Heat dissipation device and server

Abstract

The invention discloses a heat dissipation device and a server, and relates to the technical field of servers, the heat dissipation device comprises a mounting assembly, a fixing assembly, a first heat dissipation assembly and a second heat dissipation assembly, a mounting groove is formed in the mounting assembly, the mounting groove is suitable for fixing a server unit, the fixing assembly is arranged on the upper portion of the mounting assembly, and the first heat dissipation assembly and the second heat dissipation assembly are arranged in the mounting groove. The first heat dissipation assembly is arranged above the fixing assembly, the first heat dissipation assembly is provided with a cooling fin set and a liquid cooling flow channel, the liquid cooling flow channel is located in the cooling fin set, the second heat dissipation assembly is arranged on the side, away from the server unit, of the first heat dissipation assembly, an air cooling flow channel is formed in the second heat dissipation assembly, and at least part of the cooling fin set is located in the air cooling flow channel. And a part of the liquid cooling flow channel is located in the air cooling flow channel. According to the heat dissipation device, the mode of combining air cooling and liquid cooling is utilized, the heat dissipation requirement in the high-density computing environment is met, and the heat dissipation device is simple in overall structure and convenient to assemble and maintain.

Description

Technical Field

[0001] The present invention relates to the technical field of servers, and more particularly to a heat dissipation device and a server. Background Art

[0002] It is pointed out in the related art that a hard disk storage server generates a lot of heat during operation. The liquid cooling heat dissipation technology for hard disk storage servers is specifically used to quickly discharge this heat. Compared with the commonly used air cooling method in the past, the liquid cooling heat dissipation has a higher heat conduction efficiency, can better take away the heat to cool the server, and keep the server at the optimal working temperature. This technology is particularly suitable for high-density computing environments such as data centers or supercomputers. However, there are many problems with the previous liquid cooling systems. The traditional liquid cooling system cannot provide sufficient cooling capacity in a high-density computing environment. There is no direct heat dissipation structure outside the server body, resulting in overheating of components, which in turn affects performance and lifespan. Moreover, the existing liquid cooling systems often have problems of complex installation and difficult maintenance. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. For this reason, the present invention provides a heat dissipation device that can more effectively control the temperature of the server unit, reduce the problems of performance degradation and shortened hardware lifespan caused by overheating, meet the heat dissipation requirements in a high-density computing environment, and the overall structure of the heat dissipation device is simple, convenient for assembly and maintenance.

[0004] The present invention also provides a server.

[0005] The heat dissipation device according to the first aspect of the present invention is used to dissipate heat from the server unit. The heat dissipation device includes: a mounting component, the mounting component is formed with a mounting groove, and the mounting groove is adapted to fix the server unit; a fixing component, the fixing component is arranged on the upper part of the mounting component; a first heat dissipation component, the first heat dissipation component is arranged above the fixing component, the first heat dissipation component has a heat sink group and a liquid cooling channel, and the liquid cooling channel is located in the heat sink group; a second heat dissipation component, the second heat dissipation component is arranged on the side of the first heat dissipation component facing away from the server unit, the second heat dissipation component is formed with an air cooling channel, at least part of the heat sink group is located in the air cooling channel, and part of the liquid cooling channel is located in the air cooling channel.

[0006] According to the heat dissipation device of the present invention, by providing a first heat dissipation component and a second heat dissipation component, the first heat dissipation component is provided with a liquid cooling flow channel, the second heat dissipation component is provided with an air cooling flow channel, and at least a part of the first heat dissipation component is located within the air cooling flow channel. In this way, by combining air cooling and liquid cooling, heat can not only be quickly conducted away through the liquid, but also be further cooled by the air flow, or a choice can be made between liquid cooling and air cooling. This can not only more effectively control the temperature, but also reduce the problems of performance degradation and shortened hardware lifespan caused by overheating, meeting the heat dissipation requirements in a high-density computing environment, and the overall structure of the heat dissipation device is simple, facilitating assembly and maintenance.

[0007] In some feasible embodiments of the present invention, a channel is formed within the heat sink group. The first heat dissipation component includes a liquid cooling pipe, the liquid cooling flow channel is formed within the liquid cooling pipe, and at least a part of the liquid cooling pipe is located within the channel.

[0008] In the above technical solution, by integrating the liquid cooling pipe within the heat sink group, the liquid cooling pipe is closely combined with the heat sink group, improving the assembly compactness of the heat dissipation device, saving the space volume of the heat dissipation device. The coolant flows within the liquid cooling pipe, and the coolant absorbs and takes away heat, ensuring the efficiency of heat exchange and improving the heat conduction efficiency.

[0009] In some feasible embodiments of the present invention, the heat sink group includes a plurality of heat sink single pieces. The plurality of heat sink single pieces are arranged in their thickness directions. A through hole is formed on each heat sink single piece, and each through hole communicates in the thickness direction of the heat sink single piece to define the channel. The channel includes a first through section and a second through section. Both the first through section and the second through section extend in the thickness direction of the heat sink single piece, and the first through section and the second through section are arranged at intervals.

[0010] In the above technical solution, by providing a heat sink group composed of a plurality of heat sink single pieces, the heat dissipation area is increased, the efficiency of heat conduction is improved, facilitating modular manufacturing and replacement. The plurality of heat sink single pieces are stacked together along their thickness directions. A through hole is formed on each heat sink single piece, and the through hole provides a positioning space for the insertion of the liquid cooling pipe. The through holes on the plurality of heat sink single pieces are aligned after stacking, thus forming a continuous channel. The channel is used to accommodate the liquid cooling pipe. The channel includes a first through section and a second through section, guiding the flow direction of the coolant and avoiding the occurrence of coolant short circuit, improving the heat exchange uniformity.

[0011] In some feasible embodiments of the present invention, the liquid cooling pipe has a first pipe section, a second pipe section, and a third pipe section connected in sequence. The first pipe section and the third pipe section are parallel and spaced apart in the radial direction, and the second pipe section extends along an arc. The first pipe section is located within the first through section, and the third pipe section is located within the second through section.

[0012] In the above technical solution, by arranging the first pipe section and the third pipe section in parallel at intervals and the second pipe section connected between the first pipe section and the third pipe section, the distance of the liquid cooling flow path is extended without changing the space volume, the cooling path is increased, the heat exchange efficiency is improved, and the compactness and reliability of the heat dissipation device are enhanced.

[0013] In some feasible embodiments of the present invention, the first heat dissipation component includes: a mounting frame, the mounting frame is connected between the heat sink group and the second heat dissipation component, the mounting frame is formed with a first connecting portion, the heat sink group is formed with a second connecting portion, and the mounting frame and the heat sink group are cooperatively connected through the cooperation of the first connecting portion and the second connecting portion.

[0014] In the above technical solution, the connection between the mounting frame and the heat sink group is realized through the cooperation of the first connecting portion and the second connecting portion, so that the heat sink group can be more firmly connected to the mounting frame, avoiding the situation of the heat sink group falling off, and at the same time facilitating assembly and maintenance.

[0015] In some feasible embodiments of the present invention, the second heat dissipation component includes a fixing frame and a fan, the fan is arranged in the fixing frame, the fixing frame is formed with a third connecting portion, the mounting frame is formed with a fourth connecting portion, and the mounting frame and the fixing frame are cooperatively connected through the cooperation of the third connecting portion and the fourth connecting portion.

[0016] In the above technical solution, the connection between the fixing frame and the mounting frame is realized through the cooperation of the third connecting portion and the fourth connecting portion, so that the fixing frame and the mounting frame can be stably connected, avoiding the situation of the fixing frame and the mounting frame being separated from each other, improving the connection stability between the fixing frame and the mounting frame, and reducing the assembly difficulty between the mounting frame and the fixing frame.

[0017] In some feasible embodiments of the present invention, a mounting strip is arranged in the fixing frame, the mounting strip is detachably connected to the fixing frame, and the fan is arranged on the mounting strip.

[0018] In the above technical solution, the mounting strip is connected in the fixing frame, providing an assembly position for the fan. The mounting strip is used to carry the fan or other air-cooling components. The mounting strip is detachably connected to the fixing frame, facilitating the disassembly and assembly of the fan for maintenance, replacement or cleaning of the fan, improving the maintainability of the heat dissipation device, and the mounting strip can be adapted to different fan models with different sizes, air volumes and rotation speeds.

[0019] In some feasible embodiments of the present invention, the fixing component includes: a first carrier plate and a second carrier plate. The first carrier plate is disposed at the bottom of the heat sink group, and the second carrier plate is disposed on both sides of the first carrier plate in the thickness direction of the heat sink group. The first carrier plate is connected to the second carrier plate, and the second carrier plate is connected to the heat sink group.

[0020] In the above technical solution, by providing the first carrier plate and the second carrier plate, they jointly play the roles of bearing, positioning, and connecting the heat sink group, ensuring the structural stability of the fixing component. The first carrier plate is located below the heat sink group and is used to support and connect the heat sink group. The second carrier plates are distributed on both sides of the first carrier plate. The first carrier plate and the second carrier plate can be connected by welding, fasteners, snap connection, etc., realizing the effective fixation and protection of the heat sink group.

[0021] In some feasible embodiments of the present invention, the first carrier plate is formed with a fifth connection portion, and the second carrier plate is formed with a sixth connection portion. The first carrier plate and the second carrier plate are connected in cooperation through the fifth connection portion and the sixth connection portion.

[0022] In the above technical solution, the connection between the first carrier plate and the second carrier plate is realized through the cooperation of the fifth connection portion and the sixth connection portion, enabling the first carrier plate and the second carrier plate to be stably connected, avoiding the situation of the first carrier plate and the second carrier plate separating from each other, and improving the connection stability of the first carrier plate and the second carrier plate.

[0023] In some feasible embodiments of the present invention, a limiting member is provided on the second carrier plate, and the limiting member is located on both sides of the heat sink group in its thickness direction.

[0024] In the above technical solution, the heat sink group is located between the limiting members. The limiting members are used to position and fix the heat sink group, ensuring that the heat sink group will not shift or loosen after installation, thereby improving the stability and reliability of the heat dissipation device. At the same time, the vibration resistance of the heat sink group is enhanced, facilitating assembly during assembly, and improving the assembly accuracy and assembly efficiency.

[0025] In some feasible embodiments of the present invention, the first heat dissipation component further includes: a limiting seat, and a limiting groove is formed on the limiting seat. At least part of the first pipe section and at least part of the second pipe section are located in the limiting groove.

[0026] In the above technical solution, the limiting seat cooperates with the liquid cooling pipe to ensure that the liquid cooling pipe maintains a stable position after assembly. The limiting groove on the limiting seat limits the liquid cooling pipe, preventing the liquid cooling pipe from shifting, vibrating, or deforming during operation, playing a role in supporting the liquid cooling pipe, reducing the stress concentration of the liquid cooling pipe, and reducing the risk of fatigue fracture.

[0027] In some feasible embodiments of the present invention, the mounting assembly includes a mounting member and an adjusting member. The mounting groove is formed on the mounting member, and the adjusting member is connected to the mounting member to fix the server unit.

[0028] In the above technical solution, the mounting assembly realizes the positioning and bearing of the server unit through the mounting groove on the mounting member. By applying a clamping force to the server unit through the adjusting member, it can be applicable to server units of various specifications and sizes, improving the adaptability of the heat dissipation device. Moreover, the structure of the mounting assembly is simple, facilitating assembly and maintenance.

[0029] In some feasible embodiments of the present invention, the adjusting member is threadedly connected to the mounting member. One side surface of the adjusting member facing the mounting groove is formed as an adjusting surface, and the adjusting surface is adapted to abut and connect with the server unit.

[0030] In the above technical solution, the adjusting member and the mounting member are connected by thread meshing. An adjusting surface is formed on the adjusting member, and the adjusting surface abuts against the server unit so that the server unit is stably clamped between the adjusting members.

[0031] The server according to the second aspect of the present invention includes: a server unit and a heat dissipation device according to the first aspect of the present invention. The server unit is adapted to be disposed on the heat dissipation device.

[0032] For the server according to the present invention, by providing the heat dissipation device according to the first aspect of the present invention, therefore, it has the same technical effects, that is, the first heat dissipation component is provided with a liquid cooling flow channel, the second heat dissipation component is provided with an air cooling flow channel, and at least part of the first heat dissipation component is located in the air cooling flow channel. In this way, by using a combination of air cooling and liquid cooling, the heat can not only be quickly conducted out through the liquid, but also be further cooled by the air flow, or a choice can be made between liquid cooling and air cooling, which can not only more effectively control the temperature, but also reduce the problems of performance degradation and shortened hardware life caused by overheating, and is especially suitable for the heat dissipation requirements in a high-density computing environment. Moreover, the overall structure of the heat dissipation device is simple, facilitating assembly and maintenance.

[0033] In some feasible embodiments of the present invention, the server unit includes a housing, and a heat dissipation portion is formed on the housing. The heat dissipation portion is formed on opposite side walls of the housing.

[0034] The additional aspects and advantages of the present invention will be partially given in the following description, partially become apparent from the following description, or be understood through the practice of the present invention. Description of the Drawings

[0035] To more clearly illustrate the embodiments of the present invention, the following will briefly introduce the accompanying drawings required for the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0036] Figure 1 Schematic diagram of a heat dissipation device provided by an embodiment of the present invention; Figure 2 For Figure 1 Schematic diagram of another perspective of the heat dissipation device shown in Figure 3 For Figure 1 Assembly schematic diagram of the heat dissipation device and the server unit shown in Figure 4 For Figure 1 Schematic diagram of the structure of the first heat dissipation component shown in Figure 5 For Figure 1 Exploded view of the mounting component shown in Figure 6 For Figure 1 Exploded view of the first heat dissipation component and the second heat dissipation component shown in

[0037] Among them, the above-mentioned accompanying drawings include the following reference numerals: 100, heat dissipation device; 1, mounting component; 11, mounting piece; 111, mounting groove; 12, adjusting piece; 13, protective pad; 2, fixing component; 21, first carrier plate; 211, third connection hole; 22, second carrier plate; 221, fourth connection hole; 222, limiting piece; 3, first heat dissipation component; 31, heat sink group; 311, channel; 3111, first through section; 3112, second through section; 312, connecting protrusion; 32, liquid cooling pipe; 321, first pipe section; 322, second pipe section; 323, third pipe section; 324, sealing joint; 33, mounting frame; 331, connecting groove; 332, second connection hole; 34, limiting seat; 4, second heat dissipation component; 41, fixing frame; 411, first connection hole; 412, mounting strip; 42, fan; 5, fastener; 200, server unit; 201, housing; 202, heat dissipation part. Detailed implementation manners

[0038] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0039] It should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. The terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, where the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, where the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of either one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above accompanying drawing descriptions are intended to cover non-exclusive inclusion.

[0041] In the description of the embodiments of the present invention, technical terms such as "first" and "second" are only used to distinguish different objects, and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity, specific order or primary-secondary relationship of the indicated technical features. In the description of the embodiments of the present invention, the meaning of "a plurality" is more than two, unless otherwise specifically defined.

[0042] Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The phrase occurring in various places in the specification is not necessarily referring to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive of other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0043] In the description of the embodiments of the present invention, the term "and / or" is merely a description of the associated relationship of the associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after.

[0044] In the description of the embodiments of the present invention, the term "a plurality" refers to more than two (including two).

[0045] In the related art, it is pointed out that a hard disk storage server generates a lot of heat when running. The liquid cooling heat dissipation technology of the hard disk storage server is specifically used to quickly discharge this heat. Compared with the commonly used air cooling method before, the heat conduction efficiency of liquid cooling is higher, and it can better take away the heat to cool the server and keep the server at the optimal working temperature. This technology is particularly suitable for high-density computing environments, such as data centers or supercomputers. However, there are many problems with the previous liquid cooling systems. The traditional liquid cooling system cannot provide sufficient cooling capacity in a high-density computing environment. There is no direct heat dissipation structure outside the server body, resulting in overheating of components, which in turn affects performance and lifespan. Moreover, existing liquid cooling systems often have problems such as complex installation and difficult maintenance. Therefore, how to improve the heat dissipation effect of the server has become an urgent issue to be solved.

[0046] Based on the above considerations, in order to improve the heat dissipation effect of the server, the inventor has conducted in-depth research and designed a heat dissipation device. The following refers to Figures 1-6 Describe the heat dissipation device according to the first aspect embodiment of the present invention.

[0047] The heat dissipation device 100 according to the first aspect embodiment of the present invention includes: a mounting component 1, a fixing component 2, a first heat dissipation component 3, and a second heat dissipation component 4.

[0048] Specifically, the mounting component 1 is formed with a mounting groove 111, and the mounting groove 111 is adapted to fix the server unit 200. The fixing component 2 is disposed on the upper part of the mounting component 1, and the first heat dissipation component 3 is disposed above the fixing component 2. The first heat dissipation component 3 has a heat sink group 31 and a liquid cooling flow channel, and the liquid cooling flow channel is located within the heat sink group 31. The second heat dissipation component 4 is disposed on the side of the first heat dissipation component 3 facing away from the server unit 200, and the second heat dissipation component 4 is formed with an air cooling flow channel. At least a part of the heat sink group 31 is located within the air cooling flow channel, and a part of the liquid cooling flow channel is located within the air cooling flow channel.

[0049] It can be understood that the mounting component 1 has a mounting groove 111 for stably mounting the server unit 200, ensuring that the server unit 200 can be firmly integrated into the heat dissipation device 100. The fixing component 2 is located on the upper part of the mounting component 1 and is used to mount the first heat dissipation component 3, providing a mounting position for the first heat dissipation component 3 to ensure that the first heat dissipation component 3 can be stably and safely assembled in place. The first heat dissipation component 3 includes a heat sink group 31 and a liquid cooling flow channel. The liquid cooling flow channel is disposed inside the heat sink group 31, and liquid flows within the liquid cooling flow channel. After absorbing heat, the liquid takes the heat out of the heat dissipation device 100, thereby achieving a cooling effect. The liquid cooling flow channel is in direct contact with the heat sink group 31, so that heat can be effectively taken away from the heat sink group 31, maintaining the server unit 200 at a lower operating temperature. The second heat dissipation component 4 is located on the side of the first heat dissipation component 3 facing away from the server unit 200, and the second heat dissipation component 4 is formed with an air cooling flow channel. The setting of the air cooling flow channel further enhances the heat dissipation effect. In particular, at least a part of the heat sink group 31 and at least a part of the liquid cooling flow channel are both located within the air cooling flow channel. In this way, the heat sink group 31 can accelerate the cooling speed through air flow, increasing the overall heat dissipation efficiency of the heat dissipation device 100.

[0050] Refer to Figures 1-3 As shown, the mounting component 1 has a mounting groove 111, and the server unit 200 is located within the mounting groove 111. The mounting component 1 can stably connect the server unit 200 to the heat dissipation device 100. The fixing component 2 is connected above the mounting component 1, and the first heat dissipation component 3 is connected above the fixing component 2. The first heat dissipation component 3 has a heat sink group 31 and a liquid cooling flow channel, and liquid flows within the liquid cooling flow channel. The liquid can absorb the heat of the server unit 200 and take the heat away, so that the server unit 200 is always at a suitable operating temperature. The second heat dissipation component 4 is connected above the first heat dissipation component 3, and the second heat dissipation component 4 is formed with an air cooling flow channel. At least a part of the heat sink group 31 is located within the air cooling flow channel. In this way, air flow can take away the temperature of the heat sink group 31, playing a role in cooling the heat sink group 31. At the same time, at least a part of the liquid cooling flow channel is also located within the air cooling flow channel. In this way, while air flow takes away the heat of the heat sink group 31, it can also take away the temperature of the liquid cooling flow channel.

[0051] When the heat dissipation device 100 is working, when the server unit 200 needs to be cooled down, the first heat dissipation component 3 and / or the second heat dissipation component 4 can be turned on according to the actual temperature of the server unit 200. That is to say, when the temperature of the server unit 200 is relatively high, the first heat dissipation component 3 or the second heat dissipation component 4 can be selected to be turned on. If the temperature of the server unit 200 reaches the threshold value, the first heat dissipation component 3 and the second heat dissipation component 4 can be turned on simultaneously. Thus, both resource waste is reduced and a better heat dissipation effect is provided.

[0052] According to the heat dissipation device 100 of the embodiment of the present invention, by providing the first heat dissipation component 3 and the second heat dissipation component 4, the first heat dissipation component 3 is provided with a liquid cooling flow channel, the second heat dissipation component 4 is provided with an air cooling flow channel, and at least a part of the first heat dissipation component 3 is located in the air cooling flow channel. In this way, the combination of air cooling and liquid cooling is utilized, so that heat can not only be quickly conducted out through the liquid, but also be further cooled by the air flow, or a choice can be made between liquid cooling and air cooling. It can not only more effectively control the temperature, but also reduce the problems of performance degradation and shortened hardware life caused by overheating, meet the heat dissipation requirements in a high-density computing environment, and the overall structure of the heat dissipation device 100 is simple, facilitating assembly and maintenance.

[0053] In any embodiment of the present invention, a channel 311 is formed in the heat sink group 31. The first heat dissipation component 3 includes a liquid cooling pipe 32, and the liquid cooling flow channel is formed in the liquid cooling pipe 32. At least a part of the liquid cooling pipe 32 is located in the channel 311. It can be understood that the channel 311 in the heat sink group 31 is used to accommodate the liquid cooling pipe 32. The liquid cooling pipe 32 is a hollow pipe structure for transmitting and guiding the coolant to flow. The liquid cooling flow channel is formed in the liquid cooling pipe 32, and the coolant flows in the liquid cooling pipe 32 to absorb and carry away heat. At least a part of the liquid cooling pipe 32 is located in the channel 311, so that the liquid cooling pipe 32 can be closely combined with the heat sink group 31, improving the heat conduction efficiency. That is, the heat is first transferred to the heat sink and then transferred to the liquid cooling pipe 32 through contact. The liquid cooling pipe 32 is integrated in the heat sink group 31, saving the space volume of the heat dissipation device 100 and improving the structural compactness of the heat dissipation device 100.

[0054] Refer to Figure 4 As shown, the channel 311 is formed in the heat sink group 31. The first heat dissipation component 3 includes a liquid cooling pipe 32, and the liquid cooling flow channel is formed in the liquid cooling pipe 32. A part of the liquid cooling pipe 32 is located in the channel 311. In this way, a part of the liquid cooling flow channel is also located in the channel 311. Thus, by integrating the liquid cooling pipe 32 in the heat sink group 31, the liquid cooling pipe 32 is closely combined with the heat sink group 31, improving the assembly compactness of the heat dissipation device 100, saving the space volume of the heat dissipation device 100. The coolant flows in the liquid cooling pipe 32, and the coolant absorbs and carries away heat, ensuring the efficiency of heat exchange and improving the heat conduction efficiency.

[0055] In any embodiment of the present invention, the heat sink group 31 includes a plurality of heat sink single pieces, and the plurality of heat sink single pieces are arranged in their thickness directions. Through holes are formed on each heat sink single piece, and the through holes communicate with each other in the thickness direction of the heat sink single piece to define a channel 311. The channel 311 includes a first through section 3111 and a second through section 3112. Both the first through section 3111 and the second through section 3112 extend in the thickness direction of the heat sink single piece, and the first through section 3111 and the second through section 3112 are arranged at intervals. Thus, by providing the heat sink group 31 composed of a plurality of heat sink single pieces, the heat dissipation area is increased, the heat conduction efficiency is improved, and modular manufacturing and replacement are facilitated. The plurality of heat sink single pieces are stacked together in their thickness directions, and through holes are formed on each heat sink single piece. The through holes provide a positioning space for the insertion of the liquid cooling tube 32. The through holes on the plurality of heat sink single pieces are aligned after stacking, thereby forming a continuous channel 311. The channel 311 is used to accommodate the liquid cooling tube 32. The channel 311 includes a first through section 3111 and a second through section 3112, which guides the flow direction of the coolant and avoids the occurrence of coolant short circuit, thereby improving the heat exchange uniformity.

[0056] Referring to Figure 4 and Figure 6 As shown, the heat sink group 31 includes 49 heat sink single pieces. The 49 heat sink single pieces are arranged in their own thickness directions. Four through holes are formed on each heat sink single piece. The four through holes on one heat sink single piece communicate with the four through holes on the adjacent heat sink single piece correspondingly, and the corresponding through holes are coaxially arranged, that is, the four through holes on one heat sink single piece respectively correspond to the four through holes on the adjacent heat sink single piece. There are two channels 311, and each channel 311 includes a first through section 3111 and a second through section 3112. Both the first through section 3111 and the second through section 3112 extend in the thickness direction of the heat sink single piece. The first through section 3111 and the second through section 3112 are arranged at intervals. The height of the first through section 3111 is lower than the height of the second through section 3112. Moreover, the distance between the first through sections 3111 of the two channels 311 is less than the distance between the first through section 3111 and the second through section 3112 of the same channel 311.

[0057] In any embodiment of the present invention, the liquid cooling pipe 32 has a first pipe section 321, a second pipe section 322, and a third pipe section 323 connected in sequence. The first pipe section 321 and the third pipe section 323 are parallel and spaced apart in the radial direction. The second pipe section 322 extends along an arc. The first pipe section 321 is located within the first through section 3111, and the third pipe section 323 is located within the second through section 3112. Thus, by providing the first pipe section 321 and the third pipe section 323 arranged in parallel and spaced apart, and the second pipe section 322 connected between the first pipe section 321 and the third pipe section 323, the distance of the liquid cooling flow path is extended without changing the space volume, the cooling path is increased, the heat exchange efficiency is improved, and the compactness and reliability of the heat dissipation device 100 are enhanced.

[0058] Referring to Figure 4 As shown, the liquid cooling pipe 32 includes a first pipe section 321, a second pipe section 322, and a third pipe section 323. Both the first pipe section 321 and the third pipe section 323 extend in the thickness direction of the heat dissipation single piece. Both the first pipe section 321 and the third pipe section 323 extend along a straight line. The second pipe section 322 is connected between the first pipe section 321 and the second pipe section 322. The liquid cooling pipe 32 is formed into a U shape. The second pipe section 322 extends along an arc, reducing the flow resistance of the coolant and avoiding turbulence, vortex, and pressure drop loss during the flow of the coolant. The first pipe section 321 and the third pipe section 323 are located within the heat sink group 31, and the second pipe section 322 is located outside the heat sink group 31, which is convenient for assembly and maintenance.

[0059] In some feasible embodiments, a sealing joint 324 is provided at the free end of the first pipe section 321, that is, at the end where the first pipe section 321 is connected to the external cooling system. The sealing joint 324 is provided to ensure that the coolant does not leak at the connection between the liquid cooling pipe 32 and the external cooling system, and the sealing joint 324 can achieve quick connection and disconnection.

[0060] Here, the sealing joint 324 is formed as a high-temperature resistant material part. The sealing joint 324 is threadedly connected to the first pipe section 321, which is convenient for disassembly and replacement.

[0061] In any embodiment of the present invention, the first heat dissipation assembly 3 includes: a mounting frame 33. The mounting frame 33 is connected between the heat sink group 31 and the second heat dissipation assembly 4. The mounting frame 33 is formed with a first connecting portion, and the heat sink group 31 is formed with a second connecting portion. The mounting frame 33 and the heat sink group 31 are cooperatively connected through the first connecting portion and the second connecting portion. Thus, the connection between the mounting frame 33 and the heat sink group 31 is achieved through the cooperation of the first connecting portion and the second connecting portion, enabling the heat sink group 31 to be more firmly connected to the mounting frame 33, avoiding the situation of the heat sink group 31 falling off, and being convenient for assembly and maintenance at the same time.

[0062] Referring toFigure 2 and Figure 6 As shown in Figure 2 and Figure 6 , the mounting frame 33 is located between the heat sink group 31 and the second heat dissipation component 4. The second heat dissipation component 4 is connected to the upper side of the mounting frame 33, and the heat sink group 31 is connected to the lower side of the mounting frame 33. The first connecting portion is formed on the mounting frame 33, and the second connecting portion is formed on the heat sink group 31. The first connecting portion and the second connecting portion cooperate to connect the heat sink group 31 and the mounting frame 33.

[0063] Further, one of the first connecting portion and the second connecting portion is formed as a connecting protrusion 312, and the other of the first connecting portion and the second connecting portion is formed as a connecting groove 331. The connecting protrusion 312 extends into the connecting groove 331. It can be understood that it can be that the first connecting portion is formed as the connecting protrusion 312 and the second connecting portion is formed as the connecting groove 331, or the first connecting portion is formed as the connecting groove 331 and the second connecting portion is formed as the connecting protrusion 312. In this way, the connecting protrusion 312 is located in the connecting groove 331, realizing the connection between the mounting frame 33 and the heat sink group 31. The connection manner between the connecting protrusion 312 and the connecting groove 331 is simple, realizing the rapid assembly of the mounting frame 33 and the heat sink group 31, facilitating the assembly positioning, and the connection structure between the mounting frame 33 and the heat sink group 31 is stable and reliable.

[0064] As Figure 6 shown in Figure 6 , the first connecting portion is formed as the connecting groove 331, and the second connecting portion is formed as the connecting protrusion 312.

[0065] In some other feasible embodiments, the fitting connection structure of the first connecting portion and the second connecting portion includes but is not limited to this.

[0066] In any embodiment of the present invention, the second heat dissipation component 4 includes a fixing frame 41 and a fan 42. The fan 42 is arranged in the fixing frame 41. The fixing frame 41 is formed with a third connecting portion, and the mounting frame 33 is formed with a fourth connecting portion. The mounting frame 33 and the fixing frame 41 are connected by the cooperation of the third connecting portion and the fourth connecting portion. Thus, the connection between the fixing frame 41 and the mounting frame 33 is realized through the cooperation of the third connecting portion and the fourth connecting portion, enabling the fixing frame 41 and the mounting frame 33 to be stably connected, avoiding the situation that the fixing frame 41 and the mounting frame 33 are separated from each other, improving the connection stability between the fixing frame 41 and the mounting frame 33, and reducing the assembly difficulty between the mounting frame 33 and the fixing frame 41.

[0067] Referring to Figure 5 and Figure 6As shown in the figure, the fixed frame 41 is located on the upper side of the mounting frame 33. The second heat dissipation component 4 is connected to the mounting frame 33 through the fixed frame 41. A third connecting portion is formed on the fixed frame 41, and a fourth connecting portion is formed on the mounting frame 33. The third connecting portion and the fourth connecting portion cooperate to connect the fixed frame 41 and the mounting frame 33.

[0068] Furthermore, the third connecting portion is formed as a first connecting hole 411, and the fourth connecting portion is formed as a second connecting hole 332. The fastener 5 passes through the first connecting hole 411 and the second connecting hole 332 to be connected. As Figure 6 shown in the figure, the first connecting hole 411 penetrates the fixed frame 41 in the up and down direction, and the second connecting hole 332 penetrates the mounting frame 33 in the up and down direction. The fixed frame 41 is formed as a rectangle, and the first connecting hole 411 is provided at least at the four corners of the fixed frame 41. There are two mounting frames 33, which are on both sides of the heat sink group 31 in the length direction. A connecting groove 331 is formed on each mounting frame 33, and a second connecting hole 332 is formed on each mounting frame 33. The second connecting holes 332 are arranged in one-to-one correspondence with the first connecting holes 411. The corresponding first connecting holes 411 and second connecting holes 332 are penetrated by the fastener 5. In this way, the fixed frame 41 and the mounting frame 33 are connected by the fastener 5 passing through the first connecting hole 411 and the second connecting hole 332, and the connection method is simple and convenient for assembly.

[0069] In any embodiment of the present invention, as Figure 4 shown in the figure, an installation strip 412 is provided in the fixed frame 41. The installation strip 412 is detachably connected to the fixed frame 41, and the fan 42 is arranged on the installation strip 412. It can be understood that the installation strip 412 is connected in the fixed frame 41 to provide an assembly position for the fan 42. The installation strip 412 is used to carry the fan 42 or other air-cooled components. The installation strip 412 is detachably connected to the fixed frame 41, which is convenient for disassembling and assembling the fan 42 to maintain, replace or clean the fan 42, improving the maintainability of the heat dissipation device 100. The installation strip 412 can be adapted to different models of fans 42 with different sizes, air volumes and rotation speeds.

[0070] In other embodiments, shock-absorbing members are provided on the installation strip 412, reducing the vibration generated when the fan 42 works from being transmitted to other components and reducing the noise generated when the fan 42 works.

[0071] In any embodiment of the present invention, the fixing component 2 includes: a first bearing plate 21 and a second bearing plate 22. The first bearing plate 21 is disposed at the bottom of the heat sink group 31, and the second bearing plate 22 is disposed on both sides of the first bearing plate 21 in the thickness direction of the heat sink group 31. The first bearing plate 21 is connected to the second bearing plate 22, and the second bearing plate 22 is connected to the heat sink group 31. It can be understood that by providing the first bearing plate 21 and the second bearing plate 22, they jointly play the roles of supporting, positioning, and connecting the heat sink group 31, ensuring the structural stability of the fixing component 2. The first bearing plate 21 is located below the heat sink group 31 and is used to support and connect the heat sink group 31. The second bearing plates 22 are distributed on both sides of the first bearing plate 21. The first bearing plate 21 and the second bearing plate 22 can be connected by welding, fasteners 5, snap connection, etc., realizing the effective fixation and protection of the heat sink group 31.

[0072] Referring to Figure 3 and Figure 5 As shown, there is one first bearing plate 21, and one bearing plate is located below the heat sink group 31. There are two second bearing plates 22, and the two second bearing plates 22 are respectively connected to both sides of the heat sink group 31 in the thickness direction. The second bearing plate 22 is located between the first bearing plate 21 and the heat sink group 31, and both second bearing plates 22 are connected to the first bearing plate 21.

[0073] Here, preferably, the heat sink group 31 and the second bearing plate 22 are connected by a thermal conductive adhesive.

[0074] In any embodiment of the present invention, the first bearing plate 21 is formed with a fifth connection portion, and the second bearing plate 22 is formed with a sixth connection portion. The first bearing plate 21 and the second bearing plate 22 are connected by the cooperation of the fifth connection portion and the sixth connection portion. Thus, the connection between the first bearing plate 21 and the second bearing plate 22 is realized through the cooperation of the fifth connection portion and the sixth connection portion, enabling the first bearing plate 21 and the second bearing plate 22 to be stably connected, avoiding the situation where the first bearing plate 21 and the second bearing plate 22 are separated from each other, and improving the connection stability of the first bearing plate 21 and the second bearing plate 22.

[0075] Referring to Figure 5 As shown, the second bearing plate 22 is located above the first bearing plate 21. The fifth connection portion is formed on the first bearing plate 21, and the sixth connection portion is formed on the second bearing plate 22. The fifth connection portion and the sixth connection portion cooperate to connect the first bearing plate 21 and the second bearing plate 22.

[0076] Furthermore, the fifth connection portion is formed as a third connection hole 211, and the sixth connection portion is formed as a fourth connection hole 221. The fastener 5 passes through the first connection hole 411 and the second connection hole 332 for connection. As Figure 6As shown, there are four third connection holes 211, and all four third connection holes 211 penetrate the first carrier plate 21 in the up and down direction. The fourth connection hole 221 penetrates the second carrier plate 22 in the up and down direction, and each third connection hole 211 corresponds to a fourth connection hole 221.

[0077] In any embodiment of the present invention, a limiting member 222 is provided on the second carrier plate 22, and the limiting member 222 is located on both sides of the heat sink group 31 in its thickness direction. It can be understood that the heat sink group 31 is located between the limiting members 222, and the limiting member 222 is used to position and fix the heat sink group 31, ensuring that the heat sink group 31 will not shift or loosen after installation, thereby improving the stability and reliability of the heat dissipation device 100. At the same time, the vibration resistance of the heat sink group 31 is enhanced, facilitating assembly during assembly, and improving the assembly accuracy and assembly efficiency.

[0078] Optionally, the limiting member 222 can be a boss, a buckle, a stop block, a fastener 5, an elastic pressing block, etc.

[0079] In any embodiment of the present invention, as Figure 4 shown, the first heat dissipation assembly 3 further includes: a limiting seat 34, a limiting groove is formed on the limiting seat 34, and at least part of the first pipe section 321 and at least part of the second pipe section 322 are located in the limiting groove. It can be understood that the limiting seat 34 cooperates with the liquid cooling pipe 32 to ensure that the liquid cooling pipe 32 maintains a stable position after assembly. The limiting groove on the limiting seat 34 limits the liquid cooling pipe 32, preventing the liquid cooling pipe 32 from shifting, vibrating or deforming during operation, playing a role in supporting the liquid cooling pipe 32, reducing the stress concentration of the liquid cooling pipe 32, and reducing the risk of fatigue fracture.

[0080] Preferably, the limiting seat 34 is made of aluminum alloy, so that the limiting seat 34 has good thermal conductivity and mechanical strength.

[0081] In any embodiment of the present invention, the mounting assembly 1 includes a mounting member 11 and an adjusting member 12. A mounting groove 111 is formed on the mounting member 11, and the adjusting member 12 is connected to the mounting member 11 to fix the server unit 200. Referring to Figure 3 shown, the mounting assembly 1 realizes the positioning and loading of the server unit 200 through the mounting groove 111 on the mounting member 11. By applying a clamping force to the server unit 200 through the adjusting member 12, it can be applicable to server units 200 of various specifications and sizes, improving the adaptability of the heat dissipation device 100, and the structure of the mounting assembly 1 is simple, facilitating assembly and maintenance.

[0082] In any embodiment of the present invention, the adjusting member 12 is threadedly connected to the mounting member 11. The surface of the adjusting member 12 facing the mounting groove 111 is formed as an adjusting surface, and the adjusting surface is adapted to abut and connect with the server unit 200. It can be understood that threads are formed on the adjusting member 12 and the mounting member 11, and the adjusting member 12 and the mounting member 11 are connected by screw engagement. An adjusting surface is formed on the adjusting member 12, and the adjusting surface abuts against the server unit 200 so that the server unit 200 is stably clamped between the adjusting members 12.

[0083] Furthermore, a protective pad 13 is provided between the adjusting surface and the server unit 200, which avoids the risk of the adjusting member 12 damaging the server unit 200 and plays a protective role for the server unit 200.

[0084] Next, reference will be made to Figures 1-6 describe the heat dissipation device 100 according to a specific embodiment of the present invention.

[0085] Referring to Figures 1-6 As shown, the heat dissipation device 100 includes: a mounting assembly 1, a fixing assembly 2, a first heat dissipation assembly 3, and a second heat dissipation assembly 4. The mounting assembly 1 includes a mounting member 11 and an adjusting member 12. The fixing assembly 2 includes a first carrier plate 21 and a second carrier plate 22. The first heat dissipation assembly 3 includes a liquid cooling pipe 32, a heat sink group 31, a mounting frame 33, and a limiting seat 34. The second heat dissipation assembly 4 includes a fixing frame 41 and a fan 42.

[0086] Specifically, the mounting assembly 1 has a mounting groove 111, and the server unit 200 is located in the mounting groove 111. The mounting assembly 1 can stably connect the server unit 200 to the heat dissipation device 100. The fixing assembly 2 is connected above the mounting assembly 1. The first heat dissipation assembly 3 is connected above the fixing assembly 2. The first heat dissipation assembly 3 has a heat sink group 31 and a liquid cooling flow channel. A liquid flows in the liquid cooling flow channel, and the liquid can absorb the heat of the server unit 200 and take away the heat, so that the server unit 200 is always at an appropriate working temperature. The second heat dissipation assembly 4 is connected above the first heat dissipation assembly 3. The second heat dissipation assembly 4 forms an air cooling flow channel. At least part of the heat sink group 31 is located in the air cooling flow channel. In this way, the air flow can take away the temperature of the heat sink group 31 and play a role in cooling the heat sink group 31. At the same time, at least part of the liquid cooling flow channel is also located in the air cooling flow channel. In this way, when the air flow takes away the heat of the heat sink group 31, it can also take away the temperature of the liquid cooling flow channel.

[0087] When the heat dissipation device 100 is working and the server unit 200 needs to be cooled down, the first heat dissipation component 3 and / or the second heat dissipation component 4 can be turned on according to the actual temperature of the server unit 200. That is to say, when the temperature of the server unit 200 is relatively high, the first heat dissipation component 3 or the second heat dissipation component 4 can be selected to be turned on. If the temperature of the server unit 200 reaches the threshold value, the first heat dissipation component 3 and the second heat dissipation component 4 can be turned on simultaneously.

[0088] The channel 311 is formed within the heat sink group 31. The first heat dissipation component 3 includes a liquid cooling pipe 32. A liquid cooling flow path is formed within the liquid cooling pipe 32. A part of the liquid cooling pipe 32 is located within the channel 311. In this way, a part of the liquid cooling flow path is also located within the channel 311. Thus, by integrating the liquid cooling pipe 32 within the heat sink group 31, the liquid cooling pipe 32 is closely combined with the heat sink group 31, improving the assembly compactness of the heat dissipation device 100 and saving the space volume of the heat dissipation device 100. The coolant flows within the liquid cooling pipe 32, and the coolant absorbs and takes away heat, ensuring the efficiency of heat exchange and improving the heat conduction efficiency. The heat sink group 31 includes 49 heat sink single pieces. The 49 heat sink single pieces are arranged in the thickness direction of themselves. Four through holes are formed on each heat sink single piece. The four through holes on one heat sink single piece are correspondingly communicated with the four through holes on the adjacent heat sink single piece, and the corresponding through holes are coaxially arranged, that is, the four through holes on one heat sink single piece respectively correspond to the four through holes on the adjacent heat sink single piece. There are two channels 311, and each channel 311 includes a first through section 3111 and a second through section 3112. Both the first through section 3111 and the second through section 3112 extend in the thickness direction of the heat sink single piece. The first through section 3111 and the second through section 3112 are arranged at intervals. The height of the first through section 3111 is lower than the height of the second through section 3112. Moreover, the distance between the first through sections 3111 of the two channels 311 is less than the distance between the first through section 3111 and the second through section 3112 of the same channel 311.

[0089] The liquid cooling pipe 32 includes a first pipe section 321, a second pipe section 322, and a third pipe section 323. Both the first pipe section 321 and the third pipe section 323 extend in the thickness direction of the heat sink single piece. Both the first pipe section 321 and the third pipe section 323 extend along a straight line. The second pipe section 322 is connected between the first pipe section 321 and the second pipe section 322. The liquid cooling pipe 32 is formed into a U shape. The second pipe section 322 extends along an arc, reducing the flow resistance of the coolant and avoiding the turbulence, vortex, and pressure drop loss during the flow of the coolant. The first pipe section 321 and the third pipe section 323 are located within the heat sink group 31, and the second pipe section 322 is located outside the heat sink group 31. This is convenient for assembly and maintenance. A sealing joint 324 is provided at one end of the first pipe section 321 connected to the external cooling system. The mounting frame 33 is located between the heat sink group 31 and the second heat dissipation component 4. The second heat dissipation component 4 is connected to the upper side of the mounting frame 33, and the heat sink group 31 is connected to the lower side of the mounting frame 33. The first connecting portion is formed on the mounting frame 33, and the second connecting portion is formed on the heat sink group 31. The first connecting portion and the second connecting portion cooperate to connect the heat sink group 31 and the mounting frame 33. The first connecting portion is formed as a connecting groove 331, and the second connecting portion is formed as a connecting protrusion 312. The connecting protrusion 312 is located within the connecting groove 331, realizing the connection between the mounting frame 33 and the heat sink group 31.

[0090] The fixing frame 41 is located on the upper side of the mounting frame 33. The second heat dissipation component 4 is connected to the mounting frame 33 through the fixing frame 41. The third connecting portion is formed on the fixing frame 41, and the fourth connecting portion is formed on the mounting frame 33. The third connecting portion and the fourth connecting portion cooperate to connect the fixing frame 41 and the mounting frame 33. The first connecting hole 411 penetrates through the fixing frame 41 in the up-down direction, and the second connecting hole 332 penetrates through the mounting frame 33 in the up-down direction. The fixing frame 41 is formed as a rectangle. The first connecting hole 411 is provided at least at the four corners of the fixing frame 41. There are two mounting frames 33, which are on both sides of the heat sink group 31 in the length direction. A connecting groove 331 is formed on each mounting frame 33, and a second connecting hole 332 is formed on each mounting frame 33. The second connecting holes 332 are arranged in one-to-one correspondence with the first connecting holes 411. Fasteners 5 are inserted into the corresponding first connecting holes 411 and second connecting holes 332. In this way, the fixing frame 41 and the mounting frame 33 are connected by inserting the fasteners 5 into the first connecting holes 411 and the second connecting holes 332. An installation strip 412 is provided inside the fixing frame 41. The installation strip 412 is detachably connected to the fixing frame 41. The fan 42 is arranged on the installation strip 412. There is one first bearing plate 21, and the one bearing plate is located below the heat sink group 31. There are two second bearing plates 22, and the two second bearing plates 22 are respectively connected to both sides of the heat sink group 31 in the thickness direction. The second bearing plates 22 are located between the first bearing plate 21 and the heat sink group 31, and the second bearing plates 22 are both connected to the first bearing plate 21. The heat sink group 31 and the second bearing plates 22 are connected by a thermal conductive adhesive.

[0091] The second carrier plate 22 is located above the first carrier plate 21. The fifth connecting portion is formed on the first carrier plate 21, and the sixth connecting portion is formed on the second carrier plate 22. The fifth connecting portion and the sixth connecting portion cooperate to connect the first carrier plate 21 and the second carrier plate 22. There are four third connecting holes 211, and all four third connecting holes 211 penetrate the first carrier plate 21 in the up and down direction. The fourth connecting hole 221 penetrates the second carrier plate 22 in the up and down direction, and each third connecting hole 211 corresponds to a fourth connecting hole 221. The heat sink group 31 is located between the limiting members 222. The limiting members 222 are used to position and fix the heat sink group 31, ensuring that the heat sink group 31 will not shift or loosen after installation. The limiting seat 34 cooperates with the liquid cooling pipe 32 to ensure that the liquid cooling pipe 32 maintains a stable position after assembly. The limiting groove on the limiting seat 34 limits the liquid cooling pipe 32, preventing the liquid cooling pipe 32 from shifting, vibrating or deforming during operation, and playing a role in supporting the liquid cooling pipe 32. The mounting assembly 1 realizes the positioning and bearing of the server unit 200 through the mounting groove 111 on the mounting member 11. By applying a clamping force to the server unit 200 through the adjusting member 12, it can be applicable to server units 200 of various specifications and sizes, improving the adaptability of the heat dissipation device 100. A protective pad 13 is provided between the adjusting surface and the server unit 200.

[0092] A server according to a second aspect embodiment of the present invention includes: a server unit 200 and a heat dissipation device 100 according to a first aspect embodiment of the present invention. The server unit 200 is adapted to be disposed on the heat dissipation device 100.

[0093] For the server according to the embodiment of the present invention, by providing the heat dissipation device 100 according to the first aspect embodiment of the present invention, therefore, it has the same technical effects, that is, the first heat dissipation component 3 is provided with a liquid cooling flow channel, the second heat dissipation component 4 is provided with an air cooling flow channel, and at least part of the first heat dissipation component 3 is located in the air cooling flow channel. In this way, the combination of air cooling and liquid cooling is utilized, so that the heat can not only be quickly conducted out through the liquid, but also can be further cooled by the air flow, or a choice can be made between liquid cooling and air cooling, which can not only more effectively control the temperature, but also reduce the problems of performance degradation and shortened hardware life caused by overheating, and is especially suitable for the heat dissipation requirements in a high-density computing environment, and the overall structure of the heat dissipation device 100 is simple, convenient for assembly and maintenance.

[0094] In some embodiments, the server unit 200 includes a housing 201, and a heat dissipation portion 202 is formed on the housing 201. The heat dissipation portion 202 is formed on opposite side walls of the housing 201. As Figure 2 shown, the heat dissipation portion 202 is formed as a rectangle, and a plurality of heat dissipation mesh holes arranged in an array are formed in the rectangular heat dissipation portion 202. Thus, not only the air flow path is optimized, the heat dissipation efficiency is improved, but also a good dust-proof effect is achieved.

[0095] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A heat dissipation device, characterized in that, Used to dissipate heat for a server unit (200), the heat dissipation device comprising: A mounting assembly (1), the mounting assembly (1) being formed with a mounting groove (111), the mounting groove (111) being suitable for fixing the server unit (200); A fixing component (2), the fixing component (2) being arranged on the upper part of the mounting component (1); A first heat dissipation component (3), the first heat dissipation component (3) being arranged above the fixing component (2), the first heat dissipation component (3) comprising a heat sink group (31) and a liquid cooling channel, the liquid cooling channel being located inside the heat sink group (31); A second heat dissipation component (4), the second heat dissipation component (4) being arranged on a side of the first heat dissipation component (3) facing away from the server unit (200), the second heat dissipation component (4) forming an air cooling channel, at least a portion of the heat sink group (31) being located in the air cooling channel, and a portion of the liquid cooling channel being located in the air cooling channel.

2. The heat dissipation device according to claim 1, wherein A channel (311) is formed in the heat sink group (31), the first heat dissipation component (3) comprises a liquid cooling tube (32), the liquid cooling channel is formed in the liquid cooling tube (32), and at least a portion of the liquid cooling tube (32) is located in the channel (311).

3. The heat dissipation device according to claim 2, wherein The heat sink group (31) comprises a plurality of heat sinks, the plurality of heat sinks are arranged in the thickness direction thereof, each heat sink is formed with a through hole, and each through hole is connected in the thickness direction of the heat sink to define the channel (311). The channel (311) comprises a first through section (3111) and a second through section (3112), the first through section (3111) and the second through section (3112) both extending in the thickness direction of the heat dissipation sheet, and the first through section (3111) and the second through section (3112) are arranged at intervals.

4. The heat dissipation device according to claim 3, wherein, The liquid cooling tube (32) comprises a first tube section (321), a second tube section (322) and a third tube section (323) which are connected in sequence; the first tube section (321) and the third tube section (323) are parallel and spaced apart in a radial direction; the second tube section (322) extends along an arc; the first tube section (321) is located in the first through section (3111); and the third tube section (323) is located in the second through section (3112).

5. The heat dissipation device according to claim 4, wherein The first heat dissipation component (3) comprises: a mounting frame (33), the mounting frame (33) being connected between the heat sink group (31) and the second heat dissipation component (4), the mounting frame (33) being formed with a first connection portion, the heat sink group (31) being formed with a second connection portion, the mounting frame (33) and the heat sink group (31) being connected to each other via the first connection portion and the second connection portion.

6. The heat dissipation device according to claim 5, wherein, The second heat dissipation component (4) includes a fixed frame (41) and a blower (42). The blower (42) is disposed within the fixed frame (41). The fixed frame (41) is formed with a third connection portion, and the mounting frame (33) is formed with a fourth connection portion. The mounting frame (33) and the fixed frame (41) are cooperatively connected through the cooperation of the third connection portion and the fourth connection portion.

7. The heat dissipation device according to claim 6, characterized in that, An installation strip (412) is disposed within the fixed frame (41). The installation strip (412) is detachably connected to the fixed frame (41). The blower (42) is disposed on the installation strip (412).

8. The heat dissipation device according to claim 3, wherein The fixing component (2) includes: a first bearing plate (21) and a second bearing plate (22). The first bearing plate (21) is disposed at the bottom of the heat sink group (31). The second bearing plate (22) is disposed on both sides of the first bearing plate (21) in the thickness direction of the heat sink group (31). The first bearing plate (21) is connected to the second bearing plate (22), and the second bearing plate (22) is connected to the heat sink group (31).

9. The heat dissipation device according to claim 8, wherein The first bearing plate (21) is formed with a fifth connection portion, and the second bearing plate (22) is formed with a sixth connection portion. The first bearing plate (21) and the second bearing plate (22) are cooperatively connected through the cooperation of the fifth connection portion and the sixth connection portion.

10. The heat dissipation device according to claim 8, characterized in that, A limiting member (222) is disposed on the second bearing plate (22). The limiting member (222) is located on both sides of the heat sink group (31) in its thickness direction.

11. The heat dissipation device according to claim 5, wherein, The first heat dissipation component (3) further includes: a limiting seat (34). A limiting groove is formed on the limiting seat (34). At least a part of the first pipe section (321) and at least a part of the second pipe section (322) are located within the limiting groove.

12. The heat dissipation device according to any one of claims 1-11, wherein, The installation component (1) includes an installation member (11) and an adjusting member (12). An installation groove (111) is formed on the installation member (11). The adjusting member (12) is connected to the installation member (11) to fix the server unit (200).

13. The heat dissipation device according to claim 12, wherein The adjusting member (12) is threadedly connected to the installation member (11). One side surface of the adjusting member (12) facing the installation groove (111) is formed as an adjusting surface. The adjusting surface is adapted to be in abutting connection with the server unit (200).

14. A server, characterized in that, Including a server unit (200) and the heat dissipation device according to any one of claims 1 - 13. The server unit (200) is adapted to be disposed on the heat dissipation device (100).

15. The server according to claim 14, wherein The server unit (200) includes a housing (201). A heat dissipation portion (202) is formed on the housing (201). The heat dissipation portion (202) is formed on opposite side walls of the housing (201).

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