A battery pack real-time clock system

Abstract

The present invention discloses a real-time clock system for a battery pack, which belongs to the field of battery pack management technology and includes an MCU; the MCU is electrically connected to a low-voltage conversion module, which is electrically connected to an isolation module; the communication interface of the MCU is connected to the communication interface of the isolation module. The isolation module is electrically connected to a high-voltage acquisition module and an RTC; the communication interface of the high-voltage acquisition module is connected to the communication interface of the isolation module; the communication interface of the RTC is connected to the communication interface of the isolation module or the communication interface of the high-voltage acquisition module; the RTC is electrically connected to a high-voltage conversion module, which is connected to the battery pack; and the low-voltage conversion module is connected to a low-voltage power supply. The present invention ensures that the real-time clock function of the battery pack operates normally under any working conditions, and ensures the normal operation of SOX-related functions. The normal operation of the real-time clock under all working conditions is achieved through the lowest cost increase and the simplest solution change.

Description

Technical Field

[0001] The present invention relates to the technical field of battery pack management, and in particular to a battery pack real-time clock system. Background Art

[0002] To improve the accuracy of battery pack SOX estimation and enhance the end-user experience, the battery pack BMS requires an RTC (real-time clock) function for time counting. For example, the SOC function relies on an OCV lookup table for correction, and the accuracy of the OCV lookup table is related to the length of time the battery pack is stationary. The battery pack SOH is strongly correlated not only with the number of charge and discharge cycles (cycle life) but also with the length of time the battery pack is stationary (calendar life).

[0003] In a car, due to the presence of a 12V or 24V low-voltage battery, the BMS will continue to operate in a charged state when the battery pack is in the car. In electric aircraft, a 28V low-voltage power supply also provides power to the BMS during operation.

[0004] Conventional solution 1 (such as Figure 3 As shown in the figure): Converts 12V, 24V or 28V power from the low-voltage battery to 5V normal power to power the RTC function of the BMS and maintain its normal operation. Once the low-voltage power supply is lost, the RTC function will also stop operating.

[0005] When a low-voltage power supply is present, the low-voltage power chip converts the battery power to a low-voltage power supply, LV_5V (using the system's internal power supply of 5V as an example; other operating levels apply equally). LV_5V powers the MCU and RTC chips. Simultaneously, LV_5V powers the high-voltage data acquisition ADC through an isolation module. Data communication occurs between the MCU and the RTC, and this communication is achieved via the isolation chip. In single-battery pack mode (when the battery pack is offline and not installed in the power system, or when the battery swap mode is removed from the car or aircraft), if an additional low-voltage power supply network is not provided, the BMS system loses its low-voltage power supply and the RTC timing function ceases. Due to the loss of RTC functionality, SOX-related functions that rely heavily on RTC timing cannot function normally.

[0006] High cost option 2 (such as Figure 4 As shown in Figure 1, the overall architecture is similar to conventional solution 1, with the addition of a high-voltage to low-voltage power supply. This power supply draws power from the battery pack's total voltage and converts the high voltage into a low-voltage supply via an isolation transformer. This power supply circuit ensures normal RTC operation when the low-voltage battery loses power. However, the high-voltage to low-voltage power supply circuit is complex, costly, and consumes significant power.

[0007] Based on this, the present invention designs a battery pack real-time clock system to solve the above problems. Summary of the Invention

[0008] In view of the above-mentioned shortcomings of the prior art, the present invention provides a battery pack real-time clock system.

[0009] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0010] A battery pack real-time clock system, comprising an MCU;

[0011] The MCU is electrically connected to a low-voltage conversion module, and the low-voltage conversion module is electrically connected to an isolation module;

[0012] The communication interface of the MCU is connected to the communication interface of the isolation module;

[0013] The isolation module is electrically connected to the high voltage acquisition module and the RTC;

[0014] The communication interface of the high-voltage acquisition module is connected to the communication interface of the isolation module;

[0015] The communication interface of the RTC is connected to the communication interface of the isolation module or the communication interface of the high-voltage acquisition module;

[0016] The RTC is electrically connected to a high-voltage conversion module, which is connected to a battery pack;

[0017] The low voltage conversion module is connected to the low voltage power supply.

[0018] Furthermore, the communication interface includes at least one data sending pin and at least one data receiving pin.

[0019] Furthermore, when the communication interface of the RTC is connected to the communication interface of the isolation module, the high-voltage acquisition module and the RTC contain one set of communication interfaces, the isolation module contains four sets of communication interfaces, and the MCU contains two sets of communication interfaces.

[0020] Furthermore, when the communication interface of the RTC is connected to the communication interface of the high-voltage acquisition module, the MCU and the RTC have one set of communication interfaces, the isolation module has two sets of communication interfaces, and the high-voltage acquisition module has two sets of communication interfaces.

[0021] Furthermore, the low voltage conversion module is a low voltage power supply chip.

[0022] Furthermore, the isolation module is a high and low voltage isolation chip.

[0023] Furthermore, the high voltage acquisition module is an ASIC chip.

[0024] Furthermore, the high-voltage conversion module includes but is not limited to an LDO, an LDO-like or a DC / DC power supply.

[0025] Beneficial Effects: This invention adjusts the RTC to the high-voltage range, preventing it from ceasing operation in the event of a loss of low-voltage power supply. By adding a high-voltage conversion module, the high-voltage range directly supplies power to the RTC after a loss of low-voltage power supply. This ensures the normal operation of the real-time clock and SOX-related functions under all operating conditions. This achieves the normal operation of the real-time clock under all operating conditions with the lowest cost and simplest solution change. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0027] Figure 1 This is a block diagram of a battery pack real-time clock system according to embodiment 1 of the present invention;

[0028] Figure 2 This is a block diagram of a battery pack real-time clock system according to embodiment 2 of the present invention;

[0029] Figure 3 Real-time clock system frame for existing battery packs Figure 1 ;

[0030] Figure 4 Real-time clock system frame for existing battery packs Figure 2 . DETAILED DESCRIPTION

[0031] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0032] The present invention will be further described below with reference to the embodiments.

[0033] Example 1: Please refer to Figure 1 , a battery pack real-time clock system, including an MCU;

[0034] The MCU is electrically connected to a low-voltage conversion module, and the low-voltage conversion module is electrically connected to an isolation module;

[0035] The communication interface of the MCU is connected to the communication interface of the isolation module.

[0036] The isolation module is electrically connected to the high voltage acquisition module and the RTC;

[0037] The communication interface of the high-voltage acquisition module is connected to the communication interface of the isolation module;

[0038] The communication interface of the RTC is connected to the communication interface of the isolation module;

[0039] The RTC is electrically connected to a high-voltage conversion module, which is connected to a battery pack;

[0040] The low voltage conversion module is connected to a 12V, 24V or 28V power supply.

[0041] The communication interface includes at least one data transmission pin and at least one data reception pin.

[0042] The low voltage conversion module is a low voltage power supply chip.

[0043] The isolation module is a high and low voltage isolation chip.

[0044] The high voltage acquisition module is an ASIC chip.

[0045] The high-voltage conversion module includes but is not limited to an LDO, an LDO-like or a DC / DC power supply.

[0046] When the communication interface of the RTC is connected to the communication interface of the isolation module, the high-voltage acquisition module and the RTC contain one set of communication interfaces, the isolation module contains four sets of communication interfaces, and the MCU contains two sets of communication interfaces.

[0047] The data sending pins of the first group of communication interfaces of the MCU are connected to the data receiving pins of the first group of communication interfaces of the isolation module;

[0048] The data receiving pins of the first group of communication interfaces of the MCU are connected to the data sending pins of the first group of communication interfaces of the isolation module;

[0049] The data receiving pins of the second group of communication interfaces of the isolation module are connected to the data sending pins of a group of communication interfaces of the high voltage acquisition module;

[0050] The data sending pins of the second group of communication interfaces of the isolation module are connected to the data receiving pins of a group of communication interfaces of the high voltage acquisition module;

[0051] The data transmission pins of the second communication interface of the MCU are connected to the data receiving pins of the third communication interface of the isolation module;

[0052] The data receiving pins of the second communication interface of the MCU are connected to the data sending pins of the third communication interface of the isolation module;

[0053] The data receiving pins of the fourth group of communication interfaces of the isolation module are connected to the data sending pins of a group of communication interfaces of the RTC;

[0054] The data sending pins of the fourth group of communication interfaces of the isolation module are connected to the data receiving pins of a group of communication interfaces of the RTC.

[0055] When the BMS is powered by low voltage, the low-voltage power chip converts the battery power to LV_5V. The LV_5V voltage powers the MCU. Simultaneously, the LV_5V voltage powers the ASIC and RTC through an isolation module. The RTC communicates with the MCU via the high-low voltage isolation chip.

[0056] The high-voltage power module directly converts the entire battery pack's high voltage into an HV_5V_2 power supply. The RTC can independently draw power from either HV_5V or HV_5V_2. If the low-voltage power supply fails, the RTC maintains operation using HV_5V_2. The RTC's normal operating current is less than 10mA, simplifying the high-voltage conversion module's power supply design. This high-voltage power supply can be achieved with minimal architectural changes to the current BMS design, resulting in minimal cost savings.

[0057] Adjusting the RTC to the high-voltage range prevents it from ceasing operation if the low-voltage power supply is lost while in the low-voltage range. Adding a high-voltage conversion module allows the high-voltage range to directly power the RTC after a loss of low-voltage power. This ensures the normal operation of the real-time clock and SOX-related functions under all operating conditions. This achieves the normal operation of the real-time clock under all operating conditions with the lowest cost and simplest solution change.

[0058] Example 2: Please refer to Figure 2 ;

[0059] A battery pack real-time clock system, comprising an MCU;

[0060] The MCU is electrically connected to a low-voltage conversion module, and the low-voltage conversion module is electrically connected to an isolation module;

[0061] The communication interface of the MCU is connected to the communication interface of the isolation module.

[0062] The isolation module is electrically connected to the high voltage acquisition module and the RTC;

[0063] The communication interface of the high-voltage acquisition module is connected to the communication interface of the isolation module;

[0064] The communication interface of the RTC is connected to the communication interface of the high voltage acquisition module;

[0065] The RTC is electrically connected to a high-voltage conversion module, which is connected to a battery pack;

[0066] The low voltage conversion module is connected to a 12V, 24V or 28V power supply.

[0067] The communication interface includes at least one data transmission pin and at least one data reception pin.

[0068] The low voltage conversion module is a low voltage power supply chip.

[0069] Low voltage conversion module: The low voltage in passenger cars is 9-16V, or the low voltage in commercial vehicles is 18-32V, or the low voltage in commercial aircraft is 22-30.3V.

[0070] High-voltage conversion module: The total voltage of the high-voltage battery pack in electric vehicles is 100V~1000V, and the total voltage of the high-voltage battery pack in commercial vehicles or commercial aircraft is about 1500V;

[0071] The isolation module is a high and low voltage isolation chip.

[0072] The high voltage acquisition module is an ASIC chip.

[0073] The high-voltage conversion module includes but is not limited to an LDO, an LDO-like or a DC / DC power supply.

[0074] When the communication interface of the RTC is connected to the communication interface of the high-voltage acquisition module, the MCU and the RTC have one set of communication interfaces, the isolation module has two sets of communication interfaces, and the high-voltage acquisition module has two sets of communication interfaces.

[0075] A data transmission pin of a group of communication interfaces of the MCU is connected to a data receiving pin of a first group of communication interfaces of the isolation module;

[0076] A data receiving pin of a group of communication interfaces of the MCU is connected to a data transmitting pin of a first group of communication interfaces of the isolation module;

[0077] The data receiving pins of the second group of communication interfaces of the isolation module are connected to the data sending pins of a group of communication interfaces of the high voltage acquisition module;

[0078] The data sending pins of the second group of communication interfaces of the isolation module are connected to the data receiving pins of a group of communication interfaces of the high voltage acquisition module;

[0079] The data sending pins of the second communication interface of the high voltage acquisition module are connected to the data receiving pins of a communication interface of the RTC;

[0080] The data receiving pins of the second group of communication interfaces of the high-voltage acquisition module are connected to the data sending pins of a group of communication interfaces of the RTC.

[0081] When the BMS is powered by low voltage, the low-voltage power chip converts the battery power to LV_5V. LV_5V powers the MCU. Simultaneously, LV_5V powers the ASIC and RTC through the isolation module. The RTC no longer communicates directly with the MCU, but instead communicates with the ASIC. Data communication between the ASIC and MCU occurs via the isolation chip, with the ASIC acting as a bridge between the RTC and MCU.

[0082] The high-voltage power module directly converts the entire battery pack's high voltage into an HV_5V_2 power supply. The RTC draws power independently from either HV_5V or HV_5V_2. If the low-voltage power supply fails, the RTC maintains operation using HV_5V_2. The RTC's normal operating current is less than 10mA, simplifying the high-voltage conversion module's power supply design. This allows for high-voltage power supply integration with minimal architectural changes to existing BMS designs, resulting in minimal cost savings.

[0083] Adjusting the RTC to the high-voltage range prevents it from ceasing operation if the low-voltage power supply is lost while in the low-voltage range. Adding a high-voltage conversion module allows the high-voltage range to directly power the RTC after a loss of low-voltage power. This ensures the normal operation of the real-time clock and SOX-related functions under all operating conditions. This achieves the normal operation of the real-time clock under all operating conditions with the lowest cost and simplest solution change.

[0084] MCU: microprogrammed control unit, microprogram controller or single chip microcomputer.

[0085] BMS: battery management system, battery management system.

[0086] SOX: state of X, a general term for the battery pack's state of charge, which can be further subdivided into SOC, SOH, etc.

[0087] SOC: state of charge.

[0088] SOH: state of health, state of health.

[0089] OCV: open circuit voltage.

[0090] RTC: real time clock.

[0091] ADC: analog digital converter.

[0092] LDO: Low dropout regulator, low voltage difference linear regulator,

[0093] DC / DC: direct current to direct current, DC to DC power supply.

[0094] ASIC: application specific integrated circuit.

[0095] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A battery pack real-time clock system, including an MCU, characterized in that: The MCU is electrically connected to a low-voltage conversion module, and the low-voltage conversion module is electrically connected to an isolation module; The communication interface of the MCU is connected to the communication interface of the isolation module; The isolation module is electrically connected to the high voltage acquisition module and the RTC; The communication interface of the high-voltage acquisition module is connected to the communication interface of the isolation module; The communication interface of the RTC is connected to the communication interface of the isolation module or the communication interface of the high-voltage acquisition module; The RTC is electrically connected to a high-voltage conversion module, which is connected to a battery pack; The low voltage conversion module is connected to the low voltage power supply; The communication interface includes at least one data transmission pin and at least one data reception pin; When the communication interface of the RTC is connected to the communication interface of the isolation module, the high-voltage acquisition module and the RTC have a group of communication interfaces, the isolation module has four groups of communication interfaces, and the MCU has two groups of communication interfaces; the data sending pins of the first group of communication interfaces of the MCU are connected to the data receiving pins of the first group of communication interfaces of the isolation module; the data receiving pins of the first group of communication interfaces of the MCU are connected to the data sending pins of the first group of communication interfaces of the isolation module; the data receiving pins of the second group of communication interfaces of the isolation module are connected to the data receiving pins of the first group of communication interfaces of the isolation module; the data sending pins of the second group of communication interfaces of the isolation module are connected to the data receiving pins of the group of communication interfaces of the high-voltage acquisition module; the data sending pins of the second group of communication interfaces of the isolation module are connected to the data receiving pins of the group of communication interfaces of the high-voltage acquisition module; the data sending pins of the second group of communication interfaces of the MCU are connected to the data sending pins of the third group of communication interfaces of the isolation module; the data receiving pins of the second group of communication interfaces of the MCU are connected to the data sending pins of the third group of communication interfaces of the isolation module; the data receiving pins of the fourth group of communication interfaces of the isolation module are connected to the data sending pins of the group of communication interfaces of the RTC; the data sending pins of the fourth group of communication interfaces of the isolation module are connected to the data receiving pins of the group of communication interfaces of the RTC; when the BMS low-voltage power supply exists, the low-voltage power supply chip converts the battery power supply into low-voltage power supply LV_5V to power the MCU; LV_5V The ASIC chip and RTC are powered by the isolation module, and the RTC and MCU communicate with each other through the high-low voltage isolation chip; the high-voltage area power module directly converts the high voltage of the battery pack into HV_5V_2 power, and the RTC independently draws power from HV_5V or HV_5V_2; when the low-voltage area power is lost, the RTC is powered by HV_5V_2; when the communication interface of the RTC is connected to the communication interface of the high-voltage acquisition module, the MCU and RTC have one set of communication interfaces, the isolation module has two sets of communication interfaces, and the high-voltage acquisition module has two sets of communication interfaces; the data sending pins of one set of communication interfaces of the MCU are connected to the first set of communication pins of the isolation module The data receiving pins of a communication interface of the MCU are connected to the data sending pins of the first communication interface of the isolation module; the data receiving pins of the second communication interface of the isolation module are connected to the data sending pins of a group of communication interfaces of the high-voltage acquisition module; the data sending pins of the second communication interface of the isolation module are connected to the data receiving pins of a group of communication interfaces of the high-voltage acquisition module; the data sending pins of the second communication interface of the high-voltage acquisition module are connected to the data receiving pins of a group of communication interfaces of the RTC; the data receiving pins of the second communication interface of the high-voltage acquisition module are connected to the data sending pins of a group of communication interfaces of the RTC;When the BMS is powered by low voltage, the low-voltage power chip converts the battery power to low-voltage LV_5V to power the MCU. LV_5V then powers the ASIC and RTC through the isolation module. The RTC no longer communicates directly with the MCU, but instead with the ASIC. The ASIC and MCU communicate via the isolation chip, with the RTC and MCU communicating via the ASIC as a bridge. The high-voltage power module directly converts the battery pack's high voltage to HV_5V_2 power, and the RTC draws power independently from either HV_5V or HV_5V_2. When the low-voltage power is lost, the RTC is powered by HV_5V_2.

2. The battery pack real-time clock system according to claim 1, characterized in that: The low voltage conversion module is a low voltage power supply chip.

3. The battery pack real-time clock system according to claim 2, characterized in that: The isolation module is a high and low voltage isolation chip.

4. The battery pack real-time clock system according to claim 2, characterized in that: The high voltage acquisition module is an ASIC chip.

5. The battery pack real-time clock system according to claim 2, characterized in that: The high-voltage conversion module includes but is not limited to an LDO, an LDO-like or a DC / DC power supply.

Images