Packaging method of flat vacuum glass

Abstract

The invention relates to the technical field of glass manufacturing, and provides a flat vacuum glass packaging method which comprises the following steps: acquiring the plane shape of target flat glass, and acquiring the shape information of the edge side part of the target flat glass to acquire the curve characteristics of the edge side part of the target flat glass; coating a surface metallization layer: coating the edge side part of the target plate glass with a continuous metallization layer according to the curve characteristics of the edge side part of the target plate glass; surface supporting columns are constructed, and a plurality of supporting columns are arranged on the surface of the target plate glass; constructing a soldering tin packaging layer, collecting position information of the metallization layer at the edge side part of the target plate glass, and coating the metallization layer with the continuous soldering tin packaging layer; and laminating and packaging. And the coating of the metallization layer and the construction of the soldering tin packaging layer can be used in more target plate glass scenes with non-standard shapes, so that the packaging requirements of the target plate glass with the non-standard shapes can be met.

Description

Technical Field

[0001] The present invention relates to the technical field of glass manufacturing, and particularly provides a method for encapsulating flat vacuum glass. Background Art

[0002] With the continuous deepening of the concepts of building energy conservation and environmental protection, vacuum glass has received extensive attention due to its excellent heat insulation and sound insulation performance. Generally, vacuum glass forms a vacuum layer between two pieces of glass, effectively reducing heat conduction and sound transmission, thereby improving the energy efficiency and living comfort of buildings.

[0003] However, the traditional encapsulation method of flat vacuum glass is often only applicable to standard rectangular vacuum glass. For non-standard shapes such as circular, oval, triangular vacuum glass, there are certain limitations in the encapsulation technology, which also restricts the wide application of vacuum glass in building decoration and special application scenarios. Summary of the Invention

[0004] The purpose of the present invention is to provide a method for encapsulating flat vacuum glass, aiming to solve the problem that the existing encapsulation method of vacuum glass is difficult to meet the encapsulation requirements of non-standard shaped glass.

[0005] To achieve the above purpose, the technical solution adopted by the present invention is: A method for encapsulating flat vacuum glass provided by an embodiment of the present application includes the following steps: Obtaining the planar shape of the target flat glass, collecting the shape information of the edge portion of the target flat glass to obtain the curve characteristics of the edge portion of the target flat glass; Coating the surface metallization layer, coating a continuous metallization layer on the edge portion of the target flat glass according to the curve characteristics of the edge portion of the target flat glass; Constructing the surface support columns, arranging a plurality of support columns on the surface of the target flat glass; Constructing the solder encapsulation layer, collecting the position information of the metallization layer at the edge portion of the target flat glass, and coating a continuous solder encapsulation layer on the metallization layer; Laminating and encapsulating, laminating the target flat glass that has completed the above steps, and performing encapsulation treatment in a vacuum encapsulation furnace.

[0006] Advantages of the present invention: The encapsulation method of the flat vacuum glass provided by the present invention increases the acquisition of the shape information of the edge side of the target flat glass to obtain corresponding curve features, providing parameter support for the subsequent coating of the surface metallization layer and the construction of the solder encapsulation layer. Especially when the target flat glass is a non-standard shaped glass, its edge side presents different curvatures. In this way, the coating of the metallization layer and the construction of the solder encapsulation layer can be used in more non-standard shaped target flat glass scenarios, thus meeting the encapsulation requirements of non-standard shaped target flat glass.

[0007] In some embodiments, the thickness of the metallization layer is 10 μm to 70 μm; the width of the metallization layer is 1 mm to 15 mm.

[0008] In some embodiments, the thickness of the solder encapsulation layer is 20 μm to 150 μm; the width of the solder encapsulation layer is 1 mm to 15 mm.

[0009] In some embodiments, in the step of obtaining the planar shape of the target flat glass and collecting the image of the edge side of the target flat glass to obtain the curve features of the edge side of the target flat glass, the shape information of the edge side of the target flat glass is collected in real time by infrared scanning, and the curve features of the edge side are identified and obtained through the artificial intelligence module.

[0010] In some embodiments, in the step of constructing the solder encapsulation layer and collecting the position information of the metallization layer at the edge side of the target flat glass to coat the continuous solder encapsulation layer on the metallization layer, the position information of the metallization layer is collected in real time by infrared scanning, and the curve features of the edge side are identified and obtained through the artificial intelligence module to fine-tune the thickness and width of the solder encapsulation layer.

[0011] In some embodiments, before the step of obtaining the planar shape of the target flat glass and collecting the shape information of the edge side of the target flat glass to obtain the curve features of the edge side of the target flat glass, the encapsulation method further includes: Cutting and grinding of the target flat glass, cutting the target flat glass into a preset shape, and grinding the edge side of the target flat glass.

[0012] In some embodiments, the encapsulation method further includes: Placement of the getter, opening a groove structure on the surface of the target flat glass, and disposing the getter in the groove structure.

[0013] In some embodiments, in the construction of the surface support pillars, in the step of setting a plurality of support pillars on the surface of the target flat glass, the surface area of the target flat glass is obtained by infrared scanning, and the placement positions of the support pillars are constructed by the artificial intelligence module according to the surface area of the target flat glass.

[0014] In some embodiments, between the step of constructing the surface support pillars, setting a plurality of support pillars on the surface of the target flat glass and the step of constructing the solder encapsulation layer, collecting the position information of the metallization layer at the edge portion of the target flat glass, and applying a continuous solder encapsulation layer to the metallization layer, the encapsulation method further includes: Tempering and sintering of the glass, tempering the target flat glass provided with the support pillars in a tempering furnace, and sintering and connecting the support pillars to the target flat glass.

[0015] In some embodiments, the encapsulation method further includes: Activation and detection of the getter, heating the getter in the groove structure of the target flat glass to activate the getter, and performing a temperature difference experiment on the encapsulated target flat glass. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0017] Figure 1 It is a flowchart of the encapsulation method of the flat vacuum glass provided in Embodiment 1 of the present invention; Figure 2 It is a flowchart of the encapsulation method of the flat vacuum glass provided in Embodiment 2 of the present invention; Figure 3 It is a flowchart of the encapsulation method of the flat vacuum glass provided in Embodiment 3 of the present invention; Figure 4 It is a flowchart of the encapsulation method of the flat vacuum glass provided in Embodiment 4 of the present invention; Figure 5 It is a flowchart of the encapsulation method of the flat vacuum glass provided in Embodiment 5 of the present invention; Figure 6 It is a top view of the flat vacuum glass provided in the embodiments of the present invention; Figure 7 It is a cross-sectional view of the flat vacuum glass provided in the embodiments of the present invention in the state of assembled sheets.

[0018] Among them, the reference numerals in the figures are as follows: 100, target flat glass; 101, edge side part; 102, support column; 10, metallization layer; 20, solder encapsulation layer; 30, getter. Detailed implementation manners

[0019] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0020] In the description of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

[0021] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality of" means two or more unless otherwise specifically defined.

[0022] In the present invention, unless otherwise clearly specified and defined, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] The encapsulation methods of traditional flat vacuum glass often only apply to standard rectangular vacuum glass because the current encapsulation is difficult to achieve curved encapsulation. Therefore, for non-standard shapes such as circular, oval, triangular vacuum glass, there are certain limitations in the encapsulation technology.

[0024] In view of this, the present application provides a packaging method for flat vacuum glass, which adds the collection of shape information of the edge side of the target flat glass to obtain the corresponding curve characteristics; and provides parameter support for the subsequent coating of the surface metallization layer and the construction of the solder packaging layer. In particular, when the target flat glass is a non-standard shaped glass, its edge side presents different curvatures. In this way, the coating of the metallization layer and the construction of the solder packaging layer can be used in more non-standard shaped target flat glass scenarios, thereby also meeting the packaging requirements of non-standard shaped target flat glass.

[0025] Please refer to Figure 1 The embodiment of the present application provides a method for packaging flat vacuum glass, comprising the following steps: S001 , acquiring the plane shape of the target flat glass 100 , collecting shape information of the edge portion 101 of the target flat glass 100 to obtain curve features of the edge portion 101 of the target flat glass 100 .

[0026] It can be understood that the plane shape of the target flat glass 100 refers to the shape of the current target flat glass 100 from the projection direction perpendicular to the surface of the target flat glass 100. For example, the plane shape of the target flat glass 100 can be rectangular, circular, elliptical, triangular or other special shapes.

[0027] The edge portion 101 of the target glass plate 100 refers to the edge of the target glass plate 100. For example, the edge portion of a rectangular target glass plate is a straight edge portion, while the edge portion of a circular or elliptical target glass plate is a curved edge portion. That is, the edge portion 101 is not limited to a straight edge, a curved edge, or a wavy shape. Furthermore, the curved shape of the edge portion 101 refers to the contour shape of the edge portion 101 when projected perpendicular to the surface of the target glass plate 100.

[0028] S002 , coating the surface metallization layer 10 , coating the edge portion 101 of the target flat glass 100 with a continuous metallization layer 10 according to the curve characteristics of the edge portion 101 of the target flat glass 100 .

[0029] It can be understood that the metallization layer 10 refers to a metal coating of a certain thickness. This metal coating should have a first surface facing the edge portion 101 of the target flat glass 100 and a second surface opposite the first surface. The second surface should be the surface facing outward from the edge portion 101 and should also be flat with the subsequent solder encapsulation layer. Therefore, the first surface should be adapted to the edge portion 101 of the target flat glass 100, thus complementing the edge portion 101. The second surface should be flat to facilitate the subsequent solder encapsulation layer adhesion.

[0030] Here, the continuous metallization layer 10 means that on the edge side portion 101 of the target flat glass 100, the metal layer covers the entire edge side portion 101.

[0031] S003. Construction of the surface support pillars 102. A plurality of support pillars 102 are provided on the surface of the target flat glass 100.

[0032] Understandably, the support pillar 102 is a columnar structure for supporting two target flat glasses 100. That is, the opposite ends of the support pillar 102 respectively abut against the two target flat glasses 100. It can be seen from this that the support pillar 102 is located on the surface of the target flat glass 100, that is, the support pillar 102 is located on the large surface of the target flat glass 100.

[0033] It should also be noted that the setting positions of the respective support pillars 102 on the surface of the target flat glass 100 can be adjusted according to actual usage requirements. For example, the number and spacing of the support pillars 102 can be set according to the surface area of the target flat glass 100.

[0034] S004. Construction of the solder encapsulation layer 20. The position information of the metallization layer 10 at the edge side portion 101 of the target flat glass 100 is collected, and a continuous solder encapsulation layer 20 is coated on the metallization layer 10.

[0035] Understandably, before laminating and encapsulating the target flat glass 100, a solder encapsulation layer 20 needs to be provided on the metallization layer 10 for the target flat glass 100 to be laminated through the solder encapsulation layer 20 and to form a sealed vacuum glass.

[0036] S005. Laminating and encapsulating. The target flat glass 100 that has completed the above steps is laminated, and encapsulation treatment is performed in a vacuum encapsulation furnace.

[0037] Understandably, after the construction of the solder encapsulation layer 20 is completed, the target flat glass 100 is laminated with other components and placed in a vacuum encapsulation furnace for final encapsulation treatment to ensure the sealing performance during the use of the vacuum glass and the stability of the vacuum layer.

[0038] The encapsulation method of the flat vacuum glass provided by the present invention increases the acquisition of the shape information of the edge side portion 101 of the target flat glass 100 to obtain corresponding curve features, providing parameter support for the subsequent coating of the surface metallization layer 10 and the construction of the solder encapsulation layer 20. Especially when the target flat glass 100 is a glass with a non-standard shape, the edge side portion 101 presents different curvatures. In this way, the coating of the metallization layer 10 and the construction of the solder encapsulation layer 20 can be used in more scenarios of target flat glass 100 with non-standard shapes, thus meeting the encapsulation requirements of the target flat glass 100 with non-standard shapes.

[0039] Please refer to Figure 6 and Figure 7 , in some embodiments, the thickness of the metallization layer 10 is 10 μm to 70 μm; the width of the metallization layer 10 is 1 mm to 15 mm.

[0040] It can be understood that the thickness of the metallization layer 10 can be integer values such as 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, etc., or decimal values such as 10.1 μm, 30.9 μm, 60.05 μm, etc.

[0041] The width of the metallization layer 10 can be integer values such as 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, 15 mm, etc., or decimal values such as 1.1 mm, 7.159 mm, 13.121 mm, etc.

[0042] Please refer to Figure 6 and Figure 7 , in some embodiments, the thickness of the solder encapsulation layer 20 is 20 μm to 150 μm; the width of the solder encapsulation layer 20 is 1 mm to 15 mm.

[0043] It can be understood that the thickness of the solder encapsulation layer 20 can be integer values such as 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, etc., or decimal values such as 10.1 μm, 30.9 μm, 60.05 μm, 100.36 μm, 149.36 μm, etc.

[0044] The width of the solder encapsulation layer 20 can be integer values such as 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 11 mm, 12 mm, 13 mm, 14 mm, 15 mm, etc., or decimal values such as 1.1 mm, 7.159 mm, 13.121 mm, etc.

[0045] In some embodiments, in the step of obtaining the planar shape of the target flat glass 100 and collecting an image of the edge portion 101 of the target flat glass 100 to obtain the curve features of the edge portion 101 of the target flat glass 100, the shape information of the edge portion 101 of the target flat glass 100 is collected in real time by infrared scanning, and the curve features of the edge portion 101 are identified and obtained through an artificial intelligence module.

[0046] It can be understood that the infrared scanning technology is a non-contact detection and imaging technology based on the infrared radiation characteristics of objects, and is widely used in industrial inspection, security monitoring, medical diagnosis, military reconnaissance and other fields. It is usually completed by an infrared scanning system, which generally includes an optical system, a detector, a signal processing system and a display system. Thus, the formation information of the edge portion 101 of the target flat glass 100 can be obtained by means of infrared scanning technology.

[0047] The artificial intelligence module may include an edge detection operator module, an edge detection network module, a contour extraction and shape analysis module, etc. Among them, the edge detection operator module may include a Canny edge detection module, a Prewitt operator module and a Laplacian operator module. The Canny edge detection module is a classic edge detection algorithm. Through Gaussian filtering, gradient calculation, non-maximum suppression and double-threshold processing, it can extract continuous edge curves; the Prewitt operator module is based on first-order gradient calculation and is suitable for fast edge detection; the Laplacian operator module is based on second-order derivatives and is sensitive to noise, but can detect finer edge changes. The edge detection network module may include an edge convolution network and HED (Holistically-Nested Edge Detection). Among them, the edge convolution network is used as mentioned in the edge feature extraction method for autonomous driving. The edge convolution network can construct a spatial relationship model through three convolution templates of the cross shape, the fishing net shape and the cross shape, and effectively identify the edge features in the image.

[0048] Thus, the curve features of the edge portion 101 of the target flat glass 100, such as curvature, slope, etc., can be finally obtained to prepare for the coating of the metallization layer 10 in the subsequent process.

[0049] In some embodiments, in the construction of the solder encapsulation layer 20, in the step of collecting the position information of the metallization layer 10 at the edge portion 101 of the target flat glass 100 and coating the continuous solder encapsulation layer 20 on the metallization layer 10, the position information of the metallization layer 10 is collected in real time by infrared scanning, and the curve features of the edge portion 101 are identified and obtained through an artificial intelligence module to finely adjust the thickness and width of the solder encapsulation layer 20.

[0050] Similarly, the same infrared scanning technique and artificial intelligence module can be used to obtain the position information of the metallization layer 10, providing data support for the coating of the solder encapsulation layer 20.

[0051] Exemplarily, there are differences in color difference and light transmittance between the metallization layer 10 and the edge portion 101 of the target flat glass 100. Therefore, the metallization layer 10 and the edge portion 101 of the target flat glass 100 can be distinguished based on this.

[0052] Please refer to Figure 2 , in some embodiments, before the step of obtaining the planar shape of the target flat glass 100 and collecting the shape information of the edge portion 101 of the target flat glass 100 to obtain the curve characteristics of the edge portion 101 of the target flat glass 100, the steps of the encapsulation method further include: S006. Cutting and grinding of the glass, cutting the target flat glass 100 into a preset shape, and grinding the edge portion 101 of the target flat glass 100.

[0053] It can be understood that according to actual usage requirements, the target flat glass 100 is cut into corresponding shapes, such as oval flat glass, circular flat glass, and triangular flat glass, etc. After cutting, an automatic grinding machine can be used to grind the edge of the target flat glass 100 to eliminate burrs and irregular shapes generated during the cutting process, providing a basis for the subsequent coating of the metallization layer 10 and the construction of the solder encapsulation layer 20.

[0054] Please refer to Figure 3 and Figure 6 , in some embodiments, the steps of the encapsulation method further include: S007. Placement of the getter 30, opening a groove structure on the surface of the target flat glass 100, and disposing the getter 30 in the groove structure.

[0055] It can be understood that the function of the getter 30 is to suck out the residual gas and water vapor in the vacuum glass, further improving the vacuum degree of the vacuum glass after lamination. Therefore, the getter 30 needs to be placed on the target flat glass 100 before lamination.

[0056] The placement method of the getter 30 is to open a groove structure on the surface of the target flat glass 100. The groove structure can be a circular groove structure or a square groove structure, and the getter 30 is stored in the groove structure.

[0057] In some embodiments, in the construction of the surface support columns 102, in the step of setting a plurality of support columns 102 on the surface of the target flat glass 100, the surface area of the target flat glass 100 is obtained by infrared scanning, and the placement points of the support columns 102 are constructed by the artificial intelligence module according to the surface area of the target flat glass 100.

[0058] Exemplarily, when the target flat glass 100 is a circular glass, the surface area of the circular glass is calculated by means of infrared scanning, and the placement points of the support columns 102 are constructed by the artificial intelligence module according to the surface area of the circular glass.

[0059] Or, exemplarily, when the target flat glass 100 is a triangular glass, the surface area of the triangular glass is calculated by means of infrared scanning, and the placement points of the support columns 102 are constructed by the artificial intelligence module according to the surface area of the triangular glass.

[0060] Please refer to Figure 4 , in some embodiments, in the construction of the surface support columns 102, between the step of setting a plurality of support columns 102 on the surface of the target flat glass 100 and the construction of the solder encapsulation layer 20, the position information of the metallization layer 10 at the edge portion 101 of the target flat glass 100 is collected, and the encapsulation method further includes: S008. Tempering and sintering of the glass, tempering the target flat glass 100 provided with the support columns 102 in a tempering furnace, and sintering and connecting the support columns 102 with the target flat glass 100.

[0061] It can be understood that the target flat glass 100 is put into a tempering furnace for tempering treatment to improve its compressive strength and high-temperature resistance, ensure its stability and reliability in subsequent use, and at the same time, the metallization layer 10 and the support columns 102 can be quickly sintered on the surface of the target flat glass 100 at the current temperature to provide higher bonding force.

[0062] Please refer to Figure 5 , in some embodiments, the steps of the encapsulation method further include: S009. Activation and detection of the getter 30, heating the getter 30 in the groove structure of the target flat glass 100 to activate the getter 30, and performing a temperature difference experiment on the encapsulated target flat glass 100.

[0063] It can be understood that after the encapsulation process is completed, the getter 30 is locally heated and activated by an electromagnetic induction device to extract the residual gas and water vapor in the vacuum glass, further improving the vacuum degree inside the vacuum glass. In addition, its vacuum performance is tested through a temperature difference experiment.

[0064] The following is illustrated by specific embodiments. Embodiment

[0065] Cutting and grinding of the glass. Select an oval target flat glass 100 to ensure that the oval shape meets the specification requirements. After cutting, use an automated grinding machine to grind the edge of the target flat glass 100 to eliminate the burrs and irregular shapes generated during the cutting process, providing a basis for the construction of subsequent metallization coatings and encapsulation layers.

[0066] Placement of the getter 30. According to the design requirements, use a high-precision laser drilling device to open circular or square grooves on the surface of the target flat glass 100 to ensure the accuracy and consistency of the getter 30 hole positions, providing support for the extraction of residual gas inside the glass in the future.

[0067] Obtaining the planar shape of the target flat glass 100. Collect the shape information of the edge portion 101 of the target flat glass 100 to obtain the curve characteristics of the edge portion 101 of the target flat glass 100.

[0068] Coating of the surface metallization layer 10. Use a metallization dispensing and spraying device to perform metallization treatment on the edge portion 101 of the target flat glass 100. During the metallization process, use an infrared scanning system to collect the edge shape of the oval glass in real time, and the artificial intelligence module identifies the curve characteristics of the edge portion 101 of the target flat glass 100 to ensure that the metallization coating evenly covers the entire edge portion 101 of the target flat glass 100. By dynamically adjusting the working parameters of the spraying device, the thickness of the metallization layer 10 is controlled at 40 microns, the width is 8 mm, and the error is controlled within ±5 microns.

[0069] Construction of the surface support posts 102. According to the design requirements, arrange a dot array with a size of 50*50 mm on the surface of the target flat glass 100, and use a ceramic dispensing and spraying device for dot placement. During the dot placement process of the support posts 102, use an infrared scanning system to collect the shape size and range of the oval target flat glass 100 in real time, and the artificial intelligence module automatically constructs the dot placement points of the support posts 102 to ensure that the dot matrix of the support posts 102 is evenly dotted on the entire surface of the oval target flat glass 100. By dynamically adjusting the working parameters of the dot placement device, the thickness of the support posts 102 is controlled at 40 microns, the diameter is 0.5 mm, and the error is controlled within ±5 microns.

[0070] Tempering and sintering of the glass. Place the oval target flat glass 100 into a tempering furnace for tempering treatment to improve its compressive strength and high-temperature resistance, ensuring its stability and reliability during subsequent use. At the same time, at this temperature, the metallization layer 10 and the support posts 102 can be quickly sintered on the glass surface to provide higher bonding strength.

[0071] For the construction of the solder encapsulation layer 20, an automated soldering device is used to evenly coat the solder encapsulation layer 20 on the metallization layer 10. During this process, an infrared scanning system is utilized to collect the metallization layer 10 on the edge portion 101 of the elliptical target flat glass 100 in real time. The artificial intelligence module identifies the edge curve features to ensure that the thickness and width of the solder encapsulation layer 20 are finely adjusted through a real-time feedback control system during the soldering process, ensuring the uniformity and integrity of the solder encapsulation layer 20. The thickness of the solder encapsulation layer 20 is controlled at 80 microns, the width is 12 mm, and the error is controlled within ±10 microns.

[0072] Lamination and encapsulation. After completing the construction of the encapsulation layer, the processed elliptical target flat glass 100 is laminated with other components and placed in a vacuum encapsulation furnace for final encapsulation processing to ensure the sealing performance of the glass during use and the stability of the vacuum layer.

[0073] Activation and detection of the getter 30. After the encapsulation process is completed, an electromagnetic induction device is used to locally heat and activate the getter 30 to extract the residual gas and water vapor inside the vacuum glass, further improving the vacuum degree inside the vacuum glass. In addition, its vacuum performance is tested through a temperature difference experiment. Embodiment

[0074] Cutting and grinding of the glass. A triangular target flat glass 100 is selected to ensure that the elliptical shape meets the specification requirements. After cutting, an automated grinding machine is used to grind the edge of the target flat glass 100 to eliminate the burrs and irregular shapes generated during the cutting process, providing a basis for the subsequent construction of the metallization coating and the encapsulation layer.

[0075] Placement of the getter 30. According to the design requirements, a high-precision laser drilling device is used to open circular or square grooves on the surface of the target flat glass 100 to ensure the accuracy and consistency of the hole positions of the getter 30, providing support for the subsequent extraction of the residual gas inside the glass.

[0076] Obtaining the planar shape of the target flat glass 100. The shape information of the edge portion 101 of the target flat glass 100 is collected to obtain the curve features of the edge portion 101 of the target flat glass 100.

[0077] Coating of the surface metallization layer 10. A metallization dispensing and spraying device is used to perform metallization treatment on the edge portion 101 of the target flat glass 100. During the metallization process, an infrared scanning system is used to collect the edge shape of the elliptical glass in real time. The artificial intelligence module identifies the curve features of the edge portion 101 of the target flat glass 100 to ensure that the metallization coating evenly covers the entire edge portion 101 of the target flat glass 100. By dynamically adjusting the working parameters of the spraying device, the thickness of the metallization layer 10 is controlled at 40 microns, the width is 8 mm, and the error is controlled within ±5 microns.

[0078] Construction of the surface support pillars 102. According to the design requirements, a dot array with a size of 50*50 mm is arranged on the surface of the target flat glass 100, and dotting treatment is carried out using a ceramic dispensing and spraying device. During the dotting process of the support pillars 102, the shape, size, and range of the triangular target flat glass 100 are collected in real time by an infrared scanning system, and the artificial intelligence module automatically constructs the dotting positions of the support pillars 102 to ensure that the dot matrix of the support pillars 102 is evenly distributed on the entire surface of the triangular target flat glass 100. By dynamically adjusting the working parameters of the dotting device, the thickness of the support pillars 102 is controlled at 40 microns, the diameter is 0.5 mm, and the error is controlled within ±5 microns.

[0079] Tempering and sintering of the glass. The triangular target flat glass 100 is placed in a tempering furnace for tempering treatment to improve its compressive strength and high-temperature resistance, ensuring its stability and reliability during subsequent use. At the same time, at this temperature, the metallization layer 10 and the support pillars 102 can be quickly sintered on the glass surface to provide higher bonding strength.

[0080] Construction of the solder encapsulation layer 20. An automated soldering device is used to evenly coat the solder encapsulation layer 20 on the metallization layer 10. During this process, the metallization layer 10 on the edge side 101 of the triangular target flat glass 100 is collected in real time by an infrared scanning system, and the artificial intelligence module identifies the edge curve characteristics to ensure that the thickness and width of the solder encapsulation layer 20 are finely adjusted through a real-time feedback control system during the soldering process, ensuring the uniformity and integrity of the solder encapsulation layer 20. The thickness of the solder encapsulation layer 20 is controlled at 80 microns, the width is 12 mm, and the error is controlled within ±10 microns.

[0081] Lamination and encapsulation. After the construction of the encapsulation layer is completed, the processed triangular target flat glass 100 is laminated with other components and placed in a vacuum encapsulation furnace for final encapsulation treatment to ensure the sealing performance of the glass during use and the stability of the vacuum layer.

[0082] Activation and detection of the getter 30. After the encapsulation process is completed, the getter 30 is locally heated and activated using an electromagnetic induction device to extract the residual gas and water vapor inside the vacuum glass, further improving the vacuum degree inside the vacuum glass. In addition, its vacuum performance is tested through a temperature difference experiment.

[0083] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for encapsulating flat vacuum glass, characterized in that, The encapsulation method includes: Obtaining the planar shape of the target flat glass, collecting the shape information of the edge part of the target flat glass to obtain the curve characteristics of the edge part of the target flat glass; Coating the surface metallization layer, coating a continuous metallization layer on the edge part of the flat glass according to the curve characteristics of the edge part of the target flat glass; Constructing the surface support columns, arranging a plurality of support columns on the surface of the target flat glass; Constructing the solder encapsulation layer, collecting the position information of the metallization layer at the edge part of the target flat glass, and coating a continuous solder encapsulation layer on the metallization layer; Laminating and encapsulating, laminating the target flat glass that has completed the above steps, and performing encapsulation processing in a vacuum encapsulation furnace.

2. The encapsulation method of the flat vacuum glass according to claim 1, characterized in that, The thickness of the metallization layer is 10μm - 70μm; the width of the metallization layer is 1mm - 15mm.

3. The encapsulation method of the flat vacuum glass according to claim 1, characterized in that, The thickness of the solder encapsulation layer is 20μm - 150μm; the width of the solder encapsulation layer is 1mm - 15mm.

4. The encapsulation method of the flat vacuum glass according to any one of claims 1 to 3, characterized in that, In the step of obtaining the planar shape of the target flat glass, collecting the image of the edge part of the target flat glass to obtain the curve characteristics of the edge part of the target flat glass, the shape information of the edge part of the target flat glass is collected in real time by infrared scanning, and the curve characteristics of the edge part are identified and obtained through the artificial intelligence module.

5. The encapsulation method of the flat vacuum glass according to any one of claims 1 to 3, characterized in that, In the step of constructing the solder encapsulation layer, collecting the position information of the metallization layer at the edge part of the target flat glass, and coating a continuous solder encapsulation layer on the metallization layer, the position information of the metallization layer is collected in real time by infrared scanning, and the curve characteristics of the edge part are identified and obtained through the artificial intelligence module to finely adjust the thickness and width of the solder encapsulation layer.

6. The encapsulation method of the flat vacuum glass according to any one of claims 1 to 3, characterized in that, Before the step of obtaining the planar shape of the target flat glass, collecting the shape information of the edge part of the target flat glass to obtain the curve characteristics of the edge part of the target flat glass, the encapsulation method further includes: Cutting and grinding the target flat glass, cutting the flat glass into a preset shape, and grinding the edge part of the target flat glass.

7. The encapsulation method of the flat vacuum glass according to claim 6, characterized in that, The encapsulation method further includes: Placing the getter, opening a groove structure on the surface of the target flat glass, and arranging a getter in the groove structure.

8. The encapsulation method of the flat vacuum glass according to any one of claims 1 to 3, characterized in that, In the step of constructing the surface support columns, arranging a plurality of support columns on the surface of the target flat glass, the surface area size of the target flat glass is obtained by infrared scanning, and the placement points of each support column are constructed by the artificial intelligence module according to the surface area size of the target flat glass.

9. The encapsulation method of the flat vacuum glass according to claim 8, characterized in that, Between the step of constructing the surface support columns, arranging a plurality of support columns on the surface of the target flat glass and the step of constructing the solder encapsulation layer, collecting the position information of the metallization layer at the edge part of the target flat glass, and coating a continuous solder encapsulation layer on the metallization layer, the encapsulation method further includes: Tempering and sintering of the glass, tempering the target flat glass provided with each support column in a tempering furnace, and sintering and connecting each support column with the target flat glass.

10. The encapsulation method of the flat vacuum glass according to claim 7, characterized in that, The encapsulation method further includes: Activation and detection of the getter, heating the getter in the groove structure of the target flat glass to activate the getter, and performing a temperature difference experiment on the encapsulated target flat glass.

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