Copper plate surface treatment device and method

Abstract

The invention relates to the technical field of red copper plate processing, in particular to a red copper plate surface treatment device which comprises supporting seats, a round shell is connected between the two supporting seats, electric push rods are evenly installed on the inner top face of the round shell at intervals in the circumferential direction, and push rods of the electric push rods penetrate through the top of the round shell to be connected with a lower grinding disc. A lifting mechanism is arranged on the outer wall of the round shell, upper grinding discs which are annularly distributed are connected to the lifting mechanism at intervals, U-shaped mounting plates are evenly mounted on the outer wall of the round shell at intervals in the circumferential direction, each U-shaped mounting plate is provided with a rotary disc, each rotary disc is provided with a clamp used for clamping a red copper plate, and the round shell is provided with a driving assembly used for driving the rotary discs to rotate. The lower grinding disc, the upper grinding disc, the rotary disc and the clamp are annularly arranged on the round shell at intervals, so that a plurality of red copper plates can be ground and polished at the same time, double-sided synchronous grinding and polishing of the red copper plates can be realized, the grinding period is greatly shortened, and the surface treatment efficiency of the red copper plates is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of processing of copper plates, and particularly to a surface treatment device and method for copper plates. Background Art

[0002] Copper plates are plates made of pure copper or high-purity copper alloys, named after their color. Copper has advantages such as good electrical conductivity, thermal conductivity, corrosion resistance, and ductility, and is widely used in electrical, electronic, construction, decoration, chemical and other fields. For example, it is used to manufacture wires and cables in the electrical industry; various decorative materials and handicrafts in the construction and decoration industries; and corrosion-resistant parts in the chemical field.

[0003] Before applying copper plates, it is particularly important to polish the surface of copper plates. This process is one of the important steps in the processing of copper plates, which can remove defects such as oxide layers and scratches, form a mirror finish, and thus significantly improve the smoothness and uniformity of the surface of copper plates. In addition, polishing can also remove verdigris, rust, and oxide layers on the surface of copper plates, reduce the subsequent corrosion risk, and since the smooth surface can reduce the friction coefficient in mechanical applications, this helps to extend the service life of copper plates in precision components.

[0004] Currently, although it has become normal to polish the surface of copper plates through polishing equipment, the existing equipment still has the following deficiencies: 1. It can only polish a single copper plate, resulting in low efficiency.

[0005] 2. It is unable to polish both sides of the copper plate simultaneously. It is necessary to polish one side first and then flip the copper plate to polish the other side, which increases the polishing cycle and reduces the overall polishing efficiency. Summary of the Invention

[0006] The present invention provides a surface treatment device for copper plates, which aims to polish multiple copper plates simultaneously to improve the surface treatment efficiency of copper plates, and can also polish both sides of the copper plate simultaneously to shorten the polishing cycle.

[0007] To achieve the above object, the present invention provides the following technical solution: A surface treatment device for a copper plate includes a support base. A circular shell with an open bottom is connected between two support bases. Electric push rods are evenly spaced along the circumferential direction on the inner top surface of the circular shell. The push rods of the electric push rods penetrate through the top of the circular shell and are connected to a lower grinding disc for polishing the lower surface of the copper plate. An elevating mechanism is provided on the top of the circular shell. Upper grinding discs distributed in a ring are spaced and connected to the elevating mechanism for polishing the upper surface of the copper plate. The upper grinding discs and the lower grinding discs correspond one by one, and the upper grinding disc is located directly above its corresponding lower grinding disc. U-shaped mounting plates are evenly spaced along the circumferential direction on the outer wall of the circular shell. A turntable is provided on each U-shaped mounting plate. A through hole for accommodating the copper plate is opened on each turntable. A clamp for clamping the copper plate is provided on each turntable. A driving component for driving the turntable to rotate is provided on the circular shell.

[0008] Preferably, the clamp includes two clamping plates slidably connected in the through hole and two screw rods rotatably connected to the turntable. The two screw rods are respectively threadedly connected to the two clamping plates.

[0009] Preferably, a driving mechanism for driving the screw rod to rotate is provided on each turntable. The driving mechanism includes two guide rods symmetrically connected to the top of the turntable. An L-shaped plate is slidably connected to each of the two guide rods. The L-shaped plate is slidably matched with the turntable. When the lower grinding disc moves downward, it can contact the L-shaped plate and push the L-shaped plate downward. A second spring is connected between the L-shaped plate and the turntable. A rack is connected to the L-shaped plate. A column gear is connected to the screw rod through a one-way clutch. The rack can engage with the adjacent column gear when it moves up and down.

[0010] Preferably, the elevating mechanism includes a mounting frame installed in the middle of the top of the circular shell. A cylinder is installed on the top of the mounting frame. A lifting plate is connected to the cylinder. Telescopic rods are evenly spaced and connected to the lifting plate. A first spring is connected between the inner rod and the outer rod of the telescopic rod. The upper grinding discs and the telescopic rods correspond one by one, and the upper grinding disc is connected to its corresponding telescopic rod.

[0011] Preferably, an air pump is installed on the outer wall of each U-shaped mounting plate. A spray pipe for spraying gas onto the copper plate is connected to the top of each U-shaped mounting plate. The spray pipe and the air pump connected to the same U-shaped mounting plate are communicated.

[0012] Preferably, chip discharge ports for discharging waste chips are spaced and opened on the top of the circular shell.

[0013] Preferably, a material guiding hopper for collecting and guiding waste chips is connected to the bottom of the circular shell.

[0014] Preferably, the driving component includes a motor installed in the middle of the circular shell. A driving gear is connected to the output shaft of the motor. A toothed ring is connected to the circumferential side wall of each turntable. The toothed ring meshes with the driving gear.

[0015] Preferably, a rubber clamping plate for buffering and protecting the copper sheet is connected to the clamping part of the clamping plate.

[0016] A surface treatment method for copper sheets includes the following steps: S1. Place the copper sheet. First, control the electric push rod to drive the grinding disc to move upward, and then place the copper sheet on the lower grinding disc. The copper sheet is supported by the lower grinding disc and is located between the two clamping plates. S2. Clamp the copper sheet. Manually rotate the two screws to make the two clamping plates approach each other, and clamp and fix the copper sheet on the turntable. S3. Grind both sides of the copper sheet. Control the air cylinder to drive the lifting plate to move downward, so as to drive the upper grinding disc to move downward and contact the copper sheet through the telescopic rod. Then control the motor to drive the driving gear to rotate. The rotation of the driving gear drives the toothed ring to drive the turntable to rotate. The rotation of the turntable drives the copper sheet to rotate through the fixture, so that the upper and lower surfaces of the copper sheet are simultaneously ground and polished by the upper grinding disc and the lower grinding disc. S4. Remove the copper sheet. Control the air cylinder to drive the lifting plate to move upward, so as to drive the upper grinding disc to move upward and separate from the copper sheet. Then manually control the two screws to drive the two clamping plates to move away from each other to loosen the copper sheet, and finally remove the copper sheet for replacement.

[0017] Compared with the prior art, the beneficial effects of the present invention are: 1. By annularly and spacedly arranging the lower grinding disc, the upper grinding disc, the turntable and the fixture on the circular shell, not only can multiple copper sheets be ground and polished simultaneously, but also the double-sided synchronous grinding and polishing of the copper sheets can be realized, greatly shortening the grinding cycle and significantly improving the efficiency of the surface treatment of the copper sheets.

[0018] 2. When the lower grinding disc moves downward, it drives the driving mechanism to work, thereby driving the screw to rotate and making the two clamping plates move away from each other to loosen the copper sheet, so as to facilitate the subsequent picking and placing of the copper sheet. There is no need for manual rotation of the screw to loosen the copper sheet by the clamping plate, which can save time and effort and improve work efficiency.

[0019] 3. Through the cooperation of the air pump and the air spray pipe, the waste chips on the lower grinding disc and the copper sheet can be blown off, realizing the cleaning of the lower grinding disc and the copper sheet. The waste chips are discharged downward into the material guiding hopper through the chip discharging port. The material guiding hopper can collect and guide the waste chips to discharge the waste chips downward to avoid the scattered waste chips and facilitate the subsequent centralized recovery of the waste chips. Description of the Drawings

[0020] Figure 1 It is a three-dimensional structure diagram of the present invention.

[0021] Figure 2 It is a partial three-dimensional structure diagram of the present invention.

[0022] Figure 3Schematic three-dimensional structure diagram of the driving component of the present invention.

[0023] Figure 4 Schematic three-dimensional structure diagram of the fixture of the present invention.

[0024] Figure 5 Installation schematic diagram of the lifting mechanism and the driving mechanism of the present invention.

[0025] Figure 6 Schematic three-dimensional structure diagram of the driving mechanism of the present invention.

[0026] Figure 7 Installation schematic diagram of the air pump and the air injection pipe of the present invention.

[0027] Figure 8 Installation schematic diagram of the material guiding hopper of the present invention.

[0028] The reference signs in the drawings are: 1 - support base, 2 - circular shell, 21 - chip discharge port, 22 - material guiding hopper, 3 - electric push rod, 4 - lower grinding disc, 51 - mounting bracket, 52 - cylinder, 53 - lifting plate, 54 - telescopic rod, 55 - first spring, 6 - upper grinding disc, 7 - U-shaped mounting plate, 8 - turntable, 81 - through port, 91 - clamping plate, 92 - screw rod, 93 - rubber clamping plate, 101 - motor, 102 - driving gear, 103 - gear ring, 111 - guide rod, 112 - L-shaped plate, 113 - second spring, 114 - rack, 115 - column gear, 12 - air pump, 13 - air injection pipe, 14 - copper sheet. Detailed implementation manners

[0029] Please refer to Figures 1 - 4, a surface treatment device for a copper plate, comprising an L-shaped support base 1. There is a circular shell 2 with an open bottom connected between the left and right support bases 1. Four electric push rods 3 are evenly spaced along the circumferential direction on the inner top surface of the circular shell 2. The push rod of the electric push rod 3 penetrates through the top of the circular shell 2 and is connected to a lower grinding disc 4 for grinding and polishing the lower surface of the copper plate 14. There is a lifting mechanism on the top of the circular shell 2. The lifting mechanism includes a mounting frame 51 installed in the middle of the top of the circular shell 2. A cylinder 52 is installed on the top of the mounting frame 51. A cross-shaped lifting plate 53 is connected to the piston rod of the cylinder 52. Four telescopic rods 54 are evenly spaced along the circumferential direction at the bottom of the cross-shaped lifting plate 53. A first spring 55 is sleeved on the inner rod of the telescopic rod 54. The two ends of the first spring 55 are respectively connected to the inner rod and the outer rod of the telescopic rod 54. Four upper grinding discs 6 are connected to the four telescopic rods 54 for grinding and polishing the upper surface of the copper plate 14. The four upper grinding discs 6 and the four lower grinding discs 4 are in one-to-one correspondence. The upper grinding disc 6 is located directly above its corresponding lower grinding disc 4. Four U-shaped mounting plates 7 are evenly spaced along the circumferential direction on the outer wall of the circular shell 2. An arc-shaped chute is opened at the upper part of each U-shaped mounting plate 7. A turntable 8 is slidably connected in the arc-shaped chute of each U-shaped mounting plate 7. A through hole 81 for accommodating the copper plate 14 is opened on each turntable 8. A clamp for clamping the copper plate 14 is provided on each turntable 8. The clamp includes a clamping plate 91 and a screw rod 92. Chutes are opened on both sides of the through hole 81. Two clamping plates 91 are slidably connected between the two chutes. Two screw rods 92 are rotatably connected to the turntable 8. The two screw rods 92 are respectively threadedly connected to the two clamping plates 91. A rubber clamping plate 93 is connected to the clamping part of the clamping plate 91. The rubber clamping plate 93 can not only increase the friction between the clamping plate 91 and the copper plate 14 to ensure firmly clamping the copper plate 14, but also buffer and protect the copper plate 14 to avoid damage to the copper plate 14 caused by the direct hard extrusion of the clamping plate 91 on the copper plate 14. A driving component for driving the turntable 8 to rotate is provided on the circular shell 2. The driving component includes a motor 101 installed in the middle of the circular shell 2. The motor 101 is located directly below the mounting frame 51. A driving gear 102 located inside the mounting frame 51 is connected to the output shaft of the motor 101. A toothed ring 103 is connected to the circumferential side wall of each turntable 8. The toothed ring 103 meshes with the driving gear 102.

[0030] First, control the electric push rod 3 to drive the grinding disc 4 to move upward. Then, place the copper plate 14 on the lower grinding disc 4, and support the copper plate 14 by the lower grinding disc 4 so that the copper plate 14 is located between the two clamping plates 91. Then, manually rotate the two screws 92 manually, so that the two clamping plates 91 approach each other, and clamp and fix the copper plate 14 on the turntable 8. Then, control the air cylinder 52 to drive the lifting plate 53 to move downward, so as to drive the upper grinding disc 6 to move downward through the telescopic rod 54 to contact the copper plate 14. After the upper grinding disc 6 moves downward and contacts the copper plate 14, the upper grinding disc 6 cannot continue to move downward, so the telescopic rod 54 continues to move downward to compress the first spring 55. Through the elastic force of the first spring 55, the upper grinding disc 6 can always maintain good contact with the copper plate 14, ensuring that the pressure applied to the copper plate 14 during the grinding process is uniform, so as to achieve an efficient and uniform double-sided grinding and polishing effect. Then, control the motor 101 to drive the driving gear 102 to rotate. The rotation of the driving gear 102 drives the gear ring 103 to drive the turntable 8 to rotate. The rotation of the turntable 8 drives the copper plate 14 to rotate through the fixture. When the copper plate 14 rotates, its upper and lower surfaces can be ground and polished by the upper grinding disc 6 and the lower grinding disc 4 at the same time. After the copper plate 14 is ground and polished, control the air cylinder 52 to drive the lifting plate 53 to move upward, so as to drive the upper grinding disc 6 to move upward and separate from the copper plate 14. Then, manually control the two screws 92 to drive the two clamping plates 91 to move away from each other to loosen the copper plate 14, and then the copper plate 14 can be removed and replaced. In this way, by arranging the lower grinding disc 4, the upper grinding disc 6, the turntable 8 and the fixture annularly and at intervals on the circular shell 2, this device can not only grind and polish multiple copper plates 14 at the same time, but also realize the double-sided synchronous grinding and polishing of the copper plates 14, greatly shortening the grinding cycle and significantly improving the efficiency of the surface treatment of the copper plates 14.

[0031] Please refer to Figures 5 - 6 , a driving mechanism for driving the screw 92 to rotate is provided on each turntable 8. The driving mechanism includes two guide rods 111 symmetrically connected to the top of the turntable 8. An L-shaped plate 112 is slidably connected to each of the two guide rods 111. The L-shaped plate 112 is slidably matched with the turntable 8. The downward movement of the lower grinding disc 4 can contact the L-shaped plate 112 and push the L-shaped plate 112 downward. A second spring 113 is sleeved on the guide rod 111. The two ends of the second spring 113 are respectively connected to the upper part of the L-shaped plate 112 and the top of the turntable 8. A rack 114 is connected to the L-shaped plate 112. A column gear 115 is connected to the screw 92 through a one-way clutch. The lifting and lowering of the rack 114 can mesh with the adjacent column gear 115.

[0032] After the purple copper plate 14 is polished, control the electric push rod 3 to drive the lower grinding disc 4 to move downwards. The lower grinding disc 4 moves downwards and contacts the L-shaped plate 112, and pushes the L-shaped plate 112 with the rack 114 to move downwards, compressing the second spring 113. The rack 114 moves downwards and meshes with the column gear 115, and pushes the column gear 115 to rotate, thereby driving the screw 92 to rotate, and further driving the two clamping plates 91 to move away from each other to loosen the purple copper plate 14, so as to facilitate the subsequent picking and placing of the purple copper plate 14. Thus, there is no need for manual rotation of the screw 92 to loosen the clamping plate 91 on the purple copper plate 14, which can save time and effort and improve work efficiency. Before placing the next batch of purple copper plates 14, first control the electric push rod 3 to drive the lower grinding disc 4 to move upwards to reset. The lower grinding disc 4 moves upwards to release the L-shaped plate 112. Under the reset action of the second spring 113, the L-shaped plate 112 with the rack 114 is pushed to move upwards to reset. Due to the action of the one-way clutch, when the rack 114 moves upwards, it pushes the column gear 115 to rotate idly without driving the screw 92 to rotate.

[0033] Please refer to Figures 7 - 8 , an air pump 12 is installed on the outer wall of each U-shaped mounting plate 7. A spray pipe 13 for spraying gas onto the purple copper plate 14 is connected to the top of each U-shaped mounting plate 7. The spray pipe 13 and the air pump 12 connected to the same U-shaped mounting plate 7 are communicated. Four groups of chip discharge ports 21 are spaced apart circumferentially at the top of the circular shell 2. The four groups of chip discharge ports 21 correspond to the four electric push rods 3 one by one. The number of each group of chip discharge ports 21 is four. The four chip discharge ports 21 in each group are annularly distributed, and the four chip discharge ports 21 in each group are arranged centered on the corresponding electric push rod 3. The top surface of the circular shell 2 is designed with a slope that is high in the middle and low on the outside to guide the waste chips to the chip discharge ports 21 and discharge them downward. A conical material guiding hopper 22 is connected to the bottom of the circular shell 2.

[0034] After completing one polishing operation on the purple copper plate 14, control the air pump 12 to work to convey the outside air into the spray pipe 13. The spray pipe 13 then sprays the gas onto the lower grinding disc 4 and the purple copper plate 14, so as to be able to blow off the waste chips on the lower grinding disc 4 and the purple copper plate 14, realizing the cleaning of the lower grinding disc 4 and the purple copper plate 14. The waste chips blown off from the lower grinding disc 4 and the purple copper plate 14 fall onto the circular shell 2 and are discharged downward into the material guiding hopper 22 through the chip discharge ports 21. The material guiding hopper 22 can collect and guide the waste chips to discharge the waste chips downward to avoid the waste chips scattering everywhere, so as to facilitate the subsequent centralized recovery of the waste chips.

[0035] A method for surface treatment of a purple copper plate includes the following steps: S1. Place the purple copper plate 14. First, control the electric push rod 3 to drive the lower grinding disc 4 to move upwards, and then place the purple copper plate 14 on the lower grinding disc 4. With the support of the lower grinding disc 4, the purple copper plate 14 is located between the two clamping plates 91; S2. Clamp the copper plate 14, manually rotate the two screws 92 to make the two clamping plates 91 approach each other, and clamp and fix the copper plate 14 on the turntable 8; S3. Grind the two sides of the copper plate 14. Control the air cylinder 52 to drive the lifting plate 53 to move downward, so as to drive the upper grinding disc 6 to move downward through the telescopic rod 54 and contact the copper plate 14. Then control the motor 101 to drive the driving gear 102 to rotate. The rotation of the driving gear 102 drives the gear ring 103 to drive the turntable 8 to rotate. The rotation of the turntable 8 drives the copper plate 14 to rotate through the fixture, so that the upper and lower surfaces of the copper plate 14 are simultaneously polished by the upper grinding disc 6 and the lower grinding disc 4; S4. Remove the copper plate 14. Control the air cylinder 52 to drive the lifting plate 53 to move upward, so as to drive the upper grinding disc 6 to move upward and separate from the copper plate 14. Then manually control the two screws 92 to drive the two clamping plates 91 to move away from each other to loosen the copper plate 14, and finally remove the copper plate 14 for replacement.

Claims

1. A surface treatment device for copper plates, characterized in that, It includes a support base (1). A circular shell (2) with an open bottom is connected between two support bases (1). Electric push rods (3) are evenly spaced along the circumferential direction on the inner top surface of the circular shell (2). The push rods of the electric push rods (3) penetrate through the top of the circular shell (2) and are connected to a lower grinding disc (4) for grinding and polishing the lower surface of a copper sheet (14). A lifting mechanism is provided on the top of the circular shell (2). Upper grinding discs (6) distributed in a ring are spacedly connected to the lifting mechanism for grinding and polishing the upper surface of the copper sheet (14). The upper grinding discs (6) and the lower grinding discs (4) are in one-to-one correspondence, and the upper grinding disc (6) is directly above its corresponding lower grinding disc (4). U-shaped mounting plates (7) are evenly spaced along the circumferential direction on the outer wall of the circular shell (2). A turntable (8) is provided on each U-shaped mounting plate (7). A through hole (81) for accommodating the copper sheet (14) is opened on each turntable (8). A clamp for clamping the copper sheet (14) is provided on each turntable (8). A driving assembly for driving the turntable (8) to rotate is provided on the circular shell (2).

2. The surface treatment device for a purple copper plate according to claim 1, characterized in that, The clamp includes two clamping plates (91) slidably connected in the through hole (81) and two screw rods (92) rotatably connected to the turntable (8). The two screw rods (92) are respectively threadedly connected to the two clamping plates (91).

3. The surface treatment device for a copper sheet according to claim 2, wherein, A driving mechanism for driving the screw rod (92) to rotate is provided on each turntable (8). The driving mechanism includes two guide rods (111) symmetrically connected to the top of the turntable (8). An L-shaped plate (112) is slidably connected to each of the two guide rods (111). The L-shaped plate (112) is in sliding fit with the turntable (8). When the lower grinding disc (4) moves down, it can contact the L-shaped plate (112) and push the L-shaped plate (112) to move down. A second spring (113) is connected between the L-shaped plate (112) and the turntable (8). A rack (114) is connected to the L-shaped plate (112). A column gear (115) is connected to the screw rod (92) through a one-way clutch. The rack (114) can engage with the adjacent column gear (115) during its lifting and lowering.

4. The surface treatment device for a purple copper plate according to claim 3, wherein, The lifting mechanism includes a mounting frame (51) installed in the middle of the top of the circular shell (2). A cylinder (52) is installed on the top of the mounting frame (51). A lifting plate (53) is connected to the cylinder (52). Telescopic rods (54) are evenly spacedly connected to the lifting plate (53). A first spring (55) is connected between the inner rod and the outer rod of the telescopic rod (54). The upper grinding discs (6) and the telescopic rods (54) are in one-to-one correspondence, and the upper grinding disc (6) is connected to its corresponding telescopic rod (54).

5. The surface treatment device for a purple copper plate according to claim 1, wherein, An air pump (12) is installed on the outer wall of each U-shaped mounting plate (7). A spray pipe (13) for spraying gas onto the copper sheet (14) is connected to the top of each U-shaped mounting plate (7). The spray pipe (13) and the air pump (12) connected to the same U-shaped mounting plate (7) are communicated.

6. The surface treatment device for a copper plate according to claim 5, wherein, Chip discharge ports (21) for discharging waste chips are spacedly opened on the top of the circular shell (2).

7. The surface treatment device for a purple copper plate according to claim 6, characterized in that, A material guiding hopper (22) for collecting and guiding waste chips is connected to the bottom of the circular shell (2).

8. A surface treatment device for copper plates according to claim 4, characterized in that The driving assembly includes a motor (101) installed in the middle of the circular shell (2). A driving gear (102) is connected to the output shaft of the motor (101). A toothed ring (103) is connected to the circumferential side wall of each turntable (8), and the toothed ring (103) meshes with the driving gear (102).

9. The surface treatment device for a purple copper plate according to claim 2, characterized in that, A rubber clamping plate (93) for buffering and protecting the copper sheet (14) is connected to the clamping part of the clamping plate (91).

10. A surface treatment method for a copper plate, based on the surface treatment device for a copper plate described in claim 8, characterized in that, It includes the following steps: S1. Place the copper sheet (14). First, control the electric push rod (3) to drive the upper grinding disc (4) to move upward. Then, place the copper sheet (14) on the lower grinding disc (4). The support of the lower grinding disc (4) makes the copper sheet (14) located between the two clamping plates (91). S2. Clamp the copper sheet (14). Manually rotate the two screws (92) to make the two clamping plates (91) approach each other, and clamp the copper sheet (14) and fix it on the turntable (8). S3. Grind both sides of the copper sheet (14). Control the air cylinder (52) to drive the lifting plate (53) to move downward, so as to drive the upper grinding disc (6) to move downward and contact the copper sheet (14) through the telescopic rod (54). Then, control the motor (101) to drive the driving gear (102) to rotate. The rotation of the driving gear (102) drives the toothed ring (103) to drive the turntable (8) to rotate. The rotation of the turntable (8) drives the copper sheet (14) to rotate through the fixture, so that the upper and lower surfaces of the copper sheet (14) are simultaneously ground and polished by the upper grinding disc (6) and the lower grinding disc (4). S4. Remove the copper sheet (14). Control the air cylinder (52) to drive the lifting plate (53) to move upward, so as to drive the upper grinding disc (6) to move upward and separate from the copper sheet (14). Then, manually control the two screws (92) to drive the two clamping plates (91) to move away from each other to loosen the copper sheet (14). Finally, remove the copper sheet (14) for replacement.

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