Backlight current control method and device, electronic equipment and computer storage medium

By dynamically adjusting the backlight current of the light emitting diode chip, the problem of the LED cannot emit light normally after cracking is solved, extending the service life of the LED and improving the life of the backlight of the entire machine.

CN120375769APending Publication Date: 2025-07-25GUANGZHOU SHIYUAN ELECTRONICS CO LTD +1
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Patent Information

Application Number
CN202410108412.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-01-25
Publication Date
2025-07-25

AI Technical Summary

Technical Problem

In the prior art, the driving current of the LED lamp is constant, resulting in the LED colloid being unable to emit light normally after cracking, reducing the service life of the entire machine backlight.

Method used

By obtaining the change in the light intensity in the backboard cavity of the entire machine equipment, calculating the brightness attenuation rate, and dynamically adjusting the backlight current of the light emitting diode chip to avoid LED dead lights caused by constant driving current.

Benefits of technology

After the LED cracking, the LED can still ensure that the light-emitting diode continues to emit normal light, extending the service life of the light-emitting diode, thereby improving the service life of the backlight of the entire machine.

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Abstract

The invention relates to the technical field of electronic equipment, and discloses a backlight current control method and device, electronic equipment and a computer storage medium, and the method comprises the steps: obtaining first illumination intensity in a backboard cavity in complete equipment at first time and second illumination intensity in the backboard cavity in the complete equipment at second time; based on the first time and the second time, determining the accumulated use duration of the complete machine equipment; based on the first illumination intensity, the second illumination intensity and the accumulated use duration, determining the brightness decay rate of the whole machine equipment; and adjusting the backlight current of a light emitting diode chip of the whole equipment based on the brightness decay rate. According to the invention, the backlight current of the light emitting diode chip in the whole machine equipment can be controlled according to the change of the brightness decay rate, the dead light of the light emitting diode caused by the constant driving current when the glue crack of the light emitting diode occurs is avoided, and the service life of the light emitting diode is prolonged, so that the service life of the whole machine backlight is prolonged.
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Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly relates to a backlight current control method, device, electronic device, and computer storage medium. Background Art

[0002] Currently, the backlights of commercial displays are basically based on light-emitting diodes (LEDs) as the light source, and the service life of the LED lamp determines the service life of the entire machine's backlight. Among the multiple materials that make up the LED lamp, the main encapsulating silicone resin is a high-molecular silicone resin material. Under long-term high-temperature, light radiation, and aerobic environmental conditions, its performance will gradually decline and deteriorate. The colloid will gradually harden, become brittle, turn yellow, and the light transmittance will also gradually decrease, ultimately leading to cracking of the LED colloid. In the traditional backlight method of the entire machine, the driving current of the LED lamp is constant. After the LED lamp undergoes colloid cracking, the LED lamp cannot emit light normally, reducing the service life of the LED lamp and thus reducing the service life of the entire machine's backlight. Summary of the Invention

[0003] This application aims to at least solve one of the technical problems existing in the related art. To this end, the embodiments of this application provide a backlight current control method, device, electronic device, and computer storage medium, which can improve the service life of the entire machine's backlight.

[0004] In a first aspect, the embodiments of this application provide a backlight current control method, including:

[0005] Obtaining a first light intensity in the backplane cavity of the entire machine device at a first time and a second light intensity in the backplane cavity of the entire machine device at a second time;

[0006] Determining the cumulative usage duration of the entire machine device based on the first time and the second time;

[0007] Determining the brightness attenuation rate of the entire machine device based on the first light intensity, the second light intensity, and the cumulative usage duration;

[0008] Adjusting the backlight current of the light-emitting diode chip of the entire machine device based on the brightness attenuation rate.

[0009] In a second aspect, the embodiments of this application provide a backlight current control device, including:

[0010] An obtaining module, configured to obtain a first light intensity in the backplane cavity of the entire machine device at a first time and a second light intensity in the backplane cavity of the entire machine device at a second time;

[0011] A first determining module, configured to determine the cumulative usage duration of the entire machine device based on the first time and the second time;

[0012] A second determination module, configured to determine a brightness attenuation rate of the entire device based on the first light intensity, the second light intensity, and the cumulative usage duration;

[0013] A backlight current control module, configured to adjust a backlight current of a light-emitting diode chip of the entire device based on the brightness attenuation rate.

[0014] In a third aspect, an embodiment of the present application further provides an electronic device, including a memory storing multiple instructions; a processor loads the instructions from the memory to execute any one of the backlight current control methods provided by the embodiments of the present application.

[0015] In a fourth aspect, an embodiment of the present application further provides a computer-readable storage medium storing multiple instructions, and the instructions are suitable for being loaded by a processor to execute any one of the backlight current control methods provided by the embodiments of the present application.

[0016] In a fifth aspect, an embodiment of the present application further provides a computer program product, including a computer program or instructions, and when the computer program or instructions are executed by a processor, any one of the backlight current control methods provided by the embodiments of the present application is implemented.

[0017] Embodiments of the present application can dynamically control the backlight current of the light-emitting diode chip in the entire device according to the change of the brightness attenuation rate, avoid the dead lamp of the light-emitting diode caused by a constant driving current when the light-emitting diode has glue cracking, ensure that the light-emitting diode can continue to emit light normally after the light-emitting diode has glue cracking, improve the service life of the light-emitting diode, and thus improve the service life of the entire backlight. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for description in the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 is one of the flow diagrams of the backlight current control method provided by the embodiments of the present application;

[0020] Figure 2 is a schematic diagram of an array structure provided by the embodiments of the present application;

[0021] Figure 3 is another flow diagram of the backlight current control method provided by the embodiments of the present application;

[0022] Figure 4It is a schematic structural diagram of the backlight current control device provided in the embodiments of the present application;

[0023] Figure 5 It is a schematic structural diagram of the electronic device provided in the embodiments of the present application. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present application. At the same time, in the description of the embodiments of the present application, the terms "first", "second", etc. are only used for distinguishing descriptions, and cannot be understood as indicating or implying relative importance. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the embodiments of the present application, "a plurality of" means two or more, unless otherwise specifically defined.

[0025] In the field of backlight, the backlight of current commercial displays is basically based on light-emitting diodes (LEDs) as the light source, and the service life of the LED lamp determines the service life of the whole machine backlight. Among the multiple materials that make up the LED lamp, the main encapsulation silicone resin is a high-molecular silicone resin material. Under long-term high-temperature, light radiation, and aerobic environmental conditions, its performance will gradually decline and deteriorate. The colloid will gradually harden, become brittle, turn yellow, and the light transmittance will also gradually decrease, eventually leading to cracking of the LED colloid. In the existing whole-machine backlight method, the driving current of the LED lamp is constant. After the LED lamp undergoes colloid cracking, the LED lamp cannot emit light normally, reducing the service life of the LED lamp. Therefore, the existing whole-machine backlight method will reduce the service life of the whole-machine backlight.

[0026] To solve the technical problems existing in the prior art, the embodiments of the present application obtain the first light intensity in the backplane cavity of the whole machine device at the first time and the second light intensity in the backplane cavity of the whole machine device at the second time; determine the cumulative usage duration of the whole machine device based on the first time and the second time; determine the brightness attenuation rate of the whole machine device based on the first light intensity, the second light intensity, and the cumulative usage duration; and adjust the backlight current of the light-emitting diode chip of the whole machine device based on the brightness attenuation rate. Therefore, the embodiments of the present application can dynamically control the backlight current of the light-emitting diode chip in the whole machine device according to the change of the brightness attenuation rate, avoid the dead lamp of the light-emitting diode caused by the constant driving current when the light-emitting diode undergoes colloid cracking, ensure that the light-emitting diode can continue to emit light normally after the light-emitting diode undergoes colloid cracking, improve the service life of the light-emitting diode, and thus improve the service life of the whole-machine backlight.

[0027] The embodiments of the present application provide a backlight current control method, apparatus, electronic device, and computer storage medium. Specifically, the embodiments of the present application will be described from the perspective of the backlight current control apparatus, which can be specifically integrated in the electronic device, that is, the backlight current control method of the embodiments of the present application can be executed by the electronic device. Optionally, the electronic device includes a terminal device. The terminal device can be a mobile phone, a tablet computer, a smart Bluetooth device, a laptop computer, a game console, or a personal computer (PC), a smart interactive tablet, and other devices. Optionally, the electronic device includes a server, which can be an independent server or a server network or server cluster composed of servers, including but not limited to computers, network hosts, single network servers, network server sets, or cloud servers composed of servers. Among them, the cloud server is composed of a large number of computers or network servers based on cloud computing.

[0028] It should be noted that the description order of the following embodiments does not limit the preferred order of the embodiments. Although the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in a different order from that shown in the drawings.

[0029] Optionally, the embodiments of the present application take the backlight current control apparatus as the execution subject for illustration. The following will be described in detail with reference to the accompanying drawings. Refer to Figure 1 , Figure 1 is one of the schematic flowcharts of the backlight current control method provided in the embodiments of the present application. The specific process of the backlight current control method provided in the embodiments of the present application can be as follows: Steps 10 to 40, including:

[0030] Step 10, obtain the first light intensity in the backplane cavity of the whole machine device at the first time and the second light intensity in the backplane cavity of the whole machine device at the second time.

[0031] It should be noted that in the embodiments of the present application, the backlight of the whole machine device is exemplified by a light emitting diode (LED) as the light source.

[0032] Furthermore, during the light-emitting process of the light-emitting diode (LED), the LED may experience glue cracking. When the LED cracks, the current of the LED may change, resulting in a change in the light-emitting brightness of the LED, and thus causing a change in the light intensity within the backplane cavity of the entire device. Therefore, during each backlight current control, the backlight current control device needs to obtain the light intensity (first light intensity) within the backplane cavity of the entire device at the current time (first time) through the photosensitive probe installed in the backlight current control device, and obtain the light intensity (second light intensity) within the backplane cavity of the entire device at the second time through the photosensitive probe. Here, the unit of light intensity is candela (Candela), which measures the intensity of the light source. The second time is the previous time of the first time, that is, the first time and the second time are two adjacent and consecutive times.

[0033] Step 20: Determine the cumulative usage duration of the entire device based on the first time and the second time.

[0034] Optionally, the backlight current control device determines the cumulative usage duration of the entire device according to the first time and the second time, specifically: calculate the time difference between the first time and the second time, and the time difference is the cumulative usage duration, that is, the time interval between the first time and the second time. The unit of the cumulative usage duration can be hours, minutes, etc., depending on the actual setting. In one embodiment, the second time is 23:59 on January 1, 2024, and the first time is 11:59 on January 3, 2024, and the cumulative usage duration is 36 hours.

[0035] Step 30: Determine the brightness attenuation rate of the entire device based on the first light intensity, the second light intensity, and the cumulative usage duration.

[0036] It should be noted that for a normal LED, the brightness attenuation will accelerate sharply after glue cracking. Therefore, it is necessary to calculate the brightness attenuation rate of the light intensity at the current time (first time) relative to the light intensity at the second time.

[0037] Therefore, the backlight current control device calculates the brightness attenuation rate of the entire device from the second time to the first time according to the first light intensity, the second light intensity, and the cumulative usage duration, specifically:

[0038] Optionally, the backlight current control device calculates the light intensity difference according to the first light intensity and the second light intensity, that is, the light intensity difference = |first light intensity - second light intensity|.

[0039] Further, the backlight current control device calculates the brightness attenuation rate according to the difference in light intensity and the cumulative usage duration, that is, brightness attenuation rate = difference in light intensity / cumulative usage duration. Therefore, the calculation formula for the brightness attenuation rate can be expressed as:

[0040] A = |(L1 - L2)| / (T1 - T2)

[0041] Where A is the brightness attenuation rate, L1 is the first light intensity, L2 is the second light intensity, T1 is the first time, and T2 is the second time.

[0042] Step 40: Adjust the backlight current of the light-emitting diode chips of the entire device based on the brightness attenuation rate.

[0043] Optionally, the backlight current control device compares the numerical value of the brightness attenuation rate with a preset rate threshold to obtain a comparison result. The preset rate threshold is set according to the actual situation. In one embodiment, the range of the preset rate threshold is [1.1, 1.5]. In actual application, the preset rate threshold is generally set to 1.2. The comparison result can be that the brightness attenuation rate is less than the preset rate threshold, or the brightness attenuation rate is greater than or equal to the preset rate threshold.

[0044] Further, if the comparison result is that the brightness attenuation rate is less than the preset rate threshold, the backlight current control device determines that there is no abnormal light-emitting diode LED in the light-emitting diode chips of the entire device, and executes the process of steps 10 to 40 at the next time after the first time.

[0045] Further, if the comparison result is that the brightness attenuation rate is greater than or equal to the preset rate threshold, the backlight current control device determines that there is an abnormal light-emitting diode LED in the light-emitting diode chips of the entire device, locates the abnormal light-emitting diode LED in the light-emitting diode chips, and controls the backlight current of the abnormal light-emitting diode LED, specifically as described in steps 401 to 403.

[0046] The embodiment of the present application can dynamically control the backlight current of the light-emitting diode chips in the entire device according to the change of the brightness attenuation rate, avoid the dead lamp of the light-emitting diode caused by a constant driving current when the light-emitting diode undergoes glue cracking, ensure that the light-emitting diode can still emit light normally after the light-emitting diode undergoes glue cracking, improve the service life of the light-emitting diode, and thus improve the service life of the entire device backlight.

[0047] To facilitate quickly locating the impact of light-emitting diodes (LEDs) on the backlight of the entire device, the LED chips of the entire device are modularized, that is, multiple LEDs are quantified in a predetermined array structure to obtain multiple groups of LEDs. Therefore, it can be understood that the LED chips include multiple groups of LEDs.

[0048] In an alternative embodiment, steps 401 to 403 are described as follows:

[0049] Step 401, obtain the backlight current control strategy of the entire device; the backlight current control strategy includes an overall control strategy and a local control strategy;

[0050] Step 402, if the backlight current control strategy is the overall control strategy, adjust the backlight current of the entire LED group according to the brightness attenuation rate; or,

[0051] Step 403, if the backlight current control strategy is the local control strategy, adjust the backlight current of the local LEDs in the LED group according to the brightness attenuation rate.

[0052] Optionally, the backlight current control device obtains the backlight current control strategy of the entire device, where the backlight current control strategy includes an overall control strategy and a local control strategy. The overall control strategy represents adjusting the backlight current of all LEDs in the LED group, and the local control strategy represents only needing to adjust the local LEDs with glue cracking (abnormal) in the LED group.

[0053] Therefore, if it is determined that the backlight current control strategy is the overall control strategy, the backlight current control device adjusts the backlight current of the entire LED group according to the brightness attenuation rate. If it is determined that the backlight current control strategy is the local control strategy, the backlight current of the local LEDs in the LED group is adjusted according to the brightness attenuation rate. It should be noted that the finally adjusted current magnitudes of the overall adjustment and the local adjustment are the same. The difference is that the overall adjustment adjusts the backlight current of all LEDs in the LED group to value A, and the local adjustment adjusts the backlight current of the LEDs with glue cracking (abnormal) in the LED group to value A. Adjusting the backlight current of the local LEDs in the LED group according to the brightness attenuation rate is as in steps 4031 to 4034.

[0054] The embodiments of the present application can flexibly adjust the backlight current of the LEDs in the LED group according to the overall control strategy and the local control strategy.

[0055] In an alternative embodiment, steps 4031 to 4034 are described as follows:

[0056] Step 4031, if the brightness attenuation rate is greater than or equal to the preset rate threshold, obtain the illumination intensity of each light-emitting diode in the light-emitting diode group and the array structure of the light-emitting diode group;

[0057] Step 4032, based on the first illumination intensity and the illumination intensity of each light-emitting diode, determine the target light-emitting diode with glue cracking in the light-emitting diode group;

[0058] Step 4033, obtain the target light-emitting area of the target light-emitting diode in the array structure;

[0059] Step 4034, based on the array structure and the target light-emitting area, control the backlight current of the target light-emitting diode.

[0060] Optionally, if the brightness attenuation rate is greater than or equal to the preset rate threshold, the backlight current control device determines that there is an abnormal light-emitting diode LED in the light-emitting diode group of the whole machine device, that is, there is a light-emitting diode LED with glue cracking. Therefore, the backlight current control device obtains the illumination intensity of each light-emitting diode in the light-emitting diode group and the array structure of the light-emitting diode group. The array structure includes multiple light-emitting areas, and each light-emitting area includes multiple light-emitting diodes.

[0061] In one embodiment, the array structure refers to Figure 2 as shown Figure 2 is the schematic diagram of the array structure provided by the embodiment of the present application. Figure 2 The array structure in

[0062] is an array structure of 5 light-emitting diode groups * 5 light-emitting diode groups, that is, the array structure includes 25 light-emitting diode groups, and each light-emitting diode group is a light-emitting diode group of 4 light-emitting diodes * 4 light-emitting diodes, that is, each light-emitting diode group includes 16 light-emitting diodes.

[0063] Optionally, the backlight current control device calculates the illumination intensity difference between the first illumination intensity and the illumination intensity of each light-emitting diode, that is, the illumination intensity difference of each light-emitting diode = the first illumination intensity - the illumination intensity of each light-emitting diode.

[0064] Further, the backlight current control device compares the illumination intensity difference of each light-emitting diode with the preset illumination intensity threshold to obtain a comparison result. Among them, the preset illumination intensity threshold is set according to the actual situation, and the comparison result can be that the illumination intensity difference is greater than or equal to the preset illumination intensity threshold, or the illumination intensity difference is less than the preset illumination intensity threshold.

[0065] Therefore, the backlight current control device determines the light-emitting diodes with the comparison result that the difference in light intensity is greater than or equal to the preset light intensity threshold as the target light-emitting diodes. Therefore, through the difference in light intensity, the embodiments of the present application can accurately locate the target light-emitting diodes with glue cracks.

[0066] Further, the backlight current control device obtains the target light-emitting area of the target light-emitting diodes in the array structure, and controls the backlight current of the target light-emitting diodes according to the array structure and the target light-emitting area, as specifically described in steps 40341 to 40344.

[0067] The embodiments of the present application can dynamically control the backlight current of the light-emitting diode group in the whole machine device according to the change of the brightness attenuation rate, avoid the dead lamp of the light-emitting diode caused by the constant drive current when the light-emitting diode has a glue crack, ensure that the light-emitting diode can continue to emit light normally after the light-emitting diode has a glue crack, improve the service life of the light-emitting diode, and thus improve the service life of the whole machine backlight.

[0068] In an optional embodiment, the descriptions of steps 40341 to 40344 are as follows:

[0069] Step 40341, obtain the central light-emitting area of the array structure and the current backlight current value of the target light-emitting diodes at the first time;

[0070] Step 40342, determine the area adjustment coefficient based on the central light-emitting area and the target light-emitting area;

[0071] Step 40343, calculate the glue crack degree coefficient of the target light-emitting diodes based on the light intensity of the target light-emitting diodes at the first time and the light intensity at the second time;

[0072] Step 40344, control the backlight current of the target light-emitting diodes based on the current backlight current value, the area adjustment coefficient, and the glue crack degree coefficient.

[0073] Optionally, the backlight current control device obtains the central light-emitting area of the array structure and the current backlight current value of the target light-emitting diodes at the first time. Further, the backlight current control device obtains the first center point position of the central light-emitting area and the second center point position of the target light-emitting area, and calculates the center point distance between the first center point position and the second center point position.

[0074] Further, the backlight current control device matches according to the center point distance and the preset mapping table to obtain the area adjustment coefficient, where the preset mapping table is an association relationship table pre-stored between the center point distance and its corresponding area adjustment coefficient. In one embodiment, the preset mapping table is shown in Table 1.

[0075] Table 1 Preset Mapping Table

[0076] Center point distance x ≤ 1 mm 1 mm < x ≤ 2 mm 2 mm < x ≤ 3 mm 3 mm < x ≤ 4 mm Region adjustment coefficient 1 0.8 0.5 0.2

[0077] Further, the backlight current control device obtains the light intensity at the glue crack limit of the target light-emitting diode, where the light intensity at the glue crack limit can be understood as the light intensity at the moment of glue crack, and the light intensity at the glue crack limit is preset.

[0078] Further, the backlight current control device calculates the glue crack degree coefficient of the target light-emitting diode according to the light intensity at the first time, the light intensity at the second time, and the light intensity at the glue crack limit of the target light-emitting diode, that is, the glue crack degree coefficient = (the light intensity at the first time - the light intensity at the second time) / the light intensity at the glue crack limit.

[0079] Further, the backlight current control device controls the backlight current of the target light-emitting diode according to the current backlight current value, the area adjustment coefficient, and the glue crack degree coefficient.

[0080] In the embodiment of the present application, the backlight current of the target light-emitting diode is controlled according to the current backlight current value, the area adjustment coefficient, and the glue crack degree coefficient, avoiding the dead lamp of the light-emitting diode caused by a constant driving current when the light-emitting diode has a glue crack, ensuring that the light-emitting diode can still emit light normally continuously after the glue crack occurs, improving the service life of the light-emitting diode, and thus improving the service life of the whole machine backlight.

[0081] In an optional embodiment, controlling the backlight current of the target light-emitting diode based on the current backlight current value, the area adjustment coefficient, and the glue crack degree coefficient includes:

[0082] Calculating a final adjustment coefficient based on the area adjustment coefficient and the glue crack degree coefficient;

[0083] Calculating a final backlight current value based on the current backlight current value and the final adjustment coefficient;

[0084] Controlling the backlight current of the target light-emitting diode with the final backlight current value.

[0085] Optionally, the backlight current control device calculates the final adjustment coefficient according to the area adjustment coefficient and the glue crack degree coefficient, that is, the final adjustment coefficient = the area adjustment coefficient * the glue crack degree coefficient.

[0086] Further, the backlight current control device calculates the final backlight current value according to the current backlight current value and the final adjustment coefficient, that is, the final backlight current value = the current backlight current value * the final adjustment coefficient.

[0087] Further, the backlight current control device uses the final backlight current value as the backlight current of the target light-emitting diode to control the operation of the target light-emitting diode.

[0088] In the embodiment of the present application, the backlight current of the target light-emitting diode is controlled according to the current backlight current value, the area adjustment coefficient, and the glue crack degree coefficient, avoiding the dead lamp of the light-emitting diode caused by a constant drive current when the light-emitting diode has a glue crack. After the light-emitting diode has a glue crack, it can still ensure that the light-emitting diode continues to emit light normally, improving the service life of the light-emitting diode, and thus improving the service life of the backlight of the whole machine.

[0089] It should be noted that during the operation of the whole machine device, the temperature in the backplane cavity also changes, and the temperature in the backplane cavity will affect the light-emitting degree of the light-emitting diode LED. Therefore, in order to improve the accurate judgment of the glue crack situation of the light-emitting diode LED and improve the accuracy of backlight current adjustment, it is necessary to adjust the intensity of the first light at the first time according to the temperature in the backplane cavity, specifically including steps 50 to 70, refer to Figure 3 , Figure 3 It is the second flow chart of the backlight current control method provided in the embodiment of the present application.

[0090] Step 50, obtain the cavity temperature value in the backplane cavity of the whole machine device at the first time;

[0091] Step 60, determine the light intensity compensation coefficient in the backplane cavity based on the cavity temperature value;

[0092] Step 70, determine the target light intensity in the backplane cavity of the whole machine device at the first time based on the light intensity compensation coefficient and the first light intensity.

[0093] Optionally, the backlight current control device obtains the cavity temperature value in the backplane cavity of the whole machine device at the first time through a temperature sensor installed in the backlight current control device. Further, the backlight current control device matches the cavity temperature value in the backplane cavity of the whole machine device at the first time with a preset mapping table to obtain the light intensity compensation coefficient corresponding to the cavity temperature value, where the preset mapping table is an association relationship table of temperature values and their corresponding light intensity compensation coefficients, specifically described in steps 601 to 603.

[0094] Further, the backlight current control device performs a multiplication operation on the light intensity compensation coefficient and the first light intensity to obtain a multiplication result, and determines the multiplication result as the target light intensity at the first time, that is, the target light intensity = light intensity compensation coefficient * first light intensity. Therefore, the target light intensity can be understood as the light intensity obtained by compensating and adjusting the first light intensity through the light intensity compensation coefficient.

[0095] The embodiments of the present application improve the accurate judgment of the glue splitting situation of light-emitting diodes (LEDs) and the accuracy of backlight current adjustment.

[0096] In an alternative embodiment, the descriptions of steps 601 to 603 are as follows:

[0097] Step 601, if the cavity temperature value is less than or equal to the first preset temperature threshold, then determine the first compensation coefficient as the light intensity compensation coefficient; or,

[0098] Step 602, if the cavity temperature value is greater than the first preset temperature threshold and less than the second preset temperature threshold, then determine the temperature range where the cavity temperature value is located, and determine the second compensation coefficient corresponding to the temperature range as the light intensity compensation coefficient; or,

[0099] Step 603, if the cavity temperature value is greater than or equal to the second preset temperature threshold, then obtain the third compensation coefficient corresponding to the second preset temperature threshold, and determine the light intensity compensation coefficient based on the third compensation coefficient, the second preset temperature threshold, and the cavity temperature value.

[0100] Optionally, if the cavity temperature value is less than or equal to the first preset temperature threshold, the backlight current control device determines the first compensation coefficient as the light intensity compensation coefficient. The first preset temperature threshold is set according to the actual situation. In one embodiment, the influence of 28 °C (Celsius) on the light-emitting diode (LED) light source can be ignored. Therefore, the first preset temperature threshold can be 28 °C, and the first compensation coefficient is 1.

[0101] It should be further noted that multiple temperature ranges are divided between the first preset temperature threshold and the second preset temperature threshold, and each temperature range corresponds to a different compensation coefficient. The second preset temperature threshold is set according to the actual situation. Therefore, if the cavity temperature value is greater than the first preset temperature threshold and less than the second preset temperature threshold, the backlight current control device determines the temperature range where the cavity temperature value is located and determines the second compensation coefficient corresponding to the temperature range. Further, the backlight current control device determines the second compensation coefficient corresponding to the temperature range as the light intensity compensation coefficient. Continuing the above embodiment, the second preset temperature threshold is 45 °C, and the range from 28 °C to 45 °C is divided into 3 temperature ranges. The 3 temperature ranges are the first temperature range (28, 34], the second temperature range (34, 40], and the third temperature range (40, 45]. For example, the compensation coefficient corresponding to the first temperature range can be set to 1.2, the compensation coefficient corresponding to the second temperature range can be set to 1.5, and the compensation coefficient corresponding to the third temperature range can be set to 1.8. If the cavity temperature value is 35 °C, it is in the second temperature range. Therefore, the second compensation coefficient corresponding to the cavity temperature value at this time is 1.5.

[0102] Further, if the cavity temperature value is greater than or equal to the second preset temperature threshold, the backlight current control device obtains a third compensation coefficient corresponding to the second preset temperature threshold. Further, the backlight current control device performs a quotient calculation based on the cavity temperature value and the second preset temperature threshold to obtain a calculation result, and multiplies the calculation result by the third compensation coefficient to obtain a light intensity compensation coefficient. Continuing with the above embodiment, the third compensation coefficient corresponding to the second preset temperature threshold of 45°C can be set to 2. If the cavity temperature value at this time is 49.5°C, then the light intensity compensation coefficient at this time = 2*(49.5 / 45) = 2.2. Therefore, in one embodiment, the third compensation coefficient is greater than the second compensation coefficient, and the second compensation coefficient is greater than the first compensation coefficient.

[0103] The embodiments of the present application can accurately obtain the light intensity compensation coefficient corresponding to the cavity temperature value, so that the target light intensity can be accurately calculated, so that the brightness attenuation rate can be accurately calculated according to the target light intensity, so that the backlight current of the light-emitting diode group in the whole machine device can be dynamically controlled according to the change of the brightness attenuation rate, avoiding the dead lamp of the light-emitting diode caused by a constant drive current when the light-emitting diode undergoes glue cracking, so that after the light-emitting diode undergoes glue cracking, the light-emitting diode can still be guaranteed to emit light continuously and normally, improving the service life of the light-emitting diode, and thus improving the service life of the whole machine backlight.

[0104] The backlight current control device provided by the embodiments of the present application will be described below. The backlight current control device described below can be correspondingly referred to the backlight current control method described above.

[0105] Refer to Figure 4 shown, Figure 4 is a schematic structural diagram of the backlight current control device provided by the embodiments of the present application. The backlight current control device may include:

[0106] An acquisition module 401, configured to acquire a first light intensity in the backplane cavity of the whole machine device at a first time and a second light intensity in the backplane cavity of the whole machine device at a second time;

[0107] A first determination module 402, configured to determine the cumulative usage duration of the whole machine device based on the first time and the second time;

[0108] A second determination module 403, configured to determine the brightness attenuation rate of the whole machine device based on the first light intensity, the second light intensity, and the cumulative usage duration;

[0109] A backlight current control module 404, configured to adjust the backlight current of the light-emitting diode chip of the whole machine device based on the brightness attenuation rate.

[0110] The embodiments of the present application can dynamically control the backlight current of the light-emitting diode group in the whole machine device according to the change of the brightness attenuation rate, avoid the dead lamp of the light-emitting diode caused by the constant driving current when the light-emitting diode has glue cracking, ensure that the light-emitting diode can continue to emit light normally after the light-emitting diode has glue cracking, improve the service life of the light-emitting diode, and thus improve the service life of the whole machine backlight.

[0111] In an alternative example, the backlight current control module 404 is further configured to:

[0112] Obtain the backlight current control strategy of the whole machine device; the backlight current control strategy includes an overall control strategy and a local control strategy;

[0113] If the backlight current control strategy is an overall control strategy, adjust the backlight current of the entire light-emitting diode group according to the brightness attenuation rate; or,

[0114] If the backlight current control strategy is a local control strategy, adjust the backlight current of the local light-emitting diodes in the light-emitting diode group according to the brightness attenuation rate.

[0115] In an alternative example, the backlight current control module 404 is further configured to:

[0116] If the brightness attenuation rate is greater than or equal to a preset rate threshold, obtain the light intensity of each light-emitting diode in the light-emitting diode group and the array structure of the light-emitting diode group; the array structure includes a plurality of light-emitting regions, and each light-emitting region includes a plurality of light-emitting diodes;

[0117] Based on the first light intensity and the light intensity of each light-emitting diode, determine the target light-emitting diode with glue cracking in the light-emitting diode group;

[0118] Obtain the target light-emitting region of the target light-emitting diode in the array structure;

[0119] Based on the array structure and the target light-emitting region, control the backlight current of the target light-emitting diode.

[0120] In an alternative example, the backlight current control module 404 is further configured to:

[0121] Obtain the central light-emitting region of the array structure and the current backlight current value of the target light-emitting diode at the first time;

[0122] Based on the central light-emitting region and the target light-emitting region, determine the region adjustment coefficient;

[0123] Calculate the glue crack degree coefficient of the target light-emitting diode based on the light intensity of the target light-emitting diode at the first time and the light intensity at the second time;

[0124] Control the backlight current of the target light-emitting diode based on the current backlight current value, the area adjustment coefficient, and the glue crack degree coefficient.

[0125] In an optional example, the backlight current control module 404 is further configured to:

[0126] Calculate the final adjustment coefficient based on the area adjustment coefficient and the glue crack degree coefficient;

[0127] Calculate the final backlight current value based on the current backlight current value and the final adjustment coefficient;

[0128] Control the backlight current of the target light-emitting diode with the final backlight current value.

[0129] In an optional example, the backlight current control device is further configured to:

[0130] Obtain the cavity temperature value in the backplane cavity of the whole machine device at the first time;

[0131] Determine the light intensity compensation coefficient in the backplane cavity based on the cavity temperature value;

[0132] Determine the target light intensity in the backplane cavity of the whole machine device at the first time based on the light intensity compensation coefficient and the first light intensity.

[0133] In an optional example, the backlight current control device is further configured to:

[0134] If the cavity temperature value is less than or equal to the first preset temperature threshold, determine the first compensation coefficient as the light intensity compensation coefficient; or,

[0135] If the cavity temperature value is greater than the first preset temperature threshold and less than the second preset temperature threshold, determine the temperature range where the cavity temperature value is located, and determine the second compensation coefficient corresponding to the temperature range as the light intensity compensation coefficient; or,

[0136] If the cavity temperature value is greater than or equal to the second preset temperature threshold, obtain the third compensation coefficient corresponding to the second preset temperature threshold, and determine the light intensity compensation coefficient based on the third compensation coefficient, the second preset temperature threshold, and the cavity temperature value;

[0137] Wherein, the third compensation coefficient is greater than the second compensation coefficient, and the second compensation coefficient is greater than the first compensation coefficient.

[0138] The specific embodiments of the backlight current control device provided in this application are basically the same as those of the backlight current control method, and will not be elaborated here.

[0139] Optionally, as Figure 5 shown, Figure 5 is a schematic structural diagram of an electronic device provided by an embodiment of this application. The electronic device may include: a processor 510, a communication interface 520, a memory 530, and a communication bus 540. Among them, the processor 510, the communication interface 520, and the memory 530 communicate with each other through the communication bus 540. The processor 510 may call a computer program in the memory 530 to execute the steps of the backlight current control method, for example, including:

[0140] Obtain the first light intensity in the backplane cavity of the whole machine device at the first time and the second light intensity in the backplane cavity of the whole machine device at the second time;

[0141] Determine the cumulative usage duration of the whole machine device based on the first time and the second time;

[0142] Determine the brightness attenuation rate of the whole machine device based on the first light intensity, the second light intensity, and the cumulative usage duration;

[0143] Adjust the backlight current of the light-emitting diode chip of the whole machine device based on the brightness attenuation rate.

[0144] In an optional embodiment, adjusting the backlight current of the light-emitting diode chip of the whole machine device based on the brightness attenuation rate includes:

[0145] Obtain the backlight current control strategy of the whole machine device; the backlight current control strategy includes an overall control strategy and a local control strategy;

[0146] If the backlight current control strategy is an overall control strategy, adjust the backlight current of the entire light-emitting diode group according to the brightness attenuation rate; or,

[0147] If the backlight current control strategy is a local control strategy, adjust the backlight current of the local light-emitting diodes in the light-emitting diode group according to the brightness attenuation rate.

[0148] In an optional embodiment, adjusting the backlight current of the local light-emitting diodes in the light-emitting diode group according to the brightness attenuation rate includes:

[0149] If the brightness attenuation rate is greater than or equal to a preset rate threshold, obtain the illumination intensity of each light-emitting diode in the light-emitting diode group and the array structure of the light-emitting diode group; the array structure includes a plurality of light-emitting regions, and each light-emitting region includes a plurality of light-emitting diodes;

[0150] Based on the first illumination intensity and the illumination intensity of each light-emitting diode, determine the target light-emitting diode with glue cracking in the light-emitting diode group;

[0151] Obtain the target light-emitting region of the target light-emitting diode in the array structure;

[0152] Based on the array structure and the target light-emitting region, control the backlight current of the target light-emitting diode.

[0153] In an alternative embodiment, controlling the backlight current of the target light-emitting diode based on the array structure and the target light-emitting region includes:

[0154] Obtain the central light-emitting region of the array structure and the current backlight current value of the target light-emitting diode at the first time;

[0155] Based on the central light-emitting region and the target light-emitting region, determine the region adjustment coefficient;

[0156] Based on the illumination intensity of the target light-emitting diode at the first time and the illumination intensity at the second time, calculate the glue cracking degree coefficient of the target light-emitting diode;

[0157] Based on the current backlight current value, the region adjustment coefficient, and the glue cracking degree coefficient, control the backlight current of the target light-emitting diode.

[0158] In an alternative embodiment, controlling the backlight current of the target light-emitting diode based on the current backlight current value, the region adjustment coefficient, and the glue cracking degree coefficient includes:

[0159] Based on the region adjustment coefficient and the glue cracking degree coefficient, calculate the final adjustment coefficient;

[0160] Based on the current backlight current value and the final adjustment coefficient, calculate the final backlight current value;

[0161] Control the backlight current of the target light-emitting diode with the final backlight current value.

[0162] In an alternative embodiment, the backlight current control method further includes:

[0163] Obtain the cavity temperature value in the backplane cavity of the whole machine device at the first time;

[0164] Determine the light intensity compensation coefficient in the backplane cavity based on the cavity temperature value;

[0165] Based on the light intensity compensation coefficient and the first light intensity, determine the target light intensity in the backplane cavity of the whole machine device at the first time.

[0166] In an alternative embodiment, determining the light intensity compensation coefficient in the backplane cavity based on the cavity temperature value includes:

[0167] If the cavity temperature value is less than or equal to the first preset temperature threshold, determine the first compensation coefficient as the light intensity compensation coefficient; or,

[0168] If the cavity temperature value is greater than the first preset temperature threshold and less than the second preset temperature threshold, determine the temperature range where the cavity temperature value is located, and determine the second compensation coefficient corresponding to the temperature range as the light intensity compensation coefficient; or,

[0169] If the cavity temperature value is greater than or equal to the second preset temperature threshold, obtain the third compensation coefficient corresponding to the second preset temperature threshold, and based on the third compensation coefficient, the second preset temperature threshold, and the cavity temperature value, determine the light intensity compensation coefficient;

[0170] Wherein, the third compensation coefficient is greater than the second compensation coefficient, and the second compensation coefficient is greater than the first compensation coefficient.

[0171] In addition, when the logical instructions in the above-mentioned memory 530 can be implemented in the form of software functional units and sold or used as an independent product, they can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of the present application. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROM, Read-Only Memory), random access memories (RAM, Random Access Memory), magnetic disks, or optical discs that can store program codes.

[0172] On the other hand, an embodiment of the present application further provides a non-transitory computer-readable storage medium. The non-transitory computer-readable storage medium includes a computer program. The computer program can be stored on the non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can execute the steps of the backlight current control method provided in each of the above embodiments, for example, including:

[0173] Obtain the first light intensity in the backplane cavity of the whole machine device at a first time and the second light intensity in the backplane cavity of the whole machine device at a second time;

[0174] Determine the cumulative usage duration of the whole machine device based on the first time and the second time;

[0175] Determine the brightness attenuation rate of the whole machine device based on the first light intensity, the second light intensity, and the cumulative usage duration;

[0176] Adjust the backlight current of the light-emitting diode chips of the whole machine device based on the brightness attenuation rate.

[0177] In an alternative embodiment, adjusting the backlight current of the light-emitting diode chips of the whole machine device based on the brightness attenuation rate includes:

[0178] Obtain the backlight current control strategy of the whole machine device; the backlight current control strategy includes an overall control strategy and a local control strategy;

[0179] If the backlight current control strategy is an overall control strategy, adjust the backlight current of the entire light-emitting diode group according to the brightness attenuation rate; or,

[0180] If the backlight current control strategy is a local control strategy, adjust the backlight current of the local light-emitting diodes in the light-emitting diode group according to the brightness attenuation rate.

[0181] In an alternative embodiment, adjusting the backlight current of the local light-emitting diodes in the light-emitting diode group according to the brightness attenuation rate includes:

[0182] If the brightness attenuation rate is greater than or equal to a preset rate threshold, obtain the light intensity of each light-emitting diode in the light-emitting diode group and the array structure of the light-emitting diode group; the array structure includes a plurality of light-emitting regions, and each light-emitting region includes a plurality of light-emitting diodes;

[0183] Based on the first light intensity and the light intensity of each light-emitting diode, determine the target light-emitting diodes with glue cracking in the light-emitting diode group;

[0184] Obtain the target light-emitting region of the target light-emitting diode in the array structure;

[0185] Based on the array structure and the target light-emitting region, control the backlight current of the target light-emitting diode.

[0186] In an alternative embodiment, controlling the backlight current of the target light-emitting diode based on the array structure and the target light-emitting region includes:

[0187] Obtain the central light-emitting region of the array structure and the current backlight current value of the target light-emitting diode at the first time;

[0188] Based on the central light-emitting region and the target light-emitting region, determine the region adjustment coefficient;

[0189] Based on the light intensity of the target light-emitting diode at the first time and the light intensity at the second time, calculate the glue crack degree coefficient of the target light-emitting diode;

[0190] Based on the current backlight current value, the region adjustment coefficient, and the glue crack degree coefficient, control the backlight current of the target light-emitting diode.

[0191] In an alternative embodiment, controlling the backlight current of the target light-emitting diode based on the current backlight current value, the region adjustment coefficient, and the glue crack degree coefficient includes:

[0192] Based on the region adjustment coefficient and the glue crack degree coefficient, calculate the final adjustment coefficient;

[0193] Based on the current backlight current value and the final adjustment coefficient, calculate the final backlight current value;

[0194] Control the backlight current of the target light-emitting diode with the final backlight current value.

[0195] In an alternative embodiment, the backlight current control method further includes:

[0196] Obtain the cavity temperature value in the backplane cavity of the whole machine device at the first time;

[0197] Based on the cavity temperature value, determine the light intensity compensation coefficient in the backplane cavity;

[0198] Based on the light intensity compensation coefficient and the first light intensity, determine the target light intensity in the backplane cavity of the whole machine device at the first time.

[0199] In an alternative embodiment, determining the light intensity compensation coefficient in the backplane cavity based on the cavity temperature value includes:

[0200] If the cavity temperature value is less than or equal to the first preset temperature threshold, determine the first compensation coefficient as the light intensity compensation coefficient; or,

[0201] If the cavity temperature value is greater than the first preset temperature threshold and less than the second preset temperature threshold, determine the temperature range where the cavity temperature value is located, and determine the second compensation coefficient corresponding to the temperature range as the light intensity compensation coefficient; or,

[0202] If the cavity temperature value is greater than or equal to the second preset temperature threshold, obtain the third compensation coefficient corresponding to the second preset temperature threshold, and determine the light intensity compensation coefficient based on the third compensation coefficient, the second preset temperature threshold, and the cavity temperature value;

[0203] Wherein, the third compensation coefficient is greater than the second compensation coefficient, and the second compensation coefficient is greater than the first compensation coefficient.

[0204] On the other hand, an embodiment of the present application further provides a computer product. The computer product includes a computer program. The computer program can be stored on the computer product. When the computer program is executed by a processor, the computer can execute the steps of the backlight current control method provided in each of the above embodiments, for example, including:

[0205] Obtain the first light intensity in the backplane cavity of the whole machine device at the first time and the second light intensity in the backplane cavity of the whole machine device at the second time;

[0206] Determine the cumulative usage duration of the whole machine device based on the first time and the second time;

[0207] Determine the brightness attenuation rate of the whole machine device based on the first light intensity, the second light intensity, and the cumulative usage duration;

[0208] Adjust the backlight current of the light emitting diode chip of the whole machine device based on the brightness attenuation rate.

[0209] In an optional embodiment, adjusting the backlight current of the light emitting diode chip of the whole machine device based on the brightness attenuation rate includes:

[0210] Obtain the backlight current control strategy of the whole machine device; the backlight current control strategy includes an overall control strategy and a local control strategy;

[0211] If the backlight current control strategy is an overall control strategy, adjust the backlight current of the entire light emitting diode group according to the brightness attenuation rate; or,

[0212] If the backlight current control strategy is a local control strategy, adjust the backlight current of the local light-emitting diodes in the light-emitting diode group according to the brightness attenuation rate.

[0213] In an alternative embodiment, adjusting the backlight current of the local light-emitting diodes in the light-emitting diode group according to the brightness attenuation rate includes:

[0214] If the brightness attenuation rate is greater than or equal to a preset rate threshold, obtain the light intensity of each light-emitting diode in the light-emitting diode group and the array structure of the light-emitting diode group; the array structure includes a plurality of light-emitting regions, and each light-emitting region includes a plurality of light-emitting diodes;

[0215] Based on the first light intensity and the light intensity of each light-emitting diode, determine the target light-emitting diodes with glue cracking in the light-emitting diode group;

[0216] Obtain the target light-emitting region of the target light-emitting diode in the array structure;

[0217] Based on the array structure and the target light-emitting region, control the backlight current of the target light-emitting diode.

[0218] In an alternative embodiment, controlling the backlight current of the target light-emitting diode based on the array structure and the target light-emitting region includes:

[0219] Obtain the central light-emitting region of the array structure and the current backlight current value of the target light-emitting diode at the first time;

[0220] Based on the central light-emitting region and the target light-emitting region, determine the region adjustment coefficient;

[0221] Based on the light intensity of the target light-emitting diode at the first time and the light intensity at the second time, calculate the glue cracking degree coefficient of the target light-emitting diode;

[0222] Based on the current backlight current value, the region adjustment coefficient, and the glue cracking degree coefficient, control the backlight current of the target light-emitting diode.

[0223] In an alternative embodiment, controlling the backlight current of the target light-emitting diode based on the current backlight current value, the region adjustment coefficient, and the glue cracking degree coefficient includes:

[0224] Based on the region adjustment coefficient and the glue cracking degree coefficient, calculate the final adjustment coefficient;

[0225] Based on the current backlight current value and the final adjustment coefficient, calculate the final backlight current value;

[0226] Control the backlight current of the target light-emitting diode with the final backlight current value.

[0227] In an optional embodiment, the backlight current control method further includes:

[0228] Obtain the cavity temperature value in the backplane cavity of the whole machine device at a first time;

[0229] Determine the light intensity compensation coefficient in the backplane cavity based on the cavity temperature value;

[0230] Determine the target light intensity in the backplane cavity of the whole machine device at the first time based on the light intensity compensation coefficient and the first light intensity.

[0231] In an optional embodiment, determining the light intensity compensation coefficient in the backplane cavity based on the cavity temperature value includes:

[0232] If the cavity temperature value is less than or equal to a first preset temperature threshold, determine the first compensation coefficient as the light intensity compensation coefficient; or,

[0233] If the cavity temperature value is greater than the first preset temperature threshold and less than a second preset temperature threshold, determine the temperature range where the cavity temperature value is located, and determine the second compensation coefficient corresponding to the temperature range as the light intensity compensation coefficient; or,

[0234] If the cavity temperature value is greater than or equal to the second preset temperature threshold, obtain the third compensation coefficient corresponding to the second preset temperature threshold, and determine the light intensity compensation coefficient based on the third compensation coefficient, the second preset temperature threshold, and the cavity temperature value;

[0235] Wherein, the third compensation coefficient is greater than the second compensation coefficient, and the second compensation coefficient is greater than the first compensation coefficient.

[0236] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated. The components shown as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art can understand and implement it without creative labor.

[0237] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on such an understanding, the essence of the above technical solution, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0238] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A backlight current control method, characterized in that, Including: Obtaining a first light intensity in a backplane cavity of the whole machine device at a first time and a second light intensity in the backplane cavity of the whole machine device at a second time; Determining an accumulated usage duration of the whole machine device based on the first time and the second time; Determining a brightness attenuation rate of the whole machine device based on the first light intensity, the second light intensity, and the accumulated usage duration; Adjusting a backlight current of a light-emitting diode chip of the whole machine device based on the brightness attenuation rate.

2. The backlight current control method according to claim 1, wherein The light-emitting diode chip includes a light-emitting diode group; the adjusting the backlight current of the light-emitting diode chip of the whole machine device based on the brightness attenuation rate includes: Obtaining a backlight current control strategy of the whole machine device; the backlight current control strategy includes an overall control strategy and a local control strategy; If the backlight current control strategy is an overall control strategy, adjusting the backlight current of the entire light-emitting diode group according to the brightness attenuation rate; or, If the backlight current control strategy is a local control strategy, adjusting the backlight current of local light-emitting diodes in the light-emitting diode group according to the brightness attenuation rate.

3. The backlight current control method according to claim 2, characterized in that The adjusting the backlight current of local light-emitting diodes in the light-emitting diode group according to the brightness attenuation rate includes: If the brightness attenuation rate is greater than or equal to a preset rate threshold, obtaining the light intensity of each light-emitting diode in the light-emitting diode group and the array structure of the light-emitting diode group; the array structure includes a plurality of light-emitting regions, and each light-emitting region includes a plurality of light-emitting diodes; Determining a target light-emitting diode with glue cracking in the light-emitting diode group based on the first light intensity and the light intensity of each light-emitting diode; Obtaining a target light-emitting region of the target light-emitting diode in the array structure; Controlling the backlight current of the target light-emitting diode based on the array structure and the target light-emitting region.

4. The backlight current control method according to claim 3, wherein The controlling the backlight current of the target light-emitting diode based on the array structure and the target light-emitting region includes: Obtaining a central light-emitting region of the array structure and a current backlight current value of the target light-emitting diode at the first time; Determining a region adjustment coefficient based on the central light-emitting region and the target light-emitting region; Calculating a glue cracking degree coefficient of the target light-emitting diode based on the light intensity of the target light-emitting diode at the first time and the light intensity at the second time; Controlling the backlight current of the target light-emitting diode based on the current backlight current value, the region adjustment coefficient, and the glue cracking degree coefficient.

5. The backlight current control method according to claim 4, wherein The controlling the backlight current of the target light-emitting diode based on the current backlight current value, the region adjustment coefficient, and the glue cracking degree coefficient includes: Calculating a final adjustment coefficient based on the region adjustment coefficient and the glue cracking degree coefficient; Calculating a final backlight current value based on the current backlight current value and the final adjustment coefficient; Controlling the backlight current of the target light-emitting diode with the final backlight current value.

6. The backlight current control method according to any one of claims 1 to 5, characterized in that, The backlight current control method further includes: Obtain the cavity temperature value in the backplane cavity of the whole machine device at the first time; Determine the light intensity compensation coefficient in the backplane cavity based on the cavity temperature value; Determine the target light intensity in the backplane cavity of the whole machine device at the first time based on the light intensity compensation coefficient and the first light intensity.

7. The backlight current control method according to claim 6, wherein The determining the light intensity compensation coefficient in the backplane cavity based on the cavity temperature value includes: If the cavity temperature value is less than or equal to the first preset temperature threshold, determine the first compensation coefficient as the light intensity compensation coefficient; or, If the cavity temperature value is greater than the first preset temperature threshold and less than the second preset temperature threshold, determine the temperature range where the cavity temperature value is located, and determine the second compensation coefficient corresponding to the temperature range as the light intensity compensation coefficient; or, If the cavity temperature value is greater than or equal to the second preset temperature threshold, obtain the third compensation coefficient corresponding to the second preset temperature threshold, and determine the light intensity compensation coefficient based on the third compensation coefficient, the second preset temperature threshold and the cavity temperature value; Wherein, the third compensation coefficient is greater than the second compensation coefficient, and the second compensation coefficient is greater than the first compensation coefficient.

8. A backlight current control device, characterized in that, including: An acquisition module, configured to acquire the first light intensity in the backplane cavity of the whole machine device at the first time and the second light intensity in the backplane cavity of the whole machine device at the second time; A first determination module, configured to determine the cumulative usage duration of the whole machine device based on the first time and the second time; A second determination module, configured to determine the brightness attenuation rate of the whole machine device based on the first light intensity, the second light intensity and the cumulative usage duration; A backlight current control module, configured to adjust the backlight current of the light emitting diode chip of the whole machine device based on the brightness attenuation rate.

9. An electronic device, characterized in that, Includes a processor and a memory, and the memory stores multiple instructions; the processor loads instructions from the memory to execute the backlight current control method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores multiple instructions, and the instructions are suitable for being loaded by a processor to execute the backlight current control method according to any one of claims 1 to 7.