A coaxial packaged laser structure

Through the improved holding module, heat conduction module and support module, the problems of low heat dissipation efficiency and structural instability of the coaxial packaged laser are solved, higher heat dissipation efficiency and reliability are achieved, and the service life of the laser is extended.

CN120389283BActive Publication Date: 2025-09-09GUANG DONG HIGH RATE COMM TECH CO LTD
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Patent Information

Application Number
CN202510878370.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-06-27
Publication Date
2025-09-09
Estimated Expiration
2045-06-27

AI Technical Summary

Technical Problem

Existing coaxially packaged lasers have low heat dissipation efficiency. The laser chip, thermistor, and heat sink lack a mechanical fixing structure and are easily detached due to thermal expansion mismatch. The pins are easily bent during installation and removal.

Method used

The improvement adopts a pressing module, a thermal conductive module and a supporting module. The pressing module ensures the firm fit of the laser chip, thermistor and heat sink through spring sheets and clamping structures. The thermal conductive module improves the heat dissipation efficiency through thermal conductive fins and coolant channels. The supporting module supports the pins through rubber sleeves and magnetic blocks to prevent bending.

Benefits of technology

It improves the heat dissipation performance and reliability of the laser, reduces the risk of detachment due to thermal expansion mismatch, reduces the probability of pin bending during installation, and extends the service life of the device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention provides a coaxial packaged laser structure, belonging to the field of laser technology. It includes a tube seat, a tube cap is provided at the upper end of the tube seat, a pin is provided on the inner side of the lower end of the tube seat, a heat sink is provided on the rear side of the upper end of the tube seat, a laser chip is provided in the middle of the front end of the heat sink, a holding module is provided on the left and right sides of the front end of the laser chip, and a photodiode is provided in the middle of the upper end of the tube seat. The present invention clamps the laser chip under the action of the stress of the spring sheet through the holding module, and because the front end spring pull rod is retractable, the front end of the holding module is fitted with the chamfer of the laser chip, generating a tension while also having a clamping force, fixing the laser chip, thermistor and the heat sink in front and on the side, making them fit more firmly and tightly. Without changing the existing installation structure, compared with the traditional method of relying only on fitting reinforcement, it is not easily affected by thermal expansion mismatch and thus more reliable to use.
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Description

Technical Field

[0001] The present invention relates to the technical field of lasers, and in particular to a coaxial packaged laser structure. Background Art

[0002] A laser is an optical device that emits a laser beam. It excites atoms, molecules, or other particles, causing them to emit highly coherent light, resulting in a strong beam of light with a specific wavelength, direction, and coherence. A coaxial packaged laser, also known as a TO-packaged laser, is a laser that encapsulates optical components such as a laser chip within a metal housing with a coaxial structure.

[0003] At present, the main shape of the packaging structure of the existing coaxial packaged laser is cylindrical, and it is composed of a tube seat and a tube cap to form a sealed structure. Then, various optical and electronic components are installed inside the sealed structure to form a complete laser. This TO packaged laser has the advantages of small size, flexible use and low cost, and is easy to produce and assemble. However, although the tube seat and other parts of the TO package can be designed for heat dissipation, the overall heat dissipation performance is still relatively weak compared to some special heat dissipation packaging structures. At the same time, the laser chip, thermistor, heat sink, etc. inside the existing laser are all fixed by a mutually fitting installation method, and the surface roughness of different materials is different. The actual contact area is not ideal, and there will be interface thermal resistance, which will also hinder the heat from the laser chip through the heat sink. Inefficiently dissipate the heat. When running at high power, the heat generated by the laser chip is difficult to dissipate quickly, resulting in excessively high chip temperature, affecting its performance and life. In addition, there is a lack of fixed structure in the area of ​​components such as the laser chip, and different materials have different thermal expansion coefficients. During the operation of the laser, temperature changes will cause the laser chip, thermistor and heat sink to expand or contract to varying degrees. This thermal expansion mismatch may cause changes in the fitting pressure between them, and in severe cases may cause separation from each other, affecting the performance and reliability of the device. At the same time, the pins of the existing TO package are prone to bending during installation and disassembly, affecting subsequent use. Therefore, it is necessary to optimize and improve the packaging structure of the existing coaxial packaged laser. Therefore, the present application provides a coaxial packaged laser structure to meet the needs. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a coaxial packaged laser structure to optimize and improve the existing coaxial packaged laser, which has low heat dissipation efficiency, lacks a mechanical fixing structure after the internal laser chip, thermistor and heat sink are bonded together, is easily separated from each other when thermal expansion mismatch occurs, and has easy bending of the pins.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] A coaxial packaged laser structure includes a tube base, a tube cap is provided at the upper end of the tube base, a pin is provided on the inner side of the lower end of the tube base, a heat sink is provided on the rear side of the upper end of the tube base, a laser chip is provided in the middle of the front end of the heat sink, and holding modules are provided on the left and right sides of the front end of the laser chip. A photodiode is provided in the middle of the upper end of the tube base, a support module is installed on the outer end of the pin, a cooling module is provided on the inner side of the tube cap, a lens is embedded in the inner side of the upper end of the tube cap, a heat conduction module is provided on the outer side below the lens, and liquid inlet pipes are symmetrically distributed on the upper and lower sides of the outer end of the tube base.

[0007] Optionally, the tube seat includes a seat body, a welding groove, a triangular block, an upper connecting pipe and an inclined groove. A welding groove is provided on the outer side of the upper end of the seat body, a triangular block is symmetrically provided behind the inner side of the welding groove, an upper connecting pipe is provided in the middle of the rear side of the triangular block, and an inclined groove is provided in the middle of the upper end of the seat body.

[0008] Optionally, the tube cap includes a cap body, an external clamping block, an internal groove and a sealing ring, the lower end of the cap body is provided with an external clamping block, an internal groove is opened on the upper inner side of the cap body, and the lower end of the external clamping block is provided with a sealing ring.

[0009] Optionally, the heat sink includes an inner cavity block, a reinforcement plate, a support block and a lower connecting pipe. A reinforcement plate is provided below the left and right sides of the outer end of the inner cavity block, support blocks are symmetrically distributed at the lower end of the inner cavity block, and a lower connecting pipe is symmetrically distributed in the middle of the lower end of the inner cavity block.

[0010] Optionally, the holding module includes a rod body, a spring sheet, a dial, a button rod, a spring pull rod, a bar, an adjusting rod and an angle plate, a spring sheet is provided on the upper and lower sides of the outer end of the rod body, a dial is provided on the upper and lower sides of the outer end of the rod body, a button rod is provided at the upper end of the dial, a spring pull rod is provided on the front side of the outer end of the button rod, a bar is provided on the front side of the spring pull rod, an adjusting rod is provided on the right side of the outer end of the bar, and an angle plate is provided at the right end of the adjusting rod.

[0011] Optionally, the support module includes a cylindrical block, a threaded rod, a magnetic block, a tension spring, a support rod, a sleeve and a rubber sleeve, the upper end of the cylindrical block is provided with a threaded rod, the inner side of the top end of the threaded rod is provided with a magnetic block, the middle part of the outer end of the cylindrical block is symmetrically distributed with a tension spring, the front end of the tension spring is provided with a support rod, the front end of the support rod is provided with a sleeve, and the inner side of the sleeve is provided with a rubber sleeve.

[0012] Optionally, the cooling module includes an outer rotating tube, an inner rotating tube, a liquid inlet, a liquid drain port and a connecting piece. The inner side of the outer rotating tube is connected to the inner rotating tube. The left side of the lower end of the outer rotating tube is provided with a liquid inlet, and the right side of the lower end of the inner rotating tube is provided with a liquid drain port. Connectors are symmetrically distributed in the middle of the outer rotating tube and the inner rotating tube.

[0013] Optionally, the heat conduction module includes a heat conduction shell, an embedded ring, welding points and heat conduction fins. The top of the heat conduction shell is provided with an embedded ring, the upper end of the embedded ring is annularly distributed with welding points, and the inner side of the heat conduction shell is annularly distributed with heat conduction fins.

[0014] Optionally, the lower end of the tube cap extends to the inner side of the upper end of the tube base and is welded by energy storage welding. The upper end of the pin passes through the inner side of the tube base and extends upward. The pin and the inner side of the contact end of the tube base are sealed with each other by a glass ring. The heat sink is an integral structure, wherein the front end structure is rectangular and the rear end structure is arc-shaped. Two through holes are provided on the left and right inside the rectangular structure at the front end, and an inverted U-shaped pipeline cavity is provided inside the arc-shaped structure at the rear end. A thermistor is attached between the heat sink and the laser chip, and two groups of the holding modules are symmetrically distributed on the left and right.

[0015] Optionally, the rod body, dial and button rod are threadedly spliced ​​into a whole, the spring sheet and spring pull rod are symmetrically distributed up and down, the rear end of the spring pull rod and the front side of the outer end of the button rod are reinforced by threads, and the front end of the spring pull rod and the rear end of the bar are welded and fixed to each other.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects:

[0017] In the above scheme, through the setting of the pressing module, before the laser chip, thermistor and heat sink are fitted and fixed, two specially sized four-corner rods are first inserted into the slots opened at the top of the left and right button rods, and then the button rods are rotated in opposite directions, so that the left and right button rods drive the clamping structure formed by the spring pull rod, bar, adjustment rod and angle plate at the front end to expand to both sides. At the same time, as the button rod drives the rod body to rotate, the spring sheet will complete the winding work. After that, when the laser chip, thermistor and heat sink are fitted, it is only necessary to slowly release the rotation force of the button rod, and the spring sheet will be wound on itself. Under the action of the characteristics, the ability generated by the winding will be released, pushing the expanded clamping structure to close inward, allowing the left and right corner plates to fit on both sides of the laser chip for clamping. Moreover, through the action of the spring pull rod, the transverse structure composed of the strips, adjustment rods and corner plates can be extended and retracted, generating a backward pulling force at the front end of the laser chip, so that the laser chip, thermistor and heat sink can fit more firmly and tightly. Without changing the existing installation structure, compared with the traditional method of relying only on fitting reinforcement, it is not easily affected by thermal expansion mismatch and caused to separate, and it is more reliable to use.

[0018] Through the heat conduction module, the heat conduction fins distributed in an annular manner on the inner side thereof increase the heat dissipation contact area, absorb the heat of the gas heated by the laser chip during operation, and then conduct the heat to the outer cavity through the heat conduction shell. At the same time, through the liquid inlet pipes arranged symmetrically on the left and right, it can be connected to the output end and the recovery end of the external cooling device. When cooling is required, the coolant in the external cooling device is injected from the liquid inlet pipe on the left side below the tube seat, and a part of the coolant will enter the internal cavity of the tube seat. The coolant in the cavity will reach the upper pipe on the left side through the internal passage of the tube seat, and when entering the heat sink, the heat sink will pass through the heat conduction pipe. The heat conducted by the heat conduction shell is taken away, and the other part of the coolant enters the cooling module along the liquid inlet pipe that passes through the inside of the tube holder, and flows into the inner tube along the outer spiral tube. Since the inner spiral tube is wrapped around the outside of the heat-conducting shell, it absorbs the heat conducted by the heat-conducting shell. Then the coolant enters the liquid inlet pipe on the right side below the tube holder from the drain port to complete the discharge work. Compared with the traditional heat dissipation through heat conduction, the new heat dissipation structure has better effect. The overall structure is only optimized and improved on the inside of the existing tube holder, tube cap and heat sink, which will not increase the overall size of the existing laser and improve the performance and service life of the internal components.

[0019] Through the support module set up, after the laser pin is installed, a rubber sleeve is wrapped around the middle of the outer side of the pin. Then, according to the distribution spacing of the pin, the length of the support rod and the self-stress of the tension spring are adjusted so that the spacing between the symmetrically distributed sleeve and the cylindrical block just matches the distribution spacing of the pin. Then, the sleeve is installed on the outside of the rubber sleeve, and the cylindrical block is fixed by a threaded rod and a magnetic block, so that the support module supports the middle of multiple pins, thereby reducing the problem of bending of the pins during installation and disassembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated herein and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, further serve to explain the principles of the invention and to enable one skilled in the art to make and use the invention.

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the three-dimensional exploded structure of the tube base, tube cap and heat sink of the present invention;

[0023] Figure 3 This is a schematic diagram of the three-dimensional structure of the tube base of the present invention;

[0024] Figure 4 This is a schematic diagram of the three-dimensional structure of the heat sink of the present invention when viewed from above;

[0025] Figure 5 This is a schematic diagram of the three-dimensional exploded structure of the pressing module of the present invention;

[0026] Figure 6 This is a bottom-up schematic diagram of the three-dimensional assembly structure of the tube base, pins and support module of the present invention;

[0027] Figure 7 This is a schematic diagram of the three-dimensional structure of the support module of the present invention from a top view;

[0028] Figure 8 This is a bottom-up schematic diagram of the three-dimensional structure of the pipe cap and the heat conduction module of the present invention;

[0029] Figure 9 This is a schematic diagram of the three-dimensional assembly structure of the pipe cap and the cooling module of the present invention;

[0030] Figure 10 This is a schematic diagram of the three-dimensional structure of the cooling module of the present invention;

[0031] Figure 11 This is a schematic diagram of the planar structure of the cooling module of the present invention;

[0032] Figure 12 This is a schematic top view of the three-dimensional structure of the heat conduction module of the present invention.

[0033] Reference numerals:

[0034] 1. Tube base; 2. Tube cap; 3. Pin; 4. Heat sink; 5. Laser chip; 6. Pressing module; 7. Photodiode; 8. Support module; 9. Cooling module; 10. Lens; 11. Heat conduction module; 12. Liquid inlet pipe; 101. Base; 102. Welding groove; 103. Triangular block; 104. Upper connecting pipe; 105. Inclined groove; 201. Cap; 202. External clamping block; 203. Inner groove; 204. Sealing ring; 401. Inner cavity block; 402. Reinforcement plate; 403. Support block; 404. Lower connecting pipe; 601. Rod body; 602, spring sheet; 603, dial; 604, button rod; 605, spring pull rod; 606, bar block; 607, adjustment rod; 608, angle plate; 801, cylindrical block; 802, threaded rod; 803, magnetic block; 804, tension spring; 805, support rod; 806, sleeve; 807, rubber sleeve; 901, outer rotating tube; 902, inner rotating tube; 903, liquid inlet; 904, liquid outlet; 905, connector; 111, heat-conducting shell; 112, embedded ring; 113, welding point; 114, heat-conducting fin.

[0035] As shown in the figure, in order to clearly implement the structure of the embodiment of the present invention, specific structures and devices are marked in the figure, but this is only for illustrative purposes and is not intended to limit the present invention to the specific structure, device and environment. According to specific needs, ordinary technicians in this field can adjust or modify these devices and environments. DETAILED DESCRIPTION

[0036] The following describes in detail a coaxial packaged laser structure provided by the present invention, in conjunction with the accompanying drawings and specific embodiments. It is also noted that, to provide a more detailed description, the following embodiments are optimal and preferred embodiments, and those skilled in the art may employ alternative implementations for certain known technologies. Furthermore, the accompanying drawings are intended only to provide a more detailed description of the embodiments and are not intended to limit the present invention.

[0037] It should be noted that references in the specification to "one embodiment," "an embodiment," "exemplary embodiments," "some embodiments," etc. indicate that the described embodiments may include specific features, structures, or characteristics, but not necessarily every embodiment will include such specific features, structures, or characteristics. Furthermore, when specific features, structures, or characteristics are described in conjunction with an embodiment, it is within the knowledge of persons skilled in the relevant art to implement such features, structures, or characteristics in conjunction with other embodiments (whether or not explicitly described).

[0038] In general, terms can be understood, at least in part, from their use in context. For example, depending at least in part on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey an exclusive set of factors, but can instead, depending at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described.

[0039] It will be understood that the meanings of “on,” “over,” and “above” in the present invention should be interpreted in the broadest manner, so that “on” means not only “directly on” something but also includes the meaning of being “on” something with intervening features or layers, and “on” or “above” means not only “on” or “above” something but also includes the meaning of being “on” or “above” something with no intervening features or layers.

[0040] Additionally, spatially relative terms such as "below," "beneath," "lower," "above," and "upper" may be used herein for descriptive convenience to describe the relationship of one element or feature to another element or features, as illustrated in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially relative descriptors used herein should be similarly interpreted accordingly.

[0041] like Figures 1 to 12As shown, an embodiment of the present invention provides a coaxial packaged laser structure, including a tube base 1, a tube cap 2 is provided at the upper end of the tube base 1, a pin 3 is provided on the inner side of the lower end of the tube base 1, a heat sink 4 is provided on the rear side of the upper end of the tube base 1, a laser chip 5 is provided in the middle of the front end of the heat sink 4, and a holding module 6 is provided on the left and right sides of the front end of the laser chip 5. A photodiode 7 is provided in the middle of the upper end of the tube base 1, a support module 8 is installed on the outer end of the pin 3, a cooling module 9 is provided on the inner side of the tube cap 2, a lens 10 is embedded and installed on the inner side of the upper end of the tube cap 2, a heat conduction module 11 is provided on the outer side below the lens 10, and liquid inlet pipes 12 are symmetrically distributed on the upper and lower sides of the outer end of the tube base 1.

[0042] The tube base 1 is an integral structure, but a pipeline channel for the coolant to pass through is opened on the outside. The lower end of the tube cap 2 extends to the inner side of the upper end of the tube base 1 and is welded by energy storage welding. There are three pins 3 symmetrically distributed, and the pins 3 are triangularly distributed below the tube base 1. Among them, the left and right pins 3 are respectively connected to the laser chip 5 and the photodiode 7, while the pin 3 on the rear side is connected to the ground end. The upper end of the pin 3 passes through the inner side of the tube base 1 and extends to the top. The pin 3 and the inner side of the contact end of the tube base 1 are sealed with each other by a glass ring. The heat sink 4 is an integral structure, wherein the front end structure is rectangular and the rear end structure is arc-shaped, and two left and right through holes are opened inside the rectangular structure of the front end, and an inverted U-shaped pipeline cavity is opened inside the arc-shaped structure of the rear end. The inlet and outlet of the inverted U-shaped pipeline cavity are respectively connected to the two lower pipes 404 installed on the left and right sides below. A thermistor is bonded between the heat sink 4 and the laser chip 5, and two groups of holding modules 6 are symmetrically distributed on the left and right. A photodiode 7 is pasted and installed on the inner middle side of the upper end of the tube base 1. The support module 8 is adsorbed on the middle part of the lower end of the tube base 1 by magnetic reinforcement. The liquid inlet 903 and the liquid discharge port 904 of the cooling module 9 are respectively connected to the liquid inlet pipes 12 on the left and right sides. Common shapes of the lens 10 include spherical, hemispherical, conical, wedge-shaped, double-bevel, etc., which can be selected according to parameters such as the divergence angle of the chip fast and slow axes. The lower end of the thermal conductive module 11 extends to the inner side of the upper end of the tube base 1, and the contact ends of the two are sealed. The upper end of the thermal conductive module 11 is welded and fixed to the upper end contact position of the inner side of the tube cap 2. The liquid inlet pipe 12 is symmetrically distributed on the left and right, and there are two distributed on each side, and the two on each side are sealed and connected to the coolant pipeline channel opened on the inner side of the tube base 1.

[0043] During operation, through the provided pressing module 6, before the laser chip 5, thermistor and heat sink 4 are fitted and fixed, the pressing modules 6 installed on both sides are first rotated in opposite directions to allow the clamping structures formed at the front ends of both sides to expand to both sides. Then, after the laser chip 5, thermistor and heat sink 4 are fitted, it is only necessary to slowly release the rotating force of the pressing module 6. Under the action of the material stress of the internal parts themselves, the expanded clamping structures on both sides are pushed inward to close. Moreover, since the front end of the pressing module 6 can extend and retract, the front end clamping structure of the pressing module 6 is fitted with the chamfer of the laser chip 5. Both a backward pulling force and an inward clamping force are generated at the front end of the laser chip 5, thereby reinforcing and fixing the front and side surfaces of the laser chip 5, the thermistor and heat sink 4, making the three fit more firmly and tightly. Without changing the existing installation structure, compared with the traditional method of relying solely on fitting reinforcement, it is not easily affected by thermal expansion mismatch and caused to separate, and is more reliable to use.

[0044] like Figure 2 、 Figure 3 and Figure 8 As shown, the tube seat 1 includes a base body 101, a welding groove 102, a triangular block 103, an upper pipe 104 and an inclined groove 105. The outer side of the upper end of the base body 101 is provided with a welding groove 102, and the triangular block 103 is symmetrically provided at the rear of the inner side of the welding groove 102. The middle part of the rear side of the triangular block 103 is provided with an upper pipe 104, and the middle part of the upper end of the base body 101 is provided with an inclined groove 105; the tube cap 2 includes a cap body 201, an outer clamping block 202, an inner embedded groove 203 and a sealing ring 204. The lower end of the cap body 201 is provided with an outer clamping block 202, the upper inner side of the cap body 201 is provided with an inner embedded groove 203, and the lower end of the outer clamping block 202 is provided with a sealing ring 204.

[0045] The base body 101 is an integral structure. The middle area of ​​the upper end of the base body 101 forms a height difference with the outer area. A welding groove 102 is provided at the position of the height difference. The internal depth and width of the welding groove 102 are adapted to the height and width of the outer clamping block 202. There are two triangular blocks 103 symmetrically distributed on the left and right, and positioning and mounting holes are provided at the upper ends of the two triangular blocks 103. There are two upper pipes 104 distributed on the left and right. The lower end of the upper pipe 104 extends to the interior of the base body 101 and is sealed and connected to the coolant pipeline channel opened in the interior of the base body 101. The inclination angle of the inclined groove 105 is consistent with the inclination angle of the photodiode 7; the cap body 201 and the outer clamping block 202 form an integrated structure. The size of the embedded groove 203 is adapted to the upper end structure of the thermal conductive module 11. The sealing ring 204 is made of sheet metal material, such as indium or tin. When welding, only a certain pressure needs to be applied to melt it and fill the gap in the welding end, thereby playing the role of welding sealing.

[0046] During operation, the seat body 101 is provided, and due to the coolant pipe channel opened on the inner side, the coolant injected from the outside can flow inside, and then enter the heat sink 4 along the upper pipe 104 connected to the left and right, and the heat generated by the laser chip 5 and the photodiode 7 is discharged in time through heat conduction, thereby ensuring the working performance and life of the laser chip 5 and the photodiode 7. The seat body 101 and the cap body 201 can be welded and reinforced through the welding groove 102 and the external clamping block 202, so that the two form an integrated sealing structure, and the triangular block 103 is used to seal the heat generated by the laser chip 5 and the photodiode 7. The design can install and reinforce the heat sink 4, and the design of the embedded groove 203 can weld the upper end of the heat conducting module 11 to the cap body 201, so that the inside of the cap body 201 forms two inner and outer cavities, wherein the size of the outer cavity is adapted to the size of the cooling module 9, and the cooling module 9 can be installed on the inside, and the inner cavity forms an inner cover structure on the outside of the working environment of the laser chip 5 and the photodiode 7 after the lower end of the heat conducting module 11 and the upper end of the base 101 are sealed and assembled with each other, thereby increasing the heat contact area and facilitating the subsequent improvement of the heat dissipation efficiency.

[0047] like Figure 4 and Figure 5 As shown, the heat sink 4 includes an inner cavity block 401, a reinforcement plate 402, a support block 403 and a lower pipe 404. The reinforcement plates 402 are provided below the left and right sides of the outer end of the inner cavity block 401. The support blocks 403 are symmetrically distributed at the lower end of the inner cavity block 401. The lower pipe 404 is symmetrically distributed in the middle of the lower end of the inner cavity block 401. The pressing module 6 includes a rod body 601, a spring sheet 602, a dial 603, a button rod 604, a spring pull rod 605, a bar 606, and a support plate 402. 06. Adjusting rod 607 and angle plate 608. Spring sheets 602 are provided on the upper and lower sides of the outer end of the rod body 601. Dial plates 603 are provided on the upper and lower sides of the outer end of the rod body 601. A button rod 604 is provided on the upper end of the dial 603. A spring pull rod 605 is provided on the front side of the outer end of the button rod 604. A bar 606 is provided on the front side of the spring pull rod 605. An adjusting rod 607 is provided on the right side of the outer end of the bar 606. An angle plate 608 is provided on the right end of the adjusting rod 607.

[0048] The inner cavity block 401 and the reinforcement plate 402 are an integrally welded structure. The positioning and mounting holes on the reinforcement plate 402 are adapted to the positioning and mounting holes on the upper end of the triangular block 103. At the same time, the three support blocks 403 welded and mounted at the lower end of the inner cavity block 401 are used to reinforce the inner cavity block 401. There are two lower pipes 404 symmetrically distributed on the left and right. The distribution spacing of the two lower pipes 404 is interconnected with the upper pipes 104 distributed on the left and right ends of the base body 101; the rod body 601, the dial 603 and the button rod 604 are threaded. As a whole, the spring sheet 602 and the spring pull rod 605 are symmetrically distributed up and down, wherein the inner protruding end of the spring sheet 602 extends to the inner side of the outer end of the rod body 601, and the outer protruding end of the spring sheet 602 extends to the inner wall of the through hole opened on the inner side of the heat sink 4. The rear end of the spring pull rod 605 and the front side of the outer end of the button rod 604 are reinforced by threads, and the front end of the spring pull rod 605 and the rear end of the bar 606 are welded and fixed to each other. The adjusting rod 607 can adjust the overall length according to needs, and the angle plate 608 is made of polyimide material.

[0049] During operation, the lower connecting pipe 404 is connected to the upper connecting pipes 104 distributed on the left and right sides of the upper end of the base 101, and the inverted U-shaped passage opened on the inner side of the heat sink 4 is used to facilitate the injection of coolant into the interior, so that the heat conducted by the heat sink 4 is cooled in time. Through the provided pressing module 6, before the laser chip 5, the thermistor and the heat sink 4 are fitted and fixed, two specially sized four-corner rods are first inserted into the notches opened on the top ends of the left and right button rods 604, and then the button rods 604 are rotated in opposite directions, so that the left and right button rods 604 drive the clamping structure formed by the spring pull rod 605, the bar 606, the adjustment rod 607 and the angle plate 608 at the front end to expand to both sides. At the same time, since the button rod 604 drives the rod body 601 to rotate, the spring sheet 602 will complete the winding work. , and then wait until the laser chip 5, thermistor and heat sink 4 are fitted together, just need to slowly release the rotational force of the button rod 604, and the spring sheet 602 will release the ability generated by the winding under the action of its own characteristics, pushing the expanded clamping structure to close inward, so that the left and right angle plates 608 fit on both sides of the laser chip 5 for clamping, and through the action of the spring pull rod 605, the horizontal structure composed of the strip 606, the adjustment rod 607 and the angle plate 608 can be extended and retracted, and a backward pulling force is generated at the front end of the laser chip 5, so that the laser chip 5, thermistor and heat sink 4 fit together more firmly and tightly. Without changing the existing installation structure, compared with the traditional method of relying only on fitting reinforcement, it is not easily affected by thermal expansion mismatch and caused to separate, and it is more reliable to use.

[0050] like Figure 6 and Figure 7As shown, the support module 8 includes a cylindrical block 801, a threaded rod 802, a magnetic block 803, a tension spring 804, a support rod 805, a sleeve 806 and a rubber sleeve 807. The upper end of the cylindrical block 801 is provided with a threaded rod 802, the inner side of the top of the threaded rod 802 is provided with a magnetic block 803, the middle part of the outer end of the cylindrical block 801 is symmetrically distributed with a tension spring 804, the front end of the tension spring 804 is provided with a support rod 805, the front end of the support rod 805 is provided with a sleeve 806, and the inner side of the sleeve 806 is provided with a rubber sleeve 807.

[0051] The cylindrical block 801 is made of metal as a whole. The lower end thread of the threaded rod 802 extends to the interior of the cylindrical block 801. The magnetic block 803 is embedded and installed on the inner side of the upper end of the threaded rod 802. The tension spring 804 and the support rod 805 are adapted to each other. The support rod 805 and the contact end of the tension spring 804 are welded and fixed together. There are three symmetrically distributed sleeves 806. The sleeve 806 is made of ceramic material. The outer end diameter of the rubber sleeve 807 is adapted to the inner diameter of the sleeve 806. The rubber sleeve 807 will expand when exposed to heat and fit tightly against the inner wall of the sleeve 806.

[0052] During operation, through the support module 8, after the laser pin 3 is installed, the rubber sleeve 807 is wrapped around the middle of the outer side of the pin 3. Then, according to the distribution spacing of the pin 3, the length of the support rod 805 and the self-stress of the tension spring 804 are adjusted, so that the spacing between the symmetrically distributed sleeve 806 and the cylindrical block 801 just matches the distribution spacing of the pin 3. Then, the sleeve 806 is installed on the outer side of the rubber sleeve 807, and the cylindrical block 801 is fixed by the threaded rod 802 and the magnetic block 803, so that the support module 8 supports the middle part of multiple pins 3, thereby reducing the problem of bending of the pin 3 during installation and disassembly.

[0053] like Figures 8 to 12 As shown, the cooling module 9 includes an outer spiral tube 901, an inner spiral tube 902, a liquid inlet 903, a liquid drain port 904 and a connector 905. The inner side of the outer spiral tube 901 is connected to the inner spiral tube 902. The left side of the lower end of the outer spiral tube 901 is provided with a liquid inlet 903, and the right side of the lower end of the inner spiral tube 902 is provided with a liquid drain port 904. Connectors 905 are symmetrically distributed in the middle of the outer spiral tube 901 and the inner spiral tube 902; the heat conduction module 11 includes a heat conduction shell 111, an embedded ring 112, welding points 113 and heat conduction fins 114. The top of the heat conduction shell 111 is provided with an embedded ring 112, the upper end of the embedded ring 112 is annularly distributed with welding points 113, and the inner side of the heat conduction shell 111 is annularly distributed with heat conduction fins 114.

[0054] The outer spiral tube 901 and the inner spiral tube 902 are connected at the top by docking, the liquid inlet 903 and the outer spiral tube 901 are connected to each other to form an integrated structure, the liquid outlet 904 and the inner spiral tube 902 are connected to each other to form an integrated structure, and the outer spiral tube 901 and the inner spiral tube 902 are supported by symmetrically distributed connecting parts 905 to ensure that there is a gap between the two; the heat-conducting shell 111 and the embedded ring 112 are an integrated structure, and the upper end of the embedded ring 112 is provided with welding points 113 in a ring shape, and the inner side of the heat-conducting shell 111 is welded with heat-conducting fins 114 distributed in a ring shape.

[0055] During operation, the heat conduction module 11 is provided, and the heat conduction fins 114 distributed in an annular manner on the inner side thereof increase the heat dissipation contact area, so as to absorb the heat of the gas heated by the laser chip 5 during operation, and then conduct the heat to the outer cavity through the heat conduction shell 111. At the same time, the liquid inlet pipe 12 provided symmetrically on the left and right can be connected to the output end and the recovery end of the external cooling device. When cooling is required, the coolant in the external cooling device is injected from the liquid inlet pipe 12 on the left side below the tube holder 1, and a part of the coolant will enter the internal cavity of the tube holder 1. The coolant entering the cavity will reach the upper pipe 104 on the left side through the internal passage of the tube holder 1, and then enter the heat sink 4 through heat conduction. The heat is taken away, and the other part of the coolant enters the cooling module 9 along the liquid inlet pipe 12 that passes through the inside of the tube holder 1, and flows into the inner spiral tube 902 along the outer spiral tube 901. Since the inner spiral tube 902 is wrapped around the outside of the heat-conducting shell 111, it absorbs the heat conducted by the heat-conducting shell 111. Then the coolant enters the liquid inlet pipe 12 on the right side below the tube holder 1 from the drain port 904 to complete the discharge work. Compared with the traditional heat dissipation through heat conduction, the new heat dissipation structure has better effect. The overall structure is only optimized and improved on the inside of the existing tube holder 1, the tube cap 2 and the heat sink 4, which will not increase the overall size of the existing laser and improve the performance and service life of the internal components.

[0056] The working principle of the technical solution provided by the present invention is as follows:

[0057] The coaxial packaged laser structure, through the provided pressing module 6, before the laser chip 5, the thermistor and the heat sink 4 are fitted and fixed, first use two specially sized four-corner rods to insert into the slots opened at the top of the left and right button rods 604, and then rotate the button rods 604 in opposite directions, so that the left and right button rods 604 drive the clamping structure formed by the spring pull rod 605, the bar 606, the adjustment rod 607 and the angle plate 608 at the front end to expand to both sides. At the same time, as the button rod 604 drives the rod body 601 to rotate, the spring sheet 602 completes the winding work. After that, after the laser chip 5, the thermistor and the heat sink 4 are fitted and fixed, it is only necessary to rotate the button rod 604. When the rotational force is slowly released, the spring sheet 602, under the action of its own characteristics, will release the ability generated by the winding, and push the expanded clamping structure to close inward, so that the left and right angle plates 608 fit on both sides of the laser chip 5 for clamping. In addition, through the action of the spring pull rod 605, the horizontal structure composed of the strip 606, the adjustment rod 607 and the angle plate 608 can be extended and retracted, and a backward pulling force is generated at the front end of the laser chip 5, so that the laser chip 5, the thermistor and the heat sink 4 fit more firmly and tightly. Without changing the existing installation structure, compared with the traditional method of relying only on fitting reinforcement, it is not easily affected by thermal expansion mismatch and thus causes separation, and is also easier to use. Secondly, the heat conducting module 11 is provided, and the heat conducting fins 114 are distributed in an annular manner on the inner side thereof, which increases the heat dissipation contact area, absorbs the heat of the gas heated by the laser chip 5 during operation, and then conducts the heat to the outer cavity through the heat conducting shell 111. At the same time, the liquid inlet pipe 12 is symmetrically arranged on the left and right, and can be connected to the output end and the recovery end of the external cooling device. When cooling is required, the coolant in the external cooling device is injected from the liquid inlet pipe 12 on the left side below the tube holder 1, and a part of the coolant will enter the internal cavity of the tube holder 1. The coolant in the cavity will reach the upper pipe 104 on the left side through the internal passage of the tube holder 1, and when entering the heat sink 4, the heat sink 4 is cooled by the heat conduction. The heat conducted is taken away by the heat conduction, and the other part of the coolant enters the cooling module 9 along the liquid inlet pipe 12 that passes through the inside of the tube base 1, and flows into the inner spiral tube 902 along the outer spiral tube 901. Since the inner spiral tube 902 is wrapped around the outside of the heat-conducting shell 111, it absorbs the heat conducted by the heat-conducting shell 111. Then the coolant enters the liquid inlet pipe 12 on the right side below the tube base 1 from the drain port 904 to complete the discharge work. Compared with the traditional heat dissipation through heat conduction, the new heat dissipation structure has a better effect. The overall structure is only optimized and improved on the inside of the existing tube base 1, the tube cap 2 and the heat sink 4, which will not increase the overall size of the existing laser and improve the performance and service life of the internal components.After the laser pins 3 are installed, a rubber sleeve 807 is wrapped around the center of the outer side of the pins 3. The length of the support rod 805 and the inherent stress of the tension spring 804 are then adjusted based on the spacing of the pins 3. This ensures that the spacing between the symmetrically distributed sleeves 806 and the cylindrical block 801 matches the spacing of the pins 3. The sleeves 806 are then installed outside the rubber sleeve 807, while the cylindrical block 801 is secured using the threaded rod 802 and magnetic block 803. This allows the support module 8 to support the center of the multiple pins 3, thereby reducing the risk of pin 3 bending during installation and removal.

[0058] The present invention encompasses any alternatives, modifications, equivalents, and solutions that fall within the spirit and scope of the present invention. To provide a thorough understanding of the present invention, specific details are described in detail below in connection with the preferred embodiments of the present invention, but those skilled in the art will be able to fully understand the present invention without these detailed descriptions. Furthermore, to avoid unnecessary confusion regarding the essence of the present invention, well-known methods, processes, procedures, components, and circuits have not been described in detail.

[0059] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A coaxial packaged laser structure, characterized in that: It includes a tube base, a tube cap is provided at the upper end of the tube base, a pin is provided on the inner side of the lower end of the tube base, a heat sink is provided on the rear side of the upper end of the tube base, a laser chip is provided in the middle of the front end of the heat sink, and a holding module is provided on the left and right sides of the front end of the laser chip, a photodiode is provided in the middle of the upper end of the tube base, a support module is installed on the outer end of the pin, a cooling module is provided on the inner side of the tube cap, a lens is embedded in the inner side of the upper end of the tube cap, a heat conduction module is provided on the outer side below the lens, and liquid inlet pipes are symmetrically distributed on the upper and lower sides of the outer end of the tube base; The holding module includes a rod body, a spring sheet, a dial, a button rod, a spring pull rod, a bar, an adjusting rod and an angle plate. Spring sheets are provided on the upper and lower sides of the outer end of the rod, and dials are provided on the upper and lower sides of the outer end of the rod. The upper end of the dial is provided with a button rod, and a spring pull rod is provided on the front side of the outer end of the button rod. A bar is provided on the front side of the spring pull rod, and an adjusting rod is provided on the right side of the outer end of the bar. The right end of the adjusting rod is provided with an angle plate. The rod body, the dial and the button rod are threadedly spliced ​​into a whole. The spring sheet and the spring pull rod are symmetrically distributed up and down. The rear end of the spring pull rod and the front side of the outer end of the button rod are threadedly reinforced, and the front end of the spring pull rod and the rear end of the bar are welded and fixed to each other.

2. The coaxial packaged laser structure according to claim 1, characterized in that: The tube seat includes a seat body, a welding groove, a triangular block, an upper connecting pipe and an inclined groove. A welding groove is provided on the outer side of the upper end of the seat body, a triangular block is symmetrically provided behind the inner side of the welding groove, an upper connecting pipe is provided in the middle of the rear side of the triangular block, and an inclined groove is provided in the middle of the upper end of the seat body.

3. The coaxial packaged laser structure according to claim 1, characterized in that: The pipe cap includes a cap body, an outer clamping block, an inner groove and a sealing ring. The lower end of the cap body is provided with an outer clamping block, the upper inner side of the cap body is provided with an inner groove, and the lower end of the outer clamping block is provided with a sealing ring.

4. The coaxial packaged laser structure according to claim 1, characterized in that: The heat sink includes an inner cavity block, a reinforcement plate, a support block and a lower connecting pipe. Reinforcement plates are provided below the left and right sides of the outer end of the inner cavity block. Support blocks are symmetrically distributed at the lower end of the inner cavity block. The lower connecting pipe is symmetrically distributed in the middle of the lower end of the inner cavity block.

5. The coaxial packaged laser structure according to claim 1, characterized in that: The support module includes a cylindrical block, a threaded rod, a magnetic block, a tension spring, a support rod, a sleeve and a rubber sleeve. The upper end of the cylindrical block is provided with a threaded rod, the inner side of the top of the threaded rod is provided with a magnetic block, the middle part of the outer end of the cylindrical block is symmetrically distributed with a tension spring, the front end of the tension spring is provided with a support rod, the front end of the support rod is provided with a sleeve, and the inner side of the sleeve is provided with a rubber sleeve.

6. The coaxial packaged laser structure according to claim 1, characterized in that: The cooling module includes an outer rotating tube, an inner rotating tube, a liquid inlet, a liquid discharge port and a connecting piece. The inner side of the outer rotating tube is connected to the inner rotating tube. The left side of the lower end of the outer rotating tube is provided with a liquid inlet, and the right side of the lower end of the inner rotating tube is provided with a liquid discharge port. Connectors are symmetrically distributed in the middle of the outer rotating tube and the inner rotating tube.

7. The coaxial packaged laser structure according to claim 1, characterized in that: The heat conduction module includes a heat conduction shell, an embedded ring, welding points and heat conduction fins. The top of the heat conduction shell is provided with an embedded ring, the upper end of the embedded ring is annularly distributed with welding points, and the inner side of the heat conduction shell is annularly distributed with heat conduction fins.

8. The coaxial packaged laser structure according to claim 1, characterized in that: The lower end of the tube cap extends to the inner side of the upper end of the tube base and is welded by energy storage welding. The upper end of the pin penetrates the inner side of the tube base and extends upward. The pin and the inner side of the contact end of the tube base are sealed with each other by a glass ring. The heat sink is an integral structure, wherein the front end structure is rectangular and the rear end structure is arc-shaped. Two through holes are opened in the left and right inside the rectangular structure of the front end, and an inverted U-shaped pipeline cavity is opened in the interior of the arc-shaped structure of the rear end. A thermistor is attached between the heat sink and the laser chip, and two groups of the holding modules are symmetrically distributed on the left and right.

Citation Information

Patent Citations

  • Optical semiconductor device and assembly method

    CN118099926A

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    CN214542913U