Electronic component heat distribution self-adaptive manifold distribution system and liquid distribution method

Abstract

The invention relates to the technical field of manifold shunting, and discloses an electronic component heat distribution self-adaptive manifold shunting system and a liquid separation method.The system comprises a temperature acquisition module, a clustering analysis module, a target heat exchange function construction module, a target space layout determination module, a cold air demand determination module and a heat dissipation execution module; wherein the temperature acquisition module is used for acquiring the real-time temperature of an electronic component in an integrated circuit chip; and the clustering analysis module is used for carrying out difference calculation on the real-time temperature and the real-time temperature of an adjacent element of the electronic element to obtain the temperature gradient of the electronic element, and carrying out clustering analysis on the electronic element based on the temperature gradient and the real-time temperature to obtain a clustering result of the electronic element. Obtaining a plurality of thermal load feature clusters of the integrated circuit chip; according to the invention, by optimizing the shunting layout of the manifolds, the heat dissipation efficiency of electronic components in the integrated circuit chip is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of manifold shunt, and particularly to a manifold shunt system and a liquid separation method with self - adaptation to the thermal distribution of electronic components. Background Art

[0002] In the field of thermal management of integrated circuit chips, with the continuous improvement of the integration density and power density of electronic components, the internal thermal field of the chip shows significant spatio - temporal non - uniformity characteristics. The branch pipes of traditional manifolds adopt a static layout with a preset equal - flow - sharing strategy to dissipate heat from electronic components.

[0003] Firstly, the static layout lacks the ability to adjust the layout according to the distribution of the internal heat load group of the integrated circuit chip. The manifold branch pipes cannot be dynamically adjusted according to the real - time thermal distribution of electronic components. When the heat load distribution of the integrated circuit chip is uneven, the heat dissipation efficiency of the manifold will be significantly reduced, resulting in overheating in some areas and over - cooling in other areas. Secondly, traditional systems mostly adopt an equal - flow - sharing strategy, that is, the cold air flow rate in each branch pipe remains the same. However, due to the significant difference in the heat load distribution of electronic components, a constant flow rate will lead to insufficient heat dissipation in high - load areas and waste of resources in low - load areas, reducing the heat dissipation efficiency of the manifold. Summary of the Invention

[0004] The present invention provides a manifold shunt system and a liquid separation method with self - adaptation to the thermal distribution of electronic components, and its main purpose is to solve the problem of reduced heat dissipation efficiency of the manifold when using the shunt layout of the manifold to dissipate heat from circuit chips in the prior art.

[0005] To achieve the above object, a manifold shunt system with self - adaptation to the thermal distribution of electronic components provided by the present invention is characterized in that the system includes a temperature acquisition module, a clustering analysis module, a target heat exchange function construction module, a target space layout determination module, a cold air demand determination module, and a heat dissipation execution module, wherein: The temperature acquisition module is used to obtain the real - time temperature of electronic components in the integrated circuit chip; The clustering analysis module is used to calculate the difference between the real - time temperature and the real - time temperature of adjacent components of the electronic component to obtain the temperature gradient of the electronic component, and perform clustering analysis on the electronic component based on the temperature gradient and the real - time temperature to obtain multiple heat load characteristic clusters of the integrated circuit chip; The target heat exchange function construction module is used to obtain the cross-sectional area and cold air flow rate of each branch pipe in the manifold, obtain the heat dissipation parameters of the electronic components, calculate the target heat load of the heat load characteristic clusters based on the heat dissipation parameters, construct the target heat exchange function of the integrated circuit chip based on the cross-sectional area, the cold air flow rate, the target heat load, and the position information of the heat load characteristic clusters, and generate the constraint conditions of the manifold according to the physical limit parameters of the branch pipes; The target space layout determination module is used to optimize the parameters of the target heat exchange function based on the gradient descent algorithm under the constraint conditions to obtain the minimum value of the target heat exchange function, determine the optimal parameters of the target heat exchange function according to the minimum value, determine the target position of the branch pipe according to the two-dimensional coordinates in the optimal parameters, determine the target inclination angle of the branch pipe according to the pitch angle in the optimal parameters, and determine the target space layout of the manifold according to the target position and the target inclination angle; The cold air demand determination module is used to calculate the branch cold air demand of the branch pipes based on the target heat load; The heat dissipation execution module is used to dissipate heat from the electronic components corresponding to the heat load characteristic clusters based on the target space layout and the branch cold air demand.

[0006] Preferably, when the clustering analysis module performs clustering analysis on the electronic components based on the temperature gradient and the real-time temperature to obtain multiple heat load characteristic clusters of the integrated circuit chip, it includes: Performing feature fusion on the temperature gradient and the real-time temperature to obtain the two-dimensional feature vectors of the electronic components, and aggregating the two-dimensional feature vectors into the vector data set of the integrated circuit chip; Performing clustering analysis on the vector data set based on the K-means clustering algorithm to obtain multiple heat load characteristic clusters of the integrated circuit chip.

[0007] Preferably, when the target heat exchange function construction module calculates the target heat load of the heat load characteristic clusters based on the heat dissipation parameters, it includes: Approximating the power consumption data of the heat dissipation parameters as the thermal energy data of the electronic components; Calculating the total cluster thermal energy of the heat load characteristic clusters based on the thermal energy data; Determining the in-cluster heat dissipation efficiency of the heat load characteristic clusters according to the component heat dissipation efficiency of the heat dissipation parameters; Calculating the target heat load of the heat load characteristic clusters based on the in-cluster heat dissipation efficiency and the total cluster thermal energy, where the calculation formula of the target heat load is as follows: In the formula, represents the The total thermal energy of a cluster of heat load characteristics Indicating the Internal heat dissipation efficiency of the cluster of the Indicating the Target heat load of the cluster of the Indicating the identifier of the cluster of heat load characteristics

[0008] Preferably, the target heat exchange function is as follows: In the formula, Indicating the target heat exchange function Indicating the parameter of the target heat exchange function Indicating the identifier of the cluster of heat load characteristics Indicating the number of clusters of heat load characteristics Indicating the Target heat load of the cluster of the Indicating the identifier of the branch pipe Indicating the number of branch pipes Indicating the heat transfer efficiency coefficient Indicating the cold air flow rate of the i-th branch pipe Indicating the Cross-sectional area of the Indicating the Pitch angle of the Indicating the Abscissa in the two-dimensional coordinates of the Indicating the Ordinate in the two-dimensional coordinates of the Indicating the Abscissa in the position information of the Indicating the Ordinate in the position information of the

[0009] Preferably, the constraint conditions are as follows: In the formula, Indicating the Abscissa in the two-dimensional coordinates of the Indicating the Ordinate in the two-dimensional coordinates of the Indicating the identifier of the branch pipe Indicating the Abscissa in the two-dimensional coordinates of the Indicating the Ordinate in the two-dimensional coordinates of the Indicating the minimum distance constraint between branch pipes Indicating the identifier of the branch pipe Indicating the The pitching angle of each branch pipe represents the lower limit of the pitching angle represents the upper limit of the pitching angle

[0010] Preferably, when the target space layout determination module executes the optimization of the parameters of the target heat exchange function based on the gradient descent algorithm to obtain the minimum value of the target heat exchange function, it includes: Optimizing the parameters of the target heat exchange function using the update formula of the gradient descent algorithm, where the update formula is as follows: In the formula, represents the parameter at the th iteration represents the parameter at the th iteration represents the learning rate represents the gradient of the target heat exchange function at represents the iteration identifier represents the target heat exchange function; When the change of the target heat exchange function is less than the preset change threshold, the minimum value of the target heat exchange function is obtained.

[0011] Preferably, when the target space layout determination module executes the determination of the target space layout of the manifold according to the target position and the target tilt angle, it includes: Installing the branch pipes according to the target position to obtain the preliminary space layout of the branch pipes; Under the preliminary space layout, adjusting the initial tilt angle of the branch pipes according to the target tilt angle to obtain the target space layout of the manifold.

[0012] Preferably, the calculation formula for the branch cold air demand is as follows: In the formula, represents the branch cold air demand of the th branch pipe represents the identifier of the branch pipe represents the heat transfer efficiency coefficient of the th branch pipe represents the target heat load of the th heat load characteristic cluster represents the identifier of the heat load characteristic cluster represents the th pitching angle of the branch pipe represents the abscissa in the two-dimensional coordinates of the th branch pipe represents the ​The ordinate in the two-dimensional coordinates of each branch pipe, represents the abscissa in the position information of the th target heat load, represents the ordinate in the position information of the th target heat load.

[0013] Preferably, when the heat dissipation execution module dissipates heat from the electronic components corresponding to the heat load feature cluster based on the target space layout and the branch cold air demand, it includes: Calculating the total cold air demand of the manifold based on the branch cold air demand; Injecting cold air into the manifold according to the total cold air demand; Calculating the branch cold air injection time of the manifold according to the branch cold air demand and the cold air flow rate; Under the target space layout, the branch pipes dissipate heat from the electronic components corresponding to the heat load feature cluster according to the branch cold air injection time.

[0014] To solve the above problems, the present invention also provides a manifold liquid separation method for electronic component heat distribution adaptation, and the method includes: S1. Obtaining the real-time temperature of the electronic components in the integrated circuit chip; S2. Calculating the difference between the real-time temperature and the real-time temperature of the adjacent components of the electronic component to obtain the temperature gradient of the electronic component, and performing clustering analysis on the electronic component based on the temperature gradient and the real-time temperature to obtain multiple heat load feature clusters of the integrated circuit chip; S3. Obtaining the cross-sectional area and cold air flow rate of each branch pipe in the manifold, obtaining the heat dissipation parameters of the electronic components, calculating the target heat load of the heat load feature cluster based on the heat dissipation parameters, constructing the target heat exchange function of the integrated circuit chip based on the cross-sectional area, the cold air flow rate, the target heat load, and the position information of the heat load feature cluster, and generating the constraint conditions of the manifold according to the physical limit parameters of the branch pipes; S4. Under the constraint conditions, optimizing the parameters of the target heat exchange function based on the gradient descent algorithm to obtain the minimum value of the target heat exchange function, determining the optimal parameters of the target heat exchange function according to the minimum value, determining the target position of the branch pipe according to the two-dimensional coordinates in the optimal parameters, determining the target tilt angle of the branch pipe according to the pitch angle in the optimal parameters, and determining the target space layout of the manifold according to the target position and the target tilt angle; S5. Calculating the branch cold air demand of the branch pipes based on the target heat load; S6. Dissipate heat from the electronic components corresponding to the heat load feature clusters based on the target space layout and the required amount of branched cold air.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. By analyzing the temperature data of the electronic components in the integrated circuit chip, considering the temperature gradient and the temperature difference between adjacent components, the present invention divides the electronic components into multiple heat load feature clusters, and can accurately identify the heat load distribution in different regions of the integrated circuit chip; based on the physical characteristics of the manifold branch pipes and the heat dissipation requirements of the electronic components, a target heat exchange function with the optimization goal of heat exchange efficiency is constructed, and the target heat exchange function is solved by an optimization algorithm to determine the optimal position and tilt angle of the manifold branch pipes, ensuring that the branch pipe layout can maximize the adaptation to the heat load distribution on the chip and improving the heat dissipation efficiency of the manifold. 2. The present invention calculates the required amount of branched cold air for each branch pipe through the target heat load of the heat load feature clusters, which accurately reflects the heat that the electronic components actually need to dissipate; the heat dissipation execution module installs the branch pipes according to the target space layout to ensure that the cold air can efficiently exchange heat with the heat load feature clusters. The target space layout considers the optimal position and tilt angle of the branch pipes to maximize the heat dissipation efficiency, and dynamically adjusts the delivery amount and injection time of the cold air according to the real-time temperature change and the heat dissipation situation of the heat load feature clusters to achieve continuous dynamic heat dissipation adjustment; through this collaborative working mode, the system can dissipate heat according to the actual situation of the heat load group distribution in the integrated circuit chip, avoiding the problem of uneven heat dissipation caused by the equal flow distribution strategy in the traditional manifold heat dissipation system and improving the heat dissipation efficiency of the manifold. Description of the Drawings

[0016] Figure 1 It is a system architecture diagram of a manifold shunt system with adaptive electronic component heat distribution provided by an embodiment of the present invention; Figure 2 It is a schematic flowchart of a manifold liquid separation method with adaptive electronic component heat distribution provided by an embodiment of the present invention.

[0017] The realization, functional characteristics and advantages of the object of the present invention will be further described with reference to the embodiments and the accompanying drawings. Detailed Embodiments

[0018] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] The terms used in the embodiments of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The singular forms "the" and "said" used in the embodiments of the present invention and the appended claims are also intended to include the plural forms unless the context clearly dictates otherwise. "Plurality" generally includes at least two.

[0020] Depending on the context, the words "if" or "when" as used herein can be interpreted as "when" or "while" or "in response to determining" or "in response to detecting". Similarly, depending on the context, the phrase "if determined" or "if detected (stated condition or event)" can be interpreted as "when determined" or "in response to determining" or "when detected (stated condition or event)" or "in response to detecting (stated condition or event)".

[0021] In addition, the step timings in the following method embodiments are only examples and not strictly limited.

[0022] In fact, the server device deployed by the manifold shunt system for adaptive thermal distribution of electronic components may be composed of one or more devices. The above-mentioned manifold shunt system for adaptive thermal distribution of electronic components can be implemented as: a service instance, a virtual machine, or a hardware device. For example, the manifold shunt system for adaptive thermal distribution of electronic components can be implemented as a service instance deployed on one or more devices in a cloud node. Simply put, the manifold shunt system for adaptive thermal distribution of electronic components can be understood as a software deployed on a cloud node for providing the manifold shunt system for adaptive thermal distribution of electronic components to each client. Alternatively, the manifold shunt system for adaptive thermal distribution of electronic components can also be implemented as a virtual machine deployed on one or more devices in a cloud node. An application software for managing each client is installed in the virtual machine. Or, the manifold shunt system for adaptive thermal distribution of electronic components can also be implemented as a server composed of many identical or different types of hardware devices, and one or more hardware devices are set to provide the manifold shunt system for adaptive thermal distribution of electronic components to each client.

[0023] In terms of implementation form, the manifold shunt system for adaptive thermal distribution of electronic components and the client adapt to each other. That is, if the manifold shunt system for adaptive thermal distribution of electronic components is an application installed on a cloud service platform, then the client is a client that establishes a communication connection with the application; or if the manifold shunt system for adaptive thermal distribution of electronic components is implemented as a website, then the client is implemented as a web page; or if the manifold shunt system for adaptive thermal distribution of electronic components is implemented as a cloud service platform, then the client is implemented as a mini-program in an instant messaging application.

[0024] Such as Figure 1As shown, it is the system architecture diagram of the manifold shunt system with adaptive electronic component thermal distribution provided by an embodiment of the present invention.

[0025] In the present invention, the manifold shunt system 100 with adaptive electronic component thermal distribution can be set in a cloud server. In terms of implementation form, it can be used as one or more service devices, or can be installed as an application on the cloud (such as the server of a mobile service operator, a server cluster, etc.), or can also be developed into a website. According to the functions achieved, the manifold shunt system 100 with adaptive electronic component thermal distribution may include an information extraction module 101, a commodity verification module 102, a verification failure module 103, a verification success module 104, a commodity settlement module 105, and a settlement success module 106. The modules in the present invention can also be referred to as units, which refer to a series of computer program segments that can be executed by a processor of an electronic device and can complete fixed functions, and are stored in the memory of the electronic device.

[0026] In an embodiment of the present invention, in the manifold shunt system with adaptive electronic component thermal distribution, each of the above modules can be independently implemented and called by other modules. Here, the call can be understood as that a certain module can be connected to multiple modules of another type and provide corresponding services for the multiple modules it is connected to. In the manifold shunt system with adaptive electronic component thermal distribution provided by the embodiment of the present invention, without modifying the program code, the applicable range of the architecture of the manifold shunt system with adaptive electronic component thermal distribution can be adjusted by adding modules and directly calling, so as to achieve cluster - type horizontal expansion, so as to achieve the purpose of quickly and flexibly expanding the manifold shunt system with adaptive electronic component thermal distribution. In practical applications, the above modules can be set in the same device or different devices, or can also be set in virtual devices, such as service instances in a cloud server.

[0027] The following will respectively describe the various components and the specific working process of the manifold shunt system with adaptive electronic component thermal distribution in combination with specific embodiments: The temperature acquisition module is used to obtain the real - time temperature of the electronic components in the integrated circuit chip; Specifically, an integrated circuit chip is a miniaturized electronic device or module with a specific circuit function formed by integrating a large number of electronic components such as transistors, resistors, capacitors and wires on a semiconductor substrate through semiconductor manufacturing processes; an electronic component is the basic unit of a circuit, including active components (such as transistors, integrated circuits) and passive components (such as resistors, capacitors, inductors), and is used to realize the electrical conduction, insulation, energy storage, amplification and other characteristics of the circuit; the real - time temperature of the electronic components is obtained by integrating a temperature sensor on the surface of the integrated circuit chip.

[0028] The clustering analysis module is configured to calculate the difference between the real-time temperature and the real-time temperatures of the adjacent components of the electronic component to obtain the temperature gradient of the electronic component, and perform clustering analysis on the electronic component based on the temperature gradient and the real-time temperature to obtain multiple thermal load characteristic clusters of the integrated circuit chip; Specifically, the "adjacent components" in "the adjacent components of the electronic component" refer to other electronic components that have a direct association relationship with the "electronic component" in terms of physical location; the temperature gradient refers to the real-time temperature difference between adjacent electronic components, which reflects the non-uniform distribution of heat in the chip. The larger the temperature gradient, the more significant the accumulation of heat in the local area.

[0029] In an embodiment of the present invention, when the clustering analysis module performs clustering analysis on the electronic component based on the temperature gradient and the real-time temperature to obtain multiple thermal load characteristic clusters of the integrated circuit chip, it includes: Perform feature fusion on the temperature gradient and the real-time temperature to obtain a two-dimensional feature vector of the electronic component, and collect the two-dimensional feature vectors into a vector data set of the integrated circuit chip; Specifically, the real-time temperature reflects the thermal load of the electronic component itself (such as whether it is overheated), and the temperature gradient reflects the thermal interaction intensity between the electronic component and its surroundings (such as whether there is heat concentration); feature fusion refers to the process of combining multiple independent features (temperature gradient and real-time temperature) into a single composite feature. After feature fusion, each two-dimensional feature vector contains both "absolute thermal state" and "relative thermal state" information; the two-dimensional feature vector is a vector composed of two feature values, which is used to characterize the thermal state of a single electronic component. Transforming the thermal state of each electronic component into a point in space facilitates the exploration of the overall thermal distribution law of the integrated circuit chip through clustering algorithms; integrating the two-dimensional feature vectors of all electronic components into a vector data set, and the vector data set is a collection of the two-dimensional feature vectors of all electronic components, constituting the thermal state data set of the integrated circuit chip.

[0030] Perform clustering analysis on the vector data set based on the K-means clustering algorithm to obtain multiple thermal load characteristic clusters of the integrated circuit chip.

[0031] Specifically, first, preprocess the vector data set by eliminating the difference in feature dimensions through normalization. Then, use the elbow method to determine the optimal number of clusters K, randomly initialize K clustering centers, calculate the Euclidean distance between each two-dimensional feature vector and each center, and assign it to the nearest cluster. Update the clustering centers based on the mean value of all two-dimensional feature vectors within the cluster, and repeat this process until the center position reaches the preset number of iterations. According to the converged clustering results, analyze statistical features such as the average real-time temperature and average temperature gradient of each cluster, and define different clusters as high-load heat island clusters, medium-load balanced clusters, and low-load cold area clusters to provide data support for the thermal design optimization and reliability evaluation of integrated circuit chips.

[0032] Generally speaking: Using the K-means algorithm to perform clustering analysis on the vector data set that combines the real-time temperature and temperature gradient of electronic components can quickly and efficiently divide electronic components into multiple heat load characteristic clusters. By identifying different heat load characteristic clusters, the distribution of cold air flow can be adjusted specifically to achieve focused heat dissipation in high-heat load areas, improve the heat dissipation efficiency, and solve the problem that the traditional manifold heat dissipation system cannot adapt to dynamic heat distribution changes.

[0033] The target heat exchange function construction module is used to obtain the cross-sectional area and cold air flow of each branch pipe in the manifold, obtain the heat dissipation parameters of the electronic components, calculate the target heat load of the heat load characteristic cluster based on the heat dissipation parameters, construct the target heat exchange function of the integrated circuit chip based on the cross-sectional area, the cold air flow, the target heat load, and the position information of the heat load characteristic cluster, and generate the constraint conditions of the manifold according to the physical limit parameters of the branch pipe; Specifically, a manifold is a fluid distribution device composed of a main pipe and multiple branch pipes (branch tubes) for distributing fluid from the main pipe to each branch tube; the cross-sectional area refers to the cross-sectional area inside the branch tube, and the cross-section of the branch tube is circular; the cold air flow refers to the volume or mass of cold air passing through the branch tube per unit time. According to the geometric design drawings or specifications of the branch tube, directly read the cross-sectional area and cold air flow of the branch tube, and according to the design specifications of the integrated circuit chip, read the heat dissipation parameters of each electronic component, and the heat dissipation parameters include power consumption data and component heat dissipation efficiency.

[0034] In the embodiment of the present invention, when the target heat exchange function construction module executes calculating the target heat load of the heat load characteristic cluster based on the heat dissipation parameters, it includes: Approximate the power consumption data of the heat dissipation parameters as the thermal energy data of the electronic components; Specifically, the power consumption data refers to the electric power consumed by an electronic component per unit time, and the thermal energy data refers to the data related to the heat actually generated or accumulated by the electronic component during operation. "Approximating the power consumption data of the heat dissipation parameter as the thermal energy data of the electronic component" means that it is considered that almost all of the electric power consumed by the electronic component is converted into heat energy, that is, it is assumed that the power consumption data and the thermal energy data are approximately equal in value.

[0035] Calculate the total thermal energy of the heat load feature cluster based on the thermal energy data, that is, calculate the total thermal energy of the heat load feature cluster by accumulating the thermal energy data of each electronic component within the heat load feature cluster. Among them, the calculation formula for the total thermal energy within the cluster is as follows: In the formula, represents the thermal energy data of the th electronic component in the heat load feature cluster, represents the identifier of the electronic component represents the th total thermal energy of the heat load feature cluster, represents the identifier of the heat load feature cluster.

[0036] Determine the in-cluster heat dissipation efficiency of the heat load feature cluster according to the component heat dissipation efficiency of the heat dissipation parameter. Among them, the calculation formula for the in-cluster heat dissipation efficiency is as follows: In the formula, represents the in-cluster heat dissipation efficiency of the th heat load feature cluster, represents the component heat dissipation efficiency of the th electronic component, represents the thermal energy data of the th electronic component, represents the total number of electronic components in the heat load feature cluster; Specifically, the component heat dissipation efficiency refers to the ability of a single electronic component to dissipate heat to the surrounding environment, and the in-cluster heat dissipation efficiency refers to the heat dissipation efficiency of all components within a heat load feature cluster as a whole, reflecting the degree to which the heat within the cluster is effectively dissipated.

[0037] Specifically, the calculation formula for the in-cluster heat dissipation efficiency uses a weighted average method to calculate the in-cluster heat dissipation efficiency. The numerator part , is to multiply the power consumption of each electronic component by its heat dissipation efficiency and then accumulate, which is equivalent to considering the contribution weight of the power consumption size of each component to the overall heat dissipation efficiency. The electronic component with a large power consumption accounts for a larger proportion in the calculation; the denominator part is the total power consumption of all electronic components within the cluster; by dividing the numerator by the denominator, the heat dissipation efficiency of the entire heat load characteristic cluster is obtained, and this is used to measure the heat dissipation capacity of the cluster as a whole. The logic underlying this calculation method is that components with high power consumption have a greater impact on overall heat dissipation. Therefore, when calculating the heat dissipation efficiency within the cluster, corresponding weights for heat dissipation efficiency should be assigned according to the power consumption of the components.

[0038] Based on the heat dissipation efficiency within the cluster and the total heat energy of the cluster, calculate the target heat load of the heat load characteristic cluster, where the calculation formula for the target heat load is as follows: In the formula, represents the total heat energy of the th heat load characteristic cluster, represents the heat dissipation efficiency within the th heat load characteristic cluster, represents the target heat load of the th heat load characteristic cluster, represents the identifier of the heat load characteristic cluster.

[0039] Specifically, the total heat energy of the cluster is the total amount of heat generated by the heat load characteristic cluster, and the heat dissipation efficiency within the cluster reflects the proportion of heat that can be effectively dissipated. Dividing the total heat by the heat dissipation efficiency gives the heat load amount that the heat load characteristic cluster actually needs to handle under the current heat dissipation capacity.

[0040] In an embodiment of the present invention, the target heat exchange function is as follows: In the formula, represents the target heat exchange function, represents the parameter of the target heat exchange function, represents the identifier of the heat load characteristic cluster, represents the number of heat load characteristic clusters, represents the th target heat load of the heat load characteristic cluster, represents the identifier of the branch pipe, represents the number of branch pipes, represents the heat transfer efficiency coefficient, represents the cold air flow rate of the th branch pipe, represents the cross-sectional area of the th branch pipe, represents the pitch angle of the th branch pipe, represents the abscissa in the two-dimensional coordinates of the th branch pipe, represents the ordinate in the two-dimensional coordinates of the represents the The abscissa in the position information of a target heat load, represents the ordinate in the position information of the

[0041] th target heat load. Specifically, for each heat load characteristic cluster, the inner summation calculates the total heat exchange contribution of all branch pipes to the heat load characteristic cluster; the numerator part comprehensively considers the heat transfer efficiency coefficient, the cold air flow rate of the branch pipe, the cross-sectional area, and the pitch angle factors, reflecting the heat exchange capacity of each branch pipe itself. The cold air flow rate and the cross-sectional area determine the ability of the branch pipe to transport cold air for heat exchange from the aspects of flow rate and channel size; then considers the effect of the installation angle of the branch pipe on the heat exchange effect, and the heat transfer efficiency coefficient corrects the entire heat exchange capacity; the denominator part is the distance calculated based on the two-dimensional coordinates of the branch pipe and the heat load characteristic cluster, reflecting the attenuation effect of the distance on the heat exchange effect. Through this fractional calculation, the actual heat exchange contribution of each branch pipe to a specific heat load characteristic cluster is obtained, and then the total heat exchange contribution of all branch pipes to this heat load characteristic cluster is obtained by summation.

[0042] Specifically, subtract the target heat load of each heat load characteristic cluster from the total heat exchange contribution of all branch pipes to the heat load characteristic cluster to obtain the difference between the heat load demand and the actual heat exchange capacity at each heat load characteristic cluster. This difference reflects the heat exchange matching degree of the current heat dissipation system at this heat load characteristic cluster. The smaller the difference, the better the heat exchange and the better the heat dissipation effect.

[0043] Specifically, square and then sum the above differences for all heat load characteristic clusters, that is . The square operation is to avoid the positive and negative cancellation of the differences and highlight the heat exchange matching differences of all heat load characteristic clusters; the summation operation comprehensively considers the heat exchange situations of all heat load characteristic clusters in the entire heat dissipation system, and finally obtains the target heat exchange function. By minimizing the target heat exchange function, the heat exchange relationship between the heat load characteristic clusters and the branch pipes in the heat dissipation system can be optimized to achieve a better heat dissipation effect.

[0044] Specifically, according to the physical limit parameters of the branch pipes, a series of limit rules and boundary conditions are set for the operation and performance optimization of the manifold as a whole to ensure that the manifold works within a reasonable and safe range.

[0045] In the embodiment of the present invention, the constraint conditions are as follows: In the formula, represents the abscissa in the two-dimensional coordinates of the th branch pipe, The ordinate in the two-dimensional coordinates of a branch pipe, indicating the identification of the branch pipe, indicating the abscissa in the two-dimensional coordinates of the indicating the ordinate in the two-dimensional coordinates of the indicating the minimum spacing constraint between branch pipes, indicating the identification of the branch pipe, indicating the pitch angle of the indicating the lower limit of the pitch angle, indicating the upper limit of the pitch angle.

[0046] Specifically, the above constraints limit from two dimensions: the spatial position and the pitch angle of the branch pipes, aiming to ensure the rationality, safety, and effectiveness of the manifold system in terms of physical layout and operation angle; it is required that the square of the distance between the th branch pipe and the adjacent th branch pipe ( being or ) should be greater than or equal to the square of the minimum spacing . The pitch angle of the th branch pipe must be between the specified lower limit and the upper limit . Exceeding this range does not meet the constraint conditions, affecting the heat exchange efficiency or causing problems such as poor air flow.

[0047] The target space layout determination module is used to optimize the parameters of the target heat exchange function based on the gradient descent algorithm under the above constraints, obtain the minimum value of the target heat exchange function, determine the optimal parameters of the target heat exchange function according to the minimum value, determine the target position of the branch pipe according to the two-dimensional coordinates in the optimal parameters, determine the target tilt angle of the branch pipe according to the pitch angle in the optimal parameters, and determine the target space layout of the manifold according to the target position and the target tilt angle; Generally speaking: The relationship between the heat dissipation resource allocation and the heat load is quantified through the target heat exchange function. Combining the constraint conditions ensures that the design scheme meets the physical feasibility. It not only solves the problem that the traditional heat dissipation system cannot adapt to the dynamic heat distribution of integrated circuit chips but also avoids resource waste. Through this precise modeling, it is possible to dynamically adjust the coolant distribution according to the actual heat load demand, improve the heat dissipation efficiency, reduce the local hot spot temperature of the chip, enhance the chip performance and reliability, extend the service life, and at the same time meet the physical limitations of engineering implementation, providing a scientific and feasible design scheme for the manifold shunt system with self-adaptive heat distribution of electronic components.

[0048] In an embodiment of the present invention, when the target space layout determination module executes optimizing the parameters of the target heat exchange function based on the gradient descent algorithm to obtain the minimum value of the target heat exchange function, it includes: Optimizing the parameters of the target heat exchange function by using the update formula of the gradient descent algorithm, where the update formula is as follows: In the formula, represents the parameter at the -th iteration, represents the parameter at the -th iteration, represents the learning rate, represents the gradient of the target heat exchange function at , represents the iteration identifier, represents the target heat exchange function; When the change of the target heat exchange function is less than the preset change threshold, the minimum value of the target heat exchange function is obtained.

[0049] Specifically, first, initialize the parameters of the target heat exchange function (parameters related to the coordinates and angles of the branch pipes, etc.), set the initial value , and determine the learning rate (controlling the parameter update step size) and the preset change threshold. Then enter the iterative process. In the -th iteration, calculate the gradient of the target heat exchange function at the current parameter , adjust the parameter according to the update formula . Subsequently, check the change in the function values of the target heat exchange function at and . If the change amount is less than the preset change threshold, it is considered that the algorithm converges. At this time, is the optimized parameter, and the corresponding target heat exchange function obtains the minimum value; if the condition is not satisfied, continue the next iteration. By continuously repeating the process of "calculating the gradient - updating the parameter - judging convergence", the parameter is gradually adjusted along the negative direction of the gradient, and finally approaches the minimum value point of the target heat exchange function to achieve parameter optimization.

[0050] Specifically, in the process of solving the target heat exchange function using the gradient descent algorithm as described above, a set of parameters that minimize the target heat exchange function will be obtained. This set of parameters is the optimal parameters, which contain various attribute information related to the branch pipes. The parameter values representing the two-dimensional coordinates of the branch pipes are extracted from the optimal parameters, and these values determine the target positions of the branch pipes in the planar layout. The optimal parameters also contain the parameter values representing the pitch angles of the branch pipes. This pitch angle describes the inclination state of the branch pipes in space. Based on this optimal pitch angle parameter, the target inclination angle of the branch pipes during installation can be determined.

[0051] In an embodiment of the present invention, when the target space layout determination module executes to determine the target space layout of the manifold according to the target position and the target inclination angle, it includes: Install the branch pipes according to the target position to obtain the preliminary space layout of the branch pipes; Under the preliminary space layout, adjust the initial inclination angle of the branch pipes according to the target inclination angle to obtain the target space layout of the manifold.

[0052] Specifically, the optimal positions of the branch pipes on the plane obtained through the previous optimization process are determined by two-dimensional coordinates (abscissa and ordinate). According to this target position information, the branch pipes are installed at the corresponding positions, thereby obtaining the preliminary space layout of the branch pipes. For example, in a heat dissipation manifold system, each branch pipe is installed at a pre-calculated planar position so that they are in a suitable distribution state in the horizontal direction. Based on the preliminary space layout of the branch pipes that has been completed, according to the target inclination angle, the initial inclination angle of the branch pipes is adjusted so that the branch pipes are not only in the appropriate positions in space but also have an appropriate inclination posture, and finally the target space layout of the manifold is obtained. For example, in a heat dissipation manifold system, adjusting the inclination angle of the branch pipes can enable cold air to more effectively exchange heat with the heat load characteristic clusters, improving the heat dissipation efficiency.

[0053] Generally speaking: The gradient descent algorithm can quickly find the optimal parameters that minimize the target heat exchange function under the premise of meeting the physical constraints of the branch pipes. The optimal parameters correspond to the best state of chip thermal management, that is, the maximum heat dissipation efficiency and the most uniform temperature distribution. By mapping the optimization results to the target positions and inclination angles of the branch pipes, the space layout of the manifold can be accurately designed, making the cold air flow direction highly match the actual heat load distribution of the integrated circuit chip, solving the limitations of traditional fixed-layout heat dissipation systems, being able to adaptively adjust the heat dissipation resource allocation according to the dynamic thermal characteristics of the chip, effectively reducing the local hot spot temperature, and improving the overall performance and reliability of the chip.

[0054] The cold air demand determination module is used to calculate the branch cold air demand of the branch pipes based on the target heat load; The heat dissipation execution module is used to dissipate heat from the electronic components corresponding to the heat load feature clusters based on the target space layout and the branch cold air demand.

[0055] In the embodiment of the present invention, the calculation formula of the branch cold air demand is as follows: In the formula, represents the branch cold air demand of the th branch pipe, represents the identifier of the branch pipe, represents the heat transfer efficiency coefficient of the th branch pipe, represents the target heat load of the th heat load feature cluster, represents the identifier of the heat load feature cluster, represents the pitch angle of the th branch pipe, represents the abscissa in the two-dimensional coordinates of the th branch pipe, represents the ordinate in the two-dimensional coordinates of the th branch pipe, represents the abscissa in the position information of the th target heat load, represents the ordinate in the position information of the th target heat load.

[0056] Specifically, is the distance calculated based on the two-dimensional coordinates of the branch pipe and the heat load feature cluster. The farther the distance, the heat exchange efficiency will be affected to a certain extent, and the required cold air flow may increase accordingly. In the formula, this distance is in the denominator position, meaning that the greater the distance, the branch cold air demand is greater; the heat load is greater, more cold air is needed to dissipate heat, reflects the influence of the angle on the heat exchange efficiency. When the angle is appropriate ( value is larger), the heat exchange efficiency is high, and the required cold air volume can be relatively reduced. The multiplication of the two reflects the comprehensive influence of the heat load and the angle on the cold air demand. As the heat transfer efficiency coefficient, it corrects the entire calculation result.

[0057] Specifically, the heat transfer efficiency coefficient of the branch pipe is obtained based on expert rules. First, the expert determines the operating parameters of the cold air in the branch pipe, such as density, viscosity, flow velocity, flow rate, inlet and outlet temperatures, pressure, etc., as well as the temperature of the heat load characteristic cluster. At the same time, the geometric structure of the branch pipe, such as diameter, length, shape, etc., the material properties of aluminum, copper, etc. (including heat conduction, temperature resistance, corrosion resistance), and the inner surface roughness and fouling conditions are analyzed. Then, relying on the profound theoretical knowledge and rich project experience in the field of heat transfer, the expert comprehensively determines the influence of the operating conditions and the characteristics of the branch pipe on heat transfer, and thus gives a reasonable heat transfer efficiency coefficient of the branch pipe.

[0058] Generally speaking: By using the target heat load of the heat load characteristic cluster as the calculation basis, the cold air flow rate required for each branch pipe can be deduced, enabling the cold air distribution to form a dynamic match with the actual heat distribution of the integrated circuit chips. This method solves the problem of fixed flow rate distribution in the traditional manifold shunt system, avoiding performance degradation in high heat load areas due to insufficient cooling and resource waste in low heat load areas due to excessive cooling.

[0059] In the embodiment of the present invention, when the heat dissipation execution module dissipates heat from the electronic components corresponding to the heat load characteristic cluster based on the target space layout and the branch cold air demand, it includes: Calculating the total cold air demand of the manifold based on the branch cold air demand, that is, according to the previously obtained branch cold air demand of each branch pipe, calculating the total cold air demand of the entire manifold by means of summation or the like.

[0060] Injecting cold air into the manifold according to the total cold air demand: Based on the calculated total cold air demand, injecting the corresponding amount of cold air into the manifold to ensure that the manifold has enough cold air for subsequent heat dissipation work.

[0061] Calculating the branch cold air injection time of the manifold according to the branch cold air demand and the cold air flow rate: Assuming that the branch cold air demand of a certain branch pipe is and the cold air flow rate is , then the branch cold air injection time of this branch pipe. By calculating the injection time, the duration of cold air release from each branch pipe can be reasonably controlled to precisely meet the heat dissipation requirements of the heat load characteristic cluster.

[0062] Under the target space layout (that is, the branch pipes are arranged according to the target position and target tilt angle), the branch pipes dissipate heat from the electronic components corresponding to the heat load characteristic cluster according to the branch cold air injection time, which can ensure that the cold air is injected at the appropriate position and for the appropriate duration, thereby efficiently dissipating heat from the electronic components and maintaining their normal operating temperature.

[0063] Generally speaking: By combining the optimized manifold space layout with the precise cold air demand of each branch pipe, customized heat dissipation can be carried out for the heat load characteristics of different regions within the integrated circuit chip. This precise matching effectively solves the local hot spot problem caused by the fixed layout and rough flow distribution of the traditional heat dissipation system, enabling the high heat load region to obtain more cooling resources and the low heat load region to avoid overcooling, thus significantly improving the overall temperature uniformity of the chip.

[0064] Referring to Figure 2 the following figure shows a schematic flowchart of a manifold liquid separation method for adaptive heat distribution of electronic components provided by an embodiment of the present invention. In this embodiment, the manifold liquid separation method for adaptive heat distribution of electronic components includes: S1. Obtain the real-time temperature of the electronic components in the integrated circuit chip; S2. Calculate the difference between the real-time temperature and the real-time temperature of the adjacent components of the electronic component to obtain the temperature gradient of the electronic component. Based on the temperature gradient and the real-time temperature, perform clustering analysis on the electronic component to obtain multiple heat load characteristic clusters of the integrated circuit chip; S3. Obtain the cross-sectional area and cold air flow rate of each branch pipe in the manifold, obtain the heat dissipation parameters of the electronic component, calculate the target heat load of the heat load characteristic cluster based on the heat dissipation parameters, construct the target heat exchange function of the integrated circuit chip based on the cross-sectional area, the cold air flow rate, the target heat load, and the position information of the heat load characteristic cluster, and generate the constraint conditions of the manifold according to the physical limit parameters of the branch pipe; S4. Under the constraint conditions, optimize the parameters of the target heat exchange function based on the gradient descent algorithm to obtain the minimum value of the target heat exchange function, determine the optimal parameters of the target heat exchange function according to the minimum value, determine the target position of the branch pipe according to the two-dimensional coordinates in the optimal parameters, determine the target tilt angle of the branch pipe according to the pitch angle in the optimal parameters, and determine the target space layout of the manifold according to the target position and the target tilt angle; S5. Calculate the branch cold air demand of the branch pipe based on the target heat load; S6. Dissipate heat from the electronic components corresponding to the heat load characteristic cluster based on the target space layout and the branch cold air demand.

[0065] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms.

[0066] The embodiments of the present application can acquire and process relevant data based on artificial intelligence technology. Among them, artificial intelligence is a theory, method, technology, and application system that uses digital computers or machines controlled by digital computers to simulate, extend, and expand human intelligence, perceive the environment, acquire knowledge, and use knowledge to obtain the best results.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A manifold shunt system with self - adapting thermal distribution of electronic components, characterized in that, The system includes a temperature acquisition module, a clustering analysis module, a target heat exchange function construction module, a target space layout determination module, a cold air demand determination module, and a heat dissipation execution module, where: The temperature acquisition module is used to obtain the real-time temperature of the electronic components in the integrated circuit chip; The clustering analysis module is used to calculate the difference between the real-time temperature and the real-time temperature of the adjacent components of the electronic components to obtain the temperature gradient of the electronic components, and perform clustering analysis on the electronic components based on the temperature gradient and the real-time temperature to obtain multiple heat load characteristic clusters of the integrated circuit chip; The target heat exchange function construction module is used to obtain the cross-sectional area and cold air flow rate of each branch pipe in the manifold, obtain the heat dissipation parameters of the electronic components, calculate the target heat load of the heat load characteristic clusters based on the heat dissipation parameters, construct the target heat exchange function of the integrated circuit chip based on the cross-sectional area, the cold air flow rate, the target heat load, and the position information of the heat load characteristic clusters, and generate the constraint conditions of the manifold according to the physical limit parameters of the branch pipes; The target space layout determination module is used to optimize the parameters of the target heat exchange function based on the gradient descent algorithm under the constraint conditions to obtain the minimum value of the target heat exchange function, determine the optimal parameters of the target heat exchange function according to the minimum value, determine the target position of the branch pipe according to the two-dimensional coordinates in the optimal parameters, determine the target inclination angle of the branch pipe according to the pitch angle in the optimal parameters, and determine the target space layout of the manifold according to the target position and the target inclination angle; The cold air demand determination module is used to calculate the branch cold air demand of the branch pipes based on the target heat load; The heat dissipation execution module is used to dissipate heat from the electronic components corresponding to the heat load characteristic clusters based on the target space layout and the branch cold air demand.

2. The manifold shunt system for adapting the thermal distribution of an electronic component according to claim 1, wherein When the clustering analysis module performs clustering analysis on the electronic components based on the temperature gradient and the real-time temperature to obtain multiple heat load characteristic clusters of the integrated circuit chip, it includes: Performing feature fusion on the temperature gradient and the real-time temperature to obtain the two-dimensional feature vector of the electronic components, and collecting the two-dimensional feature vectors into the vector data set of the integrated circuit chip; Performing clustering analysis on the vector data set based on the K-means clustering algorithm to obtain multiple heat load characteristic clusters of the integrated circuit chip.

3. The manifold shunt system with adaptive thermal distribution of electronic components according to claim 1, characterized in that, When the target heat exchange function construction module performs the calculation of the target heat load of the heat load characteristic clusters based on the heat dissipation parameters, it includes: Approximating the power consumption data of the heat dissipation parameters as the thermal energy data of the electronic components; Calculating the total thermal energy of the clusters of the heat load characteristic clusters based on the thermal energy data; Determining the in-cluster heat dissipation efficiency of the heat load characteristic clusters according to the component heat dissipation efficiency of the heat dissipation parameters; Calculate the target heat load of the heat load characteristic cluster based on the in-cluster heat dissipation efficiency and the total heat energy of the cluster, where the calculation formula for the target heat load is as follows: In the formula, represents the total heat energy of the th heat load characteristic cluster, represents the in-cluster heat dissipation efficiency of the th heat load characteristic cluster, represents the target heat load of the th heat load characteristic cluster, represents the identifier of the heat load characteristic cluster.

4. The manifold shunt system with adaptive thermal distribution of electronic components according to claim 1, characterized in that, The target heat exchange function is as follows: In the formula, represents the target heat exchange function, represents the parameters of the target heat exchange function, represents the identifier of the heat load characteristic cluster, represents the number of heat load characteristic clusters, represents the th target heat load of the heat load characteristic cluster, represents the identifier of the branch pipe, represents the number of branch pipes, represents the heat transfer efficiency coefficient, represents the cold air flow rate of the i-th branch pipe, represents the th cross-sectional area of the branch pipe, represents the th pitch angle of the branch pipe, represents the th abscissa in the two-dimensional coordinates of the branch pipe, represents the th ordinate in the two-dimensional coordinates of the branch pipe, represents the th abscissa in the position information of the target heat load, represents the th ordinate in the position information of the target heat load.

5. The manifold shunt system for adaptive thermal distribution of electronic components according to claim 1, wherein The constraint conditions are as follows: In the formula, represents the abscissa in the two-dimensional coordinates of the th branch pipe, represents the ordinate in the two-dimensional coordinates of the th branch pipe, represents the identifier of the branch pipe, represents the abscissa in the two-dimensional coordinates of the th branch pipe, represents the ordinate in the two-dimensional coordinates of the th branch pipe, represents the minimum spacing constraint between branch pipes, represents the identifier of the branch pipe, represents the th pitch angle of the branch pipe, represents the lower limit of the pitch angle, represents the upper limit of the pitch angle.

6. The manifold shunt system for adaptive thermal distribution of electronic components according to claim 1, characterized in that, When the target space layout determination module executes the optimization of the parameters of the target heat exchange function based on the gradient descent algorithm to obtain the minimum value of the target heat exchange function, it includes: Optimize the parameters of the target heat exchange function using the update formula of the gradient descent algorithm, where the update formula is as follows: In the formula, represents the parameter at the -th iteration, represents the parameter at the -th iteration, represents the learning rate, represents the gradient of the target heat exchange function at , represents the iteration identifier, represents the target heat exchange function; When the change of the target heat exchange function is less than a preset change threshold, the minimum value of the target heat exchange function is obtained.

7. The manifold shunt system for adapting to the thermal distribution of electronic components according to claim 1, characterized in that, When the target space layout determination module executes the determination of the target space layout of the manifold according to the target position and the target tilt angle, it includes: Install the branch pipes according to the target position to obtain the preliminary space layout of the branch pipes; Under the preliminary space layout, adjust the initial tilt angle of the branch pipes according to the target tilt angle to obtain the target space layout of the manifold.

8. The manifold shunt system for self-adapting the thermal distribution of an electronic component according to claim 1, wherein, The calculation formula for the required amount of branched cold air is as follows: In the formula, represents the required amount of branched cold air for the th branch pipe, represents the identification of the branch pipe, represents the heat transfer efficiency coefficient of the th branch pipe, represents the target heat load of the th heat load characteristic cluster, represents the identification of the heat load characteristic cluster, represents the pitch angle of the th branch pipe, represents the abscissa in the two-dimensional coordinates of the th branch pipe, represents the ordinate in the two-dimensional coordinates of the th branch pipe, represents the abscissa in the position information of the th target heat load, represents the ordinate in the position information of the th target heat load.

9. The manifold shunt system with adaptive thermal distribution of electronic components as described in claim 1, characterized in that, When the heat dissipation execution module executes the heat dissipation of the electronic components corresponding to the heat load feature clusters based on the target space layout and the branch cold air demand, it includes: Calculate the total cold air demand of the manifold based on the branch cold air demand; Inject cold air into the manifold according to the total cold air demand; Calculate the branch cold air injection time of the manifold according to the branch cold air demand and the cold air flow rate; Under the target space layout, the branch pipes dissipate heat from the electronic components corresponding to the heat load feature clusters according to the branch cold air injection time.

10. A manifold liquid distribution method for self - adapting the thermal distribution of electronic components, characterized in that, The method includes: S1. Obtain the real-time temperature of the electronic components in the integrated circuit chip; S2. Calculate the difference between the real-time temperature and the real-time temperature of the adjacent components of the electronic components to obtain the temperature gradient of the electronic components. Based on the temperature gradient and the real-time temperature, perform clustering analysis on the electronic components to obtain multiple heat load feature clusters of the integrated circuit chip; S3. Obtain the cross-sectional area and cold air flow rate of each branch pipe in the manifold, obtain the heat dissipation parameters of the electronic components, calculate the target heat load of the heat load feature clusters based on the heat dissipation parameters, construct the target heat exchange function of the integrated circuit chip based on the cross-sectional area, the cold air flow rate, the target heat load, and the position information of the heat load feature clusters, and generate the constraint conditions of the manifold according to the physical limit parameters of the branch pipes; S4. Under the constraint conditions, optimize the parameters of the target heat exchange function based on the gradient descent algorithm to obtain the minimum value of the target heat exchange function. Determine the optimal parameters of the target heat exchange function according to the minimum value, determine the target position of the branch pipes according to the two-dimensional coordinates in the optimal parameters, determine the target tilt angle of the branch pipes according to the pitch angle in the optimal parameters, and determine the target space layout of the manifold according to the target position and the target tilt angle; S5. Calculate the branch cold air demand of the branch pipes based on the target heat load; S6. Dissipate heat from the electronic components corresponding to the heat load feature clusters based on the target space layout and the branch cold air demand.

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