Mold manufacturing device and metal plate mold manufacturing machine thereof

Abstract

The invention provides a mold manufacturing device. The mold manufacturing device comprises a control module; the mold processing module is connected with the control module, the mold processing module comprises a first table body, a horizontal monitoring unit and a to-be-processed mold, the horizontal monitoring unit is connected with the to-be-processed mold and the control module, and the first table body is provided with a first placement groove; a magnetic attraction bottom table, a first fixing unit and an electrolyte circulating unit are arranged in the first containing groove, the magnetic attraction bottom table is arranged at the bottom of the first containing groove and connected with a to-be-treated mold and the first fixing unit, and the electrolyte circulating unit is arranged in the first containing groove and connected with the first fixing unit; and the etching module is respectively connected with the control module and the mold processing module, and the etching module is used for etching the surface of the to-be-processed mold. According to the technical scheme, the production efficiency of the metal plate die can be improved, and the rejection rate can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of mold processing, and particularly relates to a mold manufacturing device and a metal plate mold manufacturing machine thereof. Background Art

[0002] Currently, mold manufacturing devices usually use auxiliary positioning mechanisms to position and fix metal plates, and then use copper taps to etch the surfaces of the metal plates to complete the production of molds. However, in the prior art, the use of auxiliary positioning mechanisms cannot effectively ensure the flatness of the metal plates, and additional processing and inspection steps are required to correct the deviations, resulting in low production efficiency and high rejection rates of metal plate molds. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. For this purpose, the present invention provides a mold manufacturing device and a metal plate mold manufacturing machine thereof, which can improve the production efficiency of metal plate molds and reduce the rejection rate.

[0004] In a first aspect, an embodiment of the present invention provides a mold manufacturing device, including:

[0005] A control module;

[0006] A mold processing module, the mold processing module is connected to the control module, the mold processing module includes a first table body, a horizontal monitoring unit and a mold to be processed, the horizontal monitoring unit is respectively connected to the mold to be processed and the control module, the first table body is provided with a first placement groove, and a magnetic adsorption base, a first fixing unit and an electrolyte circulation unit are arranged in the first placement groove. The magnetic adsorption base is arranged at the bottom of the first placement groove and is respectively connected to the mold to be processed and the first fixing unit. The electrolyte circulation unit is arranged in the first placement groove and is connected to the first fixing unit. The magnetic adsorption base is used for adsorbing the mold to be processed, the electrolyte circulation unit is used for circulating and supplying electrolyte to the first placement groove, and the first fixing unit is used for fixing the magnetic adsorption base;

[0007] An etching module, the etching module is respectively connected to the control module and the mold processing module, and the etching module is used for etching the surface of the mold to be processed.

[0008] In some embodiments of the present invention, the etching module includes a second table body, a first connecting member, a robotic arm and a copper tap. One end of the first connecting member is connected to the second table body, the other end of the first connecting member is connected to one end of the robotic arm, and the other end of the robotic arm is connected to the copper tap.

[0009] In some embodiments of the present invention, the robotic arm holds the copper tapping by means of air suction.

[0010] In some embodiments of the present invention, a placement unit is provided at the notch of the first placement groove. The placement unit includes a first fixing device, a second connecting member, and a plurality of copper tapping fixing clips. One side of the second connecting member is connected to the first fixing device, and the other side of the second connecting member is connected to the plurality of copper tapping fixing clips.

[0011] In some embodiments of the present invention, the first fixing device is provided with a second placement groove. A first adjusting plate and a plurality of second adjusting plates are arranged in the second placement groove. The first adjusting plate is provided with a first connecting portion and a second connecting portion. The first connecting portion is connected to the second adjusting plate. A third connecting portion is formed on one side of the plurality of second adjusting plates close to the second connecting portion. The second connecting portion is connected to the first end of the second connecting member. The third connecting portion is connected to the second end of the second connecting member. A first extending plane is provided at the third end of the second connecting member. The plurality of copper tapping fixing clips are arranged above the first extending plane.

[0012] In some embodiments of the present invention, the copper tapping fixing clip is provided with a connecting portion and a fixing portion. The connecting portion is connected to the first extending plane, and the fixing portion is used to fix copper tappings of different sizes.

[0013] In some embodiments of the present invention, the electrolyte circulation unit includes a water outlet pipe, a water pump, and a plurality of water suction pipes. The water pump is respectively connected to the water outlet pipe and the water suction pipes. The water outlet pipe is arranged above the first fixing unit, and the water outlet of the water outlet pipe is arranged above the mold to be processed.

[0014] In some embodiments of the present invention, the magnetic adsorption base is provided with an adjustment track, a first position adjustment unit, and a second position adjustment unit. The first position adjustment unit and the second position adjustment unit are both disposed on the upper part of the adjustment track. The first position adjustment unit is connected to one side of the first fixing unit, and the second position adjustment unit is connected to the other side of the first fixing unit. The first position adjustment unit includes a first moving slider, a first support column, and a third connecting member. The third connecting member is respectively connected to one end of the first fixing unit and the first moving slider. The third connecting member is provided with a first moving chute. The first support column passes through the first moving chute and is connected to the bottom of the first placement groove. The second position adjustment unit includes a second moving slider, a second support column, and a fourth connecting member. The fourth connecting member is respectively connected to the other end of the first fixing unit and the second moving slider. The fourth connecting member is provided with a second moving chute. The second support column passes through the second moving chute and is connected to the bottom of the first placement groove.

[0015] In some embodiments of the present invention, the mold manufacturing device is further provided with a display module. The display module is respectively connected to the control module and the level monitoring unit. The display module is used to display the level information of the mold to be processed obtained by the level monitoring unit. The control module adjusts the etching module according to the level information.

[0016] In a second aspect, the present invention further provides a metal plate mold manufacturing machine, including:

[0017] The mold manufacturing device as described in the first aspect.

[0018] According to the mold manufacturing device of the embodiments of the present invention, it has at least the following beneficial effects:

[0019] A control module; a mold processing module, the mold processing module is connected to the control module. The mold processing module includes a first table body, a level monitoring unit, and a mold to be processed. The level monitoring unit is respectively connected to the mold to be processed and the control module. The first table body is provided with a first placement groove. Inside the first placement groove, there are a magnetic adsorption base, a first fixing unit, and an electrolyte circulation unit. The magnetic adsorption base is disposed at the bottom of the first placement groove and is respectively connected to the mold to be processed and the first fixing unit. The electrolyte circulation unit is disposed inside the first placement groove and is connected to the first fixing unit. The magnetic adsorption base is used to adsorb the mold to be processed. The electrolyte circulation unit is used to circulate and supply electrolyte to the first placement groove. The first fixing unit is used to fix the magnetic adsorption base; an etching module, the etching module is respectively connected to the control module and the mold processing module. The etching module is used to etch the surface of the mold to be processed. According to the technical solution of this embodiment, the production efficiency of the metal plate mold can be improved and the rejection rate can be reduced. Description of the Drawings

[0020] Figure 1 is a schematic diagram of the overall structure of a mold manufacturing device provided by an embodiment of the present invention;

[0021] Figure 2 is a schematic diagram of the structure of the first table body provided by an embodiment of the present invention;

[0022] Figure 3 is a schematic diagram of the structure of the electrolyte circulation unit provided by an embodiment of the present invention;

[0023] Figure 4 is a schematic diagram of the structure of the second table body provided by an embodiment of the present invention;

[0024] Figure 5 is a schematic diagram of the structure of the placement unit provided by an embodiment of the present invention;

[0025] Figure 6 is a schematic diagram of the structure of the magnetic adsorption bottom table provided by an embodiment of the present invention. Detailed Description of the Embodiment

[0026] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present invention, and should not be construed as a limitation of the present invention.

[0027] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0028] In the description of the present invention, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, exceeding, etc. are understood as not including the number itself, and above, below, within, etc. are understood as including the number itself. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or the sequence relationship of the indicated technical features.

[0029] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0030] Reference Figure 1 、 Figure 2 and Figure 3 , an embodiment of the present invention provides a mold manufacturing device, including:

[0031] A control module; a mold processing module 100, the mold processing module 100 is connected to the control module, the mold processing module 100 includes a first table body 110, a horizontal monitoring unit 120 and a mold to be processed 130, the horizontal monitoring unit 120 is respectively connected to the mold to be processed 130 and the control module, the first table body 110 is provided with a first placement groove 140, a magnetic adsorption bottom table 141, a first fixing unit 142 and an electrolyte circulation unit 143 are arranged in the first placement groove 140, the magnetic adsorption bottom table 141 is arranged at the bottom of the first placement groove 140 and is respectively connected to the mold to be processed 130 and the first fixing unit 142, the electrolyte circulation unit 143 is arranged in the first placement groove 140 and is connected to the first fixing unit 142, the magnetic adsorption bottom table 141 is used for adsorbing the mold to be processed 130, the electrolyte circulation unit 143 is used for circulating and supplying electrolyte to the first placement groove 140, and the first fixing unit 142 is used for fixing the magnetic adsorption bottom table 141; An etching module 200, the etching module 200 is respectively connected to the control module and the mold processing module 100, and the etching module 200 is used for etching the surface of the mold to be processed 130.

[0032] It should be noted that the mold manufacturing device first obtains the horizontal information of the mold to be processed 130 through the horizontal monitoring unit 120, determines the levelness of the mold to be processed 130 according to the horizontal information, and the control module fine-tunes the etching module 200 according to the levelness, so as to ensure the etching depth, shape and pattern accuracy when the etching module 200 etches the mold to be processed 130, effectively avoiding etching errors caused by mold tilt. Further, the electrolyte circulation unit 143 continuously provides electrolyte for the first placement groove 140 to ensure the continuous progress of the etching reaction when the etching module 200 etches the mold to be processed 130, thereby improving the etching speed and optimizing the etching effect. Since the magnetic adsorption bottom table 141 stably adsorbs the mold to be processed 130, the shaking of the mold during the etching process is further reduced, and the etching efficiency is further improved.

[0033] It should be noted that through the coordinated action of the control module, the mold processing module 100 and the etching module 200, the mold manufacturing device can automatically complete the placement, etching and subsequent processing steps of the mold to be processed 130 according to the preset process, thereby reducing the complexity of manual operation and improving the etching efficiency of the metal plate mold.

[0034] Reference Figure 4, the etching module 200 includes a second body 210, a first connecting member 220, a robotic arm 230, and a copper tapping tool 240. One end of the first connecting member 220 is connected to the second body 210, the other end of the first connecting member 220 is connected to one end of the robotic arm 230, and the other end of the robotic arm 230 is connected to the copper tapping tool 240.

[0035] It should be noted that the second body 210 and the robotic arm 230 are firmly connected through the first connecting member 220 to ensure the stability of the etching module 200 during operation, effectively preventing vibrations and shakes of the mold 130 to be processed when the etching module 200 is working, and improving the accuracy and consistency of etching. Further, through the control of the robotic arm 230 by the control module, the copper tapping tool 240 can move flexibly within the working area to achieve etching of different positions and shapes on the surface of the metal plate mold. At the same time, the high-precision control of the robotic arm 230 can ensure the accurate positioning of the copper tapping tool 240 during the etching process, thereby achieving the desired etching effect. In addition, the etching module 200 has a certain adaptability and can be adjusted according to different etching requirements and workpiece specifications. Exemplarily, the control module controls the robotic arm 230 to replace copper tapping tools 240 of different specifications or adjust the working range of the robotic arm 230, so as to form patterns of different sizes and shapes on the surface of the metal plate mold.

[0036] The robotic arm 230 holds the copper tapping tool 240 by air suction. It should be noted that the robotic arm 230 holds the copper tapping tool 240 by air suction, and adsorbs the copper tapping tool 240 by the suction force formed by the negative pressure in the suction cup. Specifically, the air suction type robotic arm 230 usually consists of a suction cup (one or several), a suction cup holder, and an air intake and exhaust system. When the suction cup contacts and seals the surface of the copper tapping tool 240, the air in the suction cup is pumped out through the air intake and exhaust system to form a negative pressure in the suction cup. Since the air pressure in the suction cup is lower than the external atmospheric pressure, an inward suction force is generated, thereby firmly adsorbing the copper tapping tool 240 on the suction cup. The air suction method can ensure the stability of the copper tapping tool 240 during the clamping process, making it not easy to slip or shake, thereby improving the accuracy and consistency of the etching operation. Compared with traditional clamping methods, the air suction method will not cause scratches or indentations on the surface of the copper tapping tool 240. In addition, the air suction method can be applied to copper tapping tools 240 of different shapes and sizes. As long as the surface of the copper tapping tool 240 is flat and smooth, stable clamping can be achieved by adjusting the position and number of suction cups. Further, the air suction method can be automatically controlled through the control module, including the opening and closing of the suction cup, the adjustment of the suction force, etc., thereby realizing the automation and intelligence of the etching operation and improving production efficiency.

[0037] Refer to Figure 2 and Figure 5, a placing unit 144 is provided at the notch of the first placing groove 140. The placing unit 144 includes a first fixing device 150, a second connecting member 160, and a plurality of tapping fixing clips 170. One side of the second connecting member 160 is connected to the first fixing device 150, and the other side of the second connecting member 160 is connected to the plurality of tapping fixing clips 170.

[0038] It should be noted that after the tapping tools 240 are orderly fixed on the placing unit 144, the control module can effectively identify and pick up the required tapping tools 240 without searching among the scattered tapping tools 240. Only need to input the sizes and shapes of different tapping tools 240 into the control module in advance, and the control module can replace the tapping tools 240 according to the etched pattern when performing the pattern etching. At the same time, this also facilitates the unified management and inventory of the tapping tools 240 to ensure that the quantity and types of the tapping tools 240 meet the production requirements. In addition, the first fixing device 150 is connected to the plurality of tapping fixing clips 170 through the second connecting member 160, forming a stable overall structure, which can effectively prevent the tapping tools 240 from slipping or being damaged during storage or transportation, and improves the safety and stability of the storage of the tapping tools 240.

[0039] Refer to Figure 5 , the first fixing device 150 is provided with a second placing groove 151. A first adjusting plate 152 and a plurality of second adjusting plates 153 are arranged in the second placing groove 151. The first adjusting plate 152 is provided with a first connecting portion 1521 and a second connecting portion 1522. The first connecting portion 1521 is connected to the second adjusting plate 153. A third connecting portion is formed on one side of the plurality of second adjusting plates 153 close to the second connecting portion 1522. The second connecting portion 1522 is connected to the first end of the second connecting member 160. The third connecting portion is connected to the second end of the second connecting member 160. A first extending plane is provided at the third end of the second connecting member 160. The plurality of tapping fixing clips 170 are arranged on the upper part of the first extending plane.

[0040] It should be noted that through the combination of the first adjusting plate 152 and multiple second adjusting plates 153, the internal space layout of the second placement groove 151 can be flexibly adjusted. The connection between the first connection portion 1521 and the second adjusting plate 153 allows for fine-tuning according to the size and quantity of the tapping tools 240 to ensure the best storage and fixing effects. The design of the second connection portion 1522 enables the entire placement unit 144 to have a certain degree of adjustability in height, capable of adapting to different sizes of tapping tools 240 or different storage requirements. The setting of the first extended plane provides a stable supporting surface, enabling multiple tapping tool fixing clamps 170 to be firmly installed thereon, further enhancing the structural stability. Through the carefully designed adjusting plates and connection portions, the internal space of the second placement groove 151 can be utilized to the maximum extent. This design helps to store more tapping tools 240 in a limited space, improving the space utilization rate. The setting of the first extended plane also adds additional storage space, which can further increase the storage quantity of tapping tools 240.

[0041] Referring to Figure 5 , the tapping tool fixing clamp 170 is provided with a fourth connection portion 171 and a fixing portion 172. The fourth connection portion 171 is connected to the first extended plane, and the fixing portion 172 is used to fix tapping tools 240 of different sizes.

[0042] It should be noted that the connection between the fourth connection portion 171 and the first extended plane ensures the stability of the tapping tool fixing clamp 170 during the entire movement process. It prevents the tapping tool 240 from being damaged due to shaking or falling off during the movement, thus ensuring the continuity and safety of the production process. The design of the fixing portion 172 enables the tapping tool fixing clamp 170 to clamp tapping tools 240 of different sizes. This flexibility not only improves the production efficiency but also reduces the costs and time waste caused by replacing fixing clamps of different sizes. The stability and adaptability of the tapping tool fixing clamp 170 enable the robotic arm 230 to operate the tapping tool 240 more precisely. The robotic arm 230 can accurately grasp, move, and place the tapping tool 240 without worrying about operation errors caused by the instability of the fixing clamp. In addition, the design of the tapping tool fixing clamp 170 reduces the need for manual intervention. Workers do not need to frequently replace the fixing clamp or adjust the grasping position of the robotic arm 230, thereby reducing the labor intensity and work complexity.

[0043] Referring to Figure 1 and Figure 3 , the electrolyte circulation unit 143 includes a water outlet pipe 1431, a water pump 1432, and multiple water suction pipes 1433. The water pump 1432 is respectively connected to the water outlet pipe 1431 and the water suction pipes 1433. The water outlet pipe 1431 is arranged at the upper part of the first fixing unit 142, and the water outlet of the water outlet pipe 1431 is arranged at the upper part of the mold 130 to be processed.

[0044] It should be noted that the water pump 1432, as a driving device, can effectively suck the electrolyte from the water suction pipe 1433 and transport it to the upper part of the mold to be processed 130 through the water outlet pipe 1431. It ensures the efficient flow of the electrolyte during the circulation process, helps to accelerate the electrolysis reaction process of the mold to be processed 130, and improves the etching efficiency. The outlet of the water outlet pipe 1431 is located at the upper part of the mold to be processed 130, which can ensure that the electrolyte can be evenly distributed on the surface of the mold. Thereby reducing the problems of local overheating and uneven electrolysis during the electrolysis process, and improving the processing quality and consistency. In addition, the electrolyte can take away the heat from the surface of the mold to be processed 130 during the circulation process, playing a cooling role. The design of the water outlet pipe 1431 located at the upper part of the mold can ensure that the electrolyte can directly contact the high temperature area of the mold when it flows out, thereby enhancing the cooling effect and reducing the risk of deformation of the mold to be processed 130 due to overheating.

[0045] Reference Figure 6 The magnetic bottom platform 141 is provided with an adjustment track 1411, a first position adjustment unit 1412 and a second position adjustment unit 1413. The first position adjustment unit 1412 and the second position adjustment unit 1413 are both provided on the upper part of the adjustment track 1411. The first position adjustment unit 1412 is connected to one side of the first fixed unit 142, and the second position adjustment unit 1413 is connected to the other side of the first fixed unit 142. The first position adjustment unit 1412 includes a first movable slider 14121, a first pillar 14122 and a third connecting member 14123. The third connecting member 14123 is respectively connected to one end of the first fixed unit 142 and the first movable slider Block 14121 is connected, the third connecting member 14123 is provided with a first movable slide groove 14124, the first pillar 14122 runs through the first movable slide groove and is connected to the bottom of the first placement groove 140, the second position adjustment unit 1413 includes a second movable slider 14131, a second pillar 14132 and a fourth connecting member 14133, the fourth connecting member 14133 is respectively connected to the other end of the first fixed unit 142 and the second movable slider 14131, the fourth connecting member 14133 is provided with a second movable slide groove 14134, the second pillar 14132 runs through the second movable slide groove 14134 and is connected to the bottom of the first placement groove 140.

[0046] It should be noted that both the first position adjustment unit 1412 and the second position adjustment unit 1413 are arranged on the upper part of the adjustment track 1411. By sliding the first moving slider 14121 and the second moving slider 14131 on the adjustment track 1411, high-precision adjustment of the position of the first fixing unit 142 is achieved. The first support column 14122 and the second support column 14132 respectively penetrate through the first moving chute and the second moving chute and are connected to the bottom of the first placement groove 140, which not only enhances the stability of the entire magnetic adsorption base 141, but also enables the first fixing unit 142 to maintain smooth movement during the adjustment process, avoiding processing errors caused by shaking or instability. Through the independent adjustment of the first position adjustment unit 1412 and the second position adjustment unit 1413, the position and angle of the first fixing unit 142 can be flexibly adjusted to meet the processing requirements of workpieces of different sizes and shapes, thereby improving the adaptability and flexibility of the magnetic adsorption base 141 and enabling it to be widely used in various processing scenarios. The design of the magnetic adsorption base 141 makes the installation and maintenance of the first position adjustment unit 1412 and the second position adjustment unit 1413 relatively simple. The staff can easily disassemble and replace damaged components without having to perform large-scale disassembly of the entire magnetic adsorption base 141. This reduces the maintenance cost and time cost of the mold manufacturing device and improves the reliability and service life of the equipment. The design of the magnetic adsorption base 141 takes into account safety and operation convenience. The adjustment of the position of the first fixing unit 142 can be achieved through simple operations, reducing the operation difficulty and complexity.

[0047] The mold manufacturing device is also provided with a display module. The display module is respectively connected to the control module and the horizontal monitoring unit 120. The display module is used to display the horizontal information of the mold 130 to be processed obtained by the horizontal monitoring unit 120, and the control module adjusts the etching module 200 according to the horizontal information.

[0048] It should be noted that the display module can display in real time the horizontal information of the mold 130 to be processed obtained by the horizontal monitoring unit 120. This enables the operator to intuitively understand the current horizontal state of the mold without the need for additional measurement or inspection work, thereby improving work efficiency. According to the horizontal information displayed on the display module, the control module can precisely adjust the etching module 200 to ensure the uniformity and consistency during the operation of the copper tapping 240 in the etching process, avoiding problems such as uneven etching caused by insufficient mold levelness, and improving the processing quality and product qualification rate. Through automated display and control, the manual detection and adjustment work of the mold levelness are reduced. This not only reduces the labor intensity but also reduces the errors and mistakes caused by human factors, improving the stability and reliability of the production process. The combined use of the display module 300 and the control module enables the mold manufacturing device to adapt to the processing requirements of molds of different sizes and shapes. The operator can flexibly adjust the working parameters of the etching module 200 according to the horizontal information on the display module to meet the processing requirements of different molds. The display module can not only display the horizontal information of the mold but also cooperate with the control module for fault diagnosis. When there is a problem with the mold levelness, corresponding abnormal information will be displayed on the display module to help the operator quickly locate the problem and take corresponding solutions.

[0049] The above has specifically described the preferred embodiments of the present invention. However, the present invention is not limited to the above-mentioned embodiments. Those skilled in the art can make various equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included within the scope defined by the claims of the present invention.

Claims

1. A mold manufacturing device, characterized in that, Including: A control module; A mold processing module, the mold processing module is connected to the control module. The mold processing module includes a first body, a horizontal monitoring unit and a mold to be processed. The horizontal monitoring unit is respectively connected to the mold to be processed and the control module. The first body is provided with a first placement groove. Inside the first placement groove, there are a magnetic adsorption base, a first fixing unit and an electrolyte circulation unit. The magnetic adsorption base is arranged at the bottom of the first placement groove and is respectively connected to the mold to be processed and the first fixing unit. The electrolyte circulation unit is arranged inside the first placement groove and is connected to the first fixing unit. The magnetic adsorption base is used for adsorbing the mold to be processed. The electrolyte circulation unit is used for circulating and supplying electrolyte to the first placement groove. The first fixing unit is used for fixing the magnetic adsorption base; An etching module, the etching module is respectively connected to the control module and the mold processing module. The etching module is used for etching the surface of the mold to be processed.

2. The mold manufacturing apparatus according to claim 1, characterized in that, The etching module includes a second body, a first connecting piece, a robotic arm and a copper tapping tool. One end of the first connecting piece is connected to the second body. The other end of the first connecting piece is connected to one end of the robotic arm. The other end of the robotic arm is connected to the copper tapping tool.

3. The mold manufacturing apparatus according to claim 2, wherein The robotic arm holds the copper tapping tool by air suction.

4. The mold manufacturing device according to claim 1, characterized in that, At the notch of the first placement groove, there is a placement unit. The placement unit includes a first fixing device, a second connecting piece and a plurality of copper tapping tool fixing clips. One side of the second connecting piece is connected to the first fixing device. The other side of the second connecting piece is connected to the plurality of copper tapping tool fixing clips.

5. The mold manufacturing device according to claim 4, characterized in that, The first fixing device is provided with a second placement groove. Inside the second placement groove, there are a first adjusting plate and a plurality of second adjusting plates. The first adjusting plate is provided with a first connecting portion and a second connecting portion. The first connecting portion is connected to the second adjusting plates. One side of the plurality of second adjusting plates close to the second connecting portion forms a third connecting portion. The second connecting portion is connected to the first end of the second connecting piece. The third connecting portion is connected to the second end of the second connecting piece. The third end of the second connecting piece is provided with a first extended plane. The plurality of copper tapping tool fixing clips are arranged on the upper part of the first extended plane.

6. The mold manufacturing device according to claim 5, wherein, The copper tapping tool fixing clip is provided with a connecting portion and a fixing portion. The connecting portion is connected to the first extended plane. The fixing portion is used for fixing copper tapping tools of different sizes.

7. The mold manufacturing apparatus according to claim 1, characterized in that, The electrolyte circulation unit includes a water outlet pipe, a water pump and a plurality of water suction pipes. The water pump is respectively connected to the water outlet pipe and the water suction pipes. The water outlet pipe is arranged above the first fixing unit. The water outlet of the water outlet pipe is arranged above the mold to be processed.

8. The mold manufacturing device according to claim 1, wherein The magnetic bottom table is provided with an adjustment track, a first position adjustment unit and a second position adjustment unit. The first position adjustment unit and the second position adjustment unit are both arranged on the upper part of the adjustment track. The first position adjustment unit is connected to one side of the first fixing unit, and the second position adjustment unit is connected to the other side of the first fixing unit. The first position adjustment unit includes a first moving slider, a first support pillar and a third connecting member. The third connecting member is respectively connected to one end of the first fixing unit and the first moving slider. The third connecting member is provided with a first moving chute. The first support pillar penetrates through the first moving chute and is connected to the bottom of the first placing groove. The second position adjustment unit includes a second moving slider, a second support pillar and a fourth connecting member. The fourth connecting member is respectively connected to the other end of the first fixing unit and the second moving slider. The fourth connecting member is provided with a second moving chute. The second support pillar penetrates through the second moving chute and is connected to the bottom of the first placing groove.

9. The mold manufacturing apparatus according to claim 1, wherein The mold manufacturing device is further provided with a display module, which is respectively connected to the control module and the horizontal monitoring unit. The display module is used to display the horizontal information of the mold to be processed obtained by the horizontal monitoring unit, and the control module adjusts the etching module according to the horizontal information.

10. A metal plate mold manufacturing machine, characterized in that, Comprising: The mold manufacturing device according to any one of claims 1 to 9.

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