Porous micro-pressure reciprocating planetary sphere polishing equipment and method

Abstract

According to the multi-hole micro-pressure reciprocating planetary ball polishing equipment, an upper polishing disc and a lower polishing disc are eccentrically arranged, and the upper polishing disc is connected with an X-axis sliding table; during polishing, the upper grinding and polishing disc rotates around the axis of the upper grinding and polishing disc and is matched with reciprocating motion of the X-axis sliding table to drive a ball to do complex revolution motion, meanwhile, the lower grinding and polishing disc rotates around the axis of the lower grinding and polishing disc, the ball is driven to rotate through friction force, and due to the motion mode, the contact position of the surface of the ball and the grinding and polishing discs can be continuously adjusted in the machining process of the ball; uniform enveloping of a grinding and polishing track is realized, so that the polishing quality and the forming precision of the surface of the sphere are effectively improved; in addition, a plurality of through holes used for installing the balls are formed in the upper grinding and polishing disc, counter weights can be placed in the through holes to apply stable micro pressure to the balls during polishing, stress concentration of the machined surface is reduced, and the situation that the balls are damaged due to too high local stress is avoided. Correspondingly, the invention further provides a porous micro-pressure reciprocating planetary sphere grinding and polishing method.

Description

Technical Field

[0001] The present invention relates to the field of sphere finishing equipment and technology, and particularly to a porous micro-pressure reciprocating planetary sphere grinding and polishing equipment and method. Background Art

[0002] As an important component in modern high-precision industrial applications, hard and brittle material spheres are widely used in precision bearings, optical instruments, electronic packaging, aerospace, and new energy fields. The diameters of these spheres are usually between 0.5 mm and 4 mm, and the surface roughness requirement reaches the nanometer level. The sphere diameter error and batch consistency need to be controlled within 0.1 μm. Due to the brittleness and high hardness of hard and brittle materials (such as single crystal silicon, polycrystalline silicon, silicon nitride, polycrystalline diamond-like, and ruby), extremely high requirements are imposed on the machining accuracy and efficiency in the grinding and polishing process.

[0003] The traditional polishing method uses a fixed grinding and polishing disc to process small-sized hard and brittle material spheres, and has the following problems: 1. Since the grinding and polishing disc is fixedly arranged, it is impossible to achieve the full envelope of the machining trajectory, resulting in the difficulty of meeting the high-precision requirements for the surface quality and sphericity of the sphere; 2. The pressure control is uneven, and the machining pressure is difficult to adapt to the characteristics of hard and brittle materials, easily leading to surface damage of the sphere or low polishing efficiency; 3. When processing workpieces in batches, due to the non-uniformity of pressure and trajectory, the machining consistency is poor, and the industrial application requirements cannot be met. In view of this, some manufacturers apply the planetary motion principle to the polishing device, and utilize the eccentric motion between the upper disc and the lower disc to make the workpiece not only rotate around itself but also revolve around the overall eccentric axis during the polishing process. This motion mode can achieve the full envelope of the trajectory, avoid the possible trajectory repetition of the traditional rotary motion, and thus improve the uniformity of the machining surface. For example, Chinese Patent CN202411177351.X discloses a ball grinding machine, including a lower grinding and polishing disc and an upper grinding and polishing disc; on the upper surface of the lower grinding and polishing disc, there are spiral grooves for placing spheres; during grinding and processing, the lower grinding and polishing disc is driven to rotate, and the upper grinding and polishing disc is driven to descend to apply pressure to the spheres on the spiral grooves. Under the combined action of the lower grinding and polishing disc and the upper grinding and polishing disc, the spheres move along the spiral grooves from the inside to the outside to perform a machining motion (rotation + revolution) with continuously changing self-rotation angles. With the continuous change of the self-rotation angle, the uniform full envelope of the machining trajectory on the sphere surface is achieved, thereby obtaining better single-sphere accuracy. However, when the ball grinding machine works, there is only a simple planetary motion, and there is a problem of insufficient coverage efficiency in local areas; moreover, it applies pressure to the spheres on the spiral grooves through the upper grinding and polishing disc, and it is difficult to maintain a uniform stress distribution during the processing. When the upper grinding and polishing disc is offset, it may cause workpiece breakage due to excessive local stress. Summary of the Invention

[0004] The present invention provides a porous micro-pressure reciprocating planetary spherical polishing equipment to overcome the above problems existing in the prior art. In the porous micro-pressure reciprocating planetary spherical polishing equipment of the present invention, the upper polishing disc and the lower polishing disc are eccentrically arranged, and the upper polishing disc is connected to the X-axis slide; during polishing, the upper polishing disc rotates around its axis and, in cooperation with the reciprocating movement of the X-axis slide, drives the sphere to perform a spiral revolution movement. At the same time, the lower polishing disc rotates around its axis and drives the sphere to rotate by friction. This movement mode enables the sphere to continuously adjust the contact position between its surface and the polishing disc during the processing, realizing uniform envelope of the polishing trajectory, thereby effectively improving the polishing quality and forming accuracy of the sphere surface; in addition, a plurality of through holes for installing the sphere are provided inside the upper polishing disc, and weights can be placed in the through holes during polishing to apply a stable micro-pressure to the sphere, reducing stress concentration on the processing surface and avoiding sphere breakage caused by excessive local stress. Correspondingly, the present application also provides a porous micro-pressure reciprocating planetary spherical polishing method.

[0005] For the equipment, the technical solution of the present application is as follows:

[0006] The porous micro-pressure reciprocating planetary spherical polishing equipment includes a base, and a lower polishing component and a moving component arranged on the base; an upper polishing component is provided above the lower polishing component; the upper polishing component is fixed on the moving component; the lower polishing component includes a lower polishing disc and a motor A; the upper polishing component includes an upper polishing disc and a motor B; a plurality of through holes are provided inside the upper polishing disc, and the upper polishing disc and the lower polishing disc are eccentrically arranged; the moving component includes an X-axis slide and a Z-axis slide, which are respectively used to control the movement of the upper polishing component in the X-axis direction and the Z-axis direction. During polishing, the sphere to be processed is placed in the through hole, and a corresponding weight is arranged above the sphere for applying pressure; the motor A drives the lower polishing disc to rotate, driving the sphere to perform a rotation movement, the motor B drives the upper polishing disc to rotate, driving the sphere to perform a revolution movement, and at the same time, the X-axis slide drives the upper polishing disc to move, driving the sphere to perform a reciprocating movement in the X-axis direction.

[0007] Compared with the prior art, the porous micro-pressure reciprocating planetary sphere lapping and polishing equipment of the present application has the following advantages: (1) The upper lapping and polishing disc and the lower lapping and polishing disc are eccentrically arranged, and the upper lapping and polishing disc is connected to the X-axis slide; during polishing, the upper lapping and polishing disc rotates around its axis and cooperates with the reciprocating motion of the X-axis slide to drive the sphere to perform a spiral revolution motion, enabling each area on the sphere surface to come into contact with the lapping and polishing disc in turn, improving the coverage rate of the processing area, avoiding the problem of excessive local material removal that may occur during the revolution of the sphere, and helping to obtain an ideal spherical shape; at the same time, the lower lapping and polishing disc rotates around its axis and drives the sphere to rotate by friction, thus effectively enhancing the multi-angle contact between the sphere surface and the lapping and polishing disc, achieving full coverage of the processing trajectory, preventing the unevenness problem caused by single-direction polishing, and further improving the surface finish and forming accuracy. (2) A plurality of through holes for installing the sphere to be processed are provided in the upper lapping and polishing disc. During polishing, the pressure control of the sphere is realized by placing precision small weights (such as small balls or cylinders) in the through holes. The contact between the weights and the sphere enables the pressure applied by the upper lapping and polishing disc to be stably transmitted to the sphere, so that each sphere can bear a tiny and uniform pressure during the polishing process, avoiding the risk of rupture or surface damage caused by excessive local stress.

[0008] As an optimization, in the porous micro-pressure reciprocating planetary sphere lapping and polishing equipment described above, a rotating table is provided at the top of the A motor. Correspondingly, a mounting ring is provided at the bottom of the lower lapping and polishing disc, and the mounting ring is fixedly connected to the rotating table by screw connection. At this time, the structure is simple and the connection stability is high. Further, a positioning convex column and a group of A pin holes distributed at intervals in the circumferential direction are provided at the top of the rotating table. Correspondingly, a positioning blind hole and a group of B pin holes distributed at intervals in the circumferential direction are provided at the bottom of the lower lapping and polishing disc; the positioning convex column is located in the positioning blind hole, and the A pin holes and the B pin holes are connected by pins. The design of the positioning blind hole and pin holes on the lower lapping and polishing disc can be used to provide a stable assembly reference, enabling the lower lapping and polishing disc to maintain precise positioning during installation.

[0009] As an optimization, in the porous micro-pressure reciprocating planetary sphere lapping and polishing equipment described above, the upper lapping and polishing disc is connected to the B motor through a rotating shaft; the rotating shaft has a structure with a large end and a small end, and the large end is fixedly connected to the B motor, and the small end is fixedly connected to the upper lapping and polishing disc. The upper lapping and polishing component adopts an inverted installation mode, which can achieve a relatively stable layout, enabling the upper lapping and polishing disc, the B motor, and the rotating shaft to form a high-rigidity and high-precision whole, ensuring that the runout accuracy of the upper lapping and polishing disc during rotation remains within the design requirements.

[0010] As an optimization, in the aforementioned porous micro-pressure reciprocating planetary sphere grinding and polishing equipment, a vertical mounting seat is provided between the X-axis slide and the Z-axis slide; the vertical mounting seat is slidably connected to the X-axis slide; the Z-axis slide is fixed on the vertical mounting seat. At this time, the X-axis slide and the Z-axis slide are relatively independent. Compared with the superposition structure of multiple linear motion axes of the traditional gantry, the overall stiffness is higher, the structural stability is better, the small offset caused by mechanical failures can be reduced, the control accuracy can be improved, and the later maintenance is also more convenient.

[0011] As an optimization, the aforementioned porous micro-pressure reciprocating planetary sphere grinding and polishing equipment further includes a polishing liquid supply system for adding polishing liquid to the sphere processing area during the polishing process. On the one hand, the polishing liquid will chemically react with the sphere surface to improve the material removal rate; on the other hand, after using the polishing liquid, the temperature during the polishing process can be reduced to prevent thermal damage to the sphere caused by overheating. Specifically, the polishing liquid supply system includes a liquid storage bucket, a peristaltic pump, a waste liquid recovery tank, and a waste liquid recovery bucket; the inlet pipe of the peristaltic pump is connected to the outlet of the liquid storage bucket, and the outlet pipe is connected to a universal joint hose; the universal joint hose is arranged above the lower polishing disc; the outlet of the waste liquid recovery tank is connected to the waste liquid recovery bucket through a pipeline; the lower polishing disc is located in the waste liquid recovery tank. When the polishing liquid is fully utilized at the sphere processing position, it will be thrown into the waste liquid recovery tank under the action of centrifugal force, and then flow into the waste liquid recovery bucket through the outlet of the waste liquid recovery tank for collection.

[0012] Furthermore, the middle part of the waste liquid recovery tank is turned up to form a flange. Correspondingly, the bottom edge of the rotating table is provided with a rim, and an outer ring is sleeved outside; the flange is located between the rim and the outer ring. By setting a rotating table with a specific structure at the top of the A motor, it can prevent the polishing liquid from seeping into the motor during the processing; among them, a rim is designed at the connection between the rotating table and the A motor, which can serve as the second water-blocking line of defense; secondly, an outer ring is installed outside the rotating table, which can serve as the first water-blocking line of defense.

[0013] As an optimization, in the aforementioned porous micro-pressure reciprocating planetary sphere grinding and polishing equipment, a monitoring system is further included; the monitoring system includes a pressure sensor and a camera; the pressure sensor is arranged between the A motor and the base for real-time monitoring of the sphere processing state; the camera is arranged on the three-axis slide for real-time monitoring of the sphere motion state.

[0014] For the method, the technical solution of the present application is:

[0015] Porous micro-pressure reciprocating planetary sphere grinding and polishing method, which uses the porous micro-pressure reciprocating planetary sphere grinding and polishing equipment of the present application described above to process the sphere; specifically includes the following steps: S1. The Z-axis slide starts, driving the upper grinding and polishing component to move downward, so that the gap between the upper grinding and polishing disc and the lower grinding and polishing disc is smaller than the diameter of the sphere to be processed; S2. Place the sphere to be processed into the through hole of the upper grinding and polishing disc, and place the corresponding weight above the sphere to apply pressure to the sphere; S3. The A motor starts, driving the lower grinding and polishing disc to rotate, driving the sphere to rotate; at the same time, the B motor starts, driving the upper grinding and polishing disc to rotate, and the X-axis slide starts, driving the upper grinding and polishing disc to move back and forth, thereby driving the sphere to make a reciprocating spiral revolution.

[0016] Compared with the prior art, the porous micro-pressure reciprocating planetary sphere grinding and polishing method of the present application combines the planetary motion and the X-axis reciprocating motion, achieving full coverage of the processing trajectory, effectively improving the uniformity of the surface of the processed sphere; at the same time, this method can stably control the pressure applied during the processing through the way of counterweight micro-pressure, ensuring the uniform distribution of the surface stress of the sphere during polishing, and keeping the gap between the upper grinding and polishing disc and the lower grinding and polishing disc smaller than the diameter of the sphere during the polishing process, so that the sphere is in a relatively fixed position during polishing, ensuring its uniform rotation under a small pressure, thereby improving the dimensional accuracy and surface finish, and making the surface quality of the processed sphere good. Description of the Drawings

[0017] Figure 1 is the structural schematic diagram of the porous micro-pressure reciprocating planetary sphere grinding and polishing equipment in Embodiment 1 of the present application;

[0018] Figure 2 is the structural schematic diagram of the lower grinding and polishing component in the present application;

[0019] Figure 3 is the structural schematic diagram of the lower grinding and polishing disc in the present application;

[0020] Figure 4 is the structural schematic diagram of the rotating table in the present application;

[0021] Figure 5 is the structural schematic diagram of the lower grinding and polishing component in the present application;

[0022] Figure 6 is the structural schematic diagram of the rotating shaft in the present application;

[0023] Figure 7 is Figure 5 the cross-sectional view of the lower grinding and polishing component in

[0024] Figure 8 is the structural schematic diagram of the moving component in the present application;

[0025] Figure 9 It is a schematic structural diagram of the porous micro-pressure reciprocating planetary spherical polishing equipment in Embodiment 2 of the present application;

[0026] Figure 10 It is a schematic structural diagram of the porous micro-pressure reciprocating planetary spherical polishing equipment in Embodiment 3 of the present application;

[0027] Figure 11 It is an assembly schematic diagram of the waste liquid recovery tank and the lower polishing component in the present application;

[0028] Figure 12 is Figure 11 an enlarged schematic diagram of part A in

[0029] Figure 13 It is a schematic diagram of the polishing liquid supply system in the present application;

[0030] Figure 14 It is a working principle diagram of the porous micro-pressure reciprocating planetary spherical polishing equipment in Embodiment 3 of the present application;

[0031] Figure 15 It is a movement trajectory diagram of the sphere during the polishing process.

[0032] The reference numerals in the drawings are: 1 - base; 2 - lower polishing component, 21 - lower polishing disc, 211 - mounting ring, 212 - positioning blind hole, 213 - B pin hole, 22 - A motor, 23 - rotating table, 231 - edge, 232 - positioning boss, 233 - A pin hole, 24 - retaining ring; 3 - upper polishing component, 31 - upper polishing disc, 311 - through hole, 32 - B motor, 33 - rotating shaft, 331 - protective edge, 34 - bracket, 341 - protective cover, 35 - housing; 4 - moving component, 41 - X-axis slide, 42 - Z-axis slide, 43 - vertical mounting seat, 44 - drag chain; 5 - polishing liquid supply system, 51 - liquid storage bucket, 52 - peristaltic pump, 53 - waste liquid recovery tank, 531 - flanging, 54 - waste liquid recovery bucket, 55 - universal joint pipe; 6 - monitoring system, 61 - camera, 62 - three-axis slide; 7 - LED light source; 8 - sphere to be processed; 9 - counterweight ball. Detailed implementation manners

[0033] The present application will be further described below in conjunction with the drawings and embodiments, but it shall not be used as a basis for limiting the present application. The content not described in detail in the following embodiments is all common technical knowledge in the art.

[0034] The porous micro-pressure reciprocating planetary ball lapping equipment of the present application is used for the high-precision surface processing of high-hardness brittle material balls such as single-crystalline silicon, polycrystalline silicon, silicon nitride, and ruby. It aims to achieve uniform polishing of the balls through the special structure and motion combination of the upper lapping plate, lower lapping plate, X-axis slide, and Z-axis slide (including the rotation of the upper lapping plate, the reciprocating motion of the upper lapping plate driven by the X-axis slide, and the rotation of the lower lapping plate). Specifically, by using the eccentric arrangement of the upper and lower lapping plates, the porous design of the upper lapping plate, and the precise micro-pressure counterweight method, the balls can make multi-angle contact and polishing in a micro-pressure environment, improving the surface quality while achieving the high-precision ball forming effect. The lapping equipment of the present application can be used for the high-precision processing of small-size balls (diameter 0.5 - 4 mm) or large-size planes (diameter 5 - 100 mm) workpieces, meeting the strict requirements of the shape and ensuring that the surface roughness reaches the nanometer level.

[0035] See Figure 1 , in the porous micro-pressure reciprocating planetary ball lapping equipment in this embodiment, it includes a base 1, and a lower lapping component 2 and a moving component 4 provided on the base 1; an upper lapping component 3 is arranged above the lower lapping component 2; the upper lapping component 3 is fixed on the moving component 4; the lower lapping component 2 includes a lower lapping plate 21 and a motor A 22; the upper lapping component 3 includes an upper lapping plate 31 and a motor B 32; a plurality of through holes 311 are opened inside the upper lapping plate 31, and the upper lapping plate 31 and the lower lapping plate 21 are eccentrically arranged; the moving component 4 includes an X-axis slide 41 and a Z-axis slide 42, which are respectively used to control the movement of the upper lapping component 3 in the X-axis direction and the Z-axis direction.

[0036] During polishing, first, the Z-axis slide 42 drives the upper lapping component 3 to move downward, so that the gap between the upper lapping plate 31 and the lower lapping plate 21 is smaller than the diameter of the ball to be processed; then the ball to be processed is placed into the through hole 311 of the upper lapping plate 31, and corresponding counterweights are placed above the ball (the counterweights placed in each through hole 311 are precisely designed micro balls or cylinders, and their weights are controlled within a small range, aiming to provide appropriate pressure for the ball without over-pressurizing; the specific amount of weight depends on the actual processing situation, and different pressures are required for the balls in different process situations), and pressure is applied to the ball; then, the motor A 22 is started to drive the lower lapping plate 21 to rotate, driving the ball to make a self-rotation motion; at the same time, the motor B 32 is started to drive the upper lapping plate 31 to rotate, and the X-axis slide 41 is started to drive the upper lapping plate 31 to move back and forth, thereby driving the ball to make a reciprocating spiral revolution motion.

[0037] Example 1 (See Figures 2 - 8 ):

[0038] In this embodiment, three through holes 311 are provided in the upper polishing disc 31, which are evenly distributed at intervals along the circumferential direction, and the apertures of the three through holes 311 are inconsistent, increasing sequentially from the inside to the outside.

[0039] In this embodiment, both the A motor 22 and the B motor 32 are direct drive motors. Compared with the traditional drive mode, the advantages of the direct drive motor are its fast response speed, high positioning accuracy and stable movement. These characteristics greatly improve the stability of the polishing process and the machining quality of the workpiece surface. Moreover, the direct drive motor has non-contact transmission, simple structure, small occupied space, low maintenance cost of the equipment, and at the same time reduces the noise and heat generated by the mechanical structure, and can operate continuously and stably for a long time during sphere polishing. In addition, the high-precision bearings (such as the high-precision customized bearings of IKO in Japan) built in the direct drive motor can effectively control the radial and axial runout, enabling the motor rotor to achieve a runout accuracy within 2μm.

[0040] In this embodiment, the bottom of the A motor 22 is fixed to the base 1, and a rotating table 23 is provided at the top; an installation ring 211 is provided at the bottom of the lower polishing disc 21, and the installation ring 211 is fixedly connected to the rotating table 23 by threaded connection. Specifically, four threaded holes are provided at intervals along the circumferential direction on the installation ring 211. During assembly, the radial runout accuracy of the lower polishing disc 21 can be adjusted through the four threaded holes (which can be measured by a dial indicator), ensuring the installation stability between the lower polishing disc 21 and the rotating table 23, so that the lower polishing disc 21 can still maintain stable machining accuracy even under high-load operation.

[0041] In this embodiment, a positioning boss 232 and three A pin holes 233 evenly distributed at intervals along the circumferential direction are provided at the top of the rotating table 23. Correspondingly, a positioning blind hole 212 and three B pin holes 213 evenly distributed at intervals along the circumferential direction are provided at the bottom of the lower polishing disc 21; the positioning boss 232 is located in the positioning blind hole 212, and the A pin holes 233 and the B pin holes 213 are connected by pins. The design of the positioning blind hole and pin holes on the lower polishing disc 21 can be used to position the lower polishing disc 21 during installation, improving the installation convenience, and at the same time can also prevent deviation during installation, improving the concentricity and stability of the overall assembly.

[0042] In this embodiment, the upper lapping and polishing platen 31 is connected to the B motor 32 through a rotating shaft 33; the rotating shaft 33 has a structure with a large end and a small end, and the large end is fixedly connected to the B motor 32, and the small end is fixedly connected to the upper lapping and polishing platen 31. The upper lapping and polishing component is installed in an inverted mode, which can achieve a relatively stable layout, enabling the upper lapping and polishing platen, the B motor, and the rotating shaft to form a highly rigid and high-precision whole, ensuring that the runout accuracy of the upper lapping and polishing platen during rotation is maintained within the design requirements; in addition, the structure design of the rotating shaft 33 with a large upper part and a small lower part reduces its weight while ensuring stiffness. Specifically, a blind hole is provided in the middle of the small end of the rotating shaft 33 and is fixedly connected to the upper lapping and polishing platen 31 by screws; the large end of the rotating shaft 33 is sleeved outside the B motor 32 and is fixedly connected to the B motor by screws.

[0043] In terms of accuracy requirements, the parallelism and flatness of the upper and lower surfaces of the upper lapping and polishing platen 31 and the lower lapping and polishing platen 21 need to reach less than 2 μm, and the radial runout of the side surface also needs to be within 2 μm to ensure an ideal processing effect of the sphere during the polishing process; the mounting surface of the rotating shaft 33 is processed by an in-situ dressing process to ensure that the axial runout accuracy is within 2 μm.

[0044] In this embodiment, a vertical mounting seat 43 is provided between the X-axis slide 41 and the Z-axis slide 42; the vertical mounting seat 43 is slidably connected to the X-axis slide 41; the Z-axis slide 42 is fixed to the vertical mounting seat 43. At this time, the X-axis slide 41 and the Z-axis slide 42 are relatively independent. Compared with the superposition structure of multiple linear motion axes of the traditional gantry, the overall stiffness is higher, the structural stability is better, it can reduce the minute deviation caused by mechanical failures, improve the control accuracy, and is also more convenient for later maintenance. Specifically, both the X-axis slide 41 and the Z-axis slide 42 include a base and a lead screw provided in the base; the lead screw is driven by a motor, and a slider is provided on the lead screw; telescopic protective covers are respectively provided on both sides of the slider, and the protective covers cover the top of the base; when the slider moves back and forth, one protective cover is stretched, and the other protective cover is correspondingly compressed. The vertical mounting seat 43 is fixed to the slider of the X-axis slide 41; the B motor 32 is fixed to the slider of the Z-axis slide 42 through a bracket 34.

[0045] Furthermore, a cable carrier 44 is provided on the side of the X-axis slide 41; one end of the cable carrier 44 is fixed to the vertical mounting seat 43. The setting of the cable carrier 44 is beneficial to improving the running smoothness of the X-axis slide 41, and can also arrange various pipelines in an orderly manner, reducing the occupied space of the pipelines.

[0046] In this embodiment, both the base 1 and the vertical mounting base 43 are made of marble. Marble has strong rigidity and stability. Installing the Z-axis slide 42 on the vertical marble mounting base can effectively reduce the torque in the up and down directions and improve the anti-deformation ability of the structure; after installing the X-axis slide 41 on the marble base, the force generated by its reciprocating motion on the upper polishing disc 31 can be dispersed by the marble base, thus not significantly affecting the polishing effect.

[0047] In this embodiment, both the rotating table 23 and the rotating shaft 33 are integrally formed of steel materials. Steel materials have high rigidity and a low coefficient of thermal expansion, which can effectively reduce thermal deformation caused by temperature changes, so that the rotating table 23 and the rotating shaft 33 can maintain stability during long-term and high-speed operation. At the same time, the anti-fatigue and anti-seismic capabilities of the rotating table 23 and the rotating shaft 33 are improved, enabling them to withstand multi-directional forces from the polishing disc and the motor without deformation during the polishing process, ensuring the processing consistency of the workpiece.

[0048] Embodiment 2:

[0049] See Figure 9 , different from Embodiment 1, the polishing equipment in this embodiment further includes a monitoring system 6; the monitoring system 6 includes a pressure sensor and a camera 61; the pressure sensor is disposed between the A motor 22 and the base 1 for real-time monitoring of the processing state of the sphere; the camera 61 is disposed on the three-axis slide 62 and can move in the X, Y, and Z directions for real-time monitoring of the motion state of the sphere. An outer shell 35 is provided outside the bracket 34, and an LED light source 7 is provided on the outer shell 35 for providing stable light so that the camera 61 can capture high-quality images.

[0050] When installing the pressure sensor, four mounting hole positions can be opened on the base 1, and the pressure sensor can be installed through the hole positions at a certain angle to reduce the influence of off-axis load on the pressure accuracy. During polishing, the pressure normally fluctuates within a certain small range, generally ±0.1 N or less; if the pressure is abnormal, there may be a problem with the machine, and the X-axis slide 41 will stop suddenly and give an alarm.

[0051] Embodiment 3 (see Figures 10 - 13 ):

[0052] Different from Embodiment 2, the lapping and polishing equipment in this embodiment further includes a polishing liquid supply system 5; the polishing liquid supply system 5 includes a liquid storage barrel 51, a peristaltic pump 52, a waste liquid recovery tank 53 and a waste liquid recovery barrel 54; the inlet pipe of the peristaltic pump 52 is connected to the outlet of the liquid storage barrel 51, and the outlet pipe is connected to a universal corrugated pipe 55; the universal corrugated pipe 55 is arranged above the lower lapping and polishing disc 21; the outlet of the waste liquid recovery tank 53 is connected to the waste liquid recovery barrel 54 through a pipeline; the lower lapping and polishing disc 21 is located in the waste liquid recovery tank 53. Thus, during the polishing process, polishing liquid can be added to the processing area; on the one hand, the polishing liquid will chemically react with the surface of the sphere, improving the material removal rate; on the other hand, after using the polishing liquid, the temperature during the polishing process can be reduced, preventing thermal damage to the sphere caused by overheating. When the polishing liquid is fully utilized at the sphere processing position, it will be thrown into the waste liquid recovery tank 53 under the action of centrifugal force, and then flow into the waste liquid recovery barrel 54 through the outlet of the waste liquid recovery tank 53 for collection. The liquid storage barrel 51 includes an A liquid storage barrel, a B liquid storage barrel, and a C liquid storage barrel, which are respectively filled with fine polishing liquid, fine grinding polishing liquid, and rough grinding polishing liquid, corresponding to three different processing processes: fine polishing, fine grinding, and rough polishing. The polishing liquid contains oxidant, abrasive, PH regulator, surfactant, complexing agent, lubricant, etc. Before different processes start, first rinse the waste liquid recovery tank 53 with deionized water to ensure that the residues of the previous process do not affect subsequent processing. In this embodiment, the peristaltic pump 52 selects the intelligent peristaltic pump of model M0-KMC-ST42-A-212 of the Kamoer brand.

[0053] Further, the middle part of the waste liquid recovery tank 53 is turned up to form a flanging 531. Correspondingly, the bottom edge of the rotating table 23 is provided with a rim 231, and an outer ring 24 is sleeved outside. The flanging 531 is located between the rim 231 and the outer ring 24. Thus, it can prevent the polishing liquid from seeping into the motor during the processing; among them, a rim 231 is designed at the connection between the rotating table 23 and the A motor 22, which can serve as the second water blocking line; secondly, an outer ring 24 is installed outside the rotating table 23, which can serve as the first water blocking line.

[0054] Further, a protective cover 341 is provided at the bottom of the bracket 34, which is sleeved on the upper part of the B motor 32, and a protective edge 331 is provided at the top edge of the rotating shaft 33, which is sleeved on the lower part of the B motor 32, so as to avoid the splashing of the polishing liquid and its seepage onto the B motor 32.

[0055] In this embodiment, the applicant uses the aforementioned porous micro-pressure reciprocating planetary spherical lapping and polishing equipment to perform fine polishing on a group of single-crystal silicon spheres with a diameter of 0.9 mm; the initial surface quality Sa of the spheres 8 to be processed is: 40 - 60 nm, and the initial roundness is 0.78 - 0.93 μm.

[0056] The specific steps of polishing are as follows:

[0057] S1. The Z-axis slide 42 is started, driving the upper lapping component 3 to move downward, so that the gap between the upper lapping plate 31 and the lower lapping plate 21 is less than the diameter of the sphere 8 to be processed;

[0058] S2. The sphere 8 to be processed is placed into the through hole 311 of the upper lapping plate 31, and corresponding weights are placed above the sphere to apply pressure to the sphere, with the single-sphere pressure being 8.0 g;

[0059] S3. The A motor 22 is started, driving the lower lapping plate 21 to rotate forward at a speed of 67 rpm, driving the sphere to rotate self, the B motor 32 is started, driving the upper lapping plate 31 to rotate reversely at a speed of 31 rpm, the X-axis slide 41 is started, driving the upper lapping plate 31 to reciprocate at a speed of 0.5 mm / s, thereby driving the sphere to perform a reciprocating spiral revolution; meanwhile, the peristaltic pump 52 extracts the polishing liquid, which is supplied to the processing area of the sphere by the universal joint bamboo tube 55 (see Figure 14 ). The movement trajectory of the sphere on the lower lapping plate 21 is as shown in Figure 15 .

[0060] After polishing for 30 min according to the above steps, the surface quality Sa of the single-crystalline silicon sphere drops to 4.2 - 6.4 nm, and the roundness drops to 0.13 - 0.17 μm.

[0061] In order to verify that the lapping method combining planetary motion, reciprocating auxiliary motion, and micro-pressure counterweight has higher polishing quality, the applicant uses the traditional polishing method (providing pressure by the upper lapping plate and only performing simple planetary motion) and combines planetary motion with micro-pressure counterweight to polish a group of single-crystalline silicon spheres with the same initial surface quality Sa of 40 - 60 nm and initial roundness of 0.78 - 0.93 μm for 30 min for comparison.

[0062] The results are as follows:

[0063]

[0064] As can be seen from the above table, after polishing the single-crystalline silicon sphere using the lapping method of the present application, the surface roughness is lower and the roundness is smaller, indicating that when polishing the sphere using the lapping method of the present invention, the efficiency is higher and the quality is better.

[0065] The above general description of the invention involved in this application and the description of its specific embodiments should not be construed as limiting the technical solution of the invention. Based on the disclosure of this application, those skilled in the art can, without departing from the constituent elements of the involved invention, add, subtract, or combine the disclosed technical features in the above general description or / and specific embodiments (including examples) to form other technical solutions that fall within the protection scope of this application.

Claims

1. Porous micro-pressure reciprocating planetary sphere grinding and polishing equipment, characterized in that: It includes a base (1), a lower polishing component (2) and a moving component (4) provided on the base (1); an upper polishing component (3) is provided above the lower polishing component (2); the upper polishing component (3) is fixed to the moving component (4); the lower polishing component (2) includes a lower polishing disc (21) and a motor A (22); the upper polishing component (3) includes an upper polishing disc (31) and a motor B (32); a plurality of through holes (311) are formed inside the upper polishing disc (31), and the upper polishing disc (31) is eccentrically arranged with the lower polishing disc (21); the moving component (4) includes an X-axis slide (41) and a Z-axis slide (42), which are respectively used to control the movement of the upper polishing component (3) in the X-axis direction and the Z-axis direction; during polishing, the sphere to be processed is placed in the through hole (311), and a corresponding weight is arranged above the sphere for pressing; the motor A (22) drives the lower polishing disc (21) to rotate, driving the sphere to perform a self-rotation movement, the motor B (32) drives the upper polishing disc (31) to rotate, driving the sphere to perform a revolution movement, and at the same time the X-axis slide (41) drives the upper polishing disc (31) to move, driving the sphere to perform a reciprocating movement in the X-axis direction.

2. The porous micro-pressure reciprocating planetary sphere grinding and polishing equipment according to claim 1, characterized in that: A rotating table (23) is provided at the top of the motor A (22), and correspondingly, an installation ring (211) is provided at the bottom of the lower polishing disc (21); the installation ring (211) is fixedly connected to the rotating table (23) through a threaded connection.

3. The porous micro-pressure reciprocating planetary sphere lapping and polishing equipment according to claim 2, characterized in that: A positioning convex column (232) and a group of A pin holes (233) spaced circumferentially are provided at the top of the rotating table (23), and correspondingly, a positioning blind hole (212) and a group of B pin holes (213) spaced circumferentially are provided at the bottom of the lower polishing disc (21); the positioning convex column (232) is located in the positioning blind hole (212), and the A pin holes (233) are connected to the B pin holes (213) through pins.

4. The porous micro-pressure reciprocating planetary sphere lapping and polishing equipment according to claim 1, characterized in that: The upper polishing disc (31) is connected to the motor B (32) through a rotating shaft (33); the rotating shaft (33) has a structure with a large end and a small end, and the large end is fixedly connected to the motor B (32), and the small end is fixedly connected to the upper polishing disc (31).

5. The porous micro-pressure reciprocating planetary sphere lapping and polishing equipment according to claim 1, characterized in that: A vertical mounting seat (43) is provided between the X-axis slide (41) and the Z-axis slide (42); the vertical mounting seat (43) is slidably connected to the X-axis slide (41); the Z-axis slide (42) is fixed to the vertical mounting seat (43).

6. The porous micro-pressure reciprocating planetary sphere grinding and polishing equipment according to claim 1, characterized in that: It further includes a polishing liquid supply system (5) for adding polishing liquid to the sphere processing area during polishing.

7. The porous micro-pressure reciprocating planetary ball lapping and polishing equipment according to claim 6, characterized in that: The polishing liquid supply system (5) includes a liquid storage bucket (51), a peristaltic pump (52), a waste liquid recovery tank (53) and a waste liquid recovery bucket (54); the inlet pipe of the peristaltic pump (52) is connected to the outlet of the liquid storage bucket (51), and the outlet pipe is connected to a universal joint corrugated pipe (55); the universal joint corrugated pipe (55) is arranged above the lower polishing disc (21); the outlet of the waste liquid recovery tank (53) is connected to the waste liquid recovery bucket (54) through a pipeline; the lower polishing disc (21) is located in the waste liquid recovery tank (53).

8. The porous micro-pressure reciprocating planetary sphere lapping and polishing equipment according to claim 7, characterized in that: The middle part of the waste liquid recovery tank (53) is turned up to form a flanging (531). Correspondingly, a rim (231) is provided at the bottom edge of the rotating table (23), and a retaining ring (24) is sleeved outside. The flanging (531) is located between the rim (231) and the retaining ring (24).

9. The porous micro-pressure reciprocating planetary spherical grinding and polishing equipment according to claim 1 or 6, characterized in that: It further includes a monitoring system (6); the monitoring system (6) includes a pressure sensor and a camera (61); the pressure sensor is arranged between the A motor (22) and the base (1) for monitoring the processing state of the sphere in real time; the camera (61) is arranged on the three-axis slide table (62) for monitoring the movement state of the sphere in real time.

10. The porous micro-pressure reciprocating planetary sphere grinding and polishing method is characterized in that: This method uses the porous micro-pressure reciprocating planetary sphere lapping and polishing equipment described in claim 1 to process the sphere; specifically, it includes the following steps: S1. The Z-axis slide table (42) is started to drive the upper lapping and polishing component (3) to move downward so that the gap between the upper lapping and polishing disc (31) and the lower lapping and polishing disc (21) is smaller than the diameter of the sphere to be processed. S2. The sphere to be processed is placed into the through hole (311) of the upper lapping and polishing disc (31), and a corresponding weight is placed above the sphere to apply pressure to the sphere. S3. The A motor (22) is started to drive the lower lapping and polishing disc (21) to rotate, driving the sphere to rotate; at the same time, the B motor (32) is started to drive the upper lapping and polishing disc (31) to rotate, and the X-axis slide table (41) is started to drive the upper lapping and polishing disc (31) to move back and forth, thereby driving the sphere to perform a reciprocating spiral revolution.

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