed welding, and the conduction beam 2 connects the pressure-sensing metal diaphragm 1 and the pressure-sensitive beam 5. The rear end of the threaded base 3 is fixedly connected to the front end of the protection sleeve 9 by welding, and the rear end of the protection sleeve 9 is welded to the packaging bottom cover 10, and the core sensitive unit of the sensor is installed within the sealed space thus formed. The outer shell parts such as the pressure-sensing metal diaphragm 1, the threaded base 3 and the protection sleeve 9 are made of heat-resistant 17-4PH stainless steel, and the good high-temperature resistance and corrosion resistance of the stainless steel are used to protect the internal sensitive electrical units. The width of the threaded base 3 does not exceed 2 cm, the length does not exceed 3 cm, the outer diameter of the protection sleeve 9 does not exceed 1.8 cm, and the length does not exceed 3 cm, which improves the miniaturization level of the sensor.

[0030] The overall appearance and cross-sectional structure of the pressure-sensing metal diaphragm 1 are as shown in Figure 4 , Figure 5 , having the dual functions of isolating external media and sensing strain. The pressure-sensing metal diaphragm 1 is in direct contact with the pressure medium to be measured and receives pressure input; the pressure-sensing metal diaphragm 1 is provided with a central flat diaphragm 12 and a sinusoidal corrugated structure 11 located on the outer periphery of the central flat diaphragm 12. The sinusoidal corrugated structure 11 can increase the elastic deformation of the diaphragm, improve the sensitivity of the sensor, and is also the optimal corrugated configuration for realizing linear pressure transmission; the diameter of the central flat diaphragm 12 does not exceed 1 / 3 of the diameter of the diaphragm and is consistent with the cross-sectional diameter of the conduction beam 2, serving as a reserved welding area for mating with the conduction beam.

[0031] The conduction beam 2 is cylindrical. One end of the conduction beam 2 is fixedly connected to the central flat diaphragm 12 of the pressure-sensing metal diaphragm 1, and the other end passes through the threaded base 3 and is fixedly connected to the conduction beam base 55 of the pressure-sensitive beam 5, and the fixed connection is realized by welding.

[0032] As shown Figure 6 in the figure, a U-shaped sealing groove is provided at the threaded rear end of the threaded base 3. A sealing washer 6 can be installed in the sealing groove, and the sealing washer 6 is a metal O-ring. The threaded base 3 and the sealing washer 6 facilitate the installation and sealing of the sensor. At least two coordination grooves 31 are provided at the bottom of the threaded base 3 for supporting and positioning the installation of the support beam 4 on the threaded base. The lower ends of the two support beams 4 are respectively inserted into the two coordination grooves 31 and are fixedly connected to the threaded base 3 by welding. The distance between the two support beams 4 is increased as much as possible to increase the length of the pressure-sensitive beam 5 and obtain higher sensitivity. The shape of the support beam base 52 of the pressure-sensitive beam 5 is the same as that of the support beam 4, and the two are fixedly connected by welding. The support beam 4 provides support and fixation for the pressure-sensitive beam 5.

[0033] The pressure-sensitive beam 5 includes a support beam base 52, a beam island structure 54, and a conduction beam base 55. The center of the sensitive beam is a cylindrical conduction beam base 55. The cross-sectional diameter of the conduction beam base 55 is the same as the cross-sectional diameter of the conduction beam 2, which is reserved for connection with the conduction beam. One end of the conduction beam base 55 is respectively connected to one end of the beam island structure 54, and the other end of the beam island structure 54 is fixedly connected to the support beam base 52. The support beam base 52 is arranged at both ends for coordination connection with the support beam 4 and provides fixed support for the overall structure of the pressure-sensitive beam 5. A coordination step 53 is provided on the support beam base 52; a necking groove 56 is provided between the support beam base 52 and the beam arm, and between the conduction beam base 55 and the beam arm for stress concentration; the beam arm is set as a beam island structure for increasing the structural sensitivity. The beam island structure 54 and the necking groove 56 are designed to improve the sensitivity of the pressure-sensitive beam 5, greatly reducing the design requirements for the length of the sensitive beam, enabling it to be installed in a protective sleeve 9 with an inner diameter of 1.6 cm, and reducing the size of the sensor. Strain resistors 51 are provided in the regions of both ends of the beam island structure 54 located between the two relatively arranged necking grooves 56.

[0034] As shown Figure 7 in the figure, the pressure-sensitive beam 5 is made of 17-4PH stainless steel by 3D printing technology. After completion, four top corners are cut off to form four coordination steps 53 for positioning and fixing when installing the ceramic circuit board 7. The assembly schematic diagram is as shown Figure 8 in the figure. After polishing the surface of the sensitive beam 5, four strain resistors 51 are sintered to the area near the necking groove 56 on the surface of the sensitive beam 5 by the glass micro-melting process. The pressure-sensitive beam 5 is designed with a beam island structure 54 and a necking groove 56 to achieve stress concentration and improve the sensitivity of the sensor.

[0035] The structures of the conduction beam 2, the support beam 4, and the pressure-sensitive beam 5 are all made of the same metal material and are formed into a hard connection through segmented welding, enabling the sensor to obtain a high response frequency. The strain resistor 51 uses a single-crystal silicon resistor chip or a Karma alloy strain gauge to solve the problem of insufficient sensitivity of traditional strain resistors.

[0036] The ceramic circuit board 7 is used to realize the electrical connection between the strain resistor 51 and the lead post 8. The structure of the ceramic circuit board 7 is as Figure 9 shown. The diameter of the ceramic circuit board 7 is about 1000 um smaller than the inner diameter of the protective sleeve 9. The ceramic circuit board 7 is provided with a mounting groove 71 and four first lead through holes 72. The pressure-sensitive beam 5 passes through the mounting groove 71 to ensure that the ceramic circuit board 7 falls on the coordination step 53, realizing that the lower end surfaces of the ceramic circuit board 7 and the pressure-sensitive beam 5 are installed on the same plane. The mounting groove 71 is about 500 um wider than the pressure-sensitive beam 5, leaving a redundant gap for potential thermal expansion. The four strain resistors 51 are connected to the ceramic circuit board 7 through wire bonding and form a Wheatstone bridge by the circuit on the ceramic circuit board 7. The strain resistor 51 is electrically connected to the outside through the lead post 8, improving the integration and miniaturization of the sensor. The strain resistor 51 is wire-bonded to the pads on the ceramic circuit board 7, and the pads are connected to the first lead through holes 72 through the circuits on the ceramic circuit board 7.

[0037] After the lead post 8 passes through the first lead through hole 72 on the ceramic circuit board 7, conductive paste is filled in the hole of the first lead through hole 72 and sintered to realize the electrical conduction between the lead post 8 and the circuit on the board. Then, the lead post 8 continues to pass through the second lead through hole located on the encapsulation bottom cover 10, and insulating paste is filled in the second lead through hole and sintered to fix the lead post 8 on the encapsulation bottom cover 10 and realize the sealed connection between the lead post 8 and the encapsulation bottom cover 10. The encapsulation bottom cover 10 is buckled at the rear end of the protective sleeve 9 and is fixed and sealed with the protective sleeve 9 through welding.

[0038] The pressure sensor is composed of laser welding of each part structure made of the same stainless steel material, ensuring the compatibility of the welding materials, enhancing the sensor's sealing performance and structural strength, reducing the additional stress caused by the mismatch of the thermal expansion coefficient, and improving the high-temperature resistance of the sensor.

[0039] The working principle of this pressure sensor is as follows: When the pressure-sensitive metal diaphragm 1 contacts the pressure medium to be measured, a pressure difference is formed between the inside and outside of the diaphragm, causing the pressure-sensitive metal diaphragm 1 to deform. The conduction beam 2 conducts the stress of the pressure-sensitive metal diaphragm 1 linearly and uniformly to the middle of the pressure-sensitive beam 5 to the greatest extent. The two ends of the pressure-sensitive beam 5 are fixed on the support beam 4, and the support beam 4 is fixedly connected to the threaded base 3. The stress introduced from the conduction beam 2 forms stress concentration areas in the middle and both ends of the pressure-sensitive beam 5. The strain resistors 51 distributed on the stress concentration areas convert the stress change into a resistance change.

[0040] Example 2 A water-cooled strain-resistant ultra-high temperature pressure sensor, the sensor structure is as Figure 10 shown. Based on Example 1, the difference between this embodiment and Example 1 is that in this embodiment, the pressure-sensitive metal diaphragm 1, the threaded base 3, the protective sleeve 9 and the encapsulation bottom cover 10 are also connected by welding as in Example 1, and the internal space formed thereby serves as a reference pressure cavity. The difference is that a pressure-introducing through-hole 101 is added to the encapsulation bottom cover 10 installed at the rear end of the sensor, so that liquid cooling media such as silicone oil can circulate through the pressure-introducing through-hole 101 into the reference pressure cavity. When the pressure sensor works in a high-temperature environment, the liquid medium in the reference pressure cavity helps to reduce the internal temperature of the sensor, enables the pressure-sensitive unit of the sensor to work in a relatively low-temperature constant-temperature environment, and at the same time reduces the accuracy degradation of the sensor caused by temperature drift, improves the thermal stability and high-temperature resistance performance of the sensor, and further broadens the temperature tolerance range of the sensor.

[0041] The term "consisting of" in describing a combination shall include the identified elements, ingredients, components or steps and other elements, ingredients, components or steps that do not substantially affect the basic novel features of the combination. The use of the terms "comprising" or "including" to describe the combinations of elements, ingredients, components or steps herein also contemplates embodiments consisting essentially of these elements, ingredients, components or steps. By using the term "may" herein, it is intended to indicate that any attribute described as "may" included is optional.

[0042] A plurality of elements, ingredients, components or steps can be provided by a single integrated element, ingredient, component or step. Alternatively, a single integrated element, ingredient, component or step can be divided into separate multiple elements, ingredients, components or steps. The disclosure of "a" or "an" used to describe an element, ingredient, component or step does not mean to exclude other elements, ingredients, components or steps.

[0043] It should be understood that the above description is for illustrative purposes and not for limitation. Many embodiments and many applications other than the provided examples will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of this teaching should not be determined with reference to the above description, but should be determined with reference to the full scope of the foregoing claims and the equivalents of these claims. For the sake of completeness, all articles and references including patent applications and publications are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein in the foregoing claims is not intended to abandon such subject matter, nor should it be considered that the applicant has not considered such subject matter as part of the disclosed inventive subject matter.

Claims

1. Miniaturized ultra-high temperature water-cooled high temperature pressure sensor, characterized in that, It includes a lead post (8), a housing, a conduction beam (2), a pressure-sensitive beam (5), a ceramic circuit board (7), and a pressure-sensitive unit disposed in the housing; the housing includes a pressure-sensitive metal diaphragm (1), a fixedly connected threaded base (3), a protective sleeve (9), and a packaging bottom cover (10) that are fixedly connected in sequence; The pressure-sensitive beam (5) includes a conduction beam base (55), and both sides of the conduction beam base (55) are fixedly connected to a support beam base (52) through beam island structures (54). A pressure-sensitive unit is provided on the beam island structures (54), and the support beam base (52) is fixedly connected to the threaded base (3) through a support beam (4); The pressure-sensitive metal diaphragm (1) is fixedly connected to the conduction beam base (55) through the conduction beam (2); An installation groove (71) is formed on the ceramic circuit board (7), the pressure-sensitive beam (5) is installed in the installation groove (71), and the pressure-sensitive unit is electrically connected to the ceramic circuit board (7); the lead post (8) passes through the packaging bottom cover (10) and the ceramic circuit board (7) and is fixedly connected to the ceramic circuit board (7).

2. The miniaturized ultra-high temperature water-cooled high temperature pressure sensor according to claim 1, wherein, The pressure-sensitive unit includes four strain resistors (51).

3. The miniaturized ultra-high temperature water-cooled high temperature pressure sensor according to claim 1, characterized in that, Necking grooves (56) are provided between the support beam base (52) and the beam island structures (54), and between the conduction beam base (55) and the beam island structures (54). Strain resistors (51) are provided on both end surfaces of the beam island structures (54).

4. The miniaturized ultra-high temperature water-cooled high temperature pressure sensor according to claim 1 or 3, characterized in that, The pressure-sensitive metal diaphragm (1) includes a central flat film (12) and a sine corrugated structure (11) located on the outer periphery of the central flat film (12), and the central flat film (12) is fixedly connected to the conduction beam (2).

5. The miniaturized ultra-high temperature water-cooled high temperature pressure sensor according to claim 4, characterized in that, The central flat film (12), the conduction beam (2), and the conduction beam base (55) have the same diameter.

6. The miniaturized ultra-high temperature water-cooled high temperature pressure sensor according to claim 1, characterized in that, A coordination step (53) is provided on the support beam base (52), and the stepped surface at the lower end of the support beam (4) is clamped with the coordination step (53).

7. The miniaturized ultra-high temperature water-cooled high temperature pressure sensor according to claim 1, characterized in that, The pressure-sensitive metal diaphragm (1), the threaded base (3), and the protective sleeve (9) are all made of the same material stainless steel.

8. The miniaturized ultra-high temperature water-cooled high temperature pressure sensor according to claim 1 or 7, characterized in that, The front ends of the pressure-sensitive metal diaphragm (1) and the threaded base (3), the front ends of the threaded base (3) and the protective sleeve (9), and the rear end of the protective sleeve (9) and the packaging bottom cover (10) are all fixed by welding.

9. The miniaturized ultra-high temperature water-cooled high temperature pressure sensor according to claim 1, wherein, A pressure-introducing through hole (101) is formed on the packaging bottom cover (10).

10. The miniaturized ultra-high temperature water-cooled high temperature pressure sensor according to claim 1, characterized in that, A sealing groove is provided at the rear end of the threaded base (3), and a sealing washer (6) is provided in the sealing groove.

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