Wafer glue uniformizing equipment, wafer double-sided glue uniformizing method and wafer glue uniformizing system

Abstract

The embodiment of the invention provides wafer glue uniformizing equipment, a wafer double-sided glue uniformizing method and a wafer glue uniformizing system. The wafer glue uniformizing equipment comprises a glue uniformizing suction cup, a vacuum adsorption pipeline, an air supply pipeline and a carrying table. The glue uniformizing sucker is provided with a plurality of air holes and is used for bearing a wafer to be uniformized; the vacuum adsorption pipeline is connected with the glue uniformizing suction cup, and is used for performing vacuum adsorption on the second surface of the wafer through the air hole when the first surface of the wafer is uniformized, and releasing the second surface after the first surface is uniformized, so that the wafer can be overturned until the second surface deviates from the glue uniformizing suction cup; the air supply pipeline is connected with the glue uniformizing suction cup and is used for providing airflow for the first surface through the air holes when the second surface is uniformized, so that an air layer is formed between the glue uniformizing suction cup and the first surface, and the air layer can support the wafer to be in a suspended state, so that the first surface and the glue uniformizing suction cup are kept in a non-contact state; the carrying table is used for carrying the glue uniformizing suction cup, and the glue uniformizing suction cup is configured to rotate relative to the carrying table.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of semiconductor manufacturing technology. More specifically, embodiments of the present application relate to a wafer spin coating device, a wafer double-sided spin coating method, and a wafer spin coating system. Background Art

[0002] In the process of semiconductor manufacturing, wafer spin coating is a key step, which directly affects the quality and stability of subsequent processes. Traditional wafer spin coating devices can usually only spin coat one side of the wafer. However, in certain specific applications, it is necessary to spin coat both sides of the wafer. However, existing double-sided spin coating technologies have problems such as complex operation and unstable spin coating quality. Therefore, there is an urgent need for a device and method that can efficiently and stably perform double-sided spin coating of wafers. Summary of the Invention

[0003] The purpose of the present application is to provide a new technical solution for a wafer spin coating device, a wafer double-sided spin coating method, and a wafer spin coating system.

[0004] In a first aspect, embodiments of the present application provide a wafer spin coating device. The wafer spin coating device includes:

[0005] A spin coating chuck having a plurality of air holes for carrying the wafer to be spin coated;

[0006] A vacuum adsorption pipeline connected to the spin coating chuck. When spin coating the first side of the wafer, it is used to vacuum adsorb the second side of the wafer through the air holes, and release the second side after the first side spin coating is completed, so that the wafer can be flipped to the second side facing away from the spin coating chuck;

[0007] An air supply pipeline connected to the spin coating chuck. When spin coating the second side, it is used to provide an air flow to the first side through the air holes to form a gas layer between the spin coating chuck and the first side, and the gas layer can support the wafer in a suspended state so that the first side is kept in a non-contact state with the spin coating chuck;

[0008] A carrier for carrying the spin coating chuck, and the spin coating chuck is configured to be able to rotate relative to the carrier.

[0009] Optionally, the wafer spin coating device further includes a plurality of clamping parts, and each clamping part is connected to the spin coating chuck through a driving bracket;

[0010] The driving bracket includes:

[0011] A first rod part, one end of which is connected to the side of the spin coating chuck and can move in the horizontal direction to adjust the position of the clamping part in the horizontal direction, so as to adapt to wafers of different sizes; and

[0012] A second rod portion, one end of which is connected to the other end of the first rod portion, and the other end of the second rod portion is connected to the clamping portion, and is capable of moving in the vertical direction to adjust the height of the clamping portion in the vertical direction.

[0013] Optionally, when spin coating is performed on the second surface of the wafer, the second rod portion is used to drive the clamping portion to move closer to the wafer in the vertical direction, and the first rod portion is used to drive the clamping portion to move in the horizontal direction to approach the wafer, so that the clamping portion can clamp the wafer from the peripheral side of the wafer.

[0014] Optionally, after spin coating on the second surface of the wafer is completed, the first rod portion and the second rod portion respectively drive the clamping portion away from the wafer in the horizontal direction and the vertical direction, so that the clamping portion releases the wafer.

[0015] Optionally, the plurality of air holes extend from the surface of the spin coating chuck to its interior for providing gas flow during spin coating.

[0016] Optionally, the plurality of air holes include a plurality of fixed air holes fixedly provided on the spin coating chuck and a plurality of movable air holes provided around its periphery;

[0017] Wherein, the outlet angle of the movable air hole can be adjusted relative to the spin coating chuck or the fixed air hole. By adjusting the outlet angle, the outlet direction of the movable air hole can be controlled, thereby ensuring that the wafer has no position deviation when suspended above the spin coating chuck.

[0018] Optionally, one end of the gas supply pipeline is connected to the plurality of air holes on the spin coating chuck, and the other end is connected to a nitrogen source. A flow control valve is provided on the gas supply pipeline for regulating the supply flow of nitrogen.

[0019] Optionally, a vacuum pump is provided on the vacuum adsorption pipeline, and the vacuum adsorption pipeline is communicated with the plurality of air holes on the spin coating chuck.

[0020] Optionally, the wafer spin coating device further includes a glue dropping pipeline, which is located above the spin coating chuck and is configured to provide glue to the center position of the first surface or the second surface that has been flipped over after spin coating on the first surface when spin coating the wafer.

[0021] Optionally, the stage has a rotation driving device, and the rotation driving device is connected to the spin coating chuck to drive the spin coating chuck to rotate;

[0022] After the wafer is placed on the spin chuck and glue is dropped, the spin chuck is driven to rotate by the rotation driving device, and the centrifugal force generated is used to evenly coat the glue on the first side or the second side of the wafer.

[0023] In a second aspect, an embodiment of the present application provides a method for double-sided spin coating of wafers. The method for double-sided spin coating of wafers includes:

[0024] Place the wafer to be spin-coated on the surface of the spin chuck with its first side facing up, and vacuum adsorb and fix the second side of the wafer through the vacuum adsorption pipeline and multiple air holes on the spin chuck;

[0025] Drop glue on the first side of the wafer, and rotate the spin chuck to evenly distribute the glue on the first side to complete the spin coating of the first side;

[0026] Release the vacuum-adsorbed wafer and flip the wafer so that its second side faces up;

[0027] Supply air flow to the spin chuck through the air supply pipeline, and the air flow shoots out from the air holes of the spin chuck, so that the wafer is suspended above the surface of the spin chuck under the action of the air flow, and the already spin-coated first side is kept in a non-contact state with the spin chuck;

[0028] Drop glue on the second side, and rotate the spin chuck to evenly distribute the glue on the second side to complete the double-sided spin coating of the wafer.

[0029] Optionally, the method for double-sided spin coating of the wafer further includes:

[0030] After flipping the wafer so that its second side faces up, adjust the air outlet angle of the movable air holes on the spin chuck, so that the wafer can be stably suspended above the surface of the spin chuck under the action of the air flow, and ensure that the center of the wafer is aligned with the center of the spin chuck, so as to prevent position deviation during the spin coating process of the second side.

[0031] Optionally, the method for double-sided spin coating of the wafer further includes:

[0032] During the spin coating process of the second side of the wafer, drive the clamping part connected thereto to move through the driving bracket to clamp the wafer suspended above the surface of the spin chuck.

[0033] Optionally, the method for double-sided spin coating of the wafer further includes:

[0034] After the spin coating of the second side is completed, drive the clamping part to release the wafer through the driving bracket.

[0035] In a third aspect, an embodiment of the present application provides a wafer spin coating system. The wafer spin coating system includes:

[0036] The wafer spin coating device as described in the first aspect;

[0037] A first manipulator for placing the wafer on the spin coating chuck with the first side facing up;

[0038] A second manipulator for flipping the wafer after spin coating on the first side of the wafer so that the second side faces up for spin coating on the second side;

[0039] A third manipulator for picking up the wafer from the position of the wafer clamped or released by the clamping part after spin coating on the second side;

[0040] A control system for controlling the vacuum adsorption pipeline, the air supply pipeline, the spin coating chuck and the driving bracket in the wafer spin coating device.

[0041] Optionally, the wafer spin coating system further includes a sensor. When the wafer is flipped to the second side facing up and suspended above the spin coating surface, the sensor is used to detect the position information of the wafer; the control system controls the adjustment mechanism to adjust the pore angle of the movable pores on the spin coating chuck according to the position information fed back by the sensor.

[0042] The beneficial effects of the present application are as follows:

[0043] The wafer spin coating device provided by the embodiment of the present application aims to optimize the process of double-sided spin coating of wafers. By designing the spin coating chuck and the supporting vacuum adsorption pipeline and air supply pipeline, the wafer spin coating device realizes non-contact operation for double-sided spin coating of wafers. The core of this design is that it avoids possible contamination and structural damage in the traditional double-sided spin coating process. In the traditional double-sided spin coating process, since the wafer needs to be spin coated on both sides respectively, when the wafer is flipped, the spin-coated side may contact the spin coating chuck, resulting in glue contamination or wafer structure damage. The device of the present application effectively solves this problem through non-contact operation, significantly improving the production efficiency and yield of products.

[0044] In addition, the wafer spin coating device not only supports single-sided spin coating of wafers, but also is compatible with double-sided spin coating, showing extremely high flexibility and adaptability. This means that the device can meet the requirements of both single-sided spin coating and double-sided spin coating, thereby improving the utilization rate and application range of the device.

[0045] Through the following detailed description of the exemplary embodiments of the present specification with reference to the accompanying drawings, other features and advantages of the present specification will become clear. Description of the Drawings

[0046] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the specification and, together with the description, serve to explain the principles of the specification.

[0047] Figure 1 A side view of the wafer spin coating equipment provided for the embodiments of the present application;

[0048] Figure 2 A top view of the wafer spin coating equipment provided for the embodiments of the present application;

[0049] Figure 3 A flowchart of single-sided wafer spin coating provided for the embodiments of the present application;

[0050] Figure 4 And Figure 5 A flowchart of double-sided wafer spin coating provided for the embodiments of the present application.

[0051] Explanation of reference numerals:

[0052] 1, spin coating chuck; 2, air holes; 21, fixed air holes; 22, movable air holes; 3, vacuum adsorption pipeline; 4, air supply pipeline; 5, carrier; 6, clamping part; 7, driving bracket; 71, first rod part; 72, second rod part; 8, glue dropping pipeline; 01, wafer; A, first side; B, second side. Detailed embodiments

[0053] Now, various exemplary embodiments of the present application will be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0054] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present application or its application or use.

[0055] Technologies and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies and devices should be regarded as part of the specification.

[0056] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0057] It should be noted that: similar reference numerals and letters denote similar items in the following drawings, and thus, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0058] The following will describe in detail the wafer spin coating equipment, the wafer double-sided spin coating method, and the wafer spin coating system provided by the embodiments of the present application in conjunction with the accompanying drawings.

[0059] According to an embodiment of the present application, a wafer spin coating equipment is provided. Refer to Figure 1 and Figure 2 , the wafer spin coating equipment includes a spin coating chuck 1, a vacuum adsorption pipeline 3, a gas supply pipeline 4, and a stage 5; wherein, the spin coating chuck 1 has a plurality of air holes 2 for carrying the wafer 01 to be spin coated; the vacuum adsorption pipeline 3 is connected to the spin coating chuck 1 and is used for vacuum adsorbing the second surface B of the wafer 01 through the air holes 2 when spin coating the first surface A of the wafer 01, and releasing the second surface B after the spin coating of the first surface A is completed, so that the wafer 01 can be flipped to the second surface B facing away from the spin coating chuck 1; the gas supply pipeline 4 is connected to the spin coating chuck 1 and is used for providing an air flow to the first surface A through the air holes 2 when spin coating the second surface B, so as to form a gas layer between the spin coating chuck 1 and the first surface A, and the gas layer can support the wafer 01 in a suspended state, so that the first surface A and the spin coating chuck 1 are kept in a non-contact state; the stage 5 is used for carrying the spin coating chuck 1, and the spin coating chuck 1 is configured to be able to rotate relative to the stage 5.

[0060] The wafer spin coating equipment provided by the embodiments of the present application can be applied to the semiconductor manufacturing field, especially in the process of wafer processing, for realizing uniform coating on one side or both sides of the wafer.

[0061] For the wafer spin coating equipment provided by the embodiments of the present application, the description of the main components is as follows.

[0062] The wafer spin coating equipment provided by the embodiments of the present application includes a spin coating chuck 1. Refer to Figure 1 and Figure 2 , the spin coating chuck 1 has a plurality of air holes 2, and these air holes 2 play a key role in the process of spin coating the wafer 01 to be spin coated. Specifically:

[0063] First of all, the plurality of air holes 2 on the spin coating chuck 1 can be used to carry the wafer 01 to be spin coated and ensure the stability and position accuracy of the wafer 01 during the spin coating process.

[0064] Furthermore, through the design of these air holes 2, non-contact operation between the wafer 01 to be spin coated and the spin coating chuck 1 is also realized. For example, refer to Figure 4 (h) to (j) in Figure 5, when spin coating is performed on the second side B of the wafer 01 to be spin coated, the air supply pipeline 4 provides air flow to the already spin coated first side A through a plurality of air holes 2 on the spin coating chuck 1, forming a gas layer to support the wafer 01 in a suspended state without contacting the spin coating chuck 1. This design not only effectively protects the cleanliness of the spin coating environment, avoids the possible contamination caused by the direct contact between the already spin coated first side A of the wafer 01 and the spin coating chuck 1, but also reduces the wear of the spin coating chuck 1 and extends the service life of the equipment. In short, the design of the present application avoids the contamination and structural damage that may be caused by the direct contact between the wafer 01 to be spin coated and the spin coating chuck 1 in the traditional spin coating process.

[0065] In the wafer spin coating equipment provided in the embodiment of the present application, the spin coating chuck 1 is arranged to be able to rotate relative to the stage 5. This design makes the spin coating process more uniform and improves the spin coating quality of the wafer.

[0066] When the spin coating chuck 1 rotates relative to the stage 5, the wafer 01 will rotate together with the spin coating chuck 1. This rotational movement will cause the glue dropped on the surface of the wafer 01 to be more evenly distributed on the surface of the wafer 01 (i.e., the first side A or the second side B) under the action of centrifugal force.

[0067] During the process of the spin coating chuck 1 driving the wafer 01 to rotate, referring to Figure 3 (c) in, the glue at the center of the first side A of the wafer 01 is continuously subjected to the air flow shear force from the edge of the spin coating chuck 1, which helps to further refine the glue particles and make their distribution more uniform, so as to form a glue layer on the first side A of the wafer 01, referring to Figure 3 (d) in. This realizes the spin coating operation on one side of the wafer. This rotational design in the present application ensures that the glue can be evenly coated on the surface of the wafer in the best way to meet specific process requirements.

[0068] In addition, by controlling the rotation parameters, glue layers with different thicknesses and uniformities can be achieved, so as to meet the specific requirements of subsequent process steps.

[0069] The wafer spin coating equipment provided in the embodiment of the present application includes a vacuum adsorption pipeline 3, referring to Figure 1 、 Figures 3 to 5 , the vacuum adsorption pipeline 3 is connected to the spin coating chuck 1 and is used to perform vacuum adsorption and fixation on the second side B of the wafer 01 through a plurality of air holes 2 on the spin coating chuck 1 when spin coating is performed on the first side A of the wafer 01 to be spin coated. In this way, the wafer 01 to be spin coated can be fixed on the surface of the spin coating chuck 1 with its first side A facing up and the second side B facing down, please refer to Figure 3 (b) in orFigure 4 in (b) of

[0070] After the spin coating is completed on the first side A of the wafer 01 to be spin coated, the vacuum adsorption pipeline 3 will release the vacuum adsorption effect on the second side B, which enables the wafer 01 to be flipped to a state where the second side B is facing up and the first side A is facing down, that is, the second side B of the wafer 01 to be spin coated faces away from the spin coating chuck 1. Please refer to Figure 4 (h) in, which facilitates the subsequent spin coating operation on the second side B.

[0071] The vacuum adsorption effect of the vacuum adsorption pipeline 3 ensures the position stability of the wafer 01 to be spin coated during the spin coating process, preventing the wafer 01 from falling off or shifting during rotation or flipping.

[0072] In addition, in the design of the wafer spin coating equipment provided in this application, by controlling the opening and closing states of the vacuum adsorption pipeline 3, the fixation and flipping of the wafer 01 to be spin coated can be achieved. This design greatly promotes the convenience of double-sided spin coating operation of the wafer.

[0073] Specifically, when the spin coating on the first side A of the wafer 01 to be spin coated is completed, the vacuum adsorption pipeline 3 will timely release the vacuum adsorption force on the second side B of the wafer 01, so that the spin coated wafer 01 can be stably flipped to facilitate the spin coating process on the second side B.

[0074] During the double-sided spin coating process, for the flipping operation of the wafer, this application embodiment provides a variety of flexible implementation methods. One method is manual flipping, that is, the operator can directly physically flip the wafer. Another more efficient method is to use an automated mechanical structure, such as a precision manipulator, to perform the flipping operation of the wafer. The manipulator can accurately grasp, flip and reposition the wafer, which not only improves the accuracy and stability of flipping, but also significantly improves the overall production efficiency of double-sided spin coating. Such a design not only ensures the high-quality completion of double-sided spin coating of the wafer, but also meets the requirements of different production scales and automation levels.

[0075] The wafer spin coating equipment provided in this application embodiment, in addition to including the vacuum adsorption pipeline 3, further includes a gas supply pipeline 4. Please refer to Figure 1 , the gas supply pipeline 4 is connected to the spin coating chuck 1.

[0076] In the wafer spin coating equipment provided in this application embodiment, the design of the gas supply pipeline 4 realizes the non-contact operation between the wafer 01 to be spin coated and the spin coating chuck 1. This design not only improves the cleanliness of the spin coating process, but also effectively avoids the contamination and structural damage that may be caused by the direct contact between the wafer 01 to be spin coated and the spin coating chuck 1.

[0077] The supply gas pipeline 4 is connected to the spin chuck 1. Its function is to provide a stable gas flow (such as nitrogen) to the first side A of the wafer 01 through a plurality of air holes 2 on the spin chuck 1 when spin coating is performed on the second side B of the wafer 01. This gas flow forms a thin gas layer between the wafer 01 to be spin coated and the spin chuck 1. This gas layer plays a key supporting role, enabling the wafer 01 to be spin coated to remain suspended without contacting the surface of the spin chuck 1. Please refer to Figure 4 (h) in, so that the already spin coated first side A will not be damaged or impaired.

[0078] In the traditional spin coating process, the direct contact between the wafer 01 to be spin coated and the chuck may cause problems such as glue residue and particle contamination. The design of the supply gas pipeline 4 in this application completely isolates the physical contact between the wafer and the chuck through the ejected gas flow, thereby effectively avoiding these contamination problems.

[0079] In addition, the wafer needs to withstand a certain amount of centrifugal force and frictional force during the spin coating process. If the wafer is in direct contact with the chuck, these forces may cause minor scratches and structural deformation on the surface of the wafer. The non-contact operation provided by the supply gas pipeline 4 in this application avoids these potential damage risks and protects the integrity of the wafer.

[0080] With the design of this application, since there is no physical contact between the wafer 01 to be spin coated and the spin chuck 1, the glue can be more evenly distributed, reducing the formation of defects, and thus a smoother and more uniform glue layer can be obtained on the surface of the wafer.

[0081] The wafer spin coating equipment provided by the embodiment of this application further includes a stage 5. Please refer to Figure 1 , and the stage 5 is used to carry the spin chuck 1 and provide stable support for it.

[0082] The design of the stage 5 enables the spin chuck 1 to rotate relative to it, thus meeting the rotation requirements during the wafer spin coating process.

[0083] According to the wafer spin coating equipment provided by the embodiment of this application, its technical effects are mainly reflected in the following aspects:

[0084] First, it realizes the high efficiency and precision of double-sided wafer spin coating:

[0085] The wafer spin coating equipment of the present application realizes non-contact operation during the double-sided spin coating process of wafers through the design of the spin coating chuck 1, in cooperation with the vacuum adsorption pipeline 3 and the air supply pipeline 4. When spin coating the first side A of the wafer 01 to be spin coated, the vacuum adsorption pipeline 3 performs vacuum adsorption on the second side B of the wafer through the multiple pores 2, ensuring that the wafer 01 is stably fixed on the spin coating chuck 1. After the spin coating of the first side A is completed, the vacuum adsorption is released, and the wafer 01 can be flipped for spin coating of the second side B. At the same time, the non-contact operation avoids the direct contact between the already spin-coated first side A of the wafer and the spin coating chuck during the traditional double-sided spin coating process, reducing the possibility of contamination and structural damage, and improving the accuracy of spin coating.

[0086] Second, it enhances the compatibility and flexibility of the equipment;

[0087] The wafer spin coating equipment of the present application not only supports single-sided spin coating of wafers but also is compatible with double-sided spin coating of wafers. This feature enables the wafer spin coating equipment to exhibit extremely high flexibility and adaptability when dealing with diverse production tasks.

[0088] Third, it protects the spin coating environment and helps extend the service life of the equipment;

[0089] When spin coating the second side B of the wafer 01 to be spin coated, the air supply pipeline 4 provides air flow to the first side A of the wafer 01 through the multiple pores 2, and the formed gas layer can support the wafer 01 in a suspended state. This design not only effectively avoids the direct contact between the wafer 01 and the spin coating chuck 1, protects the cleanliness of the spin coating environment, but also reduces the wear of the spin coating chuck. In the long run, this helps extend the service life of the equipment and reduce the maintenance cost.

[0090] The wafer spin coating equipment provided by the embodiments of the present application provides a new solution for the field of wafer manufacturing through the collaborative work of its main components.

[0091] In some examples of the present application, referring to Figure 1 and Figure 2 , the wafer spin coating equipment further includes a plurality of clamping parts 6, and each clamping part 6 is connected to the spin coating chuck 1 through a driving bracket 7; the driving bracket 7 includes a first rod part 71 and a second rod part 72; wherein, one end of the first rod part 71 is connected to the side part of the spin coating chuck 1 and can move in the horizontal direction to adjust the position of the clamping part 6 in the horizontal direction, so as to adapt to wafers 01 of different sizes; one end of the second rod part 72 is connected to the other end of the first rod part 71, the other end of the second rod part 72 is connected to the clamping part 6, and can move in the vertical direction to adjust the height of the clamping part 6 in the vertical direction.

[0092] In this example of the present application, the wafer spin coating equipment introduces the design of the clamping part 6 and its driving bracket 7, which is designed to improve the flexibility and adaptability of double-sided wafer spin coating.

[0093] See Figure 1 and Figure 4 in (j) and Figure 5 in (k)-(l). The main function of the clamping part 6 is to clamp the wafer 01 to ensure that during the spin coating process of the second side B of the wafer 01, the wafer 01 can be stably and accurately positioned above the spin coating chuck 1, and the first side A (spin-coated side) of the wafer 01 is kept in a non-contact state with the spin coating chuck 1.

[0094] See Figure 1 . The driving bracket 7 is mainly composed of a first rod part 71 and a second rod part 72. These two parts work together to achieve the movement of the connected clamping part 6 in the horizontal and vertical directions.

[0095] The following will separately describe the first rod part 71 and the second rod part 72.

[0096] See Figure 1 . One end of the first rod part 71 is connected to the side of the spin coating chuck 1, and it can move in the horizontal direction. This mobility enables the adjustment of the distance between the multiple clamping parts 6 or the clamping range, so as to adapt to clamping wafers 01 of different sizes to be spin-coated. This design increases the versatility and flexibility of the entire wafer spin coating equipment.

[0097] The first rod part 71 can move in the horizontal direction, for example, it means that the first rod part 71 can extend or shorten in the horizontal direction.

[0098] Please continue to see Figure 1 . One end of the second rod part 72 is connected to the other end of the first rod part 71, and the other end of the second rod part 72 is connected to the clamping part 6. The second rod part 72 can move in the vertical direction. This vertical mobility enables the clamping part 6 to clamp the floating wafer 01 (such as a wafer floating under the action of nitrogen buoyancy), see Figure 4 in (j) to ensure that during the spin coating process, the wafer 01 is kept in a non-contact state with the spin coating chuck 1, avoiding contamination of the spin-coated surface and structural damage.

[0099] The second rod part 72 can move in the vertical direction, for example, it means that the second rod part 72 can extend or shorten in the vertical direction.

[0100] In the design of the present application, the driving bracket 7 drives the clamping part 6 to be able to clamp the circumferential side of the wafer 01 in a suspended state. Refer to Figure 4 (j) in

[0101] In one example, the clamping part 6 is provided with eight, for example, and the clamping part 6 and the driving bracket 7 are arranged in one-to-one correspondence, so the driving bracket 7 is also provided with eight. When the clamping part 6 is provided with eight, the stability and accuracy of clamping the wafer 01 can be improved.

[0102] In some examples of the present application, refer to Figure 4 (h) to (j) in

[0103] When spin coating is performed on the second side B of the wafer 01, the second rod portion 72 is used to drive the clamping part 6 to move closer to the wafer 01 in the vertical direction, and the first rod portion 71 is used to drive the clamping part 6 to move in the horizontal direction to approach the wafer 01, so that the clamping part 6 can clamp the wafer 01 from the circumferential side of the wafer 01.

[0104] Refer to Figure 4 (i) in Figure 4 The second rod portion 72 is used to drive the clamping part 6 to move closer to the wafer 01 in the vertical direction. This action ensures that the clamping part 6 can move from below to above and approach the wafer 01 without disturbing the first side A (the spin-coated side) of the wafer 01. The first rod portion 71 is used to drive the clamping part 6 to move closer to the wafer 01 in the horizontal direction. Refer to

[0105]

[0106] In the wafer spin coating equipment provided in the present application, the clamping part 6 can be provided with eight, for example, so that the wafer 01 can be stably clamped from the circumferential side of the wafer 01.

[0107] ​The design of the clamping part 6 provided in this application allows it to clamp the wafer 01 from the peripheral side of the wafer 01, rather than directly pressing on the surface of the wafer 01. This clamping method avoids contaminating or damaging the first surface A with the applied photoresist, while ensuring the stability and accuracy during photoresist coating on the second surface B to be coated with photoresist.

[0108] In some examples of this application, refer to Figure 5 , after the photoresist coating on the second surface B of the wafer 01 is completed, the first rod part 71 and the second rod part 72 drive the clamping part 6 away from the wafer 01 in the horizontal direction and the vertical direction respectively, so that the clamping part 6 releases the wafer 01.

[0109] That is to say, during the process of double-sided photoresist coating on the wafer, especially after the photoresist coating on the second surface B of the wafer 01 is completed, through the coordinated actions of the first rod part 71 and the second rod part 72 of the driving bracket 7, the clamping part 6 can be driven to smoothly move away from the wafer 01, so as to facilitate timely removal of the wafer after double-sided photoresist coating. For the wafer after double-sided photoresist coating, please refer to Figure 5 (n) in

[0110] In some examples of this application, refer to Figure 1 and Figure 2 , the plurality of air holes 2 extend from the surface of the photoresist coating chuck 1 to its interior, and are used to provide gas flow during the photoresist coating process.

[0111] Refer to Figure 3 (b) in

[0112] When the wafer 01 to be coated with photoresist is placed on the surface of the photoresist coating chuck 1 with the first surface A facing up and the second surface B facing down, the plurality of air holes 2 on the photoresist coating chuck 1 can ensure that the second surface B of the wafer 01 is stably and firmly adsorbed on the surface of the photoresist coating chuck 1 by providing a vacuum adsorption function. This design helps to prevent the wafer from moving or falling off during the photoresist coating process, thus ensuring the accuracy and consistency of the photoresist coating.

[0113] Refer to Figure 1, since the openings of the air holes 2 are only exposed on the surface of the spin chuck 1, when performing single-sided spin coating (such as spin coating on the first side A) on the wafer 01 to be spin coated, the other side (such as the second side B) of the wafer 01 can be in direct contact with the surface of the spin chuck 1, which is beneficial to stably vacuum adsorb and fix the wafer 01 on the surface of the spin chuck 1.

[0114] In some examples of the present application, refer to Figure 2 , Figure 4 and Figure 5 , the plurality of air holes 2 include a plurality of fixed air holes 21 fixedly arranged on the spin chuck 1 and a plurality of movable air holes 22 arranged around its circumferential side; wherein, the air outlet angle of the movable air holes 22 can be adjusted relative to the spin chuck 1 or the fixed air holes 21, and by adjusting the air outlet angle, the air outlet direction of the movable air holes 22 can be controlled, so as to ensure that there is no position deviation when the wafer 01 floats above the spin chuck 1.

[0115] Refer to Figure 4 and Figure 5 , by arranging a plurality of movable air holes 22 on the surface of the spin chuck 1 and allowing the adjustment of their air outlet angles, the floating position of the wafer 01 above the spin chuck 1 can be better controlled. This design helps to ensure that the wafer 01 remains stable in the floating state and will not have position deviation due to uneven or unstable air flow.

[0116] During the wafer processing, refer to Figure 4 in (b), when it is necessary to perform vacuum adsorption on the second side B of the wafer 01, the fixed air holes 21 and the movable air holes 22 on the spin chuck 1 are both set to vertically provide vacuum adsorption gas to the second side B of the wafer 01. In this way, the wafer 01 can be firmly adsorbed on the spin chuck 1 to ensure stability during subsequent processing.

[0117] Subsequently, during the spin coating process on the second side B of the wafer, as shown in Figure 4 in (h), the wafer 01 is flipped over so that the original second side B facing down is now facing up, and the original first side A facing up is now facing down. At this time, the wafer 01 no longer needs to be vacuum adsorbed on the spin chuck, but needs to be suspended above the spin chuck 1 by air flow for subsequent operations such as spin coating.

[0118] To prevent the wafer 01 in the suspended state from shifting in position and affecting the quality of spin coating, the movable air holes 22 on the spin coating chuck 1 play a crucial role. These movable air holes 22 can adjust their air outlet angles according to actual needs. By precisely controlling the direction and intensity of the air flow, it is ensured that the wafer 01 remains stable in the suspended state without shifting in position. In this way, it can provide strong support for subsequent processes such as spin coating, ensuring the quality and performance of the product.

[0119] In some examples of the present application, one end of the air supply pipeline 4 is connected to a plurality of air holes 2 on the spin coating chuck 1, and the other end is connected to a nitrogen source. A flow control valve is provided on the air supply pipeline 4 for regulating the supply flow of nitrogen.

[0120] By connecting the air supply pipeline 4 to a plurality of air holes 2 on the spin coating chuck 1, it can ensure the reasonable distribution of nitrogen to each part of the spin coating chuck 1. This helps to keep the air pressure on the surface of the spin coating chuck 1 consistent during the spin coating process, thereby improving the uniformity and quality of spin coating.

[0121] The introduction of the flow control valve enables the supply flow of nitrogen to be regulated according to actual needs. By controlling the flow of nitrogen, the fluctuation of spin coating quality caused by unstable air flow can be reduced. This helps to improve the stability of the entire spin coating process, thereby ensuring the consistency and reliability of the product.

[0122] It should be noted that in addition to nitrogen, dry compressed air can also be used, but the cleanliness must be ensured, otherwise the glue on the first surface A of the wafer 01 will be contaminated. The reason for preferentially choosing N2 is that it has relatively high cleanliness.

[0123] In some examples of the present application, a vacuum pump is provided on the vacuum adsorption pipeline 3, and the vacuum adsorption pipeline 3 is communicated with a plurality of air holes 2 on the spin coating chuck 1.

[0124] The vacuum adsorption pipeline 3 is communicated with a plurality of air holes 2 on the spin coating chuck 1, ensuring that the vacuum adsorption force can be transmitted to the surface of the spin coating chuck 1, and then adsorbing the wafer.

[0125] For example, after the vacuum pump is started, the gas inside the spin coating chuck 1 is extracted through the vacuum adsorption pipeline 3 to form a negative pressure environment. A plurality of air holes 2 on the spin coating chuck 1 are in contact with the wafer surface, transmitting the negative pressure to the wafer to achieve the vacuum adsorption of the wafer.

[0126] The vacuum adsorption pipeline 3 cooperating with a plurality of air holes 2 on the spin coating chuck 1 can generate a stronger adsorption force, ensuring that the wafer is firmly adsorbed on the spin coating chuck 1 during the spin coating process, avoiding displacement or falling off. The vacuum adsorption force improves the stability of the wafer during the spin coating process.

[0127] In some examples of the present application, referring to Figures 3 to 5 , the wafer spin coating device further includes a glue dropping pipeline 8, which is located above the spin coating chuck 1 and is configured to provide glue to the center position of the first surface A or the second surface B that has been flipped after the spin coating of the first surface A when spin coating the wafer 01.

[0128] The glue dropping pipeline 8 is located above the spin coating chuck 1 and is configured to be able to provide glue to the center position of the first surface A of the wafer 01 or the second surface B that has been flipped after the spin coating of the first surface A when spin coating the wafer 01.

[0129] When spin coating the first surface A of the wafer 01, the glue dropping pipeline 8 will move to directly above the wafer 01 and drop the glue at the center position of the first surface A of the wafer 01. Refer to Figure 4 (c) in

[0130] After the spin coating of the first surface A is completed, the wafer 01 will be flipped so that the second surface B faces upward. At this time, the glue dropping pipeline 8 will move to directly above the wafer 01 again, but this time it drops the glue at the center position of the flipped second surface B. Refer to Figure 5 (k) in

[0131] The automated configuration and control of the glue dropping pipeline 8 can shorten the time of the spin coating process, thereby improving production efficiency.

[0132] In some examples of the present application, the carrier 5 has a rotation driving device, and the rotation driving device is connected to the spin coating chuck 1 to drive the spin coating chuck 1 to rotate; after the wafer 01 is placed on the spin coating chuck 1 and glue is dropped, the rotation driving device drives the spin coating chuck 1 to rotate, and the generated centrifugal force is used to evenly coat the glue on the first surface A or the second surface B of the wafer 01.

[0133] A rotation driving device is configured on the carrier 5, and the rotation driving device and the spin coating chuck 1 can be in transmission connection. The rotation driving device serves as a power source to drive the spin coating chuck 1 to perform a rotational motion in Chinese.

[0134] When the wafer 01 is placed on the spin coating chuck 1 and an appropriate amount of glue has been dropped at the center of the wafer through the glue dropping pipeline 8, the rotation driving device starts to operate. Under the action of the rotation driving device, the spin coating chuck 1 drives the wafer 01 to rotate together. During the rotation process, the glue is affected by the centrifugal force and begins to uniformly spread from the center of the wafer 01 to the periphery until a uniform glue layer covers the first surface A or the second surface B of the wafer 01.

[0135] The glue application chuck 1 is driven to rotate by a rotation driving device, and by utilizing the generated centrifugal force, the glue can be very evenly coated on the surface of the wafer. This glue application method avoids the problems of uneven glue distribution or accumulation at the edge of the wafer, and significantly improves the uniformity and consistency of glue application. The automated operation of the rotation driving device greatly shortens the time required for the glue application process. Compared with the traditional manual glue application method, this automated glue application method can complete the glue application operation faster, thereby improving the production efficiency.

[0136] By ensuring the even distribution of the glue on the surface of the wafer, problems such as process defects and increased product defect rate caused by uneven glue distribution can be avoided.

[0137] According to another embodiment of the present application, a method for double-sided glue application on a wafer is provided. Refer to Figure 4 and Figure 5 , the method for double-sided glue application on the wafer includes the following steps 100 to 500:

[0138] Step 100, as shown in (a) and (b) of Figure 4 , the wafer 01 to be glue-applied is placed on the surface of the glue application chuck 1 with its first side A facing up and its second side B facing down, and the second side B of the wafer 01 is vacuum-adsorbed and fixed through the vacuum adsorption pipeline 3 and a plurality of air holes 2 on the glue application chuck 1;

[0139] Among them, as shown in (b) of Figure 4 , it shows that the second side B of the wafer 01 is vacuum-adsorbed and fixed by the glue application chuck 1.

[0140] Step 200, as shown in (c) and (d) of Figure 4 , glue is dropped on the first side A of the wafer 01, and the glue is evenly distributed on the first side A by the rotation of the glue application chuck 1 to complete the glue application on the first side A;

[0141] Among them, as shown in (d) of Figure 4 , a glue layer is formed on the first side A.

[0142] Step 300, release the vacuum-adsorbed wafer 01, and flip the wafer 01 so that its second side B faces up;

[0143] Regarding step 300, it should be noted that Figure 4 the process of flipping the wafer 01 is not shown in the flowchart shown, which may be completed by an external manipulator or manually; and the release of the vacuum of the wafer 01 can be referred to Figure 4In (e) thereof, the vacuum adsorption pipeline 3 stops working, and gas such as nitrogen flows into the air supply pipeline 4.

[0144] Step 400, refer to Figure 4 As shown in (f) to (j) thereof, air flow is provided to the spin chuck 1 through the air supply pipeline 4, and the air flow shoots out from multiple air holes 2 of the spin chuck 1, so that the wafer 01 floats above the surface of the spin chuck 1 under the action of the air flow, and the already spin-coated first surface A is kept in a non-contact state with the spin chuck 1; wherein, the air flow is, for example, nitrogen air flow;

[0145] Wherein, Figure 4 (f) and (g) thereof show the air supply states of the fixed air holes 21 and the movable air holes 22. In particular, the air hole direction of the movable air holes 22 is adjusted;

[0146] Wherein, Figure 4 (h) thereof shows that the flipped wafer 01 floats above the surface of the spin chuck 1, the first surface A of the wafer 01 faces downward and a glue layer has been formed, and its second surface B faces upward, waiting for subsequent glue coating operation.

[0147] Step 500, refer to Figure 5 , glue is dropped on the second surface B, and the glue is evenly distributed on the second surface B by the rotation of the spin chuck 1, completing double-sided spin coating of the wafer;

[0148] Wherein, Figure 5 (k) thereof shows that glue is dropped onto the center position of the second surface B through the glue dropping pipeline 8, Figure 5 (l) thereof shows that a glue layer is formed on the second surface B.

[0149] The double-sided spin coating method for a wafer provided by the embodiment of the present application, through the control of the above steps 100 to step 500, first spin coats the first surface A of the wafer 01 to be spin coated, and then flips the wafer 01 without damaging the glue layer on the first surface A, and spin coats its second surface B. This step-by-step operation ensures the accuracy and consistency of double-sided spin coating, and is beneficial to improving the quality and performance of the final product.

[0150] In particular, during the spin coating of the second surface B of the wafer 01, air flow is provided to the spin chuck 1 through the air supply pipeline 4, so that the wafer 01 floats above the surface of the spin chuck 1, avoiding direct contact between the already spin-coated first surface A and the spin chuck 1. This non-contact spin coating method effectively prevents contamination and damage.

[0151] The above method provided by the embodiment of the present application aims to optimize the process of double-sided spin coating of a wafer. In addition, this spin coating method for a wafer also supports single-sided spin coating of the wafer.

[0152] In some examples of the present application, the method for spin coating both sides of the wafer further includes the following steps:

[0153] Referring to Figure 4 as shown in (f) and (g) in [[ID=]], after flipping the wafer 01 so that its second side B faces upward, adjust the outlet angle of the movable air holes 22 on the spin coating chuck 1, so that the wafer 01 can stably float above the surface of the spin coating chuck 1 under the action of air flow, and ensure that the center of the wafer 01 is aligned with the center of the spin coating chuck 1, so as to avoid position deviation during the spin coating process of the second side B.

[0154] By adjusting the outlet angle of the movable air holes 22, the direction and intensity of the air flow can be controlled, so that the wafer 01 can stably float above the surface of the spin coating chuck 1 under the action of the air flow. This stability plays a key role in the smooth progress of the subsequent spin coating process, avoiding uneven spin coating or failure caused by wafer shaking or deviation.

[0155] While adjusting the outlet angle of the movable air holes 22, by ensuring the alignment of the wafer center with the center of the spin coating chuck 1, the position of the wafer during the spin coating process can be controlled. This position accuracy is very important for ensuring the uniformity and consistency of spin coating, improving the quality and performance of the product.

[0156] The design of the movable air holes 22 increases the controllability of the spin coating process. By adjusting the position and outlet angle of the air holes, it can flexibly adapt to wafers of different sizes and types, as well as different spin coating requirements. This controllability makes the spin coating process more flexible and efficient.

[0157] Wherein, the range of the adjustable outlet angle of the movable air holes 22 can be between 30° and 45°.

[0158] By ensuring that there is no position deviation of the wafer during the spin coating process, problems such as uneven spin coating or inconsistent adhesive layer thickness caused by position error can be reduced.

[0159] In some examples of the present application, the method for spin coating both sides of the wafer further includes the following steps:

[0160] Referring to Figure 4 as shown in (i) and (j) in [[ID=]], during the spin coating process of the second side B of the wafer 01, drive the support bracket 7 to drive the clamping part 6 connected thereto to move, so as to clamp the wafer 01 floating above the surface of the spin coating chuck 1.

[0161] During the spin coating process of the second side B of the wafer 01, the wafer 01 needs to maintain extremely high stability to ensure uniform application of the glue. Referring toFigure 4 In (j), the clamping part 6 is driven by the driving bracket 7 to move and clamp the wafer 01 suspended above the spin chuck 1, which can effectively prevent the wafer from shaking or shifting during the spin coating process, thereby enhancing the stability of the wafer.

[0162] The clamping action of the clamping part 6 ensures the fixed position of the wafer 01 during the spin coating process, which enables the glue to be more evenly applied on the wafer surface.

[0163] In some examples of the present application, the double-sided spin coating method of the wafer further includes: Refer to Figure 5 as shown in (m), after the spin coating of the second side B is completed, the driving bracket 7 drives the clamping part 6 to release the wafer.

[0164] After the spin coating of the second side B is completed, releasing the wafer 01 in a timely manner facilitates subsequent processing steps.

[0165] In addition, long-term clamping may cause pressure damage or residual clamping marks to the wafer. Releasing the wafer immediately after spin coating is completed can reduce the risk of such damage and maintain the integrity and surface quality of the wafer.

[0166] In the present application, the precise control of the driving bracket 7 and the clamping part 6 makes the release process of the wafer 01 more controllable. This helps to ensure the stability and accuracy of the wafer during the release process and avoid the wafer from falling or being damaged due to improper release.

[0167] The embodiment of the present application also provides a single-sided spin coating method for a wafer. Refer to Figure 3 as shown, which includes the following steps 001 and 002:

[0168] Step 001, refer to Figure 3 as shown in (a) and (b), place the wafer 01 to be spin coated on the surface of the spin chuck 1 with its first side A facing up and the second side B facing down, and vacuum adsorb and fix the second side B of the wafer 01 through the vacuum adsorption pipeline 3 and the multiple air holes 2 on the spin chuck 1; wherein, refer to Figure 3 as shown in (b), it shows that the second side B of the wafer 01 is vacuum adsorbed and fixed by the spin chuck 1.

[0169] Step 002, refer to Figure 3 as shown in (c) and (d), drip glue on the first side A of the wafer 01, and rotate the spin chuck 1 to make the glue evenly distributed on the first side A, and complete the spin coating of the first side A; wherein, refer to Figure 3 as shown in (d), a glue layer is formed on the first side A.

[0170] Of course, after the glue layer is formed on the first surface A of the wafer 01, the fixation of the vacuum adsorption pipeline 3 on the second surface B of the wafer 01 can be released, so that the wafer can be taken away.

[0171] According to another embodiment of the present application, a wafer spin coating system is provided, which includes:

[0172] The wafer spin coating equipment as described above;

[0173] A first manipulator for placing the wafer 01 on the spin chuck 1 with the first surface A facing upward;

[0174] A second manipulator for flipping the wafer 01 after the spin coating on the first surface A of the wafer 01 is completed, so that its second surface B faces upward for spin coating of the second surface B;

[0175] A third manipulator for taking away the wafer 01 from the position of the wafer 01 clamped or released by the clamping part 6 after the spin coating on the second surface B is completed;

[0176] A control system for controlling the vacuum adsorption pipeline 3, the air supply pipeline 4, the spin chuck 1 and the driving bracket 7 in the wafer spin coating equipment.

[0177] In some examples of the present application, the wafer spin coating system further includes a sensor, which is used to detect the position information of the wafer 01 when the wafer 01 is flipped to the second surface B facing upward and suspended above the surface of the spin chuck 1; the control system controls the adjustment mechanism to adjust the pore angle of the movable pores on the spin chuck 1 according to the position information fed back by the sensor.

[0178] Among them, the position information of the wafer 01 includes, but is not limited to, the alignment situation between the center position of the wafer and the center of the spin chuck.

[0179] The wafer spin coating system provided by the embodiments of the present application realizes the automatic process of wafer placement, flipping and taking away by integrating the first manipulator, the second manipulator and the third manipulator, improving the production efficiency. At the same time, the control system accurately controls each component in the wafer spin coating equipment, ensuring the stability of the spin coating process.

[0180] In particular, the addition of the sensor enables the entire system to detect the position information of the wafer in real time after flipping. The control system timely adjusts the angle of the movable pores on the spin chuck according to this feedback, thereby ensuring the accurate position and suspension stability of the wafer during the spin coating process, and further improving the uniformity of spin coating and the product quality.

[0181] For the specific implementation manners of the wafer double-sided spin coating method and the wafer spin coating system according to the embodiments of the present application, reference may be made to the respective embodiments of the above-mentioned wafer spin coating equipment. Therefore, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, and will not be elaborated herein one by one.

[0182] In the above embodiments, the differences between the respective embodiments are mainly described. As long as the different optimization features between the respective embodiments are not contradictory, they can be combined to form a more optimal embodiment. For the sake of brevity of the description, it will not be elaborated herein.

[0183] Although some specific embodiments of the present application have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration purposes and not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A wafer spin coating device, characterized in that, Comprising: A spin chuck (1) having a plurality of air holes (2) for carrying a wafer (01) to be spin-coated; A vacuum adsorption pipeline (3) connected to the spin chuck (1). When spin-coating the first surface (A) of the wafer (01), it is used to vacuum-adsorb the second surface (B) of the wafer (01) through the air holes (2), and release the second surface (B) after spin-coating on the first surface (A) is completed, so that the wafer (01) can be flipped to have the second surface (B) facing away from the spin chuck (1); An air supply pipeline (4) connected to the spin chuck (1). When spin-coating the second surface (B), it is used to provide an air flow to the first surface (A) through the air holes (2) to form a gas layer between the spin chuck (1) and the first surface (A). The gas layer can support the wafer (01) in a suspended state, so that the first surface (A) and the spin chuck (1) remain in a non-contact state; A stage (5) for carrying the spin chuck (1), and the spin chuck (1) is configured to be able to rotate relative to the stage (5).

2. The wafer spin coating device according to claim 1, wherein The wafer spin-coating device further includes a plurality of clamping parts (6), and each clamping part (6) is connected to the spin chuck (1) through a driving bracket (7); The driving bracket (7) includes: A first rod part (71) whose one end is connected to the side of the spin chuck (1) and can move in the horizontal direction to adjust the position of the clamping part (6) in the horizontal direction, so as to adapt to wafers (01) of different sizes; and A second rod part (72) whose one end is connected to the other end of the first rod part (71), the other end of the second rod part (72) is connected to the clamping part (6), and can move in the vertical direction to adjust the height of the clamping part (6) in the vertical direction.

3. The wafer spin coating equipment according to claim 2, wherein When spin-coating the second surface (B) of the wafer (01), the second rod part (72) is used to drive the clamping part (6) to move closer to the wafer (01) in the vertical direction, and the first rod part (71) is used to drive the clamping part (6) to move closer to the wafer (01) in the horizontal direction, so that the clamping part (6) can clamp the wafer (01) from the peripheral side of the wafer (01).

4. The wafer spin coating device according to claim 3, wherein, After spin-coating on the second surface (B) of the wafer (01) is completed, the first rod part (71) and the second rod part (72) drive the clamping part (6) away from the wafer (01) in the horizontal direction and the vertical direction respectively, so that the clamping part (6) releases the wafer (01).

5. The wafer spin coating equipment according to claim 1, characterized in that, The plurality of air holes (2) extend from the surface of the spin chuck (1) to its interior and are used to provide gas flow during the spin-coating process.

6. The wafer spin coating device according to claim 5, wherein, The plurality of air holes (2) include a plurality of fixed air holes (21) fixedly arranged on the spin chuck (1) and a plurality of movable air holes (22) arranged around its periphery; Among them, the outlet angle of the movable air hole (22) can be adjusted relative to the spin coater chuck (1) or the fixed air hole (21). By adjusting this outlet angle, the outlet direction of the movable air hole (22) can be controlled, so as to ensure that the wafer (01) has no position deviation when suspended above the spin coater chuck (1).

7. The wafer spin coating device according to claim 1, wherein One end of the air supply pipeline (4) is connected to a plurality of air holes (2) on the spin coater chuck (1), and the other end is connected to a nitrogen source. A flow control valve is provided on the air supply pipeline (4) for regulating the supply flow of nitrogen.

8. The wafer spin coating device according to claim 1, wherein, A vacuum pump is provided on the vacuum adsorption pipeline (3), and the vacuum adsorption pipeline (3) is communicated with a plurality of air holes (2) on the spin coater chuck (1).

9. The wafer spin coating device according to any one of claims 1-8, characterized in that, The wafer spin coating device further includes a glue dropping pipeline (8). The glue dropping pipeline (8) is located above the spin coater chuck (1) and is configured to provide glue to the center position of the first surface (A) or the second surface (B) that has been turned over after the first surface (A) has been spin coated when the wafer (01) is spin coated.

10. The wafer spin coating device according to claim 9, wherein, The stage (5) has a rotation driving device, and the rotation driving device is connected to the spin coater chuck (1) to drive the spin coater chuck (1) to rotate; After the wafer (01) is placed on the spin coater chuck (1) and glue is dropped, the spin coater chuck (1) is driven to rotate by the rotation driving device, and the glue is evenly coated on the first surface (A) or the second surface (B) of the wafer (01) by using the generated centrifugal force.

11. A method for double-sided spin coating of wafers, characterized in that, Including: Place the wafer to be spin coated on the surface of the spin coater chuck with its first surface facing up, and vacuum adsorb and fix the second surface of the wafer through the vacuum adsorption pipeline and a plurality of air holes on the spin coater chuck; Drop glue on the first surface of the wafer, and rotate the spin coater chuck to evenly distribute the glue on the first surface to complete the spin coating of the first surface; Release the vacuum adsorbed wafer and flip the wafer so that its second surface faces up; Provide air flow to the spin coater chuck through the air supply pipeline, and the air flow shoots out from the air holes of the spin coater chuck, so that the wafer is suspended above the surface of the spin coater chuck under the action of the air flow, and the spin coated first surface is kept in a non-contact state with the spin coater chuck; Drop glue on the second surface, and rotate the spin coater chuck to evenly distribute the glue on the second surface to complete the double-sided spin coating of the wafer.

12. The method for double-sided spin coating of a wafer according to claim 11, wherein, The double-sided spin coating method of the wafer further includes: After flipping the wafer so that its second surface faces up, adjust the outlet angle of the movable air hole on the spin coater chuck, so that the wafer can be stably suspended above the surface of the spin coater chuck under the action of the air flow, and ensure that the center of the wafer is aligned with the center of the spin coater chuck, so as to avoid position deviation during the spin coating process of the second surface.

13. The wafer double-sided spin coating method according to claim 11, wherein The double-sided spin coating method of the wafer further includes: During the spin coating process of the second surface of the wafer, drive the clamping part connected thereto to move through the driving bracket to clamp the wafer suspended above the surface of the spin coater chuck.

14. The wafer double-sided spin coating method according to claim 13, wherein, The double-sided spin coating method for the wafer further includes: After the spin coating on the second side is completed, the driving bracket drives the clamping part to release the wafer.

15. A wafer spin coating system, characterized in that, It includes: The wafer spin coating equipment according to any one of claims 1 to 11; A first manipulator for placing the wafer (01) on the spin coating chuck (1) with the first side (A) facing up; A second manipulator for flipping the wafer (01) after the spin coating on the first side (A) of the wafer (01) is completed, so that the second side (B) faces up for spin coating on the second side (B); A third manipulator for taking away the wafer (01) from the position of the wafer (01) clamped or released by the clamping part (6) after the spin coating on the second side (B) is completed; A control system for controlling the vacuum adsorption pipeline (3), the air supply pipeline (4), the spin coating chuck (1) and the driving bracket (7) in the wafer spin coating equipment.

16. The wafer spin coating system according to claim 15, wherein, The wafer spin coating system further includes a sensor. When the wafer (01) is flipped to the second side (B) facing up and suspended above the surface of the spin coating chuck (1), the sensor is used to detect the position information of the wafer (01); the control system controls the adjustment mechanism to adjust the pore angle of the movable pores on the spin coating chuck (1) according to the position information fed back by the sensor.

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