In-situ collecting device and method for cuttings of manufacturing equipment

Abstract

The invention discloses an in-situ collecting device and method for cuttings of manufacturing equipment. The in-situ collecting device comprises an additive and subtractive composite repairing cabin, a cuttings collecting module and an electrical control system. The additive and subtractive composite repairing cabin comprises a sealed cabin, and a scrap blowing module, a cabin door opening and closing module and an additive and subtractive repairing module which are arranged in the sealed cabin; the sealed cabin is provided with eight corners, and each corner is provided with a chip removal hole; the chip collecting module comprises a chip collecting mechanism and a corner cover opening and closing mechanism; the chip collecting mechanism comprises a plurality of chip collecting boxes which are communicated with one another through hoses; an angle cover opening and closing mechanism used for controlling the chip removal holes to be opened and closed is arranged at the position corresponding to each chip removal hole; a chip collecting box is arranged outside each chip removal hole and the corresponding corner cover opening and closing mechanism in a covering manner; the electrical control system is installed on a top cover of the sealed cabin and connected with the cuttings collecting module, the cuttings blowing module, the cabin door opening and closing module and the additive and subtractive material repairing module. According to the device, in-situ repairing of any posture and position can be carried out, and generated cuttings are collected in situ.

Description

Technical Field

[0001] The present invention relates to the field of additive and subtractive hybrid manufacturing, and in particular to a chip in-situ collection device and method for manufacturing equipment. Background Art

[0002] The additive and subtractive hybrid repair technology is a derivative of the additive and subtractive manufacturing technology, and is a new technology that integrates 3D printing technology and traditional numerical control machining technology. This technology relies on the additive process to achieve material accumulation forming, and relies on subtractive machining to improve the surface quality and remove internal defects. The two have a strong complementary relationship; through the combination of the two processes, by means of subtracting first and then adding, adding first and then subtracting, or alternating addition and subtraction, etc., high-efficiency and high-quality in-situ repair of parts can be achieved, and it can be widely used in the fields of aerospace, automotive parts, ships, molds, military equipment, etc., which can improve production efficiency, reduce production costs, and extend the service life of equipment, and has broad development prospects.

[0003] At present, the in-situ additive and subtractive repair technology is still in its infancy. The equipment composition forms of additive and subtractive repair are mainly machine tool type and robot type. Neither of these two forms can automatically recycle chips, and manual cleaning is required regularly; the residue of chips will also affect the quality of the additive process, increase the possibility of defects, and affect the quality of processing and repair.

[0004] For example, the Chinese patent document with the authorization announcement number CN211102164U discloses a deep-water pipeline composite milling additive and subtractive in-situ repair equipment, but it can only perform additive and subtractive repair on pipelines and cannot effectively collect chips; the Chinese patent document with the publication number CN114619256A discloses a powder and chip separation and collection device and method for an additive and subtractive hybrid processing system, which can separate chips and processing powder scattered on the processing platform, but is only applicable to the plane machine tool type and is not applicable to the uncertain spatial postures that may exist in in-situ repair.

[0005] Therefore, there is an urgent need for an additive and subtractive equipment with a chip collection function, which can be widely used in variable-posture additive and subtractive hybrid repair scenarios such as underwater, on land, and in aerospace. Summary of the Invention

[0006] The present invention provides a chip in-situ collection device and method for manufacturing equipment, which can perform in-situ repair on large structures underwater, on land or in space in any posture and position, and in-situ collect the generated chips to achieve isolation control of the repair environment and avoid environmental pollution caused by the equipment.

[0007] A chip in-situ collection device for manufacturing equipment includes an additive and subtractive hybrid repair cabin, a chip collection module, and an electrical control system; The additive and subtractive composite repair chamber includes a sealed chamber, and a plurality of chip blowing modules, a hatch opening and closing module, and an additive and subtractive repair module arranged in the sealed chamber; the sealed chamber has eight corners, and each corner is provided with an inclined plane with a chip discharge hole. The chip collection module includes a chip collection mechanism and a corner cover opening and closing mechanism. The chip collection mechanism includes a plurality of chip collection boxes interconnected by hoses; wherein, an outer surface of the sealed chamber is provided with a corner cover opening and closing mechanism for controlling the opening and closing of the chip discharge hole at a position corresponding to each chip discharge hole; a chip collection box is covered outside each chip discharge hole and the corresponding corner cover opening and closing mechanism, and the chip collection box is fixedly sealed with the sealed chamber. The electrical control system is installed on the top cover of the sealed chamber and is respectively connected to the chip collection module, the chip blowing module, the hatch opening and closing module, and the additive and subtractive repair module.

[0008] Further, the corner cover opening and closing mechanism includes a closing servo motor fixed on the outer surface of the sealed chamber and a rotating shaft driven by the closing servo motor; a corner cover is fixed on the rotating shaft; during the process of the rotating shaft driving the corner cover to rotate, the corner cover cooperates with the inclined plane with the chip discharge hole to control the opening and closing of the chip discharge hole.

[0009] Further, a chip guide groove is provided at the connection between adjacent two surfaces in the sealed chamber for guiding chips into the chip collection box.

[0010] Further, the chip blowing module is arranged on the chamber wall of the sealed chamber and includes a high-pressure nozzle, a servo motor bracket, a pitching servo motor, a pan-tilt turntable, and a yaw servo motor. The high-pressure nozzle is fixedly connected to the outside of the servo motor bracket through a nozzle adapter plate; the pitching servo motor is fixed inside the servo motor bracket and is rotationally connected to the pan-tilt turntable; the yaw servo motor is fixed on the pan-tilt turntable and is rotationally connected to a base fixed on the chamber wall.

[0011] Further, the hatch opening and closing module includes an electric cylinder and a sealed hatch door. The bottom plate of the sealed chamber is provided with a through opening matching the sealed hatch door, and the sealed hatch door is hinged to the bottom plate of the sealed chamber through a hinge; two ends of the electric cylinder are respectively connected to the chamber wall of the sealed chamber and the inner side surface of the sealed hatch door through mounting brackets; by controlling the shortening and elongation of the electric cylinder, the sealed hatch door is driven to open and close around the hinge.

[0012] Further, the additive and subtractive repair module includes a three-axis Cartesian motion platform composed of an X1 axis, an X2 axis, a Y axis, and a Z axis. A slurry additive extruder, a subtractive module, and a chip blowing module are fixed on the Z axis; the end of the chip blowing module faces the electric spindle cutter head of the subtractive module and is used for jetting high-pressure gas during subtractive processing.

[0013] Further, a plurality of chip collection boxes interconnected by hoses are connected to a solenoid valve in the electrical control system, and the solenoid valve is opened when chip collection is required.

[0014] Further, a gyroscope is provided in the electrical control system, and during the chip collection process, the attitude of the sealed cabin is detected by the gyroscope.

[0015] A method for in-situ chip collection, using the above-mentioned in-situ chip collection device for manufacturing equipment, includes: The robotic arm carries the additive-subtractive composite repair cabin and approaches and presses it in a direction perpendicular to the surface to be repaired. The cabin door opening and closing module controls the opening of the sealed cabin door, and the additive-subtractive repair module performs additive-subtractive repair work; When chips appear during the additive-subtractive repair process, the chip blowing module and the chip lifting module in the additive-subtractive repair module work together to increase the pressure inside the sealed cabin, enhance the air convection inside the cabin, form a cyclone, and guide the chips into the chip guide groove inside the sealed cabin; After the preset pressure is reached inside the sealed cabin, the gyroscope in the electrical control system detects the current attitude of the sealed cabin. According to the different attitudes, the lowest corner point position is confirmed, and the corner cover opening and closing mechanism at this position is controlled to open the corner cover, and the chips inside the cabin are guided to be discharged by using the pressure difference between the sealed cabin and the chip collection box; For some residual chips with large mass, the direction of the high-pressure nozzle of the chip blowing module is turned to the lowest corner point of the sealed cabin, and high-pressure gas is sprayed again along the direction of the chip guide groove to completely blow the chips into the chip collection box, realizing the in-situ chip collection method of chip lifting - chip blowing - chip guiding - chip collection.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The present invention can adjust the chip collection position according to the different spatial attitudes of the processing cabin, and uses the technical route of chip lifting - chip blowing - chip guiding - chip collection to efficiently collect the generated chips, avoiding the chips remaining on the processing surface from affecting the additive repair process, and at the same time avoiding the pollution of the external environment of the cabin.

[0017] The present invention can be applied to a variety of complex working conditions, including in-situ additive-subtractive repair in underwater and space environments, and can efficiently and widely collect chips in any attitude; at the same time, the processing cabin can realize the full process automation of additive-subtractive repair, is convenient and fast to use, and improves work efficiency. Description of the Drawings

[0018] Figure 1 It is a schematic diagram of the overall structure of an in-situ chip collection device for a manufacturing equipment of the present invention.

[0019] Figure 2 It is a schematic diagram of the chip collection mechanism in the present invention.

[0020] Figure 3Schematic diagram of the angle cover opening and closing mechanism in the present invention.

[0021] Figure 4 is Figure 3 Partial enlarged view of area A in

[0022] Figure 5 Partial sectional view of the chip in-situ collection device of a manufacturing equipment according to the present invention.

[0023] Figure 6 Schematic diagram of the structure of the chip blowing module in the present invention.

[0024] Figure 7 Schematic diagram of the hatch opening and closing module in the present invention.

[0025] Figure 8 Schematic diagram of the additive and subtractive repair module in the present invention.

[0026] Figure 9 Arrangement schematic diagram of the chip blowing module in the present invention.

[0027] Figure 10 Cross-sectional schematic diagram of the chip guide groove in the present invention. Detailed implementation manners

[0028] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be noted that the following embodiments are intended to facilitate the understanding of the present invention and do not limit it in any way.

[0029] As Figure 1 shown, a chip in-situ collection device for a manufacturing equipment includes a chip collection module 1, an additive and subtractive composite repair cabin 2, and an electrical control system 3.

[0030] As Figure 2 and Figure 3 shown, the chip collection module 1 includes a chip collection mechanism 10 and an angle cover opening and closing mechanism 11.

[0031] The chip collection mechanism 10 includes a chip collection box 101, a hose 102, and a sealing ring 103. The hose 102 is connected through a quick interface installed on the chip collection box 101, and eight chip collection boxes 101 are connected to the solenoid valve in the electrical control system 3. The chip collection box 101 is fixedly connected to the additive and subtractive composite repair cabin 2, and the connection airtightness is ensured through the sealing ring 103.

[0032] As Figure 4 shown, the angle cover opening and closing mechanism 11 is installed at eight corner points of the additive and subtractive composite repair cabin 2, and includes a closing servo motor 111, a servo motor bracket 112, a rotating shaft bracket 113, a rotating shaft 114, an angle cover 115, a synchronous belt 116, and a synchronous belt pulley 117.

[0033] When receiving the instruction from the electrical control system 3, the closing servo 111 rotates by a fixed angle, drives the angle cover 115 to rotate around the rotating shaft 114 through the synchronous belt 116 and the synchronous belt pulley 117, seals the chip discharge holes reserved on the additive and subtractive composite repair chamber 2, and a flexible rubber is provided at the contact between the angle cover 115 and the chamber body to ensure airtightness. A chip collection box 101 is provided outside each chip discharge hole and the corresponding angle cover opening and closing mechanism 11.

[0034] As Figure 5 shown, the additive and subtractive composite repair chamber 2 includes a sealed chamber 23 and a chip blowing module 20, a chamber door opening and closing module 21, and an additive and subtractive repair module 22 provided in the sealed chamber 23. The sealed chamber 23 includes a top cover 231, a chamber wall 232, and a bottom plate 233.

[0035] Chip guiding grooves are provided at the joints between adjacent two surfaces in the sealed chamber 23. As Figure 10 shown, an arc-shaped chip guiding groove is provided at the joint between two adjacent chamber walls 232. Similarly, chip guiding grooves are also provided at the joints between the top cover 231 and the chamber wall 232, and between the chamber wall 232 and the bottom plate 233. After the chips fall into the chip guiding grooves, they are guided into the chip collection box 101, improving the chip collection efficiency.

[0036] As Figure 6 shown, the chip blowing module 20 includes a high-pressure nozzle 201, a nozzle adapter plate 202, a servo support 203, a pitching servo 204, a pan-tilt turntable 205, a yaw servo 206, and a base 207. The high-pressure nozzle 201 is fixed to the outside of the servo support 203 through the nozzle adapter plate 202; the pitching servo 204 is fixed inside the servo support 203 and is rotationally connected to the pan-tilt turntable 205; the yaw servo 206 is fixed on the pan-tilt turntable 205 and is rotationally connected to the base 207 fixed on the chamber wall 232.

[0037] The high-pressure nozzle 201 is connected to an external high-pressure gas source through an air pipe inside the chamber body, and the on-off is controlled by an electromagnetic valve; the chip blowing module 20 has two degrees of freedom, can realize the yaw and pitching movements of the nozzle, and can adjust the jet direction inside the chamber.

[0038] The azimuth arrangement of the chip blowing module 20 is as Figure 9 shown. During the chip recovery process, eight chip blowing modules 20 first jet high-pressure gas in the counterclockwise direction, increasing the pressure inside the chamber, enhancing the air convection inside the chamber, working simultaneously with the chip lifting module to form a cyclone, and taking the chips away from the repair surface. On the one hand, reducing the chip residue on the surface helps to improve the quality of additive repair. At the same time, this method can also improve the chip collection rate, avoid chip residue when the chips leave the surface in the processing chamber, and cause pollution to the external environment.

[0039] As Figure 7As shown in the figure, the hatch opening and closing module 21 includes a mounting bracket 211, an electric cylinder 212, a sealed hatch 213, and a hinge 214. The bottom plate 233 of the sealed chamber 23 is provided with a through opening matching the sealed hatch 213, and the sealed hatch 213 is hinged to the bottom plate 233 through the hinge 214; both ends of the electric cylinder 212 are respectively connected to the inner side surfaces of the chamber wall 232 of the sealed chamber 23 and the sealed hatch 213 through the mounting bracket 211; by controlling the shortening and elongation of the electric cylinder 212, the sealed hatch 213 is driven to open and close around the hinge 214.

[0040] After the sealed chamber 23 contacts the surface to be processed, the electric cylinder 212 drives the sealed hatch 213 to open around the hinge 214 rotation axis, enabling the internal additive and subtractive repair module 22 to reach the target processing position for repair operations.

[0041] As Figure 8 shown in the figure, the additive and subtractive repair module 22 includes a three-axis Cartesian motion platform composed of an X1 axis 221, an X2 axis 222, a Y axis 224, a Z axis 225, an XY adapter plate 223, and a YZ adapter plate 226. The slurry additive extruder is fixed on the slider nut of the Z axis through the adapter plate, and a displacement cylinder 227, a cylinder connection plate 228, an extrusion module 229, an extrusion head 2210, a syringe chuck 2211, a semi-circular pressing head 2212, a guiding flange 2213, and a syringe 2214 are installed on it. The displacement cylinder 227 can move the syringe 2214 up and down, and it can descend during additive manufacturing operations and lift the syringe 2214 during subtractive manufacturing to avoid interference. The upper end of the push rod of the syringe 2214 is clamped inside the extrusion head 2210; the filling barrel of the syringe 2214 is tightly clamped by the syringe chuck 2211 and the semi-circular pressing head 2212, and the two are connected by screws to restrict the six-degree-of-freedom of the syringe. A number of screw holes are arranged on the guiding flange 2213, and the orientation of the end of the syringe 2214 can be finely adjusted by tightening the set screws, or the deformation direction of the syringe 2214 can be restricted when the extrusion pressure is high, improving the quality of additive manufacturing.

[0042] The additive and subtractive repair module 22 also includes a subtractive module, which is composed of a spindle tool holder 2215 and an electric spindle 2216. The spindle tool holder 2215 is fixed to the Z axis 225 by screws, and the electric spindle 2216 is installed in the tool hole of the spindle tool holder 2215 and locked by three screws to ensure high rigidity during subtractive manufacturing. The chip evacuation module 2217 is connected to the cylinder connection plate 228, and its end faces the tool tip position of the electric spindle 2216. During subtractive manufacturing, it sprays high-pressure gas to cool the tool, and can also lift the chips and blow them away from the processing surface, participating in the chip recycling process.

[0043] The electrical control system 3 includes a gyroscope, a solenoid valve, a motor driver, a motorized spindle driver, and a lower computer. Each sensor and drive element is connected to the lower computer through a circuit and receives the control signals sent by it. The gyroscope can sense the current attitude of the cabin body. The solenoid valve is used to control the on / off of the air circuit. The motor driver drives the module to move. The motorized spindle driver is used to adjust the spindle speed. An integrated wiring port is provided on the upper part of the electrical box, which can be connected to external high / low-pressure air sources, power supplies, and the upper computer.

[0044] A chip in-situ collection method uses the chip in-situ collection device of the manufacturing equipment mentioned in the above embodiment, and includes: Step 1: After detecting the damage on the structure surface, the additive and subtractive composite repair cabin 2 is clamped by the robotic arm and reaches the area to be repaired. The sealed cabin 23 fits on the damaged structure in an inclined posture. When the processing cabin is completely fitted, the electric cylinder 212 controls the sealed cabin door 213 to open, maintaining the isolation between the cabin environment and the external environment.

[0045] Step 2: The additive and subtractive repair module 22 starts to work. First, it performs pre-treatment on the surface to be repaired, aiming to remove possible foreign objects on the damaged surface and regularize the defects, which is beneficial to improving the interface bonding strength. At this time, the milling operation of the motorized spindle 2215 will generate chips, and these chips will scatter on the bottom plate 233 and the milling surface. Part of them will deposit at the lowest position and the chip guide groove in the inclined cabin due to gravity.

[0046] Step 3: The chip lifting module 2216 is turned on throughout the milling process. High-pressure gas continuously supplies gas to the tool head to cool the tool, and at the same time blows some chips away from the in-situ position. After the pre-treatment of milling is completed, the tool stops rotating, and the Cartesian motion platform drives the chip lifting module 2216 to continue moving. In the Z-Zag path, it uses the high-speed pulsed ventilation method to completely sweep the damaged surface to ensure that there is no residual milling chip on the surface. At the same time, the chip blowing module 20 is turned on. The eight high-pressure nozzles 201 are driven by the pitch servo 204 and the yaw servo 206 to face the counterclockwise direction. The solenoid valve is opened to start ventilation. During the ventilation process, a counterclockwise air vortex will form inside the sealed cabin 23, driving the chips inside the cabin to flow, and at the same time increasing the pressure inside the cabin, forming a certain pressure difference with the chip collection module 1.

[0047] Step 4: The gyroscope in the electrical control system 3 starts to detect the current attitude of the cabin body. According to the different attitudes, the lowest corner position is confirmed, and the corner cover 115 at this position is opened. Using the pressure difference between the two cavities to guide the chips inside the cabin to be discharged. Some chips may remain inside the cabin due to their large mass. At this time, the solenoid valves of the chip lifting module 2217 and the chip blowing module 20 are closed. The chip blowing module 20 drives the nozzle direction to the lowest corner point under the drive of the pitch servo 204 and the yaw servo 206, and sprays high-pressure gas again along the direction of the chip guide groove to completely blow the chips out of the cabin body.

[0048] Step 5: If there are still fine chips remaining in the sealed chamber 23 at this time, just repeat Steps 3 - 4.

[0049] Step 6: The displacement cylinder 227 extends out of the slurry extruder under the action of air pressure, and additive repair is carried out on the pre - treated surface by using the slurry direct writing printing technology, leaving some machining allowances. The material used is a two - component polymer repair agent, which has been filled into the syringe 2214 in a pre - proportioned manner.

[0050] Step 7: After the polymer repair agent is completely cured, the additive - subtractive repair module 22 works again to perform final surface treatment on the repaired surface. The machining allowances reserved are finish - machined by the subtractive module to improve the surface quality and repair accuracy.

[0051] Step 8: At this time, chips will be generated in the chamber again. Repeat Steps 3 - 5.

[0052] Step 9: The repair is completed, and the sealed chamber door 213 is closed. At this time, there should be no chip residues on the repaired surface, realizing in - situ chip collection and clean repair of additive - subtractive repair.

[0053] Step 10: Manually clean the chips in the chip collection box 101 after the chamber body finishes working.

[0054] The above - described embodiments have detailed the technical solutions and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the present invention. Any modifications, supplements, and equivalent replacements made within the scope of the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip in-situ collection device for manufacturing equipment, characterized in that, It includes an additive-subtractive composite repair cabin (2), a chip collection module (1), and an electrical control system (3); The additive-subtractive composite repair cabin (2) includes a sealed cabin (23) and a plurality of chip blowing modules (20), a cabin door opening and closing module (21), and an additive-subtractive repair module (22) arranged in the sealed cabin (23); the sealed cabin (23) has eight corners, and each corner is provided with an inclined plane with a chip discharge hole; The chip collection module (1) includes a chip collection mechanism (10) and a corner cover opening and closing mechanism (11), and the chip collection mechanism (10) includes a plurality of chip collection boxes (101) interconnected by a hose (102); wherein, a corner cover opening and closing mechanism (11) for controlling the opening and closing of the chip discharge hole is provided at a position corresponding to each chip discharge hole on the outer surface of the sealed cabin (23); a chip collection box (101) is provided outside each chip discharge hole and the corresponding corner cover opening and closing mechanism (11), and the chip collection box (101) is fixedly sealed with the sealed cabin (23); The electrical control system (3) is installed on the top cover (231) of the sealed cabin (23) and is respectively connected to the chip collection module (1), the chip blowing module (20), the cabin door opening and closing module (21), and the additive-subtractive repair module (22).

2. The chip in-situ collection device of the manufacturing equipment according to claim 1, characterized in that The corner cover opening and closing mechanism (11) includes a closing servo motor (111) fixed on the outer surface of the sealed cabin (23) and a rotating shaft (114) driven by the closing servo motor (111); a corner cover (115) is fixed on the rotating shaft (114); during the process of the rotating shaft (114) driving the corner cover (115) to rotate, the corner cover (115) cooperates with the inclined plane with the chip discharge hole to control the opening and closing of the chip discharge hole.

3. The chip in-situ collection device of the manufacturing equipment according to claim 1, characterized in that A chip guiding groove is provided at the connection between adjacent two surfaces in the sealed cabin (23) for guiding chips into the chip collection box (101).

4. The chip in-situ collection device of the manufacturing equipment according to claim 1, characterized in that, The chip blowing module (20) is arranged on the cabin wall (232) of the sealed cabin (23) and includes a high-pressure nozzle (201), a servo motor bracket (203), a pitching servo motor (204), a pan-tilt turntable (205), and a yaw servo motor (206); The high-pressure nozzle (201) is fixedly connected to the outside of the servo motor bracket (203) through a nozzle adapter plate (202); the pitching servo motor (204) is fixed inside the servo motor bracket (203) and is rotatably connected to the pan-tilt turntable (205); the yaw servo motor (206) is fixed on the pan-tilt turntable (205) and is rotatably connected to a base (207) fixed on the cabin wall (232).

5. The chip in-situ collection device of the manufacturing equipment according to claim 1, characterized in that The cabin door opening and closing module (21) includes an electric cylinder (212) and a sealed cabin door (213); The bottom plate (233) of the sealed cabin (23) is provided with a through opening matching the sealed cabin door (213), and the sealed cabin door (213) is hinged to the bottom plate (233) of the sealed cabin (23) through a hinge (214); both ends of the electric cylinder (212) are respectively connected to the cabin wall (232) of the sealed cabin (23) and the inner side surface of the sealed cabin door (213) through mounting brackets (211); the opening and closing of the sealed cabin door (213) around the hinge (214) is driven by controlling the shortening and elongation of the electric cylinder (212).

6. The chip in-situ collection device of the manufacturing equipment according to claim 1, characterized in that The additive and subtractive repair module (22) includes a three-axis Cartesian motion platform composed of an X1 axis (221), an X2 axis (222), a Y axis (224) and a Z axis (225); A slurry additive extruder, a subtractive module and a chip blowing module (2217) are fixed on the Z axis (225); the end of the chip blowing module (2217) faces the tool head of the electric spindle (2216) of the subtractive module and is used for spraying high-pressure gas during subtractive machining.

7. The chip in-situ collection device of the manufacturing equipment according to claim 1, characterized in that, A plurality of chip collection boxes (101) interconnected by a hose (102) are connected to a solenoid valve in the electrical control system (3), and the solenoid valve is opened when chip collection is required.

8. The chip in-situ collection device of the manufacturing equipment according to claim 1, characterized in that, A gyroscope is provided in the electrical control system (3), and the attitude of the sealed cabin (23) is detected by the gyroscope during the chip collection process.

9. A method for in-situ chip collection, characterized in that, Using the chip in-situ collection device of the manufacturing equipment according to any one of claims 1 to 8, comprising: The robotic arm carries the additive and subtractive composite repair cabin (2) to approach and press in a direction perpendicular to the surface to be repaired, the cabin door opening and closing module (21) controls the opening of the sealed cabin door, and the additive and subtractive repair module (22) performs additive and subtractive repair work; When chips appear during the additive and subtractive repair process, the chip blowing module (20) and the chip blowing module (2217) in the additive and subtractive repair module (22) work together to increase the pressure in the sealed cabin (23), enhance the air convection in the cabin, form a cyclone, and guide the chips into the chip guide groove in the sealed cabin (23); After the pressure in the sealed cabin (23) reaches the preset pressure, the gyroscope in the electrical control system (3) detects the current attitude of the sealed cabin (23), confirms the position of the lowest corner point according to the different attitudes, controls the corner cover opening and closing mechanism (11) at this position to open the corner cover (115), and uses the pressure difference between the sealed cabin (23) and the chip collection box (101) to guide the chips in the cabin to be discharged; For some large-mass residual chips, the direction of the high-pressure nozzle (201) of the chip blowing module (20) is turned to the lowest corner point of the sealed cabin (23), and high-pressure gas is sprayed again along the direction of the chip guide groove to completely blow the chips into the chip collection box (101), realizing the chip in-situ collection method of chip blowing - chip blowing - chip guiding - chip collection.

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