Display panel and display device

Abstract

The invention relates to a display panel and a display device, the display panel comprises a display area and a non-display area located on at least one side of the display area, and the non-display area comprises at least one bonding pad area; the display panel comprises an array substrate, an organic film layer and at least one bonding pad. The organic film layer is arranged on the array substrate and covers at least part of the display area and at least part of the non-display area; the bonding pad is arranged on the organic film layer and located in the bonding pad area; the organic film layer comprises at least one interval groove, and the interval groove is arranged around the bonding pad area and penetrates through the organic film layer in the thickness direction of the array substrate; according to the display panel, the grooves are formed in the organic film layer, the interval grooves are formed in the periphery of the bonding pad area to block water vapor invasion paths of the bonding pad area and other areas, and therefore the packaging performance of the display panel is effectively improved, and the reliability of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display panel and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display panels have gradually become a new generation of display technologies due to their characteristics such as high contrast ratio, wide color gamut, and low power consumption. With the increasing demand of end customers for the reliability of OLED display products, the improvement and development of the packaging performance of display panels have become the focus of attention of each panel manufacturer.

[0003] The OLED display panel includes a stacked structure composed of an inorganic film layer, a metal film layer, an organic film layer, etc. Among them, the organic film layer is prone to becoming the main medium for water vapor intrusion due to its strong water absorption. In addition, due to the requirements of testing or bonding processes in the display panel design, there are exposed metal structures in some areas of the display panel, such as Array Test Pad, Cell Test Pad, and Flexible Printed Circuit pad, etc. The surfaces of these exposed metal structures are easily scratched, becoming the key paths for water vapor intrusion. When external water vapor intrudes into the display panel from the scratched areas, it will cause phenomena such as metal corrosion, signal abnormality, and display abnormality, resulting in a reduction in the reliability of the display panel. Summary of the Invention

[0004] The present application provides a display panel and a display device, which can effectively improve the packaging performance of the display panel and enhance the reliability of the display panel.

[0005] The present application provides a display panel, including a display area and a non-display area located on at least one side of the display area. The non-display area includes at least one pad area. The display panel includes:

[0006] An array substrate;

[0007] An organic film layer, disposed on the array substrate, and the organic film layer covers at least part of the display area and at least part of the non-display area; and

[0008] At least one pad, disposed on the organic film layer, and the pad is located in the pad area;

[0009] Wherein, the organic film layer includes at least one spacer groove, the spacer groove is arranged around the pad area and is located in the non-display area, and the spacer groove penetrates through the organic film layer along the thickness direction of the array substrate.

[0010] In some embodiments, the width of the opening of the spacing groove at an end away from the array substrate is greater than the width of the opening of the spacing groove at an end close to the array substrate.

[0011] In some embodiments, the organic film layer includes a first sub-organic layer and a second sub-organic layer, and the second sub-organic layer is located on a side of the first sub-organic layer away from the array substrate;

[0012] The spacing groove includes a first sub-groove and a second sub-groove, the first sub-groove penetrates the first sub-organic layer along the thickness direction of the array substrate, the second sub-groove penetrates the second sub-organic layer along the thickness direction of the array substrate, and the first sub-groove is connected to the second sub-groove, and in the direction from the spacing groove to the pad area, the width of the second sub-groove is greater than the width of the first sub-groove.

[0013] In some embodiments, the sidewall of the second sub-groove is retracted relative to the sidewall of the first sub-groove toward the center of the spacing groove, and the retracted distance d of the sidewall of the second sub-groove relative to the sidewall of the first sub-groove is greater than or equal to 5 μm.

[0014] In some embodiments, the non-display area includes a first pad area, the display panel includes an array substrate test pad, and the organic film layer includes a first spacing groove, wherein the array substrate test pad is located in the first pad area, and the first spacing groove is arranged around the first pad area;

[0015] And / or, the non-display area includes a second pad area, the display panel includes a display panel test pad, and the organic film layer includes a second spacing groove, wherein the display panel test pad is located in the second pad area, and the second spacing groove is arranged around the second pad area;

[0016] And / or, the non-display area includes a third pad area, the display panel includes a flexible circuit board pad, and the organic film layer includes a third spacing groove, wherein the flexible circuit board pad is located in the third pad area, and the third spacing groove is arranged around the third pad area.

[0017] In some embodiments, the organic film layer includes at least one opening, the opening is located in the pad region, and the pad is disposed in the opening.

[0018] In some embodiments, the pad includes at least one metal layer, wherein when the pad includes multiple metal layers, the multiple metal layers are stacked along the thickness direction of the array substrate.

[0019] In some embodiments, the organic film layer includes a flat portion and an isolation portion located on the flat portion. The isolation portion protrudes from a side of the flat portion away from the array substrate, and the isolation portion is disposed around the opening.

[0020] In some embodiments, the non-display area includes a bonding area and a bending area. The bending area is located between the display area and the bonding area. The bonding area is bent to the back surface of the array substrate through the bending area, and the pad area is located in the bonding area.

[0021] The present application also provides a display device, which includes the display panel as described above.

[0022] The present application provides a display panel and a display device. By forming a groove in the organic film layer to form a spacer groove around the pad area, and the spacer groove penetrates through the organic film layer, the water vapor intrusion path between the pad area and other areas can be blocked. Even if the metal surface of the pad exposed in the pad area is scratched, and water vapor enters the organic film layer below or around the pad surface from the scratch, since the spacer groove is provided around the pad area, the communication path between the organic film layer in the pad area and the organic film layers in other areas such as the display area or other component areas is blocked. Therefore, the water vapor intruding from the scratched pad surface can be prevented from entering the display area or other component areas, avoiding the influence of water vapor intrusion on the display area or other components, and thus effectively improving the packaging performance of the display panel and enhancing the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative efforts.

[0024] In order to more fully understand the present application and its beneficial effects, the following will be described in conjunction with the drawings, where the same reference numerals represent the same parts in the following description.

[0025] Figure 1 is a top view of a display panel provided by an embodiment of the present application;

[0026] Figure 2 is a partial top view of a display panel provided by an embodiment of the present application;

[0027] Figure 3 is Figure 2 an A-A cross-sectional view of a display panel provided by an embodiment;

[0028] Figure 4 is Figure 3A partial schematic diagram of a display panel provided by the embodiment.

[0029] Description of reference numerals:

[0030] 100 - Display panel; 110 - Array substrate; 111 - Substrate; 112 - Buffer layer; 113 - Inorganic insulating layer; 120 - Organic film layer; 121 - First sub - organic layer; 122 - Second sub - organic layer; 123 - Opening; 1231 - First opening; 1232 - Second opening; 124 - Flat part; 1241 - First flat part; 1242 - Second flat part; 125 - Isolation part; 1251 - First isolation part; 1252 - Second isolation part; 126 - Groove; 1261 - First groove; 1262 - Second groove; 130 - Pad; 1301 - First metal layer; 1302 - Second metal layer; 1303 - Third metal layer; 131 - Array substrate test pad; 132 - Display panel test pad; 133 - Flexible circuit board pad; 134 - Signal trace; 140 - Spacer groove; 1401 - First sub - groove; 1402 - Second sub - groove; 141 - First spacer groove; 142 - Second spacer groove; 143 - Third spacer groove; 150 - Inorganic film layer;

[0031] AA - Display area; NN - Non - display area; NA - Pad area; NA1 - First pad area; NA2 - Second pad area; NA3 - Third pad area; NB - Bending area; NC - Bonding area. Detailed implementation manners

[0032] Next, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present application.

[0033] The present application provides a display panel 100. Please refer to the following Figures 1-3. The display panel 100 includes a display area AA and a non-display area NN located on at least one side of the display area AA. The non-display area NN includes at least one pad area NA. The display panel 100 includes an array substrate 110, an organic film layer 120, and at least one pad 130. The organic film layer 120 is disposed above the array substrate 110, and the organic film layer 120 covers at least part of the display area AA and at least part of the non-display area NN; the pad 130 is disposed on the organic film layer 120, and the pad 130 is located in the pad area NA; wherein, the organic film layer 120 includes at least one spacer groove 140, the spacer groove 140 is disposed around the pad area NA and is located in the non-display area NN, and the spacer groove 140 penetrates through the organic film layer 120 along the thickness direction of the array substrate 110.

[0034] Wherein, the array substrate 110 includes a substrate 111 and a driving circuit disposed on the substrate 111; the substrate 111 can be a flexible substrate 111, such as polyimide, or a rigid substrate 111, such as glass; the driving circuit includes a thin film transistor array and other signal traces. The thin film transistor includes a gate, an active layer, a source-drain electrode, etc. Specifically, the structure of the thin film transistor can refer to the prior art, and this application does not make any limitations.

[0035] The display area AA of the display panel 100 is used for displaying images; the non-display area NN is located on one side or multiple sides of the display area AA, or the non-display area NN surrounds the display area AA. The non-display area NN is provided with signal traces, components, etc.; the pad area NA is located in the non-display area NN and is spaced apart from the display area AA. The non-display area NN may include one or more of the pad areas NA, and the pad area NA may include one or more of the pads 130. The pads 130 in different pad areas NA have different functions. For example, some of the pad areas NA may include pads 130 for testing, and some other pad areas NA may include pads 130 for bonding, etc.

[0036] Further, the display panel 100 may be a flexible display panel, such as a flexible OLED display panel. The non-display area NN includes a bonding area NC and a bending area NB, and the bending area NB is located between the display area AA and the bonding area NC. The array substrate 110 includes a display portion located in the display area AA, a bending portion located in the bending area NB, and a bonding portion located in the bonding area NC. The bonding portion is bent to the back surface of the display portion through the bending portion. The pad area NA is located in the bonding area NC, and the pad 130 is located on the side of the bonding portion away from the display portion. Among them, the bonding portion is used to bond components such as a flexible printed circuit (FPC) and an integrated circuit chip (IC).

[0037] The organic film layer 120 may be an organic material film layer such as a pixel definition layer and a planarization layer formed above the array substrate 110. The organic film layer 120 extends from the display area AA to the non-display area NN, covering at least part of the display area AA and at least part of the non-display area NN. The pad 130 is disposed on the organic film layer 120, and the pad 130 may be formed after the organic film layer 120 is formed. In this application, the organic film layer 120 includes at least one spacer groove 140. The spacer groove 140 is disposed around the pad area NA, and the spacer groove 140 is located in the non-display area NN. The spacer groove 140 penetrates the organic film layer 120 along the thickness direction of the array substrate 110. That is, in this application, the organic film layer 120 around the pad area NA is removed, cutting off the communication path between the organic film layer 120 in the pad area NA and the organic film layer 120 in other areas such as the display area AA or other component areas, blocking the water vapor intrusion path between the pad area NA and the display area AA or other component areas, thereby effectively improving the encapsulation performance of the display panel 100, and further improving the reliability of the display panel 100.

[0038] Further, the array substrate 110 further includes at least one buffer layer 112 and at least one inorganic insulating layer 113. The buffer layer 112 is located on the side of the substrate 111 close to the organic film layer 120, and the inorganic insulating layer 113 is located between the buffer layer 112 and the organic film layer 120. Among them, one or more inorganic insulating layers 113 may be included between the buffer layer 112 and the organic film layer 120.

[0039] Further, the display panel 100 further includes a light-emitting device layer disposed above the array substrate 110 and within the display area AA. The light-emitting device layer includes an anode, an organic light-emitting functional layer, and a cathode stacked in sequence along the thickness direction of the array substrate 110.

[0040] Further, the display panel 100 further includes an inorganic film layer 150 located on the side of the organic film layer 120 away from the array substrate 110. The inorganic film layer 150 covers the organic film layer 120 to protect the organic film layer 120 and prevent water vapor from invading the interior of the display panel 100 through the organic film layer 120, thereby improving the encapsulation performance of the display panel 100.

[0041] In some embodiments, the opening width w1 of the end of the spacer groove 140 away from the array substrate 110 is greater than the opening width w2 of the end of the spacer groove 140 close to the array substrate 110, so that the side wall of the spacer groove 140 forms a certain slope (Taper) with the surface of the array substrate 110, avoiding the side wall of the spacer groove 140 from being too steep. In the subsequent metal film layer etching process, the metal along the side wall of the spacer groove 140 cannot be etched cleanly, resulting in metal residue. Specifically, the cross-section of the spacer groove 140 may be trapezoidal in reverse, or the side wall of the spacer groove 140 may be stepped, but is not limited thereto.

[0042] In some embodiments, the organic film layer 120 may include a plurality of sub-organic layers. For example, the organic film layer 120 may include two or more sub-organic layers stacked in sequence along the thickness direction of the array substrate 110. The sub-organic layer may be one of a pixel definition layer, a planarization layer, or other organic material film layers.

[0043] Specifically, please refer to Figures 3-4, the organic film layer 120 includes a first sub-organic layer 121 and a second sub-organic layer 122, and the second sub-organic layer 122 is located on a side of the first sub-organic layer 121 away from the array substrate 110. Correspondingly, the spacer groove 140 includes a first sub-groove 1401 and a second sub-groove 1402. The first sub-groove 1401 penetrates through the first sub-organic layer 121 along the thickness direction of the array substrate 110, and the second sub-groove 1402 penetrates through the second sub-organic layer 122 along the thickness direction of the array substrate 110, and the first sub-groove 1401 communicates with the second sub-groove 1402. In a direction from the spacer groove 140 to the pad region NA, a width w1 of the second sub-groove 1402 is greater than a width w2 of the first sub-groove 1401, so that a side wall of the spacer groove 140 has a certain taper, avoiding the side wall of the spacer groove 140 from being too steep, and there is a problem of metal residue in a subsequent metal film layer etching process, and at the same time, peeling between the first sub-organic layer 121 and the second sub-organic layer 122 is avoided.

[0044] Furthermore, a side wall of the first sub-groove 1401 is retracted in a direction away from a center OO' of the spacer groove 140 relative to a side wall of the second sub-groove 1402, that is, the side wall of the spacer groove 140 is stepped, and a retraction distance d of the side wall of the second sub-groove 1402 relative to the side wall of the first sub-groove 1401 is greater than or equal to 5 μm. When the retraction distance d of the side wall of the second sub-groove 1402 relative to the side wall of the first sub-groove 1401 is greater than or equal to 5 μm, it can be ensured that the taper of the second sub-organic layer 122 and the taper of the first sub-organic layer 121 will not be too close and steep, so as to avoid metal residue on the side wall of the spacer groove 140 in a subsequent metal etching process, and at the same time, peeling between the first sub-organic layer 121 and the second sub-organic layer 122 is avoided, so as to ensure the packaging performance.

[0045] It can be understood that the organic film layer 120 may further include more sub-organic layers such as a third sub-organic layer and a fourth sub-organic layer. When the organic film layer 120 includes three or more sub-organic layers, its structure and principle are similar to those of the organic film layer 120 including the first sub-organic layer 121 and the second sub-organic layer 122 described above, and will not be elaborated here.

[0046] In the present application, the non-display area NN may include one or two or more pad areas NA, the display panel 100 may include one or two or more pads 130, correspondingly, the organic film layer 120 may include one or two or more spacer grooves 140. The numbers of the pad area NA, the pad 130, and the spacer groove 140 are not limited in the present application and may be specifically designed according to the actual structure of the display panel 100.

[0047] In some embodiments, please refer to Figure 1 , the non-display area NN may include a first pad area NA1, the display panel 100 includes an array substrate test pad 131 (Array Test Pad), and the organic film layer 120 includes a first spacer groove 141. Among them, the array substrate test pad 131 is located in the first pad area NA1, and the first spacer groove 141 is disposed around the first pad area NA1. Specifically, the display panel 100 may include a plurality of the array substrate test pads 131, and the plurality of the array substrate test pads 131 are arranged in rows, or columns, or in an array in the first pad area NA1. The plurality of the array substrate test pads 131 form a test element group (Test Element Group, TEG) for testing the performance of the array substrate 110. That is, in the production line of the array substrate 110, the electrical properties of the thin film transistors on the array substrate 110 are tested through the array substrate test pads 131 to judge the stability of the manufacturing process and whether the electrical properties of the thin film transistors meet the expectations. Specifically, through a probing test, a probe is used to contact the array substrate test pad 131, and a test fixture is used to measure the electrical properties of the thin film transistors. Among them, the array substrate test pad 131 is connected to the thin film transistor through a signal trace 134.

[0048] In some embodiments, please refer to Figure 1 , the non-display area NN includes a second pad area NA2, the display panel 100 includes a display panel test pad 132 (Cell Test Pad), and the organic film layer 120 includes a second spacer groove 142. Among them, the display panel test pad 132 is located in the second pad area NA2, and the second spacer groove 142 is disposed around the second pad area NA2. Specifically, the display panel 100 may include a plurality of the display panel test pads 132, and the plurality of the display panel test pads 132 are arranged in rows, or columns, or in an array in the second pad area NA2. The display panel test pad 132 is also the lighting test pad 130, which is used for the lighting test after the first cut of the display panel 100 in the production line of the display panel 100 and is used for the first yield detection of the display panel 100 on the production line.

[0049] In some embodiments, please refer to Figure 1 The non-display area NN includes a third pad area NA3, the display panel 100 includes a flexible printed circuit pad 133, and the organic film layer 120 includes a third spacing groove 143, wherein the flexible printed circuit pad 133 is located in the third pad area NA3, and the third spacing groove 143 is arranged around the third pad area NA3. Specifically, the display panel 100 may include a plurality of flexible printed circuit pads 133, and the plurality of flexible printed circuit pads 133 are arranged in rows, columns, or arrays in the third pad area NA3. The flexible printed circuit pads 133 are used to bind the gold fingers of the flexible printed circuit board. The flexible printed circuit board is bound to the non-display area NN of the display panel 100 through the flexible printed circuit pads 133, and transmits signals to the display area AA to realize the lighting of the display panel 100.

[0050] In this application, please refer to Figure 1 The non-display area NN may include at least one of the first pad area NA1, the second pad area NA2, and the third pad area NA3, wherein the orthographic projections of the first pad area NA1, the second pad area NA2, and the third pad area NA3 on the array substrate 110 do not overlap. Accordingly, the organic film layer 120 may include the first spacing groove 141 surrounding the first pad area NA1, the second spacing groove 142 surrounding the second pad area NA2, and the third spacing groove 143 surrounding the third pad area NA3, wherein the orthographic projections of the first spacing groove 141, the second spacing groove 142, and the third spacing groove 143 on the array substrate 110 do not overlap. By isolating different pad areas NA from the surrounding display area AA or other pad areas NA using independent spacing grooves 140, water vapor intrusion paths can be implemented between different pad areas NA and between the pad area NA and the display area AA, thereby improving the packaging performance of the display panel 100.

[0051] In some embodiments, please refer to Figures 3-4 The organic film layer 120 further includes at least one opening 123, the opening 123 being located in the pad area NA, and the pad 130 being disposed in the opening 123. Disposing the pad 130 in the opening 123 of the organic film layer 120 can avoid problems such as short circuits caused by contact between two adjacent pads 130.

[0052] In some embodiments, please refer to Figures 3-4, the pad 130 includes at least one metal layer, that is, the pad 130 can be composed of one layer or two or more metal layers. When the pad 130 includes multiple metal layers, the multiple metal layers are stacked along the thickness direction of the array substrate 110. The multiple metal layers can increase the overall thickness of the pad 130 and can reduce the risk of water vapor intrusion after the pad 130 is scratched.

[0053] Specifically, please refer to Figures 3-4 , the pad 130 includes a first metal layer 1301, a second metal layer 1302, and a third metal layer 1303. Among them, the second metal layer 1302 is located on the side of the first metal layer 1301 away from the array substrate 110, and the third metal layer 1303 is located on the side of the second metal layer 1302 away from the first metal layer 1301. The materials of the first metal layer 1301, the second metal layer 1302, and the third metal layer 1303 can be the same or different, and the first metal layer 1301, the second metal layer 1302, and the third metal layer 1303 all have conductivity.

[0054] In some embodiments, please refer to Figures 3-4 , the organic film layer 120 includes a flat portion 124 and a separation portion 125 located on the flat portion 124. The separation portion 125 protrudes from the side of the flat portion 124 away from the array substrate 110, and the separation portion 125 surrounds the opening 123. The separation portion 125 can be used to define the range of the pad 130 and prevent connection between adjacent pads 130. Among them, adjacent separation portions 125 are spaced apart, that is, a groove 126 is formed between adjacent separation portions 125 to facilitate the disconnection of the metal layer of the pad 130 at the groove 126, forming spaced and independent pads 130 and preventing connection between adjacent pads 130.

[0055] When the organic film layer 120 includes multiple sub-organic layers and the pad 130 includes multiple metal layers, the metal layers and the sub-organic layers can be alternately formed in sequence. Please refer to Figures 3-4, the organic film layer 120 includes the first sub-organic layer 121 and the second sub-organic layer 122, and the pad 130 includes the first metal layer 1301, the second metal layer 1302, and the third metal layer 1303. The order of forming the organic film layer 120 and the pad 130 may be: first, first forming the first metal layer 1301 on the array substrate 110, the first metal layer 1301 including a metal pattern arranged in an array; second, then forming the first sub-organic layer 121 on the array substrate 110 and the first metal layer 1301, the first sub-organic layer 121 including a plurality of first openings 1231, the first openings 1231 exposing the first metal layer 1301, wherein the first sub-organic layer 121 includes a first flat portion 1241 and a first isolation portion located on the first flat portion 1241. The first isolation portion 1251 protrudes from the side of the first flat portion 1241 away from the array substrate 110, and the first isolation portion 1251 is arranged around the first opening 1231, and two adjacent first isolation portions 1251 are spaced apart, that is, a first groove 1261 is formed between the two adjacent first isolation portions 1251; third, a second metal layer 1302 is formed on the first metal layer 1301 and the first sub-organic layer 121, and the second metal layer 1302 is disconnected at the first groove 1261 and is located in the first opening 1231, that is, the second metal layer The second sub-organic layer 122 is formed on the first sub-organic layer 121 and the second metal layer 1302, wherein the second sub-organic layer 122 includes a plurality of second openings 1232, and the second openings 1232 expose the second metal layer 1302, wherein the second sub-organic layer 122 includes a second flat portion 1242 and a second isolation portion 1252 located on the second flat portion 1242, and the second isolation portion 1252 is located on the second flat portion 1242. The second isolating portion 1252 protrudes from a side of the second flat portion 1242 away from the array substrate 110, and the second isolating portion 1252 is arranged around the second opening 1232. Two adjacent second isolating portions 1252 are spaced apart, that is, a second groove 1262 is formed between two adjacent second isolating portions 1252. In the fifth step, an inorganic film layer 150 is formed above the second sub-organic layer 122 and the second metal layer 1302. The inorganic film layer 150 covers the second sub-organic layer 122. The inorganic film layer 150 is disconnected at the second opening 1232, exposing the second metal layer 1302.Step 6: Finally, the third metal layer 1303 is formed over the inorganic film layer 150 and the second metal layer 1302. The third metal layer 1303 is disconnected at the second groove 1262 and is located in the second opening 1232. That is, the third metal layer 1303 covers the exposed second metal layer 1302 in the second opening 1232, as well as the sidewalls of the second isolation portion 1252 and at least a portion of the inorganic film layer 150 located on the top surface of the second isolation portion 1252.

[0056] It should be noted that the first metal layer 1301, the second metal layer 1302, and the third metal layer 1303 can be arranged in the same layer as some metal layers of the display area AA, that is, formed in the same process. The specific design can be based on the different structures of the display panel 100, and this application does not impose any restrictions.

[0057] The present application also provides a display device, comprising the display panel 100 described above. The display panel 100 may be an organic light-emitting diode (OLED) display panel 100. Furthermore, the display panel 100 may be an active-matrix organic light-emitting diode (AMOLED), but is not limited thereto. The display device may be a display product such as a mobile phone, tablet, computer, or television, but is not limited thereto.

[0058] The present application provides a display panel and a display device. The present application forms a spacing groove around the pad area by digging a groove in the organic film layer. The spacing groove penetrates the organic film layer and can block the water vapor intrusion path between the pad area and other areas. Even if the exposed metal surface of the pad in the pad area is scratched, water vapor enters the organic film layer below or around it from the scratch on the pad surface. Since the spacing groove is provided around the pad area, the communication path between the organic film layer in the pad area and the organic film layer in other areas such as the display area or other component areas is cut off. Therefore, the water vapor invading the scratch on the pad surface can be prevented from entering the display area or other component areas, and the influence of the water vapor intrusion on the display area or other components can be avoided, thereby effectively improving the packaging performance of the display panel and improving the reliability of the display panel.

[0059] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0060] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0061] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0062] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display panel, characterized in that, It includes a display area and a non-display area located on at least one side of the display area. The non-display area includes at least one pad area. The display panel includes: An array substrate; An organic film layer disposed on the array substrate, the organic film layer covering at least part of the display area and at least part of the non-display area; and At least one pad disposed on the organic film layer, and the pad is located in the pad area; Wherein, the organic film layer includes at least one spacer groove, the spacer groove is disposed around the pad area and is located in the non-display area, and the spacer groove penetrates the organic film layer along the thickness direction of the array substrate.

2. The display panel according to claim 1, wherein The opening width of the end of the spacer groove far from the array substrate is greater than the opening width of the end of the spacer groove close to the array substrate.

3. The display panel according to claim 2, wherein: The organic film layer includes a first sub-organic layer and a second sub-organic layer, and the second sub-organic layer is located on the side of the first sub-organic layer far from the array substrate; The spacer groove includes a first sub-groove and a second sub-groove. The first sub-groove penetrates the first sub-organic layer along the thickness direction of the array substrate, and the second sub-groove penetrates the second sub-organic layer along the thickness direction of the array substrate, and the first sub-groove communicates with the second sub-groove. In the direction from the spacer groove to the pad area, the width of the second sub-groove is greater than the width of the first sub-groove.

4. The display panel according to claim 3, wherein The side wall of the second sub-groove is retracted in a direction away from the center of the spacer groove relative to the side wall of the first sub-groove, and the retraction distance d of the side wall of the second sub-groove relative to the side wall of the first sub-groove is greater than or equal to 5 μm.

5. The display panel according to claim 1, wherein The non-display area includes a first pad area, the display panel includes an array substrate test pad, and the organic film layer includes a first spacer groove. Wherein, the array substrate test pad is located in the first pad area, and the first spacer groove is disposed around the first pad area; And / or, the non-display area includes a second pad area, the display panel includes a display panel test pad, and the organic film layer includes a second spacer groove. Wherein, the display panel test pad is located in the second pad area, and the second spacer groove is disposed around the second pad area; And / or, the non-display area includes a third pad area, the display panel includes a flexible circuit board pad, and the organic film layer includes a third spacer groove. Wherein, the flexible circuit board pad is located in the third pad area, and the third spacer groove is disposed around the third pad area.

6. The display panel according to claim 1, wherein: The organic film layer includes at least one opening, and the opening is located in the pad area, and the pad is disposed in the opening.

7. The display panel according to claim 6, wherein The pad includes at least one metal layer. When the pad includes multiple metal layers, the multiple metal layers are stacked along the thickness direction of the array substrate.

8. The display panel according to claim 6, wherein The organic film layer includes a flat portion and an isolation portion located on the flat portion. The isolation portion protrudes from the side of the flat portion far from the array substrate, and the isolation portion is disposed around the opening.

9. The display panel according to any one of claims 1 to 8, characterized in that, The non-display area includes a bonding area and a bending area. The bending area is located between the display area and the bonding area. The bonding area is bent to the back surface of the array substrate through the bending area, and the pad area is located in the bonding area.

10. A display device, characterized in that, A display panel includes the display panel according to any one of claims 1 to 9.

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