Sealing mold for embedding FPC circuit board into injection molding exposed part

Abstract

The invention belongs to the technical field of injection molding, in particular to a sealing mold for implanting an FPC circuit board into an injection molding exposed part, and provides the following scheme that the sealing mold specifically comprises a fixed mold base and a movable mold base, a lower forming mold cavity and an upper forming mold cavity are formed in the surfaces of the fixed mold base and the movable mold base respectively, and a forming part is arranged in the middle of the lower forming mold cavity and the middle of the upper forming mold cavity; an injection nozzle is arranged on the movable mold base, an FPC circuit board is embedded in the middle of the forming piece, and two installation bases connected with the forming mold cavity are arranged in the middle of the fixed mold base. According to the invention, the specially-made first glue sealing module or second glue sealing module is selected and used, the exposed parts at the two ends of the FPC circuit board are tightly fixed on the mold, and the exposed parts at the two ends of the FPC circuit board are subjected to glue sealing treatment, so that the FPC circuit board is ensured not to be displaced, deformed or damaged due to the impact of plastic melt in the injection molding process.

Description

Technical Field

[0001] The present invention relates to the technical field of injection molding, and particularly to a sealing mold for the exposed part of an FPC circuit board implanted in injection molding. Background Art

[0002] AR glasses are a product with a sci-fi color and also a product with avant-garde technology. Wearing them allows one to experience the future functions used by the handsome male and female protagonists in sci-fi movies. AR glasses can achieve many functions and can be regarded as a miniature mobile phone. It can judge the state of the user by tracking the eye gaze trajectory and can activate corresponding functions.

[0003] The frame of AR glasses is processed by injection molding. During the injection molding process of the AR glasses frame, an FPC circuit board needs to be implanted into the injection molded part. Using the double-shot molding method, the upper and lower frames of the AR glasses are injection molded separately, and the FPC circuit board is implanted into the middle groove of the upper and lower frames of the AR glasses. When the FPC circuit board is implanted in injection molding, an exposed part for the FPC circuit board to connect to electricity needs to be reserved to avoid displacement, deformation, or damage of both ends of the FPC circuit board due to the impact of the plastic melt during injection molding.

[0004] In view of this, the present invention provides a sealing mold for the exposed part of an FPC circuit board implanted in injection molding to solve the technical problems existing in the above-mentioned prior art. Summary of the Invention

[0005] Based on the technical problems existing in the background art, the present invention proposes a sealing mold for the exposed part of an FPC circuit board implanted in injection molding.

[0006] A sealing mold for the exposed part of an FPC circuit board implanted in injection molding proposed by the present invention includes a fixed mold base and a movable mold base. The surfaces of the fixed mold base and the movable mold base are respectively provided with a lower molding cavity and an upper molding cavity, and a molding part is arranged in the middle of the lower molding cavity and the upper molding cavity. An injection nozzle is installed on the movable mold base. An FPC circuit board is implanted in the middle of the molding part. Two mounting seats connected to the lower molding cavity are arranged in the middle of the fixed mold base, and a first sealing module and a second sealing module are respectively installed inside the two mounting seats. A first sealing pressing cover and a second sealing pressing cover are arranged on the surface of the movable mold base. The first sealing pressing cover and the first sealing module cooperate to form a first sealing cavity, the second sealing pressing cover and the second sealing module cooperate to form a second sealing cavity, and a glue injection runner connecting the first sealing cavity and the second sealing cavity is arranged on the side wall of the mounting seat.

[0007] Preferably, in the present invention, the first sealant module includes a first sealant mold base, and a first injection hole connected to the injection channel is provided on the side surface of the first sealant mold base. A first sealant mold mechanism is installed in the first sealant mold base, and the first sealant mold mechanism is composed of a pressing plate assembly and a cavity assembly.

[0008] Preferably, in the present invention, the cavity assembly has a columnar structure, and a first diversion groove connected to the first injection hole is provided on the outer side of the cavity assembly. A sealant groove is provided at the top of the cavity assembly, and a protection cavity for fitting with the pressing plate assembly is provided on the side surface of the top of the cavity assembly.

[0009] Preferably, in the present invention, the pressing plate assembly includes a horizontally arranged pressing plate and a vertically arranged bending rib member, and a first positioning pin is provided at the upper end of the pressing plate.

[0010] Preferably, in the present invention, the first sealant cover includes a first convex cover arranged in the upper forming cavity, and the edge of the first convex cover is adapted to the opening of the first sealant mold base. A pressing groove adapted to the pressing plate is provided in the middle of the first convex cover, and a first positioning groove adapted to the first positioning pin is provided in the middle of the pressing groove.

[0011] Preferably, in the present invention, the second sealant module includes a second sealant mold base, and a second injection hole connected to the injection channel is provided on the side surface of the second sealant mold base. A second sealant mold mechanism is installed in the second sealant mold base.

[0012] Preferably, in the present invention, the top of the second sealant mold mechanism has a circular structure. A support core rod is provided at the bottom of the second sealant mold mechanism, and second diversion grooves connected to the second injection hole are provided on the side surfaces of both the second sealant mold mechanism and the support core rod. A second positioning pin is provided above the second sealant mold mechanism. A precision positioning column is provided at the bottom of the second positioning pin, and a precision positioning groove adapted to the precision positioning column is provided in the center of the top of the second sealant mold mechanism. A U-shaped groove is provided on the side surface of the top of the second sealant mold mechanism.

[0013] Preferably, in the present invention, the second sealant cover includes a second convex cover arranged in the upper forming cavity, and the edge of the second convex cover is adapted to the opening of the second sealant mold base. A second positioning groove adapted to the second positioning pin is provided in the middle of the second convex cover, and a U-shaped convex portion adapted to the U-shaped groove is provided on the side surface of the second convex cover.

[0014] Preferably, in the present invention, the formed part includes a primary formed shell and a secondary formed shell, and a first groove for cooperating with the first sealant module is provided at one end of the primary formed shell and the secondary formed shell. A second groove for cooperating with the second sealant module is provided at the other end of the primary formed shell and the secondary formed shell.

[0015] Compared with the prior art, the present invention provides a sealing mold for the exposed parts of an FPC circuit board implanted and injection-molded, having the following beneficial effects: Both ends of the FPC circuit board are respectively arranged in the first groove and the second groove. After the two ends of the FPC circuit board are implanted, the exposed parts are used for power connection to the AR glasses. According to the formation and size of the exposed part of the FPC circuit board, a special first sealing module or a second sealing module is selected to tightly fix the exposed parts of both ends of the FPC circuit board on the mold, and through the sealing treatment of the exposed parts of both ends of the FPC circuit board, it is ensured that during the injection molding process, the FPC circuit board will not be displaced, deformed or damaged due to the impact of the plastic melt; After the fixed mold base and the movable mold base are closed, the first sealing pressing cover fixes the pressing plate assembly on the upper end of the cavity assembly. A sealing cavity is formed between the first sealing pressing cover, the pressing plate assembly and the cavity assembly. When the FPC circuit board is implanted and injection-molded, the end of the FPC circuit board is arranged above the first sealing module, and the end of the FPC circuit board is inserted into the cavity assembly. The exposed part of the FPC circuit board is sealed by using the pressing plate assembly, and the glue is injected from the injection glue runner, the first injection hole and the outside of the cavity assembly. The sealing cavity is filled with the glue, and then the connection part between the FPC circuit board and the molded part is sealed, so that the FPC circuit board is tightly fixed in the molding cavity; A sealing cavity is formed between the second sealing pressing cover, the second sealing mold base and the second sealing mold mechanism. The other end of the FPC circuit board is laid flat in the sealing cavity. After injection, the other end of the FPC circuit board is completely covered by the protective glue mass. During the injection molding process, the other end of the FPC circuit board will not be displaced, deformed or damaged due to the impact of the plastic melt. Description of the Drawings

[0016] Figure 1 Schematic structural diagram of the fixed mold base of a sealing mold for the exposed parts of an FPC circuit board implanted and injection-molded proposed by the present invention; Figure 2 Schematic structural diagram of the movable mold base of a sealing mold for the exposed parts of an FPC circuit board implanted and injection-molded proposed by the present invention; Figure 3 Schematic structural diagram of the mounting base of a sealing mold for the exposed parts of an FPC circuit board implanted and injection-molded proposed by the present invention; Figure 4 Schematic structural diagram of the molded part of a sealing mold for the exposed parts of an FPC circuit board implanted and injection-molded proposed by the present invention; Figure 5 Schematic structural diagram of the first sealing module of a sealing mold for the exposed parts of an FPC circuit board implanted and injection-molded proposed by the present invention; Figure 6 Schematic structural diagram of the first sealing pressing cover of a sealing mold for the exposed parts of an FPC circuit board implanted and injection-molded proposed by the present invention; Figure 7 Schematic diagram of the second sealant module structure of a sealant mold for the exposed part of an FPC circuit board implanted by injection molding proposed by the present invention; Figure 8 Schematic diagram of the second sealant pressing cover structure of a sealant mold for the exposed part of an FPC circuit board implanted by injection molding proposed by the present invention; Figure 9 Schematic diagram of the cavity component structure of a sealant mold for the exposed part of an FPC circuit board implanted by injection molding proposed by the present invention; Figure 10 Schematic diagram of the FPC circuit board distribution of a sealant mold for the exposed part of an FPC circuit board implanted by injection molding proposed by the present invention.

[0017] In the figure: 1 fixed mold base, 2 moving mold base, 3 lower forming cavity, 4 upper forming cavity, 5 first sealant module, 51 first sealant mold base, 52 first injection hole, 53 cavity component, 54 sealant groove, 55 pressing plate component, 56 first positioning pin, 57 protection cavity, 6 second sealant module, 61 second sealant mold base, 62 second injection hole, 63 support core rod, 64 second sealant mold mechanism, 65 second positioning pin, 66 precision positioning column, 7 formed part, 71 secondary formed housing, 72 primary formed housing, 73 second groove, 74 first groove, 8 injection nozzle, 9 first sealant pressing cover, 91 first convex pressing cover, 92 pressing groove, 93 first positioning groove, 10 second sealant pressing cover, 101 second convex pressing cover, 102 U-shaped convex part, 103 second positioning groove, 11 FPC circuit board, 12 mounting seat, 13 injection runner. Detailed implementation manners

[0018] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention.

[0019] Refer to Figures 1 - 3, an encapsulation mold for the exposed part of an FPC circuit board implanted in injection molding, comprising a fixed mold base 1 and a movable mold base 2. The surfaces of the fixed mold base 1 and the movable mold base 2 are respectively provided with a lower molding cavity 3 and an upper molding cavity 4, and a molding part 7 is arranged in the middle of the lower molding cavity 3 and the upper molding cavity 4. An injection nozzle 8 is installed on the movable mold base 2. An FPC circuit board 11 is implanted in the middle of the molding part 7. Two mounting seats 12 connected to the lower molding cavity 3 are arranged in the middle of the fixed mold base 1, and a first encapsulation module 5 and a second encapsulation module 6 are respectively installed inside the two mounting seats 12. A first encapsulation pressing cover 9 and a second encapsulation pressing cover 10 are arranged on the surface of the movable mold base 2. The first encapsulation pressing cover 9 and the first encapsulation module 5 cooperate to form a first encapsulation cavity, and the second encapsulation pressing cover 10 and the second encapsulation module 6 cooperate to form a second encapsulation cavity. A glue injection runner 13 connecting the first encapsulation cavity and the second encapsulation cavity is arranged on the side wall of the mounting seat 12.

[0020] Refer to Figure 4 , the molding part 7 includes a primary molding shell 72 and a secondary molding shell 71, and one ends of the primary molding shell 72 and the secondary molding shell 71 are provided with a first groove 74 cooperating with the first encapsulation module 5, and the other ends of the primary molding shell 72 and the secondary molding shell 71 are provided with a second groove 73 cooperating with the second encapsulation module 6. In the present invention, both ends of the FPC circuit board 11 are respectively arranged in the first groove 74 and the second groove 73. The exposed parts after the two ends of the FPC circuit board 11 are implanted are used for power connection of the AR glasses. According to the exposed shape and size of the FPC circuit board 11, the special first encapsulation module 5 or the second encapsulation module 6 is selected to tightly fix the exposed parts at both ends of the FPC circuit board 11 on the mold, and through the encapsulation treatment of the exposed parts at both ends of the FPC circuit board 11, it is ensured that during the injection molding process, the FPC circuit board 11 will not be displaced, deformed or damaged due to the impact of the plastic melt.

[0021] Refer to Figure 5, the first encapsulation module 5 includes a first encapsulation mold base 51, and a first injection hole 52 connected to the injection runner 13 is provided on the side of the first encapsulation mold base 51. A first encapsulation mold mechanism is installed in the first encapsulation mold base 51, and the first encapsulation mold mechanism is composed of a pressing plate assembly 55 and a cavity assembly 53. In the present invention, after the fixed mold base 1 and the moving mold base 2 are closed, the first encapsulation cover 9 fixes the pressing plate assembly 55 on the upper end of the cavity assembly 53. A sealing cavity is formed between the first encapsulation cover 9, the pressing plate assembly 55 and the cavity assembly 53. When the FPC circuit board 11 is implanted during injection molding, the end of the FPC circuit board 11 is located above the first encapsulation module 5. The end of the FPC circuit board 11 is inserted into the cavity assembly 53. The exposed part of the FPC circuit board 11 is sealed by using the pressing plate assembly 55. Glue is injected from the injection runner 13, the first injection hole 52 and the outside of the cavity assembly 53. The sealing cavity is filled with glue, and then the connection part between the FPC circuit board 11 and the molded part 7 is sealed, so that the FPC circuit board 11 is firmly fixed in the molding cavity, ensuring that the FPC circuit board 11 will not be displaced, deformed or damaged due to the impact of the plastic melt during the injection molding process.

[0022] Refer to Figure 9 , the cavity assembly 53 has a columnar structure, and a first diversion groove connected to the first injection hole 52 is provided on the outside of the cavity assembly 53. A sealing groove 54 is provided at the top of the cavity assembly 53, and a protection cavity 57 for mating with the pressing plate assembly 55 is provided on the side of the top of the cavity assembly 53. In the present invention, a combined sealing cavity is formed by enclosing between the first encapsulation cover 9, the pressing plate assembly 55 and the sealing groove 54 of the cavity assembly 53. By using the cooperation between the pressing plate assembly 55 and the protection cavity 57, after the end of the FPC circuit board 11 is inserted into the protection cavity 57, the connection part between the FPC circuit board 11 and the sealing cavity is sealed and fixed by using the pressing plate assembly 55, thereby protecting the exposed part of the FPC circuit board 11.

[0023] Refer to Figure 5 and Figure 9 , the pressing plate assembly 55 includes a horizontally arranged pressing plate and a vertically arranged bending rib member, and a first positioning pin 56 is provided at the upper end of the pressing plate. In the present invention, the end of the FPC circuit board 11 is bent and inserted into the protection cavity 57 under the action of the bending rib member, and the opening part of the protection cavity 57 is blocked and positioned by using the pressing plate to ensure the flat position of the exposed edge of the FPC circuit board 11, thereby ensuring the uniformity and sealing performance of the sealing inside the sealing cavity, and at the same time preventing glue from entering the protection cavity 57.

[0024] Refer to Figure 2 and Figure 6, the first sealant pressing cover 9 includes a first convex pressing cover 91 disposed in the upper forming cavity 4, and the edge of the first convex pressing cover 91 is adapted to the opening of the first sealant mold base 51. A pressing groove 92 adapted to the pressing plate is provided in the middle of the first convex pressing cover 91, and a first positioning groove 93 adapted to the first positioning pin 56 is provided in the middle of the pressing groove 92. In the present invention, the first positioning pin 56 and the pressing plate assembly 55 are firmly fixed by the first sealant pressing cover 9, so as to maintain the stability of the sealant cavity formed among the first sealant pressing cover 9, the pressing plate assembly 55 and the cavity assembly 53 during the sealant application and injection molding processes.

[0025] Refer to Figure 7 and Figure 9 , the second sealant module 6 includes a second sealant mold base 61, and a second injection hole 62 connected to the injection runner 13 is provided on the side of the second sealant mold base 61. A second sealant mold mechanism 64 is installed in the second sealant mold base 61. In the present invention, a sealant cavity is formed among the second sealant pressing cover 10, the second sealant mold base 61 and the second sealant mold mechanism 64. The other end of the FPC circuit board 11 is laid flat in the sealant cavity, and after injection, the other end of the FPC circuit board 11 is completely coated in the protective rubber mass. During the injection molding process, the other end of the FPC circuit board 11 will not be displaced, deformed or damaged due to the impact of the plastic melt.

[0026] Refer to Figure 7 and Figure 9 , the top of the second sealant mold mechanism 64 is of a circular structure. A support core rod 63 is provided at the bottom of the second sealant mold mechanism 64, and second diversion grooves connected to the second injection hole 62 are provided on the sides of both the second sealant mold mechanism 64 and the support core rod 63. A second positioning pin 65 is provided above the second sealant mold mechanism 64, a precision positioning column 66 is provided at the bottom of the second positioning pin 65, and a precision positioning groove adapted to the precision positioning column 66 is provided in the center of the top of the second sealant mold mechanism 64. A U-shaped groove is provided on the side of the top of the second sealant mold mechanism 64. In the present invention, after the FPC circuit board 11 is placed, the end of the FPC circuit board 11 is disposed between the second sealant pressing cover 10 and the second sealant mold mechanism 64, and the end of the FPC circuit board 11 is accurately positioned by the precision positioning column 66, so as to ensure that the protective rubber mass completely wraps the end of the FPC circuit board 11 during injection, and avoid protection defects.

[0027] Refer to Figure 2 and Figure 8, the second seal pressing cover 10 includes a second convex pressing cover 101 disposed in the upper forming cavity 4, and the edge of the second convex pressing cover 101 is adapted to the opening of the second seal mold base 61. A second positioning groove 103 adapted to the second positioning pin 65 is provided in the middle of the second convex pressing cover 101, and a U-shaped convex portion 102 adapted to the U-shaped groove is provided on the side of the second convex pressing cover 101. In the present invention, the second seal pressing cover 10 wraps and fixes the second positioning pin 65, and then a seal cavity that completely wraps the end of the FPC circuit board 11 is formed by the second seal pressing cover 10, the second seal mold base 61, and the second seal mold mechanism 64.

[0028] After the fixed mold base 1 and the moving mold base 2 are closed, the first seal pressing cover 9 fixes the pressing plate assembly 55 at the upper end of the cavity assembly 53. A seal cavity is formed between the first seal pressing cover 9, the pressing plate assembly 55, and the cavity assembly 53. When the FPC circuit board 11 is implanted and injection molded, the end of the FPC circuit board 11 is disposed above the first seal module 5, and the end of the FPC circuit board 11 is inserted into the cavity assembly 53. The exposed part of the FPC circuit board 11 is sealed by using the pressing plate assembly 55, and the glue is injected from the injection runner 13, the first injection hole 52, and the outside of the cavity assembly 53. The seal cavity is filled with the glue, and then the connection part between the FPC circuit board 11 and the molded part 7 is sealed, so that the FPC circuit board 11 is firmly fixed in the forming cavity. A seal cavity is formed between the second seal pressing cover 10, the second seal mold base 61, and the second seal mold mechanism 64. The other end of the FPC circuit board 11 is laid flat in the seal cavity. After injection, the other end of the FPC circuit board 11 is completely wrapped in the protective glue mass. Then, according to the exposed shape and size of the FPC circuit board 11, the special first seal module 5 or the second seal module 6 is selected to firmly fix the exposed parts at both ends of the FPC circuit board 11 on the mold, and the exposed parts at both ends of the FPC circuit board 11 are sealed to ensure that the FPC circuit board 11 will not be displaced, deformed, or damaged due to the impact of the plastic melt during the injection molding process.

[0029] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. An encapsulation mold for the exposed part of an FPC circuit board implanted in injection molding, comprising a fixed mold base (1) and a movable mold base (2). Lower and upper molding cavities (3) and (4) are respectively arranged on the surfaces of the fixed mold base (1) and the movable mold base (2), and a molding part (7) is arranged in the middle of the lower molding cavity (3) and the upper molding cavity (4). An injection nozzle (8) is installed on the movable mold base (2). An FPC circuit board (11) is implanted in the middle of the molding part (7), and it is characterized in that, In the middle of the fixed mold base (1), there are two mounting seats (12) connected to the lower molding cavity (3). Inside the two mounting seats (12), a first sealant module (5) and a second sealant module (6) are respectively installed. On the surface of the moving mold base (2), there are a first sealant pressing cover (9) and a second sealant pressing cover (10). The first sealant pressing cover (9) and the first sealant module (5) cooperate to form a first sealant cavity, and the second sealant pressing cover (10) and the second sealant module (6) cooperate to form a second sealant cavity. On the side wall of the mounting seat (12), there is a glue injection runner (13) connecting the first sealant cavity and the second sealant cavity.

2. The encapsulation mold for the exposed part of the FPC circuit board implanted and injection-molded according to claim 1, wherein The first sealant module (5) includes a first sealant mold base (51). On the side of the first sealant mold base (51), there is a first glue injection hole (52) connected to the glue injection runner (13). Inside the first sealant mold base (51), a first sealant mold mechanism is installed, and the first sealant mold mechanism is composed of a pressing plate assembly (55) and a cavity assembly (53).

3. A sealing mold for the exposed part of an FPC circuit board implanted and injection-molded according to claim 2, characterized in that, The cavity assembly (53) is in a columnar structure. On the outside of the cavity assembly (53), there is a first diversion groove connected to the first glue injection hole (52). On the top of the cavity assembly (53), there is a sealant groove (54). On the side of the top of the cavity assembly (53), there is a protection cavity (57) that is wrapped and matched with the pressing plate assembly (55).

4. A glue-sealing mold for the exposed part of the FPC circuit board implanted and injection-molded according to claim 3, characterized in that, The pressing plate assembly (55) includes a horizontally arranged pressing plate and a vertically arranged bending rib member. At the upper end of the pressing plate, there is a first positioning pin (56).

5. A sealing glue mold for the exposed part of the FPC circuit board implanted and injection molded according to claim 4, characterized in that, The first sealant pressing cover (9) includes a first convex pressing cover (91) arranged in the upper molding cavity (4). The edge of the first convex pressing cover (91) is adapted to the opening of the first sealant mold base (51). In the middle of the first convex pressing cover (91), there is a pressing groove (92) adapted to the pressing plate. In the middle of the pressing groove (92), there is a first positioning groove (93) adapted to the first positioning pin (56).

6. A glue-sealing mold for the exposed part of an FPC circuit board implanted and injection-molded according to claim 1, characterized in that, The second sealant module (6) includes a second sealant mold base (61). On the side of the second sealant mold base (61), there is a second glue injection hole (62) connected to the glue injection runner (13). Inside the second sealant mold base (61), a second sealant mold mechanism (64) is installed.

7. An encapsulation mold for the exposed part of an FPC circuit board implanted and injection-molded, according to claim 6, wherein The top of the second sealant mold mechanism (64) is circular. At the bottom of the second sealant mold mechanism (64), there is a support core rod (63). On the sides of the second sealant mold mechanism (64) and the support core rod (63), there are second diversion grooves connected to the second glue injection hole (62). Above the second sealant mold mechanism (64), there is a second positioning pin (65). At the bottom of the second positioning pin (65), there is a precision positioning column (66). In the center of the top of the second sealant mold mechanism (64), there is a precision positioning groove adapted to the precision positioning column (66). On the side of the top of the second sealant mold mechanism (64), there is a U-shaped groove.

8. A glue-sealing mold for the exposed part of an FPC circuit board implanted and injection-molded, according to claim 7, characterized in that The second seal pressing cover (10) includes a second convex pressing cover (101) disposed in the upper forming cavity (4), and the edge of the second convex pressing cover (101) is adapted to the opening of the second seal die base (61). A second positioning groove (103) adapted to the second positioning pin (65) is provided in the middle of the second convex pressing cover (101), and a U-shaped convex portion (102) adapted to the U-shaped groove is provided on the side of the second convex pressing cover (101).

9. A sealing mold for the exposed part of an FPC circuit board implanted and injection-molded, according to claim 1, wherein The formed part (7) includes a primary formed housing (72) and a secondary formed housing (71), and a first groove (74) adapted to the first seal module (5) is provided at one end of the primary formed housing (72) and the secondary formed housing (71). A second groove (73) adapted to the second seal module (6) is provided at the other end of the primary formed housing (72) and the secondary formed housing (71).

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