Pin type plastic package module and manufacturing method thereof

Abstract

The invention provides a pin type plastic package module and a manufacturing method thereof, and relates to the technical field of injection molding packaging. Firstly, an internal pin is preset in the pin type plastic package module, then injection molding packaging and grinding punching are carried out, a first upper step and a second upper step are formed on the first plastic package part, a lower step is formed on the second plastic package part, and meanwhile, the upper end and the lower end of the internal pin are exposed. And then the external pins are inserted into the pin through holes of the internal pins, and the internal pins and the external pins are welded and connected, so that welding and leading-out of the internal pins of the pin type plastic package module are realized. And finally, a pin cover is arranged, and sealing of the pin type plastic package module and external insulation of the pins are completed while the internal pins and the external pins are limited and fixed. The space utilization rate of the plastic package module in the prior art can be improved, the pin welding reliability is higher, and the application and popularization requirements of high-performance plastic package module products are met.

Description

Technical Field

[0001] This application relates to the technical field of injection molding encapsulation, and particularly relates to a pin-type plastic encapsulation module and a manufacturing method thereof. Background Art

[0002] Plastic encapsulation technology is a current mainstream module encapsulation technology. The plastic encapsulation module solution forms a plastic encapsulation module product by means of injection molding encapsulation, cutting and forming, etc. on a PCB (the full English name is: Printed Circuit Board, and the Chinese name is: Printed Circuit Board). The plastic encapsulation module solution cancels the external shell used in traditional encapsulated module products, and the plastic encapsulation material simultaneously plays the roles of structural support, heat conduction, and insulation in the product. Due to the cancellation of the external shell and the supporting insulation structure used in traditional encapsulated module products, the product size is greatly reduced, and because the plastic encapsulation material can obtain better heat conduction performance, insulation performance, and structural support performance than potting thermal conductive glue, the performance of the product in terms of heat conduction, insulation, anti-vibration, protection, etc. is synchronously greatly improved.

[0003] In the prior art, plastic encapsulation modules mainly use the methods of whole-board injection molding and cutting and forming for product injection molding encapsulation, and set output pins by means of soldering connection pins to the metal pads on the side of the PCB board. This connection method of output pins has problems such as low pin soldering strength and ineffective utilization of the external space on both sides of the pins, and poor compatibility with traditional pin-type shell encapsulated modules, and has great limitations in actual use. Summary of the Invention

[0004] In view of the above problems, this application provides a pin-type plastic encapsulation module and a manufacturing method thereof, which improve the output pins of the plastic encapsulation module, enhance the soldering strength and soldering reliability of the output pins, effectively utilize the external space on both sides of the pins, and enhance the compatibility with traditional pin-type shell encapsulated modules. The specific solutions are as follows:

[0005] In the first aspect of this application, a pin-type plastic encapsulation module is provided, and the pin-type plastic encapsulation module includes: a PCB board, a plastic encapsulation component, internal pins, external pins, and pin caps;

[0006] The PCB board includes a first assembly surface and a second assembly surface arranged opposite to each other;

[0007] The plastic encapsulation component includes a first plastic encapsulation part on one side of the first assembly surface and a second plastic encapsulation part on one side of the second assembly surface;

[0008] The internal pin includes an upper end head, a lower end head, and a pin through hole penetrating through the upper end head and the lower end head; an inner step is arranged inside the upper end head;

[0009] A limiting step is provided on the external pin.

[0010] On the side of the first encapsulation part facing away from the first assembly surface, a first upper step and a second upper step are provided, and the size of the first upper step is larger than that of the second upper step; on the side of the second encapsulation part facing away from the second assembly surface, a lower step is provided.

[0011] The internal pin is inserted, welded and mounted on the PCB board; the external pin is inserted into the pin through-hole and is welded and connected to the inner step, and the limiting step is in contact with the lower step.

[0012] Both the first upper step and the second upper step expose the upper end of the internal pin and the first end of the external pin; the pin cover is in contact with the first upper step and the first end of the external pin respectively.

[0013] Preferably, in the above-mentioned pin-type encapsulation module, the first upper step and the second upper step are obtained by grinding and drilling on the first encapsulation part.

[0014] The lower step is obtained by grinding and drilling on the second encapsulation part.

[0015] Preferably, in the above-mentioned pin-type encapsulation module, the diameter of the external pin is D1, and the diameter of the pin through-hole is D2.

[0016] Wherein, 0.1 mm ≤ D2 - D1 ≤ 0.15 mm.

[0017] Preferably, in the above-mentioned pin-type encapsulation module, the diameter of the external pin is D1, and the diameter of the inner step is D3.

[0018] Wherein, 0.2 mm ≤ D3 - D1 ≤ 0.4 mm.

[0019] Preferably, in the above-mentioned pin-type encapsulation module, the material of the pin cover is plastic material.

[0020] Preferably, in the above-mentioned pin-type encapsulation module, the material of the internal pin is copper material.

[0021] The material of the external pin is brass material.

[0022] Preferably, in the above-mentioned pin-type encapsulation module, the central area of the pin cover is bonded to the first end of the external pin by a first bonding adhesive; the peripheral area of the pin cover is bonded to the first upper step by a second bonding adhesive.

[0023] The types of the first bonding adhesive and the second bonding adhesive are different.

[0024] Preferably, in the above-mentioned pin-type plastic-sealed module, the pin cover is provided with an isolation ring;

[0025] The first adhesive is located on the inner side of the isolation ring, and the second adhesive is located on the outer side of the isolation ring.

[0026] Preferably, in the above-mentioned pin-type plastic-sealed module, the distance between the surface of the pin cover and the first assembly surface is L1, and the distance between the surface of the first plastic-sealed portion and the first assembly surface is L2; wherein L1<L2;

[0027] The distance between the surface of the limiting step away from the second assembly surface and the second assembly surface is L3, and the distance between the surface of the second plastic sealing portion and the second assembly surface is L4; wherein L3<L4.

[0028] A second aspect of the present application provides a method for manufacturing a pin-type plastic-sealed module, which is used to manufacture any of the above-mentioned pin-type plastic-sealed modules. The manufacturing method includes:

[0029] Solder the internal pins onto the PCB board;

[0030] Apply plugging glue to both ends of the pin through-hole;

[0031] Perform double-sided injection molding on the assembled PCB board to form a first plastic-sealed portion and a second plastic-sealed portion;

[0032] Grinding and punching the first plastic sealing portion and the second plastic sealing portion respectively to form a first upper step and a second upper step on a side of the first plastic sealing portion facing away from the PCB board, and forming a lower step on a side of the second plastic sealing portion facing away from the PCB board;

[0033] Cut the plastic packaging structure to form a single product unit;

[0034] For the single product unit, inserting the external pins into the pin through-holes of the internal pins and welding them to the inner steps of the internal pins;

[0035] The pin cover is installed so as to contact the first upper step and the first end of the external pin respectively.

[0036] With the above technical solution, the present application provides a pin-type plastic package module and a manufacturing method thereof. First, internal pins are pre-set in the pin-type plastic package module, and then injection molding and grinding and drilling are carried out. When a first upper step and a second upper step are formed in the first plastic package part, and a lower step is formed in the second plastic package part, the upper and lower ends of the internal pins are exposed. Then, external pins are inserted into the pin through-holes of the internal pins, and the internal pins and the external pins are welded and connected to realize the welding and leading-out of the internal pins of the pin-type plastic package module. Finally, a pin cover is set to limit and fix the internal pins and the external pins while completing the sealing of the pin-type plastic package module and the external insulation of the pins. It can improve the space utilization rate of the plastic package module in the prior art, and the pin welding reliability is higher, meeting the application and popularization requirements of high-performance plastic package module products.

[0037] The pin-type plastic package module and the manufacturing method thereof provided by the present application achieve the internal pin out-pin connection structure of the plastic package module and have several technical advantages compared with the prior art, as follows:

[0038] First: Compared with the side-out pin method of the plastic package module in the prior art, the problem that the external space on both sides of the pins cannot be utilized is solved, and the layout utilization rate of this type of product and the compatibility with the traditional pin-type shell package module are improved.

[0039] Second: Compared with the side-out pin welding structure of the plastic package module in the prior art, the pin welding structure formed by welding the internal pins and the external pins in the present application has higher welding strength and welding reliability. In the side pin welding structure of the plastic package module in the prior art, the lead-out pins rely on the surface mount welding of the side pads of the PCB board to realize the lead-out connection of the product, and the welding strength of the lead-out pins is relatively low. However, the pin welding structure of the present application is a 360-degree through-hole welding structure around the external pins formed based on the internal steps, including that the internal pins are inserted and welded on the PCB board by means of through-hole welding, and the external pins are welded on the internal pins by means of pin through-hole welding. The lead-out pin welding structure of the present application has higher welding strength and welding reliability.

[0040] Third: The pin soldering structure of the present application can meet the usage requirements of higher soldering temperature and longer soldering time during customer applications, and has a wider range of customer application parameters. In the pin-type plastic package module of the present application, the connection solder joints of the internal pins and the external pins are both located on the side away from the user installation surface, which can maximize the range of process parameters for product use. Since the pin connection solder joints are located on the side away from the customer soldering installation surface, when the product is soldered and installed, the heat generated by the soldering of the customer's solder joints (the connection solder joints between the pins and the customer's PCB board) is transferred upward through the pins, and finally it takes longer time and higher temperature to melt the solder joints of the internal pins and the external pins of the present application. That is, the pin-type plastic package module of the present application can meet the usage requirements of higher temperature soldering and longer time soldering by customers, the pin-type plastic package module has a wider range of application parameters, and the working reliability of the pin solder joints is higher.

[0041] Fourth: The pin soldering structure of the present application has a limiting structure, which can effectively prevent the stress applied to the external pins from being transmitted to the internal solder joints, and improves the working reliability of the product while enhancing the installation and fixing strength of the product. In the present application, the external pin includes a limiting step of the external pin, which can form a limiting structure to restrict the upward movement of the external pin. The first end (or the upper end) of the external pin fixes the external pin and the solder joints of its internal and external pins through the installation of a pin cover, forming a limiting structure to restrict the up and down movement of the external pin. When external stress is applied to the product pins, the limiting structure of the pin soldering structure in the present application can prevent the external stress from being transmitted to the solder joints of the internal and external pins, and improves the working reliability of the product while enhancing the installation and fixing strength of the product.

[0042] Fifth: The pin-type plastic package module provided by the present application can be directly surface-mounted during use, and there is no need to add a gasket at the bottom. Compared with the prior art products, its installation and use are more convenient. For the product of the pin-type plastic package module of the present application, a lower step is provided on the second plastic package part located at the bottom, and the limiting step of the external pin is embedded in the lower step, and there is a certain gap between the limiting step of the external pin and the second plastic package part, thus forming a groove for solder penetration during product installation and use. At the same time, since the second plastic package part at the bottom of the product is itself insulating, the product of the pin-type plastic package module of the present application can be directly attached to the customer's PCB board surface for installation during application, eliminating the requirements for adding a gasket for insulation and solder penetration of the pin solder joints during the installation of traditional module products, and its product installation and use are more convenient. Description of the Drawings

[0043] In combination with the accompanying drawings and with reference to the following specific embodiments, the above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic and the original components and elements are not necessarily drawn to scale.

[0044] Figure 1 Schematic diagram of the external shape of a pin-type plastic package module provided by an embodiment of the present invention;

[0045] Figure 2 Partial cross-sectional view of a pin-type plastic package module provided by an embodiment of the present invention;

[0046] Figure 3 Partial cross-sectional view of another pin-type plastic package module provided by an embodiment of the present invention;

[0047] Figure 4 Schematic diagram of a PCB board provided by an embodiment of the present invention;

[0048] Figure 5 Schematic diagram of the relative position of a first plastic package part and a PCB board provided by an embodiment of the present invention;

[0049] Figure 6 Schematic diagram of internal pins provided by an embodiment of the present invention;

[0050] Figure 7 Schematic diagram of external pins provided by an embodiment of the present invention;

[0051] Figure 8 Schematic diagram of the processing structure of a plastic package component provided by an embodiment of the present invention;

[0052] Figure 9 Schematic diagram of the cutting of a pin-type plastic package module provided by an embodiment of the present invention;

[0053] Figure 10 Schematic diagram of the grinding and drilling of a pin-type plastic package module provided by an embodiment of the present invention;

[0054] Figure 11 Schematic diagram of a pin cap provided by an embodiment of the present invention;

[0055] Figure 12 Schematic diagram of the flow of the manufacturing method of a pin-type plastic package module provided by an embodiment of the present invention. Detailed Description

[0056] The embodiments of the present application will be described below in conjunction with the accompanying drawings in the embodiments of the present application. The terms used in the embodiments of the present application are only used to explain the specific embodiments of the present application, rather than aiming to limit the present application. As is known to those of ordinary skill in the art, with the development of technology and the emergence of new scenarios, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems.

[0057] Here, a brief introduction to traditional packaging module products will be given first. Traditional packaging module products first mount components on the surface of a PCB board through the SMT (Surface Mounted Technology) process, and then assemble the PCB board with mounted components into the interior of an external housing to form a product by encapsulation. Due to the existence of the external housing, the size of such products is usually large; and since the external housing is usually made of metal, electrical insulation treatment is required between the internal devices and the external housing, and the treatment process is complex, which further increases the size of the product and affects its heat conduction and dissipation performance. Further, such products usually use the method of internal potting with thermal conductive glue to improve the heat conduction performance of the product, but the thermal conductive glue in the prior art has a relatively low thermal conductivity, which further restricts the improvement of the heat conduction and dissipation performance of such products. Generally speaking, due to their inherent technical characteristics, traditional packaging module products have great limitations in terms of packaging size, heat dissipation and heat conduction performance.

[0058] Under this background, the plastic packaging module solution has gradually become an upgraded alternative solution to the traditional packaging module solution. However, as described in the background art, in the prior art, plastic packaging modules mainly use the methods of full-board injection molding and cutting and forming for product injection packaging, and output pins are set by welding the side metal pads of the PCB board. This connection method of output pins has problems such as low welding strength of the pins and ineffective utilization of the external space on both sides of the pins, and poor compatibility with traditional pin-through-hole housing packaging modules, resulting in great limitations in actual use.

[0059] Based on this, the present application provides a pin-through-hole plastic packaging module and its manufacturing method, which improve the output pins of the plastic packaging module, enhance the welding strength and welding reliability of the output pins, effectively utilize the external space on both sides of the pins, and improve the compatibility with traditional pin-through-hole housing packaging modules.

[0060] To make the above objects, features and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0061] It should be noted that the orientation terms in the present invention are based on the relative position relationship shown in the accompanying drawings and cannot be used as an absolute limitation to the present application.

[0062] Reference Figure 1 , Figure 1 is a schematic diagram of the external shape of a pin - type plastic - encapsulated module provided by an embodiment of the present invention; reference Figure 2 , Figure 2 is a partial cross - sectional view of a pin - type plastic - encapsulated module provided by an embodiment of the present invention; reference Figure 3 , Figure 3 is a partial cross - sectional view of another pin - type plastic - encapsulated module provided by an embodiment of the present invention. The pin - type plastic - encapsulated module provided by the embodiment of the present invention includes: a PCB board 11, a plastic - encapsulated component 12, an internal pin 13, an external pin 14, and a pin cover 15.

[0063] As Figure 4 shown, Figure 4 is a schematic diagram of a PCB board provided by an embodiment of the present invention; wherein Figure 4 (a) represents a schematic diagram of the first assembly surface 111, Figure 4 (b) represents a schematic diagram of the second assembly surface 112; the PCB board 11 includes a first assembly surface 111 and a second assembly surface 112 which are oppositely arranged.

[0064] As Figures 1-3 and Figure 5 shown, Figure 5 is a schematic diagram of the relative position between a first plastic - encapsulated part and the PCB board provided by an embodiment of the present invention. The plastic - encapsulated component 12 includes a first plastic - encapsulated part 121 on one side of the first assembly surface 111, and a second plastic - encapsulated part 122 on one side of the second assembly surface 112.

[0065] As Figure 6 shown, Figure 6 is a schematic diagram of an internal pin provided by an embodiment of the present invention; wherein Figure 6 (a) represents a schematic diagram of the external shape of the internal pin 13, Figure 6 (b) represents a cross - sectional view of the internal pin 13; the internal pin 13 includes an upper end head 131, a lower end head 132, and a pin through - hole 133 penetrating through the upper end head 131 and the lower end head 132; an internal step 134 is arranged inside the upper end head 131.

[0066] As Figure 7 shown, Figure 7 is a schematic diagram of an external pin provided by an embodiment of the present invention; a limiting step 141 is arranged on the external pin 14.

[0067] As Figure 2 and Figure 3As shown, on the side of the first encapsulation part 121 facing away from the first assembly surface 111, there are a first upper step 16 and a second upper step 17, and the size of the first upper step 16 is larger than that of the second upper step 17; on the side of the second encapsulation part 122 facing away from the second assembly surface 112, there is a lower step 18.

[0068] The internal pin 13 is inserted and welded onto the PCB board 11 to form a solder joint 10; the external pin 14 is inserted into the pin through-hole 133 and is welded to the inner step 134 to form a solder joint 19, and the limiting step 141 contacts the lower step 18.

[0069] Both the first upper step 16 and the second upper step 17 expose the upper end 131 of the internal pin 13 and the first end of the external pin 14; the pin cover 15 contacts the first upper step 16 and the first end of the external pin 14 respectively. Herein, the first end of the external pin 14 can be understood as the upper end of the external pin 14, the second end of the external pin 14 can be understood as the lower end of the external pin 14, the lower end of the external pin 14 is on one side of the second encapsulation part 122 and extends outward.

[0070] Considering that the external pin 14 will extend to the outside of the pin - type encapsulation module, the material of the external pin 14 can be selected as brass with slightly higher hardness; considering that the internal pin 13 is located inside the pin - type encapsulation module, the internal pin 13 can be selected as copper material.

[0071] Specifically, in the embodiment of the present invention, the internal pin 13 is inserted and welded onto the PCB board 11, and the external pin 14 is inserted into the pin through - hole 133 and is welded to the inner step 134 to form the pin welding structure of the pin - type encapsulation module. As Figures 2-4 shown, after the internal pin 13 is inserted onto the PCB board 11, the upper end 131 of the internal pin 13 is on the side of the first assembly surface 111 of the PCB board 11, and the lower end 132 of the internal pin 13 is on the side of the second assembly surface 112 of the PCB board 11.

[0072] As Figure 2 shown, after the external pin 14 is inserted into the pin through - hole 133 of the internal pin 13, the limiting step 141 on the external pin 14 will be embedded into the lower step 18 on the second encapsulation part 122, and the two form a limiting relationship.

[0073] Optionally, the diameter of the external pin 14 is D1, and the diameter of the inner step 134 is D3; wherein, 0.2mm ≤ D3 - D1 ≤ 0.4mm.

[0074] That is to say, the diameter D1 of the external pin 14 is 0.2 mm - 0.4 mm smaller than the diameter D3 of the inner step 134 in the upper end 131 of the internal pin 13, so as to leave a certain tin-penetrating distance between the two, and form a 360-degree surrounding solder joint around the external pin 14 during the soldering process, improving the soldering strength and solder joint reliability of the pin soldering structure in the pin-through plastic package module.

[0075] As Figure 3 shown, the functions of the pin cover 15 in the pin-through plastic package module provided by the embodiment of the present application mainly include three points:

[0076] First, the pin cover 15 located at the upper part and the limiting step 141 of the external pin 14 located at the bottom will form a sealing structure for the pin soldering structure, which can protect the pin soldering structure from being contaminated and affected by the external environment.

[0077] Second, the material of the pin cover 15 includes but is not limited to plastic materials and other insulating materials, which play an insulating role and form an insulating isolation layer between the first plastic package part 121 and the pin soldering structure, facilitating the addition of heat dissipation measures on one side of the first plastic package part 121 during the subsequent use of the product. Exemplarily, a metal radiator is directly installed on the surface of the first plastic package part 121 for heat dissipation.

[0078] Third, it assists in fixing and limiting the pin soldering structure. Exemplarily, the pin cover 15 is adhesively contacted with the first upper step 16 and the first end of the external pin 14 respectively. That is, the external pin 14 and the pin cover 15 are adhesively fixed together by adhesive contact, forming a limiting structure that restricts the up and down movement of the external pin 14.

[0079] Further, as Figure 2 and Figure 3 shown, the limiting step 141 on the external pin 14 contacts the lower step 18 of the second plastic package part 122, forming a limiting structure that restricts the upward movement of the external pin 14.

[0080] Generally speaking, the pin cover 15 and the limiting step 141 form a limiting structure that restricts the up and down movement of the external pin 14, and the pin through-hole 133 of the internal pin 13 forms a horizontal limiting structure for the external pin 14.

[0081] Optionally, the diameter of the external pin 14 is D1, and the diameter of the pin through-hole 133 is D2; wherein, 0.1 mm ≤ D2 - D1 ≤ 0.15 mm.

[0082] That is to say, as Figure 2As shown, a tight fit design is adopted between the external pin 14 and the pin through-hole 133. The diameter D1 of the external pin 14 is 0.1 mm - 0.15 mm smaller than the diameter D2 of the pin through-hole 133, which can ensure that after the external pin 14 is inserted into the pin through-hole 133, the horizontal shaking margin inside it is very small.

[0083] Furthermore, since the length of the internal pin 13 is relatively long (usually, the length of the internal pin 13 will exceed half of the height of the pin-in-package module), even if the external pin 14 is slightly deformed under external force, the deformation stress on the external pin 14 cannot be transmitted upward to the solder joint 19 between the internal pin 13 and the external pin 14. That is, this structural design realizes the horizontal limit of the external pin 14, and the external pin 14 can withstand relatively large assembly and working stresses, with high working reliability.

[0084] As Figures 8-10 shown, Figure 8 is a schematic diagram of a processing structure for a plastic encapsulated component provided by an embodiment of the present invention; Figure 8 (a) represents a schematic diagram of the processing structure of the first plastic encapsulation part 121; Figure 8 (b) represents a schematic diagram of the processing structure of the second plastic encapsulation part 122; Figure 9 is a cutting schematic diagram of a pin-in-package module provided by an embodiment of the present invention; Figure 10 is a grinding and drilling schematic diagram of a pin-in-package module provided by an embodiment of the present invention. The first upper step 16 and the second upper step 17 are obtained by grinding and drilling on the first plastic encapsulation part 121; the lower step 18 is obtained by grinding and drilling on the second plastic encapsulation part 122.

[0085] In other words, after the product is completed with the whole-board injection molding and encapsulation, including but not limited to, by means of numerical control grinding and drilling, the first upper step 16, the second upper step 17, and the lower step 18 are formed on the plastic encapsulated component 12. The materials ground off at least include the plastic encapsulation material of the first upper step 16, the second upper step 17, and the lower step 18, the hole-blocking glue 20, the upper surface part of the upper end 131 of the internal pin 13, and the lower surface part of the lower end 132 of the internal pin 13. The area of grinding and drilling is as Figure 10 the dashed box area in.

[0086] In an alternative embodiment of the present invention, as Figure 3 shown, the central area of the pin cover 15 is bonded to the first end of the external pin 14 by the first bonding glue 21; the peripheral area of the pin cover 15 is bonded to the first upper step 16 by the second bonding glue 22; the types of the first bonding glue 21 and the second bonding glue 22 are different.

[0087] Specifically, in the embodiment of the present invention, the pin cover 15 is bonded with two types of colloids. The central area of the pin cover 15 is bonded to the top surface of the external pin 14 using a first adhesive 21, and the surrounding area of the pin cover 15 is bonded to the first upper step 16 using a second adhesive 22.

[0088] like Figure 3 As shown, the pin cover 15 is bonded using two types of adhesives. Since the first adhesive 21 needs to be bonded to the top surface of the external pin 14 and a portion of the solder joint 19 simultaneously, to ensure the long-term operational reliability of the solder joint 19, the first adhesive 21 is typically a flexible adhesive. While maintaining a certain level of fixing strength, it also exhibits relatively low curing stress to prevent damage to the solder joint 19 after prolonged operation. The second adhesive 22 is used to seal the pin cover 15 to the first upper step 16 and is typically selected from adhesives with high bonding strength and good sealing properties.

[0089] refer to Figure 11 , Figure 11 Schematic diagram of a pin cover provided by an embodiment of the present invention. The pin cover 15 is provided with an isolation ring 23.

[0090] The first adhesive 21 is located on the inner side of the isolation ring 23 , and the second adhesive 22 is located on the outer side of the isolation ring 23 .

[0091] Specifically, in the embodiment of the present invention, the pin cover 15 is provided with an isolation ring 23 for isolating the two different types of first adhesive 21 and second adhesive 22 to prevent the two colloids with significantly different properties from mixing with each other during the curing process, thereby affecting the bonding performance.

[0092] In an optional embodiment of the present invention, the distance between the surface of the pin cover 15 and the first assembly surface 111 is L1, and the distance between the surface of the first plastic sealing part 121 and the first assembly surface 111 is L2; wherein L1<L2.

[0093] The distance between the surface of the limiting step 141 away from the second assembly surface 112 and the second assembly surface 112 is L3, and the distance between the surface of the second plastic sealing part 122 and the second assembly surface 112 is L4; wherein L3<L4.

[0094] Specifically, in the embodiment of the present invention, in the direction of looking at the surface of the first encapsulation part 121, the surface of the pin cover 15 is lower than the surface of the first encapsulation part 121; in the direction of looking at the surface of the second encapsulation part 122, the surface of the limiting step 141 on the side away from the second assembly surface 112 is lower than the surface of the second encapsulation part 122. In the present application, the surface of the first encapsulation part 121 is located on the reverse side of the external pin 14 and is the main heat dissipation surface of the product. The surface of the second encapsulation part 122 is located on the same side as the external pin 14 and is the installation surface when the product is in use.

[0095] The pin cover 15 is lower than the surface of the first encapsulation part 121, so the presence of the pin cover 15 will not affect the application of heat dissipation measures by customers on the main heat dissipation surface during subsequent product installation and use, such as mounting a radiator on the surface of the first encapsulation part 121 for heat dissipation.

[0096] The surface of the limiting step 141 on the side away from the second assembly surface 112 is lower than the surface of the second encapsulation part 122, and there is a certain gap between the limiting step 141 and the surface of the second encapsulation part 122, thus forming a groove for soldering and tin penetration during product installation and use. At the same time, since the second encapsulation part 122 at the bottom of the product is itself made of an insulating material, the pin-type encapsulation module product of the present application can be directly attached to the customer's PCB board during installation and use, eliminating the requirement for adding gaskets for insulation and soldering and tin penetration of pin solder joints at the bottom during the installation of traditional module products, making the product installation and use more convenient.

[0097] Based on the above embodiments of the present invention, in another embodiment of the present invention, a manufacturing method for a pin-type encapsulation module is further provided for manufacturing the pin-type encapsulation module provided in the above embodiments. Refer to Figure 12 , Figure 12 which is a schematic flow chart of a manufacturing method for a pin-type encapsulation module provided in an embodiment of the present invention. The manufacturing method for a pin-type encapsulation module provided in an embodiment of the present invention includes:

[0098] S101: Insert and solder the internal pins 13 onto the PCB board 11.

[0099] Specifically, in this step, it includes but is not limited to inserting and soldering the internal pins 13 onto the PCB board 11 through the SMT process.

[0100] S102: Apply plugging glue 20 at both end points of the pin through-hole 133.

[0101] Specifically, in this step, the hole-blocking glue 20 is usually selected as a colloid with relatively poor fluidity and a certain degree of sealing ability to block holes. The relatively poor fluidity can prevent the colloid from flowing into the inner step 134 of the inner pin 13 and the pin through-hole 133 of the inner pin 13 during the curing process, affecting subsequent operations. And a certain degree of sealing can effectively prevent the epoxy molding compound from flowing into the inner step 134 of the inner pin 13 and the pin through-hole 133 of the inner pin 13 during the subsequent injection molding process, affecting the solder joint quality of the pin welding structure in the subsequent process.

[0102] S103: Perform double-sided injection molding encapsulation on the assembled PCB board 11 to form a first encapsulation part 121 and a second encapsulation part 122.

[0103] Specifically, in this step, perform double-sided injection molding encapsulation on the assembled PCB board 11 to form an injection molding panel including several product units.

[0104] S104: Grind and drill holes in the first encapsulation part 121 and the second encapsulation part 122 respectively, to form a first upper step 16 and a second upper step 17 on the side of the first encapsulation part 121 facing away from the PCB board 11, and form a lower step 18 on the side of the second encapsulation part 122 facing away from the PCB board 11.

[0105] Specifically, in this step, the materials ground off at least include the encapsulation material of the first upper step 16, the second upper step 17, and the lower step 18, the hole-blocking glue 20, the upper surface part of the upper end 131 of the inner pin 13, and the lower surface part of the lower end 132 of the inner pin 13. The area of grinding and drilling holes is as Figure 10 the dotted box area in.

[0106] S105: Perform cutting treatment on the encapsulation structure to form individual product units.

[0107] Specifically, in this step, as Figure 9 shown, based on the scribe groove 24, perform water jet cutting to form individual product units.

[0108] S106: Insert the external pins 14 into the pin through-holes 133 of the inner pins 13 of the individual product units, and perform soldering connection with the inner step 134 of the inner pins 133.

[0109] Specifically, in this step, after soldering, cleaning and other treatments can also be performed on it.

[0110] S107: Install the pin caps 15, so that the pin caps 15 are in contact with the first upper step 16 and the first ends of the external pins 14 respectively.

[0111] As can be seen from the above description, the present application provides a pin-type plastic package module and a manufacturing method thereof. First, internal pins 13 are pre-set in the pin-type plastic package module, and then injection molding and grinding and drilling are performed. While forming a first upper step 16 and a second upper step 17 in the first plastic package part 121, and forming a lower step 18 in the second plastic package part 122, the upper end 131 and the lower end 132 of the internal pin 13 are exposed. Then, an external pin 14 is inserted into the pin through-hole 133 of the internal pin 13, and the internal pin 13 and the external pin 14 are welded to form a solder joint 19, realizing the soldering and leading-out of the internal pin 13 of the pin-type plastic package module. Finally, a pin cover 15 is provided, which not only limits and fixes the internal pin 13 and the external pin 14, but also completes the sealing of the pin-type plastic package module and the external insulation of the pins. It can improve the space utilization rate of the plastic package module in the prior art, and the pin soldering reliability is higher, meeting the application and popularization requirements of high-performance plastic package module products.

[0112] The pin-type plastic package module and the manufacturing method thereof provided by the present application achieve the internal pin out-pin connection structure of the plastic package module, and have several technical advantages compared with the prior art, as follows:

[0113] First: Compared with the side-out-pin method of the plastic package module in the prior art, it solves the problem that the external space on both sides of the pins cannot be utilized, and improves the layout utilization rate of this type of product and the compatibility with the traditional pin-type shell package module.

[0114] Second: Compared with the side-out-pin soldering structure of the plastic package module in the prior art, the pin soldering structure formed by welding the internal pin 13 and the external pin 14 in the present application has higher soldering strength and soldering reliability. In the side-pin soldering structure of the plastic package module in the prior art, the lead-out pins rely on the surface-mount soldering of the side pads of the PCB board to realize the lead-out connection of the product, and the soldering strength of the lead-out pins is relatively low. While the pin soldering structure of the present application is a 360-degree through-hole soldering structure formed around the external pin 14 based on the internal step, including the internal pin 13 being inserted and soldered on the PCB board by means of through-hole soldering, and the external pin 14 being soldered on the internal pin 13 by means of soldering through the pin through-hole 133. The lead-out pin soldering structure of the present application has higher soldering strength and soldering reliability.

[0115] Third: The pin soldering structure of the present application can meet the usage requirements of higher soldering temperature and longer soldering time during customer applications, and has a wider range of customer application parameters. In the pin-type plastic package module of the present application, the connection solder joints 19 of the internal pins 13 and the external pins 14 are all located on the side far from the user installation surface, which can maximize the range of process parameters for product use. Since the pin connection solder joints 19 are located on the side far from the customer soldering installation surface, when the product is soldered and installed, the heat generated by the soldering of the customer's solder joints (the connection solder joints between the pins and the customer's PCB board) is transmitted upward through the pins, and finally it takes a longer time and a higher temperature to melt the solder joints 19 of the internal pins 13 and the external pins 14 of the present application. That is, the pin-type plastic package module of the present application can meet the usage requirements of higher temperature soldering and longer time soldering for customers. The pin-type plastic package module has a wider range of application parameters, and the working reliability of the pin solder joints 19 is higher.

[0116] Fourth: The pin soldering structure of the present application has a limiting structure, which can effectively prevent the stress applied to the external pins 14 from being transmitted to the internal solder joints 19, improving the installation and fixing strength of the product while enhancing the working reliability of the product. In the present application, the external pins 14 include a limiting step 141 of the external pins 14, which can form a limiting structure to restrict the upward movement of the external pins 14. The first end of the external pins 14 (or the upper end of the external pins 14) is fixed by the pin cover 15 to fix the external pins 14, the internal pins 13 and the solder joints 19 of the external pins 14, forming a limiting structure to restrict the up and down movement of the external pins 14. When external stress is applied to the product pins, the limiting structure of the pin soldering structure in the present application can prevent the external stress from being transmitted to the solder joints 19 of the internal pins 13 and the external pins 14, improving the installation and fixing strength of the product while enhancing the working reliability of the product.

[0117] Fifth: The pin-type plastic package module provided by the present application can be directly surface-mounted during use without adding gaskets at the bottom, making its installation and use more convenient compared to the prior art products. For the product of the pin-type plastic package module of the present application, a lower step 18 is provided on the second plastic package part 122 at the bottom. The limiting step 141 of the external pins 14 is embedded in the lower step 18, and there is a certain gap between the limiting step 141 of the external pins 14 and the second plastic package part 122, thus forming a groove for soldering tin penetration during product installation and use. At the same time, since the second plastic package part 122 at the bottom of the product is itself insulating, the product of the pin-type plastic package module of the present application can be directly attached to the customer's PCB board surface for installation during application, eliminating the requirements of adding gaskets at the bottom for insulation and soldering tin penetration of the pin solder joints during the installation of traditional module products, and making its product installation and use more convenient.

[0118] The above has introduced in detail a pin-type plastic encapsulation module and its manufacturing method provided by the present invention. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

[0119] It should be noted that each embodiment in this specification focuses on the differences from other embodiments. For the same and similar parts among the various embodiments, reference can be made to each other.

[0120] It should also be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that the elements inherent in a process, method, article or device including a series of elements, or those elements that are also inherent in these process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of another identical element in the process, method, article or device including the said element.

[0121] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A pin-type plastic-sealed module, characterized in that, The pin-type plastic-sealed module includes: a PCB board, a plastic-sealed component, internal pins, external pins, and a pin cover; The PCB board includes a first assembly surface and a second assembly surface that are arranged opposite to each other; The plastic sealing component includes a first plastic sealing portion located on one side of the first assembly surface, and a second plastic sealing portion located on one side of the second assembly surface; The internal pin includes an upper end, a lower end, and a pin through hole passing through the upper end and the lower end; an inner step is provided on the inner side of the upper end; A limit step is provided on the external pin; A first upper step and a second upper step are provided on a side of the first plastic sealing portion facing away from the first assembly surface, wherein the size of the first upper step is larger than that of the second upper step; a lower step is provided on a side of the second plastic sealing portion facing away from the second assembly surface; The internal pins are inserted and soldered on the PCB; the external pins are inserted into the pin through holes and soldered to the inner steps, and the limiting steps are in contact with the lower steps; The first upper step and the second upper step both expose the upper ends of the internal pins and the first ends of the external pins; the pin covers are in contact with the first upper step and the first ends of the external pins, respectively.

2. The pin-type plastic package module according to claim 1, wherein, The first upper step and the second upper step are obtained by grinding and drilling holes on the first plastic sealing part; The lower step is obtained by grinding and drilling a hole on the second plastic sealing part.

3. The pin type plastic package module according to claim 1, wherein The diameter of the external pin is D1, and the diameter of the pin through hole is D2; wherein, 0.1 mm ≤ D2 - D1 ≤ 0.15 mm.

4. The pin-type plastic encapsulation module according to claim 1, characterized in that, The diameter of the outer pin is D1, and the diameter of the inner step is D3; Among them, 0.2mm≤D3-D1≤0.4mm.

5. The pin type plastic package module according to claim 1, characterized in that, The material of the pin cover is plastic.

6. The pin-type plastic encapsulation module according to claim 1, wherein The material of the internal pins is copper; The material of the external pins is brass.

7. The pin-type plastic encapsulation module according to claim 1, wherein The central area of the pin cover is bonded to the first end of the external pin using a first adhesive; the surrounding area of the pin cover is bonded to the first upper step using a second adhesive; The first adhesive and the second adhesive are of different types.

8. The pin-type plastic encapsulation module according to claim 7, wherein, The pin cover is provided with an isolation ring; The first adhesive is located on the inner side of the isolation ring, and the second adhesive is located on the outer side of the isolation ring.

9. The pin type plastic encapsulation module according to claim 1, characterized in that, The distance between the surface of the pin cover and the first assembly surface is L1, and the distance between the surface of the first plastic sealing portion and the first assembly surface is L2; wherein L1<L2; The distance between the surface of the limiting step facing away from the second assembly surface and the second assembly surface is L3, and the distance between the surface of the second plastic sealing portion and the second assembly surface is L4; Among them, L3<L4.

10. A manufacturing method of a pin-type plastic package module, characterized in that, Used to manufacture the pin-type plastic-encapsulated module according to any one of claims 1 to 9, the manufacturing method comprising: Solder the internal pins onto the PCB board; Apply plugging glue to both ends of the pin through-hole; Perform double-sided injection molding on the assembled PCB board to form a first plastic-sealed portion and a second plastic-sealed portion; Grind and punch the first encapsulation part and the second encapsulation part respectively, to form a first upper step and a second upper step on the side of the first encapsulation part facing away from the PCB board, and form a lower step on the side of the second encapsulation part facing away from the PCB board; Perform a cutting process on the encapsulation structure to form individual product units; For the individual product units, insert external pins into the pin through holes of the internal pins and perform soldering connections with the inner steps of the internal pins; Install pin caps such that the pin caps are respectively in contact with the first upper step and the first ends of the external pins.

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