Integrated rear floor die-casting die for automobile and control method thereof

Abstract

The application belongs to the technical field of automobile part die casting, and particularly relates to an automobile integrated rear floor die casting mold and a control method thereof. The automobile integrated rear floor die casting mold comprises a supporting structure, a lifting driving mechanism and a split type forming assembly. A cooling system comprises a cooling water circulating assembly and a semiconductor refrigeration assembly. The cooling water circulating assembly comprises a cooling pipe assembly embedded in the outer wall of a fixed mold core, a circulating pump installed in an installation cavity and located below the fixed mold core and a water storage tank. The water inlet end of the circulating pump is in communication with the water outlet of the water storage tank, the water outlet end is in communication with the water return port of the water storage tank through the cooling pipe assembly, and a closed cooling water circulating path is formed. The semiconductor refrigeration assembly is used for refrigerating the cooling water in the water storage tank. The cooling water circulating assembly and the semiconductor refrigeration assembly work cooperatively, the mold temperature can be effectively reduced, the cooling effect is improved, the mold temperature can be accurately controlled, and defects such as shrinkage cavity and deformation caused by temperature problems of the castings can be effectively reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of automobile part die casting, in particular to an automobile integrated rear floor die casting mold and a control method thereof. BACKGROUND

[0002] The rear floor is an important component of the vehicle body, and the rear floor includes a rear wheel cover, a cross beam connected to the rear wheel cover, and a rear longitudinal beam. In the related art, the components in the rear floor are mainly connected by welding. In order to further improve the overall strength of the rear floor and simplify the preparation process of the rear floor, an integrated die casting process can be used to prepare the rear floor. By designing a rear floor die casting mold and injecting a forming material into the rear floor die casting mold, the preparation of an integrated die cast rear floor is achieved.

[0003] In the related art, the automobile floor die casting mold is a mold for manufacturing automobile floor components. Liquid metal is injected into the mold cavity through the die casting process, and is rapidly solidified under high pressure. The die casting mold is a tool for casting metal parts, and the die casting process is usually completed on a dedicated die casting forging machine. The existing die casting mold has the following problems during the liquid metal forming process: the traditional mold only relies on a single water cooling or air cooling system, the cooling efficiency is low, the mold temperature cannot be accurately controlled, and defects such as shrinkage and deformation of the casting caused by temperature problems are likely to occur. SUMMARY

[0004] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the purpose of the present application is to provide an automobile integrated rear floor die casting mold and a control method thereof. The present application can effectively reduce the mold temperature and improve the cooling effect through the cooperation of the cooling water circulation assembly and the semiconductor refrigeration assembly. In addition, the present application can also accurately control the mold temperature, effectively reduce defects such as shrinkage and deformation of the casting caused by temperature problems, and improve the quality of the casting.

[0005] The purpose of the present application is achieved by adopting the following technical solutions:

[0006] The present application provides an automobile integrated rear floor die casting mold, which comprises a support structure, a lifting driving mechanism and a split type forming assembly. The support structure comprises a bearing mechanism composed of a workbench with a mounting cavity, four vertical load-bearing columns and a top platform. The lifting driving mechanism comprises a linear actuator fixed to the top platform and a lifting platform connected to the linear actuator. The split type forming assembly comprises a movable mold core detachably mounted on the lifting platform and a fixed mold core mounted in the mounting cavity of the workbench. The automobile integrated rear floor die casting mold further comprises:

[0007] The cooling system comprises a cooling water circulation assembly and a semiconductor refrigeration assembly; the cooling water circulation assembly comprises a cooling pipe assembly embedded in the outer wall of the mold core, a circulating pump installed in the installation cavity and below the mold core, and a water storage tank; the water inlet end of the circulating pump is communicated with the water outlet of the water storage tank, the water outlet end is communicated with the water return port of the water storage tank through the cooling pipe assembly, and a closed cooling water circulation path is formed; the semiconductor refrigeration assembly is used for refrigerating the cooling water in the water storage tank.

[0008] In the first aspect of the application, as an optional embodiment, the semiconductor refrigeration assembly comprises a semiconductor refrigerator installed on the side wall of the workbench, a plurality of serpentine cooling rods installed in the water storage tank, and two horizontal cooling pipes; the semiconductor refrigerator comprises a refrigerator hot end and a refrigerator cold end; a plurality of serpentine cooling rods are installed side by side on the two horizontal cooling pipes, and the two horizontal cooling pipes are respectively in thermal transfer connection with the refrigerator cold end of the semiconductor refrigerator; the refrigerator hot end is installed with copper-based heat dissipation fins and is configured with an axial flow fan to forcibly dissipate heat.

[0009] In the first aspect of the application, as an optional embodiment, a central controller installed on the workbench, a first temperature sensor installed on the mold core, a second temperature sensor installed at the water inlet of the cooling pipe assembly, and a third temperature sensor installed at the water inlet of the cooling pipe assembly are further included; the signal output ends of the first temperature sensor, the second temperature sensor, and the third temperature sensor are respectively connected to the signal input ends of the central controller; and the signal output ends of the central controller are respectively connected to the signal input ends of the semiconductor refrigerator and the circulating pump.

[0010] In the first aspect of the application, as an optional embodiment, the central controller calculates the cooling water flow according to the public

[0011] Formula 1, and realizes dynamic control by adjusting the rotating speed of the circulating pump.

[0012]

[0013] In formula 1, Q(k) is the cooling water flow; P cool (k) is the refrigeration power of the semiconductor refrigerator; C p is the specific heat capacity of the cooling water at constant pressure; p is the density of the cooling water; ΔT water is the temperature difference between the inlet and outlet of the cooling pipe assembly; and a is the flow redundancy coefficient.

[0014] In the first aspect of the application, as an optional embodiment, the cooling pipe assembly is composed of a plurality of horizontal annular pipes and vertical connecting pipes in series; or the cooling pipe assembly is composed of a spiral pipe.

[0015] In the first aspect of the present application, as an optional embodiment, the outer side wall of the workbench is provided with an abutting assembly, the abutting assembly comprises left and right symmetrically arranged abutting plates, the outer side wall of the abutting plate is fixedly provided with a handle, and the inner side of the abutting plate is fixedly connected with a clamping groove of a clamping core through a clamping seat, and the outer side wall of the workbench is provided with an abutting groove matched with the shape of the abutting plate at the top.

[0016] In the first aspect of the present application, as an optional embodiment, the outer side wall of the workbench is further provided with a fastening assembly, the fastening assembly comprises a hinged seat, an L-shaped abutting frame and an abutting push rod, the movable end of the abutting push rod is hingedly connected with a movable seat, the movable seat drives the L-shaped abutting frame to rotate in the hinged seat, so that the inclined angle of the top wall of the L-shaped abutting frame is engaged with the abutting block of the top wall of the lifting platform.

[0017] In the first aspect of the present application, as an optional embodiment, the abutting block is a triangular structure, which is matched with the inclined angle shape of the L-shaped abutting frame to form a wedge-shaped abutting cooperation to fix the position of the lifting platform.

[0018] In the first aspect of the present application, as an optional embodiment, the inner wall of the four corners of the top wall of the lifting platform is slidably connected with the outer wall of the support column, the high-pressure injection pipe is installed on the right side of the top wall of the lifting platform, and the bottom end of the high-pressure injection pipe penetrates through the lifting platform and communicates with the internal mold cavity of the clamping core.

[0019] The second aspect of the present application provides a control method of an integrated automobile rear floor die-casting die, comprising the following steps:

[0020] S10, the temperature of the clamping core, the water inlet temperature and the water outlet temperature of the cooling pipe assembly are monitored in real time by the first temperature sensor, the second temperature sensor and the third temperature sensor respectively, and the temperature data is transmitted to the central controller;

[0021] S20, the central controller calculates the cooling water flow according to the received temperature data, and adjusts the rotating speed of the circulating pump to control the cooling water flow;

[0022] S30, when the temperature of the die exceeds the set threshold value, the cooling water flow is increased to realize rapid cooling; at the same time, the central controller controls the refrigeration power of the semiconductor refrigerator according to the need to refrigerate the cooling water in the water storage tank.

[0023] Compared with the prior art, the embodiment of the present application has the following beneficial effects:

[0024] The cooling water circulating assembly and the semiconductor refrigeration assembly of the cooling system of the application work in coordination, and can effectively reduce the mold temperature. The cooling water circulating assembly circulates the cooling water between the cooling pipe assembly and the water storage tank through the circulating pump, and takes away the heat generated by the mold; the semiconductor refrigeration assembly refrigerates the cooling water in the water storage tank, and ensures the low-temperature state of the cooling water, thereby improving the cooling effect. At the same time, the central controller combines the data of multiple temperature sensors, accurately calculates and dynamically adjusts the cooling water flow according to the formula, realizes the precise control of the mold temperature, effectively reduces the shrinkage cavity, deformation and other defects of the castings due to the temperature problem, and improves the quality of the castings. BRIEF DESCRIPTION OF DRAWINGS

[0025] The accompanying drawings, which form a part of the specification, are included to provide a further understanding of the application and are incorporated herein for explanation by referring to the embodiments of the present application.

[0026] Figure 1 The flow chart of the control method of the application;

[0027] Figure 2 The circuit principle block diagram of the application;

[0028] Figure 3 The structural schematic diagram of the automobile integrated rear floor die casting mold of the application;

[0029] Figure 4 The structural schematic diagram of the load-bearing column, top platform, lifting driving mechanism and movable mold core of the application;

[0030] Figure 5 The structural schematic diagram of the workbench and fastening assembly of the application;

[0031] Figure 6 The structural schematic diagram of the workbench and fastening assembly of the application from another angle;

[0032] Figure 7 The structural schematic diagram of the workbench and abutting assembly of the application;

[0033] Figure 8 The structural schematic diagram of the cooling system of the application;

[0034] Figure 9 The structural schematic diagram of the cooling system of the application from another angle;

[0035] Figure 10 The local sectional schematic diagram of the workbench of the application.

[0036] In the figure, 10, support structure; 11, workbench; 12, load-bearing column; 13, top platform; 20, lifting driving mechanism; 21, linear actuator; 22, lifting platform; 30, split forming assembly; 31, movable mold core; 32, fixed mold core; 40, fastening assembly; 41, hinged seat; 42, L-shaped abutting frame; 43, inclination angle; 44, movable seat; 45, abutting push rod; 46, mounting table; 47, abutting block; 50, abutting assembly; 51, through groove; 52, abutting groove; 53, clamping seat; 54, abutting plate; 55, handle; 56, clamping groove; 60, cooling system; 61, cooling water circulating assembly; 611, cooling pipe assembly; 6111, horizontal annular pipeline; 6112, vertical connecting pipe; 612, circulating pump; 613, water storage tank; 62, semiconductor refrigeration assembly; 621, semiconductor refrigerator; 622, serpentine cold lead rod; 623, horizontal cold lead pipe; 70, central controller; 71, first temperature sensor; 72, second temperature sensor; 73, third temperature sensor. DETAILED DESCRIPTION

[0037] In the following, the application will be further described with reference to the drawings and specific embodiments, it should be noted that the following described embodiments or technical features can be combined to form new embodiments without conflict. Unless otherwise specified, the materials and equipment used in the embodiments can be purchased from the market. Examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are only used to explain the application and cannot be understood as limiting the application.

[0038] In the description of the application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the application. In the description of the application, the meaning of "a plurality of" is two or more, unless otherwise specifically specified and limited.

[0039] In the description of the application, it should be noted that unless otherwise explicitly specified and limited, the terms "connected", "communicated", "connected" should be understood in a broad sense, for example, it can be fixedly connected, or connected through an intermediate medium, or the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0040] The terms "first", "second", and the like in the description and in the claims of the present application and above figures are used for distinguishing between similar objects and not necessarily for describing a specific sequential or chronological order. The terms "comprises", "comprising", "includes", "including" and the like are to be construed open- ended, meaning that they include the listed steps or elements, but not excluding other steps or elements. Likewise the term "sub-comprising" is to be construed open- ended, meaning that it includes the listed steps or elements, but not excluding other steps or elements.

[0041] Embodiment one:

[0042] Please refer to Figures 1-10 The embodiment provides an integrated automobile rear floor die-casting die, which comprises a support structure 10, a lifting driving mechanism 20, a split forming assembly 30 and a cooling system 60.

[0043] Specifically, the support structure 10 comprises a bearing mechanism composed of a workbench 11 with a mounting cavity, four vertical bearing columns 12 and a top platform 13, which provides stable support for the whole die.

[0044] Specifically, the lifting driving mechanism 20 comprises a linear actuator 21 fixed to the top platform 13 and a lifting platform 22 connected with the linear actuator 21, which is used for realizing the lifting movement of the movable die core 31 to complete the die closing and opening actions in the die-casting process; preferably, the linear actuator is a hydraulic cylinder.

[0045] Specifically, the split forming assembly 30 comprises a movable die core 31 detachably mounted on the lifting platform 22 and a fixed die core 32 mounted in the mounting cavity of the workbench 11, which facilitates the installation, maintenance and replacement of the die; the movable die core 31 and the fixed die core 32 form a forming cavity after being closed, and the shape and size of the forming cavity are matched with the automobile rear floor.

[0046] Specifically, the cooling system 60 comprises a cooling water circulating assembly 61 and a semiconductor refrigeration assembly 62; the cooling water circulating assembly 61 comprises a cooling pipe assembly 611 embedded in the outer wall of the fixed die core, a circulating pump 612 mounted in the mounting cavity and located below the fixed die core and a water storage tank 613; the water inlet end of the circulating pump 612 is in communication with the water outlet of the water storage tank 613, the water outlet end thereof is in communication with the water return port of the water storage tank 613 through the cooling pipe assembly 611, and a closed cooling water circulating path is formed; the semiconductor refrigeration assembly 62 is used for refrigerating the cooling water in the water storage tank 613.

[0047] On the basis of the above structure, the cooling water circulating assembly 61 and the semiconductor refrigeration assembly 62 of the cooling system 60 of the present application work in coordination, so that the mold temperature can be effectively reduced. The cooling water circulating assembly 61 circulates the cooling water between the cooling pipe assembly 611 and the water storage tank 613 through the circulating pump 612, so as to take away the heat generated by the mold; the semiconductor refrigeration assembly 62 refrigerates the cooling water in the water storage tank 613, so as to ensure the low temperature state of the cooling water, thereby improving the cooling effect.

[0048] In a preferred embodiment, the semiconductor refrigeration assembly 62 comprises a semiconductor refrigerator 621 installed on the side wall of the workbench 11, a plurality of serpentine cooling rods 622 installed in the water storage tank 613, and two horizontal cooling pipes 623; the semiconductor refrigerator 621 comprises a hot end and a cold end; the plurality of serpentine cooling rods 622 are installed side by side on the two horizontal cooling pipes 623, and the two horizontal cooling pipes 623 are respectively in heat transfer connection with the cold end of the semiconductor refrigerator 621; the hot end is installed with copper-based heat dissipation fins, and is configured with an axial flow fan for forced heat dissipation.

[0049] On the basis of the above structure, the semiconductor refrigerator 621 in the semiconductor refrigeration assembly 62 of the present application realizes refrigeration by using the thermoelectric effect, and transmits the cold energy of the cold end to the cooling water in the water storage tank 613 through the serpentine cooling rods 622 and the horizontal cooling pipes 623, so as to quickly and effectively reduce the temperature of the cooling water. The plurality of serpentine cooling rods 622 are installed side by side on the horizontal cooling pipes 623, so as to increase the contact area with the cooling water and improve the heat exchange efficiency. The copper-based heat dissipation fins installed on the hot end have good heat conduction performance, so as to quickly dissipate the heat. The forced heat dissipation effect of the axial flow fan further improves the heat dissipation efficiency, ensures the normal work of the semiconductor refrigerator 621, avoids the influence of the high temperature of the hot end on the refrigeration effect, and prolongs the service life of the semiconductor refrigerator 621.

[0050] In a preferred embodiment, a central controller 70 is installed on the workbench 11, a first temperature sensor 71 is installed on the fixed mold core, a second temperature sensor 72 is installed at the water inlet of the cooling pipe assembly 611, and a third temperature sensor 73 is installed at the water inlet of the cooling pipe assembly 611; the signal output ends of the first temperature sensor 71, the second temperature sensor 72 and the third temperature sensor 73 are respectively connected with the signal input ends of the central controller 70; and the signal output ends of the central controller 70 are respectively connected with the signal input ends of the semiconductor refrigerator 621 and the circulating pump 612.

[0051] On the basis of the above structure, the first temperature sensor 71, the second temperature sensor 72 and the third temperature sensor 73 respectively monitor the mold core temperature, the cooling pipe assembly 611 inlet water temperature and the outlet water temperature in real time, and transmit these temperature data to the central controller 70. The central controller 70 can accurately understand the temperature state of the mold and the cooling effect according to these data, so as to timely adjust the refrigeration power of the semiconductor refrigerator 621 and the rotating speed of the circulating pump 612, realize accurate control of the mold temperature, and improve the quality and consistency of the castings.

[0052] In a preferred embodiment, the central controller 70 calculates the cooling water flow according to formula 1, and realizes dynamic control by adjusting the rotating speed of the circulating pump 612.

[0053]

[0054] In formula 1,

[0055] Q(k): cooling water flow, m 3 / h;

[0056] Pcool(K): refrigeration power of the semiconductor refrigerator, kW;

[0057] Cp: specific heat capacity of cooling water at constant pressure, the specific heat capacity of water is 4.1868kJ / kg·℃;

[0058] ρ: density of cooling water, water is 1000kg / m 3 ;

[0059] ΔTwater: temperature difference between inlet and outlet water of the cooling pipe assembly;

[0060] α is the flow redundancy coefficient, taken as 0.15-0.3, used to cope with sudden change of heat load.

[0061] On the basis of the above scheme, the central controller 70 calculates the cooling water flow according to formula, and realizes dynamic control by adjusting the rotating speed of the circulating pump 612. This way can accurately adjust the flow of cooling water according to the actual heat load of the mold, and ensure the stability and effectiveness of the cooling effect. The setting of the flow redundancy coefficient considers the case of sudden change of heat load. When the heat load suddenly increases, the cooling water flow can be increased to quickly cool down, avoiding the mold temperature being too high, and ensuring the normal work of the mold and the quality of the castings. The flow redundancy coefficient is used to realize rapid cooling by increasing the cooling water flow, rather than simply increasing the power of the semiconductor refrigerator 621, which reduces the temperature gradient of the hot end, avoids the rapid reduction of refrigeration efficiency caused by local overheating of the heat dissipation fin, improves the energy utilization efficiency, and reduces the operation cost.

[0062] In the preferred embodiment, the cooling pipe assembly 611 is composed of a plurality of horizontal annular pipes 6111 and vertical connecting pipes 6112 in series. The structure of the cooling pipe assembly 611 composed of a plurality of horizontal annular pipes 6111 and vertical connecting pipes 6112 in series can form a more uniform cooling area on the outer wall of the mold core, making the temperature of each part of the mold more uniform, and reducing the deformation and defects of the castings caused by temperature differences.

[0063] As an alternative, the cooling pipe assembly 611 is composed of a spiral pipe. The spiral pipe structure of the cooling pipe assembly 611 increases the flow path of the cooling water on the outer wall of the mold core, prolongs the contact time of the cooling water with the mold, and further improves the cooling efficiency and uniformity.

[0064] In the preferred embodiment, the abutment assembly 50 is installed on the outer side wall of the workbench 11, which includes left and right symmetrically arranged abutment plates 54, the outer side wall of the abutment plate 54 is fixedly installed with a handle 55, the inner side of the abutment plate 54 is clamped and fixed with the clamping groove 56 opened on the side wall of the mold core through the clamping seat 53, and the top of the outer side wall of the workbench 11 is opened with an abutment groove 52 matching the shape of the abutment plate 54.

[0065] Specifically, the through grooves 51 are opened on the inner wall of the two abutment grooves 52 and correspond to the positions of the clamping grooves 56, the outer walls of the plurality of through grooves 51 correspond to the positions of the corresponding clamping grooves 56 one by one, and the inner walls of the plurality of through grooves 51 are matched with the outer walls of the corresponding clamping seats 53.

[0066] On the basis of the above-mentioned scheme, the abutment assembly 50 on the outer side wall of the workbench 11 is clamped and fixed with the clamping groove 56 on the side wall of the mold core through the clamping seat 53 on the inner side of the abutment plate 54, and at the same time, the abutment plate 54 cooperates with the abutment groove 52 on the top of the outer side wall of the workbench 11, which can effectively fix the position of the mold core, prevent the displacement or shaking of the mold core during the die casting process, and ensure the precision and quality of the castings. The handle 55 on the outer side wall of the abutment plate 54 facilitates the installation and disassembly operations of the operator, and improves the work efficiency.

[0067] In the preferred embodiment, the workbench 11 is also provided with a fastening assembly 40, which includes a hinged seat 41, an L-shaped abutment frame 42, and an abutment push rod 45. The movable end of the abutment push rod 45 is hinged to a movable seat 44, the movable seat 44 drives the L-shaped abutment frame 42 to rotate in the hinged seat 41, and the inclination angle 43 of the top wall of the L-shaped abutment frame 42 is engaged with the abutment block 47 on the top wall of the lifting platform 22.

[0068] On the basis of the above scheme, the fastening assembly 40 of the outer side wall of the workbench 11 drives the movable seat 44 through the abutting push rod 45, so that the L-shaped abutting frame 42 rotates in the hinged seat 41 and is engaged with the abutting block 47 of the top wall of the lifting platform 22, which can reliably fix the position of the lifting platform 22. During the die casting process, the displacement or shaking of the lifting platform 22 due to pressure is prevented, the accurate mold closing of the movable mold core 31 and the fixed mold core is ensured, and the precision and quality of the casting are improved.

[0069] The abutting push rod 45 is mainly fixed on the outer side wall of the workbench 1 through the mounting table 46, and the movable ends of the two abutting push rods 45 on the same side are simultaneously extended to drive the movable seat 44 and the L-shaped abutting frame 42 to rotate in the inner wall of the hinged seat 41.

[0070] In the preferred embodiment, the abutting block 47 is triangular in structure and matches the shape of the inclined angle 43 of the L-shaped abutting frame 42 to form a wedge-shaped abutting cooperation to fix the position of the lifting platform 22.

[0071] On the basis of the above scheme, the abutting block 47 is triangular in structure and matches the shape of the inclined angle 43 of the L-shaped abutting frame 42 to form a wedge-shaped abutting cooperation. This structure can provide greater fastening force and has better self-locking performance when subjected to external force, which can effectively prevent the loosening between the L-shaped abutting frame 42 and the abutting block 47, further improving the stability and reliability of the lifting platform 22.

[0072] In the preferred embodiment, the inner walls of the four corners of the top wall of the lifting platform 22 are slidably connected with the outer walls of the support columns, and a high-pressure injection pipe is installed on the right side of the top wall of the lifting platform 22, with the bottom end of the high-pressure injection pipe penetrating the lifting platform 22 and communicating with the internal mold cavity of the movable mold core.

[0073] On the basis of the above scheme, the inner walls of the four corners of the top wall of the lifting platform 22 are slidably connected with the outer walls of the support columns, which provides a guiding effect for the lifting of the lifting platform 22 and ensures the stability of the lifting platform 22 during lifting, avoiding the shaking or deviation of the movable mold core 31 during mold closing and opening, and improving the precision of the casting. The high-pressure injection pipe installed on the right side of the top wall of the lifting platform 22 can accurately inject liquid metal into the cavity formed by the movable mold core 31 and the fixed mold core, meet the requirements of the die casting process, and ensure the forming quality of the casting.

[0074] The assembly process, working process and maintenance process of the present application are as follows:

[0075] Mold assembly: first, the workbench 11 of the support structure 10 is placed in a suitable working position, ensuring that the workbench 11 is stable. Then install the four corners of the vertical load-bearing column 12 on the four corners of the workbench 11, and fix it with the workbench 11. Then install the top platform 13, fix the top platform 13 with the top end of the load-bearing column 12, complete the assembly of the support structure 10. The linear actuator 21 of the lifting drive mechanism 20 is fixedly installed on the top platform 13, and then the lifting platform 22 is connected with the output end of the linear actuator 21, ensuring that the lifting platform 22 can be lifted smoothly under the drive of the linear actuator 21. Install the fixed mold core in the installation cavity of the workbench 11, and fix it by clamping the clamping groove 56 on the side wall of the fixed mold core with the clamping seat 53 on the inner side of the abutting plate 54 of the abutting assembly 50, and at the same time, the abutting plate 54 is matched with the abutting slot 52 on the top of the outer wall of the workbench 11, completing the installation of the fixed mold core. The movable mold core 31 is detachably installed on the lifting platform 22, ensuring that the movable mold core 31 is firmly connected with the lifting platform 22. Install the cooling system 60, embed the cooling pipe assembly 611 in the outer wall of the fixed mold core, connect the circulating pump 612 with the water tank 613, make the water inlet end of the circulating pump 612 communicate with the water outlet of the water tank 613, and the water outlet end communicate with the water return port of the water tank 613 through the cooling pipe assembly 611. Install the semiconductor refrigeration assembly 62, install the semiconductor refrigerator 621 on the side wall of the workbench 11, install the serpentine cold lead 622 and the horizontal cold lead pipe 623 in the water tank 613, and make the horizontal cold lead pipe 623 and the refrigeration end of the semiconductor refrigerator 621 in thermal transfer connection, install copper-based heat dissipation fins and axial flow fans on the hot end of the refrigerator. Install the temperature monitoring and control system, install the first temperature sensor 71 on the fixed mold core, the second temperature sensor 72 on the water inlet of the cooling pipe assembly 611, and the third temperature sensor 73 on the water outlet of the cooling pipe assembly 611. Install the central controller 70 on the workbench 11, and connect the signal output ends of the three temperature sensors with the signal input end of the central controller 70, and connect the signal output end of the central controller 70 with the signal input end of the semiconductor refrigerator 621 and the circulating pump 612 respectively. Install the abutting assembly 50 and the fastening assembly 40, install the abutting plate 54 of the abutting assembly 50 on the outer wall of the workbench 11, install the hinged seat 41, the L-shaped abutting frame 42 and the abutting push rod 45 of the fastening assembly 40 on the outer wall of the workbench 11, and adjust the positional relationship between the L-shaped abutting frame 42 and the abutting block 47 on the top wall of the lifting platform 22, ensuring reliable abutting and fixing. Install the sliding block on the inner wall of the top wall of the lifting platform 22, make it slide with the outer wall of the support column, and install the high-pressure injection pipe on the right side of the top wall of the lifting platform 22, make its bottom end penetrate the lifting platform 22 and communicate with the internal mold cavity of the movable mold core 31.

[0076] Mold working process: start the lifting drive mechanism 20, the linear actuator 21 drives the lifting platform 22 to rise, makes the movable mold core 31 and the fixed mold core close. The liquid metal is injected into the cavity formed by the movable mold core 31 and the fixed mold core 32 through the high-pressure injection pipe. During the die casting process, the first temperature sensor 71 monitors the temperature of the fixed mold core in real time, the second temperature sensor 72 and the third temperature sensor 73 monitor the water temperature of the inlet and outlet of the cooling pipe assembly 611 respectively, and transmit the temperature data to the central controller 70. The central controller 70 calculates the cooling water flow according to the temperature data, adjusts the rotating speed of the circulating pump 612 to control the cooling water flow, and calculates the cooling water flow according to the formula 1. When the mold temperature exceeds the set threshold value, the cooling water flow is increased to realize rapid cooling. At the same time, the central controller 70 controls the refrigeration power of the semiconductor refrigerator 621 according to the need, and refrigerates the cooling water in the water storage tank 613 to maintain the appropriate mold temperature. After the die casting is completed, the lifting drive mechanism 20 drives the lifting platform 22 to descend to realize the mold opening, and the castings are taken out.

[0077] Mold maintenance: when the fixed mold core needs to be maintained or replaced, pull the handle 55 to pull the abutment plate 54, so that the clamping seat 53 on the inner side of the abutment plate 54 is separated from the clamping groove 56 on the side wall of the fixed mold core, and the fixed mold core can be taken out from the installation cavity of the workbench 11. When the movable mold core 31 needs to be maintained or replaced, it can be directly disassembled from the lifting platform 22. Periodically check the various components of the cooling system 60, such as the circulating pump 612, the semiconductor refrigerator 621, the cooling pipe assembly 611, etc., to ensure their normal work. Check the accuracy of the temperature sensor, and calibrate or replace it if necessary. Check whether the connection of the abutment assembly 50 and the fastening assembly 40 is firm, and tighten it in time if it is loose.

[0078] Example two:

[0079] Please refer to Figures 1-2 The embodiment provides a control method of an automobile integrated rear floor die casting mold, which comprises the following steps:

[0080] S10, the first temperature sensor, the second temperature sensor and the third temperature sensor are used to monitor the temperature of the fixed mold core, the water temperature of the cooling pipe assembly inlet and the water temperature of the outlet in real time respectively, and the temperature data is transmitted to the central controller;

[0081] S20, the central controller calculates the cooling water flow according to the received temperature data, adjusts the rotating speed of the circulating pump to control the cooling water flow, and combines formula 1.

[0082] S30, when the mold temperature exceeds the set threshold value, the cooling water flow is increased to realize rapid cooling; at the same time, the central controller controls the refrigeration power of the semiconductor refrigerator according to the need, and refrigerates the cooling water in the water storage tank.

[0083] The control method realizes intelligent control of the mold temperature by monitoring the mold temperature and the cooling water temperature in real time and calculating the cooling water flow rate according to the formula. The cooling water flow rate and the refrigeration power of the semiconductor refrigerator can be dynamically adjusted according to the actual thermal load of the mold, ensuring the stability and accuracy of the mold temperature, improving the quality and production efficiency of the castings. When the mold temperature exceeds the set threshold, the cooling water flow rate is preferentially increased to achieve rapid cooling, rather than simply increasing the power of the semiconductor refrigerator, thereby reducing the thermal end temperature gradient, avoiding the sudden drop in refrigeration efficiency caused by local overheating of the heat dissipation fins, improving energy utilization efficiency, and reducing operating costs.

[0084] Although only some parts and embodiments of the present application have been illustrated and described, many modifications and changes can be conceived by those skilled in the art without departing from the scope and spirit of the claims, such as: changes in the size, dimension, structure, shape and proportion of various elements, mounting arrangement, material use, color, orientation, etc.

[0085] The above-mentioned embodiments are only preferred embodiment modes of the embodiments of the present application, and cannot be used to limit the scope of protection of the embodiments of the present application. Any non-essential changes and substitutions made by those skilled in the art on the basis of the embodiments of the present application are within the scope of protection of the embodiments of the present application.

Claims

1. A die-casting mold for an integrated rear floor of an automobile, comprising a support structure, a lifting drive mechanism, and a split molding assembly; the support structure includes a load-bearing mechanism consisting of a worktable with an installation cavity, four vertical load-bearing columns at the corners, and a top platform; the lifting drive mechanism includes a linear actuator fixed to the top platform and a lifting platform connected to the linear actuator; the split molding assembly includes a moving mold core mounted on the lifting platform and a fixed mold core mounted in the installation cavity; characterized in that, It also includes a cooling system; The cooling system includes a cooling water circulation assembly and a semiconductor refrigeration assembly. The cooling water circulation assembly includes a cooling pipe assembly embedded in the outer wall of the fixed mold core, a circulation pump installed in the mounting cavity and located below the fixed mold core, and a water storage tank. The inlet of the circulation pump is connected to the outlet of the water storage tank, and its outlet is connected to the return outlet of the water storage tank through the cooling pipe assembly, forming a closed cooling water circulation path. The semiconductor refrigeration assembly is used to cool the cooling water in the water storage tank. The semiconductor cooling assembly includes a semiconductor cooler mounted on the side wall of the workbench, multiple serpentine cooling rods mounted in a water tank, and two horizontal cooling pipes. The semiconductor cooler includes a hot end and a cold end. The multiple serpentine cooling rods are mounted side by side on the two horizontal cooling pipes, and the two horizontal cooling pipes are respectively connected to the cold end of the semiconductor cooler for heat transfer. The hot end of the cooler is equipped with copper-based heat dissipation fins and is configured with an axial fan for forced heat dissipation. It also includes a central controller mounted on the workbench, a first temperature sensor mounted on the fixed mold core, a second temperature sensor mounted at the inlet of the cooling pipe assembly, and a third temperature sensor mounted at the inlet of the cooling pipe assembly. The signal output terminals of the first, second, and third temperature sensors are respectively connected to the signal input terminal of the central controller, and the signal output terminal of the central controller is respectively connected to the signal input terminals of the semiconductor cooler and the circulating pump. The central controller calculates the cooling water flow rate according to formula (1) and achieves dynamic control by adjusting the speed of the circulating pump; Formula (1) In formula (1), Q(k) is the cooling water flow rate; P cool (K) represents the cooling power of the semiconductor cooler; C p ρ is the specific heat capacity of cooling water at constant pressure; ρ is the density of cooling water; ΔT water α represents the temperature difference between the inlet and outlet water of the cooling pipe assembly; α is the flow redundancy coefficient.

2. The integrated automotive rear floor die-casting mold according to claim 1, characterized in that, The cooling pipe assembly consists of multiple horizontal annular pipes connected in series with vertical connecting pipes; or, the cooling pipe assembly consists of spiral pipes.

3. The integrated automotive rear floor die-casting mold according to claim 1, characterized in that, The outer wall of the workbench is equipped with an abutment assembly, which includes abutment plates arranged symmetrically on the left and right. A handle is fixedly installed on the outer wall of the abutment plate. The inner side of the abutment plate is engaged and fixed with a slot opened on the side wall of the mold core through a card seat. An abutment groove matching the shape of the abutment plate is opened on the top of the outer wall of the workbench.

4. The integrated automotive rear floor die-casting mold according to claim 1, characterized in that, The outer wall of the workbench is also equipped with a fastening assembly, which includes a hinge seat, an L-shaped abutment frame and an abutment push rod. The movable end of the abutment push rod is hinged to the movable seat. The movable seat drives the L-shaped abutment frame to rotate within the hinge seat, so that the inclination angle of the top wall of the L-shaped abutment frame engages with the abutment block of the top wall of the lifting platform.

5. The integrated rear floor die-casting mold for automobiles according to claim 4, characterized in that, The abutment block has a triangular structure, which matches the tilt angle shape of the L-shaped abutment frame to form a wedge-shaped abutment fit to fix the position of the lifting platform.

6. The integrated automotive rear floor die-casting mold according to claim 1, characterized in that, The inner walls of the four corners of the top wall of the lifting platform are slidably connected to the outer walls of the four corner vertical load-bearing columns. A high-pressure injection pipe is installed on the right side of the top wall of the lifting platform, and the bottom end of the high-pressure injection pipe passes through the lifting platform and communicates with the internal mold cavity of the moving mold core.

7. A control method for an integrated automotive rear floor die-casting mold as described in any one of claims 1-6, characterized in that, Includes the following steps: S10. The temperature of the fixed mold core, the inlet water temperature and the outlet water temperature of the cooling pipe assembly are monitored in real time by the first temperature sensor, the second temperature sensor and the third temperature sensor respectively, and the temperature data is transmitted to the central controller. S20. The central controller calculates the cooling water flow rate based on the received temperature data and formula (1), and adjusts the speed of the circulating pump to control the cooling water flow rate. S30. When the mold temperature exceeds the set threshold, the cooling water flow rate is increased to achieve rapid cooling. At the same time, the central controller controls the cooling power of the semiconductor cooler as needed to cool the cooling water in the water tank.

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