Blowing dust removal device for semiconductor packaging device

Abstract

The invention belongs to the technical field of semiconductor production, and provides a blowing dust removal device for a semiconductor packaging device, which comprises a shell, a conveying belt is rotatably mounted in the shell, a plurality of groups of first brackets which are distributed at intervals are fixedly mounted on the conveying belt, sliding blocks are slidably mounted on the first brackets, and rotating shafts are rotatably mounted on the sliding blocks; the rotating shaft penetrates through the sliding block, a gear is fixedly installed at one end of the rotating shaft, two moving plates are slidably installed on the rotating shaft, and clamping plates are fixedly installed on the moving plates. Compared with the prior art, the dust blowing device has the following beneficial effects that the semiconductor component is conveyed through the conveying belt, and the upper surface and the lower surface of the semiconductor component are turned over in the conveying process, so that comprehensive dust blowing operation on the surface of the semiconductor component can be achieved, sustainable comprehensive dust blowing operation on the semiconductor component is achieved, and the production efficiency is improved. The conveying belt is prevented from stopping moving, and the dust blowing and cleaning effect of the semiconductor component is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor production, and particularly relates to a blowing and dust-removing device for a semiconductor packaging device. Background Art

[0002] During the processing of semiconductors, due to problems such as air circulation in the workshop, dust or particles will adhere to the surface of semiconductor chips on the production line. Particles on the semiconductor chips can easily cause the phenomenon that the semiconductor chips tilt and have gaps with the packaging frame when the semiconductor chips are encapsulated in the packaging frame.

[0003] In the prior art, before semiconductor packaging, workers are required to inspect and remove dust from the semiconductor. In the prior art, since the semiconductor is attached to a certain surface of the conveying device, in the face of this situation, it is not easy for the dust-removing device to clean the dust existing on its contact surface. For the above technical problems, the Chinese patent with the patent publication number CN222402601U adsorbs the semiconductor through a vacuum suction head and moves the semiconductor upward away from the conveyor belt when in use, so as to clean the lower surface of the semiconductor. However, in this process, the semiconductor is in a fixed state and cannot be conveyed, resulting in intermittency in the blowing and dust-removing of the semiconductor and reducing the blowing and dust-removing cleaning speed of the semiconductor. Summary of the Invention

[0004] The purpose of the present invention is to provide a blowing and dust-removing device for a semiconductor packaging device, aiming to solve the technical problem that the blowing and dust-removing of the semiconductor in the prior art is intermittent, reducing the blowing and dust-removing cleaning speed of the semiconductor.

[0005] The present invention is realized as follows. A blowing and dust-removing device for a semiconductor packaging device includes a housing. A conveyor belt is rotatably installed in the housing. A plurality of groups of first brackets are fixedly installed on the conveyor belt at intervals. A slider is slidably installed on the first bracket. A rotating shaft is rotatably installed on the slider. The rotating shaft penetrates through the slider and a gear is fixedly installed at one end of the rotating shaft. Two groups of moving plates are slidably installed on the rotating shaft. Clamping plates are fixedly installed on the moving plates. A cover plate is fixedly installed in the middle of the housing. A rack is arranged on the cover plate. The rack is used in cooperation with the gear. A cross plate is fixedly installed in the housing. Two groups of base plates are slidably installed on the cross plate. A servo module for driving the two groups of base plates to move synchronously and in opposite directions is arranged on the housing. A telescopic member is fixedly installed on the surface of the base plate close to the conveyor belt. A push plate is fixedly installed at the output end of the telescopic member. The length of the horizontal section of the base plate is greater than the length of the rack. The distribution area of the horizontal section of the base plate covers the distribution area of the rack. Two groups of lifting plates are slidably installed on the cover plate. A blowing hood is fixedly installed at the end of the lifting plate located in the housing. The cross section of the blowing hood is arc-shaped and the opening faces the conveyor belt. The blowing hood is connected to a blower fixedly installed on the housing.

[0006] Further technical solution: A limit plate is fixedly installed on the rotating shaft. The limit plates are distributed along the length direction of the rotating shaft, and the moving plate is slidably connected to the limit plates.

[0007] Further technical solution: Two sets of support plates located inside the moving plate are fixedly installed on the rotating shaft. Elastic members distributed around the rotating shaft are fixedly installed on the side surface of the support plate close to the moving plate, and one end of the elastic member away from the support plate is fixedly connected to the moving plate.

[0008] Further technical solution: Multiple sets of evenly spaced balls are rotatably installed on the surfaces of the moving plates facing away from each other.

[0009] Further technical solution: A camera is fixedly installed on the cover plate. The camera is located in the area where the rack is located and is used to detect the position of the semiconductor.

[0010] Further technical solution: A vertical plate is slidably installed on the cover plate. The vertical plate penetrates the cover plate, and one end of the vertical plate is fixedly connected to the rack. A third adjustment screw for driving the rack to move up and down is threadedly connected to the cover plate.

[0011] Further technical solution: Multiple sets of second brackets are fixedly installed on the conveyor belt. The positions of the second brackets correspond to the positions of the first brackets. A grille plate is slidably installed on the second brackets, and a second adjustment screw for driving the grille plate to move up and down is rotatably installed on the second brackets.

[0012] Further technical solution: A dust suction hood is fixedly installed inside the housing. The dust suction hoods are distributed along the length direction of the housing, and the dust suction hood is connected to an exhaust fan fixedly installed on the housing.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. The semiconductor components are conveyed by the conveyor belt. During the conveying process, the semiconductor components are turned over on the upper and lower surfaces through devices such as the push plate, clamping plate, gear, and rack, so that a comprehensive dust blowing operation on the surface of the semiconductor components can be realized, achieving a sustainable and comprehensive dust blowing operation on the semiconductor components, avoiding the conveyor belt from stopping moving, and improving the dust blowing and cleaning effect of the semiconductor components.

[0014] 2. Air is delivered into the hood by a hair dryer, and the air is blown from the hood toward the semiconductor components. Due to the arc-shaped structure of the hood, the air moves along the radial direction of the hood after being blown out of the hood, so that the air can be blown toward the upper surface and side surfaces of the semiconductor components, and air with different flow directions can be blown to different surfaces of the semiconductor components. Under the action of multi-directional air flow, impurities on the surface of the semiconductor components can be blown off more easily, reducing the dead angle of dust blowing and improving the cleaning effect of dust blowing. The flipping of the semiconductor components allows the air to be further blown to all sides of the semiconductor components, further reducing the dead angle of dust blowing and improving the cleaning effect.

[0015] 3. The height of the grid plate is adjusted by the second adjusting screw so that the lower surface of the semiconductor component contacts the grid plate after flipping, so that the semiconductor component obtains stable support after flipping, further reducing the probability of damage caused by impact with the conveyor belt after flipping, and further improving the stability of the semiconductor component flipping. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0017] Figure 2 It is a schematic diagram of the structure inside the shell of the present invention.

[0018] Figure 3 It is a structural schematic diagram of the rotating shaft in the present invention.

[0019] Figure 4 for Figure 2 A magnified schematic diagram of area A in the middle.

[0020] Figure 5 It is a structural schematic diagram of the conveyor belt in the present invention.

[0021] Figure 6 It is a structural schematic diagram of the push plate in the present invention.

[0022] In the accompanying drawings: 1. Shell; 2. Cover plate; 3. Conveyor belt; 4. First bracket; 5. Slider; 6. First adjusting screw; 7. Rotating shaft; 8. Gear; 9. Limiting plate; 10. Support plate; 11. Elastic member; 12. Moving plate; 13. Clamp; 14. Ball; 15. Second bracket; 16. Second adjusting screw; 17. Grille plate; 18. Vertical plate; 19. Rack; 20. Third adjusting screw; 21. Horizontal plate; 22. Base plate; 23. Servo module; 24. Camera; 25. Hair dryer; 26. Blowing hood; 27. Lifting plate; 28. Dust hood; 29. Exhaust fan; 30. Telescopic member; 31. Push plate. DETAILED DESCRIPTION

[0023] In order to make the objectives, technical solutions, and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0024] The following describes the specific implementation of the present invention in detail with reference to specific embodiments.

[0025] As Figures 1-6 shown, a blowing and dust-removing device for a semiconductor packaging device provided by the present invention includes a housing 1. A conveyor belt 3 is rotatably installed in the housing 1. A plurality of sets of first brackets 4 distributed at intervals are fixedly installed on the conveyor belt 3. A slider 5 is slidably installed on the first bracket 4. A rotating shaft 7 is rotatably installed on the slider 5. The rotating shaft 7 penetrates through the slider 5 and a gear 8 is fixedly installed at one end of the rotating shaft 7. Two sets of moving plates 12 are slidably installed on the rotating shaft 7. A clamping plate 13 is fixedly installed on the moving plate 12. A limiting plate 9 is fixedly installed on the rotating shaft 7. The limiting plate 9 is distributed along the length direction of the rotating shaft 7 and the moving plate 12 is slidably connected to the limiting plate 9. Two sets of support plates 10 located inside the moving plate 12 are fixedly installed on the rotating shaft 7. Elastic members 11 distributed around the rotating shaft 7 are fixedly installed on the side surface of the support plate 10 close to the moving plate 12. One end of the elastic member 11 away from the support plate 10 is fixedly connected to the moving plate 12. A plurality of sets of balls 14 distributed at intervals are rotatably installed on the surfaces of the moving plates 12 away from each other; A cover plate 2 is fixedly installed in the middle of the housing 1. A rack 19 is arranged on the cover plate 2. The rack 19 is used in cooperation with the gear 8. A vertical plate 18 is slidably installed on the cover plate 2. The vertical plate 18 penetrates through the cover plate 2 and one end of the vertical plate 18 is fixedly connected to the rack 19. A third adjusting screw 20 for driving the rack 19 to move up and down is threadedly connected to the cover plate 2. A cross plate 21 is fixedly installed in the housing 1. Two sets of substrate plates 22 are slidably installed on the cross plate 21. A servo module 23 for driving the two sets of substrate plates 22 to move synchronously and in opposite directions is arranged on the housing 1. A telescopic member 30 is fixedly installed on the surface of the substrate plate 22 close to the conveyor belt 3. The output end of the telescopic member 30 is fixedly installed with a push plate 31. The length of the horizontal section of the substrate plate 22 is greater than the length of the rack 19. The distribution area of the horizontal section of the substrate plate 22 covers the distribution area of the rack 19. A camera 24 is fixedly installed on the cover plate 2. The camera 24 is located in the area where the rack 19 is located and is used to detect the position of the semiconductor; Two sets of lifting plates 27 are slidably installed on the cover plate 2. A blowing hood 26 is fixedly installed at the end of the lifting plate 27 located inside the housing 1. The cross section of the blowing hood 26 is arc-shaped and the opening faces the conveyor belt 3. The blowing hood 26 is connected to a hair dryer 25 fixedly installed on the housing 1.

[0026] In practical application of this embodiment, the semiconductor component to be cleaned is placed on the conveyor belt 3, and is located between two sets of clamping plates 13 near the rotating shaft 7. The conveyor belt 3 drives the semiconductor component to move. The height of the blowing hood 26 is adjusted according to the height of the semiconductor component. After that, the lifting plate 27 is fixed by fixing screws to complete the fixing of the blowing hood 26, so that the blowing hood 26 can be closer to the semiconductor component, improving the dust blowing effect. Air is conveyed into the blowing hood 26 by the blower 25, and the air blows from the blowing hood 26 to the semiconductor component. Due to the arc-shaped structure of the blowing hood 26, the air moves along the radial direction of the blowing hood 26 after being blown out of the blowing hood 26. Thus, the air can blow to the upper surface and the side surface of the semiconductor component, and the air flowing in different directions can blow to different surfaces of the semiconductor component. Under the action of the air flowing in multiple directions, the impurities on the surface of the semiconductor component can be more easily blown off, reducing the dead angle of dust blowing and improving the cleaning effect of dust blowing; When the rotating shaft 7 near which the camera 24 detects the approaching semiconductor component moves to the area where the horizontal section of the substrate 22 is located, at this time, the servo module 23 drives the two sets of substrates 22 to move inward simultaneously. The substrate 22 drives the push plate 31 to move so that the push plate 31 contacts the ball 14. After that, the push plate 31 can push the clamping plate 13 to move towards the semiconductor component. Since the width of the semiconductor component is known, after the two sets of substrates 22 move a set distance, the clamping plate 13 contacts and clamps the surface of the semiconductor component. As the semiconductor component moves, the gear 8 at the end of the rotating shaft 7 meshes with the rack 19. Furthermore, the rotating shaft 7 will rotate during the movement. The rotating shaft 7 drives the semiconductor component to rotate through the clamping plate 13. The rotating shaft 7 is rotated 180 degrees through the rack 19, so that the original lower surface of the semiconductor component rotates to the upper side. When the gear 8 leaves the rack 19, the clamping plate 13 still clamps the semiconductor component. At this time, under the action of gravity, the semiconductor component will drive the rotating shaft 7 to rotate until the semiconductor component contacts the conveyor belt 3. Since the push plate 31 always applies a thrust to the moving plate 12, under the action of friction, the rotating shaft 7 can rotate slowly, stably and smoothly, avoiding the impact between the semiconductor component and the conveyor belt 3. The smoothness of the contact between the moving plate 12 and the push plate 31 is ensured by the ball 14, reducing the friction. After that, the push plate 31 disengages from the moving plate 12. After the upper and lower surfaces of the semiconductor component are flipped, the dust blowing operation is continued through the blowing hood 26 at the rear. Thus, the surface of the semiconductor component that originally contacted the conveyor belt 3 can be cleaned, realizing the comprehensive dust blowing and cleaning operation of the semiconductor component. The flipping of the semiconductor component enables the air to further blow to each side surface of the semiconductor component, further reducing the dead angle of dust blowing and improving the cleaning effect; Adjust the height of the slider 5 through the first adjusting screw rod 6 according to the thickness of the semiconductor component, so as to adjust the height of the rotating shaft 7, enabling the clamping plate 13 to contact more with the side surface of the semiconductor component, improving the stability when the semiconductor component is flipped. At the same time, adjust the height of the rack 19 through the third adjusting screw rod 20 to ensure that the gear 8 can mesh with the rack 19, and adjust the height of the push plate 31 through the telescopic member 30 to ensure that the push plate 31 can contact the moving plate 12, improving the flexibility of equipment use; When the push plate 31 pushes the moving plate 12 to move, the elastic member 11 will be compressed. When the push plate 31 leaves the moving plate 12, under the action of the elastic member 11, the moving plate 12 will reset. At this time, the clamping plate 13 leaves the side surface of the semiconductor component, making the back surface of the semiconductor component unobstructed during subsequent dust blowing, ensuring the dust blowing effect of the semiconductor component.

[0027] In an example of this embodiment, the telescopic member 30 is an electric telescopic rod. Of course, it can also be other components such as a hydraulic cylinder that can actively change in length, and the electric telescopic rod drives the push plate 31 to move up and down.

[0028] As Figure 2 、 Figure 4 shown, a blowing and dust removing device for a semiconductor packaging device provided by the present invention. A plurality of second brackets 15 are fixedly installed on the conveyor belt 3, and the positions of the second brackets 15 correspond to the positions of the first brackets 4. A grille plate 17 is slidably installed on the second brackets 15, and a second adjusting screw rod 16 for driving the grille plate 17 to move up and down is rotatably installed on the second brackets 15.

[0029] In actual application of this embodiment, according to the height of the lower surface of the semiconductor component after flipping, adjust the height of the grille plate 17 through the second adjusting screw rod 16, so that the lower surface of the semiconductor component after flipping contacts the grille plate 17, enabling the semiconductor component to obtain stable support after flipping, further reducing the probability of damage caused by the impact between the semiconductor component and the conveyor belt 3 after flipping, and further improving the stability of flipping of the semiconductor component.

[0030] As Figure 1 、 Figure 2 shown, a blowing and dust removing device for a semiconductor packaging device provided by the present invention. A dust suction cover 28 is fixedly installed in the housing 1, the dust suction cover 28 is distributed along the length direction of the housing 1, and the dust suction cover 28 is connected to an exhaust fan 29 fixedly installed on the housing 1.

[0031] In actual application of this embodiment, the exhaust fan 29 is used to extract the air in the dust suction cover 28, thereby exhausting the air in the housing 1, enabling the blown impurities and dust to be discharged from the housing 1 in a timely manner, and preventing the dust and impurities from adhering to the semiconductor component again.

[0032] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

[0033] In addition, it should be understood that although this specification is described in accordance with the embodiments, not every embodiment only includes an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A blowing dust removal device for a semiconductor packaging device, comprising a housing (1), characterized in that, A conveyor belt (3) is rotatably installed inside the housing (1). A plurality of first brackets (4) are fixedly installed on the conveyor belt (3) at intervals. A slider (5) is slidably installed on the first bracket (4). A rotating shaft (7) is rotatably installed on the slider (5). The rotating shaft (7) penetrates through the slider (5) and a gear (8) is fixedly installed at one end of the rotating shaft (7). Two moving plates (12) are slidably installed on the rotating shaft (7), and a clamping plate (13) is fixedly installed on the moving plate (12). A cover plate (2) is fixedly installed in the middle of the housing (1). A rack (19) is arranged on the cover plate (2), and the rack (19) is used in cooperation with the gear (8). A cross plate (21) is fixedly installed inside the housing (1). Two substrate plates (22) are slidably installed on the cross plate (21). A servo module (23) for driving the two substrate plates (22) to move synchronously and in opposite directions is arranged on the housing (1). A telescopic member (30) is fixedly installed on the surface of the substrate plate (22) close to the conveyor belt (3). A push plate (31) is fixedly installed at the output end of the telescopic member (30). The horizontal section length of the substrate plate (22) is greater than the length of the rack (19), and the distribution area of the horizontal section of the substrate plate (22) covers the distribution area of the rack (19). Two lifting plates (27) are slidably installed on the cover plate (2). A blowing hood (26) is fixedly installed at the end of the lifting plate (27) located inside the housing (1). The cross section of the blowing hood (26) is arc-shaped and the opening faces the conveyor belt (3). The blowing hood (26) is connected to a blower (25) fixedly installed on the housing (1).

2. The air-blowing dust removal device for a semiconductor packaging device according to claim 1, characterized in that, A limiting plate (9) is fixedly installed on the rotating shaft (7). The limiting plate (9) is distributed along the length direction of the rotating shaft (7), and the moving plate (12) is slidably connected to the limiting plate (9).

3. The blowing dust removal device for a semiconductor packaging device according to claim 2, wherein, Two support plates (10) located inside the moving plate (12) are fixedly installed on the rotating shaft (7). Elastic members (11) distributed around the rotating shaft (7) are fixedly installed on the side surface of the support plate (10) close to the moving plate (12). One end of the elastic member (11) away from the support plate (10) is fixedly connected to the moving plate (12).

4. The air-blowing dust removal device for a semiconductor packaging device according to claim 3, wherein, A plurality of balls (14) are rotatably installed on the surfaces of the moving plates (12) away from each other at intervals.

5. The air-blowing dust removal device for a semiconductor packaging device according to claim 1, characterized in that, A camera (24) is fixedly installed on the cover plate (2). The camera (24) is located in the area where the rack (19) is located and is used to detect the position of the semiconductor.

6. The air-blowing dust removal device for a semiconductor packaging device according to claim 1, characterized in that, A vertical plate (18) is slidably installed on the cover plate (2). The vertical plate (18) penetrates through the cover plate (2) and one end of the vertical plate (18) is fixedly connected to the rack (19). A third adjusting screw (20) for driving the rack (19) to move up and down is threadedly connected to the cover plate (2).

7. The air-blowing dust removal device for a semiconductor packaging device according to claim 1, wherein, A plurality of second brackets (15) are fixedly installed on the conveyor belt (3). The positions of the second brackets (15) correspond to the positions of the first brackets (4). A grille plate (17) is slidably installed on the second bracket (15). A second adjusting screw (16) for driving the grille plate (17) to move up and down is rotatably installed on the second bracket (15).

8. The air-blowing dust removal device for a semiconductor packaging device according to claim 1, characterized in that, A dust suction hood (28) is fixedly installed inside the housing (1). The dust suction hood (28) is distributed along the length direction of the housing (1), and the dust suction hood (28) is connected to an exhaust fan (29) fixedly installed on the housing (1).

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