Optical module, optical equipment and passive optical network (PON) system

Abstract

The invention provides an optical module, optical equipment and a passive optical network (PON) system, which are used for simplifying the assembly process of the optical module and reducing the assembly cost. By assembling the optical assembly integrated with the first optical element and the second optical element in the optical module, multiplexing of multiple paths of downlink optical signals and separation of uplink optical signals and downlink optical signals can be realized, and the optical module can be assembled before the optical assembly is assembled in the optical module. And a light path between the first optical element and the second optical element is built in the optical assembly. Therefore, after the optical component is assembled on the optical module, only the pose of the optical component in the optical module needs to be adjusted, so that the assembly process is reduced, and the assembly cost is reduced.

Description

Technical Field

[0001] This application relates to the field of optical communication technologies, and particularly to an optical module, an optical device, and a passive optical network (PON) system. Background Art

[0002] Under the overall situation of the full popularization of optical networks, passive optical networks (PONs) are widely used in access optical communication networks. After continuous development of PONs, there are currently two main PON standards. One is the ethernet PON (EPON) standard, and the other is the gigabit PON (GPON) standard. The EPON standard has given rise to EPON and 10G EPON, and the GPON standard has given rise to GPON and XGS-PON. EPON and GPON are usually referred to as the first-generation PONs, and 10G EPON and XGS-PON are referred to as the second-generation PONs. With the completion of the formulation of the next-generation standard, operators of XGS-PON and 10G EPON have both chosen to apply the 50G PON of the International Telecommunications Union - Telecommunication Standardization Sector (ITU-T) to their next-generation access networks. This means that PONs will be unified into the same set of standard systems.

[0003] Operators currently operating first-generation and / or second-generation PONs in the existing network hope to smoothly evolve to 50G PON, that is, they can achieve coexistence of three generations of PONs without replacing the optical network units (ONUs) of the first-generation and / or second-generation, without modifying the optical distribution network (ODN), and only by replacing the printed circuit board assembly (PCBA) and the optical module at the optical line terminal (OLT) end. However, in order to transmit signals of more generations, the optical module in the OLT needs to be assembled with more optical components, which greatly increases the assembly cost of the optical module. Summary of the Invention

[0004] This application provides an optical module, an optical device, and a PON system, which are used to simplify the assembly process of the optical module and reduce the assembly cost.

[0005] In a first aspect, the present application provides an optical module. The optical module includes a housing having a cavity inside. The optical module further includes a first electrical interface, an optical device, and an optical interface. The optical device includes a plurality of optical emission components, a plurality of optical reception components, a demultiplexing component, and an optical component. Among them, the first electrical interface and the optical interface are respectively assembled on the housing, and the optical device is assembled in the cavity. The optical component includes a carrier, a first optical element, and a second optical element. The first optical element and the second optical element are respectively assembled on the carrier. The plurality of optical emission components are configured to receive multiple downstream electrical signals from the first electrical interface and convert the multiple downstream electrical signals into multiple downstream optical signals with different wavelengths. The first optical element is configured to multiplex (or combine) the multiple downstream optical signals into one downstream optical signal. The second optical element is configured to receive the one downstream optical signal and transmit the one downstream optical signal to the optical interface. The second optical element is further configured to receive one upstream optical signal from the optical interface and reflect the one upstream optical signal to the demultiplexing component. The demultiplexing component is configured to demultiplex the one upstream optical signal into multiple upstream optical signals with different wavelengths. The plurality of optical reception components are configured to convert the multiple upstream optical signals into multiple upstream electrical signals and send the multiple upstream electrical signals to the first electrical interface.

[0006] In the existing cavity, a multiplexing component is assembled to multiplex multiple downstream optical signals into one downstream optical signal, and a filter is assembled to separate the upstream optical signal from the downstream optical signal. Generally, both the multiplexing component and the filter include a filter film, and the filtering effect of the filter film is closely related to the incident angle of the optical signal. Therefore, when assembling the multiplexing component and the filter in the optical device, it is necessary to precisely build the optical path between the optical emission component and the multiplexing component, and also precisely build the optical path between the multiplexing component and the filter. The assembly process is complex and the assembly cost is relatively high. For example, it is necessary not only to adjust the pose of the lens between the optical emission component and the multiplexing component, but also to precisely mount or actively couple the filter during the assembly of the filter.

[0007] By assembling the above optical component in the cavity in the present application, not only can the functions of the multiplexing component and the filter be respectively realized by the first optical element and the second optical element, but also, since the first optical element and the second optical element are integrally assembled on the same carrier, it is beneficial to build the optical path between the first optical element and the second optical element before assembling the optical component in the optical module. In this way, after assembling the optical component / carrier in the optical module, only the optical path between the optical emission component and the first optical element needs to be adjusted to meet the requirements of the incident angles of the optical signals for the first optical element and the second optical element, which is beneficial to reducing the assembly process of the optical device and thus beneficial to reducing the assembly cost of the optical module.

[0008] Among them, "downlink" is used to represent the signal transmission direction from the first electrical interface to the optical interface, and "uplink" is used to represent the signal transmission direction from the optical interface to the first electrical interface.

[0009] Optionally, the carrier is used to transmit the one-way downlink optical signal obtained by multiplexing the optical elements to the second optical element.

[0010] In this way, it is beneficial to mount the incident surface or the exit surface of the downlink optical signal on the first optical element and the incident surface or the exit surface of the downlink optical signal on the second optical element on the surface of the carrier. Thus, it is beneficial to process the shape of the carrier according to the relative pose between the first optical element and the second optical element. After the first optical element and the second optical element are respectively mounted on the corresponding surface areas of the carrier, the optical path between the first optical element and the second optical element can be built. This not only simplifies the assembly difficulty of the optical components and reduces the assembly cost, but also, since the mounting area of the optical element and the glass carrier is large, it is beneficial to improve the stability of the mounting position of the optical element on the glass carrier, improve the assembly accuracy, ensure the multiplexing effect of the first optical element on multiple downlink optical signals and the separation effect of the second optical element on the uplink optical signal and the downlink optical signal. Therefore, it is also beneficial to improve the performance of the optical module.

[0011] Optionally, the second optical element is a filter film deposited on the carrier, or the second optical element is a glass sheet with a filter film deposited thereon, and the glass sheet is mounted on the carrier. That is to say, the second filter sheet can be a filter film or a glass sheet with a filter film deposited thereon provided in the light-emitting area of the downlink optical signal on the surface of the carrier, which is beneficial to shortening the optical path of the downlink optical signal in the optical module and reducing the size of the optical module.

[0012] Optionally, the first optical element includes a plurality of filter sheets and one or more reflector sheets. Among them, the filter sheet can be a filter film deposited on the carrier or a glass sheet with a filter film deposited thereon, and the glass sheet can be mounted on the carrier. Among them, the reflector sheet can be a high reflection (HR) film deposited on the carrier or a glass sheet with an HR film deposited thereon, and the glass sheet can be mounted on the carrier.

[0013] Optionally, the carrier is a carrier made of glass.

[0014] The optical module further includes a housing, and the optical device is integrally assembled in the cavity formed by the housing. In this way, it is not only beneficial to ensure the airtightness of the optical module, but also beneficial to reducing the distance between different optical components in the optical device, beneficial to reducing the volume of the optical module, or installing more components in an optical module with a fixed size to support the transmission of data of more generations of PON.

[0015] Optionally, the cavity further includes a first electromagnetic shielding cavity and a second electromagnetic shielding cavity. The electromagnetic shielding cavity can also be simply referred to as the shielding cavity. The shielding cavity can shield the interference between the electromagnetic signals inside the cavity and the electromagnetic signals outside the cavity. The plurality of optical emission components can be assembled in the first shielding cavity, and the plurality of optical reception components can be assembled in the second shielding cavity. In this way, it is beneficial to reduce the crosstalk between the optical emission components and the optical reception components, and ensure the effectiveness and stability of the transceiver of the optical module. Moreover, compared with installing different optical emission components or different optical reception components in different shielding cavities, this is beneficial to reducing the number of shielding cavities in the housing, which is not only beneficial to saving materials, but also beneficial to improving the design freedom in a limited cavity, reducing the size of the optical module, or installing more components in an optical module with a fixed size to support the transmission of data of more generations of PON.

[0016] Optionally, a partition wall is further provided in the cavity. The partition wall and the housing are respectively used to shield electromagnetic interference. The partition wall divides a part or all of the layout space in the cavity into a first shielding cavity and a second shielding cavity. Or rather, the partition wall and the housing jointly form the first electromagnetic shielding cavity and the second electromagnetic shielding cavity. For example, one surface of the partition wall can form a first shielding cavity with a part of the area of the housing, and the other surface of the partition wall can form a second shielding cavity with other parts of the area of the housing.

[0017] In this application, a single partition wall and the housing can form a first shielding cavity and a second shielding cavity in the cavity formed by the housing. In this way, it is beneficial to reduce the isolation materials required to form multiple shielding cavities, beneficial to saving materials, reducing costs, and also beneficial to saving the space of the cavity in the housing, reducing the size of the optical module, or installing more components in an optical module with a fixed size to support the transmission of data of more generations of PON.

[0018] Optionally, the optical interface is used to transmit the downstream optical signal inside the cavity to the outside of the housing, and can also be used to transmit the upstream optical signal outside the housing to the inside of the cavity. Optionally, the optical interface can be an optical fiber adapter.

[0019] Optionally, the first electrical interface includes a plurality of external pins provided outside the housing and a plurality of internal pins provided inside the housing. The plurality of external pins are electrically connected to the plurality of internal pins respectively. The plurality of optical emission components and the plurality of optical reception components can be respectively connected to the plurality of internal pins.

[0020] Optionally, the multiple external pins are disposed outside on the same side of the housing, and the multiple internal pins are disposed inside this side. Compared with the pins connecting different optical components in the first electrical interface being disposed on different sides of the housing, disposing the pins connected to the multiple optical transmitting components and the multiple optical receiving components on the same side of the housing is conducive to reducing the layout space occupied by the first electrical interface in the optical module, thereby facilitating reducing the size of the optical module, or installing more components in an optical module of a fixed size to support the transmission of data of more generations of PON.

[0021] Optionally, the partition wall extends from the side surface into the cavity. In this way, it is conducive to assembling the multiple optical transmitting components and the multiple optical receiving components at a position close to the first electrical interface. This is not only conducive to increasing the length of the optical path between the optical transmitting components and the optical receiving components and reducing optical crosstalk, but also conducive to shortening the length of the connection line between the optical receiving component and the first electrical interface and the length of the connection line between the optical transmitting component and the first electrical interface, so as to reduce the impedance of the connection line and reduce the electrical crosstalk between the upstream electrical signal and the downstream electrical signal.

[0022] Optionally, the multiple upstream electrical signals include at least three upstream electrical signals with different transmission rates. Alternatively, the multiple downstream electrical signals include at least three downstream electrical signals with different transmission rates. Or, the multiple upstream electrical signals include at least three upstream electrical signals with different transmission rates, and the multiple downstream electrical signals include at least three downstream electrical signals with different transmission rates.

[0023] Optionally, the multiple optical transmitting components include a first optical transmitting component and a second optical transmitting component, and the multiple optical receiving components include a first optical receiving component and a second optical receiving component. Among them, the transmission rate of the downstream electrical signal received by the first optical transmitting component is greater than the transmission rate of the downstream electrical signal received by the second optical transmitting component, and the transmission rate of the upstream electrical signal sent by the first optical receiving component may be the same as the transmission rate of the upstream electrical signal sent by the second optical receiving component. Or, the transmission rate of the upstream electrical signal sent by the first optical receiving component is greater than the transmission rate of the upstream electrical signal sent by the second optical receiving component, and the transmission rate of the downstream electrical signal received by the first optical transmitting component may be the same as the transmission rate of the downstream electrical signal received by the second optical transmitting component. Or, the transmission rate of the downstream electrical signal received by the first optical transmitting component is greater than the transmission rate of the downstream electrical signal received by the second optical transmitting component, and the transmission rate of the upstream electrical signal sent by the first optical receiving component is greater than the transmission rate of the upstream electrical signal sent by the second optical receiving component.

[0024] Through experimental analysis, it is found that the greater the signal frequency (i.e., the greater the signal rate), the greater the electrical crosstalk between the optical transmitting component and the optical receiving component. Conversely, the smaller the signal frequency (i.e., the smaller the signal rate), the smaller the electrical crosstalk between the optical transmitting component and the optical receiving component. Moreover, the smaller the distance between the optical transmitting component and the optical receiving component, the greater the crosstalk between them. Conversely, the greater the distance between them, the smaller the crosstalk between them.

[0025] Based on this discovery, the present application proposes that the distance between the first optical transmitting component and the first optical receiving component can be greater than the distance between the second optical transmitting component and the second optical receiving component. In this way, it is beneficial to reduce the crosstalk noise in the electrical signals with a relatively high data transmission rate in the optical device and ensure the communication quality of the optical module.

[0026] Optionally, the distance between the first optical transmitting component and the first optical receiving component is greater than the distance between the second optical transmitting component and the second optical receiving component. This is beneficial to ensure the communication quality of the optical module.

[0027] Optionally, the at least three electrical signals with different transmission rates can be electrical signals of three different generations of PON.

[0028] Optionally, the optical module further includes a second electrical interface and an electrical component. The electrical component is electrically connected to the first electrical interface and the second electrical interface respectively. The second electrical interface can be used to connect the PCBA in the optical device. The electrical component is used to send the multiple downstream electrical signals to the first electrical interface according to the electrical signals received from the second electrical interface, and send electrical signals to the second electrical interface according to the multiple upstream electrical signals received from the first electrical interface.

[0029] In a second aspect, the present application provides an optical device, which includes a printed circuit board assembly PCBA and one or more optical modules as described in the first aspect or any possible manner in the first aspect connected to the PCBA.

[0030] Optionally, the optical device is an optical line terminal OLT or an optical network unit ONU or a forwarding device or a computing device or a storage device.

[0031] In a third aspect, the present application provides a passive optical network PON system, which may include an optical line terminal OLT, an optical distribution network ODN, and one or more optical network units ONU as described in the second aspect. Among them, the OLT is connected to the one or more ONUs through the ODN. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 Schematically showing a possible structure of the PON system;

[0033] Figure 2 Schematically shows a possible structure of a Combo optical module;

[0034] Figure 3-1 and Figure 3-2 Schematically show possible structures of an integrated optical component respectively;

[0035] Figure 4-1 Schematically shows an equivalent structure of the integrated optical component;

[0036] Figure 4-2 Schematically shows Figure 4-1 a possible structure of the Tx / Rx filter 2 in

[0037] Figure 5 Schematically shows the fitting result of the electrical crosstalk between the optical transmitting component and the optical receiving component;

[0038] Figure 6 , Figure 7 and Figure 8 Schematically show a possible structure of the Combo optical module provided by the present application respectively. Detailed implementation manners

[0039] Under the overall situation of the full popularization of the optical network, passive optical network (PON) is widely used in the access optical communication network. Figure 1 Schematically shows the structure of PON. As Figure 1 shown, PON may include an optical line terminal (OLT), an optical distribution network (ODN) and multiple optical network units (ONU). The OLT is connected to multiple ONTs through the ODN, forming a point-to-multipoint PON system network.

[0040] The OLT can establish connections with networks or devices such as the public telephone switching network (PTSN), the Internet or cable television (CATV) through a switch. The structure of the OLT will be introduced later and will not be elaborated here.

[0041] If the ONU provides user port functions at the same time, such as the ONU provides an Ethernet user port or a plain old telephone service (POTS) user port, the ONU can also be called an optical network termination (ONT).

[0042] The ODN includes a passive optical splitter for optical power distribution, a backbone optical fiber connected between the passive optical splitter and the OLT, and a branch optical fiber connected between the passive optical splitter and the ONU.

[0043] As Figure 1 shown, the OLT may include a printed circuit board assembly (PCBA) and an optical module. The PCBA may include a printed circuit board (PCB) and a processing module integrated on the PCB. The optical module has an optical interface (or an optical connector or an optical adapter) and an electrical interface (or an electrical connector). Among them, the optical interface is used to connect the optical fiber, and the electrical interface is used to connect the processing module. The processing module may include one or more electronic components (such as capacitors, resistors, triodes, MOS transistors) and / or one or more chips. The functions of the chips in the processing module are not limited in this application. For example, the processing module includes a media access control (MAC) chip, and the MAC chip can communicate with the optical module through the electrical interface to manage and / or configure the process of the optical module receiving and transmitting optical signals.

[0044] When transmitting data downstream, the processing module sends an electrical signal (referred to as a downstream electrical signal) to the connected optical module, and the optical module converts the downstream electrical signal into an optical signal (referred to as a downstream optical signal). The downstream optical signal is transmitted to each ONU through the ODN. When transmitting data upstream, the optical signal (referred to as an upstream optical signal) sent by the ONU is transmitted to the OLT through the ODN. The optical module in the OLT converts the upstream optical signal into an electrical signal (referred to as an upstream electrical signal) and sends the upstream electrical signal to the processing module.

[0045] Figure 1 Schematically shows an optical module in the OLT. Optionally, multiple optical modules may be provided in the OLT, and the processing module is respectively connected to the multiple optical modules.

[0046] Through the continuous development of PON, there are currently two main PON standards: Ethernet Passive Optical Network (EPON) and Gigabit Passive Optical Network (GPON). The EPON standard has evolved into EPON and 10G EPON, while the GPON standard has evolved into GPON and XGS-PON. EPON and GPON are generally referred to as first-generation PON, while 10G EPON and XGS-PON are second-generation PON. With the completion of the next-generation 10G PON standard, operators of XGS-PON and 10G EPON have chosen to adopt the ITU-T's 50G PON for their next-generation access networks. This means that PON will eventually converge on a common set of standards.

[0047] Operators who are currently operating first-generation and / or second-generation PON networks hope to smoothly evolve to 50GPON, that is, they can achieve the coexistence of three generations of PON by simply replacing the PCBA and optical modules at the OLT end without replacing the first-generation and / or second-generation ONUs or changing the ODN. Figure 1 As shown in the figure, the same PON can include GPON ONU, XGS-PON ONU and 50G PON ONU, which requires the processing module and optical module in the OLT to support three generations of PON technology.

[0048] like Figure 1 As shown, this application refers to the optical module that supports multiple generations of PON technologies as a combination (Combo) optical module. The following uses the Combo optical module that supports three generations of PON standards: GPON, XGS-PON, and 50G PON as an example. Figure 2 The following diagram schematically shows a possible structure of a Combo optical module. Figure 2 As shown in the figure, to support GPON, XGS-PON, and 50GPON, Combo optical modules generally include GPON optical components, XGS-PON optical components, and 50G PON optical components, respectively, for transmitting signals of the corresponding generations. In addition, for single-fiber bidirectional optical modules, the optical components of each generation include the corresponding generation of optical transmitter components (denoted as Tx) and optical receiver components (denoted as Rx).

[0049] In general, different generations of optical components not only have different signal transmission rates but also different optical signal wavelengths. Furthermore, within the same generation, the wavelength of the optical signal transmitted by the optical transmitter (called the downstream wavelength) and the wavelength of the optical signal received by the optical receiver (called the upstream wavelength) are also generally different. For example, the upstream and downstream wavelengths corresponding to GPON, XGS-PON, and 50GPON are shown in Table 1.

[0050] Table 1

[0051] Downlink wavelength (nm) Uplink wavelength (nm) GPON 1480～1500 1290～1330 XGS-PON 1575～1581 1260～1280 50G PON 1340～1344 1284～1288

[0052] For ease of description, in this application, the downstream wavelengths of GPON, XGS-PON, and 50G PON are denoted as λ1, λ2, and λ3 respectively, and the upstream wavelengths of GPON, XGS-PON, and 50G PON are denoted as λ4, λ5, and λ6 respectively.

[0053] PON belongs to a system with coexisting upstream and downstream signals and uses a single-fiber bidirectional optical component to transmit optical signals. Therefore, an optical path adjustment component also needs to be provided in the optical device of the OLT. For example, the optical path adjustment component may include a multiplexing component, and the multiplexing component is used to multiplex multiple downstream optical signals into one downstream optical signal. For example, the optical path adjustment component may include a demultiplexing component, and the demultiplexing component is used to demultiplex one upstream optical signal received from the optical interface into multiple upstream optical signals. For example, the optical path adjustment component may include a Tx / Rx filter, and the Tx / Rx filter is used to separate the upstream optical signal and the downstream optical signal.

[0054] In order to transmit more generations of signals, more generations of optical components need to be assembled in the Combo optical module, increasing the difficulty of optical path design, which results in a higher assembly cost of the Combo optical module.

[0055] By analyzing the structures of the multiplexing component and the Tx / Rx filter, it is found that generally one or more filter films are installed in both of them. Based on the wavelength, the filter film selectively reflects or transmits the optical signal (i.e., filtering). In this way, the multiplexing component and the Tx / Rx filter can achieve their respective functions. Moreover, the filtering effect of the filter film is closely related to the incident angle of the optical signal. For the convenience of description, in this application, the filter film in the multiplexing component is called the first filter film, the filter film in the Tx / Rx filter or the Tx / Rx filter itself is called the second filter film, the required incident angle of the first filter film is called the first incident angle, and the required incident angle of the second filter film is called the second incident angle. The first incident angle and the second incident angle may be the same or different. The required incident angle of the filter film may be the central angle of the filter film or any angle within the passband range of the filter film. To ensure the multiplexing effect of the multiplexing component on multiple downstream optical signals and the separation effect of the Tx / Rx filter on the upstream and downstream optical signals, it is not only required that the downstream optical signal is incident on the first filter film at the first incident angle, but also required that the downstream optical signal emerging from the first filter film is incident on the second filter film at the second incident angle. For example, after assembling the multiplexing component into the Combo optical module, not only is it necessary to adjust the lens between the optical transmitting component and the first filter film so that the downstream optical signal is incident on the first filter film at the first incident angle, but also during the assembly of the Tx / Rx filter, precise mounting or active coupling of the Tx / Rx filter is required to ensure that the downstream optical signal emerging from the first filter film is incident on the second filter film at the second incident angle.

[0056] To reduce the assembly cost of the Combo optical module, based on the above findings, this application provides an integrated optical component. In this integrated optical component, a first optical element for implementing the function of the multiplexing component is integrally provided, and a second optical element for implementing the function of the Tx / Rx filter is also integrally provided. Among them, the first optical element may include one or more filter films (called the first filter film), and the second optical element may include at least one filter film (called the second filter film). In this way, it is beneficial to set up the optical path between the first filter film and the second filter film before assembling the integrated optical component into the Combo optical module. For example, the optical signal incident on the first filter film at the first incident angle is made to be incident on the second filter film at the second incident angle after emerging from the first filter film.

[0057] In this way, after assembling the integrated optical component into the Combo optical module, only by adjusting the downstream optical signal to be incident on the first filter film at the first incident angle, it can be ensured that the downstream optical signal emerging from the first filter film is incident on the second filter film at the second incident angle, reducing the assembly process, which is thus beneficial to reducing the assembly cost.

[0058] Optionally, the first optical element and the second optical element can be integrally disposed on the same carrier. In this way, it is beneficial to set up the optical path between the first optical element and the second optical element on the carrier, and then assemble the carrier into the Combo optical module. Next, only by adjusting the downlink optical signal to be incident on the first filter at the first incident angle, the downlink optical signal exiting from the first filter can be incident on the second filter at the second incident angle, reducing the assembly process, and thus facilitating the reduction of the assembly cost.

[0059] Optionally, the carrier can be a substrate made of a light-impermeable (or non-light-transmitting) material, and the first optical element and the second optical element can be integrally disposed on the substrate. The present application does not limit the material of the substrate. For example, the substrate material can include at least one of metal, ceramic, and resin. The downlink optical signal can be transmitted between different optical elements through the air above the substrate. By accurately assembling each optical element at the corresponding assembly position on the substrate, it is beneficial to make the optical signal incident on the first filter at the first incident angle and, after exiting from the first filter, incident on the second filter at the second incident angle.

[0060] Determining the assembly positions of the first optical element and the second optical element on the substrate only helps to determine the relative positions between the first optical element and the second optical element. During the assembly process, the relative angle (or attitude) between the first optical element and the second optical element also needs to be adjusted, which not only increases the assembly complexity but also has a lower assembly accuracy.

[0061] Optionally, the carrier can be a carrier made of glass (abbreviated as glass carrier). Since the glass carrier can transmit optical signals, it is beneficial to mount the downlink optical signal on the surface of the glass carrier at the incident surface or the exit surface of the optical element, and transmit the downlink optical signal between different optical elements through the glass carrier. Different optical elements can be disposed in different surface regions of the glass carrier. For the convenience of description, the surface region of the glass carrier for setting the first optical element in the present application is referred to as the first surface region, and the surface region of the glass carrier for setting the second optical element is referred to as the second surface region.

[0062] In this way, the shape of the glass carrier can be processed according to the relative position and pose between the first optical element and the second optical element. For example, the relative position and relative angle between the first surface area and the second surface area of the glass carrier meet the assembly requirements of the first optical element and the second optical element. After that, only by mounting the first optical element and the second optical element on the corresponding surface areas respectively, the optical path between the first optical element and the second optical element can be established, so that the optical signal incident on the first filter at the first incident angle is incident on the second filter at the second incident angle after exiting the first filter. In this way, not only the assembly accuracy is improved, ensuring the multiplexing effect of the first optical element on the multiple downlink optical signals and the separation effect of the second optical element on the uplink optical signals and the downlink optical signals, but also, due to the large mounting area between the optical element and the glass carrier, it is beneficial to improve the stability of the mounting position of the optical element on the glass carrier, and thus beneficial to improve the reliability and performance of the integrated optical component.

[0063] After the downlink optical signal passes through the first filter, it is incident on the glass carrier from the first surface area of the glass carrier, and after being transmitted by the glass carrier, it exits from its second surface area to the second filter. By adjusting the shape of the glass carrier, the angle between the plane where the second surface area is located and the plane where the first surface area is located can be changed, which is beneficial to making the optical signal incident on the first filter at the first incident angle be incident on the second filter at the second incident angle after exiting the first filter.

[0064] Figure 3-1 And Figure 3-2 Figure 1 and Figure 2 respectively schematically show a possible structure of the integrated optical component. To facilitate the understanding of the structure and function of the integrated optical component, the present application disassembles the integrated optical component into Figure 4-1 the multiplexing component 1 and the Tx / Rx filter 2 of the "z"-shaped block (z-block) type shown in Figure 3.

[0065] As Figure 4-1 shown in Figure 4, the multiplexing component 1 includes a glass carrier 11. Three different areas of the surface 111 of the glass carrier 11 are respectively coated with filtering films 111a, 111b, and 111c, and two different areas of the surface 112 of the glass carrier 11 are respectively coated with a high reflection (HR) film 112a and an anti-reflection (AR) film 112b. The filtering film 111a is used to transmit the optical signal with a wavelength of λ1 and reflect the optical signals with wavelengths of λ2 and λ3. The filtering film 111b is used to transmit the optical signal with a wavelength of λ2 and reflect the optical signal with a wavelength of λ3. The filtering film 111c is used to transmit the optical signal with a wavelength of λ3.

[0066] The paths of the optical beams with different wavelengths in the multiplexing component 1 are in a zigzag shape, thus achieving optical beam combination. Specifically, the downstream optical signal (denoted as O1) with a wavelength of λ1 emitted by GPON Tx is incident on the filter film 111a at a first incident angle, and then the filter film 111a and the AR film can sequentially transmit the downstream optical signal O1. The downstream optical signal (denoted as O2) with a wavelength of λ2 emitted by XGS-PON Tx is incident on the filter film 111b at a first incident angle, and the filter film 111b can transmit the downstream optical signal O2. Then, the HR film and the filter film 111a can sequentially reflect the downstream optical signal O2, and then the AR film can transmit the downstream optical signal O2. The downstream optical signal (denoted as O3) with a wavelength of λ3 emitted by 50GPON Tx is incident on the filter film 111c, and the filter film 111c can transmit the downstream optical signal O3. Then, the HR film, the filter film 111b, the HR film and the filter film 111a sequentially reflect the downstream optical signal O3, and then the AR film can transmit the downstream optical signal O3. The downstream optical signals O1, O2 and O3 transmitted by the AR film are combined into one downstream optical signal (denoted as Ot). Therefore, it can be considered that the surface area of the glass carrier 11 coated with the AR film is the light outlet of the downstream optical signal on the glass carrier 11.

[0067] The downstream optical signal Ot is incident on the Tx / Rx filter 2 at a second incident angle, and the Tx / Rx filter 2 transmits it. The transmitted downstream optical signal Ot can be incident on the optical interface and then transmitted to the opposite end through the optical fiber connected to the optical interface.

[0068] The optical fiber can also transmit the upstream optical signal (denoted as Or) sent by the opposite end to the optical interface. The upstream optical signal can include optical signal components with wavelengths of λ4, λ5 and λ6. Then, the upstream optical signal Or can be incident on the Tx / Rx filter 2, and the Tx / Rx filter 2 reflects it, thus separating the upstream optical signal Or and the downstream optical signal Ot.

[0069] As Figure 4-2 shown, the Tx / Rx filter 2 can include a glass sheet 21 and a filter film 22, and the filter film 22 is coated on one surface (referred to as the third surface area) of the glass sheet 21. The other surface (referred to as the fourth surface area) of the glass sheet 21 is mounted on the glass carrier 11. The third surface area is, for example, the surface area for receiving the upstream optical signal, and the fourth surface area is, for example, the surface area for receiving the downstream optical signal. The glass sheet 21 can be a single integrally formed glass sheet, or can be obtained by pasting multiple glass sheets.

[0070] Figure 3-1 The integrated optical component shown can be understood as obtained by replacing the Figure 4-1 shown AR film with the Tx / Rx filter 2. Figure 3-1In this case, the glass carrier 11 can be understood with reference to the glass carrier mentioned above. The filtering films 111a, 111b, and 111c can be understood with reference to the first filter mentioned above. Each surface area of the glass carrier 11 coated with the filtering films 111a, 111b, and 111c can be understood with reference to the first surface area mentioned above. The Tx / Rx filter 2 can be understood with reference to the second filter mentioned above. The surface area of the glass carrier 11 where the glass sheet 21 is attached can be understood with reference to the second surface area mentioned above.

[0071] The fourth surface area of the glass sheet 21 can be attached to the glass carrier 11. After the combined downstream optical signal Ot exits the glass carrier, the glass sheet 21 can transmit it to the surface of the filtering film 22. In this way, by adjusting at least one of the shape, material, and structure of the glass sheet 21, etc., the incident angle of the downstream optical signal Ot on the filtering film 22 can be adjusted to ensure that the downstream optical signal Ot is incident on the filtering film 22 at the second incident angle. For example, by setting the third surface area and the fourth surface area of the glass sheet 21 as two non-parallel planes, it is beneficial to make the incident angle of the downstream optical signal Ot on the filtering film 22 different from its incident angle on the third surface area.

[0072] Figure 3-2 The integrated optical component shown can be understood as obtained by replacing the Figure 4-1 AR film shown with the filtering film 22 on the Tx / Rx filter 2. Figure 3-2 In this case, the glass carrier 11 can be understood with reference to the glass carrier mentioned above. The filtering films 111a, 111b, and 111c can be understood with reference to the first filter mentioned above. Each surface area of the glass carrier 11 coated with the filtering films 111a, 111b, and 111c can be understood with reference to the first surface area mentioned above. The filtering film 22 can be understood with reference to the second filter mentioned above. The surface area of the glass carrier 11 coated with the filtering film 22 can be understood with reference to the second surface area mentioned above.

[0073] Since there is no need to coat the surface of the glass sheet 21 and then attach the glass sheet 21 to the glass carrier 11, the number of materials and the production process for assembling the integrated optical component are reduced. This not only helps to reduce costs but also helps to improve the accuracy of the incident angle of the downstream optical signal on the filtering film 22, thereby improving the accuracy of separating the downstream optical path and the upstream optical path of the integrated optical component and is beneficial to improving the product performance.

[0074] In addition to the first optical element mentioned above, which includes the first filter (such as filter films 111a, 111b, and 111c), other optical elements may also be included, such as HR 112a. The filter films 111a, 111b, 111c, and HR 112a together combine multiple downlink optical signals into one downlink optical signal. The multiple optical signals mentioned in this application may refer to multiple optical signals transmitted simultaneously or multiple optical signals transmitted in a time-division manner.

[0075] After assembling the glass carrier 11 into the Combo optical module, by adjusting the lens, the optical paths of the downlink optical signals are adjusted to be incident on the filter films 111a, 111b, and 111c at the first incident angle respectively, which can ensure that the combined downlink optical signal is incident on the filter film 22 at the second incident angle, reducing the assembly process, and thus being beneficial to reducing the assembly cost.

[0076] The size of the layout space in the Combo optical module is usually fixed. For example, considering the forward compatibility of the access device, the package form of the Combo optical module is likely to be the same as that of the previous generation optical module, that is, maintaining the small form factor pluggable (SFP) package form. In the case of limited layout space in the Combo optical module, to achieve an increase in functions, it poses challenges to the optical path design in the optical module.

[0077] By comparing Figure 3-1 and Figure 4-1 or comparing Figure 3-2 and Figure 4-1 It can be seen that compared with setting the second filter at other positions outside the glass carrier, setting the second filter and the first filter on the same surface of the glass carrier is beneficial to saving the layout space in the Combo optical module, thus facilitating the assembly of more optical devices in the limited layout space of the Combo optical module, achieving the miniaturization of the Combo optical module, and being beneficial to reducing the difficulty of the optical path design and the assembly cost of the Combo optical module.

[0078] The materials of the glass carrier and the glass sheet mentioned in this application can be replaced with other materials for transmitting optical signals, and the filter film mentioned in this application can also be called a thin film filter.

[0079] In Figure 2 In the shown Combo optical module, each optical component is respectively encapsulated in a transistor-outline (TO)-type package, and different optical components are encapsulated in different TO-type packages. As Figure 2As shown, GPONRx, XGS-PON Rx, 50GPON Rx, GPON Tx, XGS-PON Tx, and 50G PON Tx are encapsulated in six TO-type packages. The six TO-type packages and the optical interfaces are respectively arranged in seven through holes of a seven-way connector body, and the optical path adjustment component is arranged in the cavity within the connector body.

[0080] In Figure 2 the shown Combo optical module, due to the large volume of each package and the large number of packages, it is difficult to miniaturize the Combo optical module.

[0081] This application proposes to encapsulate the Combo optical module using a box (BOX)-type encapsulation method.

[0082] Encapsulate each optical component in the Combo optical module within the housing of the same box (BOX). In this way, it is not only beneficial to ensure the airtightness of the optical module, but also beneficial to reduce the distance between different optical components, which is beneficial for the Combo optical module to transmit signals of more generations of PON in a smaller size.

[0083] This application does not limit the shape and material of the housing. Optionally, the housing can be used to shield the electrical crosstalk and / or optical crosstalk between the inside and outside of the housing. Herein, the inside of the housing can refer to the cavity formed by the housing, and the outside of the housing can refer to the outside of the cavity formed by the housing. For example, the material of the housing can include metal. Optionally, the material of the housing can also include non-metallic materials, such as ceramics and / or resins. By way of example, the housing can be obtained through ceramic metallization technology by appropriately coating a metal layer that can be firmly bonded to its sealing surface on the ceramic to obtain the housing.

[0084] Through analysis, it is found that the electrical crosstalk between the optical emission component and the optical reception component mainly comes from the electromagnetic interference between the bonding wires or leads (bonding) in the optical emission component and the leads (bonding) in the optical reception component, and the optical crosstalk between the optical emission component and the optical reception component mainly comes from the interference of the optical signal emitted by the optical emission component on the optical reception component. Through comparative experiments, it is found that the crosstalk between different optical emission components is much smaller than the crosstalk between the optical emission component and the optical reception component, and there is a small difference between the crosstalk between different optical emission components when different optical emission components are arranged in different shielding cavities and the crosstalk between different optical emission components when different optical emission components are arranged in the same shielding cavity.

[0085] Therefore, this application proposes that in the internal cavity of the BOX, GPON Tx, XGS-PON Tx, and 50GPON Tx can be integrated within the same shielded cavity (referred to as the first shielded cavity). In this way, it is beneficial to reduce the distance between different optical emission components, decrease the volume of the optical module, and moreover, it is beneficial to reduce the number of shielded cavities, lower the material complexity, and improve the design freedom.

[0086] Moreover, in the internal cavity of the BOX, GPON Rx, XGS-PON Rx, and 50GPON Rx are arranged in other shielded cavities outside the first shielded cavity. In this way, it is beneficial to reduce the crosstalk between the optical emission components and the optical reception components, and ensure the effectiveness and stability of the optical module's transmission and reception.

[0087] Through comparative experiments, it is found that the crosstalk between different optical reception components is much smaller than the crosstalk between the optical emission components and the optical reception components. Moreover, when different optical reception components are arranged in different shielded cavities, the crosstalk between different optical reception components has a relatively small difference compared with the crosstalk between different optical reception components when they are arranged in the same shielded cavity.

[0088] Therefore, this application proposes that in the internal cavity of the BOX, GPON Rx, XGS-PON Rx, and 50GPON Rx can be integrated within the same shielded cavity (referred to as the second shielded cavity). In this way, it is beneficial to reduce the distance between different optical reception components, decrease the volume of the optical module, and moreover, it is beneficial to reduce the number of shielded cavities, lower the material complexity, and improve the design freedom.

[0089] Moreover, in the internal cavity of the BOX, GPON Tx, XGS-PON Tx, and 50G PON Tx are arranged in other shielded cavities outside the second shielded cavity. In this way, it is beneficial to reduce the crosstalk between the optical emission components and the optical reception components, and ensure the effectiveness and stability of the optical module's transmission and reception.

[0090] Optionally, in the internal cavity of the BOX, GPON Tx, XGS-PON Tx, and 50G PON Tx can be integrated within the first shielded cavity, and GPON Rx, XGS-PON Rx, and 50GPON Rx can be integrated within the second shielded cavity. In this way, it is beneficial to decrease the volume of the optical module, reduce the number of shielded cavities, lower the material complexity, and improve the design freedom. Moreover, it is beneficial to reduce the crosstalk between the optical emission components and the optical reception components, and ensure the effectiveness and stability of the optical module's transmission and reception.

[0091] This application proposes that a partition wall (or baffle) is provided in the internal cavity of the BOX. The partition wall and the BOX housing respectively form a first shielding cavity and a second shielding cavity. On the basis of reusing the BOX housing, only by adding a partition wall can the first shielding cavity and the second shielding cavity be formed. In this way, it is beneficial to save the space of the internal cavity of the BOX, reduce the volume of the BOX, and is also beneficial to reducing the material complexity and cost.

[0092] This application does not limit the material of the partition wall, as long as the partition wall can shield electrical crosstalk and / or optical crosstalk. In this way, the shielding cavity can be used to shield the electrical crosstalk and / or optical crosstalk between the inside and outside of the shielding cavity. The material of the partition wall can refer to the material of the housing introduced above and will not be elaborated here. Later, a metal partition wall is taken as an example. This application does not limit the thickness and shape of the partition wall. For example, the partition wall can be a planar wall.

[0093] The BOX housing generally has multiple sides. An electrical interface can be provided on one side of the BOX housing (referred to as the first side), and the electrical interface is used to connect a plurality of optical transmitting components and a plurality of optical receiving components respectively. Compared with setting a plurality of electrical interfaces on multiple sides of the housing and connecting different electrical components to different electrical interfaces, setting the electrical interfaces connected to the plurality of optical transmitting components and the plurality of optical receiving components on the same side of the housing is beneficial to reducing the layout space occupied by the electrical interfaces in the optical module and reducing the volume of the optical module.

[0094] The metal partition wall can extend from the first side into the internal cavity of the housing, which is beneficial to the metal partition wall dividing the housing on the first side into a first housing area and a second housing area. Among them, the first housing area can be used to form a first shielding cavity with the metal partition wall, and the second housing area can be used to form a second shielding cavity with the metal partition wall. In this way, it is beneficial to assemble the plurality of optical transmitting components and the plurality of optical receiving components at positions close to the first side in the cavity to reduce optical crosstalk and electrical crosstalk, and is also beneficial to shortening the length of the connection line between the optical component and the electrical interface and reducing electrical crosstalk.

[0095] The distances between different optical transmitting components and the metal partition wall can be different. In this way, it is beneficial to assemble each optical transmitting component at a position close to the electrical interface, shorten the length of the connection line between each optical transmitting component and the electrical interface, and reduce electrical crosstalk.

[0096] Similarly, the distances between different optical receiving components and the metal partition wall can be different. In this way, it is beneficial to assemble each optical receiving component at a position close to the electrical interface, shorten the length of the connection line between each optical receiving component and the electrical interface, and reduce electrical crosstalk.

[0097] The first side surface can be perpendicular to the metal isolation wall. Optionally, the multiple optical emission components and the multiple optical reception components can be arranged in sequence in a direction perpendicular to the metal isolation wall.

[0098] Each optical emission component can emit a downlink optical signal in a direction parallel to the metal isolation wall, and each optical reception component can receive an uplink optical signal in a direction parallel to the metal isolation wall.

[0099] In order to further reduce the electrical crosstalk between the optical emission components and the optical reception components, based on the design of comparative experiments and the analysis of the fitting results of the experiments, the present application proposes that the relative positions between different optical reception components and / or the relative positions between different optical emission components can be determined according to the rate of the signals transmitted by the optical components.

[0100] An optical emission component and an optical reception component are respectively arranged at two positions with a first spacing within the housing. By changing the frequency (frequency, Freq) of the signals transmitted by the two, the intensity of the electrical crosstalk between the two is detected. The unit of the intensity of the electrical crosstalk is dB. The fitting result is as Figure 5 shown by curve 1. An optical emission component and an optical reception component are respectively arranged at two positions with a second spacing within the housing. By changing the frequency of the signals transmitted by the two, the electrical crosstalk between the two is detected. The fitting result is as Figure 5 shown by curve 2. Among them, the first spacing is greater than the second spacing. The smaller the signal frequency, the generally smaller the signal rate. Conversely, the larger the signal frequency, the generally larger the signal rate. For example, when the signal frequency is 28 GHz, the signal rate is close to 50 Gbps (i.e., the signal rate of the third-generation PON). The signal frequencies corresponding to the signal rates of the first-generation PON and the second-generation PON generally do not exceed 5 GHz.

[0101] By observing curve 1 and curve 2, it can be seen that when the signal frequency does not exceed 28 GHz (i.e., the signal rate does not exceed 50 Gbps), the larger the signal frequency (i.e., the larger the signal rate), the greater the electrical crosstalk between the optical emission component and the optical reception component. Conversely, the smaller the signal frequency (i.e., the smaller the signal rate), the smaller the electrical crosstalk between the optical emission component and the optical reception component. And, the electrical crosstalk between the Rx and Tx of the third generation is much higher than that between the Rx and Tx of the other two generations.

[0102] By comparing curve 1 and curve 2, it can be seen that for the same signal frequency (i.e., the same signal rate), the smaller the spacing between the optical emission component and the optical reception component, the greater the crosstalk between the two. Conversely, the larger the spacing between the two, the smaller the crosstalk between the two. That is to say, by increasing the spacing between the optical emission component and the optical reception component, it is beneficial to reduce the electrical crosstalk between the two.

[0103] Based on the conclusions drawn from the above analysis, the present application proposes that the distance between the optical transmitter component with the highest signal transmission rate (such as 50G PON Tx) and the metal isolation wall can be greater than the distance between other optical transmitter components and the metal isolation wall, and the distance between the optical receiver component with the highest signal transmission rate (such as 50G PON Rx) and the metal isolation wall can be greater than the distance between other optical receiver components and the metal isolation wall. In this way, it is beneficial to increase the distance between the Rx and Tx of the third generation, reduce the electrical crosstalk between them, and ensure the signal quality of the signals transmitted by the optical module.

[0104] Optionally, for any two optical transmitter components in the optical module that transmit signals at different rates, the distance between the optical transmitter component with a higher signal transmission rate and the metal isolation wall can be greater than the distance between the optical transmitter component with a lower signal transmission rate and the metal isolation wall. Similarly, for any two optical receiver components in the optical module that transmit signals at different rates, the distance between the optical receiver component with a higher signal transmission rate and the metal isolation wall can be greater than the distance between the optical receiver component with a lower signal transmission rate and the metal isolation wall. That is to say, for multiple optical components in any shielding cavity, they are arranged in the form that the low-speed components are centered and close to the isolation wall, and the high-speed components are on the side (i.e., far from the isolation wall or close to the side wall of the package) to achieve a higher channel electrical isolation degree.

[0105] The above introduces the inventive concept of the optical module provided by the present application. In practical applications, a Combo optical module can be prepared by selecting some or all of the above inventive concepts as needed. The Combo optical module that supports the first-generation PON, the second-generation PON, and the third-generation PON can also be called a 50G PON triple-mode optical module. The following gives an example of the possible structure of the 50G PON triple-mode optical module.

[0106] Figure 6 Schematically shows a possible structure of a 50G PON triple-mode optical module based on the BOX package form. As Figure 6 shown, each optical component in the optical module is assembled in the same BOX housing (or package), and a metal isolation wall is provided in this housing. The metal isolation wall and the housing respectively form a first shielding cavity and a second shielding cavity. GPON Tx, XGS-PON Tx, and 50GPON Tx are assembled in the first shielding cavity, and GPON Rx, XGS-PON Rx, and 50GPON Rx are assembled in the second shielding cavity. The metal isolation wall is beneficial to shielding the optical crosstalk and electrical crosstalk between the optical receiver component and the optical transmitter component. As Figure 6 shown, each optical transmitter component and optical receiver component are all assembled on the same side of the housing (i.e., Figure 6 the left side), which is beneficial to setting the electrical interface of the optical module on the left side of the housing. As Figure 6As shown, a demultiplexing component, the integrated optical component provided by the present application, and an optical interface are further provided inside the BOX housing. The present application does not limit the assembly positions of the demultiplexing component and the integrated optical component in the housing. Figure 6 Taking the demultiplexing component being assembled in the second shielding cavity and the integrated optical component being assembled in the layout space inside the housing except for the first shielding cavity and the second shielding cavity as an example.

[0107] Based on Figure 6 The structure shown, the present application also provides a method. GPON Tx, XGS-PON Tx, and 50GPON Tx receive three downstream electrical signals from the electrical interface and convert the three downstream electrical signals into three downstream optical signals with different wavelengths. For example, GPON Tx receives an electrical signal of 2.5 Gbps from the electrical interface and converts the electrical signal into an optical signal with a wavelength of λ1. XGS-PON Tx receives an electrical signal of 10 Gbps from the electrical interface and converts the electrical signal into an optical signal with a wavelength of λ2. 50G PON Tx receives an electrical signal of 50 Gbps from the electrical interface and converts the electrical signal into an optical signal with a wavelength of λ3. The integrated optical component receives 3 downstream optical signals and multiplexes the 3 downstream optical signals into one downstream optical signal (or called a multiplexed signal or a combined wave signal), and the integrated optical component is also used to transmit this one downstream optical signal to the optical interface. The integrated optical component is also used to receive one upstream optical signal from the optical interface. Based on the foregoing introduction, the integrated optical component not only has a multiplexing function but also has the function of separating the upstream optical signal and the downstream optical signal. Therefore, the integrated optical component can transmit this one upstream optical signal to the demultiplexing component instead of transmitting the upstream optical signal to the optical transmitting component. This one upstream optical signal can be a multiplexed signal of three upstream optical signals, and the wavelengths of the three upstream optical signals can be λ4, λ5, and λ6 respectively, and the transmission rates of the three upstream optical signals are 2.5 Gbps, 10 Gbps, and 50 Gbps respectively. The demultiplexing component can demultiplex three upstream optical signals with different wavelengths from this one upstream optical signal, and the wavelengths of the three upstream optical signals are, for example, λ4, λ5, and λ6 respectively. GPON Rx, XGS-PON Rx, and 50GPON Rx convert the multiple upstream optical signals into multiple upstream electrical signals and send the multiple upstream electrical signals to the electrical interface. For example, GPON Rx converts the upstream optical signal with a wavelength of λ4 into an electrical signal of 2.5 Gbps and sends this electrical signal to the electrical interface. XGS-PON Rx converts the upstream optical signal with a wavelength of λ5 into an electrical signal of 10 Gbps and sends this electrical signal to the electrical interface. GPON Rx converts the upstream optical signal with a wavelength of λ6 into an electrical signal of 50 Gbps and sends this electrical signal to the electrical interface.

[0108] Figure 7 Schematically shows another possible structure of a 50G PON triple-mode optical module in the form of a BOX. AsFigure 7 As shown, the inside of the housing is hermetically sealed. The housing can be made of a ceramic-metallized material. The optical interface and the electrical interface are located at opposite ends of the ceramic-metallized package. The end with the electrical interface is called the first end, and the end with the optical interface is called the second end. A metal partition wall is provided inside the housing. The metal partition wall extends from the first end to the second end, jointly forming a first shielding cavity and a second shielding cavity with the housing. Moreover, there is a layout space for the optical components left between the metal partition wall and the second end.

[0109] GPON Tx, XGS-PON Tx, and 50GPON Tx are sequentially assembled in the first shielding cavity along a direction perpendicular to the metal partition wall. GPON Rx, XGS-PON Rx, and 50GPON Rx are sequentially assembled in the second shielding cavity along a direction perpendicular to the metal partition wall. This not only helps to reduce the layout space occupied by the optical transmitting components and optical receiving components in the housing but also helps to reduce the crosstalk between the optical transmitting components and the optical receiving components, ensuring the effectiveness and stability of the optical module's transceiver. The three-way Tx and the three-way Rx are both arranged on the side close to the first end to connect to the electrical interface respectively.

[0110] As Figure 7 shown, the integrated optical component can be assembled in the first shielding cavity. For each downstream optical signal, a collimating lens 3 and / or an isolator 4 can also be assembled on the optical path between the Tx and the filter films 111a, 111b, and 111c in the integrated optical component. As Figure 7 shown, the collimating lens 3 and the isolator 4 can be assembled in the first shielding cavity. Figure 7 Taking the integrated optical component as Figure 3-1 shown as an example. The structure of the integrated optical component and the functions of each optical element can refer to Figure 3-1 the relevant description, which will not be elaborated here.

[0111] As Figure 7 shown, the demultiplexing component 9 can be assembled in the second shielding cavity. For each upstream optical signal, a converging lens 11 and / or an isolator 10 can also be assembled on the optical path between the Rx and the demultiplexing component. As Figure 7 shown, the converging lens 11 and the isolator 15 can be assembled in the second shielding cavity.

[0112] As Figure 7 shown, a deflection element 5, a lens 6, a deflection element 7, and a deflection element 8 can also be assembled inside the housing. The deflection element 5 is used to deflect the propagation directions of the upstream optical signal and the downstream optical signal. The lens 6 is used to converge the downstream optical signal and collimate the upstream optical signal on the optical path between the deflection element 5 and the optical interface. The deflection elements 7 and 8 are respectively used to deflect the propagation direction of the upstream optical signal.

[0113] As shown Figure 7 in the figure, GPON Tx, XGS-PON Tx, and 50G PON Tx respectively receive electrical signals from electrical interfaces and emit a downstream optical signal. After the three downstream optical signals are collimated by lens 2 respectively, they are transmitted to the filter films 111a, 111b, and 111c on the integrated optical component through isolator 3 respectively. Filter films 111a, 111b, 111c, and HR film 112a multiplex the three downstream optical signals into one downstream optical signal, and filter 2 transmits this downstream optical signal to the optical interface. This application does not limit that the downstream optical signal transmitted by filter 2 to the optical interface directly enters the optical interface after exiting from filter 2. As shown Figure 7 in the figure, the downstream optical signal exiting from filter 2 is deflected by deflection element 5 and then converged by lens 6 and then enters the optical interface to achieve the output of the downstream optical signal.

[0114] Filter 2 receives an upstream optical signal from the optical interface and reflects this upstream optical signal to the demultiplexing component 9. This application does not limit that the upstream optical signal received by filter 2 from the optical interface directly enters filter 2 from the optical interface. As shown Figure 7 in the figure, the upstream optical signal incident into the cavity through the optical interface is collimated by lens 6 and deflected by deflection element 5 in sequence and then enters filter 2. Filter 2 reflects the upstream optical signal. The reflected upstream optical signal enters the demultiplexing component 9 after being reflected by deflection element 7 and deflection element 8 in sequence. The demultiplexing component 9 demultiplexes the incident one upstream optical signal into three upstream optical signals. These three upstream optical signals are transmitted through the corresponding isolators 10 respectively, and then are converged by the corresponding focusing lenses 11. Each converged upstream optical signal enters the corresponding optical receiving component. Each optical receiving component may include an optical receiving chip 12 and a trans-impedance amplifier (TIA) 13. After the optical receiving chip 12 converts the upstream optical signal into a photocurrent, the TIA 13 amplifies the photocurrent and converts it into a voltage signal. This voltage signal is output through the electrical interface.

[0115] This application does not limit the type of the optical receiving chip. For example, the optical receiving chip may include a photodetector (PD) or an avalanche photon diode (APD).

[0116] This application does not limit the structure of the optical emission component. For example, the optical emission component may include a light source, and may also include other devices related to optical emission, such as a collimating lens and / or an isolator, etc. This application does not limit the type of the light source. For example, the light source may include a laser. The laser may be an electroabsorption modulator (EML) with an electro-optic conversion function, a directly modulated laser (DML), or a vertical cavity surface emitting laser (VCSEL), etc.

[0117] The optical emission component can be integrated into the housing by means of chip on carrier (COC). In this way, it is beneficial to assemble multiple optical emission components in the housing with a smaller occupied volume.

[0118] Above, taking the optical module including three optical emission components and three optical reception components as an example, this application does not limit the number of optical emission components and optical reception components in the optical module. Above, taking the optical module supporting three different generations of PON technologies as an example, the optical module can support a greater or smaller number of generations of PON technologies. This application does not limit the rates of the signals transmitted by the optical emission components and optical reception components of each generation of PON. Taking the rates of the signals transmitted by GPON Tx, XGS-PON Tx, and 50GPON Tx as 2.5 Gbps, 10 Gbps, and 50 Gbps respectively, and taking the rates of the signals transmitted by GPON Rx, XGS-PON Rx, and 50GPON Rx as 2.5 Gbps, 10 Gbps, and 50 Gbps respectively as an example in the foregoing.

[0119] This application does not limit the type of the optical interface. For example, the optical interface may be a multi fiber push on (MPO) type fiber optic connector, a ferrule connector (FC) type fiber optic connector, a square connector (SC) type fiber optic connector, a lucent connector (LC) type fiber optic connector, a straight tip (ST) type fiber optic connector, or a fiber distributed data interface (FDDI) type fiber optic connector.

[0120] The optical module provided by this application may include more Figure 6 or Figure 7 components or devices than shown. For example, referring to Figure 8, the optical module may further include a PCBA, in which electrical components may be integrated. For example, the electrical components may include one or more electronic components (such as capacitors, resistors, triodes, MOS transistors) and / or one or more chips. The functions of the chips in the electrical components are not limited in this application. For example, the one or more chips may have the functions of at least one of a microcontroller unit (MCU), a laser driver chip, a limiting amplifier chip, a clock data recovery (CDR), a power management chip, and a digital signal processing (DSP) chip. A single chip among the one or more chips may be used to implement one of the above functions, or a single chip may implement multiple of the above functions.

[0121] For the sake of description, this application will Figure 6 or Figure 7 The structure shown is referred to as an optical device. The optical device may be electrically connected to at least one electrical component in the PCBA based on the chip-on-board (COB) method or the pluggable method, etc. Correspondingly, Figure 6 and Figure 7 The electrical interface shown is the electrical interface of the optical device, and this electrical interface is used to connect the electrical components in the PCBA. The electrical interface of the optical module may be provided on the PCBA, and the electrical interface on the PCBA may be used to connect Figure 1 The processing module shown.

[0122] The number of optical devices in the optical module is not limited in this application. Optionally, multiple optical devices may be assembled in the optical module, and the multiple optical devices may be respectively electrically connected to the electrical components in the PCBA.

[0123] Above, taking the electrical components connected to the optical device being provided on the PCB as an example, this application does not limit the electrical components to be integrated on the PCB.

[0124] As above, taking the optical module provided in this application and applied to an OLT as an example, this optical module can be applied to any optical device. For example, this optical device can be a forwarding device (such as a router or a switch, etc.) or a computing device (such as a personal computer or a server, etc.) or a storage device (such as a storage server), etc. As above, taking the optical device and the optical module provided in this application and applied to an optical device in a PON as an example, this optical device and optical module can be applied to other optical communication systems. These other optical communication networks include, but are not limited to: any one or a combination of multiple of optical transport network (OTN), optical access network (OAN), Metropolitan Area Network (MAN), synchronous digital hierarchy (SDH), Ethernet, or flex Ethernet (FlexE), wavelength division multiplexing (WDM) network, etc.

[0125] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described systems, devices, and units can refer to the corresponding processes in the foregoing method examples and will not be elaborated here. The "A and / or B" involved in the examples of this application can be understood to include both "A and B" and "A or B" these two scenarios. The terms "first", "second", "third", "fourth", etc. in the specification, claims, and the above-mentioned drawings of this application are used to distinguish similar objects and do not necessarily need to describe a specific order or sequence. It should be understood that such terms can be interchanged under appropriate circumstances, which is only a way of distinguishing objects with the same attributes when describing the examples of this application.

[0126] In several examples provided in this application, it should be understood that the disclosed module, device, or equipment can be implemented in other ways. For example, the device example described above is only illustrative. Another point is that the shown or discussed coupling or direct coupling or communication connection to each other can be through some interfaces. The indirect coupling or communication connection of devices or units can be in an electrical or other form.

[0127] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. An optical module, characterized in that, The optical module includes a housing with a cavity inside, a plurality of optical emission components, a plurality of optical reception components, a demultiplexing component, and an optical component respectively assembled in the cavity, and a first electrical interface and an optical interface respectively assembled on the housing. Among them, the optical component includes a carrier and a first optical element and a second optical element respectively assembled on the carrier; The plurality of optical emission components are configured to receive multiple downstream electrical signals from the first electrical interface and convert the multiple downstream electrical signals into multiple downstream optical signals with different wavelengths; The first optical element is configured to multiplex the multiple downstream optical signals into one downstream optical signal; The second optical element is configured to receive and transmit the one downstream optical signal to the optical interface; The second optical element is further configured to receive one upstream optical signal from the optical interface and reflect the one upstream optical signal to the demultiplexing component; The demultiplexing component is configured to demultiplex the one upstream optical signal into multiple upstream optical signals with different wavelengths; The plurality of optical reception components are configured to convert the multiple upstream optical signals into multiple upstream electrical signals and send the multiple upstream electrical signals to the first electrical interface.

2. The optical module according to claim 1, wherein The carrier is configured to transmit the one downstream optical signal to the second optical element.

3. The optical module according to claim 2, characterized in that, The second optical element is a filter film plated on the carrier, or the second optical element is a glass sheet plated with a filter film, and the glass sheet is mounted on the carrier.

4. The optical module according to claim 2 or 3, characterized in that The first optical element includes a plurality of filter sheets and one or more reflector sheets.

5. The optical module according to any one of claims 1-4, characterized in that, The cavity includes a first electromagnetic shielding cavity and a second electromagnetic shielding cavity. And the plurality of optical emission components are assembled in the first electromagnetic shielding cavity, and the plurality of optical reception components are assembled in the second electromagnetic shielding cavity.

6. The optical module according to claim 5, wherein, An isolation wall is provided in the cavity. The isolation wall and the housing are respectively configured to shield electromagnetic interference, and the isolation wall and the housing together form the first electromagnetic shielding cavity and the second electromagnetic shielding cavity.

7. The optical module according to claim 6, characterized in that, The first electrical interface includes a plurality of external pins provided outside on the same side of the housing and a plurality of internal pins provided inside on the side. The plurality of external pins are respectively electrically connected to the plurality of internal pins, and the isolation wall extends from the side into the cavity.

8. The optical module according to any one of claims 1-7, characterized in that, The multiple upstream electrical signals include at least three upstream electrical signals with different transmission rates, and / or the multiple downstream electrical signals include at least three downstream electrical signals with different transmission rates.

9. The optical module according to claim 8, wherein The distance between the first optical emission component and the first optical reception component among the plurality of optical emission components is greater than the distance between the second optical emission component and the second optical reception component among the plurality of optical reception components. Among them, the transmission rate of the downstream electrical signal received by the first optical emission component is greater than the transmission rate of the downstream electrical signal received by the second optical emission component, and / or the transmission rate of the upstream electrical signal sent by the first optical reception component is greater than the transmission rate of the upstream electrical signal sent by the second optical reception component.

10. The optical module according to any one of claims 1-9, characterized in that, The optical module further includes a second electrical interface and an electrical component, and the electrical component is respectively electrically connected to the first electrical interface and the second electrical interface; The electrical component is configured to transmit the multiplexed downstream electrical signals to the first electrical interface according to the electrical signals received from the second electrical interface, and transmit electrical signals to the second electrical interface according to the multiplexed upstream electrical signals received from the first electrical interface.

11. An optical device, characterized in that, The optical device includes a printed circuit board assembly (PCBA) and one or more optical modules as claimed in any one of claims 1-10 connected to the PCBA.

12. The optical device according to claim 11, wherein, The optical device is an optical line terminal (OLT), an optical network unit (ONU), a forwarding device, a computing device, or a storage device.

13. A passive optical network (PON) system, characterized in that Comprising an optical line terminal (OLT) as claimed in claim 12, an optical distribution network (ODN), and one or more optical network units (ONU), wherein the OLT is connected to the one or more ONUs through the ODN.

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