Molding die, resin molding device, and method for manufacturing resin molded article

Abstract

The molding die is provided with a molding die main body which holds an object to be molded and has a cavity to which a resin material is supplied, and the molding die main body is provided with: an upper die; a lower mold including a cartridge block in which a cartridge filled with a resin material is formed; and an intermediate mold (IM) disposed between the upper mold and the lower mold and having a first surface (81) facing the object to be molded. The intermediate mold (IM) has: a main body member (86) having a gate (84) for supplying a resin material to the cavity; an outer frame member (87) disposed on the periphery of the main body member (86); and a holding mechanism (88) that holds the main body member (86) to the outer frame member (87), the main body member (86) and the outer frame member (87) being separable.

Description

Technical Field

[0001] The present disclosure relates to a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product. Background Art

[0002] A substrate or the like on which a semiconductor chip is fixed is generally used as an electronic component by performing resin encapsulation. Conventionally, as a resin molding apparatus for resin-encapsulating a substrate or the like, an apparatus including a die for transfer molding is known. In transfer molding, there is a top gate method of supplying a resin material from a direction perpendicular to the substrate or the like (for example, refer to Patent Document 1).

[0003] The die for transfer molding of the top gate method disclosed in Patent Document 1 includes an upper die, a lower die, and an intermediate die (referred to as an intermediate die in Patent Document 1) between the upper die and the lower die. In the die disclosed in Patent Document 1, a runner is formed in the upper die, a cavity and a gate are formed in the intermediate die, and a cavity is formed in the lower die. There is also a case where the runner is formed in the intermediate die.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2009-196230 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] In the die for transfer molding of the top gate method, since a cavity, a gate, a runner, etc. are formed in the intermediate die, the machining of the intermediate die takes a long time when manufacturing the die. In addition, in the case of machining errors of the intermediate die or damage to a part of the intermediate die, the entire intermediate die becomes unusable.

[0009] Therefore, there is a need for a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product that can manufacture an intermediate die in a short time.

[0010] Solutions to the Problems

[0011] The characteristic configuration of the molding die of the present disclosure lies in the following points. It includes a molding die main body that holds the object to be molded and has a cavity into which a resin material is supplied. The molding die main body has: an upper die; a lower die including a barrel block formed with a barrel for filling the resin material; and an intermediate die disposed between the upper die and the lower die and having a first surface facing the object to be molded. The intermediate die has: a main body member having a gate for supplying the resin material to the cavity; an outer frame member disposed on the periphery of the main body member; and a holding mechanism that holds the main body member in the outer frame member, and the main body member and the outer frame member can be separated.

[0012] The characteristic configuration of the resin molding apparatus of the present disclosure lies in the following points. It includes: the molding die described above; and a mold clamping mechanism for clamping the molding die.

[0013] The manufacturing method of the resin molded product of the present disclosure is characterized in the following points. The resin molding apparatus described above is used. The manufacturing method of the resin molded product includes: a supply process of supplying the object to be molded and the resin material to the molding die; a mold clamping process of clamping the molding die by the mold clamping mechanism; and a molding process of performing resin molding of the object to be molded by causing the molten resin material to flow from the barrel through the gate into the cavity.

[0014] Advantages of the Invention

[0015] According to the present disclosure, it is possible to provide a molding die for an intermediate die, a resin molding apparatus, and a manufacturing method of a resin molded product that can manufacture the intermediate die in a short time. Description of the Drawings

[0016] Figure 1 It is a schematic diagram showing the resin molding apparatus of the first embodiment.

[0017] Figure 2 It is a schematic diagram showing the mold clamping mechanism of the resin molding apparatus.

[0018] Figure 3 It is a schematic diagram showing the molding process including the mold clamping process.

[0019] Figure 4 It is a schematic diagram showing the molding process including the mold clamping process.

[0020] Figure 5 It is an exploded perspective view of the intermediate die of the first embodiment.

[0021] Figure 6 It is a perspective view showing the intermediate die.

[0022] Figure 7 It is a top view showing the intermediate die.

[0023] Figure 8 is Figure 7 a view looking in the direction of line VIII-VIII of

[0024] Figure 9 is Figure 7 a view looking in the direction of line IX-IX of

[0025] Figure 10 is Figure 7 a view looking in the direction of line X-X of

[0026] Figure 11 is Figure 7 a view looking in the direction of line XI-XI of

[0027] Figure 12 is a perspective view showing the first holding member.

[0028] Figure 13 is a perspective view showing the second holding member.

[0029] Figure 14 is a cross-sectional view showing the intermediate mold of the second embodiment.

[0030] Figure 15 is a cross-sectional view showing the intermediate mold of the second embodiment.

[0031] Figure 16 is a cross-sectional view showing the intermediate mold of the third embodiment. Detailed Embodiments

[0032] Hereinafter, embodiments of the molding die, the resin molding apparatus, and the resin molded product of the present disclosure will be described based on the drawings. However, the present disclosure is not limited to the following embodiments, and various modifications can be made without departing from the gist thereof.

[0033] 〔Configuration of the Whole Apparatus〕

[0034] A molded object such as a substrate on which a semiconductor chip (hereinafter sometimes simply referred to as "chip") is fixed is used as an electronic component by resin encapsulation. This electronic component is used, for example, as a high-frequency module substrate for a portable communication terminal, a module substrate for power control, a substrate for device control, and the like. As one of the techniques for resin encapsulating a molded object, there is a transfer method of manufacturing a semiconductor package by resin encapsulating a BGA (Ball Grid Array) substrate or the like. In this transfer method, a substrate or the like on which a chip is fixed is accommodated in a cavity of a molding die, a resin sheet obtained by consolidating powdery resin is supplied to a barrel of the molding die, heated and melted, and then, in a state where the molding die is closed, the molten resin obtained by melting the resin sheet is supplied into the cavity to be cured, and the mold is opened to manufacture a resin molded product. It should be noted that the top gate method is used in the transfer method in this embodiment.

[0035] The powdery resin includes not only powdery resin but also a resin sheet formed of a solid resin obtained by compacting and consolidating the powdery resin, and either one becomes a molten resin in a liquid state by heating. The powdery resin can be a thermoplastic resin or a thermosetting resin. In the case of a thermosetting resin, the viscosity decreases when heated, and it polymerizes and cures when further heated to become a cured resin. For the powdery resin in this embodiment, from the viewpoint of ease of operation, a resin sheet formed of a solid resin is preferred. In addition, a highly fluid thermosetting resin containing micronized filler is preferred.

[0036] Figure 1 FIG. shows a schematic configuration of the resin molding apparatus 100 of this embodiment. The resin molding apparatus 100 is an apparatus that uses a molding die C and molds a pre-resin-molded substrate Sa (an example of a molded object) with resin. In this embodiment, the pre-resin-molded substrate Sa is rectangular and has a semiconductor chip fixed thereto in advance.

[0037] The resin molding apparatus 100 includes: a CPU (Central Processing Unit) 1 as a central control device; a storage unit 8 that stores control information such as a control program; a molding mechanism 2 that has a molding die C; a drive mechanism that drives the following respective parts; and a touch panel 9 that accepts input of operation instructions and abnormality processing-related information from an operator and displays various output information of the resin molding apparatus 100. The CPU 1 constitutes a control unit 10, and the control unit 10 controls the operations of the respective parts of the resin molding apparatus 100 by executing a program stored in the storage unit 8 or the like.

[0038] The operation of the resin molding apparatus 100 described below is performed based on the operation instructions of the control unit 10 unless otherwise specified. In the following description, the operation instructions of the control unit 10 are omitted in principle, and will be described as needed.

[0039] The resin molding apparatus 100 is constituted by a device that integrally connects the supply module M1, the molding module M2, and the accommodation module M3 in this order. The supply module M1 includes a feed cassette 7 that houses a plurality of resin pre-molding substrates Sa. The molding module M2 includes a molding die C. The accommodation module M3 includes a discharge cassette 72 that houses the resin-molded substrate Sb (an example of a resin molded product) after molding the resin pre-molding substrate Sa using resin. A guide member G is provided across each of these modules and is arranged in a straight line. The guide member G is a rail-shaped member along which a later-described loader 40 and unloader 44 travel. The guide member G is disposed on the back side of each module.

[0040] The modules are configured to be detachable and attachable to / from each other, so that they can be increased or decreased. The resin molding apparatus 100 of the present embodiment has two molding modules M2. The resin molding apparatus 100 may have only one molding module M2, or may have three or more molding modules M2.

[0041] 〔Drive mechanism〕

[0042] The drive mechanism includes a loader 40, a substrate supply unit 42, an unloader 44, a mold clamping mechanism 35, and a later-described transfer mechanism.

[0043] The loader 40 is a transport mechanism that transports the resin pre-molding substrate Sa into the molding die C. The substrate supply unit 42 is a transport mechanism that pushes out the resin pre-molding substrate Sa from the feed cassette 7 and delivers it to the alignment mechanism 70. The unloader 44 is a transport mechanism that removes the resin-molded substrate Sb from the molding die C. The transfer mechanism is a mechanism that supplies the resin obtained by melting a resin sheet T (an example of a resin material) from a barrel to a cavity in the molding die C. The mold clamping mechanism 35 is a mechanism that clamps the molding die C. The transfer mechanism is driven independently of the mold clamping mechanism 35.

[0044] The loader 40, the substrate supply unit 42, and the unloader 44 each have an actuator 40b, an actuator 42b, and an actuator 44b. The actuator 40b, the actuator 42b, and the actuator 44b are, for example, air cylinders corresponding to their respective installation locations, the distances for driving each part, and the like.

[0045] 〔Substrate supply unit〕

[0046] The substrate supply unit 42 is a mechanism that pushes out the resin pre - formed substrate Sa one by one from the cassette 7 and conveys it to the alignment mechanism 70. The cassette 7 is a storage container that stores a plurality of resin pre - formed substrates Sa at intervals in the vertical direction. The substrate supply unit 42 has an actuator 42b. In the present embodiment, the substrate supply unit 42 uses the actuator 42b to push out the resin pre - formed substrate Sa from the cassette 7 and move it to the alignment mechanism 70 arranged adjacent to the cassette 7. The alignment mechanism 70 has a rotating disk 70a. When the resin pre - formed substrate Sa is placed thereon, the rotating disk 70a rotates to align the resin pre - formed substrates Sa in a state suitable for the loader 40 to pick up the resin pre - formed substrate Sa. The substrate supply unit 42, the cassette 7, and the alignment mechanism 70 are provided in the supply module M1. The substrate supply unit 42, the cassette 7, and the alignment mechanism 70 are arranged on the front side of the guide G in the supply module M1.

[0047] 〔Loader〕

[0048] The loader 40 is a conveying mechanism that conveys the resin pre - formed substrate Sa into the molding die C. The loader 40 can move from the supply module M1 to the molding module M2 along the guide G. The loader 40 has a loader pickup portion 40a for picking up the resin pre - formed substrate Sa and the resin sheet T.

[0049] The loader pickup portion 40a includes a plurality of pairs of claws (not shown) extending downward. The loader pickup portion 40a uses an actuator (not shown) to drive the pair of claws to pick up the resin pre - formed substrate Sa from the alignment mechanism 70 and convey it to and place (load) it on the lower die LM of the molding die C. Hereinafter, the picking - up action performed by the loader pickup portion 40a is simply referred to as picking up.

[0050] In addition, the loader pickup portion 40a uses another actuator (not shown) to drive the claws for holding the resin material to pick up the resin sheet T from the resin supply device 79. The picking up of the resin sheet T is performed in the same manner as the picking up of the resin pre - formed substrate Sa. Among them, in the present embodiment, each claw picks up one resin sheet.

[0051] The loader pickup portion 40a can move forward and backward from the Figure 1 back side to the front side by using the actuator 40b. For the loader 40, the loader pickup portion 40a moves forward and backward to pick up the resin pre - formed substrate Sa from the alignment mechanism 70, and then moves from the supply module M1 to the molding module M2 along the guide G to convey the resin pre - formed substrate Sa into the molding die C. In addition, the loader 40 moves the loader pickup portion 40a forward and backward to receive the resin sheet T from the resin supply device 79, moves from the supply module M1 to the molding module M2, and conveys the resin sheet T into the molding die C.

[0052] 〔Unloader〕

[0053] The unloader 44 is a conveying mechanism for removing the resin-molded substrate Sb from the molding die C. The unloader 44 can move from the molding module M2 to the accommodation module M3 along the guide member G. The unloader 44 has an unloader pickup portion 44a for picking up the resin-molded substrate Sb and the like. The unloader pickup portion 44a can move back and forth from the back side to the front side by means of the actuator 44b. For the unloader 44, the unloader pickup portion 44a is moved back and forth to pick up the resin-molded substrate Sb from the lower die LM of the molding die C, moves from the molding module M2 to the accommodation module M3, and conveys and accommodates the resin-molded substrate Sb into the discharge box 72 of the accommodation module M3. Figure 1 It should be noted that the unloader pickup portion 44a, like the loader pickup portion 40a, is provided with a plurality of pairs of claws (not shown) extending downward. The pickup of the unloader pickup portion 44a is carried out in the same manner as the pickup of the loader pickup portion 40a.

[0054] 〔Molding Module〕

[0055] Next, the molding module M2 will be described in detail. As shown in, in the molding module M2, connecting rods (tie-bars) 32 are erected at the four corners of the lower fixed plate 31 which is rectangular in plan view, and an upper fixed plate 33 which is rectangular in plan view is provided near the upper ends of the connecting rods 32. A movable platen 34 which is rectangular in plan view is provided between the lower fixed plate 31 and the upper fixed plate 33. The movable platen 34 is provided with holes through which the connecting rods 32 pass at the four corners and can move up and down along the connecting rods 32. Above the lower fixed plate 31, there is a mold clamping mechanism 35 which is a device for moving the movable platen 34 up and down. The mold clamping mechanism 35 includes: an electric motor Ma composed of a servo motor or the like as a driving source; and a load sensor Wa composed of a strain gauge, a force sensor, etc. for measuring the mold clamping force (hereinafter referred to as "clamping force") of the molding die C. The mold clamping mechanism 35 can perform the mold clamping of the molding die C by moving the movable platen 34 upward, and perform the mold opening of the molding die C by moving the movable platen 34 downward.

[0056] Then, use Figure 2 The molding die C is configured to include a molding die main body M having a lower die LM, an upper die UM, and an intermediate die IM. The lower die LM, the upper die UM, and the intermediate die IM are composed of molds and the like, and the intermediate die IM is disposed between the lower die LM and the upper die UM. Figure 2

[0057]

[0058] ​​The lower mold LM is placed on the lower template 38, and the lower template 38 is placed on the movable platen 34. The lower mold LM includes: a base block 51, a lower mold ejector block 52 and a lower mold cavity block 53 disposed on the base block 51, and a barrel block 54. The lower mold ejector block 52 can move in the vertical direction (hereinafter, also referred to as the plumb direction) relative to the base block 51 and the lower mold cavity block 53. The lower mold ejector block 52 houses a plurality of lower mold ejector pins (not shown), and the resin-molded substrate Sb is ejected from the lower mold cavity block 53 by the lower mold ejector pins. The lower mold cavity block 53 is held by a lower mold holding block 38a extending upward from the lower template 38 and a plurality of lower mold support columns 51a. The lower mold holding block 38a has a lower mold holding claw 38b for holding the intermediate mold IM on the lower mold LM.

[0059] The substrate Sa before resin molding is placed on the upper surface of the lower mold cavity block 53 with the surface on which the semiconductor chip Sc etc. is fixed facing upward. In the present embodiment, in order to be able to mold two substrates Sa before resin molding by one molding operation, the lower mold LM has two lower mold cavity blocks 53, 53 arranged side by side left and right, and a barrel block 54 is disposed at a position sandwiched by the two lower mold cavity blocks 53, 53. A cylindrical recess, i.e., a barrel 54b, is formed in the barrel block 54, and a resin sheet T (resin melted by heating) is filled inside the barrel 54b. Below the barrel block 54, a plunger 54a driven by an electric motor Mb such as a servo motor is inserted so as to be able to move up and down. An elastic member (not shown) is provided at the support portion of the plunger 54a, and the plunger 54a is slightly displaced by the elastic force of the elastic member to release excess pressing force, and can conform to the deviation of the resin amount when the resin sheet T melts during pressure holding. In addition, the lower mold LM has a load sensor Wb composed of a strain gauge, a force sensor, etc. for measuring the force for pressing out the molten resin Ta (an example of a resin material) by the plunger 54a.

[0060] The upper mold UM is disposed opposite to the lower mold LM with the intermediate mold IM interposed therebetween. The upper mold UM includes a cage base 61 fixed to the lower surface of the upper fixed plate 33, a first upper mold ejector block 62 disposed below the cage base 61, a second upper mold ejector block 63, an upper mold cavity block 64, and a knockout block 65. The knockout block 65 is assembled to the lower surface 68 of the upper mold cavity block 64. The first upper mold ejector block 62 and the second upper mold ejector block 63 can move in the vertical direction relative to the cage base 61 and the upper mold cavity block 64. The first upper mold ejector block 62 houses a plurality of first upper mold ejector pins (not shown). It should be noted that the first upper mold ejector pins have a Z shape. At the time of mold opening, the unnecessary resin (hereinafter also referred to as the residual resin Tb) that remains in the knockout runner 83a, the runner 83, and the gate 84 and is solidified is held by the upper mold UM. After that, the residual resin Tb is separated from the resin-molded substrate Sb and ejected from the upper mold cavity block 64. The second upper mold ejector block 63 houses a plurality of second upper mold ejector pins (not shown). The resin-molded substrate Sb is ejected from the intermediate mold IM by the second upper mold ejector pins. The upper mold cavity block 64 is held by upper mold holding blocks 61a extending downward from both ends of the cage base 61 and a plurality of upper mold support columns 61b. Upper mold holding claws 61c for holding the intermediate mold IM to the upper mold UM are formed on the upper mold holding blocks 61a.

[0061] The intermediate mold IM has a plate shape. A runner 83 is formed on the second surface 82 on the side opposite to the upper mold UM, and a cavity MC is formed on the first surface 81 on the side opposite to the lower mold LM. Here, in the intermediate mold IM, the surface on the side opposite to the pre-resin-molded substrate Sa is referred to as the molding surface, and the surface on the opposite side is referred to as the non-molding surface. In the present embodiment, the second surface 82 becomes the non-molding surface, and the first surface 81 becomes the molding surface. The intermediate mold IM is formed with a gate 84 for supplying the molten resin Ta flowing in the runner 83 to the cavity MC from the second surface 82 to the first surface 81. In Figure 2 the intermediate mold IM has a cavity MC for accommodating and fixing a plurality of semiconductor chips Sc, etc. to the pre-resin-molded substrate Sa, and a through hole 85 for the molten resin Ta from the barrel 54b to flow is formed in a portion corresponding to the barrel 54b of the barrel block 54. The molding die main body M of the present embodiment is configured in a top gate manner with the gate 84 disposed above the cavity MC.

[0062] 〔Manufacturing method of resin molded product〕

[0063] Next, use Figures 1 to 4A method for manufacturing a resin molded product will be described. The method for manufacturing a resin molded product (resin molded completed substrate Sb) includes: a supply process of supplying a resin pre-molded substrate Sa and a resin sheet T to a molding die C; a mold clamping process of clamping the molding die C; and a molding process of performing resin molding on the resin pre-molded substrate Sa by filling molten resin Ta supplied from a gate 84 into a cavity MC. This molding process is a process in which the molding module M2 performs resin molding on the resin pre-molded substrate Sa during the period from the loading of the resin pre-molded substrate Sa into the molding module M2 to the unloading of the resin molded completed substrate Sb from the molding module M2, and this molding process includes a mold clamping process. The operations of the molding die C and the mold clamping mechanism 35 in the molding process are controlled by the control unit 10.

[0064] First, the supply process will be described. As Figure 1 shown, the loader 40 is pre-heated in a state where the accommodation space of the resin sheet T is insulated. In addition, a heater (not shown) is energized to pre-heat the molding die body M (also refer to Figure 2 ). Then, two resin pre-molded substrates Sa taken out from the feed cassette 7 are placed on the alignment mechanism 70. The alignment mechanism 70 has a rotating disk 70a. When the resin pre-molded substrates Sa are placed, the rotating disk 70a is rotated to align the resin pre-molded substrates Sa in a state suitable for the resin pre-molded substrate Sa to be picked up by the loader 40. The loader pickup portion 40a picks up the resin pre-molded substrate Sa from the alignment mechanism 70 by using an actuator 40b and places it on the loader 40, and receives the resin sheet T from the resin supply device 79 and accommodates it in the accommodation space of the resin sheet T of the loader 40. Then, the loader 40 transports the resin pre-molded substrate Sa to the molding module M2, places the resin pre-molded substrate Sa with the side fixed with the semiconductor chip facing upward on the substrate setting portion of the lower mold LM, and accommodates the resin sheet T in the cylinder 54b of the cylinder block 54 (refer to Figure 2 ). By accommodating the resin sheet T in the cylinder 54b of the cylinder block 54, a heater (not shown) built in the lower mold LM heats the resin sheet T to make it into molten resin Ta.

[0065] As Figure 2 shown, the intermediate mold IM is held by the upper mold holding claw 61c, and the second surface 82 contacts the lower surface 68 of the upper mold cavity block 64. Thereby, the intermediate mold IM is integrated with the upper mold cavity block 64. In addition, at this time, the knockout block 65 assembled to the upper mold cavity block 64 enters the through hole 85 of the intermediate mold IM, and a knockout flow path 83a (resin path of the knockout portion) for the molten resin Ta to flow is formed between the inner peripheral surface of the through hole 85 and the outer peripheral surface of the knockout block 65.

[0066] Next, the molding process including the mold clamping process will be described. First, starting from the state shown in Figure 2 , the movable platen 34 is moved upward by the mold clamping mechanism 35, and the lower mold LM is moved in the direction of the upper mold UM and the intermediate mold IM (vertical direction). As shown in Figure 3 , the lower mold cavity block 53 is brought into contact with the first surface 81 of the intermediate mold IM. Further, the movable platen 34 is moved upward by the mold clamping mechanism, and the lower mold LM is further moved in the direction of the upper mold UM to perform mold clamping. After the mold clamping is completed, the plunger 54a is moved upward by the electric motor Mb, and the molten resin Ta flows from the barrel 54b through the knockout runner 83a and the runner 83 to the gate 84. Then, the supply of the molten resin Ta to the cavity MC is started from the gate 84. After that, further, the transfer mechanism 39 including the plunger 54a rises, and the molten resin Ta in the barrel 54b is filled into the cavity MC. Then, after the filling of the molten resin Ta into the cavity MC is completed, after a predetermined time, the molten resin Ta is solidified.

[0067] After the molten resin Ta is solidified, the control unit 10 opens the molding die C by moving the movable platen downward by the mold clamping mechanism. At this time, since the intermediate mold IM is held by the lower mold holding claw 38b, it moves downward integrally with the lower mold LM, and the residual resin Tb is demolded from the intermediate mold IM and maintains a state of being in close contact with the upper mold cavity block 64. That is, the residual resin Tb is separated from the resin-molded substrate Sb by separating the intermediate mold IM from the upper mold UM (refer to Figure 4 ).

[0068] After that, as the first upper mold ejector block 62 moves downward, the residual resin Tb in close contact with the upper mold cavity block 64 is demolded from the upper mold cavity block 64 and unloaded by a plurality of first upper mold ejector pins (not shown) protruding downward from the upper mold cavity block 64.

[0069] Next, the movable platen 34 is moved upward again by the mold clamping mechanism 35, the lower mold LM is moved in the direction of the upper mold UM and the intermediate mold IM, and the lower mold cavity block 53 is brought into contact with the intermediate mold IM. Then, the holding of the intermediate mold IM is switched from the lower mold holding claw 38b to the upper mold holding claw 61c. Thereby, the intermediate mold IM is integrated with the upper mold UM again.

[0070] After that, the control unit 10 opens the molding die C by moving the movable platen downward. At this time, since the intermediate mold IM is held by the upper mold holding claw 61c, only the lower mold LM moves downward. The second upper mold ejector block 63 (not shown) also moves downward in linkage with the downward movement of the lower mold LM, and the second upper mold ejector pins protrude downward from the intermediate mold IM while maintaining contact with the resin-molded substrate Sb. Thereby, the resin-molded substrate Sb is demolded from the intermediate mold IM and maintains a state of being in close contact with the lower mold cavity block 53.

[0071] After the lower mold LM moves downward, the lower mold ejector block 52 moves relatively upward, and accordingly, the lower mold ejector pins (not shown) also rise. Thereby, the resin-molded substrate Sb is demolded from the lower mold LM, and the resin molding is completed. After that, the resin-molded substrate Sb is picked up by the pick-up portion 44a of the unloader 44, and the resin-molded substrate Sb is moved from the molding module M2 to the accommodation module M3 by the unloader 44. Then, in the accommodation module M3, it is accommodated in the discharge box 72 (refer to Figure 1 ).

[0072] 〔Configuration of the intermediate mold〕

[0073] 〔First embodiment〕

[0074] As Figure 5 , Figure 6 shown, the intermediate mold IM of the present embodiment includes a plurality (two in the present embodiment) of main body members 86 and an outer frame member 87 disposed on the periphery of the main body members 86. The main body member 86 has a main body molding surface 81a (an example of the first surface) formed with a cavity MC, a main body non-molding surface 82a (an example of the second surface) opposite to the main body molding surface 81a, a runner 83, and a gate 84. The outer frame member 87 has an outer frame molding surface 81b (an example of the first surface), an outer frame non-molding surface 82b (an example of the second surface), and a through hole 85 (removing the runner 83a). The outer frame member 87 has two rectangular openings 87a, and the two main body members 86 are held by the holding mechanism 88 in a state of being respectively attached to the openings 87a. The main body member 86 and the outer frame member 87 can be separated.

[0075] 〔Outer frame member〕

[0076] The outer frame member 87 is plate-shaped with two rectangular openings 87a when viewed from above (when viewed in a direction perpendicular to the first surface 81. The same applies hereinafter). The outer frame member 87 has two short frames 87c and two long frames 87d constituting the outer frame of the outer frame member 87, and a central frame 87e bridging the two short frames 87c. Each opening 87a is demarcated by two short frames 87c, a long frame 87d, and a central frame 87e. A plurality (five in the present embodiment) of through holes 85 and runners 83 are formed in the central frame 87e. Since the two openings 87a have the same shape, only one opening 87a will be described below.

[0077] The opening 87a is configured to have four inner surfaces. Specifically, there are two first inner surfaces 87f (an example of an inner surface) each formed by two short frames 87c, a second inner surface 87g (an example of an inner surface) formed by a long frame 87d, and a third inner surface 87h (an example of an inner surface) formed by a central frame 87e. Among them, stepped portions 87i are respectively formed on the two first inner surfaces 87f. Specifically, in the first inner surface 87f, the surface adjacent to the outer frame forming surface 81b protrudes inward of the opening 87a more than the surface adjacent to the non-outer frame forming surface 82b to form the stepped portion 87i.

[0078] As Figure 7 shown, tapered portions 87j (also refer to Figure 8 ) for facilitating the attachment of the main body member 86 to the opening 87a are formed on the two first inner surfaces 87f and the second inner surface 87g adjacent to the non-outer frame forming surface 82b of the outer frame member 87. That is to say, three tapered portions 87j are formed in the opening 87a. In addition, as Figure 9 shown, a plurality (four in this embodiment) of socket head cap screws 87k (an example of a set screw) are assembled on the second inner surface 87g of the outer frame member 87 so as to be able to protrude inward of the opening 87a from the second inner surface 87g (also refer to Figure 5 ). In a state where the main body member 86 is attached to the opening 87a, the socket head cap screws 87k are tightened so as to protrude inward of the opening 87a from the second inner surface 87g, thereby pressing the main body member 86 against the third inner surface 87h. As a result, the gap between the non-formed surface 82a of the main body of the main body member 86 and the non-outer frame forming surface 82b of the central frame 87e of the outer frame member 87 disappears, and when manufacturing the resin molded product (resin molded completed substrate Sb), the molten resin Ta flowing in the runner 83 does not leak from between the main body member 86 and the central frame 87e.

[0079] 〔Main body member〕

[0080] As Figure 5 , Figure 6As shown, the main body member 86 is a rectangular plate-like shape when viewed from above. A cavity MC is formed in the main body forming surface 81a, and a runner 83 is formed in the main body non-forming surface 82a. A gate 84 penetrating the main body member 86 in the thickness direction is formed from the runner 83 to the cavity MC. In the main body member 86, a stepped portion 86c corresponding to the stepped portion 87i of the first inner side surface 87f of the short frame 87c of the outer frame member 87 is formed on the outer side surface 86b facing the first inner side surface 87f. Specifically, in the outer side surface 86b, the surface adjacent to the main body forming surface 81a is recessed more than the surface adjacent to the main body non-forming surface 82a. Therefore, when the main body member 86 is moved downward relative to the opening 87a of the outer frame member 87 and fitted into the opening 87a with the main body forming surface 81a facing downward, the stepped portion 86c of the main body member 86 contacts the stepped portion 87i of the outer frame member 87. Thereby, the main body forming surface 81a is held by the outer frame member 87 (also refer to Figure 11 ). It should be noted that in the state where the stepped portion 86c of the main body member 86 contacts the stepped portion 87i of the outer frame member 87, the main body forming surface 81a of the main body member 86 and the outer frame forming surface 81b of the outer frame member 87 are in the same plane, and the main body non-forming surface 82a of the main body member 86 and the outer frame non-forming surface 82b of the outer frame member 87 are in the same plane.

[0081] 〔Retention mechanism〕

[0082] As Figure 5 shown, the retention mechanism 88 in the present embodiment includes a first retention member 88a (an example of a retention member), a second retention member 88b (an example of a retention member), a main body groove portion 86a (an example of a groove portion), and an outer frame groove portion 87b (an example of a groove portion). The first retention member 88a and the second retention member 88b are fixed to the outer frame member 87 and hold the main body member 86. The main body groove portion 86a is formed in the main body member 86, and the outer frame groove portion 87b is located at a position continuous with the main body groove portion 86a and is formed in the outer frame member 87. The first retention member 88a is disposed on the first surface 81 side of the main body member 86, and the second retention member 88b is disposed on the second surface 82 side of the main body member 86. By clamping the main body member 86 with the first retention member 88a and the second retention member 88b, the main body member 86 is held by the outer frame member 87.

[0083] As Figure 8 、 Figure 10 、 Figure 11As shown, the first holding member 88a and the second holding member 88b are received from the main body groove portion 86a through to the outer frame groove portion 87b. The depth of the main body groove portion 86a from the main body forming surface 81a and the main body non-forming surface 82a is slightly deeper than the depth of the outer frame groove portion 87b from the outer frame forming surface 81b and the outer frame non-forming surface 82b. In addition, the depth of the outer frame groove portion 87b is such that in the state where the first holding member 88a and the second holding member 88b are respectively received, the first holding member 88a does not protrude beyond the outer frame forming surface 81b, and the second holding member 88b does not protrude beyond the outer frame non-forming surface 82b.

[0084] The first holding member 88a and the second holding member 88b are respectively as Figure 12 , Figure 13 shown, only the shape of the through-hole to be described later is different, and the other parts have the same shape. Therefore, hereinafter, only the first holding member 88a will be described, and the description of the second holding member 88b will be omitted. Regarding the shape of the through-hole, the first holding member 88a and the second holding member 88b will be described respectively.

[0085] As Figure 12 shown, the first holding member 88a has a fixing portion 88c and a holding portion 88d extending from the fixing portion 88c. The fixing portion 88c is the part received in the outer frame groove portion 87b, and the holding portion 88d is the part received in the main body groove portion 86a (also refer to Figure 8 ). The first holding member 88a has a substantially D-shaped shape in a plan view, and the above-mentioned through-hole is formed in the fixing portion 88c. The through-hole formed in the fixing portion 88c of the first holding member 88a is an internal thread 88e. On the other hand, as Figure 13 shown, the through-hole of the fixing portion 88c of the second holding member 88b is a countersunk hole 88f (also refer to Figure 10 , Figure 11 ). C-chamfers are respectively formed at the end portion of the fixing portion 88c on the side opposite to the holding portion 88d and at the end portion of the holding portion 88d on the side opposite to the fixing portion 88c. As Figure 8 , Figure 10 , Figure 11 shown, the first holding member 88a and the second holding member 88b are respectively fixed to the outer frame member 87 by a bolt 87l with a head (an example of a bolt. Hereinafter, simply referred to as bolt 87l). It should be noted that the thicknesses of the fixing portion 88c and the holding portion 88d of the first holding member 88a in the direction along the central axis of the through-hole (internal thread 88e) are the same.

[0086] As Figure 8As shown, a through hole 87m is formed at the bottom of the outer frame groove portion 87b on the side of the outer frame forming surface 81b that houses the first holding member 88a. The through hole 87m is coaxial with the internal thread 88e of the housed first holding member 88a, and a bolt 87l that can be fastened to the internal thread 88e can pass through the through hole 87m. Further, a counterbore 87o (an example of a recessed portion) that can house the head 87p of the bolt 87l is formed on the side of the non-forming surface 82b of the outer frame of the through hole 87m. The depth of the counterbore 87o is deeper than the thickness of the head 87p of the bolt 87l. Further, as Figure 10 , Figure 11 shown, an internal thread 87n is formed at the bottom of the outer frame groove portion 87b on the side of the non-forming surface 82b of the outer frame that houses the second holding member 88b. The internal thread 87n is coaxial with the counterbore 88f through which the bolt 87l can pass in the second holding member 88b, and can be fastened to the bolt 87l. In the present embodiment, the internal thread 87n does not penetrate to the first surface 81, but the internal thread 87n may also penetrate to the first surface 81. The depth of the counterbore in the counterbore 88f of the second holding member 88b is deeper than the thickness of the head 87p of the bolt 87l.

[0087] As Figure 5 , Figure 6 shown, the first holding member 88a is assembled at two locations on the long frame 87d of the outer frame forming surface 81b. Further, as Figure 5 , Figure 7 shown, in the non-forming surface 82b of the outer frame, the second holding member 88b is assembled at one location in each of the two short frames 87c, and is assembled at two locations on the long frame 87d and two locations on the central frame 87e, respectively. On the side of the first surface 81, as described above, the stepped portion 86c of the main body member 86 is held by the stepped portion 87i of the short frame 87c. Therefore, the short frame 87c on the side of the first surface 81 does not require the first holding member 88a. It should be noted that in Figure 5 , the illustration of the second holding member 88b assembled at two locations on the central frame 87e is omitted.

[0088] As Figure 8 , Figure 10 , Figure 11 shown, for the first holding member 88a housed on the side of the first surface 81 and the second holding member 88b housed on the side of the second surface 82, the bolt 87l is inserted and fastened from the side of the second surface 82 (the non-forming surface 82b of the outer frame). In this way, by inserting and fastening the bolt 87l from the side of the second surface 82, the possibility of accidentally damaging the cavity MC formed on the first surface 81 during fastening or the like can be suppressed.

[0089] The main body member 86 and the outer frame member 87 have the same thickness. That is, the distance between the main body forming surface 81a and the non-forming surface 82a of the main body is the same as the distance between the outer frame forming surface 81b and the non-forming surface 82b of the outer frame. In addition, as Figure 8 , Figure 10 , Figure 11 shown, the thicknesses of the fixing portion 88c and the holding portion 88d in the first holding member 88a and the second holding member 88b along the central axis direction of the through holes (internal thread 88e, counterbore 88f) are the same. Moreover, the depth of the main body groove portion 86a from the main body forming surface 81a and the non-forming surface 82a of the main body is slightly deeper than the depth of the outer frame groove portion 87b from the outer frame forming surface 81b and the non-forming surface 82b of the outer frame. Therefore, in the state where the main body member 86 is attached to the outer frame member 87 and held by the first holding member 88a and the second holding member 88b, when the main body forming surface 81a of the main body member 86 and the outer frame forming surface 81b of the outer frame member 87 are in the same plane, there is a gap d between the bottom surface of the fixing portion 88c of each of the first holding member 88a and the second holding member 88b and the bottom of the main body groove portion 86a. Due to the existence of the gap d, the main body member 86 can relatively move by the amount of the gap d in the vertical direction (the thickness direction of the main body member 86) with respect to the outer frame member 87 (the first holding member 88a and the second holding member 88b).

[0090] If the depth of the main body groove portion 86a from the main body forming surface 81a and the non-forming surface 82a of the main body is the same as the depth of the outer frame groove portion 87b from the outer frame forming surface 81b and the non-forming surface 82b of the outer frame, the main body member 86 will be fixed to the outer frame member 87 without a gap. In this case, even if the main body member 86 and the outer frame member 87 have the same thickness, due to the depth deviation between the main body groove portion 86a and the outer frame groove portion 87b in the first surface 81 and the second surface 82, the main body forming surface 81a of the main body member 86 and the outer frame forming surface 81b of the outer frame member 87 may not be in the same plane. In this case, a step formed by the main body member 86 and the outer frame member 87 will be generated on the surface of the intermediate mold IM, and the mold clamping of the forming mold by the mold clamping mechanism cannot be correctly performed. However, if, as in the present embodiment, the main body member 86 can relatively move in the vertical direction with respect to the outer frame member 87, then by simply processing the main body member 86 and the outer frame member 87 to have the same thickness, when the mold is clamped by the mold clamping mechanism 35, the main body member 86 can be moved in the vertical direction with respect to the outer frame member 87 by sandwiching the intermediate mold IM between the upper mold and the lower mold, so that the main body forming surface 81a and the outer frame forming surface 81b are in the same plane, and thus the mold clamping of the forming mold can be correctly performed.

[0091] 〔Second Embodiment〕

[0092] Next, use Figure 14 and Figure 15The configuration of the intermediate mold IM of the second embodiment will be described. In the present embodiment, the method of holding the main body forming surface 81a of the main body member 86 by the first inner side surface 87f of the short frame 87c of the outer frame member 87 is different from that of the first embodiment, and the other configurations are the same as those of the first embodiment. Therefore, in the description of the present embodiment, the same reference numerals are assigned to the parts having the same configurations as those of the first embodiment, and the detailed description of the same configurations is omitted.

[0093] Figure 14 It is a cross-sectional view of the intermediate mold IM at the part where the first holding member 88a is cut perpendicularly to the extending direction of the short frame 87c, showing the cross-section from the main body member 86 to the short frame 87c of the outer frame member 87. Figure 15 It is a cross-sectional view of the intermediate mold IM at the part where the second holding member 88b is cut perpendicularly to the extending direction of the short frame 87c, showing the cross-section from the main body member 86 to the short frame 87c of the outer frame member 87. In the present embodiment, a stepped portion 87i is not formed on the first inner side surface 87f of the short frame 87c of the outer frame member 87, and the first inner side surface 87f is planar. In addition, a stepped portion 86c is not formed on the outer side surface 86b of the main body member 86, and the outer side surface 86b is planar. Further, in the short frame 87c of the present embodiment, the main body forming surface 81a is held by the first holding member 88a, and the main body non-forming surface 82a is held by the second holding member 88b.

[0094] 〔Third Embodiment〕

[0095] Next, use Figure 16 to describe the configuration of the intermediate mold IM of the third embodiment. In the present embodiment, the method of holding the main body non-forming surface 82a of the main body member 86 by the first inner side surface 87f of the short frame 87c of the outer frame member 87 is different from that of the first embodiment, and the other configurations are the same as those of the first embodiment. Therefore, in the description of the present embodiment, the same reference numerals are assigned to the parts having the same configurations as those of the first embodiment, and the detailed description of the same configurations is omitted.

[0096] Figure 16A cross-sectional view of the intermediate mold IM at a position where the bolt 87l is cut perpendicularly to the extending direction of the short frame 87c, showing the cross-section of the short frame 87c from the main body member 86 to the outer frame member 87. In the present embodiment, the main body forming surface 81a is held by the contact between the stepped portion 87i formed on the first inner side surface 87f of the short frame 87c of the outer frame member 87 and the stepped portion 86c formed on the outer side surface 86b of the main body member 86. In addition, the main body non-forming surface 82a is fixed to the outer frame member 87 by a plurality of bolts 87l that fasten the stepped portion 86c and the stepped portion 87i. The bolt 87l is inserted from the side of the main body non-forming surface 82a toward the main body forming surface 81a. The head 87p of the bolt 87l is received in the countersunk head 87o.

[0097] 〔Other Embodiments〕

[0098] Hereinafter, other embodiments of the above-described embodiment will be described. It should be noted that, for ease of understanding, the same components as those in the above-described embodiment are described using the same terms and reference numerals.

[0099] <1> In the above-described embodiment, the forming die for forming two resin pre-forming substrates Sa by a single forming operation, and the intermediate mold IM has two main body members 86. However, in the case of a forming die for forming one resin pre-forming substrate Sa by a single forming operation, the main body member 86 included in the intermediate mold IM may be one.

[0100] <2> In the above-described embodiment, the main body member 86 of the intermediate mold IM is rectangular, but it is not limited thereto. For example, any shape such as a circle can be used. In addition, the size of the main body member 86 is not limited.

[0101] <3> In the above-described embodiment, the cavity MC is formed only in the intermediate mold IM, but it is not limited thereto. The cavity MC may be formed in both the intermediate mold IM and the lower mold LM, or may be formed only in the lower mold LM.

[0102] <4> In the above-described embodiment, the runner 83 is formed only in the intermediate mold IM, but it is not limited thereto. The runner 83 may be formed throughout the intermediate mold IM and the upper mold UM, or may be formed only in the upper mold UM.

[0103] <5> In the main body member 86 of the above-described embodiment, the depth of the main body groove portion 86a from the main body molding surface 81a and the main body non-molding surface 82a is formed to be slightly deeper than the depth of the outer frame groove portion 87b from the outer frame molding surface 81b and the outer frame non-molding surface 82b. In addition, the thicknesses of the fixing portion 88c and the holding portion 88d of the first holding member 88a and the second holding member 88b along the central axis direction of the through holes (internal thread 88e, countersunk hole 88f) are the same, but are not limited thereto. It is also possible to make the depth of the main body groove portion 86a the same as the depth of the outer frame groove portion 87b, and make the thickness of the holding portion 88d of the first holding member 88a and the second holding member 88b thinner than the thickness of the fixing portion 88c. In addition, it is also possible to make the depth of the main body groove portion 86a deeper than the depth of the outer frame groove portion 87b, and make the thickness of the holding portion 88d of the first holding member 88a and the second holding member 88b thinner than the thickness of the fixing portion 88c. As long as the main body member 86 is configured to be relatively movable in the vertical direction with respect to the outer frame member 87, any configuration can be adopted for the relationship between the depth of the main body groove portion 86a and the depth of the outer frame groove portion 87b, and the relationship between the thickness of the holding portion 88d and the thickness of the fixing portion 88c of the first holding member 88a and the second holding member 88b.

[0104] <6> In the above-described embodiment, the number of the first holding member 88a and the second holding member 88b that hold the main body member 86 is not limited to the number disclosed in this embodiment. It can be more than the number disclosed in the embodiment or less than the number disclosed in the embodiment. In addition, the shapes of the first holding member 88a and the second holding member 88b of the above-described embodiment have a substantially D-shaped shape when viewed from above, but as long as it is a shape that extends over the main body groove portion 86a and the outer frame groove portion 87b, there is no particular limitation. For example, it can also be rectangular when viewed from above.

[0105] <7> In the above-described embodiment, in the state where the main body member 86 is attached to the outer frame member 87, the stepped portion 86c of the main body member 86 contacts the stepped portion 87i of the outer frame member 87, but is not limited thereto. A gap of about d may also be provided between the stepped portion 86c of the main body member 86 and the stepped portion 87i of the outer frame member 87.

[0106] <8> As a configuration for holding the main body member 86 by the first inner surface 87f of the short frame 87c of the outer frame member 87, in the first embodiment, the main body molding surface 81a is held by holding the stepped portion 86c of the main body member 86 by providing a stepped portion 87i on the first inner surface 87f, and the main body non-molding surface 82a is held by the second holding member 88b. In the second embodiment, the main body molding surface 81a of the main body member 86 is held by the first holding member 88a, and the main body non-molding surface 82a is held by the second holding member 88b. In the third embodiment, the main body molding surface 81a is held by holding the stepped portion 86c of the main body member 86 by providing a stepped portion 87i on the first inner surface 87f, and the main body non-molding surface 82a is held by fastening with bolts 87l. However, the methods for holding the main body molding surface 81a and the main body non-molding surface 82a are not limited to this. In the outer frame member 87, stepped portions may be provided on the second inner surface 87g and the third inner surface 87h instead of or together with the first inner surface 87f. In addition, when holding the main body molding surface 81a of the main body member 86 by the stepped portion, the method for holding the main body non-molding surface 82a may also be held by either or both of the second holding member 88b and the bolts 87l. These methods can be combined as freely as possible to hold the main body member 86.

[0107] <9> In the above-described embodiment, tapered portions 87j are formed on the two first inner surfaces 87f and the second inner surface 87g (the three inner surfaces of the opening 87a) adjacent to the outer frame non-molding surface 82b of the outer frame member 87, but it is not limited to this. The tapered portions 87j may be formed on at least one of the three inner surfaces of the two first inner surfaces 87f and the second inner surface 87g.

[0108] <10> In the above-described embodiment, the molding die for transfer molding in a top gate method has a gate formed above the cavity, but it is not limited to this. For example, it may also be a molding die having a gate formed below the cavity.

[0109] 〔Summary of the above-described embodiment〕

[0110] Hereinafter, a summary of the molding die C, the resin molding apparatus 100, and the method for manufacturing a resin molded product (resin-molded completed substrate Sb) described in the above-described embodiment will be described.

[0111] (1) The forming die C is characterized by the following points. It has a forming die main body M that holds the object to be formed (substrate Sa before resin forming), and has a cavity MC to which a resin material (resin sheet T, molten resin Ta) is supplied. The forming die main body M has: an upper die UM; a lower die LM including a barrel block 54 formed with a barrel 54b for filling the resin material (resin sheet T); and an intermediate die IM disposed between the upper die UM and the lower die LM, having a first surface 81 facing the object to be formed (substrate Sa before resin forming). The intermediate die IM has: a main body member 86 having a gate 84 for supplying the resin material (molten resin Ta) to the cavity MC; an outer frame member 87 disposed on the periphery of the main body member 86; and a holding mechanism 88 that holds the main body member 86 in the outer frame member 87, and the main body member 86 and the outer frame member 87 can be separated from each other.

[0112] In the forming die C of this characteristic configuration, the intermediate die IM is composed of a main body member 86 and an outer frame member 87. The main body member 86 is held in the outer frame member 87 by the holding mechanism 88, and the main body member 86 and the outer frame member 87 can be separated from each other. Therefore, the main body member 86 and the outer frame member 87 can be manufactured in parallel, so the time for manufacturing the intermediate die IM can be shortened. In addition, since the main body member 86 and the outer frame member 87 are manufactured separately, even if a defect occurs in one manufacturing process and it is discarded, the influence will not spread to the other. Therefore, the intermediate die IM can be manufactured efficiently.

[0113] (2) In the forming die C described in the above (1), it may also be that the holding mechanism 88 includes: holding members (first holding member 88a, second holding member 88b) fixed to the outer frame member 87 to hold the main body member 86; and groove portions (main body groove portion 86a, outer frame groove portion 87b) formed from the outer frame member 87 through the main body member 86 to accommodate the holding members (first holding member 88a, second holding member 88b).

[0114] According to this configuration, the main body member 86 can be held in the outer frame member 87 only by accommodating the holding members (first holding member 88a, second holding member 88b) in the groove portions (main body groove portion 86a, outer frame groove portion 87b).

[0115] (3) In the forming die C described in the above (2), it may also be that the main body member 86 can move in the vertical direction relative to the holding members (first holding member 88a, second holding member 88b) fixed to the outer frame member 87.

[0116] According to this configuration, by simply processing the main body member 86 and the outer frame member 87 to have the same thickness, when the mold clamping mechanism 35 is used for mold clamping, the main body member 86 can be moved in the vertical direction relative to the outer frame member 87 by clamping the intermediate mold IM between the upper mold UM and the lower mold LM, so that the first surface 81 of the main body member 86 and the first surface 81 of the outer frame member 87 are in the same plane. Thus, the mold clamping of the molding die C can be correctly performed.

[0117] (4) In the molding die C described in the above (2) or (3), the holding members (the first holding member 88a and the second holding member 88b) may be fixed to the outer frame member 87 by bolts (bolts 87l with heads), and the heads 87p of the bolts (bolts 87l with heads) are received in recesses (counterbores 87o) formed in the second surface 82 on the side opposite to the first surface 81 of the outer frame member 87.

[0118] According to this configuration, since the heads 87p of the bolts (bolts 87l with heads) are received in the recesses (counterbores 87o), the heads 87p of the bolts (bolts 87l with heads) do not interfere with mold clamping when the mold clamping mechanism 35 performs mold clamping.

[0119] (5) In the molding die C described in any one of the above (1) to (4), a rectangular opening 87a for assembling the main body member 86 and a through hole 85 connected to the barrel 54b are formed in the outer frame member 87, and at least one of the three inner side surfaces (the first inner side surface 87f, the second inner side surface 87g, and the third inner side surface 87h) among the four inner side surfaces (the first inner side surface 87f, the second inner side surface 87g, the third inner side surface 87h) constituting the opening 87a, excluding the one inner side surface adjacent to the through hole 85, is formed with a tapered portion 87j.

[0120] According to this configuration, the main body member 86 can be smoothly assembled to the outer frame member 87 along the tapered portion 87j.

[0121] (6) In the molding die C described in the above (5), the main body member 86 may be pressed against one inner side surface adjacent to the through hole 85 in the opening 87a of the outer frame member 87 by a set screw (hexagon socket head bolt 87k).

[0122] According to this configuration, since the main body member 86 is pressed against one inner side surface adjacent to the through hole 85 in the opening 87a of the outer frame member 87 by the set screw (hexagon socket head bolt 87k), the gap between the main body member 86 and the outer frame member 87 disappears, and when manufacturing the resin molded product (the resin molded substrate Sb), the molten resin Ta does not leak from between the main body member 86 and the outer frame member 87.

[0123] (7) In the molding die C described in any one of (1) to (6) above, it is also possible that the main body member 86 has a cavity MC on the first surface 81 (main body molding surface 81a) and a runner 83 on the second surface 82 (main body non-molding surface 82a) on the side opposite to the first surface 81.

[0124] According to this configuration, the top gate type molding die C can be formed only by processing the main body member 86.

[0125] (8) The resin molding apparatus 100 is characterized by comprising: the molding die C described in any one of (1) to (7) above; and a mold clamping mechanism 35 for clamping the molding die C.

[0126] The resin molding apparatus 100 according to this characteristic configuration can manufacture a resin molded product (resin molded completed substrate Sb) using the molding die C described in any one of (1) to (7) above.

[0127] (9) The method for manufacturing a resin molded product (resin molded completed substrate Sb) using the resin molding apparatus 100 described in (8) above is characterized by including: a supply step of supplying a molding object (pre-resin molding substrate Sa) and a resin material (resin sheet T) to the molding die C; a mold clamping step of clamping the molding die C by the mold clamping mechanism 35; and a molding step of performing resin molding of the molding object (pre-resin molding substrate Sa) by causing the molten resin material (molten resin Ta) to flow from the cylinder 54b through the gate 84 to the cavity MC.

[0128] In the method for manufacturing a resin molded product (resin molded completed substrate Sb) having this characteristic, after supplying the molding object (pre-resin molding substrate Sa) and the resin material (resin sheet T) to the molding die C in the supply step, in the mold clamping step, the molding die C is clamped by the mold clamping mechanism 35 in a state where the resin material (resin sheet T) is heated. Then, in the molding step, the resin material (molten resin Ta) is caused to flow from the cylinder 54b through the gate 84 to the cavity MC to perform resin molding of the molding object (pre-resin molding substrate Sa), whereby a resin molded product (resin molded completed substrate Sb) can be manufactured using the molding die C.

[0129] Industrial Applicability

[0130] The present disclosure can be applied to a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product.

[0131] Explanation of Reference Numerals:

[0132] 35: Mold clamping mechanism;

[0133] 54: Cylinder block;

[0134] 54b: Barrel;

[0135] 81: First surface;

[0136] 81a: Main body forming surface (first surface);

[0137] 81b: Outer frame forming surface (first surface);

[0138] 82: Second surface;

[0139] 82a: Main body non-forming surface (second surface);

[0140] 82b: Outer frame non-forming surface (second surface);

[0141] 83: Runner;

[0142] 84: Gate;

[0143] 85: Through hole;

[0144] 86: Main body member;

[0145] 86a: Main body groove part (groove part);

[0146] 87: Outer frame member;

[0147] 87a: Opening part;

[0148] 87b: Outer frame groove part (groove part);

[0149] 87f: First inner side surface (inner side surface);

[0150] 87g: Second inner side surface (inner side surface);

[0151] 87h: Third inner side surface (inner side surface);

[0152] 87j: Taper part;

[0153] 87k: Hexagon socket head cap screw (set screw);

[0154] 87l: Bolt with head (bolt);

[0155] 87o: Countersunk head (recessed part);

[0156] 87p: Head;

[0157] 88: Holding mechanism;

[0158] 88a: First holding member (holding member);

[0159] 88b: Second holding member (holding member);

[0160] 100: Resin molding device;

[0161] C: Molding die

[0162] IM: Intermediate die

[0163] LM: Lower die

[0164] M: Molding die body

[0165] MC: Cavity

[0166] Sa: Substrate before resin molding (object to be molded)

[0167] Sb: Substrate after resin molding (resin molded product)

[0168] T: Resin sheet (resin material)

[0169] Ta: Molten resin (resin material)

[0170] UM: Upper die

Claims

1. A molding die includes a molding die body that holds an object to be molded and has a cavity into which a resin material is supplied. The molding die body has: an upper die; a lower die including a barrel block in which a barrel for filling the resin material is formed; and an intermediate die disposed between the upper die and the lower die and having a first surface facing the object to be molded. The intermediate die has: a main body member having a gate for supplying the resin material to the cavity; an outer frame member disposed at the periphery of the main body member; and a holding mechanism that holds the main body member in the outer frame member. The main body member and the outer frame member are separable.

2. The molding die according to claim 1, wherein the holding mechanism includes: a holding member fixed to the outer frame member to hold the main body member; and a groove portion formed from the outer frame member through the main body member to accommodate the holding member.

3. The molding die according to claim 2, wherein the main body member is movable in the vertical direction relative to the holding member fixed to the outer frame member.

4. The molding die according to claim 2 or 3, wherein the holding member is fixed to the outer frame member by bolts, and the heads of the bolts are accommodated in recesses formed in a second surface of the outer frame member opposite to the first surface.

5. The molding die according to any one of claims 1 to 4, wherein a rectangular opening for assembling the main body member and a through hole connected to the barrel are formed in the outer frame member, and a tapered portion is formed on at least one of three inner side surfaces of the four inner side surfaces constituting the opening, excluding one inner side surface adjacent to the through hole.

6. The molding die according to claim 5, wherein the main body member is pressed against one inner side surface of the opening of the outer frame member adjacent to the through hole by a set screw.

7. The molding die according to any one of claims 1 to 6, wherein the main body member has the cavity on the first surface and a runner on a second surface opposite to the first surface.

8. A resin molding apparatus includes: the molding die according to any one of claims 1 to 7; and a mold clamping mechanism that clamps the molding die.

9. A method for manufacturing a resin molded product using the resin molding apparatus according to claim 8, the method for manufacturing a resin molded product includes: a supply step of supplying the object to be molded and the resin material to the molding die; a mold clamping step of clamping the molding die by the mold clamping mechanism; and a molding step of performing resin molding of the object to be molded by causing the molten resin material to flow from the barrel through the gate to the cavity.

Images