Composition applied to preparation line of high polymer material

By preparing a composition of nickel protective layer and aluminum protective layer on polymer materials, the problems of tension, ductility and resistance of composite aluminum foil materials in new energy batteries are solved, and the battery performance and safety are improved.

CN120399448APending Publication Date: 2025-08-01SHANGHAI BOROS NEW MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202510291933.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-12
Publication Date
2025-08-01

AI Technical Summary

Technical Problem

The existing composite aluminum foil materials are difficult to meet the requirements of high tension, ductility and low resistance in new energy batteries, and the thickness is difficult to thin, affecting battery performance and safety.

Method used

The polymer material is treated with a surface treatment agent and a catalyst, and the nickel protective layer and an aluminum protective layer are formed by electroplating and evaporating aluminum. The treatment is carried out in combination with a specific composition to form a high-performance aluminum foil composite material.

Benefits of technology

The prepared aluminum foil composite tension TD>180, MD>160, the ductility is increased by 0.5%-1%, the resistance meets and exceeds the requirements of the power battery, and the thickness is reduced to 8μm, which improves the performance and safety of the battery.

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Abstract

The invention relates to a composition applied to a preparation line on a high polymer material. The composition comprises a compound as shown in a formula (I) and a compound as shown in a formula (II). The tensile force of the aluminum foil composite material prepared from the composition is TDgt; 180, MDgt; the ductility is improved by 0.5%-1%, the resistance meets and exceeds the requirements of a power battery, the technical obstacles in the prior art are effectively overcome, and the performance and the safety of the battery are improved; in addition, the aluminum foil with the thinnest thickness of 13 microns commonly used at present is thinned to 8 microns, and the performance of the battery is further optimized. # imgabs0 #
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Description

Technical Field

[0001] The present invention relates to the technical field of electronic materials and manufacturing, and particularly relates to a composition applied to the preparation of circuits on polymer materials. Background Art

[0002] With the rapid development of the new energy industry, as a key energy storage device, the performance and safety of new energy batteries have received wide attention. The selection of the positive current collector material of the new energy throttle has an important impact on the overall performance of the battery. At present, pure aluminum foil is mainly used as the current collector material for the positive electrode of the new energy throttle, and its thinnest thickness is 13 microns. However, battery manufacturers have put forward higher requirements for the performance of aluminum foil, such as the tensile strength requirement TD>180, MD>160, good ductility, and the resistance requirement to meet the requirements of power batteries, etc. Although there are some aluminum foil suppliers in the market, there is no supplier who can fully meet these requirements.

[0003] In this context, composite aluminum foil has received attention as a new type of current collector material. Composite aluminum foil is mainly made of PET and PP materials, and is prepared by processes such as laser sintering or vacuum sputtering. However, these methods have some problems, such as greater physical and mechanical damage to the substrate, resulting in the performance of the composite aluminum foil being difficult to meet the requirements of battery manufacturers. In addition, it is also difficult to reduce the thickness of the composite aluminum foil, which limits its application in the battery field.

[0004] In view of this, there is an urgent need for a composition applied to the preparation of circuits on polymer materials. Summary of the Invention

[0005] The object of the present invention is to provide a composition applied to the preparation of circuits on polymer materials in view of the deficiencies in the prior art.

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] The first aspect of the present invention is to provide a composition for use in preparing circuits on polymer materials. The steps of preparing circuits on polymer materials include: cleaning and opening the ring with a surface treatment agent, performing overflow water washing twice with deionized water, performing roughening treatment with potassium permanganate, performing overflow water washing twice with deionized water, performing neutralization treatment with hydrogen peroxide, performing overflow water washing twice with deionized water, performing surface treatment with a second composition, performing overflow water washing twice with deionized water, performing catalytic treatment with a catalyst, performing overflow water washing twice with deionized water, performing acceleration treatment, performing overflow water washing twice with deionized water, depositing a chemical nickel layer, washing with deionized water, washing with hot deionized water, washing with deionized water, baking and crosslinking, cleaning and activating the nickel surface, washing with deionized water twice, electroplating nickel, and washing with deionized water twice; wherein, the composition includes: a compound represented by formula (I) and a compound represented by formula (II);

[0008]

[0009] Among them, the steps of preparing circuits on polymer materials further include: after electroplating nickel and washing with deionized water twice, treating with the composition to form a nickel protection layer, washing with deionized water twice, evaporating aluminum, treating with the composition to form an aluminum protection layer, washing with deionized water twice, and baking and winding up.

[0010] Preferably, the steps of preparing circuits on polymer materials further include: after cleaning and activating the nickel surface and washing with deionized water twice, before electroplating nickel, pre-plating copper, washing with deionized water, electroplating copper, and washing with deionized water twice.

[0011] Preferably, by volume fraction, the second composition is composed of 45%-60% pure water, 10%-40% tetramethylammonium hydroxide, 2%-5% aqueous polyimide, 1%-2% terephthalic acid, 1%-3% ethylene glycol, 0.5%-2% aqueous glycoluril resin, 0.5%-2% aqueous functional additive, and 0.1%-1.0% nano-oriented dispersant.

[0012] The aqueous functional additive and the nano-oriented dispersant in the present invention are both as shown in ZL202210827748.3.

[0013] The second aspect of the present invention is to provide an application of the composition as described above in preparing circuits on polymer materials.

[0014] The present invention adopts the above technical solutions, and compared with the prior art, has the following technical effects:

[0015] The tensile strength of the aluminum foil composite material prepared from the composition of the present invention is TD > 180 and MD > 160, and the ductility is increased by 0.5% - 1%. The resistance meets and exceeds the requirements of power batteries, effectively overcoming the technical obstacles in the prior art and improving the performance and safety of the batteries. Moreover, the present invention also thins the currently commonly used aluminum foil with a minimum thickness of 13 μm to 8 μm, further optimizing the performance of the batteries. Detailed Embodiments

[0016] The following will describe in detail the specific embodiments of the present invention.

[0017] Unless otherwise defined, the technical terms or scientific terms used in the claims and the specification should have the ordinary meaning understood by those of ordinary skill in the technical field to which the present invention pertains.

[0018] The term "comprising" or similar words used in the specification and claims of this patent application of the present invention are intended to mean that the items appearing before "comprising" cover the items listed after "comprising" or their equivalents, and do not exclude other items.

[0019] The numerical values mentioned in the present invention include all numerical values that increase unit by unit from low to high. Here, it is assumed that there is an interval of at least two units between any lower value and higher value. For example, if it is said that a component amount or a physical quantity ranges from 1 to 100, 10 to 90 is more preferable, and 20 to 80 is the most preferable, it is intended to express that numerical values such as 5 to 95, 14 to 76, 23 to 67, 32 to 58, 41 to 49, etc. are all clearly listed in this specification; for numerical values less than 1, 0.0001, 0.001, 0.01 or 0.1 is considered a more appropriate unit. The foregoing examples are for illustrative purposes only. In fact, all numerical combinations between the listed lowest value and highest value are considered to be clearly listed in this specification in a similar manner.

[0020] Example 1

[0021] This example provides a composition used in the preparation of circuits on a polymer material, including: a compound shown in formula (I) and a compound shown in formula (II):

[0022]

[0023] Example 2

[0024]

[0025]

[0026] Among them, Pro AD-250 is a mixture of alkali and surfactant, Pro-KK is potassium permanganate, Pro-SO is hydrogen peroxide, Pro AD-3316 is palladium, Pro AD-3800 is a mixture of sulfuric acid and surfactant, Pro EN-1820M is malic acid or / and succinic acid, Pro EN-1820A is electroless nickel, Pro EN-1820B is sodium borohydride, Pro EN-1820C is amino acid, Pro-311 is oxalic acid; SPAIN is the second composition, so named because it microscopically resembles a spine.

[0027] As shown in the above table, the steps of preparing a circuit on a polymer material include: cleaning and ring-opening with a surface treatment agent, overflowing and washing twice with deionized water, roughening with potassium permanganate, overflowing and washing twice with deionized water, neutralizing with hydrogen peroxide, overflowing and washing twice with deionized water, surface treating with the second composition, overflowing and washing twice with deionized water, catalytic treatment with a catalyst, overflowing and washing twice with deionized water, acceleration treatment, overflowing and washing twice with deionized water, depositing an electroless nickel layer, deionized water washing, hot deionized water washing, deionized water washing, baking and crosslinking, cleaning and activating the nickel surface, deionized water washing twice, pre-plating copper, deionized water washing, electroplating copper, and deionized water washing twice, electroplating nickel, deionized water washing twice, treating with the composition as described in Example 1 to form a nickel protection layer, deionized water washing twice, evaporating aluminum, treating with the composition as described in Example 1 to form an aluminum protection layer, deionized water washing twice, and baking and rewinding.

[0028] Example 3

[0029]

[0030]

[0031] Among them, Pro AD-250 is a mixture of alkali and surfactant, Pro-KK is potassium permanganate, Pro-SO is hydrogen peroxide, Pro AD-3316 is palladium, Pro AD-3800 is a mixture of sulfuric acid and surfactant, Pro EN-1820M is malic acid or / and succinic acid, Pro EN-1820A is electroless nickel, Pro EN-1820B is sodium borohydride, Pro EN-1820C is amino acid, Pro-311 is oxalic acid; SPAIN is the second composition, so named because it microscopically resembles a spine.

[0032] As shown in the above table, the steps for preparing a circuit on a polymer material include: cleaning and ring-opening with a surface treatment agent, overflow water washing twice with deionized water, roughening with potassium permanganate, overflow water washing twice with deionized water, neutralizing with hydrogen peroxide, overflow water washing twice with deionized water, surface treatment with a second composition, overflow water washing twice with deionized water, catalytic treatment with a catalyst, overflow water washing twice with deionized water, acceleration treatment, overflow water washing twice with deionized water, depositing a chemical nickel layer, deionized water washing, hot deionized water washing, deionized water washing, baking and crosslinking, cleaning and activating the nickel surface, deionized water washing twice, electroplating nickel, deionized water washing twice, treating with the composition described in Example 1 to form a nickel protection layer, deionized water washing twice, evaporating aluminum, treating with the composition described in Example 1 to form an aluminum protection layer, deionized water washing twice, and baking and winding up.

[0033] Example 4

[0034] Peeling force test

[0035] Name of the testing equipment: Electronic universal testing machine; Model of the testing equipment: AG-X plus;

[0036] Testing environmental temperature: 22°C - 28°C; Relative humidity of the testing environment: 45%RH - 70%RH;

[0037] Testing method: Conduct a 90° pulling test on the aluminum foil composite material with a universal tensile tester. The aluminum foil composite material is prepared from Example 2. The pulling speed is 50 mm / min, and the pulling distance is higher than 70 mm.

[0038] The test results are shown in the following table:

[0039]

[0040] Thickness test and resistance test

[0041] In the aluminum foil composite material prepared from Example 2, the thickness of the polymer material (PET) substrate is 4.5 μm, the total thickness is 8 μm - 9 μm, and the resistance is 5 mΩ - 7 mΩ.

[0042] In the aluminum foil composite material prepared from Example 3, the thickness of the polymer material (PET) substrate is 4.5 μm, the total thickness is 8 μm, and the resistance is from !6 mΩ to 22 mΩ.

[0043] In summary, for the aluminum foil composite material prepared from the composition of the present invention, the tensile strength in the TD direction is >180, and in the MD direction is >160, and the ductility is increased by 0.5%-1%. The resistance meets and exceeds the requirements of power batteries, effectively overcoming the technical obstacles in the prior art and improving the performance and safety of the batteries. Moreover, the present invention also reduces the thickness of the currently commonly used thinnest aluminum foil of 13 μm to 8 μm, further optimizing the performance of the batteries.

[0044] The above are only the preferred embodiments of the present invention, and do not limit the implementation manners and protection scope of the present invention accordingly. For those skilled in the art, it should be realized that all the equivalent replacements and obvious changes made by using the content of the specification of the present invention should be included in the protection scope of the present invention.

Claims

1. A composition used in the preparation of circuits on polymer materials, and the steps of preparing circuits on polymer materials include: Cleaning and opening the loop with a surface treatment agent, overflow water washing twice with deionized water, roughening treatment with potassium permanganate, overflow water washing twice with deionized water, neutralization treatment with hydrogen peroxide, overflow water washing twice with deionized water, surface treatment with a second composition, overflow water washing twice with deionized water, catalytic treatment with a catalyst, overflow water washing twice with deionized water, acceleration treatment, overflow water washing twice with deionized water, depositing a chemical nickel layer, deionized water washing, hot deionized water washing, deionized water washing, baking and crosslinking, cleaning and activating the nickel surface, deionized water washing twice, electroplating nickel, and deionized water washing twice; characterized in that the composition comprises: a compound represented by formula (I) and a compound represented by formula (II); Wherein, the steps of preparing a circuit on the polymer material further include: after electroplating nickel and deionized water washing twice, treating with the composition to form a nickel protection layer, deionized water washing twice, aluminum evaporation, treating with the composition to form an aluminum protection layer, deionized water washing twice, and baking and winding.

2. The composition according to claim 1, wherein The steps of preparing a circuit on the polymer material further include: after cleaning and activating the nickel surface and deionized water washing twice, before electroplating nickel, pre-plating copper, deionized water washing, electroplating copper, and deionized water washing twice.

3. The composition according to claim 1, wherein By volume fraction, the second composition is composed of 45%-60% pure water, 10%-40% tetramethylammonium hydroxide, 2%-5% waterborne polyimide, 1%-2% terephthalic acid, 1%-3% ethylene glycol, 0.5%-2% waterborne glycoluril resin, 0.5%-2% waterborne functional additive, and 0.1%-1.0% nano-oriented dispersant.

4. Use of a composition according to any one of claims 1-3 in preparing a circuit on a polymer material.

Citation Information

Patent Citations

  • Composition as well as preparation method and application thereof

    CN115477847A