Laser drilling process and laser drilling system for silica gel adhesive tape

Through laser drilling process and base film peeling technology, the problems of hole drilling accuracy and consistency of medical silicon gel tape are solved, and efficient and low-cost hole processing is achieved, with beautiful and flexible appearance.

CN120362764APending Publication Date: 2025-07-25NANJING 3H MEDICAL PROD CO LTD
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Patent Information

Application Number
CN202510634705.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-16
Publication Date
2025-07-25

AI Technical Summary

Technical Problem

The hole punching process of existing medical silicone gel tape requires customized molds, which are costly, poorly flexible, and have poor hole punching accuracy and consistency. Traditional methods affect appearance and material accumulation.

Method used

The laser hole drilling process is adopted to achieve half-cut holes through the laser generator, and the waste is peeled off by the base film, combined with the suction platform and the peeling roller under negative pressure to separate the waste, and the precise hole drilling of the silicon gel tape is completed.

Benefits of technology

It improves the drilling accuracy and consistency, reduces the cost of the mold, has a flat appearance, meets multiple pore sizes and distribution needs, and has good waste separation effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a laser drilling process and a laser drilling system for a medical silica gel adhesive tape. The laser drilling process comprises the following steps: (1) feeding; (2) laser drilling; (3) stripping and waste discharge: stripping the bottom film attached with cut waste materials through a stripping roller after punching is completed, and rolling the bottom film onto a waste discharge roller; waste materials generated by laser hole cutting are brought out together by controlling the winding tension and the winding speed of the stripping waste discharge shaft and the angle between the materials and the winding shaft, and hole cutting and waste material separation is achieved. And (4) laminating and rolling. According to the laser hole semi-cutting device, the characteristics of high energy, high power, high precision, rapidness and controllability of laser are utilized for achieving hole semi-cutting on materials, then waste generated by hole semi-cutting is stripped and discharged through the stripping and waste discharging step, and finally the machining process is completed through film covering and rolling. The device is suitable for machining round holes of various sizes and various arrangement modes in the silica gel adhesive tape, the punching size precision is high, the consistency is good, and the appearance is flat and attractive.
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Description

Technical Field

[0001] The present invention relates to the technical field of medical silicone gels, and particularly relates to a laser drilling process and a laser drilling system for silicone gel tapes. Background Art

[0002] Medical silicone gels have the characteristics of good waterproofing, excellent carbon dioxide and water vapor permeability, good biocompatibility, being repeatedly adhesive, painless when applied and removed, etc. In recent years, they have been widely used in the field of wound care and play a significant role in promoting wound healing, anti-scarring, softening cutin, improving skin condition, etc. When medical silicone gel tapes are applied, they are usually perforated to improve their water vapor permeability and liquid absorption when combined with foam dressings. Therefore, the perforation effect directly affects their performance and aesthetics. Traditional ultrasonic drilling processes and mechanical drilling processes generally require customized molds, and the drilling size and distribution are fixed, resulting in high costs and poor flexibility. Although ultrasonic drilling does not require waste discharge, the silicone gel extruded accumulates around the holes, directly affecting the hole size and appearance; mechanical drilling is limited by the mold material and the processing difficulty of the workpiece material, and there are also problems such as low drilling accuracy and poor drilling consistency. Summary of the Invention

[0003] Aiming at the problems in the prior art such as the need for customized molds, high mold costs, poor flexibility, unsatisfactory drilling effects, poor appearance and consistency, etc., the present invention first provides a laser drilling process for medical silicone gel tapes, including the following steps:

[0004] (1) Loading: Place the neatly coated and wound silicone gel tape roll on the unwinding roller. After adjusting the unwinding and winding tensions, it enters the laser drilling equipment through the driving roller.

[0005] (2) Laser drilling: Set the process parameters of the laser drilling equipment and start the equipment for testing. After the test is completed, enter the formal processing program; by adjusting the laser output power, semi-cut drilling of the material is achieved, and the material is not completely drilled through, that is, drilling of the PET film, acrylic adhesive coating layer, PU film layer and silicone gel adhesive coating layer is achieved, and at the same time, the integrity of the base film must be retained.

[0006] (3) Peeling and waste discharging: After drilling, the base film with the cut waste attached is peeled off by the peeling roller and wound onto the waste discharging roller; by controlling the winding tension, winding speed of the peeling waste discharging shaft and the angle between the material and the winding shaft, the waste generated by the laser cutting holes is taken out together, realizing the separation of the cut holes and the waste.

[0007] (4) Film laminating and winding: Re-cover the release film placed on the film laminating roller onto the silicone gel tape after the peeling and waste discharging treatment and complete the winding using the winding roller.

[0008] Further, in step (1), the silicone gel tape roll has a five-layer structure, which from top to bottom are a PET film, an acrylic adhesive coating layer, a PU film layer, a silicone gel adhesive coating layer, and a base film. The peel strength between the PET film and the acrylic adhesive coating layer is greater than the peel strength between the base film and the silicone gel adhesive coating layer.

[0009] Further, in step (1), the winding and unwinding tension is 10 - 20 N.

[0010] Further, in step (3), the peeling angle of the base film forms an angle of 90 - 180° with the main material.

[0011] Further, in step (4), the release film is made of PE material, with a thickness of 0.05 - 0.1 mm and a release force of 3.5 - 4.0 N.

[0012] Secondly, the present invention provides a laser drilling system for the above-mentioned silicone gel tape laser drilling process, which includes an unwinding roller, and the unwinding roller is sequentially connected to a deviation rectifying device, a driving roller, a laser drilling device, a traction roller, a peeling roller, a first transition roller, a second transition roller, a third transition roller, and a winding roller. The peeling roller and the second transition roller are respectively connected to a waste discharging roller and a film laminating roller.

[0013] Further, several laser optical systems are provided at the inner top of the laser drilling device. The laser optical system is composed of a laser generator and a galvanometer system; a negative pressure down-drawing platform is provided below the laser optical system. Due to the negative pressure down-drawing function of the processing tabletop, the material can be evenly adsorbed on the platform during processing, and an automatic air suction and exhaust device is provided behind the workbench, which can discharge the waste gas generated during the processing.

[0014] Further, the laser generator is a CO2 metal radio frequency laser, with a maximum power of 300 W, a processing accuracy of ±10 μm, and a maximum processing speed of 200 mm / s.

[0015] Further, the light passing aperture of the galvanometer system is 30 - 45 mm.

[0016] Further, the size of the negative pressure down-drawing platform is 350 mm * 350 mm.

[0017] The beneficial effects of the present invention:

[0018] 1. The present invention utilizes the characteristics of high energy, high processing accuracy, and controllability of the laser to improve the drilling accuracy and drilling consistency of the silicone gel adhesive. At the same time, it creatively uses the base film to peel the waste material together from the main material, making the processed finished product more flat and beautiful.

[0019] 2. The present invention does not require custom-made molds, saving the manufacturing and maintenance costs of the molds.

[0020] 3. The process of the present invention is flexible and can meet the requirements of various different punching hole diameters and punching distributions. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is the process flow chart of the present invention;

[0022] Figure 2 is the structural schematic diagram of the silicone gel tape coil of the present invention;

[0023] Figure 3 is the structural schematic diagram of the laser punching system of the present invention;

[0024] In the figure: 1-unwinding roller, 2-deviation rectifying device, 3-driving roller, 4-laser punching equipment, 41-laser optical system, 42-negative pressure suction platform, 5-traction roller, 6-peeling roller, 7-waste discharging roller, 8-first transition roller, 9-second transition roller, 10-film laminating roller, 11-third transition roller, 12-winding roller. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0026] Embodiment 1 Laser punching system of the present invention

[0027] As Figure 3 shown, the laser punching system for the above-mentioned silicone gel tape laser punching process includes an unwinding roller 1, and the unwinding roller 1 is sequentially connected to a deviation rectifying device 2, a driving roller 3, a laser punching equipment 4, a traction roller 5, a peeling roller 6, a first transition roller 8, a second transition roller 9, a third transition roller 11 and a winding roller 12. The peeling roller 6 and the second transition roller 9 are respectively connected to a waste discharging roller 7 and a film laminating roller 10. The rest of the rewinding and unwinding devices can realize the functions of rewinding and unwinding, deviation rectifying, peeling and compounding of the coil, and the maximum rewinding and unwinding speed is 20 m / min.

[0028] A laser optical system 41 is provided at the top inside the laser punching equipment 4. The laser optical system 41 is composed of a laser generator and a galvanometer system. To improve the processing efficiency, multiple laser optical systems 41 can be set at the reserved positions inside the laser punching equipment 4; a negative pressure suction platform 42 is provided below the laser optical system 41. Since the processing table has a negative pressure suction function, the material can be evenly adsorbed on the platform during processing to prevent the material from shifting and wrinkling. An automatic air suction and exhaust device is provided at the back of the workbench, which can discharge the waste gas generated during the processing.

[0029] The laser generator is a CO2 metal radio frequency laser with a maximum power of 300W, a processing accuracy of ±10μm, and a maximum processing speed of 200mm / s.

[0030] The galvanometer system comprises a galvanometer motor, a galvanometer control board, a galvanometer swing mirror, a dynamic focusing lens and other components, and its light aperture is 30-45 mm.

[0031] The size of the negative pressure suction platform 43 is 350mm*350mm.

[0032] Example 2 Laser drilling process of the present invention

[0033] (1) Loading: Place the neatly coated silicone gel tape roll on the unwinding roller, adjust the tension of the unwinding and rewinding, and then enter the laser punching equipment through the active roller; the silicone gel tape has a five-layer structure, with a maximum roll diameter of 50 cm and a maximum width of 33 cm. Figure 2 As shown, from top to bottom are PET film, acrylic adhesive layer, PU film layer, silicone gel coating layer, and base film; the peeling force between the PET film and the acrylic adhesive layer must be greater than the peeling force between the silicone gel layer and the base film, the thickness of the PET film is 0.03-0.04mm, the thickness of the base film is 0.05-0.1mm, the thickness of the PU film is 0.02-0.025mm, and the thickness of the silicone gel layer is 0.08-0.12mm. When loading, first place the coil on the unwinding roller 1, while ensuring that the PET film faces upward, and then pass the coil through the deviation correction device 2, the active roller 3, the negative pressure suction platform 43, the traction roller 5, the peeling roller 6, the first transition roller 8, the second transition roller 9, and the third transition roller 11, and finally roll the material at the winding roller 12, set the unwinding tension between 10N and 20N, and adjust the initial tension in time according to the coil diameter of the coil, so that the coil is flat, without deformation and wrinkles.

[0034] (2) Laser drilling: Set the process parameters of the laser drilling equipment 4 and start the equipment for testing. After the test is completed, enter the formal processing procedure; set the output power of the laser generator to 240-300W, set the punching hole diameter to 0.1-3.0mm, the hole spacing to 0.1-3.0mm, and the arrangement of the circular holes in the punching area. Set the processing speed to 0.5m / min on the control panel, turn on the laser drilling equipment, and after processing a section of material, pause the processing to observe whether the punching of the material is to achieve half-cut punching, that is, to achieve the punching of the PET film, acrylic glue coating layer, PU film layer and silicone gel coating layer, while retaining the integrity of the base film. During this period, the output power of the laser generator needs to be adjusted according to the different materials, and multiple tests are conducted to achieve the described material half-cut effect. After the output power parameters of the laser generator are confirmed, reset the processing speed to 2m / min, and turn on the equipment to achieve stable punching.

[0035] (3) Stripping and waste discharging: After punching, the bottom film with the cut waste attached is stripped by the stripping roller 6 and wound onto the waste discharging roller 7; by controlling the winding tension, winding speed of the stripping waste discharging shaft and the angle between the material and the winding shaft, the waste generated by laser punching is taken out together to achieve the separation of the punching and the waste; the winding tension of the waste discharging roller 7 is 10 - 15 N, the stripping angle of the bottom film forms an angle of 90 - 180° with the main material, and during the stripping process, the bottom film takes away the waste generated by laser punching and winds it up, leaving the upper four-layer structure, that is, the PET film after punching, the acrylic glue coating layer, the PU film layer and the silicone gel coating layer.

[0036] (4) Film laminating and winding: The release film placed on the film laminating roller 10 is re-covered onto the silicone gel tape after the stripping and waste discharging treatment and wound by the winding roller. The release film is placed on the film laminating roller 12, the release film is made of PE material, with a thickness of 0.05 - 0.1 mm and a release force of 3.5 - 4.0 N. After the coil processed in step 3 passes through the first transition roller 8 and reaches the position of the film laminating roller 10, the PE release film is laminated on the surface of the silicone gel coating layer, and the material is made to fit through the pressure of the second transition roller 9 to complete the film laminating step. The unwinding tension of the film laminating roller 10 is 5 - 10 N. After the film laminating is completed, the coil passes through the third transition roller 11 and finally reaches the position of the winding roller 12, and the final winding is completed at the winding roller 12.

[0037] The above content is only the preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope, and the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A laser drilling process for silicone gel tape, characterized in that, It includes the following steps: (1) Loading: Place the neatly wound silicon gel tape coil for coating on the unwind roller (1). After adjusting the unwind and rewind tensions, it enters the laser drilling equipment (4) through the deviation rectifying device (2) and the driving roller (3). (2) Laser drilling: Set the process parameters of the laser drilling equipment (4) and turn on the equipment for testing. After the test is completed, enter the formal processing program. (3) Peeling and waste discharging: After drilling, peel the base film with the cut waste attached through the peeling roller (6) and wind it onto the waste discharging roller (7). (4) Film laminating and winding: Re-cover the release film placed on the film laminating roller (11) onto the silicon gel tape after peeling and waste discharging treatment, and complete the winding using the winding roller (14).

2. The laser drilling process of the silicone gel tape according to claim 1, wherein In step (1), the silicon gel tape coil has a five-layer structure, which is, from top to bottom, a PET film, an acrylic adhesive coating layer, a PU film layer, a silicon gel coating layer, and a base film. The peeling force between the PET film and the acrylic adhesive coating layer is greater than the peeling force between the base film and the silicon gel coating layer.

3. The laser drilling process of the silicone gel tape according to claim 1, characterized in that In step (1), the unwind and rewind tensions are 10 - 20 N.

4. The laser drilling process of the silicone gel tape according to claim 1, characterized in that, In step (3), the peeling angle of the base film forms an angle of 90 - 180° with the main material.

5. The laser drilling process of the silicone gel tape according to claim 1, characterized in that, In step (4), the release film is made of PE material, with a thickness of 0.05 - 0.1 mm and a release force of 3.5 - 4.0 N.

6. A laser drilling system for the laser drilling process of the silicone gel tape according to any one of claims 1 to 5, characterized in that, It includes an unwind roller (1), and the unwind roller (1) is sequentially connected to a deviation rectifying device (2), a driving roller (3), a laser drilling equipment (4), a traction roller (5), a peeling roller (6), a first transition roller (8), a second transition roller (9), a third transition roller (11), and a winding roller (12). The peeling roller (6) and the second transition roller (9) are respectively connected to a waste discharging roller (7) and a film laminating roller (10).

7. The laser drilling system according to claim 6, wherein There are several laser optical systems (41) provided at the inner top of the laser drilling equipment (4), and a negative pressure downward suction platform (42) is provided below the laser optical systems (41).

8. The laser drilling system according to claim 7, wherein, The laser optical system (41) consists of a laser generator and a galvanometer system.

9. The laser drilling system according to claim 8, wherein, The laser generator is a CO2 metal radio frequency laser, with a maximum power of 300 W, a processing accuracy of ±10 μm, and a maximum processing speed of 200 mm / s; the light passing aperture of the galvanometer system is 30 - 45 mm.

10. The laser drilling system according to claim 7, wherein The size of the negative pressure downward suction platform (42) is 350 mm * 350 mm.