Display device

Abstract

A display device includes: a display panel including a display area having a plurality of pixels and a first pad area disposed around the display area; a data driving part on the first pad region; and a connection member on the data driving component. The connecting member has different thicknesses depending on a portion thereof disposed at the data driving part.

Description

[0001] Cross - reference to related applications

[0002] This application claims the benefit and priority of Korean Patent Application No. 10 - 2024 - 0013308, filed on January 29, 2024, the entire contents of which are incorporated herein by reference for all purposes. Technical field

[0003] The present disclosure relates to a display device. Background art

[0004] With the development of the information society, various demands for display devices for displaying images are increasing. Various types of display devices are being used, such as liquid crystal display devices, organic light - emitting diode display devices, etc.

[0005] In an organic light - emitting display device among display devices, light is emitted by itself. Compared with a liquid crystal display device, the organic light - emitting display device has a larger viewing angle, better contrast, etc., and does not require a separate backlight, so it can be lighter, thinner, and is advantageous in terms of power consumption. In addition, the organic light - emitting display device can be driven at a low DC voltage, and has a fast response speed and a low manufacturing cost. Summary of the invention

[0006] An organic light - emitting display device may include a display panel and a data driving component, and the data driving component may be mounted on the display panel in the form of a driving chip, or may be mounted on a printed circuit board attached to the display panel.

[0007] One or more aspects of the present disclosure are to provide a display device capable of shielding a data driving component from static electricity.

[0008] One or more aspects of the present disclosure are to provide a display device capable of forming a ground path from the display panel to the printed circuit board.

[0009] One or more aspects of the present disclosure are to provide a display device capable of compensating for a step difference between a data driving component and a reinforcing component disposed adjacent to the data driving component.

[0010] Additional features and advantages of the present disclosure will be set forth in the following description, and in part will be obvious from the description, or may be learned by practice of the present disclosure. Other advantages of the present disclosure will be realized and obtained by the structures particularly pointed out in the written description, claims, and drawings.

[0011] According to an embodiment of the present disclosure, a display device may include: a display panel including a display area having a plurality of pixels and a first pad area disposed around the display area; a data driving component on the first pad area; and a connection member on the data driving component. The connection member may have different thicknesses according to the portion thereof disposed at the data driving component.

[0012] According to another embodiment of the present disclosure, a display device may include: a display panel including a display area having a plurality of pixels and a first pad area disposed around the display area; a data driving component on the first pad area; and a connection member on the data driving component. The connection member may not include an inclined surface.

[0013] According to an embodiment of the present disclosure, the display device includes a connection member covering the data driving component, thereby shielding the data driving component from static electricity.

[0014] According to an embodiment of the present disclosure, a ground path from the display panel to a printed circuit board may be formed through the connection member.

[0015] According to an embodiment of the present disclosure, a reinforcing component is disposed around the data driving component, and the conductive portion of the reinforcing component and the connection member are electrically connected, so that a ground contact area between the display panel and the printed circuit board can be further obtained.

[0016] According to an embodiment of the present disclosure, the connection member is formed without an inclined surface, so that the adhesion between the connection member and the underlying reinforcing component or data driving component can be further improved.

[0017] According to an embodiment of the present disclosure, the adhesion between the connection member and the underlying reinforcing component or data driving component is improved, so that the durability and lifespan of the display device can be improved.

[0018] According to an embodiment of the present disclosure, the connection member is composed of an integral connection member that prevents static electricity and performs a grounding function, thereby achieving the effect of single materialization.

[0019] It should be understood that the foregoing general description and the following detailed description of the present disclosure are both exemplary and explanatory, and are intended to provide further explanation of the claimed disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are included to provide a further understanding of the present disclosure, and are incorporated in and constitute a part of this application. The drawings illustrate embodiments of the present disclosure and, together with the description, are used to explain the principles of the present disclosure.

[0021] Figure 1 is a plan view of a display device according to an embodiment of the present disclosure.

[0022] Figure 2 is a cross-sectional view taken along line A-A' of Figure 1 in accordance with an embodiment of the present disclosure.

[0023] Figure 3 shows Figure 2 a cross-sectional view in which a bent region of a display device is bent.

[0024] Figure 4 is a cross-sectional view of a display panel of Figure 2 in accordance with an embodiment of the present disclosure.

[0025] Figure 5 is a magnified plan view of region Q1 of Figure 1 in accordance with an embodiment of the present disclosure.

[0026] Figure 6 is a cross-sectional view taken along line B-B' of Figure 5 in accordance with an embodiment of the present disclosure.

[0027] Figure 7 is a magnified plan view of region Q2 of Figure 6 in accordance with an embodiment of the present disclosure.

[0028] Figure 8 is a magnified plan view of region Q3 of Figure 6 in accordance with an embodiment of the present disclosure.

[0029] Figure 9 is a magnified plan view of region Q4 of Figure 6 in accordance with an embodiment of the present disclosure.

[0030] Figure 10 is a cross-sectional view of a display device in accordance with another embodiment of the present disclosure.

[0031] Figure 11 is a cross-sectional view of a display device in accordance with another embodiment of the present disclosure.

[0032] Figure 12 is a cross-sectional view of a display device in accordance with another embodiment of the present disclosure.

[0033] Throughout the drawings and the detailed description, unless otherwise described, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustration, and / or convenience, the dimensions, lengths, and thicknesses of layers, regions, and elements, and their descriptions may be exaggerated. Detailed Description

[0034] Reference will now be made in detail to aspects of the present disclosure, examples of which may be shown in the accompanying drawings. In the following description, when a detailed description of a well-known method, function, or configuration may unnecessarily obscure aspects of the present disclosure, its detailed description may be omitted for the sake of brevity. The progress of the described processing steps and / or operations is an example; however, the order of the steps and / or operations is not limited to the order described herein and may be changed, except for steps and / or operations that must occur in a specific order.

[0035] Unless otherwise noted, even if similar reference numerals are shown in different drawings, similar reference numerals may refer to similar elements throughout. Unless otherwise noted, the same reference numerals may be used throughout the specification and drawings to refer to the same or substantially the same elements. In one or more aspects, unless otherwise noted, the same elements (or elements with the same name) in different drawings may have the same or substantially the same functions and characteristics. The names of the various elements used in the following description are chosen for convenience only and may therefore be different from the names used in actual products.

[0036] Aspects described by reference to the accompanying drawings illustrate the advantages and features of the present disclosure and their implementation methods. However, the present disclosure may be embodied in different forms and should not be construed as limited to the aspects set forth herein. On the contrary, these aspects are examples, and these aspects are provided so that the present disclosure may be thorough and complete, to help those skilled in the art understand the inventive concept without limiting the scope of the present disclosure.

[0037] The shapes, sizes, areas, widths, heights, thicknesses, ratios, angles, numbers, the number of elements, etc. disclosed in the drawings used to describe aspects of the present disclosure are merely examples, and thus, the present disclosure is not limited to the details shown. When using terms such as "comprising", "having", "including", "containing", "constituting", "manufacturing", "forming", "composing", etc., one or more elements (e.g., layers, films, regions, components, sections, members, parts, areas, parts, steps, operations, etc.) may be added, unless terms such as "only" are used. The terms used in the present disclosure are only used to describe specific aspects and are not intended to limit the scope of the present disclosure. The terms used herein are only used to describe exemplary aspects and are not intended to limit the scope of the present disclosure. Unless the context clearly dictates otherwise, singular terms may include plural forms. The word "exemplary" means serving as an example or illustration. An aspect may be one or more exemplary aspects. Multiple aspects are multiple exemplary aspects. Any embodiment described herein as an "example" or an "aspect" is not necessarily to be construed as more preferred or more advantageous than other embodiments.

[0038] In one or more aspects, an element, feature, or corresponding information (e.g., level, range, dimension, size, etc.) is interpreted as including an error or tolerance range, even in the absence of an explicit description of such error or tolerance range. The error or tolerance range may be caused by various factors (e.g., process factors, internal or external influences, noise, etc.). Additionally, the term "may" includes all meanings of the term "can".

[0039] When describing positional relationships, where terms such as "on", "above", "under", "over", "below", "beneath", "near", "next to", "adjacent to", "beside", "proximate to", etc. are used to describe the positional relationship between two components, one or more other components may be located between the two components, unless more restrictive terms such as "immediately", "directly", or "proximately" are used. For example, when a structure is described as being positioned "on another structure", "above another structure", "under another structure", "over another structure", "below another structure", "beneath another structure", "near another structure", "next to another structure", "adjacent to another structure", "beside another structure", or "proximate to another structure", such description shall be interpreted as including the case where the structures are in contact with each other, and the case where one or more additional structures are disposed or inserted therebetween. Additionally, terms such as "front", "rear", "back", "left", "right", "top", "bottom", "downward", "upward", "upper", "lower", "above", "below", "column", "row", "vertical", "horizontal", etc. refer to an arbitrary reference system.

[0040] When describing temporal relationships, when the time sequence is described as, for example, "after", "subsequent", "next", "before", "previous", "prior to", etc., non - consecutive or non - sequential cases may be included, unless more restrictive terms such as "just", "immediately", or "directly" are used.

[0041] It should be understood that although terms such as "first", "second", etc. may be used herein to describe various elements (e.g., layers, films, regions, components, segments, members, parts, areas, portions, steps, operations, etc.), these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present disclosure, the first element may be the second element, and similarly, the second element may be the first element. In addition, without departing from the scope of the present disclosure, the first element, the second element, etc. may be arbitrarily named according to the convenience of those skilled in the art. The terms "first", "second", etc. can be used to distinguish components from each other, but the functions or structures of the components are not limited by the serial numbers or component names in front of the components.

[0042] When describing the elements of the present disclosure, terms such as "first", "second", "A", "B", "(a)", "(b)", etc. can be used. These terms are intended to identify the corresponding elements (single or multiple) from other elements (single or multiple), and these terms are not used to define the nature, basis, order, or quantity of the elements.

[0043] For expressions such as an element (e.g., a layer, a film, a region, a component, a segment, etc.) being "connected", "coupled", "attached", "bonded", etc. to another element, unless otherwise specified, the element can not only be directly connected, coupled, attached, bonded, etc. to the other element, but also be indirectly connected, coupled, attached, bonded, etc. to the other element, with one or more intervening elements provided or inserted between the elements.

[0044] For expressions such as an element (e.g., a layer, a film, a region, a component, a segment, etc.) being "in contact with", "overlapping", etc. with another element, unless otherwise specified, the element can not only be directly in contact with, overlapping, etc. the other element, but also be indirectly in contact with, overlapping, etc. the other element, and one or more intervening elements are provided or inserted between the elements or layers.

[0045] Terms such as "line" or "direction" should not be interpreted only based on geometric relationships (in which the corresponding lines or directions are parallel or orthogonal to each other), and can refer to lines or directions with a broader directivity within the range where the components of the present disclosure can operate functionally.

[0046] The term "at least one" should be understood to include any and all combinations of one or more of the related listed items. For example, each of the phrases "at least one of the first item, the second item, or the third item" and "at least one of the first item, the second item, and the third item" can represent (i) a combination of one or more of the first item, the second item, and the third item, and (ii) only one of the first item, the second item, and the third item.

[0047] The expression “a first element, a second element, and / or a third element” should be understood to include one of the first, second, and third elements, as well as any or all combinations of the first, second, and third elements. For example, A, B, and / or C includes: only A; only B; only C; any one of A, B, and C (e.g., A, B, or C); some combination of A, B, and C (e.g., A and B; A and C; or B and C); and all of A, B, and C. Additionally, the expression “A / B” can be understood as A and / or B. For example, the expression “A / B” can mean: only A; only B; A or B; or A and B.

[0048] In one or more aspects, unless otherwise specified, the terms “between” and “among” may be used interchangeably merely for convenience. For example, the expression “between a plurality of elements” can be understood as among a plurality of elements. In another example, the expression “among a plurality of elements” can be understood as between a plurality of elements. In one or more examples, the number of elements can be two. In one or more examples, the number of elements can be more than two. Additionally, when an element (e.g., a layer, film, region, component, section, etc.) is referred to as “between at least two elements,” the element can be the only element between the at least two elements, or there can also be one or more intervening elements.

[0049] In one or more aspects, unless otherwise specified, the phrases “each other” and “one another” may be used interchangeably merely for convenience. For example, the expression “different from each other” can be understood as different from one another. In another example, the expression “different from one another” can be understood as different from each other. In one or more examples, the number of elements involved in the foregoing expressions can be two. In one or more examples, the number of elements involved in the foregoing expressions can be more than two.

[0050] In one or more aspects, unless otherwise specified, the phrases “one or more of...” and “one or more of the...” may be used interchangeably merely for convenience.

[0051] The term “or” means “inclusive or,” rather than “exclusive or.” For example, unless otherwise specified or clear from the context, “x uses a or b” means any natural inclusive arrangement. For example, “a or b” can mean “a,” “b,” or “a and b.” For example, “a, b, or c” can mean “a,” “b,” “c,” “a and b,” “b and c,” “a and c,” or “a, b, and c.”

[0052] Features of various aspects of the present disclosure may be partially or fully coupled or combined with each other, may be technically related to each other, or may be operatively, linked, or driven in various ways. Aspects of the present disclosure may be implemented or executed independently of each other, or may be implemented or executed together in a co-dependent or related relationship. In one or more aspects, components of each device according to various aspects of the present disclosure are operatively coupled and configured.

[0053] Unless otherwise defined, the terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the example aspects belong. Further understood is that terms, such as those defined in a common dictionary, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless explicitly defined otherwise herein.

[0054] The terms used herein have been selected as general terms in the relevant technical field. However, due to the development and / or changes in technology, convention, preferences of those skilled in the art, etc., there may be other terms in addition to these terms. Therefore, the terms used herein should not be construed as limiting the technical idea, but should be understood as examples of the terms used to illustrate the embodiments.

[0055] In addition, in specific cases, the terms may be arbitrarily selected by the applicant, and in such cases, their detailed meanings are described herein. Therefore, the terms used herein should be understood not only based on the name of the terms, but also based on the meaning of the terms and their content.

[0056] The "X-axis direction", "Y-axis direction", and "Z-axis direction" should not be interpreted only by the geometric relationship of being mutually perpendicular, and may have a wider directivity within the range where they can function in the elements of the present disclosure.

[0057] In the following description, various example aspects of the present disclosure are described in detail with reference to the accompanying drawings. Regarding the reference numerals of the elements in each drawing, the same elements may be shown in other drawings, and unless otherwise stated, similar reference numerals may refer to similar elements. In addition, for ease of description, the ratios, dimensions, sizes, and thicknesses of each element shown in the drawings may be different from the actual ratios, dimensions, sizes, and thicknesses, and thus, the aspects of the present disclosure are not limited to the ratios, dimensions, sizes, and thicknesses shown in the drawings.

[0058] Figure 1 is a plan view of a display device according to an embodiment of the present disclosure. Figure 2 is along according to an embodiment of the present disclosure Figure 1 sectional view taken along line A-A' of. Figure 3 is shown Figure 2Cross-sectional view of a bent display device's bent area.

[0059] Reference Figures 1 to 3 , according to an embodiment of the present disclosure, the display device 10 may include a display panel 100. The display panel 100 may include a display area DA and a non-display area NDA disposed around the display area DA. For example, in the display panel 100, the display area DA and the non-display area NDA disposed around the display area DA may be defined. Hereinafter, all mentioned areas may be represented as included in the display panel 100 or may be represented as defined in the display panel 100.

[0060] The display area DA may include a plurality of pixels PX. The plurality of pixels PX may be arranged in a matrix form, but the pixels are not limited thereto. The display area DA may have a rectangular shape, the rectangular shape including a short side extending in a first direction DR1 and a long side extending in a second direction DR2, and is not limited thereto.

[0061] In a plan view, the non-display area NDA may surround the display area DA. For example, the non-display area NDA may be arranged to surround all long sides (or sides extending in the second direction DR2) and all short sides (or sides extending in the first direction DR1) of the display area DA. However, the non-display area NDA is not limited thereto.

[0062] The non-display area NDA disposed on the other side of the display area DA in the second direction DR2 may protrude in the direction of the other side of the second direction DR2. The width of the non-display area NDA protruding in the direction of the other side of the second direction DR2 in the first direction DR1 may be smaller than the width of the display panel 100 on which the display area DA is disposed. The non-display area NDA protruding in the direction of the other side of the second direction DR2 may include a plurality of pad areas PA1 and PA2 and a bent area BA.

[0063] The bent area BA may be disposed between the display area DA and the first pad area PA1. Figure 1 and Figure 2 shows that the bent area BA is located at one end of the non-display area NDA on the side in the second direction DR2, and this one end protrudes in the direction of the other side of the second direction DR2. However, the embodiments of the present disclosure are not limited thereto. As Figure 3 shown, the display panel 100 may be bent in the bent area BA. When the display panel 100 is bent in the bent area BA, the first pad area PA1 and the second pad area PA2 of the display panel may be respectively arranged to overlap the display area DA in the thickness direction.

[0064] The first pad region PA1 may be disposed between the bending region BA and the second pad region PA2. The data driving component DIC may be disposed at the first pad region PA1. The first pad region PA1 may include a plurality of first pads. The data driving component DIC may include a plurality of bumps. The first pads of the first pad region PA1 and the plurality of bumps of the data driving component DIC may be electrically connected to each other. The first pads and the bumps may be electrically connected through an anisotropic conductive film (ACF), and are not limited thereto. The first pads and the bumps may also be electrically connected through ultrasonic bonding. However, embodiments of the present disclosure are not limited thereto.

[0065] The second pad region PA2 may be disposed at the other end on the other side of the display panel 100 in the second direction DR2, and the other end protrudes in the direction on the other side of the second direction DR2. The flexible printed circuit board FPCB may be attached to the second pad region PA2. The second pad region PA2 may include a plurality of second pads, and the flexible printed circuit board FPCB may include a plurality of leads. The plurality of second pads and the plurality of leads may be electrically connected to each other. The second pads and the leads may be electrically connected through an anisotropic conductive film (ACF), and are not limited thereto. The second pads and the leads may also be electrically connected through ultrasonic bonding. However, embodiments of the present disclosure are not limited thereto.

[0066] The display device 10 according to an embodiment of the present disclosure may further include a reinforcing member SP disposed around the data driving component DIC. The reinforcing member SP may surround the data driving component DIC in a plan view. For example, the reinforcing member SP may include a portion disposed on the other side of the data driving component DIC in the first direction DR1 and extending in the second direction DR2, a portion disposed on one side of the data driving component DIC in the first direction DR1 and extending in the second direction DR2, and a portion disposed on one side of the data driving component DIC in the second direction DR2 and extending in the first direction DR1. The reinforcing member SP may have a rectangular shape having an open side (or shape) longer than the other side, but embodiments of the present disclosure are not limited thereto. The reinforcing member SP may not be disposed on the other side of the data driving component DIC in the second direction DR2. The reinforcing member SP may not be disposed between the data driving component DIC and the flexible printed circuit board FPCB, or between the data driving component DIC and the second pad region PA2.

[0067] The display panel 100 includes a bending region BA. Thus, when the display panel 100 is bent with respect to the bending region BA, the display panel 100 can be formed to have a very thin thickness to minimize the bending stress of the display panel 100. Since the data driving component DIC having high rigidity is disposed at the first pad region PA1, when the display panel 100 is bent, the peripheral region of the data driving component DIC may be very vulnerable to the rigidity.

[0068] In the case of the display device 10 according to an embodiment of the present disclosure, a reinforcing component SP having high rigidity is disposed around the data driving component DIC. Thus, when the display panel 100 is bent, the rigidity of the peripheral region of the data driving component DIC can be increased.

[0069] The reinforcing component SP is not disposed between the data driving component DIC and the flexible printed circuit board FPCB or between the data driving component DIC and the second pad region PA2, and thus, the physical interference with the flexible printed circuit board FPCB attached to the second pad region PA2 can be minimized.

[0070] The flexible printed circuit board FPCB may further include a connector CN and may be electrically connected to a main circuit board or the like through the connector CN. However, the embodiments of the present disclosure are not limited thereto.

[0071] The display device 10 according to an embodiment of the present disclosure may further include a connection member CT overlapping with the data driving component DIC, the reinforcing component SP, and the flexible printed circuit board FPCB. The connection member CT may cover or shield the data driving component DIC. For example, the connection member CT may completely (or entirely) cover or shield the data driving component DIC. The connection member CT may shield the data driving component DIC from external static electricity by completely covering the data driving component DIC.

[0072] As Figure 2 shown, the connection member CT may cover the data driving component DIC and overlap with the reinforcing component SP around the data driving component DIC. For example, the connection member CT may completely cover the data driving component DIC and overlap with the reinforcing component SP around the data driving component DIC. The connection member CT may partially overlap with the reinforcing component SP and may not overlap with another part of the reinforcing component SP. However, the embodiments of the present disclosure are not limited thereto.

[0073] Figure 4 is a cross-sectional view of a Figure 2 display panel according to an embodiment of the present disclosure.

[0074] Refer to Figure 4, the display panel 100 may include a substrate 101, a first thin film transistor 120, a second thin film transistor 130, a light emitting component 150, an encapsulation component 170, and a touch component 180.

[0075] The substrate 101 may include one or more plastic materials. For example, the substrate 101 may be a multi-substrate including a variety of plastic materials such as polyimide, but embodiments of the present disclosure are not limited thereto.

[0076] A buffer layer 102 may be disposed on the substrate 101. The buffer layer 102 may minimize or delay the diffusion of moisture or oxygen penetrating into the substrate 101. The buffer layer 102 may be formed by alternately stacking silicon nitride (SiN x ) and silicon oxide (SiO x ) at least once, but embodiments of the present disclosure are not limited thereto.

[0077] A first light-shielding layer 126 may be disposed on the buffer layer 102. The first light-shielding layer 126 may prevent light from transmitting through the first semiconductor layer 123 of the first thin film transistor 120. For example, the first semiconductor layer 123 may be disposed to overlap with the first light-shielding layer 126. The first light-shielding layer 126 may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof. However, embodiments of the present disclosure are not limited thereto.

[0078] A first insulating layer 103 may be disposed on the first light-shielding layer 126. The first insulating layer 103 may prevent a short circuit between the components of the first thin film transistor 120 and the first light-shielding layer 126. The first insulating layer 103 may be formed of the same material as that of the buffer layer 102. However, embodiments of the present disclosure are not limited thereto. For example, the first insulating layer 103 may be formed of inorganic materials such as silicon nitride (SiN x ) and silicon oxide (SiO x ). However, embodiments of the present disclosure are not limited thereto.

[0079] The first thin film transistor 120 may be disposed on the first insulating layer 103. The first thin film transistor 120 may include a first source electrode 121, a first gate electrode 122, a first semiconductor layer 123, and a first drain electrode 124.

[0080] The first semiconductor layer 123 may be disposed on the first insulating layer 103. The first semiconductor layer 123 may include an oxide semiconductor material such as indium gallium zinc oxide (IGZO) and semiconductor materials such as amorphous silicon, low-temperature polycrystalline silicon, and polycrystalline silicon. However, embodiments of the present disclosure are not limited thereto. The first semiconductor layer 123 may include a channel region, a source region, and a drain region.

[0081] The low-temperature polycrystalline semiconductor layer or the polycrystalline semiconductor layer has a higher mobility than the amorphous semiconductor layer and the oxide semiconductor layer, and thus can have lower power consumption and excellent reliability. Therefore, the driving transistor can be composed of a low-temperature polycrystalline semiconductor layer or a polycrystalline semiconductor film, but the embodiments of the present disclosure are not limited thereto.

[0082] The second insulating layer 104 may be disposed on the first semiconductor layer 123. The second insulating layer 104 may be formed of the same material as that of the first insulating layer 103, and may prevent a short circuit between the first semiconductor layer 123 and other components of the first thin film transistor 120.

[0083] The first gate electrode 122 may be disposed on the second insulating layer 104. The first gate electrode 122 may be disposed on the second insulating layer 104 so as to overlap with the channel region of the first semiconductor layer 123. The first gate electrode 122 may be formed as a single layer or multiple layers including molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or a composite thereof, but the embodiments of the present disclosure are not limited thereto. The first gate electrode 122 may be provided together with the gate line.

[0084] The third insulating layer 105 may be disposed on the first gate electrode 122. The third insulating layer 105 may be formed of the same material as that of the first insulating layer 103 or the second insulating layer 104, but the embodiments of the present disclosure are not limited thereto.

[0085] The first source electrode 121 and the first drain electrode 124 may be disposed on the third insulating layer 105.

[0086] The first source electrode 121 and the first drain electrode 124 may be electrically connected to the first semiconductor layer 123 through contact holes. The first source electrode 121 and the first drain electrode 124 may be formed of a metal material. For example, the first source electrode 121 and the first drain electrode 124 may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof, but the embodiments of the present disclosure are not limited thereto.

[0087] The first source electrode 121 and the first drain electrode 124 may be provided together with the data line. For example, the data line may be formed of the same material as that of the first source electrode 121 and the first drain electrode 124 and on the same layer, but the embodiments of the present disclosure are not limited thereto.

[0088] The storage electrode 140 may be provided to be spaced apart from the first thin film transistor 120. The storage electrode 140 may include a first storage electrode 141, a second storage electrode 142, and a third storage electrode 143.

[0089] The first storage electrode 141 may be formed of the same material as the first gate electrode 122 and on the same layer, but embodiments of the present disclosure are not limited thereto.

[0090] The second storage electrode 142 may be disposed on the first storage electrode 141. The second storage electrode 142 may be disposed on the third insulating layer 105, and a capacitor may be formed with the third insulating film 105 between the first storage electrode 141 and the second storage circuit 142 as a dielectric. The second storage electrode 142 may be formed of the same material as the material of the first storage electrode 141, but embodiments of the present disclosure are not limited thereto.

[0091] The second thin film transistor 130 may be disposed to be spaced apart from the first thin film transistor 120 and the storage electrode 140. The second thin film transistor 130 may include a second source electrode 131, a second gate electrode 132, a second semiconductor layer 133, and a second drain electrode 134.

[0092] The second light-shielding layer 136 may be disposed on the same layer as the second storage electrode 142.

[0093] The second light-shielding layer 136 may prevent light from reaching the second semiconductor layer 133 in a manner similar to that of the first light-shielding layer 126, thereby extending the lifespan of the second thin film transistor 130. For example, the second semiconductor layer 133 may be disposed to overlap with the second light-shielding layer 136.

[0094] The fourth insulating layer 106 may be disposed on the second light-shielding layer 136. The fourth insulating layer 106 may be formed of the same material as the first insulating layer 103, the second insulating layer 104, or the third insulating layer 105, but embodiments of the present disclosure are not limited thereto.

[0095] The second semiconductor layer 133 may be disposed on the fourth insulating layer 106. The second semiconductor layer 133 may include a source region, a drain region, and a channel region between the source region and the drain region.

[0096] The second semiconductor layer 133 may include an oxide semiconductor material such as indium gallium zinc oxide (IGZO) and semiconductor materials such as amorphous silicon, low-temperature polycrystalline silicon, polycrystalline silicon, and the like. However, embodiments of the present disclosure are not limited thereto.

[0097] The fifth insulating layer 108 may be disposed on the second semiconductor layer 133. The fifth insulating layer 108 may be formed of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105, or the fourth insulating layer 106, but embodiments of the present disclosure are not limited thereto.

[0098] The second gate electrode 132 may be disposed on the fifth insulating layer 108.

[0099] The second gate electrode 132 may be formed of the same material as that of the first gate electrode 122, but embodiments of the present disclosure are not limited thereto. For example, the second gate electrode 132 may be formed as a single layer or multiple layers including molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or a composite thereof, but embodiments of the present disclosure are not limited thereto.

[0100] The sixth insulating layer 109 may be disposed on the second gate electrode 132. The sixth insulating layer 109 may be formed of the same material as that of the first insulating layer 103, the second insulating layer 104, the third insulating layer 105, the fourth insulating layer 106, or the fifth insulating layer 108, but embodiments of the present disclosure are not limited thereto.

[0101] The first source electrode 121, the first drain electrode 124, the third storage electrode 143, the second source electrode 131, and the second drain electrode 134 may be disposed on the sixth insulating layer 109.

[0102] The third storage electrode 143, the second source electrode 131, and the second drain electrode 134 may be formed of the same material as that of the first source electrode 121 and the first drain electrode 124, and may be disposed on the same layer as the first source electrode 121 and the first drain electrode 124, but embodiments of the present disclosure are not limited thereto. For example, the third storage electrode 143, the second source electrode 131, and the second drain electrode 134 may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof, but embodiments of the present disclosure are not limited thereto.

[0103] The first thin film transistor 120 may be a driving transistor, and the second thin film transistor 130 may be a switching transistor, but embodiments of the present disclosure are not limited thereto.

[0104] The first protective layer 111 may be disposed on the first source electrode 121 and the first drain electrode 124.

[0105] The first protective layer 111 may planarize the upper portion of the first thin film transistor 120 and protect the first thin film transistor 120. The first protective layer 111 may be formed of an organic material. For example, the first protective layer 111 may be formed of an organic material including acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin, but embodiments of the present disclosure are not limited thereto.

[0106] The second protective layer 112 may be disposed on the first protective layer 111. The second protective layer 112 may be formed of the same material as that of the first protective layer 111, but embodiments of the present disclosure are not limited thereto.

[0107] The connection electrode 145 may be disposed between the first protective layer 111 and the second protective layer 112.

[0108] The connection electrode 145 may electrically connect the first thin film transistor 120 and the light emitting component 150. The connection electrode 145 may be formed of the same material as that of the first source electrode 121 and the first drain electrode 124, but embodiments of the present disclosure are not limited thereto.

[0109] The connection electrode 145 may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof, but embodiments of the present disclosure are not limited thereto.

[0110] The light emitting component 150 may be disposed on the second protective layer 112. The light emitting component 150 may include an anode electrode 151, an organic layer 152, and a cathode electrode 153.

[0111] The anode electrode 151 may be disposed on the second protective layer 112. The anode electrode 151 may be electrically connected to the first thin film transistor 120 through a contact hole formed in the second protective layer 112. The anode electrode 151 may be a reflective electrode or a transparent electrode for reflecting light, but embodiments of the present disclosure are not limited thereto. The anode electrode 151 may include a stacked structure (Ti / Al / Ti) of metal materials having a high reflectivity, such as aluminum (Al) and titanium (Ti), a stacked structure ITO / Al / ITO of aluminum (Al) and ITO, an APC alloy, and may be formed as a single layer or multiple layers. However, embodiments of the present disclosure are not limited thereto.

[0112] The organic layer 152 may be disposed on the anode electrode 151. The organic layer 152 may include one or more light-emitting structures (or light-emitting devices or elements), in which a hole transport layer and an electron transport layer are stacked on the anode electrode 151 in the listed order or the reverse order. For example, the hole transport layer may include a hole injection layer, an electron blocking layer, a P-type charge generation layer, etc., but the embodiments of the present disclosure are not limited thereto. For example, the electron transport layer may include an electron injection layer, a hole blocking layer, an N-type charge generation layer, etc., but the embodiments of the present disclosure are not limited thereto. The organic layer 152 may be an organic light-emitting layer, an inorganic light-emitting layer, a quantum dot light-emitting layer, a micro light-emitting diode, a micro-mini light-emitting diode, etc., but the embodiments of the present disclosure are not limited thereto. For example, the organic layer 152 of the display panel 100 according to the embodiments of the present disclosure may include an organic light-emitting layer. The organic layer 152 may include a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer. The organic layer 152 may further include a white light-emitting layer, but the embodiments of the present disclosure are not limited thereto.

[0113] The cathode electrode 153 may be disposed on the organic layer 152. The cathode electrode 153 may be a transparent electrode or a reflective electrode for transmitting light, but the embodiments of the present disclosure are not limited thereto. For example, the cathode electrode 153 may include a transparent conductive material (such as indium tin oxide (ITO) or indium zinc oxide (IZO)), or a metal that transmits visible light.

[0114] The bank 154 may be provided to expose the anode electrode 151. The bank 154 may define an opening (or emission region) of the sub-pixel and may be provided to cover an edge portion of the anode electrode 151. Each sub-pixel may include a red emission region, a green emission region, and a blue emission region. Each sub-pixel may further include a white emission region. For example, the sub-pixel may be a pixel, but the term is not limited thereto. The bank 154 may be composed of a material including a black pigment, etc. or an organic material such as a benzocyclobutene resin, a polyimide resin, an acrylic resin, or a photosensitive polymer, but the embodiments of the present disclosure are not limited thereto. When the bank 154 is formed of a material including a black pigment, a black dye, etc., the bank 154 may be a black bank. When the bank 154 is formed of a material including a black pigment or a black dye, the bank can block external light or light reflected from the outside, thereby further improving the brightness of the display device.

[0115] The encapsulation member 170 may be disposed on the embankment 154 or the light-emitting member 150. The encapsulation member 170 may include one or more insulating layers. For example, the encapsulation member 170 may include a first encapsulation layer 171, a second encapsulation layer 172 on the first encapsulation layer 171, and a third encapsulation layer 173 on the second encapsulation layer 172. The encapsulation member 170 may include one or more inorganic material layers and one or more organic material layers. For example, the first encapsulation layer 171 and the third encapsulation layer 173 may include inorganic materials, and the second encapsulation layer 172 may include organic materials, but embodiments of the present disclosure are not limited thereto.

[0116] The touch buffer layer 181 may be disposed on the encapsulation member 170. For example, the touch buffer layer 181 may be disposed on the third encapsulation layer 173. The touch buffer layer 181 may be formed of the same material as that of the buffer layer 102, but embodiments of the present disclosure are not limited thereto. The touch insulation layer 184 may be disposed on the touch buffer layer 181. The touch insulation layer 184 may prevent a short circuit between the touch electrodes. The touch insulation layer 184 may be formed of silicon oxide (SiO x ), silicon nitride (SiN x ), or a multi-layer thereof, but embodiments of the present disclosure are not limited thereto. The first touch electrode 185 may be disposed on the touch insulation layer 184. The first touch electrode 185 may include a 1a touch electrode 185a extending in a first direction and a 1b touch electrode 185b extending in a second direction different from the first direction.

[0117] The second touch electrode 182 may be disposed between the touch buffer layer 181 and the touch insulation layer 184.

[0118] The second touch electrode 182 may be electrically connected to the 1a touch electrode 185a through a contact hole formed in the touch insulation layer 184. For example, the 1a touch electrode 185a and the second touch electrode 182 may extend in the first direction.

[0119] The first touch electrode 185 and the second touch electrode 182 may include a metal material. For example, the first touch electrode 185 and the second touch electrode 182 may be formed of titanium (Ti), nickel (Ni), aluminum (Al), or an alloy thereof, or may be formed as a three-layer such as titanium (Ti) / aluminum (Al) / titanium (Ti), but embodiments of the present disclosure are not limited thereto.

[0120] Figure 5 is an enlarged plan view of the region Q1 according to an embodiment of the present disclosure Figure 1 of. Figure 6 is a cross-sectional view taken along the line B-B’ according to an embodiment of the present disclosure Figure 5 of. Figure 7 is according to an embodiment of the present disclosureFigure 6 An enlarged plan view of region Q2. Figure 8 is an enlarged plan view of Figure 6 region Q3 according to an embodiment of the present disclosure. Figure 9 is an enlarged plan view of Figure 6 region Q4 according to an embodiment of the present disclosure. Figure 10 is a cross-sectional view taken along line C-C' in Figure 5 according to an embodiment of the present disclosure.

[0121] Referring to Figures 5 to 10 , a display device 10 according to an embodiment of the present disclosure may include a display panel 100 and a flexible printed circuit board FPCB. Since the description of the display panel 100 is substantially the same as that in reference Figures 1 to 4 , its repeated description may be omitted or briefly described.

[0122] Referring to Figures 5 to 10 , a display panel 100 according to an embodiment of the present disclosure may include a data driving component DIC and a plurality of pad regions PA1 and PA2. Since the description of the data driving component DIC and the plurality of pad regions PA1 and PA2 is substantially the same as that in reference Figures 1 to 4 , its repeated description may be omitted or briefly described.

[0123] For example, the data driving component DIC may be disposed at the first pad region PA1. The second pad region PA2 may be at the flexible printed circuit board FPCB.

[0124] As Figure 5 shown, a ground line GNL may be formed at the flexible printed circuit board FPCB. The connection member CT may have a substantially rectangular shape. The connection member CT may further include a protrusion that protrudes to the other side in the second direction DR2 to overlap with the ground line GNL of the flexible printed circuit board FPCB. The length of the connection member CT having the protrusion formed therein in the second direction DR2 may be greater than the length of the connection member CT not having the protrusion formed therein in the second direction DR2. The data driving component DIC and the reinforcing component SP may be spaced apart from each other.

[0125] As Figure 6 shown, the ground line GNL may be disposed on the base film BS of the flexible printed circuit board FPCB, but the embodiments of the present disclosure are not limited thereto. For example, according to a display device according to some embodiments of the present disclosure, the flexible printed circuit board FPCB may further include an insulating layer that is on the ground line GNL and in Figure 5 the region where the ground line GNL of

[0126] As Figure 6As shown, the connecting member CT can be adjacent to the data driving component DIC, the reinforcing component SP, and the printed circuit board FPCB. For example, the connecting member CT can be directly adjacent to the data driving component DIC, the reinforcing component SP, and the printed circuit board FPCB. The data driving component DIC can have a first thickness t1, and the reinforcing component SP can have a second thickness t2. The first thickness t1 can be the thickness of the data driving component DIC in the third direction DR3. The second thickness t2 can be the thickness of the reinforcing component SP in the third direction DR3. The space (or separation space) GAP can be the distance (or separation distance) between the data driving component DIC and the reinforcing component SP, and can be the distance (or separation distance) in the second direction DR2. The first thickness t1 and the second thickness t2 can be different from each other, and the first thickness t1 can be greater than the second thickness t2. Since the thickness t1 of the data driving component DIC is greater than the thickness t2 of the reinforcing component SP, the connecting member CT can have an inclined surface in the space between the data driving component DIC and the reinforcing component SP. In an embodiment of the present disclosure, the inclined surface can be any surface whose upper surface does not extend in the second direction DR2 (or horizontal direction). For example, the inclined surface can include not only an inclined surface with a constant inclination (or constant slope), but also an inclined surface with a non-constant inclination (or non-constant slope). For example, at least a part of the inclined surface with a non-constant inclination (or non-constant slope) can include an inclined surface including a curved surface (or bevel surface), but the embodiments of the present disclosure are not limited thereto.

[0127] As Figure 7 shown, the connecting member CT can include multiple layers. The connecting member CT can include a connecting portion 230, an insulating portion 220 on the connecting portion 230, and a conductive portion 210 on the insulating portion 220. The connecting portion 230 can include a base material 231, a first adhesive portion 232 between the base material 231 and the insulating portion 220, and a second adhesive portion 233 between the base material 231 and the reinforcing component SP. The base material 231 can include polyethylene terephthalate (PET), but the embodiments of the present disclosure are not limited thereto. The first adhesive portion 232 and the second adhesive portion 233 can include a pressure-sensitive adhesive (PSA), but the embodiments of the present disclosure are not limited thereto. The connecting portion 230 can connect the insulating portion 220 and the reinforcing component SP below it. In Figure 7 it, the connecting portion 230 is shown as a double-sided tape, but the embodiments of the present disclosure are not limited thereto. For example, the connecting portion 230 can be formed of an adhesive material or an adhesive.

[0128] The insulating portion 220 can include an insulating material. The insulating material can include an organic insulating material or an inorganic insulating material.

[0129] The conductive portion 210 may include a metal having conductivity. For example, the conductive portion 210 may be formed as a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof. However, embodiments of the present disclosure are not limited thereto. The conductive portion 210 may include a first contact hole CTH1 passing through the insulating portion 220 and the connecting portion 230. For example, in the first contact hole CTH1, the conductive portion 210 may be exposed to the reinforcing member SP. The conductive portion 210 exposed to the reinforcing member SP in the first contact hole CTH1 may contact the reinforcing member SP and be electrically connected to the reinforcing member SP. For example, the conductive portion 210 exposed to the reinforcing member SP in the first contact hole CTH1 may directly contact the reinforcing member SP and be electrically connected to the reinforcing member SP. The first contact hole CTH1 may contact the reinforcing member SP and be electrically connected to the reinforcing member SP. For example, the first contact hole CTH1 may directly contact the reinforcing member SP and be electrically connected to the reinforcing member SP.

[0130] In the display device 10 according to an embodiment of the present disclosure, the connection member CT is electrically connected to the reinforcing member SP, thereby increasing the electrical grounding path. According to an embodiment of the present disclosure, the reinforcing member SP may include a conductive material such as a metal material. The reinforcing member SP made of the metal material may be used as a grounding path. For example, the grounding path may be the display panel 100, the conductive portion 210 of the connection member CT, and the printed circuit board FPCB. The conductive portion 210 of the connection member CT may be electrically connected to the reinforcing member SP directly disposed on the display panel 100, thereby providing a grounding path to the display panel 100. Figure 7 Only the electrical connection between the connection member CT and the reinforcing member SP on one side of the data driving component DIC in the second direction DR2 is shown, Figure 7 The electrical connection between the conductive portion 210 and the reinforcing member SP shown in can also be applied to the connection members CT and the reinforcing member SP on one side and the other side of the data driving component DIC in the first direction DR1. The reinforcing member SP may be provided to surround the periphery of the data driving component DIC. The connection member CT may be electrically connected to the reinforcing member SP surrounding the periphery of the data driving component DIC, and the reinforcing member SP may be formed of a metal material, so that a grounding path can be formed. For example, the reinforcing member SP may be used as a ground terminal, and the printed circuit board FPCB may include a ground wire GNL. In addition, the connection member CT may connect the ground wire GNL and the ground terminal (reinforcing member SP). In addition, the connection member CT shields the data driving component DIC, thereby preventing static electricity from being generated. Therefore, the connection member CT may be an overall connection member that prevents static electricity and performs a grounding function. [[ID=http: / / www.wipo.int / pct / en / wo.jsp?wo=2017 / 066042]]

[0131] As Figure 8As shown, the connection member CT can be attached to the flexible printed circuit board FPCB. The connection member CT can be attached to the flexible printed circuit board FPCB through Figure 7 the second adhesive portion 233 described in

[0132] . The conductive portion 210 can be exposed in the region where the conductive portion 210 overlaps with the flexible printed circuit board FPCB. The conductive portion 210 can be electrically connected to the flexible printed circuit board FPCB through a second contact hole CTH2 passing through the insulating portion 220 and the connecting portion 230. Figure 9 As shown, the connection member CT can be attached to the data driver integrated circuit DIC. The connection member CT can be attached to the data driver integrated circuit DIC through Figure 7 the second adhesive portion 233 described in

[0133] . The conductive portion 210 of the connection member CT may not be exposed on the data driver integrated circuit DIC.

[0134] Figure 10 Hereinafter, a display device according to another embodiment of the present disclosure will be described. For reference numerals that are the same as or similar to those described above, repeated descriptions thereof may be omitted or briefly described. Figure 11 FIG.

[0135] Referring to Figure 10 and Figure 11 , the connection member CT_1 of the display device 11 according to an embodiment of the present disclosure can have different thicknesses for each region.

[0136] Referring to Figure 10 and Figure 11 and Figure 5 , the connection member CT can contact the data driver integrated circuit DIC, the reinforcing member SP, and the flexible printed circuit board FPCB. Since the thickness t1 of the data driver integrated circuit DIC is greater than the thickness t2 of the reinforcing member SP, the connection member CT can have an inclined surface in the space GAP between the data driver integrated circuit DIC and the reinforcing member SP. Near the inclined surface of the connection member CT, the connection member CT is likely to peel off from the upper surface of the reinforcing member SP or the upper surface of the data driver integrated circuit DIC. If the connection member CT peels off from the upper surface of the reinforcing member SP or the upper surface of the data driver integrated circuit DIC, the adhesion area between the connection member CT and the reinforcing member SP or between the connection member CT and the data driver integrated circuit DIC may be reduced, resulting in poor adhesion.

[0137] In addition, an air gap may be formed between the inclined surface of the connection member CT and the upper surface of the reinforcement member SP or the upper surface of the data driving member DIC. Due to the air gap, air bubbles may be formed on the surface of the second bonding portion (see the reference numeral 233 in Figure 7 of the drawing) of the connection portion (see the reference numeral 230 in Figure 7 of the drawing) of the connection member CT. Air bubbles formed on the surface of the second bonding portion (see the reference numeral 233 in Figure 7 of the drawing) of the connection portion (see the reference numeral 230 in Figure 7 of the drawing) of the connection member CT may cause poor adhesion between the connection member CT and the reinforcement member SP or between the connection member CT and the data driving member DIC.

[0138] According to an embodiment of the present disclosure, the connection member CT_1 may compensate for the step difference between the data driving member DIC and the reinforcement member SP. For example, the connection member CT_1 may be configured to have a greater thickness at the reinforcement member so as to compensate for the height difference between the data driving member DIC and the reinforcement member SP. Therefore, an inclined surface may not be formed on the connection member CT_1, and the adhesion or attachment force between the connection member CT_1 and the underlying reinforcement member SP or the data driving member DIC may be further improved.

[0139] The connection member CT_1 may include a first portion CT1 and a second portion CT2. The first portion CT1 may overlap with the data driving member DIC, the printed circuit board FPCB, the gap space GAP between the data driving member DIC and the reinforcement member SP, and the space (or separation space) between the data driving member DIC and the printed circuit board FPCB. The second portion CT2 may overlap with the reinforcement member SP. The first portion CT1 may have a third thickness t3a. The second portion CT2 may have a fourth thickness t3b. The fourth thickness t3b may be greater than the third thickness t3a. The difference between the fourth thickness t3b and the third thickness t3a may be the same as the difference between the first thickness t1 and the second thickness t2.

[0140] In accordance with Figure 10 and Figure 11In the display device 11, the second portion CT2 of the connection member CT_1 having the fourth thickness t3b overlaps with the reinforcing member SP. Accordingly, in the space GAP between the data driving member DIC and the reinforcing member SP, the connection member CT_1 can be set to be flat without an inclined surface (or bevel surface). In an embodiment, the surface of the portion of the connection member CT_1 facing the data driving member DIC is formed by a horizontal surface. In an embodiment, the surface of the portion of the connection member CT_1 facing the reinforcing member SP is formed by a horizontal surface. In an embodiment, the surface of the portion of the connection member CT_1 facing the spaced-apart space GAP between the data driving member DIC and the reinforcing member SP is formed by a horizontal surface. In an embodiment, the surface of the portion of the first portion CT1 facing the data driving member DIC and the surface of the portion of the first portion CT1 facing the spaced-apart space GAP between the data driving member DIC and the reinforcing member SP are formed as a first horizontal surface, and the surface of the second portion CT2 facing the reinforcing member SP is formed as a second horizontal surface. In an embodiment, the surface of the portion of the first portion CT1 facing the data driving member DIC and a part of the surface of the portion of the first portion CT1 facing the spaced-apart space GAP between the data driving member DIC and the reinforcing member SP are formed as a first horizontal surface, the surface of the second portion CT2 facing the reinforcing member SP is formed as a second horizontal surface, and the surface of the remaining portion of the portion of the first portion CT1 facing the spaced-apart space GAP between the data driving member DIC and the reinforcing member SP is formed as a third horizontal surface. Accordingly, the problem of peeling of the connection member CT_1 at the portion where the connection member CT_1 is connected to the upper surface of the reinforcing member SP or the upper surface of the data driving member DIC can be further improved. As a result, the adhesion failure that may occur due to the peeling of the connection member CT_1 from the upper surface of the reinforcing member SP or the upper surface of the data driving member DIC can be further improved.

[0141] In addition, since the connection member CT_1 is set to be flat without an inclined surface (or bevel surface) in the space GAP between the data driving member DIC and the reinforcing member SP, an air gap can be prevented from being formed between the connection member CT_1 and the upper surface of the reinforcing member SP or the upper surface of the data driving member DIC in advance.

[0142] Figure 12 is a cross-sectional view of a display device according to another embodiment of the present disclosure.

[0143] Reference Figure 12 According to, the connection member CT_2 of the display device 12 according to another embodiment of the present disclosure may further include a third portion CT3.

[0144] The third part CT3 can be disposed between the first part CT1 and the second part CT2. The third part CT3 can be disposed in a space (or separation space) GAP between the data driving component DIC and the strengthening component SP. The third part CT3 can have a fifth thickness t3c. The fifth thickness t3c can be greater than the fourth thickness t3b. The difference between the fifth thickness t3c and the third thickness t3a can be the same as the thickness t1 of the data driving component DIC.

[0145] According to Figure 12 the display device 12, the third part CT3 can be attached to the upper surface of the display panel 100. For example, the third part CT3 can be directly attached to the upper surface of the display panel 100. As a result, the adhesion between the connecting member CT_2 and the components SP, DIC, and 100 below the connecting member CT_2 can be further enhanced. In addition, since the connecting member CT_2 is additionally coupled to the display panel 100 between the data driving component DIC and the strengthening component SP, the connecting member CT_2 is less likely (or can be reduced) to peel off from the strengthening component SP or the data driving component DIC.

[0146] For example, the width of the third part CT3 can be less than the width of the space GAP. Since the width of the third part CT3 is less than the width of the space GAP, when the connecting member CT_2 is attached to the data driving component DIC and the strengthening component SP, even if an alignment error occurs, the third part CT3 can avoid overlapping with the data driving component DIC or the strengthening component SP.

[0147] The display device according to various embodiments of the present disclosure can be applied to mobile devices, video phones, smart watches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, curved devices, sliding devices, variable devices, electronic notebooks, e-books, portable multimedia players (PMPs), personal digital assistants (PDAs), MP3 players, mobile medical equipment, desktop PCs, laptop PCs, netbook computers, workstations, navigation devices, vehicle navigation devices, vehicle display devices, vehicle equipment, theater equipment, theater display devices, TVs, wallpaper devices, sign devices, game devices, laptops, monitors, cameras, video cameras, and household appliances, etc.

[0148] The display device according to various embodiments of the present disclosure can be described as follows.

[0149] A display device according to various embodiments of the present disclosure may include: a display panel including a display area having a plurality of pixels and a first pad area provided around the display area; a data driving component on the first pad area; and a connection member on the data driving component. The connection member may have different thicknesses according to the portion thereof provided in the data driving component.

[0150] According to various embodiments of the present disclosure, the connection member may cover the data driving component.

[0151] According to various embodiments of the present disclosure, the display device may further include a reinforcing member provided around the data driving component and spaced apart from the data driving component.

[0152] According to various embodiments of the present disclosure, the thickness of the data driving component may be greater than the thickness of the reinforcing member.

[0153] According to various embodiments of the present disclosure, the connection member may include a first portion and a second portion overlapping with the reinforcing member. The thickness of the second portion may be greater than the thickness of the first portion.

[0154] According to various embodiments of the present disclosure, the first portion may overlap with the data driving component.

[0155] According to various embodiments of the present disclosure, the first portion may be provided at a space between the data driving component and the reinforcing member.

[0156] According to various embodiments of the present disclosure, the connection member may further include a third portion overlapping with the space between the data driving component and the reinforcing member. The thickness of the third portion may be greater than the thickness of the second portion.

[0157] According to various embodiments of the present disclosure, the connection member may include a connection portion and a conductive portion on the connection portion.

[0158] According to various embodiments of the present disclosure, the connection portion at the first portion may be attached to the data driver. The connection portion at the second portion may be attached to the reinforcing member.

[0159] According to various embodiments of the present disclosure, the conductive portion at the second portion may contact the reinforcing member.

[0160] According to various embodiments of the present disclosure, the display panel may further include a second pad area. The display device may further include a printed circuit board located in the second pad area. The first portion of the connection member may overlap with a portion of the printed circuit board.

[0161] According to various embodiments of the present disclosure, the printed circuit board may further include a ground wire. The conductive portion at the first portion of the connection member may contact the ground wire.

[0162] According to various embodiments of the present disclosure, a reinforcing member may not be provided between the data driving member and the second pad region.

[0163] According to various embodiments of the present disclosure, the reinforcing member may include a conductive material, and the conductive portion at the second portion may contact the conductive material.

[0164] A display device according to various embodiments of the present disclosure may include: a display panel including a display area having a plurality of pixels and a first pad region provided around the display area; a data driving member provided on the first pad region; and a connection member covering the data driving member. The connection member may not include an inclined surface.

[0165] According to various embodiments of the present disclosure, the surface of the portion of the connection member facing the data driving member may be formed by a horizontal surface.

[0166] According to various embodiments of the present disclosure, the connection member may cover the data driving member.

[0167] According to various embodiments of the present disclosure, the display device may further include a reinforcing member provided around the data driving member and spaced apart from the data driving member. The connection member and the reinforcing member may be electrically connected to each other.

[0168] According to various embodiments of the present disclosure, the display panel may further include a second pad region. The display device may further include a printed circuit board at the second pad region. The connection member may be electrically connected to the printed circuit board.

[0169] According to various embodiments of the present disclosure, the connection member may include a connection portion and a conductive portion on the connection portion. The conductive portion may be electrically connected to the reinforcing member and the printed circuit board.

[0170] According to various embodiments of the present disclosure, a reinforcing member may not be provided between the data driving member and the second pad region.

[0171] According to various embodiments of the present disclosure, the connection member may include a first portion and a second portion. The first portion may overlap with the data driving member and the spaced-apart space between the data driving member and the reinforcing member, and the second portion may overlap with the reinforcing member.

[0172] According to various embodiments of the present disclosure, the surface of the portion of the first portion facing the data driving member and the surface of the portion of the first portion facing the spaced-apart space between the data driving member and the reinforcing member may be formed by a first horizontal surface, and the surface of the second portion facing the reinforcing member may be formed by a second horizontal surface.

[0173] According to various embodiments of the present disclosure, a surface of a portion of the first part facing the data driving member and a surface of a part of a portion of the first part facing the spaced-apart space between the data driving member and the reinforcing member may be formed by a first horizontal surface, a surface of the second part facing the reinforcing member may be formed by a second horizontal surface, and a surface of the remaining portion of the portion of the first part facing the spaced-apart space between the data driving member and the reinforcing member may be formed by a third horizontal surface.

[0174] According to various embodiments of the present disclosure, a surface of a portion of the connecting member facing the reinforcing member may be formed by a horizontal surface.

[0175] It will be apparent to those skilled in the art that various modifications and variations can be made in the present disclosure without departing from the scope of the present disclosure. Accordingly, the present disclosure is intended to cover modifications and variations of the present disclosure provided that they come within the scope of the appended claims and their equivalents.

Claims

1. A display device, comprising: A display panel, including a display area having a plurality of pixels and a first pad area provided around the display area; A data driving component, on the first pad area; And A connection member, on the data driving component, Wherein, the connection member has different thicknesses according to the part thereof provided at the data driving component.

2. The display device according to claim 1, wherein, The connection member covers the data driving component.

3. The display device according to claim 1, further comprising a strengthening component, the strengthening component being provided around the data driving component and spaced apart from the data driving component.

4. The display device according to claim 3, wherein The thickness of the data driving component is greater than the thickness of the strengthening component.

5. The display device according to claim 3, Among them, The part of the connection member provided at the data driving component includes a first part and a second part overlapping with the strengthening component, and Wherein, the thickness of the second part is greater than the thickness of the first part.

6. The display device according to claim 5, wherein, The first part overlaps with the data driving component.

7. The display device according to claim 5, wherein, The first part is provided at the space between the data driving component and the strengthening component.

8. The display device according to claim 7, Among them, The connection member further includes a third part, the third part overlapping with the space between the data driving component and the strengthening component, and Wherein, the thickness of the third part is greater than the thickness of the second part.

9. The display device according to claim 5, wherein, The connection member includes a connection part and a conductive part on the connection part.

10. The display device according to claim 9, Among them, The connection part at the first part is attached to the data driving component, and Wherein, the connection part at the second part is attached to the strengthening component.

11. The display device according to claim 10, wherein The conductive part at the second part contacts the strengthening component.

12. The display device according to claim 9, Among them, The display panel further includes a second pad area, Wherein, the display device further includes a printed circuit board at the second pad area, and Wherein, the first part of the connection member overlaps with a part of the printed circuit board.

13. The display device according to claim 12, Among them, The printed circuit board further includes a ground wire, and Wherein, the conductive part at the first part of the connection member contacts the ground wire.

14. The display device according to claim 13, wherein, The strengthening component is not provided between the data driving component and the second pad area.

15. The display device according to claim 11 or 13, wherein The strengthening component includes a conductive material, and the conductive part at the second part contacts the conductive material.

16. A display device, comprising: A display panel, including a display area having a plurality of pixels and a first pad area provided around the display area; A data driving component, on the first pad area; And A connection member, covering the data driving component, Wherein, the connection member does not include an inclined surface.

17. The display device according to claim 16, wherein, The surface of the part of the connection member facing the data driving component is formed by a horizontal surface.

18. The display device according to claim 17, wherein, The connection member covers the data driving component.

19. The display device according to claim 17 further includes a reinforcing member disposed around the data driving member and spaced apart from the data driving member, Among them, and the connection member and the reinforcing member are electrically connected to each other.

20. The display device according to claim 19, Among them, wherein the display panel further includes a second pad region, wherein the display device further includes a printed circuit board at the second pad region, and wherein the connection member is electrically connected to the printed circuit board.

21. The display device according to claim 20, Among them, wherein the connection member includes a connecting portion and a conductive portion on the connecting portion, and wherein the conductive portion is electrically connected to the reinforcing member and the printed circuit board.

22. The display device according to claim 20, wherein, The reinforcing member is not disposed between the data driving member and the second pad region.

23. The display device according to claim 19, wherein, The connection member includes a first portion and a second portion, the first portion overlapping with the data driving member and the spaced-apart space between the data driving member and the reinforcing member, and the second portion overlapping with the reinforcing member.

24. The display device according to claim 23, wherein, The surface of the portion of the first portion facing the data driving member and the surface of the portion of the first portion facing the spaced-apart space between the data driving member and the reinforcing member are formed by a first horizontal surface, and the surface of the second portion facing the reinforcing member is formed by a second horizontal surface.

25. The display device according to claim 23, wherein The surface of a part of the portion of the first portion facing the data driving member and the surface of a part of the portion of the first portion facing the spaced-apart space between the data driving member and the reinforcing member are formed by a first horizontal surface, the surface of the second portion facing the reinforcing member is formed by a second horizontal surface, and the surface of the remaining part of the portion of the first portion facing the spaced-apart space between the data driving member and the reinforcing member is formed by a third horizontal surface.

26. The display device according to claim 19, wherein, The surface of the portion of the connection member facing the reinforcing member is formed by a horizontal surface.

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