Material processing device and method

Abstract

The invention provides a material processing device and method.The material processing device comprises a liquid storage cavity, an ultrasonic generation device and a sealed container, and the liquid storage cavity is used for containing a first liquid medium; the ultrasonic generating device comprises a spherical-crown-shaped ultrasonic vibrator assembly, and the ultrasonic vibrator assembly is used for emitting ultrasonic waves; the interior of the sealed container is used for containing process liquid, the process liquid is formed by dispersing a to-be-processed material in a second liquid medium, and the sealed container can be contained in the liquid storage cavity and immersed in the first liquid medium; the ultrasonic vibrator assembly is arranged on the outer side of the sealed container in a surrounding mode, and the sphere center of the spherical-crown-shaped ultrasonic vibrator assembly coincides with the center of the sealed container. Ultrasonic waves can penetrate through the sealed container, and the ultrasonic waves can enable the second liquid medium to generate ultrasonic cavitation. The central area of the sealed container of the material processing device forms the cavitation area, and the cavitation energy density of the cavitation area is high, so that micro-nano processing of the to-be-processed material can be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of the preparation of micron materials and nano materials. Specifically, it relates to a material processing device and method. Background Art

[0002] Ultrasonic cavitation is a cavitation phenomenon caused by ultrasonic waves. The ultrasonic waves fluctuate alternately in a cycle. The liquid molecules are compressed and stretched periodically. Under the action of negative sound pressure, tiny bubbles (also called air bubbles or cavitation nuclei) are generated in the liquid. Thereafter, the air bubbles in the sound field continuously absorb energy, vibrate, expand, collapse until they burst. At the moment on the verge of collapse, the energy accumulated by the air bubbles is quickly released, generating physical effects such as local high temperature and high pressure, shock waves, and microjets. The energy released by the collapse of the air bubbles can be used as the power for chemical reactions and material processing, making ultrasonic cavitation currently widely applicable to chemical reactions and material processing.

[0003] Taking material processing as an example, under the effect of ultrasonic cavitation, the material can be cut to change the material size. It can be understood that the material cutting ability is related to the air bubble energy density (that is, the cavitation energy generated by the collapse of air bubbles per unit time and per unit space), and the air bubble energy density is positively correlated with the sound pressure. For this reason, in some related technologies, an ultrasonic horn is provided to increase the vibration amplitude of the ultrasonic waves and thus increase the sound pressure.

[0004] However, by using this method, the size of the prepared material is still difficult to reach the micron level or the nano level. Summary of the Invention

[0005] An embodiment of the present invention aims to at least solve one of the technical problems existing in the prior art, and provides a material processing device and method.

[0006] In a first aspect, an embodiment of the present invention provides a material processing device, including: a liquid storage cavity, an ultrasonic generating device, and a sealed container. The liquid storage cavity is used for containing a first liquid medium;

[0007] The ultrasonic generating device includes an ultrasonic oscillator assembly in a spherical crown shape, and the ultrasonic oscillator assembly is used for emitting ultrasonic waves;

[0008] The inside of the sealed container is used for containing a process liquid, and the process liquid is formed by dispersing a material to be processed in a second liquid medium. The sealed container can be placed in the liquid storage cavity and immersed in the first liquid medium; the ultrasonic oscillator assembly is arranged around the outside of the sealed container, and the center of the spherical crown-shaped ultrasonic oscillator assembly coincides with the center of the sealed container; the sealed container allows ultrasonic waves to penetrate, and the ultrasonic waves can cause ultrasonic cavitation in the second liquid medium.

[0009] In one implementation of the first aspect of the present invention, the ultrasonic oscillator assembly is adhesively connected to the chamber wall of the liquid storage chamber; alternatively, the ultrasonic oscillator assembly can be accommodated inside the liquid storage chamber and immersed in the first liquid medium.

[0010] In one implementation of the first aspect of the present invention, the ultrasonic generating device further includes a housing having an inner surface in the shape of a spherical cap and an opening for the sealed container to pass through; the ultrasonic oscillator assembly is disposed on the housing, and the ultrasonic oscillator assembly is in contact with the inner surface of the housing;

[0011] When the ultrasonic oscillator assembly is adhesively connected to the chamber wall of the liquid storage chamber, the material processing device further includes a sealing door that can open and close the opening. When the sealing door closes the opening, the sealing door and the housing jointly enclose the liquid storage chamber.

[0012] In one implementation of the first aspect of the present invention, the material processing device further includes a bracket provided with a connection position, and the sealed container is detachably connected to the connection position;

[0013] The bracket is fixedly disposed inside the liquid storage chamber, and the connection position is at the center of the spherical ultrasonic oscillator assembly; alternatively, the bracket is disposed inside the liquid storage chamber and can move relative to the chamber wall of the liquid storage chamber. The material processing device further includes a driving mechanism for driving the bracket to move so as to be able to drive the sealed container to move to the center of the spherical ultrasonic oscillator assembly.

[0014] In one implementation of the first aspect of the present invention, the liquid pressure of the first liquid medium is configured to be equal to the liquid pressure of the process liquid inside the sealed container and less than or equal to the limit pressure value of the sealed container.

[0015] In one implementation of the first aspect of the present invention, the material processing device further includes a feeding system, a discharging system, a first hydraulic detector, and a controller. The sealed container is provided with a liquid inlet and a liquid outlet;

[0016] The feeding system includes a supply pipeline, as well as a storage container, a first control valve, and a first booster pump located outside the liquid storage chamber; the inflow end of the supply pipeline is communicated with the storage container, the outflow end is connected to the liquid inlet, the first booster pump and the first control valve are disposed on the supply pipeline, and the first booster pump is used to drive the process liquid in the storage container to be conveyed to the sealed container through the supply pipeline; the opening degree of the first control valve is adjustable to regulate the flow rate of the process liquid flowing into the sealed container;

[0017] The discharging system includes a discharging pipeline, as well as a collection container and a second control valve located outside the liquid storage chamber; the inflow end of the discharging pipeline is connected to the liquid outlet, the outflow end is communicated with the collection container; the second control valve is disposed on the discharging pipeline, and the opening degree of the second control valve is adjustable to regulate the flow rate of the process liquid flowing out of the sealed container;

[0018] The first hydraulic detector is used to detect the hydraulic pressure inside the sealed container. The controller controls the first booster pump, the first control valve, and the second control valve according to the hydraulic pressure value detected by the first hydraulic detector and the preset pressure value, so as to control the hydraulic pressure inside the sealed container.

[0019] In one implementation manner of the first aspect of the present invention, the feeding system further includes a flowmeter connected to the controller. The flowmeter is used to detect the flow rate of the process liquid passing through the supply pipeline. The controller controls the opening degree of the first control valve according to the flow rate detected by the flowmeter and the preset flow rate, so as to regulate the flow rate of the process liquid flowing into the sealed container.

[0020] In one implementation manner of the first aspect of the present invention, the air intake system further includes an air inlet pipeline, a gas source, a third control valve, and a second booster pump provided outside the liquid storage cavity. The controller is connected to the third control valve and the second booster pump. The second booster pump is arranged on the air inlet pipeline. The second booster pump is used to increase the pressure of the conveyed reaction gas, so that the gas source passes the reaction gas into the process liquid through the air inlet pipeline. The third control valve is arranged on the air inlet pipeline and is used to control the on-off of the air inlet pipeline.

[0021] In one implementation manner of the first aspect of the present invention, a filter is provided on the air inlet pipeline. The filter is used to filter the reaction gas passing through the air inlet pipeline.

[0022] In one implementation manner of the first aspect of the present invention, the material processing device further includes a liquid injection device and a second hydraulic detector. The liquid injection device includes a water tank, a liquid inlet pipeline, and a third booster pump and a fourth control valve arranged on the liquid inlet pipeline. The water tank is communicated with the liquid storage cavity through the liquid inlet pipeline. The third booster pump is used to drive the first liquid medium in the water tank to be conveyed to the liquid storage cavity. The opening degree of the fourth control valve is adjustable to regulate the flow rate of the first liquid medium flowing into the liquid storage cavity.

[0023] The second hydraulic detector is used to detect the hydraulic pressure inside the liquid storage cavity. The controller controls the third booster pump and the fourth control valve according to the hydraulic pressure value detected by the second hydraulic detector and the preset pressure value, so as to control the hydraulic pressure inside the liquid storage cavity, so that the liquid pressure of the first liquid medium is equal to the liquid pressure of the process liquid inside the sealed container.

[0024] In one implementation manner of the first aspect of the present invention, the ultrasonic oscillator assembly is of an integral structure; or, the ultrasonic oscillator assembly includes a plurality of vibrating bodies, and the plurality of vibrating bodies are spherically symmetrically distributed with respect to the center of the spherical ultrasonic oscillator assembly in a spherical crown shape. The material processing device further includes a controller, and the controller can respectively control the vibration amplitude of the plurality of vibrating bodies.

[0025] In a second aspect, an embodiment of the present invention provides a material processing method, which is applied to any one of the material processing devices provided in the first aspect of the present invention. The material processing method includes:

[0026] Liquid injection step: injecting a first liquid medium into the liquid storage cavity and injecting a process liquid into the sealed container, and the center of the sealed container coincides with the center of the spherical ultrasonic oscillator assembly;

[0027] Ultrasonic cavitation step: applying power to the ultrasonic oscillator assembly so that the ultrasonic oscillator assembly emits ultrasonic waves, and the ultrasonic waves can cause ultrasonic cavitation in the second liquid medium.

[0028] In an implementation manner of the second aspect of the present invention, the power applied to the ultrasonic oscillator assembly is greater than or equal to 500 W, and the frequency of the ultrasonic waves is greater than or equal to 20 kHz.

[0029] In an implementation manner of the second aspect of the present invention, when the material processing device further includes a controller, a feeding system, a discharging system, a first hydraulic detector, a second hydraulic detector, and a liquid injection device,

[0030] Before the liquid injection step, the method further includes:

[0031] Receiving a preset pressure value;

[0032] Judging whether the preset pressure value is less than or equal to the limit pressure value of the sealed container;

[0033] If not, the liquid injection step specifically includes:

[0034] Injecting a first liquid medium into the liquid storage cavity so that the liquid pressure of the first liquid medium reaches a threshold value;

[0035] Injecting a process liquid into the sealed container so that the liquid pressure of the process liquid in the sealed container reaches a threshold value; the threshold value is less than or equal to the limit pressure value of the sealed container;

[0036] Injecting a first liquid medium into the liquid storage cavity and injecting a process liquid into the sealed container at the same time, so that the liquid pressure of the first liquid medium and the liquid pressure of the process liquid in the sealed container increase simultaneously until the liquid pressure of the first liquid medium and the liquid pressure of the process liquid in the sealed container reach the preset pressure value at the same time.

[0037] The present invention has the following beneficial effects:

[0038] The material processing device provided by the present invention is designed such that the ultrasonic oscillator assembly is spherical-crown-shaped, and the center of the sphere of the ultrasonic oscillator assembly coincides with the center of the sealed container. A standing wave sound field can be formed within the space enclosed by the ultrasonic oscillator assembly. The antinode of the standing wave is formed at the center of the spherical-crown-shaped ultrasonic oscillator assembly, and since the center of the sphere of the ultrasonic oscillator assembly coincides with the center of the sealed container, the energy of the standing wave can be concentrated on the central region of the sealed container. The sound pressure in the central region of the sealed container is high, and the bubbles can stably suspend at the antinode, so the bubbles can be concentrated in the central region of the sealed container. Thus, the central region of the sealed container is formed as a cavitation region, and the cavitation energy density in this cavitation region is high, enabling micro-nano processing of the material to be processed. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 FIG. is a schematic structural diagram of a material processing device provided in Embodiment 1 of the present application;

[0040] Figure 2 FIG. is a schematic structural diagram of another material processing device provided in Embodiment 1 of the present application;

[0041] Figure 3 FIG. is a schematic structural diagram of yet another material processing device provided in Embodiment 1 of the present application;

[0042] Figure 4 is Figure 1 a schematic structural diagram of a variant of the material processing device shown;

[0043] Figure 5 is Figure 2 a schematic structural diagram of a variant of the material processing device shown;

[0044] Figure 6 is Figure 3 a schematic structural diagram of a variant of the material processing device shown;

[0045] Figure 7 FIG. is a schematic flowchart of a material processing method provided in Embodiment 3 of the present application.

[0046] DESCRIPTION OF REFERENCE NUMERALS:

[0047] 100 - Material processing device;

[0048] 10 - Liquid storage container; 11 - Liquid storage cavity; 12 - Sealing door;

[0049] 20 - Ultrasonic generating device; 21 - Power supply; 22 - Ultrasonic oscillator assembly; 23 - Housing;

[0050] 24 - Inner housing; 25 - First liquid medium;

[0051] 30 - Sealed container; 31 - Process liquid;

[0052] 40 - Bracket;

[0053] 50 - Loading system; 51 - Storage container; 52 - Supply pipeline; 53 - First control valve; 54 - First booster pump; 55 - Flowmeter; 56 - Unloading system; 57 - Discharge pipeline; 58 - Collection container;

[0054] 59 - Second control valve;

[0055] 60 - Intake system; 61 - Intake pipeline; 62 - Third control valve; 63 - Second booster pump;

[0056] 64 - Filter. Detailed implementation mode

[0057] It can be understood that the cavitation energy density is related not only to the sound pressure, but also to the liquid pressure, bubble size, bubble spatial distribution, spherical symmetry of the bubble, other ultrasonic parameters, etc. After careful research, the inventors of the present application found that the reason why it is difficult to achieve the micron or nanometer scale for the size of the materials prepared in the related art is that although the ultrasonic horn can effectively increase the amplitude of ultrasonic vibration and increase the sound pressure, the occurrence area of the ultrasonic cavitation effect is large, so the spatial area where the bubbles are distributed is large, that is, the bubbles are more dispersed, resulting in the energy released by the collapse of the bubbles during the material processing cannot act on the material concentratedly, and the cavitation energy density is correspondingly low, which further leads to the inability to achieve micro-nano scale cutting for some materials. Therefore, when the related art uses ultrasonic cavitation for material processing, it does not have good material compatibility.

[0058] In view of this, the embodiments of the present application provide a material processing device and method. To make those skilled in the art better understand the technical solutions of the present invention, the material processing device and method provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0059] As used herein, the terms "bubble", "air bubble" and "cavitation nucleus" can be used interchangeably. As used herein, the terms "bubble cluster", "bubble group" and "bubble array" can be used interchangeably.

[0060] Embodiment 1

[0061] The embodiments of the present application provide a material processing device, which can be applied to material processing and is specifically used for cutting materials. Figure 1 The structure of a material processing device provided by Embodiment 1 of the present application is shown. Please refer to Figure 1, the material processing device 100 includes a liquid storage chamber 11, a sealed container 30, and an ultrasonic generating device 20. Among them, the liquid storage chamber 11 is used to contain the first liquid medium 25, the inside of the sealed container 30 is used to contain the process liquid 31, and the sealed container 30 can be placed in the liquid storage chamber 11 and immersed in the first liquid medium 25. Here, the process liquid 31 refers to a mixed solution formed by dispersing the material to be processed in the second liquid medium.

[0062] The ultrasonic generating device 20 may specifically include a power supply 21, an ultrasonic generator, and an ultrasonic oscillator assembly 22. The power supply 21 is arranged outside the liquid storage chamber 11 and is electrically connected to the ultrasonic generator. The power supply 21 applies power to the ultrasonic generator. The ultrasonic generator is electrically connected to the ultrasonic oscillator assembly 22 to transmit the generated high-frequency electrical signal to the ultrasonic oscillator assembly 22. The ultrasonic oscillator assembly 22 converts the high-frequency electrical signal into a high-frequency mechanical vibration and exports it, thereby generating ultrasonic waves in the first liquid medium 25.

[0063] As Figure 1 shown, the ultrasonic oscillator assembly 22 is spherical-crown-shaped. When the sealed container 30 containing the process liquid 31 is placed in the liquid storage chamber 11, the spherical-crown-shaped ultrasonic oscillator assembly 22 is arranged to surround the outside of the sealed container 30, and the center of the spherical-crown-shaped ultrasonic oscillator assembly 22 (shown as O in Figure 1 coincides with the center of the sealed container 30 (shown as P in Figure 1 ), then the ultrasonic waves emitted by the ultrasonic oscillator assembly 22 can penetrate the sealed container 30 and propagate in the second liquid medium. Among them, the height of the spherical-crown-shaped ultrasonic oscillator assembly 22 is H, and the radius of the spherical-crown-shaped ultrasonic oscillator assembly 22 is R, and H > R.

[0064] The working principle of the material processing device 100 in this embodiment is: the ultrasonic oscillator assembly 22 vibrates to generate ultrasonic waves, and the ultrasonic waves penetrate the sealed container 30 and are conducted into the second liquid medium, causing ultrasonic cavitation in the second liquid medium.

[0065] Since the ultrasonic oscillator assembly 22 is spherical-crown-shaped, ultrasonic waves can be reflected back and forth between any two locations that are spherically symmetric about the center of the sphere O on the ultrasonic oscillator assembly 22. Any two ultrasonic waves with opposite propagation directions and the same amplitude are superimposed to form a standing wave. Thus, it can be understood that a standing wave sound field can be formed within the space enclosed by the ultrasonic oscillator assembly 22. Based on the fact that the ultrasonic oscillator assembly 22 is spherical-crown-shaped, correspondingly, the standing wave sound field is generally spherical, and a wave antinode can be formed at the focal point of the spherical standing wave sound field (i.e., at the center of the sphere O). Among them, the amplitude is the largest at the wave antinode of the standing wave, that is, the sound pressure is the largest at the wave antinode, and the energy of the standing wave is concentrated at the wave antinode. Since the center of the sealed container 30 coincides with the center of the sphere O of the ultrasonic oscillator assembly 22, the center of the sealed container 30 is also located at the wave antinode of the standing wave sound field. Therefore, the energy of the standing wave can be concentrated on the central region of the sealed container 30, and the sound pressure in the central region of the sealed container 30 is high.

[0066] At the same time, the bubbles formed by the ultrasonic cavitation of the second liquid medium can stably suspend at the wave antinode under the standing wave sound field, so that the bubbles are concentrated in the central region of the sealed container 30. Then, a bubble cluster (which can also be called a bubble group or a bubble array) can be formed in the central region of the sealed container 30. In this way, the energy released by the collapse of the bubble cluster is highly concentrated and can physically cut the material to be processed within a space with a micro-nano scale size to achieve micro-nano processing of the material to be processed.

[0067] Therefore, when using the material processing device 100 of this embodiment to process materials, a standing wave sound field can be formed within the space enclosed by the ultrasonic oscillator assembly 22. The wave antinode of the standing wave is formed at the center of the sphere O of the spherical-crown-shaped ultrasonic oscillator assembly 22, and the center of the sphere O of the ultrasonic oscillator assembly 22 coincides with the center of the sealed container 30. In this way, the energy of the standing wave can be concentrated on the central region of the sealed container 30, the sound pressure in the central region of the sealed container 30 is high, and the bubbles can stably suspend at the wave antinode. Then, the bubbles can be concentrated in the central region of the sealed container 30, which is beneficial to weakening or even eliminating the negative impact of the large bubble distribution area on the cavitation energy density. That is to say, the central region of the sealed container 30 is a cavitation region, where the sound pressure is high, the bubble distribution is concentrated, and the cavitation energy density in this cavitation region is high.

[0068] Moreover, as can be seen from the foregoing description, a standing wave sound field is formed within the space enclosed by the spherical-crown-shaped ultrasonic oscillator assembly 22. The standing wave sound field is generally spherical. Therefore, the sound pressures at any two locations that are spherically symmetrically distributed about the center O within the space enclosed by the ultrasonic oscillator assembly 22 are equal. Thus, the ultrasonic pressure received by the bubbles formed in the central region of the sealed container 30 is generally spherically symmetrically distributed about the center of the sealed container 30, that is, the forces on the bubbles are spherically symmetric about the center of the sealed container 30. This can make the formed bubbles have good spherical symmetry. Since the high spherical symmetry of the bubbles is beneficial to increasing the cavitation energy density, therefore, this also helps to make the cavitation region reach a high cavitation energy density.

[0069] In summary, it can be seen that through this design, the material processing device 100 has a cavitation region with a high cavitation energy density, so as to be able to perform micro-nano processing on the material to be processed.

[0070] Taking the above-mentioned material to be processed as graphene as an example, through a large number of experimental verifications, the energy generated by the collapse of the bubble cluster is sufficient to cut graphene, so that graphene can be cut into graphene nanoribbons. The width of the prepared graphene nanoribbons is about 100 nm, and the length is about 500 nm.

[0071] Among them, the elastic modulus of graphene is 1 TPa, and the fracture strength is 130 GPa. That is to say, the strength of graphene is extremely high, and the strength of graphene is much higher than that of metal materials such as copper Cu, gold Au, and lead Pb. Therefore, the material processing device 100 of this embodiment can also be applied to perform micro-nano processing on other materials with strengths lower than that of graphene. Exemplarily, the material to be processed can be molybdenum disulfide MoS2. Using the material processing device 100 of this embodiment, molybdenum disulfide can be cut into MoS2 quantum dots with a size less than 10 nm. Taking another example, the material to be processed can be metal micron particles such as gold Au or lead Pb. Using the material processing device 100 of this embodiment, the metal micron particles can be cut into metal nanoparticles.

[0072] Based on the foregoing description, it can be seen that the material processing device 100 of this embodiment can be used to perform micro-nano processing on various materials such as metals, graphene, and alloys. That is, the material processing device 100 has good material compatibility and can be generally applied to the processing of various materials.

[0073] Of course, it can be understood that the material processing device 100 of this embodiment is not limited to the cutting processing of material sizes, and can also be used for material etching or melting, etc. Exemplarily, the material to be processed can be a copper sheet or a stainless steel sheet. Using the material processing device 100 of this embodiment, a micron-scale etching effect can be achieved on the surface of the copper sheet or the stainless steel sheet.

[0074] In addition, on the premise that the type and size of the material to be processed, as well as the requirements of the material processing technology are the same, compared with the related technology, the material processing device 100 of this embodiment has a higher cavitation energy density in the cavitation region. Therefore, the energy generated by ultrasonic cavitation can act on more materials to be processed. That is to say, the material processing device 100 of this embodiment can be used for large-scale cutting of materials.

[0075] When the type, size and scale of the material to be processed, as well as the requirements of the material processing technology are all the same, compared with the related technology, the material processing device 100 of this embodiment has a higher cavitation energy density in the cavitation region. Therefore, the energy generated by ultrasonic cavitation can cut the material to meet the process requirements faster, which is beneficial to shortening the process duration. That is to say, when using this material processing device 100 to process materials, the material processing efficiency is high.

[0076] It should be noted that when using an ultrasonic horn to increase the amplitude of ultrasonic vibration to cut graphite materials in the related technology, in order to reduce the surface tension between the liquid used as the ultrasonic conduction medium and the graphite material, the liquid used as the ultrasonic conduction medium should be selected as ortho-dichlorobenzene, etc., which has limitations. In this embodiment, the above-mentioned first liquid medium 25 and the second liquid medium used as the ultrasonic conduction medium can be any one of liquids such as pure water and deionized water, and the selection range is large. In the material processing device 100 disclosed herein, the first liquid medium 25 and the second liquid medium can be the same or different. Preferably, the first liquid medium 25 and the second liquid medium can be fully degassed to facilitate reducing the gas inside.

[0077] According to Figure 1 In the example shown, the cavity wall of the liquid storage cavity 11 is adapted to the spherical crown ultrasonic oscillator assembly 22, and the ultrasonic oscillator assembly 22 can be specifically attached to and connected to the cavity wall of the liquid storage cavity 11. That is to say, the ultrasonic oscillator assembly 22 is arranged inside the liquid storage cavity 11, and at least part of the first liquid medium 25 fills the space surrounded by the ultrasonic oscillator assembly 22. The inner surface of the ultrasonic oscillator assembly 22 is in contact with the first liquid medium 25, and the outer surface is not in contact with the first liquid medium 25. In this way, on the premise of ensuring that a standing wave sound field can be formed in the space surrounded by the ultrasonic oscillator assembly 22, the liquid storage cavity 11 can be made as small as possible, which is beneficial to reducing the floor area of the material processing device 100, and at the same time, the amount of the first liquid medium 25 required to be contained in the liquid storage cavity 11 can be made as small as possible.

[0078] Furthermore, please continue to refer to Figure 1, the ultrasonic generating device 20 further includes a housing 23 and a sealing door 12. The housing 23 has an inner surface in the shape of a spherical crown. The housing 23 has an opening through which the sealed container 30 can pass, and the sealing door 12 can open and close the opening. When the sealing door 12 closes the opening, the sealing door 12 and the housing 23 together enclose a liquid storage chamber 11. By designing the housing 23, on the one hand, the housing 23 can provide a supporting function for the ultrasonic oscillator assembly 22, which is conducive to improving the installation stability of the ultrasonic oscillator assembly 22. On the other hand, the housing 23 and the sealing door 12 can jointly form a liquid storage container 10 that encloses the liquid storage chamber 11. The liquid storage chamber 11 can be sealed, and the material processing device 100 can be used as an independent module, with a high degree of modularity.

[0079] To further improve the installation stability of the ultrasonic oscillator assembly 22, the ultrasonic generating device 20 may further include an inner housing 24 in the shape of a spherical crown. The inner housing 24 is adapted to the ultrasonic oscillator assembly 22, and the inner housing 24 can be attached to and connected with the inner surface of the ultrasonic oscillator assembly 22. In this embodiment, the materials of the housing 23 and the inner housing 24 are not specifically limited. For example, the housing 23 and the inner housing 24 can be made of metal materials such as stainless steel and aluminum.

[0080] Optionally, the sealing door 12 can be detachably connected to the housing 23. When the sealing door 12 is connected to the housing 23, the sealing door 12 closes the opening. When the sealing door 12 is separated from the housing 23, the opening is opened. Alternatively, the sealing door 12 can be movably connected to the housing 23. For example, the sealing door 12 can be hingedly connected to the housing 23 so as to be able to rotate relative to the housing 23 to open and close the opening. Or, the sealing door 12 can be slidably connected to the housing 23 so as to be able to translate relative to the housing 23 to open and close the opening.

[0081] Optionally, as Figure 1 shown, a concave arc surface is formed on the side of the sealing door 12 facing the liquid storage chamber 11. When the sealing door 12 closes the opening, the arc surface and the inner surface of the housing 23 together enclose a spherical liquid storage chamber 11.

[0082] It can be understood that in the material processing device 100 disclosed in this article, the installation methods of the sealed container 30 in the liquid storage chamber 11 include but are not limited to the following possibilities.

[0083] As a possible way, as Figure 1 shown, the material processing device 100 further includes a bracket 40 disposed in the liquid storage chamber 11. The bracket 40 is provided with a connection position, and the sealed container 30 is detachably connected to the connection position.

[0084] For example, in Figure 1In the illustrated example, the bracket 40 can be fixedly arranged in the liquid storage cavity 11. At this time, the connection position is at the center of the spherical ultrasonic oscillator assembly 22 in the shape of a spherical crown. The bracket 40 can be fixedly connected to the cavity wall of the liquid storage cavity 11 by means of clamping, welding, bonding and other techniques.

[0085] Among them, the first liquid medium 25 can be manually injected into the housing 23. In this example, the opening is located at the top of the housing 23. When the material processing device 100 of this example is used for material processing, the specific processing process can be as follows: i) Open the opening and inject the first liquid medium 25 into the housing 23 through the opening; ii) Fill the sealed container 30 with the process liquid 31; iii) Place the sealed container 30 into the housing 23 through the opening and connect the sealed container 30 to the connection position, so that the sealed container 30 is immersed in the first liquid medium 25, and the center of the sealed container 30 coincides with the center of the spherical ultrasonic oscillator assembly 22 in the shape of a spherical crown; iv) Operate the sealing door 12 to close the opening to seal the liquid storage cavity 11; v) Turn on the power supply 21, the ultrasonic generating device 20 works, the ultrasonic oscillator assembly 22 emits ultrasonic waves, and the ultrasonic waves can cause ultrasonic cavitation in the second liquid medium; vi) After a period of time, turn off the power supply 21, the ultrasonic generating device 20 stops working, operate the sealing door 12 to open the opening, then disassemble and separate the sealed container 30 from the bracket 40, take out the sealed container 30 through the opening to the outside of the housing 23, and take out the micron-sized or nano-sized material obtained by cutting from the sealed container 30. Of course, step i) above can also be replaced by executing after step ii), and this embodiment does not specifically limit this.

[0086] When performing step i), the liquid pressure P1 of the first liquid medium 25 in the liquid storage cavity 11 can reach the threshold value. At the same time, when performing step ii), the liquid pressure P2 of the process liquid 31 in the sealed container 30 can also reach the threshold value, and the threshold value is less than or equal to the limit pressure value P of the sealed container 30 MAX . That is to say, the liquid pressure P1 of the first liquid medium 25 is equal to the liquid pressure P2 of the process liquid 31, and P2 ≤ P MAX . With such a design, when performing step iii), the sealed container 30 is at equal pressure inside and outside, which is beneficial to preventing the sealed container 30 from being damaged due to excessive internal and external pressure differences, and preventing the sealed container 30 from expanding and being damaged due to the internal hydraulic pressure exceeding the bearing capacity, ensuring that the sealed container 30 filled with the process liquid is stably immersed in the first liquid medium 25.

[0087] Exemplarily, the threshold value can be 1 MPa.

[0088] Here, it should be noted that the equality of P1 and P2 referred to in this article is not limited to absolute equality in the mathematical sense. When the difference between P1 and P2 is within a very small range, they can be regarded as equal. Alternatively, the first liquid medium 25 can be automatically injected into the interior of the housing 23 by the liquid injection device. At this time, the opening can be provided at the top of the housing 23 or on the side of the housing 23. Specifically, the liquid injection device includes a water tank, a liquid inlet pipeline, and a third booster pump (for example, a water pump). The water tank is used to store the first liquid medium 25. The water tank is connected to the liquid storage chamber 11 through the liquid inlet pipeline. Under the driving action of the third booster pump, the water tank injects the first liquid medium 25 into the liquid storage chamber 11 through the liquid inlet pipeline. Moreover, the material processing device 100 may further include a recovery container, a discharge pipeline, and a fourth booster pump (for example, a water pump). The recovery container is connected to the liquid storage chamber 11 through the discharge pipeline. Under the driving action of the fourth booster pump, the first liquid medium 25 inside the liquid storage chamber 11 is discharged into the recovery container through the discharge pipeline.

[0089] Taking the opening provided on the side of the housing 23 as an example, when the material processing device 100 of this example is used for material processing, the specific processing process may be as follows: 1) Fill the sealed container 30 with the process liquid 31, open the opening, and then place the sealed container 30 into the interior of the housing 23 through the opening, and connect the sealed container 30 to the connection position; 2) Operate the sealing door 12 to close the opening to seal the liquid storage chamber 11; 3) Operate the third booster pump to drive the first liquid medium 25 in the water tank to be introduced into the liquid storage chamber 11 through the liquid inlet pipeline, so that the sealed container 30 is immersed in the first liquid medium 25; 4) Turn on the power supply 21, and the ultrasonic generating device 20 works. The ultrasonic oscillator assembly 22 emits ultrasonic waves, and the ultrasonic waves can cause ultrasonic cavitation in the second liquid medium; 5) After a period of time, turn off the power supply 21, and the ultrasonic generating device 20 stops working. Operate the fourth booster pump so that the first liquid medium 25 inside the liquid storage chamber 11 is discharged into the recovery container through the discharge pipeline; 6) Operate the sealing door 12 to open the opening, then disassemble and separate the sealed container 30 from the bracket 40, and take out the sealed container 30 from the housing 23 through the opening, and take out the micron-sized or nanometer-sized material obtained by cutting from the sealed container 30.

[0090] When performing step 1), the liquid pressure P2 of the process liquid 31 in the sealed container 30 can be specifically made to reach the threshold value. At the same time, when performing step 3), the liquid pressure P1 of the first liquid medium 25 in the liquid storage chamber 11 can also be specifically made to reach the threshold value.

[0091] This example is set in this way to be able to automatically supply liquid to the liquid storage chamber 11 and automatically recover the first liquid medium 25 in the liquid storage chamber 11.

[0092] For another example, Figure 2The structure of another material processing device provided in the first embodiment of the present application is shown. Figure 2 In the example shown, the material processing device 100 also includes a driving mechanism (not shown), which is transmission-connected to the bracket 40, and the driving mechanism is used to drive the bracket 40 to move relative to the cavity wall of the liquid storage cavity 11, so that the sealed container 30 can move until its center coincides with the center of the spherical crown-shaped ultrasonic vibrator assembly 22.

[0093] When the material processing device 100 of this example is used to process materials, an exemplary specific processing process may be: a) filling the sealed container 30 with the process liquid 31, opening the opening, and then placing the sealed container 30 into the shell 23 through the opening, and connecting the sealed container 30 to the connection position; b) operating the sealing door 12 to close the opening to seal the liquid storage chamber 11; c) operating the third booster pump to drive the first liquid medium 25 in the water tank to be introduced into the liquid storage chamber 11 through the liquid inlet pipeline, so that the sealed container 30 is immersed in the first liquid medium 25; d) the driving mechanism is operated to drive the bracket 40 to move until the sealed container 30 is driven to move to a position exceeding 100°. The center of the sphere of the sonic vibrator assembly 22; e) Turn on the power supply 21, the ultrasonic generator 20 works, and the ultrasonic vibrator assembly 22 emits ultrasonic waves, which can cause ultrasonic cavitation in the second liquid medium; f) After a period of time, turn off the power supply 21, the ultrasonic generator 20 stops working, and the fourth booster pump is operated, so that the first liquid medium 25 in the liquid storage chamber 11 is discharged into the recovery container through the discharge pipeline; g) Operate the sealing door 12 to open the opening, and then remove the sealed container 30 from the bracket 40 and take the sealed container 30 out of the shell 23 through the opening, and take out the cut micron or nanometer material from the sealed container 30. Of course, the execution order of the above steps c) and d) can also be replaced with each other, and this embodiment does not specifically limit this.

[0094] Optionally, the driving mechanism may be specifically configured to drive the support 40 to move along the X-axis, Y-axis, and Z-axis of the coordinate system XYZ of the material processing device 100. In some embodiments, the driving mechanism may also drive the support 40 to rotate around the X-axis.

[0095] As in the material processing device 100 disclosed in this article, the detachable connection between the sealed container 30 and the connecting position can be achieved by screwing, snapping, plugging, etc. Taking snapping as an example, the connecting position may include a slot, and the sealed container 30 is provided with a protrusion facing outward, and the protrusion and the slot can be snapped in or out of engagement.

[0096] Figure 3 The structure of another material processing device provided in the first embodiment of the present application is shown. As another possible method, please refer to Figure 3, the sealed container 30 is provided with a liquid inlet and a liquid outlet. The material processing device 100 further includes a controller, a feeding system 50, a discharging system 56, and a first hydraulic detector.

[0097] The feeding system 50 includes a supply pipeline 52, as well as a storage container 51, a first control valve 53, and a first booster pump 54 located outside the liquid storage cavity 11. The storage container 51 is used to hold the process liquid 31. The inflow end of the supply pipeline 52 is connected to the storage container 51, the outflow end of the supply pipeline 52 extends into the liquid storage cavity 11 and is connected to the liquid inlet. The first booster pump 54 can be used to increase the pressure of the conveyed process liquid 31, so as to convey the process liquid 31 in the storage container 51 into the sealed container 30 through the supply pipeline 52. The opening degree of the first control valve 53 is adjustable to adjust the flow rate of the process liquid 31 flowing into the sealed container 30.

[0098] The discharging system 56 includes a discharge pipeline 57, as well as a collection container 58 and a second control valve 59 located outside the liquid storage cavity 11. The inflow end of the discharge pipeline 57 extends into the liquid storage cavity 11 and is connected to the liquid outlet, the outflow end of the discharge pipeline 57 is connected to the collection container 58, and the mixed solution in the sealed container 30 can be discharged into the collection container 58 through the discharge pipeline 57. The opening degree of the second control valve 59 is adjustable to adjust the flow rate of the process liquid 31 flowing out of the sealed container 30.

[0099] The first hydraulic detector is used to detect the hydraulic pressure (i.e., P2) in the sealed container 30. The controller is electrically connected to the above-mentioned first hydraulic detector, first booster pump 54, first control valve 53, and second control valve 59, and the controller can control the first booster pump 54, first control valve 53, and second control valve 59 according to the hydraulic pressure value detected by the first hydraulic detector and the preset pressure value, so as to control the hydraulic pressure in the sealed container 30. Exemplarily, the first control valve 53 and the second control valve 59 can be selected from any one of a butterfly valve, an electric ball valve, and a regulating valve to achieve. The number of the first control valves 53 is not limited. For example, as shown in Figure 3 shown, there can be 2 first control valves 53, and one of the first control valves 53 can be used as a spare.

[0100] In this embodiment, the sealed container 30 is connected to the supply pipeline 52 and the discharge pipeline 57, and the sealed container 30 can be fixed in the liquid storage cavity 11. When using the material processing device 100 to process materials, there is no need for manual loading and unloading of the sealed container 30. The feeding system 50 can automatically supply the process liquid 31 to the sealed container 30 placed in the liquid storage cavity 11, and the discharging system 56 can automatically discharge the mixed solution in the sealed container 30 outside the liquid storage cavity 11. The degree of automation is high, which is beneficial to improving the material processing efficiency.

[0101] Moreover, when the material processing apparatus 100 of the present example is in use, before material processing, the controller can control the feeding system 50 to first inject the process liquid 31 into the sealed container 30. By controlling the opening degree of the first control valve 53, the flow rate of the process liquid 31 input into the sealed container 30 is adjusted to achieve hydraulic regulation of the sealed container 30, so that the liquid pressure P2 of the process liquid 31 can reach the preset pressure value. Since the hydraulic pressure of the sealed container 30 is adjustable, during the material processing, on the premise that the sealed container 30 can be stably placed in the first liquid medium 25, a relatively large value can be adopted for the preset flow rate (for example, greater than P MAX ), and the hydraulic pressure of the sealed container 30 is correspondingly adjusted to a relatively large value, which is beneficial to increasing the cavitation energy density. Therefore, on the premise that other parameters are the same, the cavitation energy density in the cavitation region can be further increased, further ensuring that micro-nano processing of the material can be achieved.

[0102] In some embodiments, as Figure 3 shown, on the basis of the embodiment in which the material processing apparatus 100 further includes a feeding system 50, the feeding system 50 may further include a flow meter 55 electrically connected to the controller. The flow meter 55 is used to detect the flow rate of the process liquid 31 passing through the supply pipeline 52. The controller controls the opening degree of the first control valve 53 according to the flow rate detected by the flow meter 55 and the preset flow rate to regulate the flow rate of the process liquid 31 flowing into the sealed container 30. Designed in this way, the flow rate of the process liquid 31 delivered to the sealed container 30 can be accurately controlled. During the material processing, the preset flow rate can be designed as a relatively large value, so that the material processing apparatus 100 can perform large-scale cutting or etching processing on the material.

[0103] In some embodiments, the material processing apparatus 100 may further include a second hydraulic detector and the above-mentioned liquid injection device. The liquid injection device further includes a fourth control valve electrically connected to the controller and provided on the liquid inlet pipeline. The opening degree of the fourth control valve is adjustable to regulate the flow rate of the liquid inlet pipeline (i.e., the flow rate of the first liquid medium 25 flowing into the liquid storage chamber 11). The second hydraulic detector is used to detect the hydraulic pressure in the liquid storage chamber 11. The controller is electrically connected to the second hydraulic detector, the third booster pump, and the fourth control valve. The controller can control the third booster pump and the fourth control valve according to the hydraulic pressure value detected by the second hydraulic detector and the preset pressure value to control the hydraulic pressure in the liquid storage chamber 11. That is to say, the hydraulic pressure of the liquid storage chamber 11 is also adjustable.

[0104] In this way, before material processing, the controller can control the third booster pump to operate so that the first liquid medium 25 in the water tank flows into the liquid storage chamber 11. And the controller can also control the flow rate by the opening degree of the third control valve to regulate the hydraulic pressure of the liquid storage chamber 11, so that the liquid pressure P1 of the first liquid medium 25 is equal to P2.

[0105] With such a design, before material processing, since the liquid pressure P1 of the first liquid medium 25 and the liquid pressure P2 of the process liquid 31 are both adjustable, the liquid pressure P2 of the process liquid 31 can be made consistent with the liquid pressure P1 of the first liquid medium 25, which helps prevent the sealed container 30 from being damaged due to excessive internal and external pressure differences.

[0106] It can be understood that the above-mentioned first booster pump 54 and the above-mentioned third booster pump can be variable-speed pumps or fixed-speed pumps. When the first booster pump 54 and the third booster pump are variable-speed pumps, the flow rate of the process liquid 31 input into the sealed container 30 and the flow rate of the first liquid medium 25 input into the liquid storage chamber 11 can also be adjusted. In this way, while injecting the process liquid 31 into the sealed container 30, the first liquid medium 25 can be injected into the liquid storage chamber 11, and by adjusting the flow rate and flow volume, the growth rates of P1 and P2 can be made the same, so that the two are equal in real time and reach the preset pressure value simultaneously. In this way, it helps ensure that the pressure inside and outside the sealed container 30 is equal during the liquid injection process, so as to avoid damage due to excessive internal and external pressure differences. At this time, the hydraulic pressure inside and outside the sealed container 30 can be pressurized to be greater than P MAX , which helps increase the cavitation energy density. On the premise that other parameters are the same, the cavitation energy density in the cavitation region can be further increased to further ensure that micro-nano processing of the material can be achieved. Exemplarily, the preset pressure value can be greater than or equal to 10 MPa. It can be seen that when P1 and P2 are both adjustable, P2 can be adjusted to be much higher than the threshold value and P MAX .

[0107] In some embodiments, please continue to refer to Figure 3 , the material processing device 100 further includes an air intake system 60, and the air intake system 60 can controllably introduce reaction gases (for example, carbon dioxide, nitrogen, ammonia) into the process liquid 31. Specifically, the air intake system 60 includes an intake pipeline 61, a gas source (not shown in the figure) provided outside the liquid storage chamber 11, a third control valve 62, and a second booster pump 63. The second booster pump 63 is arranged on the intake pipeline 61, and the second booster pump 63 is used to increase the pressure of the conveyed reaction gas, so that the gas source introduces the reaction gas into the process liquid 31 through the intake pipeline 61. The third control valve 62 is arranged on the intake pipeline 61 and is used to control the on-off of the intake pipeline 61. Similar to the first control valve 53 and the second control valve 59, the third control valve 62 can also be selected from any one of a butterfly valve, an electric ball valve, and a regulating valve to achieve. Both the second booster pump 63 and the third control valve 62 are connected to the controller, and the controller can control the working state of the second booster pump 63 and the opening degree of the third control valve 62 to adjust the gas volume of the reaction gas introduced into the process liquid 31.

[0108] Here, the introduction of the reaction gas from the gas source into the process liquid 31 through the intake pipeline 61 should be understood in a broad sense.

[0109] In one example, it can be understood that the outlet end of the intake pipe 61 extends into the liquid storage cavity 11 and is directly communicated with the inside of the sealed container 30, so as to directly introduce the reaction gas into the process liquid 31 inside the sealed container 30.

[0110] In another example, please refer to Figure 3 , it can also be understood that the outlet end of the intake pipe 61 is communicated with the supply pipe 52, and the outlet end of the intake pipe 61 is communicated with the inside of the sealed container 30 through the supply pipe 52. The reaction gas and the process liquid 31 in the supply pipe 52 are mixed and then jointly introduced into the sealed container 30. At this time, the intake pipe 61 can be located outside the liquid storage cavity 11, which is beneficial to avoid the intake pipe 61 occupying a part of the liquid storage cavity 11 and can also prevent the intake pipe 61 extending into the liquid storage cavity 11 from obstructing the transmission of ultrasonic waves.

[0111] In this example, when there are multiple first control valves 53, at least one of the multiple first control valves 53 is located downstream of the outlet end of the intake pipe 61. With this design, the first control valve 53 located downstream of the outlet end of the intake pipe 61 can also play a role in controlling the on-off of the intake pipe 61. When it is necessary to fill the reaction gas into the process liquid 31, the controller can control the first control valve 53 and the second control valve 59 located upstream of the outlet end of the intake pipe 61 to close, control the third control valve 62 and the first control valve 53 located downstream of the outlet end of the intake pipe 61 to open, and control the second booster pump 63 to boost pressure. In still another example, it can also be understood that the outlet end of the intake pipe 61 is communicated with the inside of the storage container 51, so that the reaction gas and the process liquid 31 in the storage container 51 are mixed and then introduced into the sealed container 30.

[0112] Furthermore, a filter 64 can also be provided on the intake pipe 61. The filter 64 is used to filter the reaction gas passing through the intake pipe 61, so as to reduce the impurities existing in the reaction gas introduced into the sealed container 30.

[0113] It is easy to understand that Figure 3 An exemplary working process of the material processing device 100 shown includes the following steps. A) The first control valve 53 is opened to conduct the supply pipe 52, the second control valve 59 is closed to cut off the discharge pipe 57, the first booster pump 54 is started, and the storage container 51 conveys the process liquid 31 to the sealed container 30 through the supply pipe 52 until the liquid pressure P2 of the process liquid 31 in the sealed container 30 reaches the threshold value; B) The sealing door 12 closes the opening, the controller controls the fourth control valve to open to conduct the liquid inlet pipe, and the third booster pump operates to drive the first liquid medium 25 in the water tank to be introduced into the liquid storage cavity 11 through the liquid inlet pipe, so that the sealed container 30 is immersed in the first liquid medium 25 until the liquid pressure P1 of the first liquid medium 25 reaches the threshold value; Since the threshold value is less than P MAX, the sealed container 30 will not be damaged during steps A) and B); C) the controller controls both the first control valve 53 and the fourth control valve to open, and the first booster pump 54 and the third booster pump operate simultaneously; during this process, by adjusting the opening degrees of the first control valve 53 and the fourth control valve and the rotational speeds of the first booster pump 54 and the third booster pump, the inside and outside of the sealed container 30 are pressurized simultaneously, and the hydraulic pressures P1 and P2 inside and outside the sealed container 30 are equal in real time until a preset pressure value is reached (e.g., greater than P MAX ); D) Open the third control valve 62 to conduct the intake pipe 61, start the second booster pump 63, and the gas source conveys the reaction gas into the sealed container 30 through the intake pipe 61, and then close the third control valve 62; E) Turn on the power supply 21, the ultrasonic generating device 20 works, the ultrasonic oscillator assembly 22 emits ultrasonic waves, and the ultrasonic waves can cause ultrasonic cavitation in the second liquid medium; E) After a period of time, turn off the power supply 21, the ultrasonic generating device 20 stops working, the first control valve 53 is closed to cut off the supply pipe 52, and the second control valve 59 is opened to conduct the discharge pipe 57, so that the materials cut into micrometer or nanometer levels are discharged into the collection container 58 along with the second liquid medium.

[0114] The following details the specific implementation of the ultrasonic oscillator assembly 22 of the material processing device 100 in the above embodiments.

[0115] In any of the above embodiments, the ultrasonic oscillator assembly 22 can be formed by using piezoelectric ceramics or magnetostrictive materials. Piezoelectric ceramics are a type of ceramic material that can convert mechanical energy and electrical energy into each other. In the technical solution of this application, piezoelectric ceramics can be used to convert electrical energy into mechanical energy, thereby generating ultrasonic waves. When magnetostrictive materials are magnetized in a magnetic field, they will elongate or shorten in the magnetization direction, and the size of the magnetostrictive materials can be significantly changed by changing the current passing through the coil, thereby generating ultrasonic waves. The ultrasonic oscillator assembly 22 formed by using piezoelectric ceramics or magnetostrictive materials can simply and effectively emit ultrasonic waves. Of course, in other embodiments, the ultrasonic oscillator assembly 22 can also be formed by other materials, which is not specifically limited here.

[0116] In some embodiments, the ultrasonic oscillator assembly 22 is an integral structure. Specifically, the ultrasonic oscillator assembly 22 can be formed into an integral part by using an integral molding process, or the ultrasonic oscillator assembly 22 can also be formed by splicing multiple vibrating bodies, and any two vibrating bodies can be connected by means such as clamping, bonding, and welding. In this embodiment, the ultrasonic oscillator assembly 22 vibrates as a whole to generate ultrasonic waves.

[0117] In some other embodiments, the ultrasonic oscillator assembly 22 includes a plurality of vibrating bodies, which are spherically symmetrically distributed with respect to the center O of the spherical-crowned ultrasonic oscillator assembly 22. Further, the material processing apparatus 100 may further include a controller capable of separately controlling the vibration amplitude of each vibrating body. In this embodiment, the ultrasonic oscillator assembly 22 can vibrate locally to generate ultrasonic waves.

[0118] Among them, the plurality of vibrating bodies can be divided into multiple groups, and each group has two vibrating bodies that are spherically symmetrically distributed with respect to the center O of the spherical-crowned ultrasonic oscillator assembly 22. When using the material processing apparatus 100 of this example for material processing, by controlling one or more groups of vibrating bodies not to vibrate or controlling the vibration amplitudes of at least two groups of vibrating bodies to be different, the distribution of the sound field can be changed, so that the position of the bubbles and the array arrangement mode of the bubbles can be accurately adjusted, that is, the action position of the energy released by ultrasonic cavitation can be accurately controlled, thereby enabling precise control of the processing of the material. Taking the use of the material processing apparatus 100 to etch a material as an example, a specified-shaped etching pattern can be formed on the surface of a copper sheet or a stainless steel sheet.

[0119] Embodiment 2

[0120] This embodiment is similar to Embodiment 1, except for the installation position of the ultrasonic oscillator assembly 22. Please refer to Figures 1 to 3 , in Embodiment 1, the ultrasonic oscillator assembly 22 is attached to and connected to the cavity wall of the liquid storage cavity 11. Figure 4 shows Figure 1 the structure of a modified example of the material processing apparatus shown in Figure 5 shows Figure 2 the structure of a modified example of the material processing apparatus shown in Figure 6 shows Figure 3 the structure of a modified example of the material processing apparatus shown in. Please refer to Figures 4 to 6 , in this embodiment, the ultrasonic oscillator assembly 22 is installed inside the liquid storage cavity 11 and immersed in the first liquid medium 25.

[0121] When the material processing apparatus 100 of this embodiment is used for material processing, a standing wave sound field is formed in the space surrounded by the spherical-crowned ultrasonic oscillator assembly 22, and the wave antinode of the standing wave is formed at the center O of the spherical-crowned ultrasonic oscillator assembly 22, and the center O of the ultrasonic oscillator assembly 22 coincides with the center of the sealed container 30, so that the energy of the standing wave can be concentrated on the central region of the sealed container 30. The sound pressure in the central region of the sealed container 30 is high, and the bubbles can stably suspend at the wave antinode, so the bubbles can be concentrated in the central region of the sealed container 30. Thus, the central region of the sealed container 30 is formed as a cavitation region, and the cavitation energy density in this cavitation region is high, so as to enable micro-nano processing of the material to be processed.

[0122] When the ultrasonic generating device 20 further includes a housing 23, the housing 23 is correspondingly immersed in the first liquid medium 25. In this way, the housing 23 can not only provide support for the ultrasonic oscillator assembly 22 to improve the installation stability of the ultrasonic oscillator assembly 22, but also the ultrasonic oscillator assembly 22 and the housing 23 jointly bear the liquid pressure P1 of the first liquid medium 25, so that the whole formed by the ultrasonic oscillator assembly 22 and the housing 23 has a high hydraulic pressure resistance.

[0123] In this embodiment, the material processing device 100 further includes a liquid storage container 10, and the liquid storage container 10 encloses a liquid storage cavity 11. The cross-sectional shape of the liquid storage container 10 is not limited, and can be, for example, elliptical, rectangular, circular, etc.

[0124] In this embodiment, the liquid storage container 10 may further have a through hole through which the ultrasonic oscillator assembly 22 can pass, so that the ultrasonic oscillator assembly 22 can be placed into the liquid storage cavity 11 via the through hole. When the ultrasonic generating device 20 further includes a housing 23, the opening of the housing 23 is open, so that the sealed container 30 can enter the inside of the ultrasonic oscillator assembly 22 via the opening.

[0125] Figure 4 When the shown material processing device 100 is installed, first connect the connection position of the sealed container 30 filled with the process liquid 31 to the bracket 40, then move the ultrasonic oscillator assembly 22 from the through hole into the liquid storage cavity 11, and align the open end of the spherical-crowned ultrasonic oscillator assembly 22 with the sealed container 30. Then move the ultrasonic oscillator assembly 22 in the liquid storage cavity 11 to approach the bracket 40, so that part of the bracket 40 extends into the inside of the ultrasonic oscillator assembly 22 in sequence through the opening of the housing 23 and the open end of the ultrasonic oscillator assembly 22 until the center O of the spherical-crowned ultrasonic oscillator assembly 22 coincides with the center of the sealed container 30.

[0126] Figure 5 When the shown material processing device 100 is installed, connect the connection position of the sealed container 30 filled with the process liquid 31 to the bracket 40, move the ultrasonic oscillator assembly 22 from the through hole into the liquid storage cavity 11, and then drive the bracket 40 to move through the driving mechanism, so that the bracket 40 extends into the inside of the ultrasonic oscillator assembly 22 in sequence through the opening of the housing 23 and the open end of the ultrasonic oscillator assembly 22 to drive the sealed container 30 into the inside of the ultrasonic oscillator assembly 22 until the center O of the spherical-crowned ultrasonic oscillator assembly 22 coincides with the center of the sealed container 30.

[0127] In other embodiments of the present application, after the sealed container 30 is horizontally moved into the ultrasonic oscillator assembly 22 through the open end driven by the bracket 40, the driving mechanism can further drive the bracket 40 to rotate around the X-axis to an upright state, so that the center O of the spherical ultrasonic oscillator assembly 22 coincides with the center of the sealed container 30. It can be seen that by driving the sealed container 30 by the bracket 40 to horizontally move into the ultrasonic oscillator assembly 22 through the open end, it is beneficial to prevent the bracket 40 and the sealed container 30 from colliding with the ultrasonic oscillator assembly 22 when passing through the open end.

[0128] When the material processing device 100 is as Figure 6 shown, the ultrasonic oscillator assembly 22 may be provided with a first avoidance hole, and the supply pipeline 52 is arranged in the first avoidance hole. And / or, the ultrasonic oscillator assembly 22 is provided with a second avoidance hole, and the discharge pipeline 57 is arranged in the second avoidance hole. Such an arrangement is beneficial to avoid interference between at least one of the supply pipeline 52 and the discharge pipeline 57 and the ultrasonic oscillator assembly 22.

[0129] Figure 6 When the material processing device 100 shown is installed, the ultrasonic oscillator assembly 22 can be first moved into the liquid storage cavity 11 from the through hole, and then the sealed container 30 is moved into the ultrasonic oscillator assembly 22. The supply pipeline 52 is arranged in the first avoidance hole, and the discharge pipeline 57 is arranged in the second avoidance hole, so that the liquid inlet of the sealed container 30 is connected to the outflow end of the supply pipeline 52, and the liquid outlet is connected to the inflow end of the discharge pipeline 57.

[0130] Embodiment III

[0131] This embodiment provides a material processing method, which can be applied to any one of the material processing devices 100 in Embodiment I and Embodiment II to realize the processing of materials. Figure 7 It is a schematic flow chart of a material processing method provided in Embodiment III of the present application. Please refer to Figure 7 , the material processing method includes the following steps.

[0132] S10, a liquid injection step of injecting a first liquid medium 25 into the liquid storage cavity 11 and injecting a process liquid 31 into the sealed container 30, and the center of the sealed container 30 coincides with the center of the spherical ultrasonic oscillator assembly 22.

[0133] S20, an ultrasonic cavitation step of applying power to the ultrasonic oscillator assembly 22 so that the ultrasonic oscillator assembly 22 emits ultrasonic waves, and the ultrasonic waves can cause ultrasonic cavitation in the second liquid medium.

[0134] When the material processing method of this embodiment is used for material treatment, a standing wave sound field is formed in the space enclosed by the spherical-crown ultrasonic oscillator assembly 22. The wave antinode of the standing wave is formed at the center of the spherical-crown ultrasonic oscillator assembly 22, and the center of the ultrasonic oscillator assembly 22 coincides with the center of the sealed container 30. In this way, the energy of the standing wave can be concentrated on the central region of the sealed container 30. The sound pressure in the central region of the sealed container 30 is high, and the bubbles can stably suspend at the wave antinode, so the bubbles can be concentrated in the central region of the sealed container 30. Thus, the central region of the sealed container 30 is formed as a cavitation region, and the cavitation energy density in this cavitation region is high, so as to realize the micro-nano processing of the material to be processed.

[0135] The above-mentioned first liquid medium 25 and second liquid medium can be fully degassed liquids. In this example, before performing S10, the first liquid medium 25 and the second liquid medium can also be degassed.

[0136] When the material processing device 100 is Figure 1 , Figure 2 , Figure 4 or Figure 5 the structure shown, S10 in the material processing method provided by this embodiment specifically includes the following steps S111 to S113.

[0137] S111, inject the first liquid medium 25 into the liquid storage cavity 11.

[0138] S112, inject the process liquid 31 into the sealed container 30.

[0139] S113, immerse the sealed container 30 in the first liquid medium 25 and make the center of the sealed container 30 coincide with the center of the spherical-crown ultrasonic oscillator assembly 22.

[0140] Among them, the execution order of S111 and S112 can be reasonably designed and customized according to the structure of the material processing device 100, as long as the sealed container 30 filled with the process liquid 31 can be immersed in the first liquid medium 25, and the center of the sealed container 30 coincides with the center O of the spherical-crown ultrasonic oscillator assembly 22. The liquid pressure of the first liquid medium 25 in S111 can be a threshold value, and the liquid pressure of the process liquid 31 in S112 is also a threshold value, and the threshold value is less than or equal to P MAX .

[0141] When the material processing device 100 is Figure 3 or Figure 6When the structure shown is involved, that is, when the material processing device 100 further includes a feeding system, a discharging system, a first hydraulic detector, a second hydraulic detector, a liquid injection device, and a controller, before S10, the material processing method may further include S30 and S40. The material processing method provided in this example can be specifically implemented by the controller of the material processing device 100.

[0142] S30, receiving a preset pressure value.

[0143] S40, determining whether the preset pressure value is less than or equal to the limit pressure value P of the sealed container MAX .

[0144] Optionally, if the determination result of S40 is no, there are multiple possible specific implementation processes for S10.

[0145] For example, in one possibility, S10 specifically includes the following steps S121 to S123.

[0146] S121, injecting a first liquid medium into the liquid storage cavity so that the liquid pressure of the first liquid medium reaches a threshold value.

[0147] S122, injecting a process liquid into the sealed container so that the liquid pressure of the process liquid in the sealed container reaches a threshold value; the threshold value is less than or equal to the limit pressure value of the sealed container.

[0148] S123, injecting the first liquid medium into the liquid storage cavity and injecting the process liquid into the sealed container at the same time, so that the liquid pressure of the first liquid medium and the liquid pressure of the process liquid in the sealed container increase simultaneously until the liquid pressure of the first liquid medium and the liquid pressure of the process liquid in the sealed container reach the preset pressure value at the same time.

[0149] In this embodiment, first, the pressure P1 of the first liquid medium in the liquid storage cavity and the pressure P2 of the process liquid in the sealed container are respectively increased to not exceed the limit pressure value P of the sealed container MAX , and the sealed container can withstand this pressure, so it will not be damaged. Then, P1 and P2 are increased simultaneously so that P1 and P2 reach the preset pressure value exceeding P MAX at the same time.

[0150] For another example, in another possibility, the specific implementation process of S10 is: injecting the first liquid medium into the liquid storage cavity and injecting the process liquid into the sealed container at the same time, so that the liquid pressure of the first liquid medium and the liquid pressure of the process liquid in the sealed container increase simultaneously until the liquid pressure of the first liquid medium and the liquid pressure of the process liquid in the sealed container rise from 0 to the preset pressure value at the same time. In this embodiment, P1 and P2 are directly controlled to reach the preset pressure value exceeding P MAX at the same time.

[0151] It should be noted that when the first booster pump and the third booster pump are variable-speed pumps, the speeds of the first booster pump and the third booster pump can be adjusted so that P1 and P2 are equal in real time during the process of increasing P1 and P2.

[0152] Since the cavitation energy density is related to the liquid pressure, and the increase of the liquid pressure has a favorable effect on the increase of the cavitation energy density, therefore, the material processing method of this embodiment makes P1 and P2 adjustable by design, so that P1 and P2 can reach a value exceeding P MAX to increase the cavitation energy density in the cavitation region, further ensuring that micro-nano processing of the material can be achieved. And, by such control, the water pressure inside and outside the sealed container 30 is ensured to be consistent, so as to prevent the sealed container 30 from being damaged due to excessive internal and external pressure differences.

[0153] Optionally, if the judgment result of S40 is yes, in the specific implementation process of S10, the liquid can be injected into the sealed container and the liquid storage chamber in sequence to increase P1 and P2 to the preset pressure value successively, or the liquid can be injected into the sealed container and the liquid storage chamber simultaneously to increase P1 and P2 to the preset pressure value simultaneously. Since the preset pressure value is less than or equal to P MAX , even if P1 and P2 are not increased simultaneously, the sealed container will not be damaged.

[0154] When the material processing device 100 is Figure 3 or Figure 6 shown in the structure, that is, when the material processing device 100 further includes an air intake system 60, before S20, the material processing method may further include S50.

[0155] S50, input reaction gas into the process liquid.

[0156] Among them, the execution order of S50 is not limited to after S10, and it can also be before S10, and can be reasonably designed according to the structure of the material processing device 100 and actual requirements.

[0157] In any of the above embodiments, the power loaded on the ultrasonic oscillator assembly 22 in S20 can be specifically greater than or equal to 500W, preferably 3000W. Since cavitation occurs in relation to the sound pressure, therefore, the material processing method of this embodiment makes the process liquid 31 generate cavitation for micro-nano processing by adopting power parameters that can generate a power higher than the cavitation threshold.

[0158] In any of the above embodiments, the duty cycle of the ultrasonic waves emitted by the ultrasonic oscillator assembly 22 in S20 may be greater than 10%. On this basis, a moderate value may be adopted for the duty cycle of the ultrasonic waves. It can be understood that when the bubbles collapse, physical effects such as local high temperature and high pressure, shock waves, and microjets are generated. The energy released by the bubbles includes thermal energy and mechanical energy. By setting the duty cycle of the ultrasonic waves to a moderate value, it is avoided that the duty cycle of the ultrasonic waves is too large, resulting in excessive thermal energy, so as to promote the mechanical energy to act on the material as much as possible during material processing, so that the material is cut under the action of mechanical force to prevent damage to the material surface caused by thermal energy. Of course, the duty cycle of the ultrasonic waves is not limited to the above range, and can also be designed and adjusted according to experience and actual working conditions.

[0159] In any of the above embodiments, the vibration frequency of the ultrasonic oscillator assembly 22 is greater than or equal to 20 kHz, and specifically may be 20 kHz to 800 kHz. The vibration frequency of the ultrasonic oscillator assembly 22 can be designed and adjusted according to experience and actual working conditions.

[0160] In any of the above embodiments, the process duration of step S20 can be reasonably designed, that is, the ultrasonic cavitation duration is reasonably designed to precisely control the action on the material. Taking the material to be processed as graphene as an example, when nano-processing graphene according to this material processing method, the process duration of step S20 is preferably 200 s to 300 s.

[0161] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principle of the present invention, and the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims

1. A material processing device, characterized in that, Comprising: A liquid storage chamber for containing a first liquid medium; An ultrasonic generating device including an ultrasonic oscillator assembly in a spherical crown shape, the ultrasonic oscillator assembly being configured to emit ultrasonic waves; And A sealed container for containing a process liquid therein, the process liquid being formed by dispersing a material to be processed in a second liquid medium, the sealed container being capable of being placed in the liquid storage chamber and immersed in the first liquid medium; the ultrasonic oscillator assembly is disposed around the outside of the sealed container, and the center of the spherical crown-shaped ultrasonic oscillator assembly coincides with the center of the sealed container; the sealed container allows the ultrasonic waves to penetrate, and the ultrasonic waves can cause ultrasonic cavitation in the second liquid medium.

2. The material processing device according to claim 1, wherein The ultrasonic oscillator assembly is adhesively connected to the chamber wall of the liquid storage chamber; or, the ultrasonic oscillator assembly can be placed inside the liquid storage chamber and immersed in the first liquid medium.

3. The material processing device according to claim 2, characterized in that, The ultrasonic generating device further includes a housing having an inner surface in a spherical crown shape, the housing having an opening for the sealed container to pass through; the ultrasonic oscillator assembly is disposed on the housing, and the ultrasonic oscillator assembly is in contact with the inner surface of the housing; When the ultrasonic oscillator assembly is adhesively connected to the chamber wall of the liquid storage chamber, the material processing device further includes a sealing door that can open and close the opening, and when the sealing door closes the opening, the sealing door and the housing together enclose the liquid storage chamber.

4. The material processing device according to any one of claims 1 to 3, characterized in that It further includes a bracket provided with a connection position, and the sealed container is detachably connected to the connection position; The bracket is fixedly disposed inside the liquid storage chamber, and the connection position is at the center of the spherical crown-shaped ultrasonic oscillator assembly; Or, the bracket is disposed inside the liquid storage chamber and can move relative to the chamber wall of the liquid storage chamber, and the material processing device further includes a driving mechanism for driving the bracket to move so as to be able to drive the sealed container to move to the center of the spherical crown-shaped ultrasonic oscillator assembly.

5. The material processing device according to claim 4, wherein The liquid pressure of the first liquid medium is configured to be equal to the liquid pressure of the process liquid in the sealed container and less than or equal to the limit pressure value of the sealed container.

6. The material processing device according to any one of claims 1 to 3, characterized in that, It further includes a feeding system, a discharging system, a first hydraulic detector, and a controller, and the sealed container is provided with a liquid inlet and a liquid outlet; The feeding system includes a supply pipeline, as well as a storage container, a first control valve, and a first booster pump located outside the liquid storage chamber; the inflow end of the supply pipeline is communicated with the storage container, the outflow end is connected to the liquid inlet, the first booster pump and the first control valve are disposed on the supply pipeline, and the first booster pump is used to drive the process liquid in the storage container to be conveyed to the sealed container through the supply pipeline; the opening degree of the first control valve is adjustable to adjust the flow rate of the process liquid flowing into the sealed container; The blanking system includes a discharge pipeline, a collection container located outside the liquid storage cavity, and a second control valve; the inflow end of the discharge pipeline is connected to the liquid outlet, and the outflow end is communicated with the collection container; the second control valve is arranged on the discharge pipeline, and the opening degree of the second control valve is adjustable to adjust the flow rate of the process liquid flowing out of the sealed container. The first hydraulic detector is used to detect the hydraulic pressure in the sealed container, and the controller controls the first booster pump, the first control valve and the second control valve according to the hydraulic pressure value detected by the first hydraulic detector and the preset pressure value to control the hydraulic pressure in the sealed container.

7. The material processing device according to claim 6, characterized in that, The feeding system further includes a flow meter connected to the controller. The flow meter is used to detect the flow rate of the process liquid passing through the supply pipeline, and the controller controls the opening degree of the first control valve according to the flow rate detected by the flow meter and the preset flow rate to regulate the flow rate of the process liquid flowing into the sealed container.

8. The material processing device according to claim 6, wherein, The feeding system further includes an air inlet pipeline, a gas source, a third control valve and a second booster pump arranged outside the liquid storage cavity. The controller is connected to the third control valve and the second booster pump. The second booster pump is arranged on the air inlet pipeline and is used to increase the pressure of the conveyed reaction gas so that the gas source passes the reaction gas into the process liquid through the air inlet pipeline; the third control valve is arranged on the air inlet pipeline and is used to control the on-off of the air inlet pipeline.

9. The material processing device according to claim 8, characterized in that, A filter is arranged on the air inlet pipeline, and the filter is used to filter the reaction gas passing through the air inlet pipeline.

10. The material processing device according to claim 6, characterized in that, The material processing device further includes a liquid injection device and a second hydraulic detector. The liquid injection device includes a water tank, a liquid inlet pipeline, a third booster pump and a fourth control valve arranged on the liquid inlet pipeline. The water tank is communicated with the liquid storage cavity through the liquid inlet pipeline. The third booster pump is used to drive the first liquid medium in the water tank to be conveyed to the liquid storage cavity; the opening degree of the fourth control valve is adjustable to adjust the flow rate of the first liquid medium flowing into the liquid storage cavity. The second hydraulic detector is used to detect the hydraulic pressure in the liquid storage cavity, and the controller controls the third booster pump and the fourth control valve according to the hydraulic pressure value detected by the second hydraulic detector and the preset pressure value to control the hydraulic pressure in the liquid storage cavity so that the liquid pressure of the first liquid medium is equal to the liquid pressure of the process liquid in the sealed container.

11. The material processing device according to any one of claims 1 to 3, characterized in that, The ultrasonic oscillator assembly is of an integral structure; or, the ultrasonic oscillator assembly includes a plurality of vibrating bodies, and the plurality of vibrating bodies are symmetrically distributed with respect to the center of the spherical crown-shaped ultrasonic oscillator assembly. The material processing device further includes a controller, and the controller can respectively control the vibration amplitude of the plurality of vibrating bodies.

12. A material processing method, applied to the material processing device according to any one of claims 1 to 11, characterized in that, The material processing method includes: A liquid injection step of injecting the first liquid medium into the liquid storage cavity and injecting the process liquid into the sealed container, and the center of the sealed container coincides with the center of the spherical crown-shaped ultrasonic oscillator assembly. In the ultrasonic cavitation step, power is applied to the ultrasonic oscillator assembly so that the ultrasonic oscillator assembly emits ultrasonic waves, and the ultrasonic waves can cause ultrasonic cavitation in the second liquid medium.

13. The material processing method according to claim 12, characterized in that, The power applied to the ultrasonic oscillator assembly is greater than or equal to 500 W, and the frequency of the ultrasonic waves is greater than or equal to 20 kHz.

14. The material processing method according to claim 12, characterized in that, When the material processing device further includes a controller, a feeding system, a discharging system, a first hydraulic detector, a second hydraulic detector, and a liquid injection device, Before the liquid injection step, the method further includes: Receiving a preset pressure value; Judging whether the preset pressure value is less than or equal to the limit pressure value of the sealed container; If not, the liquid injection step specifically includes: Injecting the first liquid medium into the liquid storage cavity so that the liquid pressure of the first liquid medium reaches a threshold value; Injecting the process liquid into the sealed container so that the liquid pressure of the process liquid in the sealed container reaches a threshold value; the threshold value is less than or equal to the limit pressure value of the sealed container; Injecting the first liquid medium into the liquid storage cavity and injecting the process liquid into the sealed container at the same time, so that the liquid pressure of the first liquid medium and the liquid pressure of the process liquid in the sealed container increase simultaneously until the liquid pressure of the first liquid medium and the liquid pressure of the process liquid in the sealed container reach the preset pressure value at the same time.

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