Host assembly and electronic equipment

Abstract

The embodiment of the invention discloses a host assembly and electronic equipment. The host assembly can be applied to electronic equipment such as a notebook computer, a mobile phone and wearable equipment. The mainboard at least partially extends to the outer side of the projection, parallel to the plane of the mainboard, of the keyboard, so that electronic devices with large sizes on the mainboard can be arranged on the first plate part, the thickness of the position where the keyboard is located is greatly reduced, and even if a part of the mainboard is located under the keyboard, the electronic devices can be arranged on the first plate part. And the thickness occupied by the part of the mainboard is relatively small, so that the overall thickness of the electronic equipment is reduced, and the light and thin design requirement of the electronic equipment is met. Certainly, electronic devices with large power on the main board can be arranged on the first board part, after the electronic devices with large power are moved out from the position under the keyboard, the influence of heat emitted by the main board on the keyboard is reduced, the temperature of the keyboard area is reduced, and the user experience is improved.

Description

Technical Field

[0001] The present application relates to the field of electronic products, and in particular to a host component and an electronic device. Background Art

[0002] Electronic devices such as laptop computers include a display component and a host component, which are connected by a hinge structure. Figure 1 The host assembly includes a mainboard 13', a keyboard 12', a cooling fan 11' and other components. Currently, the keyboard 12' is usually installed on top of the mainboard 13' and the cooling fan 11', that is, the mainboard 13' and the cooling fan 11' are installed below the keyboard 12'. As users' requirements for electronic products increase, the thickness of the host assembly is one of the factors for evaluating the quality of electronic equipment. Therefore, how to reduce the thickness of the host assembly to meet the demand for the development of thin and light electronic equipment has always been a technical issue that technicians in this field have been paying attention to. Summary of the invention

[0003] The embodiments of the present application provide a host component and an electronic device that are relatively thin and can enhance user experience.

[0004] In a first aspect, an embodiment of the present application provides a host component, which is applied to an electronic device, including:

[0005] Host housing;

[0006] A keyboard, supported by the first housing, having N keys; N is an integer greater than or equal to 1;

[0007] The main board is located in the inner cavity of the host shell and on the side of the keyboard away from the operating part of the keys. Along a plane parallel to the main board, the main board has a first board portion that is staggered with the keyboard, and the main heating area of the main board is at least partially arranged on the first board portion.

[0008] In the embodiment of the present application, the mainboard at least partially extends to the outside of the projection of the keyboard on the plane parallel to the mainboard, so that the relatively large electronic devices on the mainboard can be arranged on the first board portion, so that the thickness of the keyboard will be greatly reduced. Even if part of the mainboard is located directly below the keyboard, the thickness of this part of the mainboard is relatively small, which is conducive to reducing the overall thickness of the electronic device and meeting the requirements of the thin and light design of the electronic device. Of course, the relatively high-power electronic devices on the mainboard can also be arranged on the first board portion. After most or part of the high-power electronic devices are moved out from directly below the keyboard, the keyboard will be less affected by the heat generated by the mainboard, the temperature of the keyboard area will be reduced, and the user experience will be improved.

[0009] In a feasible embodiment, the main heating area of the mainboard is completely arranged on the first board portion, so that the heat generated by the main heating area has a relatively small impact on the keyboard, the keyboard temperature is relatively low, and the user experience is better.

[0010] In a feasible embodiment, the mainboard and the keyboard are completely staggered, and the projections of the mainboard and the keyboard in a plane parallel to the mainboard do not overlap. Especially for low-power (e.g., power of about 20W) laptops, the mainboard area is relatively small, and the mainboard can be completely staggered with the keyboard, so that the thickness of the electronic device can be determined solely by the thickness of the mainboard or the thickness of the keyboard. Compared with the thickness of the mainboard plus the keyboard in the prior art, the thickness of the electronic device provided by the embodiment of the present application can be further reduced, meeting the requirements for the thin and light design of the electronic device.

[0011] In a feasible embodiment, the main board also includes a second board portion, the second board portion is connected to a side of the first board portion close to the keyboard, a part of the main heating area is located on the second board portion, the keyboard includes a keycap-type button and a touchpad, the touchpad is integrated with at least one touch button, the second board portion is located below the touchpad, and the keycap-type button is located on the side of the touchpad away from the first board portion. Compared with the keycap-type keyboard, the touchpad is relatively thin, and can be raised by a height of a distance relative to the inner surface of the keycap-type button located inside the main housing, which can provide a larger space for the main board 13 located below it to a certain extent, facilitating the arrangement of electronic devices on the main board.

[0012] In a feasible embodiment, a heat dissipation fan is further included, which is located outside the projection of the keyboard and the mainboard on a plane parallel to the mainboard, and the heat dissipation fan and the first plate portion are located on the same side of the keyboard. In this embodiment, the keyboard, the heat dissipation fan, and the mainboard are staggered and not overlapped in thickness, so that the thickness of the host assembly can be designed according to the larger thickness of the keyboard, the heat dissipation fan, and the mainboard, and the host assembly is simple in design and relatively thin in thickness.

[0013] In a feasible embodiment, a heat sink is further included, which is at least partially overlapped with the heat generating components on the main heat generating area of the first board portion, and the projections of the heat sink and the keyboard on the main board do not overlap. The heat sink is used to dissipate heat from the heat generating components on the main heat generating area, and the heat sink is located at the first board portion, overlapped with the first board portion, and has no overlapping area with the keyboard, so that the thickness of the host assembly can be reduced as much as possible under the premise of effectively dissipating heat from the heat generating components.

[0014] In a feasible embodiment, the radiator is a heat pipe radiator, part of the pipe section of the heat pipe radiator is arranged on the first plate portion, and the other part of the pipe section extends between the heat dissipation fan and the heat dissipation through hole of the host housing. In this example, while meeting the need to cool the heat-generating components, the thickness of the heat pipe radiator is small, and the thickness of the first plate portion is minimized.

[0015] In a feasible embodiment, it further includes a first battery, which is located between the keyboard and the bottom wall of the host housing. In this embodiment, on the premise of achieving a smaller thickness of the host component, the idle space between the keyboard and the bottom wall of the host housing can be fully utilized, which plays a role in expanding the battery of the host component and improving the quality of the host component.

[0016] In a feasible embodiment, it further includes a main touch screen and two second batteries. The main touch screen can at least be used as a mouse function. The main touch screen and the two second batteries are both located on the side of the keyboard away from the first plate portion, and the two second batteries are located on both sides of the main touch screen. In this example, the number of the second batteries is two, and the arrangement is flexible, which can fully utilize the internal space of the host component and improve the overall battery capacity of the host component.

[0017] In a feasible embodiment, antenna modules or / and speakers are also integrated in the two side regions of the keyboard along a predetermined direction. In the plane parallel to the main board, the predetermined direction is perpendicular to the arrangement direction of the keyboard and the first plate portion. In this example, the antenna modules and the speakers are arranged by making full use of the space on both sides of the keyboard, and the structure of the host component is compact.

[0018] In a feasible embodiment, the electronic device includes a display component, and the display component is rotatably connected to the host component through a rotating shaft mechanism so that the electronic device is in an open state or a closed state. The host housing includes a surface on one side of the keyboard, and a part of the surface bulges upward to form a convex portion. The convex portion and the first plate portion are on the same side of the host component, and the rotating shaft structure is arranged on the convex portion. This can facilitate the installation of the rotating shaft mechanism.

[0019] In a feasible embodiment, when the electronic device is in the closed state, the convex surface of the convex portion and the outer surface of the display component facing away from the display surface form a partial appearance surface of the electronic device; this can improve the appearance of the electronic device.

[0020] Or / and, when the electronic device is in the open state, the convex portion is located on the back side of the display component. In this embodiment, when the electronic device is in the open state, the convex portion is located on the back side of the display component, which will not affect the appearance of the electronic device in the open state and gives the user a better experience.

[0021] In a feasible embodiment, the host housing further includes a bottom wall, and the convex portion and the bottom wall are connected by a connecting side wall. The connection sockets in the host component are centrally arranged on the connecting side wall. In the embodiment of the present application, various connection sockets of the host component are arranged at the position where the convex portion is located. In this way, the side walls at other positions of the host housing can be designed as arc-shaped structures, making the shape of the electronic device visually feel thinner and improving the quality of the electronic device.

[0022] In a second aspect, an embodiment of the present application provides an electronic device, including a display component, a rotating shaft structure, and the host component according to any one of the above, wherein the host component and the display component are rotatably connected through the rotating shaft structure.

[0023] In a feasible embodiment, the number of the rotating shaft structures is two, the two rotating shaft structures are coaxially arranged, and the first plate portion and the heat dissipation fan of the host component are located between the two rotating shaft structures. While realizing the reliable rotation of the host component and the display component, it is beneficial to arrange the main board and the heat dissipation fan.

[0024] In a feasible embodiment, each rotating shaft structure includes an arc-shaped rotating arm and a core shaft, one of which is fixedly connected to the display component, and the other is fixedly connected to the host component, and the arc-shaped rotating arm rotates around the core shaft. This rotating shaft structure occupies a small volume, which is beneficial to the layout of the main board and the heat dissipation fan inside the host component.

[0025] The electronic device of the present application includes the above host component, so it also has the above technical effects of the host component. Description of the Drawings

[0026] Figure 1 is a schematic structural diagram of the host component in the prior art;

[0027] Figure 2 is Figure 1 a schematic cross-sectional view taken along line A'-A' of the host component shown;

[0028] Figure 3-1 is a schematic structural diagram of the electronic device provided in an embodiment of the present application;

[0029] Figure 3-2 is Figure 3-1 a partial enlarged view in;

[0030] Figure 4 is Figure 3-1 a schematic diagram of the electronic device shown in a closed state;

[0031] Figure 5 is Figure 3-1 a disassembled schematic diagram of the host component of the electronic device provided;

[0032] Figure 6 is Figure 5 a schematic diagram of the host component shown in an assembled state;

[0033] Figure 7-1 is Figure 6 a schematic cross-sectional view taken along line A-A in;

[0034] Figure 7-2 is Figure 7-1 a partial enlarged view in;

[0035] Figure 8 For Figure 6 the host component shown in the top view of removing the first housing;

[0036] Figure 9 For Figure 8 the schematic diagram of removing the keyboard from the structure shown;

[0037] Figure 10 For Figure 6 the schematic diagram of the B - B cross - section in the host component shown;

[0038] Figure 11 The structural schematic diagram of another embodiment of the host component provided by the present application, in which the first housing is hidden;

[0039] Figure 12 For Figure 11 the structural schematic diagram of the host component shown with the keyboard hidden;

[0040] Figure 13 For Figure 11 the E - E cross - sectional view of the structure shown;

[0041] Figure 14 For Figure 13 the enlarged view at C1 of the structure shown.

[0042] Wherein, Figures 1 to 14 the one - to - one correspondence between the reference numerals and the component names in the drawings is as follows:

[0043] 100 Electronic device;

[0044] 1 Host component; 11 Host housing; 11 - 1 First housing; 11 - 11 Keycap hole; 11 - 12 Screen mounting hole; 11 - 10 Surface; 111 Protrusion; 11 - 2 Second housing; 111 Protrusion; 112 First side wall; 113 Second side wall; 113a Through - hole; 12 Keyboard; 12 - 1 Mechanical keyboard; 12 - 2 Touchpad; 12 - 21 Touch control button; 13 Main board; 131 First board part; 132 Second board part; 133 First heating device; 134 First main heating area; 135 Second main heating area; 136 Second heating device; 14 Main touch screen; 11a Through - hole; 11b Heat dissipation through - hole; 16 Heat dissipation fan; 17 Radiator; 18 First battery; 19 Second battery; 110 Speaker; 15 Antenna module;

[0045] 2 Display component; 21 Display housing; 22 Display screen;

[0046] 3 Rotating shaft structure. Specific embodiments

[0047] In view of the technical problem of the relatively large thickness of the host component mentioned in the background art, the inventors of the present application have conducted extensive research on the host component of the current electronic device and found that: due to work requirements, a large number of electronic devices are usually arranged on the main board 13'. Some of the electronic devices are relatively large in volume and high in power, and require a certain thickness. After the main board 13' and the keyboard 12' are stacked, the thickness is relatively large. Please refer to Figure 1 for understanding. Especially, the power of the electronic devices on the main board is relatively high, and a large amount of heat is generated during operation, which needs to be dissipated in time. Otherwise, it will affect the working efficiency of the electronic devices. In severe cases, heat accumulation is likely to cause the main board to be burned out. Therefore, a radiator 14' is usually arranged in the main heat generation area where high-power electronic devices are installed on the main board 13' to dissipate heat from the main heat generation area in time. The radiator 14' and the main board are stacked up and down and installed under the keyboard 12'. Please refer to Figure 2 for understanding. This further becomes an important factor restricting the reduction of the thickness of the host component in the current technology.

[0048] In addition, a large amount of heat is generated when the high-power electronic devices on the main board 13' are working, and the heat will quickly conduct to the keycap position of the keyboard above it, resulting in a relatively high temperature of some keycaps. Figure 1 The highest temperature P point position is shown in

[0049] The temperature of the keycap at the P point position can sometimes reach more than forty degrees, reducing the user experience of using the electronic device.

[0050] Based on the above research, the present application provides a host component that can reduce the thickness of the host component and can improve the user experience of using the electronic device to a certain extent, and an electronic device having the host component.

[0051] The host component provided by the embodiment of the present application is mainly applied to an electronic device, where the electronic device can be a mobile terminal such as a notebook computer, a mobile phone, a wearable device, a vehicle-mounted device, an augmented reality (AR) / virtual reality (VR) device, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), etc., or it can also be a professional shooting device such as a digital camera, a single-lens reflex camera / mirrorless camera, an action camera, a gimbal camera, a drone, etc. The embodiment of the present application does not limit the specific type of the electronic device. For the convenience of understanding, the following takes the electronic device as a notebook computer for illustration.

[0052] Please refer to Figure 3-1 、 Figure 3-2 and Figure 4 , Figure 3-1 which is a schematic structural diagram of an electronic device provided in an embodiment of the present application; Figure 3-2 is Figure 3-1 a partial enlarged view in Figure 4 is Figure 3-1 a schematic diagram of the electronic device shown in the closed state.

[0053] In an embodiment of the present application, the electronic device 100 includes a main body component 1, a display component 2 and a rotating shaft structure 3 that rotate relative to each other. Figure 3-1 In the example, the electronic device is a laptop computer. Figure 3-1 In the example, the display component 2 of the electronic device is the display side of the laptop computer, the main body component 1 is the keyboard side of the laptop computer, and the rotating shaft structure 3 realizes the rotational connection between the main body component 1 and the display component 2, so that the electronic device 100 is in an open state and a closed state, where Figure 3-1 is a schematic diagram of the electronic device 100 at a certain moment in the open state, Figure 4 is a schematic diagram of the electronic device 100 in the closed state.

[0054] Please refer to Figure 3-1 , in an embodiment of the present application, the main body component 1 includes a main body housing 11 and a keyboard 12. The main body housing 11 includes a surface 11-10 on one side of the keyboard 12. The surface 11-10 bulges upward locally to form a convex portion 111. The rotating shaft structure 3 is provided on the convex portion 111. The convex portion 111 is located at the top of the main body housing 11. In this article, the end of the main body housing 11 where the rotating shaft structure is provided is defined as the top. In this embodiment, the convex portion 111 of the electronic device 100 can provide an installation basis for the rotating shaft structure 3, facilitate the setting of the rotating shaft structure 3, and can provide a relatively large internal space, facilitating the setting of the connection socket 11a, as described in detail later.

[0055] Considering the overall appearance performance of the electronic device, when the electronic device is in the closed state, the convex portion 111 and the outer surface of the display component 2 facing away from the display screen 22 form the appearance surface of the electronic device. When the electronic device 100 is closed, the appearance is relatively beautiful. When the electronic device 100 is in the open state, the convex portion 111 is located on the back side of the display component 2. Please refer to Figure 3-1 . The back side is the side of the display component 2 away from the display screen 22. In this embodiment, when the electronic device is in the open state, the convex portion 111 is located on the back side of the display component 2, which will not affect the appearance of the electronic device in the open state and gives the user a better experience.

[0056] Please refer to Figure 5, in the embodiment of the present application, the main body housing 11 further includes a bottom wall (the second housing 11-2 in the figure), and a connection socket is provided on the connection side wall where the convex portion 111 is connected to the bottom wall. The connection side wall includes two relatively arranged first side walls 112 and a second side wall 113 on the back side of the main body housing 11. The shape of the connection socket can be circular, rectangular or other shapes to meet the requirements of power connection sockets, USB connection sockets, volume connection sockets, etc. The connection sockets 11a in the main body assembly 1 are centrally arranged on the connection side wall, and the shapes of the connection sockets are not limited to those shown in the figure and can be set as required. In the figure, it is shown that one connection socket 11a is provided on the first side wall 112 and three connection sockets 11a are provided on the second side wall. Of course, the number and shape of the connection sockets 11a are not limited to those shown in the figure and can be reasonably set according to the specific electronic device.

[0057] In the embodiment of the present application, various connection sockets 11a of the main body assembly 1 are arranged at the position where the convex portion 111 is located. In this way, the side walls at other positions of the main body housing 11 can be designed as arc-shaped structures, making the shape of the electronic device visually feel thinner and improving the quality of the electronic device 100.

[0058] Please refer to again Figure 3-1 , in the embodiment of the present application, each rotation shaft structure includes an arc-shaped rotating arm 31 and a core shaft (not shown). One of them is fixedly connected to the display assembly 2, and the other is fixedly connected to the main body assembly 1. The arc-shaped rotating arm 31 rotates around the core shaft. The core shaft can be installed inside the main body housing 11, the arc-shaped rotating arm 31 is installed on the display housing 21 of the display assembly 2, and the arc-shaped rotating arm 31 passes through the through hole on the main body housing 11 and can rotate around the core shaft. The structure of this rotation shaft structure is simple and occupies a relatively small thickness space.

[0059] Please refer to Figure 5 , Figure 5 For Figure 3-1 is an exploded view of the main body assembly in the electronic device shown. In the embodiment of the present application, the main body assembly 1 further includes a main touch screen 14 and a main board 13. Among them, the keyboard 12 and the main board 13 are fixed in the inner cavity of the main body housing 11. The main body housing 11 generally includes two parts: a first housing 11-1 and a second housing 11-2, and the two enclose the inner cavity. The first housing 11-1 is provided with a key cap hole 11-11 and a screen mounting hole 11-12. The keys of the keyboard 12 can be exposed outside the main body housing 11 through the key cap hole 11-11 to facilitate the user to input. The number of keys on the keyboard 12 can refer to the current technology. The keyboard 12 can be a mechanical keyboard 12 in the form of key caps, and of course, it can also be a keyboard 12 form with partial touch keys. The main touch screen 14 is mainly used for the mouse function and is installed at the position of the screen mounting hole 11-12. Usually, the main touch screen 14 is located on the side of the keyboard 12 close to the user for the convenience of the user to operate. For example Figure 2As shown, the host housing 11 includes a rotating end portion on which a rotating shaft structure 3 is disposed, and the main touch screen 14 is located on a side of the keyboard 12 away from the rotating end portion and away from the top of the host assembly 1 .

[0060] In the embodiment of the present application, the motherboard 13 is also generally referred to as an integrated circuit board, which carries the function of connecting various hardware devices and components, and is mainly responsible for data transmission, energy supply, and coordination of the work of various hardware devices. The motherboard 13 has a central processing unit (CPU), a graphics processing unit (GPU), a basic input output system (BIOS) chip, a chipset, a memory controller chip, a hard disk controller chip, a sound chip, a charging chip, a power management chip, a network interface card or a wireless local area network module, an expansion card slot controller, a power management chip, and a data line, etc. Depending on the type of electronic device, the electronic device may include more or less structures than the components listed above, or combine some components, or split some components, or arrange the components differently.

[0061] Please refer to Figure 7-1 and Figure 7-2 In the embodiment of the present application, the mainboard 13 is located on the side of the keyboard 12 away from the key operation part. For the keyboard 12 whose key operation part is a key cap, the mainboard 13 is located on the side of the keyboard 12 away from the key cap. The mainboard 13 is located in the space enclosed by the host housing 11 and the keyboard 12. Figure 8 and Figure 9 understand, Figure 8 for Figure 6 The schematic top view of the host assembly without the first housing is shown; Figure 9 for Figure 8 The structure shown is a schematic diagram without the keyboard. In the embodiment of the present application, along a plane parallel to the mainboard 13, the mainboard 13 has a first plate portion 131 arranged staggered with the keyboard 12, and the main heating area of the mainboard 13 is at least partially arranged on the first plate portion 131. The so-called main heating area of the mainboard 13 refers to the area where the mainboard 13 is provided with relatively high-power electronic devices, that is, at least part of the electronic devices on the mainboard 13 that generate relatively high heat are arranged on the first plate portion 131. Figure 8 and Figure 9Two main heating areas are shown: a first main heating area 134 and a second main heating area 135. The first main heating area 134 is provided with a first heating device 133, and the second main heating area 135 is provided with a second heating device 136. Of course, the number of heating devices arranged on the first board portion 131 and the number of main heating areas are not limited to those described herein and are reasonably determined according to the number of heating devices arranged on the main board 13. In theory, high-power devices with large heat generation on the main board 13 can be concentrated on the first board portion 131. Electron devices with relatively large power include but are not limited to the following: chipset, CPU, BIOS chip, etc. The chipset can be a System on Chip (SOC).

[0062] In the embodiment of the present application, at least a part of the main board 13 extends to the outside of the projection of the keyboard 12 on a plane parallel to the plane of the main board 13. In this way, relatively large electron devices on the main board 13 can be arranged on the first board portion 131, so that the thickness of the position where the keyboard 12 is located will be greatly reduced. Even if a part of the main board 13 is located directly below the keyboard 12, the thickness occupied by this part of the main board 13 is relatively small. This is beneficial to reducing the overall thickness of the electronic device and meeting the thin and light design requirements of the electronic device. Of course, relatively large power electron devices on the main board 13 can also be arranged on the first board portion 131. In this way, after moving part or all of the relatively large power electron devices out from directly below the keyboard 12, the influence of the heat emitted by the main board 13 on the keyboard 12 will be reduced, the temperature of the keyboard 12 area will be lowered, and the user experience will be improved.

[0063] Especially for a notebook computer with low power consumption (for example, about 20W), the area of the main board 13 is relatively small, and the main board 13 can be completely staggered from the keyboard 12. In this way, the thickness of the electronic device can be determined solely by the thickness of the main board 13 or the thickness of the keyboard 12. Compared with the sum of the thickness of the main board 13 and the keyboard 12 in the prior art, the thickness of the electronic device provided by the embodiment of the present application can be further reduced to meet the thin and light design requirements of the electronic device.

[0064] Please refer to again Figure 6 , Figure 6 shows the temperatures at four positions when the host component 1 is working. The temperature at point P1 is 43.3 °C, the temperature at point P2 is 42.1 °C, the temperature at point P3 is 40.3 °C, and the temperature at point P4 is 45.3 °C. From Figure 6 it can be seen that the highest temperature of the host component 1 is far from the keyboard 12 area. In the prior art, the highest temperature point P (please refer to Figure 1 ) of the electronic device during operation is located at the position of the keyboard 12. Therefore, when the host component 1 provided by the embodiment of the present application is working, the area where the keyboard 12 is located is less affected by the temperature of the main board 13.

[0065] As Figure 8 andFigure 9 As shown, in the embodiment of the present application, the main board 13 and the keyboard 12 are completely staggered, that is, the projections of the main board 13 and the keyboard 12 in the plane parallel to the main board 13 do not overlap. This can further reduce the thickness of the electronic device, and the keyboard 12 is minimally affected by the main board 13.

[0066] Please refer to Figure 7-1 、 Figure 8 、 Figure 9 , in the embodiment of the present application, the host component 1 further includes a cooling fan 16. The cooling fan 16 is located inside the cavity of the host housing 11 and is mainly used to dissipate heat from the heat-generating components on the main board 13. The cooling fan 16 is located outside the projections of the keyboard 12 and the main board 13 in the plane parallel to the main board 13. That is to say, the cooling fan 16 is arranged staggeredly with the keyboard 12 and does not overlap in the thickness direction. Similarly, the cooling fan 16 is also arranged staggeredly with the main board 13 and does not overlap in the thickness direction. The cooling fan 16 is arranged beside the main board 13. In order to install the cooling fan, the main board 13 can be provided with a corresponding avoidance structure. The number of cooling fans 16 can be one or two. The cooling fan 16 and the first board portion 131 are on the same side of the keyboard 12. The figure shows that the cooling fan 16 and the first board portion 131 are located on the side of the keyboard 12 close to the rotating shaft structure. Figure 9 shows an example in which two cooling fans 16 are located on one side of the main board 13. Of course, the two cooling fans 16 can also be located on both sides of the main board 13 along the S2 direction. The relative installation position of the cooling fan 16 and the main board 13 is related to the heat dissipation area required on the main board 13 and the arrangement of each electronic component in the host component 1. The installation position of the cooling fan 16 can be reasonably set according to the specific product.

[0067] In the embodiment of the present application, the cooling fan 16 is not arranged overlapping with the main board 13 and the keyboard 12. In this way, the thickness of the host component 1 is only related to the component with the larger thickness among the cooling fan 16, the main board 13, and the keyboard 12. Please refer to Figure 7-1 and understand that the thickness of the cooling fan 16 is h, and the thickness of the main board is h2. Obviously, h is greater than h2. When designing, meeting the thickness requirement of the cooling fan 16 can meet the motherboard installation thickness requirement. Compared with the prior art where the cooling fan 16 overlaps with the keyboard 12, the thickness of the host component 1 in the embodiment of the present application can be thinner.

[0068] Please refer to Figure 9 , in the embodiment of the present application, a first battery 18 can also be added to the empty space directly below the keyboard 12. The first battery 18 is located between the keyboard 12 and the bottom wall of the host housing 11. This can make full use of the space in the thickness direction of the host component 1, increase the battery capacity of the host component 1, and improve the quality of the host component 1.

[0069] Moreover, on the side of the keyboard 12 away from the first board portion 131, in addition to the main touch screen 14 being provided, second batteries 19 are also provided on both sides of the main touch screen 14 in the S2 direction. Please refer to Figure 8 and Figure 9 , in this embodiment, the number of the second batteries 19 is two, and the installation flexibility is relatively high, which can make full use of the space inside the host housing 11. The host component 1 has a compact structure, which is beneficial to meeting the design requirements of the small-sized host component 1.

[0070] Of course, the first battery 18 and the second battery 19 can also be considered to be integrally provided to reduce the number of components of the host component 1.

[0071] Please refer to again Figure 8 and Figure 9 , in the embodiment of the present application, an antenna module 15 and a speaker 110 are further provided in the host component 1. The antenna module 15 and the speaker 110 are installed inside the host housing 11. The antenna module 15 and the speaker 110 can be integrated on both sides of the keyboard 12 along the S2 direction, so that the space on both the left and right sides of the keyboard 12 can be fully utilized, and the installation compactness of each component is relatively high.

[0072] Of course, the number of the antenna module 15 and the speaker 110 is not limited to the above in the present application. The number of the antenna module 15 can also be one, or three or more. Similarly, the number of the speaker 110 can also be one, or three or more.

[0073] Please refer to again Figure 8 、 Figure 9 and Figure 10 , in the implementation of the present application, the host component 1 further includes a radiator 17. The radiator 17 is at least partially stacked with the heat-generating components on the main heat-generating area of the first board portion 131, and the radiator 17 can at least dissipate heat from the heat-generating components stacked with it. Figure 9 and Figure 10 show that the radiator 17 is stacked on the side of the first heat-generating device 133 away from the main board 13. The projections of the radiator 17 and the keyboard 12 on the main board 13 do not overlap, that is to say, the radiator 17 is located on the first board portion 131 that is misaligned with the keyboard 12, and the radiator 17 is also misaligned with the keyboard 12. Please refer to Figure 7-1It is understood that among the thickness h of the cooling fan 16, the total thickness h1 of the stacked first plate portion 131 and the radiator 17, and the thickness of the keyboard 12, the thickness of the cooling fan 16 is the largest. Therefore, in the design, as long as the thickness of the main body housing 11 can meet the requirement of accommodating the cooling fan 16, it can meet the installation requirements of the keyboard 12, as well as the motherboard 13 and the radiator 17. In the embodiment of the present application, at the positions where the keyboard 12, the motherboard 13, and the cooling fan 16 are arranged, the maximum thickness of the main body component 1 is approximately equal to the sum of the thickness of the cooling fan 16, the gap between the thickness of the cooling fan 16 and the main body housing 11 in the thickness direction, the thickness of the first housing 11-1, and the thickness of the second housing 11-2.

[0074] The total thickness of the main body component 1 provided in the embodiment of the present application is determined by the thickness of the cooling fan 16, and is approximately equal to the sum of the thickness of the cooling fan 16, the gap between the cooling fan 16 and the main body housing, and the thickness of the main body housing. Compared with the prior art where the cooling fan, the motherboard, and the keyboard are stacked, the thickness of the main body component 1 can reduce the thickness difference between the keyboard and the main body housing. The overall thickness reduction range of the main body component 1 is approximately 2.5 mm to 3.5 mm. The above range values are only the preferred values for the thickness reduction of the main body component 1, and those skilled in the art should understand that the thickness reduction value of the main body component 1 is not limited to the values described herein.

[0075] In the embodiment of the present application, the setting position of the radiator 17 is optimized, which is beneficial to obtaining a smaller overall thickness of the main body component 1.

[0076] In the embodiment of the present application, the radiator 17 can be a heat pipe radiator. Please refer to Figure 8 and Figure 9 again. Part of the pipe section 171 of the heat pipe radiator is arranged on the first plate portion 131, and the other part of the pipe section extends between the cooling fan 16 and the heat dissipation through hole 11b of the main body housing 11. In this way, while meeting the requirement of cooling the heat-generating components, the heat pipe radiator has a small thickness and minimizes the occupation of the thickness at the position of the first plate portion 131.

[0077] Please combine Figures 11 to 12 to understand that in the embodiment of the present application, a part of the motherboard 13 can also extend directly below the keyboard 12, that is, a part of the motherboard 13 overlaps with the keyboard 12. In the embodiment of the present application, the overlapping part of the motherboard 13 and the keyboard 12 is defined as the second plate portion 132, and the second plate portion 132 is located inside the projection of the keyboard 12 on the motherboard 13. In this way, the main heat-generating area on the motherboard 13 can be located on the first plate portion 131, and the electronic devices with relatively small volume and power can be located on the second plate portion 132, which can appropriately reduce the size of the electronic device in the S1 direction.

[0078] In the embodiment of the present application, in order to minimize the thickness of the main body component 1, the structure of the keyboard 12 can be improved as follows.

[0079] Please refer to Figures 11 to 14 In the embodiment of the present application, the keyboard 12 includes a keycap-type button 12-1 and a touchpad 12-2, the touchpad 12-2 is integrated with at least one touch key 12-21, the second plate portion 132 is located below the touchpad 12-2, and the keycap-type button 12-1 is located on the side of the touchpad 12-2 away from the first plate portion 131. One or more rows of touch keys 12-21 can be set on the touchpad 12-2, which depends on the position of the main board 13. A touch key 12-21 on the touchpad 12-2 can be a single key with one character, such as an English letter key, and of course it can also be a combination key, with two characters on one touch key 12-21, which are selected and used by cooperating with the shift key, such as a combination key of F1 to F12 and a symbol key, or a combination key of a numeric key and a character, etc.

[0080] The touch pad 12 - 2 may be a strip-shaped structure, and the touch buttons 12 - 21 are arranged along the axial direction of the rotating shaft structure.

[0081] Compared with the keycap keyboard 12, the touch panel 12-2 is relatively thin, and can be raised by a height of H1 relative to the inner surface of the keycap key 12-2 located inside the host housing. Figure 14 It is understood that this can provide a larger space for the mainboard 13 located therebelow to a certain extent, thereby facilitating the arrangement of electronic components on the mainboard 13 .

[0082] and Figure 6 Compared with the embodiment structure, Figure 11 Although the second board portion 132 of the main board 13 in the disclosed embodiment is stacked directly below the keyboard 12, the embodiment of the present application sets the keyboard corresponding to the second board portion 132 to the structure of the touchpad 12-2, so that the total thickness of the host assembly is only increased by the thickness of the touchpad 12-2, and the thickness of the touchpad 12-2 is usually relatively thin, about 1 mm.

[0083] In the embodiment of the present application, the host housing 11, the cooling fan 16, the radiator 17, the battery and other components can be arranged with Figure 6 The structures in the provided embodiments are the same and will not be described again here.

[0084] The electronic device in the present application has the above-mentioned host component 1 of the present application, and therefore also has the above-mentioned technical effects of the host component 1.

[0085] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0086] The orientation terms mentioned in the embodiments of the present application, such as "inner", "outer", etc., are only with reference to the directions of the attached drawings. Therefore, the orientation terms used are for better and clearer description and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it should not be construed as a limitation to the embodiments of the present application.

[0087] In the description of the embodiments of the present application, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article or device.

[0088] In the embodiments of the present application, "and / or" is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after.

[0089] In this article, specific examples are used to elaborate on the principles and implementation manners of the present application. The description of the above embodiments is only for helping to understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A host component, applied to an electronic device, characterized in that, include: Host housing; A keyboard, supported by the first housing, having N keys; The main board is located in the inner cavity of the host shell and on the side of the keyboard away from the operating part of the key. Along a plane parallel to the main board, the main board has a first board portion that is staggered with the keyboard, and the main heating area of the main board is at least partially arranged on the first board portion.

2. The host component according to claim 1, wherein, The main heating area of the main board is completely arranged on the first board portion.

3. The host component according to claim 2, characterized in that, The mainboard and the keyboard are completely staggered, and the projections of the mainboard and the keyboard in a plane parallel to the mainboard do not overlap.

4. The host component according to claim 1, wherein The main board also includes a second board portion, which is connected to a side of the first board portion close to the keyboard, and a portion of the main heating area is located on the second board portion. The keyboard includes keycap-type buttons and a touchpad, and the touchpad is integrated with at least one touch button. The second board portion is located below the touchpad, and the keycap-type buttons are located on a side of the touchpad away from the first board portion.

5. The host component according to any one of claims 1 to 4, characterized in that It also includes a heat dissipation fan located outside the projections of the keyboard and the mainboard on a plane parallel to the mainboard, and the heat dissipation fan and the first plate portion are located on the same side of the keyboard.

6. The host component according to claim 5, wherein It also includes a heat sink, which at least partially overlaps with the heat-generating components on the main heat-generating area of the first board portion, and the projections of the heat sink and the keyboard on the main board do not overlap.

7. The host component according to claim 6, wherein The radiator is a heat pipe radiator, a part of the pipe section of the heat pipe radiator is arranged on the first plate portion, and another part of the pipe section extends between the heat dissipation fan and the heat dissipation through hole of the host housing.

8. The host component according to any one of claims 1 to 7, characterized in that Also included is a first battery, which is located between the keyboard and the bottom wall of the host housing.

9. The host component according to any one of claims 1 to 8, characterized in that It also includes a main touch screen and two second batteries, wherein the main touch screen can at least be used as a mouse function, the main touch screen and the two second batteries are both located on the side of the keyboard away from the first plate portion, and the two second batteries are located on both sides of the main touch screen.

10. The host component according to any one of claims 1 to 9, characterized in that, Antenna modules and / or speakers are integrated in both side areas of the keyboard along a predetermined direction. In a plane parallel to the main board, the predetermined direction is perpendicular to the arrangement direction of the keyboard and the first board portion.

11. The host component according to any one of claims 1 to 10, characterized in that, The electronic device includes a display component, which is rotatably connected to the host component via a hinge mechanism so that the electronic device is in an open state or a closed state. The host housing includes a surface located on one side of the keyboard, and the surface is partially raised upward to form a raised portion. The raised portion and the first plate portion are located on the same side of the host component, and the hinge structure is arranged on the raised portion.

12. The host component according to claim 11, characterized in that, When the electronic device is in a closed state, the raised surface of the raised portion and the outer surface of the display assembly facing away from the display surface form a partial appearance surface of the electronic device; Alternatively or alternatively, when the electronic device is in an open state, the protrusion is located on the back side of the display assembly.

13. The host component according to claim 11, wherein The host housing further comprises a bottom wall, the protrusion is connected to the bottom wall via a connecting side wall, and the connecting sockets in the host assembly are centrally arranged on the connecting side wall.

14. An electronic device, characterized in that, It includes a display component, a rotating shaft structure, and the host component described in any one of claims 1-13. The host component and the display component are rotatably connected through the rotating shaft structure.

15. The electronic device according to claim 14, wherein The number of the rotating shaft structures is two, and the first plate portion and the heat dissipation fan of the host component are located between the two rotating shaft structures.

16. The electronic device according to claim 14 or 15, characterized in that, Each of the rotating shaft structures includes an arc-shaped rotating arm and a core shaft. One is fixedly connected to the display component, and the other is fixedly connected to the host component. The arc-shaped rotating arm rotates around the core shaft.

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