Radio frequency chip and electronic device

Abstract

The radio frequency chip and the electronic equipment provided by the embodiments of the present disclosure comprise: a first baseband circuit, a second baseband circuit and at least one signal processing link; the signal processing link comprises: a quadrature frequency conversion module and a transceiving amplification module; the transceiving amplification module is used for amplifying signals and receiving and sending signals through an external antenna terminal; the quadrature frequency conversion module is connected with the first baseband circuit and the second baseband circuit respectively; the quadrature frequency conversion module is used for adjusting the frequency of input signals; the first baseband circuit and the second baseband circuit are connected with the external circuit of the radio frequency chip respectively, and are used for processing signals input into the baseband circuit respectively. The radio frequency chip provided by the present disclosure integrates the signal receiving and signal sending functions in the same radio frequency chip through architecture innovation, can realize half-duplex communication, realizes the integration of the radio frequency chip through sharing the baseband circuit, and can realize the coverage of multiple frequency bands through flexible configuration of the signal processing link.

Description

Technical Field

[0001] The present disclosure relates to the field of communication technology, and in particular to a radio frequency chip and electronic equipment. Background Art

[0002] With the rapid development of modern communications technology, the demand for multifunctional, integrated, miniaturized, low-power, and low-cost radio equipment has become increasingly urgent. To meet these demands, RF channel processing systems, as core components of radio equipment, must possess wide frequency coverage, flexible reconfigurability, high integration, and high performance / performance ratios. However, the implementation and technical architecture of traditional RF channel processing systems have significant limitations, hindering the performance improvement and intensive development of radio equipment.

[0003] As the core of the RF channel processing system, traditional RF channel links are typically built from multiple discrete RF receiver chips, transmitter chips, and peripheral circuits. This discrete architecture requires multiple chips to be cascaded to implement signal reception and transmission and processing functions, resulting in a bulky link, high power consumption, and significantly increased hardware complexity. In addition, the frequency band coverage of the devices in the discrete architecture is limited, making it difficult to support wide-band reconfiguration requirements. The impedance matching and signal isolation performance between the devices are poor, further reducing the flexibility and reliability of the communication system. These problems severely limit the application of radio equipment in miniaturized, multi-functional integrated scenarios. Summary of the Invention

[0004] The embodiments of the present disclosure provide a radio frequency chip and electronic device to solve the problems of separate transceiver chips, circuit structure load, large size, high power consumption and limited frequency band coverage in radio frequency channel links.

[0005] Based on the above problems, in a first aspect, an embodiment of the present disclosure provides a radio frequency chip, comprising: a first baseband circuit, a second baseband circuit, and at least one signal processing link;

[0006] The signal processing link includes: an orthogonal frequency conversion module and a transmitting and receiving amplification module;

[0007] The first end of the amplifying module is connected to the external antenna end of the RF chip; the second end and the third end of the amplifying module are respectively connected to the orthogonal frequency conversion module; the amplifying module is used to amplify the signal and receive and send the signal through the external antenna end;

[0008] The orthogonal frequency conversion module is connected to the first baseband circuit and the second baseband circuit respectively; the orthogonal frequency conversion module is used to adjust the input signal frequency;

[0009] The first baseband circuit and the second baseband circuit are respectively connected to the external circuit of the radio frequency chip; and are respectively used to process the signals input to the baseband circuit.

[0010] In combination with the first aspect, in a possible implementation manner, the radio frequency chip switches the working mode according to the host computer signal; wherein the working mode includes: a receiving mode and a transmitting mode;

[0011] The transceiver amplification module is configured to receive and amplify a first signal transmitted by the external antenna when the RF chip is in a receiving mode; the first signal is processed by the transceiver amplification module, the orthogonal frequency conversion module, the first baseband circuit, and the second baseband circuit and then output as a first baseband orthogonal signal;

[0012] The first baseband circuit and the second baseband circuit are used to receive a second baseband orthogonal signal transmitted by an external circuit of the RF chip when the RF chip is in a transmitting mode; the second baseband orthogonal signal is processed by the first baseband circuit, the second baseband circuit, the orthogonal frequency conversion module and the transceiver amplification module and output as a second signal.

[0013] In combination with the first aspect, in a possible implementation manner, the transmitting and receiving amplification module includes: a signal switching device, a first amplifier and a second amplifier;

[0014] The first end of the signal switching device is connected to the external antenna end of the radio frequency chip;

[0015] The second end of the signal switching device is connected to the input end of the first amplifier;

[0016] The third terminal of the signal switching device is connected to the output terminal of the second amplifier;

[0017] The output end of the first amplifier is connected to the orthogonal frequency conversion module, and the first amplifier is used to adjust the received first signal into a first differential signal and transmit it to the orthogonal frequency conversion module when the first end of the signal switching device and the second end of the signal switching device are conductive;

[0018] The second amplifier input terminal is connected to the orthogonal frequency conversion module. The first amplifier is used to adjust the received second differential signal into the second signal when the first terminal of the signal switching device and the third terminal of the signal switching device are conductive.

[0019] In combination with the first aspect, in a possible implementation manner, the transceiver amplification module is configured to convert the received first signal into the first differential signal and transmit the signal to the orthogonal frequency conversion module when the RF chip is in a receiving mode;

[0020] The orthogonal frequency conversion module is used to mix the first differential signal with a local oscillator orthogonal differential signal and then output the first orthogonal differential signal to the first baseband circuit and the second baseband circuit;

[0021] The first baseband circuit and the second baseband circuit are used to adjust the first orthogonal differential signal to obtain the first baseband orthogonal signal; and output the first baseband orthogonal signal to the external circuit of the radio frequency chip.

[0022] In combination with the first aspect, in one possible implementation, the first baseband circuit and the second baseband circuit are configured to, when the RF chip is in a transmit mode, respectively adjust the received second baseband orthogonal signal into a second orthogonal differential signal and then output the signal to the orthogonal frequency conversion module;

[0023] The orthogonal frequency conversion module is used to convert the frequency of the second orthogonal differential signal and output the second differential signal;

[0024] The receiving, transmitting and amplifying module is used to obtain the second signal according to the second differential signal and output it to the external antenna end of the radio frequency chip.

[0025] In combination with the first aspect, in a possible implementation manner, the signal switching device is configured to switch the conduction state of the first amplifier and the second amplifier according to the state of the radio frequency chip;

[0026] Wherein, when the RF chip is in a receiving state, the first amplifier is turned on and the second amplifier is turned off; the first signal is input into the signal switching device via the first end of the signal switching device and output to the first amplifier via the signal switching device;

[0027] When the RF chip is in a transmitting state, the second amplifier is turned on and the first amplifier is turned off; the second signal obtained by the second amplifier is input into the signal switching device via the third terminal of the signal switching device.

[0028] In combination with the first aspect, in a possible implementation manner, the orthogonal frequency conversion module includes: an orthogonal signal generating circuit, a first orthogonal mixer, and a second orthogonal mixer;

[0029] A first end of the first quadrature mixer is connected to the first amplifier, a second end of the first quadrature mixer is connected to the first baseband circuit, and a third end of the first quadrature mixer is connected to the second baseband circuit;

[0030] A first end of the second quadrature mixer is connected to the second amplifier, a second end of the second quadrature mixer is connected to the first baseband circuit, and a third end of the second quadrature mixer is connected to the second baseband circuit;

[0031] The orthogonal signal generating circuit is connected to the first orthogonal mixer and the second orthogonal mixer respectively;

[0032] The orthogonal signal generating circuit is used to obtain four local oscillator orthogonal differential signals according to the input local oscillator signal, and output them to the first orthogonal mixer and the second orthogonal mixer respectively;

[0033] The first orthogonal mixer is configured to receive the first differential signal output by the transceiver amplification module and mix the first differential signal with the local oscillator orthogonal differential signal to obtain a first orthogonal differential signal when the RF chip is in a receiving mode;

[0034] The second orthogonal mixer is used to receive a second orthogonal differential signal when the RF chip is in a transmitting mode, and obtain a second differential signal after mixing it with the local oscillator orthogonal differential signal.

[0035] In combination with the first aspect, in one possible implementation, the first baseband circuit and the second baseband circuit each include a plurality of signal processing devices, wherein the plurality of signal processing devices include at least: a filter, a third amplifier, and an attenuator;

[0036] The filter is used to filter out noise signals in the signal input to the baseband circuit;

[0037] The third amplifier is provided at the final stage of the baseband circuit, and is used to amplify the signal and output it to the outside of the radio frequency chip;

[0038] The attenuator is used to attenuate the signal input to the baseband circuit according to a preset step signal.

[0039] In combination with the first aspect, in a possible implementation manner, the first baseband circuit and the second baseband circuit further include: a feedback circuit, a fourth amplifier, a first equalizer, and a second equalizer;

[0040] The feedback circuit is used to provide feedback on the signal between the input and output ends of the baseband circuit;

[0041] The fourth amplifier is used to amplify the signal input to the baseband circuit;

[0042] The first equalizer and the second equalizer are used to increase the high-frequency gain of the signal input to the baseband circuit.

[0043] A second aspect of an embodiment of the present disclosure provides an electronic device, comprising: the radio frequency chip described in any one of the first aspects.

[0044] The beneficial effects of the embodiments of the present disclosure include:

[0045] An embodiment of the present disclosure provides a radio frequency chip and electronic device, comprising: a first baseband circuit, a second baseband circuit, and at least one signal processing link; the signal processing link comprises: an orthogonal frequency conversion module and a transceiver amplification module; the first end of the transceiver amplification module is connected to the external antenna end of the radio frequency chip; the second and third ends of the transceiver amplification module are respectively connected to the orthogonal frequency conversion module; the transceiver amplification module is used to amplify signals and receive and transmit signals through the external antenna end; the orthogonal frequency conversion module is respectively connected to the first baseband circuit and the second baseband circuit; the orthogonal frequency conversion module is used to adjust the input signal frequency; the first baseband circuit and the second baseband circuit are respectively connected to the external circuit of the radio frequency chip and are respectively used to process the signal input to the baseband circuit. The radio frequency chip provided by the present disclosure, through architectural innovation, integrates both signal transmission and reception functions within the same radio frequency chip, enabling half-duplex communication; and achieves integration of the radio frequency chip through a shared baseband circuit. Furthermore, flexible configuration of the signal processing link can achieve multi-band coverage. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 A schematic structural diagram of a radio frequency chip provided in an embodiment of the present disclosure;

[0047] Figure 2 A schematic diagram of the structure of a large-scale receiving and distributing module provided in an embodiment of the present disclosure;

[0048] Figure 3 A schematic structural diagram of an orthogonal frequency conversion module provided in an embodiment of the present disclosure;

[0049] Figure 4 A schematic structural diagram of a baseband circuit provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0050] The present disclosure provides a radio frequency chip and electronic device. Preferred embodiments of the present disclosure are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are intended only to illustrate and explain the present disclosure and are not intended to limit the present disclosure. Furthermore, the embodiments and features of the embodiments in this application may be combined with each other unless there is a conflict.

[0051] An embodiment of the present disclosure provides a radio frequency chip, comprising: a first baseband circuit, a second baseband circuit, and at least one signal processing link;

[0052] The signal processing link includes: orthogonal frequency conversion module and transmitting and receiving amplification module;

[0053] The first end of the transceiver module is connected to the external antenna end of the RF chip; the second end and the third end of the transceiver module are respectively connected to the orthogonal frequency conversion module; the transceiver module is used to send and receive signals through the external antenna;

[0054] The orthogonal frequency conversion module is connected to the first baseband circuit and the second baseband circuit respectively; the orthogonal frequency conversion module is used to adjust the input signal frequency;

[0055] The first baseband circuit and the second baseband circuit are respectively connected to the external circuit of the radio frequency chip and are respectively used to process the signals input to the baseband circuit.

[0056] In the disclosed embodiments, a radio frequency chip is provided that can be used in radio equipment. The radio frequency chip employs a differential I / Q zero-IF architecture, integrating multiple functions such as signal filtering, amplification, attenuation, up-conversion, and down-conversion. It can operate in half-duplex communication mode, achieving both receiving and transmitting functions on a single chip. The radio frequency chip can be produced using silicon-based processes.

[0057] The RF chip provided in this disclosure can perform both RF signal reception and transmission. Its structure includes a signal processing link and a baseband circuit. The signal processing link includes at least one signal processing link, one end of which is connected to an antenna external to the chip (e.g., the antenna of a radio device). RF signals received by the radio device antenna are input to the RF chip via one end of the signal processing link. The RF chip converts the RF signals into signals recognizable by the radio device through single-slip and down-conversion processes, thereby enabling signal reception. Baseband signals to be transmitted by the radio device (i.e., the second baseband quadrature signal in this disclosure) are transmitted by the RF chip's external circuitry to the baseband circuitry and then input to the RF chip. The RF chip performs up-conversion and other operations on the baseband signals to generate the corresponding RF signals, which are then output to the radio device's antenna via one end of the signal processing link, thereby enabling signal transmission. The external circuitry of the RF chip can be the radio device's control and processing unit (e.g., a microprocessor or digital signal processor).

[0058] For radio equipment that needs to cover multiple frequency bands, it is necessary to have a radio frequency chip that can process multi-band signals. The radio frequency chip provided by the embodiment of the present disclosure can be set up with multiple signal processing links of different frequency bands. The structure of each signal processing link is the same, but the operating frequency bands applicable to the components therein can be different. Each signal link can share the baseband circuit and local oscillator signal. This achieves coverage of multiple frequency bands with a single radio frequency chip and realizes chip integration.

[0059] like Figure 1 As shown, the present disclosure provides an RF chip covering the S-Ku band as an example, which includes two signal processing links 3 and a first baseband circuit 1 and a second baseband circuit 2. Each signal processing link 3 includes a transceiver amplification module 31 and an orthogonal frequency conversion module 32. Among them, one signal processing link 3 is used to process signals in the S band and the C band, and the frequency range is The signal processing link 3 is connected to the corresponding antenna terminal through the port RF_L. The other signal processing link 3 is used to process the X-band and Ku-band signals with a frequency range of The signal processing link 3 is connected to the corresponding antenna terminal through the port RF_H. The local oscillator signal is input into two orthogonal frequency conversion modules 32 through the port LO.

[0060] The RF chip can also include a standard serial-to-parallel conversion interface (SPI, Serial Peripheral interface), a reference power supply module (BGR, Bandgap Reference), a DC offset compensation module (DCOC, DC Offset Cancellation) and a second-order compensation module (IP2OC, Input Second-Order Intercept Point Offset Calibration).

[0061] Among them, BGR is a circuit module that generates a stable reference voltage for the RF chip; DCOC is used to eliminate the DC bias in the signal chain; IP2OC can calibrate the second-order intermodulation interference in the zero-IF architecture; SPI is used to enable the RF chip to transmit data over short distances with other peripheral devices. In the embodiment of the present disclosure, other peripheral devices may include the host computer of the RF chip.

[0062] In another embodiment provided by the present disclosure, the radio frequency chip switches the working mode according to the host computer signal; wherein the working mode includes: receiving mode and transmitting mode;

[0063] The transceiver amplification module is configured to receive and amplify a first signal transmitted by an external antenna when the RF chip is in a receiving mode; the first signal is processed by the transceiver amplification module, the orthogonal frequency conversion module, the first baseband circuit, and the second baseband circuit to output a first baseband orthogonal signal;

[0064] The first baseband circuit and the second baseband circuit are used to receive the second baseband orthogonal signal transmitted by the external circuit of the RF chip when the RF chip is in the transmitting mode; the second baseband orthogonal signal is processed by the orthogonal frequency conversion module and the transceiver amplification module and output as the second signal.

[0065] In the embodiment of the present disclosure, the host computer of the RF chip may be a controller in a radio device, and the controller may control the working mode of the RF chip by sending a control signal (ie, a host computer signal) via SPI.

[0066] The first signal can be a radio frequency signal received by the antenna of the radio device (i.e., the external antenna of the aforementioned radio frequency chip). The antenna inputs the received first signal into the radio frequency chip connected to the antenna. The radio frequency chip then demodulates the first high-frequency signal to extract a first baseband orthogonal signal containing target information (e.g., voice and data). It should be noted that the first baseband orthogonal signal can be a signal in an orthogonal decomposition form, comprising two signal components, each of which can be transmitted as a differential signal pair. The first baseband orthogonal signal can be a low-frequency signal.

[0067] The second baseband orthogonal signal can be the information that the radio device needs to transmit. After being input into the RF chip and modulated by the RF chip, the second orthogonal signal is upconverted into a high-frequency carrier signal (i.e., the second signal). The second signal is then output to an antenna connected to the RF chip and transmitted by the antenna, enabling long-distance signal transmission. It should be noted that the second baseband orthogonal signal can be a signal that directly carries the original information (e.g., the voice, data, or image to be transmitted). It can be in the form of a low-frequency signal in an orthogonal decomposition form. This signal can include two signal components, each of which can be transmitted as a differential signal pair.

[0068] In another embodiment provided by the present disclosure, Figure 2 As shown, the receiving and transmitting amplification module includes: a signal switching device 311, a first amplifier 312 and a second amplifier 313;

[0069] The first terminal 314 of the signal switching device is connected to the external antenna terminal of the radio frequency chip;

[0070] The second terminal 315 of the signal switching device is connected to the input terminal of the first amplifier 312;

[0071] The third terminal 316 of the signal switching device is connected to the output terminal of the second amplifier 313;

[0072] The output end of the first amplifier 312 is connected to the orthogonal frequency conversion module; the first amplifier 312 is used to adjust the received first signal into a first differential signal and transmit it to the orthogonal frequency conversion module when the first end of the signal switching device and the second end of the signal switching device are connected;

[0073] The input end of the second amplifier 313 is connected to the orthogonal frequency conversion module; the second amplifier 313 is used to adjust the received second differential signal into the second signal when the first end of the signal switching device and the third end of the signal switching device are connected.

[0074] In the embodiment of the present disclosure, the signal switching device 311 can be a component that changes the internal signal path according to an external enable signal. In practical applications, this function can be implemented by a field effect transistor (FET) or a heterojunction bipolar transistor (HBT). This is for illustration only and is not limiting. The signal switching device 311 can include three connection ports. Among them, the first end 314 of the signal switching device is connected to the antenna end outside the chip. In the receiving mode, the first signal can be input into the signal switching device 311 through the first end and output from the second end 315 of the signal switching device to the input end of the first amplifier 312.

[0075] First amplifier 312 can be a low-noise amplifier. It can maintain signal integrity while reducing noise introduced by itself, enabling the acquisition of extremely low-intensity signals and improving the sensitivity of the receiving system. It can also convert single-ended signals into differential signals. In the present disclosure, first amplifier 312 can convert the received first signal from a single-ended signal into a differential signal and amplify it to obtain a first differential signal.

[0076] The input of the second amplifier 313 is connected to the orthogonal frequency conversion module. In transmit mode, it receives the second differential signal generated by the orthogonal frequency conversion module and converts the second differential signal into a single-ended RF signal (i.e., the second signal). The second amplifier 313 can be a power amplifier that amplifies the input signal and converts the differential signal into a single-ended signal, providing sufficient power for the output signal to drive the load. The second signal output by the second amplifier 313 is input to the third terminal of the signal switching device 311 and output through the first terminal 314 of the signal switching device to the external antenna terminal of the chip.

[0077] In another embodiment provided by the present disclosure, the transceiver amplification module is configured to adjust the received first signal into a first differential signal and transmit the first differential signal to the orthogonal frequency conversion module when the radio frequency chip is in a receiving mode;

[0078] an orthogonal frequency conversion module, configured to mix the first differential signal with a local oscillator orthogonal differential signal and then output the first orthogonal differential signal to the first baseband circuit and the second baseband circuit;

[0079] The first baseband circuit and the second baseband circuit are used to adjust the first orthogonal differential signal to obtain a first baseband orthogonal signal; and output the first baseband orthogonal signal to an external circuit of the radio frequency chip.

[0080] In an embodiment of the present disclosure, when the RF chip is in receiving mode, the orthogonal frequency conversion module receives the first differential signal sent by the transceiver amplification module. The differential signal may be a signal pair consisting of two signals with a phase difference of 180°. After the first differential signal is input into the orthogonal frequency conversion module, it is mixed with the local oscillator orthogonal differential signal to achieve orthogonal down-conversion and generate a first orthogonal differential signal. The orthogonal differential signal may be composed of an in-phase component and a quadrature component, the two signal components having equal amplitudes and maintaining a phase difference of 90°, and each signal component may be transmitted using a differential signal pair.

[0081] The orthogonal frequency conversion module transmits the two signal components of the generated first orthogonal differential signal to the first and second baseband circuits, respectively. Each baseband circuit performs baseband frequency gain adjustment, low-pass filtering, and amplification on the input signal components, and outputs a processed signal component. The two signal components output by the first and second baseband circuits form a set of orthogonal differential signals, known as the first baseband quadrature signals. The first baseband quadrature signals are output outside the RF chip and can be used as signals that can be recognized by other components within the radio device, thereby enabling RF signal reception.

[0082] In another embodiment provided by the present disclosure, the first baseband circuit and the second baseband circuit are configured to respectively adjust the received second baseband orthogonal signal into a second orthogonal differential signal and then output the signal to the orthogonal frequency conversion module when the radio frequency chip is in a transmit mode;

[0083] an orthogonal frequency conversion module, configured to convert the frequency of the second orthogonal differential signal and output a second differential signal;

[0084] The receiving and transmitting amplification module is used to obtain a second signal according to the second differential signal and output it to the external antenna end of the radio frequency chip.

[0085] In the disclosed embodiment, when the RF chip is in transmit mode, the first baseband circuit and the second baseband circuit perform amplitude adjustment and low-pass filtering on the received second baseband quadrature signal to generate a second quadrature differential signal, which is then output to the quadrature frequency conversion module. The second baseband quadrature signal can be generated by a radio device and intended to be transmitted to another radio device.

[0086] It should be noted that the second baseband orthogonal signal may be an orthogonal signal composed of two signal components transmitted in the form of a differential signal pair. The two signal components may be generated by a signal generating unit in the radio device and input into two baseband circuits respectively.

[0087] The orthogonal frequency conversion module up-converts the received second orthogonal differential signal to a radio frequency, converts it into a second differential signal, and outputs the second differential signal to the transceiver amplification module.

[0088] The transceiver amplification module inputs the received second differential signal into the second amplifier 313, amplifies the second differential signal and converts it into a single-ended RF signal (i.e., the second signal), and then outputs it to the antenna end outside the RF chip to realize signal transmission.

[0089] In another embodiment provided by the present disclosure, the signal switching device 311 is configured to switch the conduction states of the first amplifier 312 and the second amplifier 313 according to the state of the radio frequency chip;

[0090] When the RF chip is in a receiving state, the first amplifier 312 is turned on and the second amplifier 313 is turned off; the first signal is input into the signal switching device 311 via the first end 314 of the signal switching device and is output to the first amplifier 312 via the signal switching device 311;

[0091] When the RF chip is in the transmitting state, the second amplifier 313 is turned on and the first amplifier 312 is turned off; the second signal obtained by the second amplifier 313 is input into the signal switching device 311 via the third terminal of the signal switching device 311 .

[0092] In the disclosed embodiment, the RF chip can change its operating mode based on signals from the host computer. When the RF chip is in receive mode, the first terminal 314 and the second terminal of the signal switching device are conductive, while the first terminal 314 to the third terminal of the signal switching device are disconnected, thereby turning on the first amplifier 312 and turning off the second amplifier 313. The first signal received by the external antenna terminal of the RF chip is input to the first amplifier 312 via the signal switching device 311.

[0093] When the RF chip is in transmit mode, the first terminal 314 and the third terminal of the signal switching device are conductive, while the first terminal 314 to the second terminal of the signal switching device are disconnected, thereby turning off the first amplifier 312 and turning on the second amplifier 313. The second amplifier 313 is connected to the antenna terminal outside the chip, and the second signal output by the second amplifier 313 is output to the antenna terminal outside the chip via the signal switching device 311, thereby achieving signal transmission.

[0094] In another embodiment provided by the present disclosure, Figure 3As shown, the orthogonal frequency conversion module includes: an orthogonal signal generating circuit 321, a first orthogonal mixer 322 and a second orthogonal mixer 323;

[0095] A first terminal 324 of the first quadrature mixer is connected to the first amplifier 312 , a second terminal 326 of the first quadrature mixer is connected to the first baseband circuit, and a third terminal 327 of the first quadrature mixer is connected to the second baseband circuit;

[0096] A first terminal 325 of the second quadrature mixer is connected to the second amplifier 313 , a second terminal 328 of the second quadrature mixer is connected to the first baseband circuit, and a third terminal 329 of the second quadrature mixer is connected to the second baseband circuit;

[0097] The quadrature signal generating circuit 321 is connected to the first quadrature mixer 322 and the second quadrature mixer 323 respectively;

[0098] The quadrature signal generating circuit 321 is used to generate four local oscillator quadrature differential signals according to the input local oscillator signal, and output them to the first quadrature mixer 322 and the second quadrature mixer 323 respectively;

[0099] The first orthogonal mixer 322 is configured to receive the first differential signal output by the transceiver amplification module and mix it with the local oscillator orthogonal differential signal to obtain a first orthogonal differential signal when the RF chip is in the receiving mode.

[0100] The second orthogonal mixer 323 is configured to receive the second orthogonal differential signal and mix it with the local oscillator orthogonal differential signal to obtain a second differential signal when the RF chip is in the transmit mode.

[0101] In the disclosed embodiment, the quadrature signal generation circuit 321 may first convert the input local oscillator signal into a differential signal, and then convert the differential signal into four local oscillator quadrature differential signals. The local oscillator signal may be converted into a differential signal using methods such as balun conversion, and the quadrature signal generation circuit 321 may employ a multi-stage polyphase filter structure.

[0102] Optionally, since the forward signal generation process may cause certain losses to the input signal, a corresponding driving amplifier can be cascaded at the subsequent stage of the orthogonal signal generation circuit 321 to compensate for the losses generated in the orthogonal signal generation process and ensure that the local oscillator orthogonal differential signal output by the orthogonal signal generation circuit 321 can reach the required amplitude.

[0103] Furthermore, when the RF chip is in the receiving mode, the first orthogonal mixer 322 uses the frequency addition and subtraction characteristics of the input high-frequency differential signal (i.e., the first differential signal) to achieve spectrum shifting and down-conversion, and converts the input differential signal pair (i.e., the first differential signal) into four orthogonal differential signals (i.e., the first orthogonal differential signal).

[0104] When the RF chip is in the transmitting mode, the second orthogonal mixer 323 receives the second orthogonal differential signal sent by the first baseband circuit and the second baseband circuit, and uses the local oscillator orthogonal differential signal generated by the orthogonal circuit as the carrier signal to up-convert the second orthogonal differential signal at the baseband frequency to obtain the second differential signal at the RF frequency.

[0105] In another embodiment provided by the present disclosure, the first baseband circuit and the second baseband circuit respectively include a plurality of signal processing devices, and the plurality of signal processing devices include at least: a filter, a third amplifier, and an attenuator;

[0106] A filter is used to filter out noise signals from the signal input to the baseband circuit;

[0107] The third amplifier is provided at the final stage of the baseband circuit and is used to amplify the signal and output it to the outside of the RF chip;

[0108] The attenuator is used to attenuate the signal input to the baseband circuit according to a preset step signal.

[0109] In the disclosed embodiments, when the RF chip is in receive mode, the two signal components of the orthogonal differential signal can be input into different baseband circuits. The baseband circuits can perform processing such as gain adjustment and signal amplification on the input signal components and output the processed signal components, thereby converting the first orthogonal differential signal into a first baseband orthogonal signal. The first baseband orthogonal signal is output from the RF chip as a signal that can be recognized by other components in the radio device.

[0110] When the RF chip is in transmit mode, the baseband circuit receives a second baseband quadrature signal. This second baseband quadrature signal can be generated by other components of the radio device and intended for transmission. The two signal components in the second baseband quadrature signal can be sent to different baseband circuits. The baseband circuits can then perform amplitude adjustment and signal amplification on each of the input signal components and output the two signal components to generate a second quadrature differential signal.

[0111] The baseband circuit may include multiple signal processing devices, and the corresponding signal processing devices can be configured as needed. To ensure that the signals obtained by the first baseband circuit and the second baseband circuit have the same delay, the first baseband circuit and the second baseband circuit should have the same structure.

[0112] The first baseband circuit and the second baseband circuit may include at least: a filter, a third amplifier, and an attenuator. The third amplifier may be provided at the final stage of the baseband circuit to amplify the baseband quadrature signal and provide sufficient drive capability for the signal output by the baseband circuit. The attenuator may be provided at the pre-stage of the baseband circuit to attenuate the signal input to the baseband circuit according to a preset step signal and adjust the signal gain.

[0113] The filter may be an Optimal and Precise Array Response Control Algorithm (OPARC) filter for filtering out-of-band harmonics, intermodulation products, and noise in the signal.

[0114] In another embodiment provided by the present disclosure, the first baseband circuit and the second baseband circuit further include: a feedback circuit, a fourth amplifier, a first equalizer, and a second equalizer;

[0115] A feedback circuit, used to provide feedback on a signal between an input terminal and an output terminal of a baseband circuit;

[0116] A fourth amplifier, configured to amplify a signal input to the baseband circuit;

[0117] The first equalizer and the second equalizer are used to increase the high-frequency gain of the signal input to the baseband circuit.

[0118] In the embodiment of the present disclosure, the baseband circuit may further include: a fourth amplifier, a first equalizer, and a second equalizer.

[0119] Among them, the fourth amplifier is used to provide high gain for the signal input to the baseband circuit and amplify the above signal; the first equalizer and the second equalizer are used to increase the high-frequency gain of the signal in the baseband circuit; the feedback circuit can be a DC offset calibration (DCOC, DCOffsetCancellation) circuit, which collects the DC offset at the output end of the baseband circuit and feeds it back into the input end of the baseband circuit to eliminate or suppress possible DC offsets in the baseband circuit caused by process deviations, device mismatches or environmental factors.

[0120] It should be noted that the signal processing device inside the baseband circuit provided by the present disclosure can be configured according to the actual application scenario, and the configuration of the signal processing device inside the baseband circuit is not fixed. Figure 4 The configuration of the baseband circuit shown in FIG. 1 is taken as an example. In one possible implementation, the first baseband circuit and the second baseband circuit can be implemented as follows: Figure 4Structure: wherein the fourth amplifier 401 serves as the input end of the baseband circuit to receive the first orthogonal differential signal or the second baseband orthogonal signal, the output end of the fourth amplifier 401 is connected to the input end of the first equalizer 402, the output end of the first equalizer 402 is connected to the input end of the attenuator 403, the output end of the attenuator 403 is connected to the output end of the second equalizer 404, the output end of the second equalizer 404 is connected to the input end of the filter 405, the output end of the filter 405 is connected to the input end of the third amplifier 406, the output end of the third amplifier 406 can output the first baseband orthogonal signal or the second orthogonal differential signal under different working modes of the RF chip, one end of the feedback circuit 407 is connected to the output end of the third amplifier 406, and the other end is connected to the input end of the fourth amplifier 401.

[0121] The present disclosure also provides an electronic device, comprising the radio frequency chip provided in any one of the embodiments of the present disclosure.

[0122] Through the above description of the embodiments, those skilled in the art will clearly understand that the embodiments of the present disclosure can be implemented through hardware or through software plus the necessary general-purpose hardware platform. Based on this understanding, the technical solutions of the embodiments of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, USB flash drive, or mobile hard drive) and includes a number of instructions for causing a computer device (such as a personal computer, server, or network device) to execute the methods described in the various embodiments of the present disclosure.

[0123] Those skilled in the art will understand that the accompanying drawings are merely schematic diagrams of a preferred embodiment, and the modules or processes in the accompanying drawings are not necessarily required for implementing the present disclosure.

[0124] Those skilled in the art will appreciate that the modules in the devices of the embodiments may be distributed in the devices of the embodiments as described in the embodiments, or may be located in one or more devices different from the embodiments with corresponding changes. The modules of the above embodiments may be combined into one module or further split into multiple submodules.

[0125] The serial numbers of the above-mentioned embodiments of the present disclosure are for description only and do not represent the advantages or disadvantages of the embodiments.

[0126] Obviously, those skilled in the art may make various changes and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include these modifications and variations.

Claims

1. A radio frequency chip, characterized in that: include: a first baseband circuit, a second baseband circuit, and at least one signal processing chain; The radio frequency chip switches the working mode according to the host computer signal; wherein the working mode includes: receiving mode and transmitting mode; The signal processing link includes: an orthogonal frequency conversion module and a transmitting and receiving amplification module; The first end of the amplifying module is connected to the external antenna end of the RF chip; the second end and the third end of the amplifying module are respectively connected to the orthogonal frequency conversion module; the amplifying module is used to amplify the signal and receive and send the signal through the external antenna end; The transceiver amplification module includes: a signal switching device, a first amplifier, and a second amplifier; the transceiver amplification module is used to receive and amplify the first signal transmitted by the external antenna end when the RF chip is in the receiving mode; and to obtain the second signal and output it to the external antenna end of the RF chip when the RF chip is in the transmitting mode; The first end of the signal switching device is connected to the external antenna end of the RF chip; the second end of the signal switching device is connected to the input end of the first amplifier; the third end of the signal switching device is connected to the output end of the second amplifier; the output end of the first amplifier is connected to the orthogonal frequency conversion module; the input end of the second amplifier is connected to the orthogonal frequency conversion module; The first amplifier is configured to adjust the received first signal into a first differential signal and transmit the first differential signal to the orthogonal frequency conversion module when the first end of the signal switching device and the second end of the signal switching device are conductive; The second amplifier is configured to adjust the received second differential signal into the second signal when the first terminal of the signal switching device and the third terminal of the signal switching device are conductive; The orthogonal frequency conversion module is connected to the first baseband circuit and the second baseband circuit respectively; the orthogonal frequency conversion module is used to adjust the input signal frequency; The first baseband circuit and the second baseband circuit are respectively connected to the external circuit of the RF chip, and are respectively used to process the signals input to the baseband circuit; the first baseband circuit and the second baseband circuit are used to receive the second baseband orthogonal signal transmitted by the external circuit of the RF chip when the RF chip is in the transmitting mode; and output the first baseband orthogonal signal to the external circuit of the RF chip when the RF chip is in the receiving mode.

2. The chip according to claim 1, wherein: The first signal is processed by the transceiver amplification module, the orthogonal frequency conversion module, the first baseband circuit and the second baseband circuit and output as a first baseband orthogonal signal; The second baseband orthogonal signal is processed by the first baseband circuit, the second baseband circuit, the orthogonal frequency conversion module and the transceiver amplification module and then output as a second signal.

3. The chip according to claim 2, wherein: The receiving and amplifying module is configured to adjust the received first signal into the first differential signal and transmit the signal to the orthogonal frequency conversion module when the RF chip is in a receiving mode; The orthogonal frequency conversion module is used to mix the first differential signal with a local oscillator orthogonal differential signal and then output the first orthogonal differential signal to the first baseband circuit and the second baseband circuit; The first baseband circuit and the second baseband circuit are used to adjust the first orthogonal differential signal to obtain the first baseband orthogonal signal; and output the first baseband orthogonal signal to the external circuit of the radio frequency chip.

4. The chip according to claim 2, wherein: The first baseband circuit and the second baseband circuit are configured to respectively adjust the received second baseband orthogonal signal into a second orthogonal differential signal and output the signal to the orthogonal frequency conversion module when the radio frequency chip is in a transmitting mode; The orthogonal frequency conversion module is used to convert the frequency of the second orthogonal differential signal and output the second differential signal; The receiving, transmitting and amplifying module is used to obtain the second signal according to the second differential signal and output it to the external antenna end of the radio frequency chip.

5. The chip according to claim 2, wherein: The signal switching device is used to switch the conduction state of the first amplifier and the second amplifier according to the state of the radio frequency chip; Wherein, when the RF chip is in a receiving state, the first amplifier is turned on and the second amplifier is turned off; the first signal is input into the signal switching device via the first end of the signal switching device and output to the first amplifier via the signal switching device; When the RF chip is in a transmitting state, the second amplifier is turned on and the first amplifier is turned off; the second signal obtained by the second amplifier is input into the signal switching device via the third terminal of the signal switching device.

6. The chip according to claim 2, wherein: The orthogonal frequency conversion module includes: an orthogonal signal generating circuit, a first orthogonal mixer and a second orthogonal mixer; A first end of the first quadrature mixer is connected to the first amplifier, a second end of the first quadrature mixer is connected to the first baseband circuit, and a third end of the first quadrature mixer is connected to the second baseband circuit; A first end of the second quadrature mixer is connected to the second amplifier, a second end of the second quadrature mixer is connected to the first baseband circuit, and a third end of the second quadrature mixer is connected to the second baseband circuit; The orthogonal signal generating circuit is connected to the first orthogonal mixer and the second orthogonal mixer respectively; The orthogonal signal generating circuit is used to obtain four local oscillator orthogonal differential signals according to the input local oscillator signal, and output them to the first orthogonal mixer and the second orthogonal mixer respectively; The first orthogonal mixer is configured to receive the first differential signal output by the transceiver / amplifier module and mix it with the local oscillator orthogonal differential signal to obtain a first orthogonal differential signal when the RF chip is in a receiving mode; The second orthogonal mixer is used to receive a second orthogonal differential signal when the RF chip is in a transmitting mode, and obtain a second differential signal after mixing it with the local oscillator orthogonal differential signal.

7. The chip according to claim 1, wherein: The first baseband circuit and the second baseband circuit respectively include a plurality of signal processing devices, wherein the plurality of signal processing devices include at least: a filter, a third amplifier and an attenuator; The filter is used to filter out noise signals in the signal input to the baseband circuit; The third amplifier is provided at the final stage of the baseband circuit, and is used to amplify the signal and output it to the outside of the radio frequency chip; The attenuator is used to attenuate the signal input to the baseband circuit according to a preset step signal.

8. The chip according to claim 6, wherein: The first baseband circuit and the second baseband circuit further include: a feedback circuit, a fourth amplifier, a first equalizer, and a second equalizer; The feedback circuit is used to provide feedback on the signal between the input and output ends of the baseband circuit; The fourth amplifier is used to amplify the signal input to the baseband circuit; The first equalizer and the second equalizer are used to increase the high-frequency gain of the signal input to the baseband circuit.

9. An electronic device, characterized in that: include: The radio frequency chip according to any one of claims 1 to 8.

Images