Processing method of glass plate
By covering the protective film layer on the surface of the glass plate and etching with laser cutting and glass etching liquid, the thermal stress and cutting surface roughness problems during laser cutting of glass are solved, and high-quality glass separation and smooth edges are achieved, avoiding additional polishing processes.
Patent Information
- Application Number
- CN202510556180.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-29
- Publication Date
- 2025-08-01
AI Technical Summary
There are microcracks and deformation problems caused by thermal influence when cutting glass, and the roughness of the cutting surface requires additional polishing and may cause slag hanging.
The protective film layer is covered on the surface of the glass plate, and the cutting path is formed using laser cutting and the cutting path is etched in the glass etching liquid to separate the glass plate. The green laser and linear polarization state are used, the cutting depth is less than the thickness of the glass, and the etching is used with 5-10% hydrofluoric acid for 14-20 hours.
It reduces the thermal stress of the glass plate, reduces microcracks and deformation, smooth cutting surface without polishing, eliminates slag hanging phenomenon, and improves the quality of glass workpieces.
Smart Images
Figure CN120398401A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of glass, and in particular to a processing method for a glass plate. Background Art
[0002] Using a laser to cut glass is a common glass processing method. Although laser cutting of glass has advantages such as high precision and good edge quality, there are also some defects, mainly including the following aspects:
[0003] Thermal influence: Although laser cutting of glass is often considered "cold processing", a certain amount of heat is still generated during the cutting process. If the heat accumulates too much, it may cause local overheating of the glass, resulting in thermal stress, and further causing problems such as microcracks and deformation of the glass. Especially for thick glass of several millimeters or heat-sensitive glass materials, the thermal influence is more obvious.
[0004] Cutting surface roughness: The cutting surface of laser-cut glass is not completely smooth, but has a certain roughness. Although the roughness is usually within a certain range, for some optical glass or precision instrument glass components with extremely high surface quality requirements, additional post-processing operations such as polishing may be required. Summary of the Invention
[0005] To solve at least some of the above problems in the prior art, the present invention provides a processing method for a glass plate, which is characterized by including:
[0006] Covering a protective film layer on the surface of the glass plate to wrap the glass plate;
[0007] Using a laser cutting method to cut the front surface of the glass plate to form a cutting path, and the cutting depth of the cutting path is less than the thickness of the glass plate; and
[0008] Placing the glass plate with the cutting path in a glass etching solution to etch the cutting path so that the glass plate is separated to obtain a glass workpiece.
[0009] Further, the thickness of the glass plate is 3 mm - 5 mm, and the depth of the cutting path is 0.1 mm to 2 mm.
[0010] Further, the glass etching solution is hydrofluoric acid with a concentration of 5% - 10%.
[0011] Further, the protective film layer is a chromium film layer.
[0012] Further, the thickness of the protective film layer is 1000 nm to 2000 nm.
[0013] Further, a laser device is used to cut the front surface of the glass plate to form a plurality of concentric circular cutting paths.
[0014] Further, the laser used for laser cutting is a green laser, the laser wavelength is 532 nm, and the polarization state of the laser is a linearly polarized state.
[0015] Further, the average power of the laser cutting is 10 W, and the frequency is 1500 - 2000 kHz.
[0016] The present invention has at least the following beneficial effects: In the glass plate processing method of the present invention, first, a cutting channel is cut on a relatively thick glass plate using a laser cutting process, and then a glass etching solution is used to etch the cutting channel until the glass plate is separated to obtain a glass workpiece, which can reduce the thermal stress on the glass plate during the processing, reduce or even avoid problems such as microcracks and deformation; moreover, the edge of the glass workpiece obtained by etching the cutting channel with the glass etching solution is smooth and does not cut the hand, and no additional polishing process is required. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] To further clarify the above and other advantages and features of the embodiments of the present invention, a more specific description of the embodiments of the present invention will be presented with reference to the accompanying drawings. It can be understood that these drawings only depict typical embodiments of the present invention and will not be considered as limiting its scope. In the drawings, for clarity, the same or corresponding components will be denoted by the same or similar reference numerals.
[0018] Figure 1 Shows the flow of a method for processing a glass plate according to an embodiment of the present invention.
[0019] Figure 2 Shows a schematic structural diagram of a glass plate with a protective film layer according to an embodiment of the present invention.
[0020] Figure 3 Shows a schematic structural diagram of a glass plate with a cutting channel according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0021] It should be noted that the components in the drawings may be exaggerated for illustration purposes and are not necessarily to scale.
[0022] In the present invention, each embodiment is only intended to illustrate the solution of the present invention and should not be construed as restrictive.
[0023] In the present invention, unless otherwise specified, the quantifiers "a" and "one" do not exclude the scenario of multiple elements.
[0024] It should also be noted here that in the embodiments of the present invention, for clarity and simplicity, only a part of the components or assemblies may be shown, but those of ordinary skill in the art can understand that, under the teaching of the present invention, the required components or assemblies can be added according to the specific scenario requirements.
[0025] It should also be noted herein that within the scope of the present invention, terms such as "identical", "equal", "equivalent" do not mean that the two numerical values are absolutely equal, but allow for a certain reasonable error, that is, these terms also cover "substantially identical", "substantially equal", "substantially equivalent".
[0026] It should also be noted herein that in the description of the present invention, the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present invention and simplifying the description, rather than explicitly or implicitly indicating that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as explicitly or implicitly indicating relative importance.
[0027] In addition, the embodiments of the present invention describe the process steps in a specific order. However, this is only for the convenience of distinguishing each step, rather than limiting the sequence of each step. In different embodiments of the present invention, the sequence of each step can be adjusted according to the adjustment of the process.
[0028] For thick glass of several millimeters, using laser cutting will cause thermal stress, resulting in problems such as microcracks and deformation in the glass. Moreover, there is a certain roughness on the cutting surface of laser-cut glass, and additional post-treatment processes such as polishing are required. In addition, when laser-cutting glass, sometimes some tiny glass particles or slag will adhere to the cutting edge, that is, the slagging phenomenon. This is because during the cutting process, part of the glass material is melted but not completely blown away or discharged, and it adheres to the cutting edge after cooling. The slagging not only affects the appearance quality of the glass but may also affect subsequent assembly or use, and additional post-treatment processes such as polishing are required to remove it. Therefore, in order to avoid the defects of laser-cutting thick glass, the present application proposes a new method for processing glass plates, which uses a laser to draw cutting tracks on the glass plate and then separates the glass plate along the cutting tracks by wet etching.
[0029] Figure 1 The flowchart of a method for processing a glass plate according to an embodiment of the present invention is shown. Figure 2 The schematic structural diagram of a glass plate with a protective film layer according to an embodiment of the present invention is shown. Figure 3 The schematic structural diagram of a glass plate with cutting tracks according to an embodiment of the present invention is shown.
[0030] As Figure 1 shown, a method for processing a glass plate includes:
[0031] Step 1, as Figure 2 shown, a protective film layer 20 is covered on the surface of the glass plate 10 to cover the glass plate 10. In one embodiment, the protective film layer 20 completely covers the glass plate 10, and the protective film layer 20 can be a chromium film layer. The thickness of the protective film layer 20 is 1000 nm to 2000 nm. Optionally, before plating the protective film, the surface of the glass plate is ultrasonically cleaned and dried.
[0032] Step 2, as Figure 3 shown, the front surface of the glass plate 10 is cut using a laser cutting method to form a cutting channel 101, and the cutting depth of the cutting channel 101 is less than the thickness of the glass plate 10. In one embodiment, the thickness of the glass plate 10 is 3 mm - 5 mm, the depth of the cutting channel 101 is 0.1 mm to 2 mm, preferably 1 mm to 2 mm. The width of the cutting channel 101 is about 0.02 mm. The cost of forming the cutting channel using the laser cutting method is one-tenth of the cost of completely dividing the glass by the laser. In one embodiment, the glass plate 10 is a rectangular glass plate, and the glass plate is cut using a laser cutting method to form a plurality of concentric circular cutting channels on the front surface of the glass plate.
[0033] In one embodiment, the laser used for laser cutting can be selected as a green laser, with a wavelength of 532 nm, a polarization state of linear polarization state, an average power of 10 W, and a frequency of 1500 - 2000 kHz.
[0034] Step 3, the glass plate 10 with the cutting channel 101 is placed in a glass etching solution to etch the cutting channel 101 so that the glass plate 10 is separated to obtain glass workpieces. At 20°C - 30°C, the glass plate with the cutting channel is soaked in hydrofluoric acid with a concentration of 5% - 10% for about 14 - 20 hours. After this wet etching, the cutting channel depth of the glass plate 10 is extended until the glass plate 10 is separated, forming a plurality of glass workpieces.
[0035] The hydrofluoric acid with a concentration of 40% is diluted with deionized water into hydrofluoric acid with a concentration of 5% - 10%. Then the diluted hydrofluoric acid is used to etch the cutting channels on the glass plate.
[0036] In an embodiment of the present invention, a glass plate with multiple circular cutting channels is soaked in hydrofluoric acid with a concentration of 5% for about 20 hours. The glass plate is separated along the cutting channels to obtain multiple ring-shaped glass workpieces and circular glass workpieces. The outer diameters of each ring-shaped glass workpiece and the diameter of the circular glass are measured. The outer diameters of the 7 rings are 140.97 mm, 119.37 mm, 99.43 mm, 77.17 mm, 69.6 mm, 48.93 mm, and 45.54 mm respectively, and the diameter of the circular glass workpiece is 25.87 mm. The error between the measured diameter and the designed diameter is within 0.2 mm. The edges of the glass workpieces are smooth and do not cut hands, with a roughness of 50 nm - 60 nm, and no additional polishing process is required. Moreover, the glass etching solution can corrode the glass particles or slag attached generated by laser cutting, weakening or even eliminating the influence of the slag hanging phenomenon in laser cutting.
[0037] First, use the laser cutting process to cut cutting channels on a thicker glass plate, and then use the glass etching solution to etch the cutting channels until the glass plate is separated to obtain glass workpieces, which can reduce the thermal stress on the glass plate during the processing and reduce or even avoid problems such as microcracks and deformation.
[0038] Hydrofluoric acid with a concentration of 2% and 30% is used for comparison. When the glass plate with cutting channels is placed in hydrofluoric acid with a concentration of 30%, the width of the cutting channels will increase, increasing the error between the size of the glass workpiece and the theoretical size, and the chromium film will also be significantly corroded, and even the glass plate surface covered by the chromium film will be corroded.
[0039] When the glass plate with cutting channels is placed in hydrofluoric acid with a concentration of 2%, the etching at the cutting channels is slow, and the separation of the glass plate is not completed in 20 hours.
[0040] Although some embodiments of the present invention have been described in this application document, those skilled in the art can understand that these embodiments are only shown as examples. Those skilled in the art can think of numerous variant solutions, alternative solutions, and improvement solutions without exceeding the scope of the present invention under the teaching of the present invention. The appended claims are intended to define the scope of the present invention and thereby cover the methods and structures within the scope of these claims themselves and their equivalent transformations.
Claims
1. A processing method of a glass plate, characterized in that, Including: Covering a protective film layer on the surface of the glass plate to wrap the glass plate; Using a laser cutting method to cut the front surface of the glass plate to form cutting channels, and the cutting depth of the cutting channels is less than the thickness of the glass plate; And Placing the glass plate with cutting channels in a glass etching solution to etch the cutting channels so that the glass plate is separated to obtain glass workpieces.
2. The method according to claim 1, wherein The thickness of the glass plate is 3 mm - 5 mm, and the depth of the cutting channels is 0.1 mm - 2 mm.
3. The method according to claim 1, wherein The glass etching solution is hydrofluoric acid with a concentration of 5% - 10%.
4. The method according to claim 1, wherein The protective film layer is a chromium film layer.
5. The method according to claim 1, characterized in that The thickness of the protective film layer is 1000 nm - 2000 nm.
6. The method according to claim 1, characterized in that, Using a laser device to cut the front surface of the glass plate to form a plurality of concentric circular cutting channels.
7. The method according to claim 1, characterized in that, The laser used for laser cutting is a green laser, the laser wavelength is 532 nm, and the polarization state of the laser is a linearly polarized state.
8. The method according to claim 1, wherein The average power of the laser cutting is 10 W, and the frequency is 1500 - 2000 kHz.