Super-soft copper wire lamp string production process

Abstract

The invention discloses a super-soft copper wire lamp string production process which comprises the following steps: flattening and shaping a'copper wire doubling ', and removing a surface insulating layer of the'copper wire doubling' to form a plurality of equidistant or unequidistant'welding points'; moving the'copper wire doubling 'forwards to enable the'welding point' to be placed on the mounting table, and realizing mounting and welding of the LED chip and the'welding point 'on the mounting table; moving the'copper wire doubling 'forwards to enable the next'welding point' to be placed on the mounting table, and repeating the mounting and welding operation of the LED chip and the'welding point '; according to the method, the ultra-soft copper wire lamp string with the ultra-soft copper wire as a carrier and the LED chip as a light emitting source can be produced, the overall size of the lamp string is greatly reduced, and the ultra-soft copper wire lamp string is convenient to carry, suitable for various braiding processes and high in production efficiency. The lamp string can be widely applied to respective scenes, and the applicability of the lamp string is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of lamp string processing and production, and in particular to a production process for ultra-flexible copper wire lamp strings. Background Art

[0002] Copper wire lamp strings are a new type of LED energy-saving and environmental protection decorative lamp strings in which LED light-emitting bodies are welded to copper wires. Due to the influence of processing technology, the copper wires serving as the carriers of LEDs on the current market are mostly set to be relatively "thick" to facilitate the welding of the copper wires and the LED light-emitting bodies. This results in the relatively large overall volume of the existing lamp strings on the market, making it difficult to apply the lamp strings to small-sized objects or difficult to apply them to more delicate occasions, restricting the use of the lamp strings. At the same time, it is not conducive to the convenient carrying of the lamp strings. Further, when the lamp strings on the market are processed, the distance between adjacent LED light-emitting bodies is equal, and producers cannot flexibly adjust the distance between each adjacent LED light-emitting body as needed to make it unequal. Further, the LED light-emitting bodies of the lamp strings on the market can only choose a single-color encapsulation glue during encapsulation, making it difficult to meet the diverse needs of consumers. Summary of the Invention

[0003] The object of the present invention is to propose a production process for ultra-flexible copper wire lamp strings in view of the technical problems existing in the background art, including the following steps: flattening and shaping the "copper wire parallel connection" to remove the surface insulation layer of the "copper wire parallel connection" to form a number of equally spaced or unequally spaced "welding points"; moving the "copper wire parallel connection" forward so that the "welding points" are placed on the mounting table, and realizing the mounting and welding of the LED chips and the "welding points" on the mounting table; moving the "copper wire parallel connection" forward so that the next "welding point" is placed on the mounting table, and repeating the above-mentioned mounting and welding operations of the LED chips and the "welding points"; using encapsulation glue to perform single-color or multi-color encapsulation on the already mounted LED chips, and curing the encapsulation glue through a curing lamp.

[0004] Further, it further includes the following steps: setting a driving mechanism, the driving mechanism including a clamping device for "grabbing" the "copper wire parallel connection"; setting two groups of clamping devices, and making the two groups of clamping devices move forward and backward alternately along the processing direction of the "copper wire parallel connection"; when the clamping device moves forward, making it clamp the "copper wire parallel connection" to drive the "copper wire parallel connection" to continuously move forward.

[0005] Further, it further includes the following steps: controlling the forward movement speed of the "copper wire parallel connection" by controlling the forward and backward movement speeds of the two groups of clamping devices; moving the equally spaced or unequally spaced "welding points" adjacent to each other to the mounting table by controlling the forward movement speed of the "copper wire parallel connection".

[0006] Further, the following steps are further included: arranging a front and rear driving cylinder, a first connecting plate, a left and right driving cylinder, a second connecting plate, a clamping part and a clamping cylinder on the clamping device; connecting the front and rear driving cylinder with the first connecting plate, and driving the first connecting plate to move back and forth along the processing direction of "copper wire parallel connection" through the front and rear driving cylinder; connecting the left and right driving cylinders with the second connecting plate and the first connecting plate respectively, and driving the second connecting plate to move relative to the first connecting plate in the left and right directions through the left and right driving cylinders; arranging the clamping part on the second connecting plate, and at the same time connecting the clamping cylinder with the clamping part, and driving the opening and closing of the clamping part through the clamping cylinder to realize the clamping of "copper wire parallel connection".

[0007] Further, the step of "flattening and shaping the "copper wire parallel connection" and removing the surface insulation layer of the "copper wire parallel connection" to form a number of equidistant or non-equidistant "welding points"" further includes the following steps: arranging a shaping mechanism and a laser, the shaping mechanism including a pressing part and a pressing platform; arranging the pressing part above the pressing platform; arranging a first guiding hole and a second guiding hole at the front and rear ends of the pressing platform respectively; threading the "copper wire parallel connection" through the first guiding hole, passing it under the pressing part, and passing it out through the second guiding hole; controlling the pressing part to move downward, and the pressing part can apply pressure to the "copper wire parallel connection" to flatten and shape the "copper wire parallel connection"; using the laser to remove the surface insulation layer of the "copper wire parallel connection" to form a number of equidistant or non-equidistant "welding points".

[0008] Further, the step of "moving the "copper wire parallel connection" forward to place the "welding point" on the mounting table and realizing the mounting and welding of the LED chip and the "welding point" on the mounting table" further includes the following steps: arranging a mounting groove and a heating element on the mounting table: moving the "copper wire parallel connection" to place the "welding point" in the mounting groove; dotting solder paste at the "welding point", and heating the solder paste to melt it through the heating element; mounting the LED chip at the "welding point" and realizing the electrical connection between the LED chip and the "welding point" through the solder paste.

[0009] Further, the step of "dotting solder paste at the "welding point" and heating the solder paste to melt it through the heating element" further includes the following steps: arranging a glue taking mechanism, the glue taking mechanism including a solder paste tray and a first robotic arm; arranging a solder paste dispensing head at one end of the first robotic arm and a first robotic arm driving device at the other end; arranging the solder paste in the solder paste tray; through the first robotic arm driving device, moving the solder paste dispensing head into the solder paste tray to realize the automatic glue taking of the solder paste by the solder paste dispensing head; through the first robotic arm driving device, moving the solder paste dispensing head to the mounting groove and dotting the solder paste at the "welding point" to realize the automatic glue dispensing at the "welding point".

[0010] Further, "mounting the LED chip at the 'welding point' and achieving electrical connection between the LED chip and the 'welding point' through solder paste" further includes the following steps: setting a mounting mechanism. The mounting mechanism includes an expansion ring and a second robotic arm; a pick-up head is arranged at one end of the second robotic arm, and a second robotic arm driving device is arranged at the other end; placing the blue film carrying the LED chip at the expansion ring; moving the pick-up head to the expansion ring through the second robotic arm driving device to "grab" the LED chip; moving the pick-up head to the mounting groove through the second robotic arm driving device and placing the LED chip at the "welding point" to achieve automatic mounting and welding of the LED chip.

[0011] Further, "using encapsulating glue to perform single-color or multi-color encapsulation on the mounted LED chip and curing the encapsulating glue through a curing lamp" further includes the following steps: setting an encapsulating mechanism. The encapsulating mechanism includes a dispensing device and a three-way driving device. The dispensing device includes a number of dispensing pens; connecting the three-way driving device with the dispensing device, and the three-way driving device can drive the dispensing device to move in the X-axis direction, Y-axis direction, and Z-axis direction; controlling the "copper wire parallel connection" to move forward, so that the mounted LED chip leaves the mounting table and moves to the encapsulating mechanism; controlling the movement of the dispensing device through the three-way driving device, selecting a dispensing pen to perform encapsulation on the LED chip to achieve single-color or multi-color encapsulation of the LED chip.

[0012] Further, "using encapsulating glue to perform single-color or multi-color encapsulation on the mounted LED chip and curing the encapsulating glue through a curing lamp" further includes the following steps: arranging a number of curing lamps in the processing direction of the "copper wire parallel connection"; controlling the "copper wire parallel connection" to move forward, so that the encapsulated LED chip passes through the above-mentioned curing lamps to achieve curing of the encapsulating glue.

[0013] Compared with the prior art, the present invention has the following beneficial technical effects: It can be understood that since the present invention needs to flatten and shape the "copper wire parallel connection" before processing the "copper wire parallel connection", after the "copper wire parallel connection" is flattened, the welding area between its welding point and the LED chip will increase, so as to solve the technical problem that it is difficult to stably weld the copper wire with the LED chip due to the overly thin copper wire. Through the above steps, the present invention can produce a super-flexible copper wire lamp string with a super-flexible thin copper wire as the carrier and an LED chip as the light source, greatly reducing the overall volume of the lamp string, being convenient to carry, suitable for various taping processes, and being widely applicable to various scenarios, increasing the applicability of the lamp string.

[0014] Further, it can be understood that since an insulating layer is attached to the outer layer of the copper wire, before processing, it is also necessary to remove the surface insulating layer of the "copper wire parallel connection" to form a number of equidistant or non-equidistant "welding points". Then, by moving the "copper wire parallel connection", the "welding points" are placed on the mounting table, and the LED chips can be mounted and welded on the mounting table. Through the above steps, the present invention can control the distance between adjacent LED chips by controlling the distance between adjacent welding points. Producers can flexibly adjust the distance between adjacent LED chips in the same super-flexible copper wire lamp string according to requirements, so as to realize the mounting of LED chips at different distances, meet the processes of various complex scenarios, and improve the flexible applicability of the super-flexible copper wire lamp string.

[0015] Further, when the present invention processes the lamp string, encapsulation adhesives of different colors can be selected to encapsulate the LED chips, so as to realize different color encapsulations for different LED chips in the same super-flexible copper wire lamp string, enhance the beauty and interest of the product, and meet the diverse needs of users. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a flowchart of the present invention;

[0017] Figure 2 is a flowchart of step S1;

[0018] Figure 3 is a flowchart of step S2;

[0019] Figure 4 is a flowchart of step S23;

[0020] Figure 5 is a flowchart of step S24;

[0021] Figure 6 is a flowchart of step S4;

[0022] Figure 7 is a three-dimensional state diagram of the equipment (mechanism) involved in the method of the present invention;

[0023] Figure 8 is a partial enlarged view at A;

[0024] Figure 9 is a partial enlarged view at D;

[0025] Figure 10 is a partial enlarged view at B;

[0026] Figure 11 is a partial enlarged view at C;

[0027] Figure 12 is a three-dimensional state diagram of another perspective of the equipment of the present invention;

[0028] Figure 13 This is the position distribution diagram of the mounting table, glue-taking mechanism and shaping mechanism of the present invention;

[0029] Figure 14 This is the enlarged partial view at E;

[0030] Figure 15 This is the enlarged partial view at F;

[0031] Figure 16 This is the three-dimensional state diagram of the driving mechanism;

[0032] Figure 17 This is the three-dimensional state diagram of the encapsulation mechanism. Specific embodiments

[0033] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other.

[0034] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or a specific connection; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific situations.

[0036] The following will describe the specific embodiments of the present invention in detail with reference to the drawings.

[0037] As Figures 1 - 17 shown, the present invention provides a production process for super-flexible copper wire lamp strings, including the following steps:

[0038] S1: Flatten and reshape the “copper wire parallel line” and remove the surface insulation layer of the “copper wire parallel line” to form a number of “welding points” with equal or unequal distances;

[0039] S2: Move the "copper wire parallel line" forward to place the "welding point" on the mounting table 13, and implement the mounting and welding of the LED chip and the "welding point" on the mounting table 13;

[0040] S3: Move the "copper wire parallel" forward to place the next "welding point" on the mounting table, and repeat the above-mentioned mounting and welding operations of the LED chip and the "welding point";

[0041] S4: Use packaging glue to encapsulate the mounted LED chips in the same color or multiple colors, and use a curing lamp to cure the packaging glue.

[0042] It can be understood that the "copper wire parallel lines" of this embodiment are composed of two groups of thin ultra-flexible copper wire parallel lines. Before processing the "copper wire parallel lines", because the copper wire is relatively thin, in order to improve the welding stability of the copper wire and the LED chip and improve the welding success rate, the "copper wire parallel lines" need to be flattened and shaped first. After the "copper wire parallel lines" are flattened, the welding area between the welding point and the LED chip will increase, so as to solve the technical problem that the copper wire is difficult to stably weld with the LED chip due to the copper wire being too thin. Through the above steps, the present invention can produce an ultra-flexible copper wire lamp string with ultra-flexible copper wire as the carrier and the LED chip as the light source, which greatly reduces the overall volume of the lamp string, is easy to carry, is suitable for various braiding processes, can be widely used in respective scenarios, and increases the applicability of the lamp string.

[0043] Furthermore, it can be understood that since an insulating layer is attached to the outer layer of the copper wire, the surface insulating layer of the "copper wire parallel line" needs to be removed before processing to form a number of equidistant or unequally spaced "welding points", and then the "copper wire parallel line" is moved to place the "welding points" on the mounting table. The welding points can realize the mounting and welding of LED chips on the mounting table. Through the above steps, the present invention can control the spacing between adjacent LED chips by controlling the spacing between adjacent welding points. Producers can flexibly adjust the spacing between adjacent LED chips in the same ultra-flexible copper wire lamp string according to demand to realize the mounting of different distances between LED chips, meet the process of various complex scenes, and improve the flexible applicability of ultra-flexible copper wire lamp strings.

[0044] Furthermore, because the present invention can select different colors of packaging glue to encapsulate the LED chips when processing the lamp string, so as to achieve different color packaging for different LED chips in the same ultra-flexible copper wire lamp string, thereby improving the beauty and fun of the product and meeting the diverse needs of users.

[0045] Further, in this embodiment, the copper wire will continuously move forward along the processing direction during the processing. It can be understood that the processing procedures of the lamp string are mainly divided into the insulation removal process, the dispensing process, the mounting process, and the encapsulation and curing process. Specifically, the time for the insulation removal process is 200 ms, the time for the solder paste dispensing process is 150 ms, the time for the LED chip mounting process is 50 ms, and the time for the LED chip encapsulation and curing process is 100 ms.

[0046] Further, it can be understood that the current moving speed of the existing copper wire moving continuously along the processing direction is inconvenient. Therefore, the existing processing technology can only perform dispensing and soldering on equally spaced welding points. Once the distance between the welding points changes, it is difficult to ensure that each welding point can be accurately moved to the mounting table for dispensing and soldering. To solve the above technical problems, the present invention further includes the following steps:

[0047] S5: Set a driving mechanism 14, and the driving mechanism 14 includes a clamping device 141 for "grasping" and "copper wire parallel connection";

[0048] S6: Set two groups of clamping devices 141, and make the two groups of clamping devices 141 move forward and backward alternately along the processing direction of the "copper wire parallel connection";

[0049] S7: When the clamping device 141 moves forward, make it clamp the "copper wire parallel connection" to drive the "copper wire parallel connection" to continuously move forward.

[0050] Through the above steps, the present invention can adjust the forward movement distance of the copper wire by controlling the moving speed of the two groups of clamping devices 141, that is, the present invention can adapt the distance between adjacent LED chips through the driving mechanism 14, and the producer can flexibly adjust the distance between adjacent LED chips in the same lamp string according to the needs.

[0051] Specifically, in this embodiment, as a specific implementation manner of the clamping device 141, the clamping device 141 includes a front and rear driving cylinder 1411, a first connecting plate 1412, a left and right driving cylinder 1413, a second connecting plate 1414, a clamping portion 1415, and a clamping cylinder 1416. The front and rear driving cylinder 1411 is connected to the first connecting plate 1412 to drive the first connecting plate 1412 to move forward and backward along the processing direction of the copper wire. The second connecting plate 1414 is connected to the first connecting plate 1412 through the left and right driving cylinder 1413, and the left and right driving cylinder 1413 is used to drive the second connecting plate 1414 to move relative to the first connecting plate 1412 in the left and right directions. The clamping portion 1415 is arranged on the second connecting plate 1414 and is connected to the clamping cylinder 1416, and the clamping cylinder 1416 is used to drive the clamping portion 1415 to open and close to realize the clamping of the copper wire.

[0052] Based on the above settings, when the two sets of clamping devices 141 move forward and backward alternately, in order to prevent the clamping parts 1415 from blocking each other, the two left and right driving cylinders 1413 need to cooperate and work alternately, so that the two sets of second connecting plates 1414 move relative to the respective first connecting plates 1412 in the left and right directions, thereby ensuring that when the two sets of clamping devices 141 move forward and backward alternately, their respective clamping parts 1415 will not be on the same straight line at the same time. That is, when the clamping part 1415 of one set of clamping devices 141 clamps the copper wire and moves forward, the left and right driving cylinders 1413 of the other set of clamping devices 141 are activated, causing the clamping parts 1415 of the two sets of clamping devices 141 to have an alternating trend to prevent the two clamping parts 1415 from blocking each other.

[0053] Further, in this embodiment, step S1: flattening and shaping the "copper wire parallel connection", removing the surface insulation layer of the "copper wire parallel connection" to form a number of equidistant or non-equidistant "welding points" further includes the following steps:

[0054] S11: setting an integer shaping mechanism 11 and a laser 12, the integer shaping mechanism 11 includes a pressing part 111 and a pressing platform 112;

[0055] S12: setting the pressing part 111 above the pressing platform 112;

[0056] S13: respectively setting a first guiding hole 1121 and a second guiding hole 1122 at the front and rear ends of the pressing platform 112;

[0057] S14: threading the "copper wire parallel connection" through the first guiding hole 1121, passing it under the pressing part, and passing it out through the second guiding hole 1122;

[0058] S15: controlling the pressing part 111 to move downward, and the pressing part 111 can apply pressure to the "copper wire parallel connection" to flatten and shape the "copper wire parallel connection";

[0059] S16: using the laser 12 to remove the surface insulation layer of the "copper wire parallel connection" to form a number of equidistant or non-equidistant "welding points".

[0060] Specifically, in this embodiment, the integer shaping mechanism 11 further includes a flexible block 113. The flexible block 113 can be a flexible object such as a sponge. The flexible block 113 is arranged between the pressing part 111 and the pressing platform 112 to clamp the copper wire between the flexible block 113 and the pressing platform 112. Through the above structural settings, the flexible block 113 can clean the copper wire to avoid impurities from being mixed into the copper wire during the welding process, thereby affecting the processing of the copper wire.

[0061] Further, in this embodiment, step S2: Move the "copper wire parallel connection" forward to place the "welding point" on the mounting table, and the mounting and welding of the LED chip and the "welding point" on the mounting table further include the following steps:

[0062] S21: Set a mounting groove 131 and a heating element 132 on the mounting table 13:

[0063] S22: Move the "copper wire parallel connection" to place the "welding point" in the mounting groove 131;

[0064] S23: Apply solder paste to the "welding point" and heat the solder paste through the heating element 132 to melt it;

[0065] S24: Mount the LED chip at the "welding point" and achieve electrical connection between the LED chip and the "welding point" through the solder paste.

[0066] Based on the above settings, the mounting groove 131 can limit the left and right movement of the copper wire to a certain extent, playing a guiding role. At the same time, it can also keep the copper wire straight during the processing, ensuring that its position does not shift, further improving the processing stability of the copper wire. During processing, the solder paste can be applied to the welding point, and the mounting table 13 can generate high temperature through the heating element 132 inside it to melt the solder paste, and then the LED chip is installed at the welding point to achieve the welding of the LED chip and the copper wire.

[0067] Further, in this embodiment, step S23: Apply solder paste to the "welding point" and heat the solder paste through the heating element to melt it, further include the following steps:

[0068] S231: Set a glue-taking mechanism 15, and the glue-taking mechanism 15 includes a solder paste tray 151 and a first robotic arm 152;

[0069] S'232: Set a solder paste dispensing head 1521 at one end of the first robotic arm 152 and a first robotic arm driving device 1522 at the other end;

[0070] S233: Place the solder paste in the solder paste tray 151;

[0071] S234: Through the first robotic arm driving device, move the solder paste dispensing head 1521 into the solder paste tray 151 to achieve automatic glue-taking of the solder paste by the solder paste dispensing head;

[0072] S23: Through the first robotic arm driving device, move the solder paste dispensing head 1521 to the mounting groove and apply the solder paste to the "welding point" to achieve automatic glue dispensing for the "welding point".

[0073] Specifically, the tin pan 151 is connected to a tin pan rotating device 153 for driving the rotation of the tin pan 151, and the first robotic arm driving device 1522 is used to drive the tin soldering head 1521 to move between the tin pan 151 and the mounting table 13. Specifically, the first robotic arm driving device 1522 includes a rotating motor and a lifting cylinder. The rotating motor can drive the first robotic arm 152 to rotate, and the lifting cylinder can drive the first robotic arm 152 to move up and down. Through the above settings, when applying solder paste for feeding, the rotating motor can rotate the first robotic arm 152 to place the tin soldering head 1521 above the tin pan 151, and then through the lifting cylinder, the first robotic arm 152 is controlled to move up and down so that the solder paste in the tin pan 151 adheres to the tin soldering head 1521. Similarly, the first robotic arm 152 is controlled by the rotating motor and the lifting cylinder to move to the copper wire welding point in the mounting groove 131 to achieve automatic dispensing of solder paste at the welding point.

[0074] In addition, the glue taking mechanism 15 further includes a tin scraping part 154 and a tin scraping part lifting mechanism 155. The tin scraping part 154 is arranged above the tin pan 151, and the tin scraping part lifting mechanism 155 is connected to the tin scraping part 154 for driving the tin scraping part 154 to move up and down relative to the tin pan 151. In this embodiment, the tin scraping part lifting mechanism 155 is a lifting cylinder. Through the above settings, the tin scraping part 154 cooperates with the rotation of the tin pan 151 to keep the solder paste in the tin pan 151 at the same horizontal plane. Further, the tin scraping part 154 can be controlled by the tin scraping part lifting mechanism 155 to adjust the up and down height in the tin pan 151 to realize the adjustment of the thickness of the solder paste in the tin pan 151.

[0075] Further, in this embodiment, step S24: mounting the LED chip at the "welding point" and realizing the electrical connection between the LED chip and the "welding point" through solder paste further includes the following steps:

[0076] S241: Set up a mounting mechanism 16, and the mounting mechanism 16 includes an expansion ring 161 and a second robotic arm 162;

[0077] S242: Set a pick-up head 1621 at one end of the second robotic arm 162 and a second robotic arm driving device 1622 at the other end;

[0078] S243: Place the blue film carrying the LED chip at the expansion ring;

[0079] S244: Through the second robotic arm driving device, move the pick-up head to the expansion ring to "grab" the LED chip;

[0080] S245: Through the second robotic arm driving device, move the pick-up head to the mounting groove and place the LED chip at the "welding point" to achieve automatic mounting and welding of the LED chip.

[0081] Specifically, in this embodiment, one end of the die bonder ring 161 is connected to a die bonder ring driving device 163 for driving the movement of the die bonder ring 161 in the X-axis direction and the Y-axis direction. The second robotic arm driving device 1622 is used to drive the pick-up head 1621 to move between the die bonder ring 161 and the mounting table 13. Further, the second robotic arm driving device 1622 also includes a rotating motor and a lifting cylinder. The rotating motor can drive the second robotic arm 162 to rotate, and the lifting cylinder can drive the second robotic arm 162 to move up and down to realize the movement of the pick-up head 1621 between the die bonder ring 161 and the mounting table 13.

[0082] Through the above settings, the blue film of the LED chip can be placed on the die bonder ring 161. When mounting the LED chip, the rotating motor and the lifting cylinder can be used to move the pick-up head 1621 above the LED chip to realize the "grasping" of the LED chip. Further, in order to realize the precise "grasping" of the LED chip by the pick-up head 1621, a first vision mechanism 21 is also provided above the die bonder ring 161 of the mounting mechanism 16. The first vision mechanism 21 can be used to monitor the process of the pick-up head 1621 grasping the LED chip. Further, during the "grasping" process of the LED chip, the position of the die bonder ring 161 can also be finely adjusted by the die bonder ring driving device 163 to realize the precise "grasping" of the LED chip by the pick-up head 1621. After the pick-up head 1621 obtains the LED chip, the pick-up head 1621 can be moved to the soldering point of the copper wire in the mounting groove 131 through the rotating motor and the lifting cylinder to realize the mounting of the LED chip.

[0083] In addition, in order to further improve the mounting accuracy of the pick-up head 1621 on the copper wire soldering point, a second vision mechanism 22 is also provided above the mounting table 13. The second vision mechanism 22 can be used to monitor the process of the pick-up head 1621 mounting the LED chip. Further, a mounting table driving device 31 is also provided at the connection between the mounting table 13 and the operation platform 1 for controlling the movement of the mounting table 13 in the X-axis direction and the Y-axis direction. During the mounting process of the LED chip, the position of the mounting table 13 can also be finely adjusted by the mounting table driving device 31 to further increase the docking accuracy of the pick-up head 1621 at the copper wire soldering point.

[0084] Further, the mounting mechanism 16 further includes a vacuum film suction device 164. The vacuum film suction device 164 is disposed below the dicing ring 161. The vacuum film suction device 164 is provided with an adsorption mechanism 1641 at the top for adsorbing the blue film of the LED chip to fix the blue film of the LED chip to the dicing ring 161. Further, the adsorption mechanism 1641 includes a housing. The housing is provided with an opening at the top and a thimble inside. The thimble can move upward relative to the housing and pass through the opening. With the above structural arrangement, when the pick-up head 1621 "grabs" the LED chip, the thimble can be ejected from the opening to separate the LED chip from the blue film of the LED chip, thereby realizing the "grabbing" of the LED chip by the pick-up head 1621. Further, in this embodiment, a driving device 32 of the vacuum film suction device is further disposed below the vacuum film suction device 164. The driving device can realize the movement of the vacuum film suction device 164 in the X-axis direction and the Y-axis direction relative to the operation platform 1 to realize fine adjustment of the position of the vacuum film suction device 164.

[0085] Further, in this embodiment, step S4: encapsulating the mounted LED chips with the same color or multiple colors using encapsulation glue and curing the encapsulation glue by a curing lamp further includes the following steps:

[0086] S41: Set up an encapsulation mechanism 17. The encapsulation mechanism 17 includes a dispensing device 171 and a three-way driving device 172. The dispensing device 171 includes a plurality of dispensing pens 1711;

[0087] S42: Connect the three-way driving device 172 to the dispensing device 171. The three-way driving device 172 can drive the dispensing device 171 to move in the X-axis direction, the Y-axis direction and the Z-axis direction;

[0088] S43: Control the "copper wire parallel connection" to move forward, so that the mounted LED chips leave the mounting table and move to the encapsulation mechanism;

[0089] S44: Control the movement of the dispensing device through the three-way driving device 172, select a dispensing pen to encapsulate the LED chip, so as to realize the same-color or multi-color encapsulation of the LED chip.

[0090] It can be understood that based on the above settings, after the LED chips are welded, the encapsulation of the LED chips can be achieved through the encapsulation mechanism 17. Specifically, during encapsulation, the dispensing device 171 can be driven by the three-way driving device 172 to move in all directions, up, down, left, and right, so as to select dispensing pens 1711 of different colors, thereby realizing the multi-color encapsulation of the LED chips. Specifically, in this embodiment, the dispensing device 171 can include six dispensing pens 1711, and six different colors of encapsulation glue are stored in the six dispensing pens 1711. Through the above structural settings, when the present invention produces ultra-flexible copper wire lamp strings, different colors of encapsulation glue can be selected to encapsulate the LED chips. Producers can, according to requirements, form LED chips that can emit different colors in a single lamp string, so as to enhance the beauty and interest of the product, enable the product to be applied to various different environments and scenarios, and increase the applicability of the product.

[0091] Specifically, in order to realize the three-way movement of the dispensing device 171, the encapsulation mechanism 17 further includes a support base 173, a first fixing plate 174, and a second fixing plate 175. The three-way driving device 172 includes an X-direction driving unit 1721, a Y-direction driving unit 1722, and a Z-direction driving unit 1723. The first fixing plate 174 is movably connected to the support base 173 through the X-direction driving unit 1721 and the Y-direction driving unit 1722 to realize the movement of the first fixing plate 174 relative to the support base 173 in the X-axis direction and the Y-axis direction. One end of the second fixing plate 175 is fixedly connected to the first fixing plate 174, and the other end is connected to the dispensing device 171 through the Z-direction driving unit 1723. Through the above structural settings, the dispensing device 171 can realize movement in the three directions of the "X-axis", "Y-axis", and "Z-axis" through the X-direction driving unit 1721, the Y-direction driving unit 1722, and the Z-direction driving unit 1723.

[0092] Further, in this embodiment, step S4: Using the encapsulation glue to perform the same-color or multi-color encapsulation on the already mounted LED chips, and realizing the curing of the encapsulation glue through the curing lamp, further includes the following steps:

[0093] S45: Set a plurality of curing lamps 103 in the processing direction of "copper wire parallel connection";

[0094] S46: Control the "copper wire parallel connection" to move forward, so that the encapsulated LED chips pass through the above-mentioned curing lamps 103 to realize the curing of the encapsulation glue.

[0095] Specifically, the curing lamps 103 are arranged behind the encapsulation mechanism 17 and are arranged along the processing direction of the copper wire. Through the above settings, when the LED chips are encapsulated by the encapsulation mechanism 17, the encapsulation glue on them will be cured when passing through the curing lamps 103 to realize the full-automatic production of the lamp string.

[0096] In addition, in this embodiment, the device body 10 further includes a wire feeding cylinder 21. The wire feeding cylinder 21 is arranged behind the shaping mechanism 11. The copper wire to be processed can be wound around the wire feeding cylinder 21. During processing, the copper wire will be conveyed from the wire feeding cylinder 21 to the shaping mechanism 11.

[0097] Furthermore, in this embodiment, the present invention is also provided with a wire winding device 22. The wire winding device 22 is used for storing the processed copper wire. Specifically, the wire winding device 22 includes a support rod 221, a counterweight rod 222, a wire winding cylinder 223 and a wire winding motor 224. The support rod 221 is arranged on one side of the driving mechanism 14. A first wire winding pulley 2211 is arranged on the support rod 221. The first wire winding pulley 2211 is used for receiving the copper wire from the driving mechanism 14. A storage space 101 is formed below the operation platform 1 by the device body 10. The counterweight rod 222, the wire winding cylinder 223 and the wire winding motor 224 are all arranged on the mounting seat 102 in the storage space 101. One end of the counterweight rod 222 is provided with a second wire winding pulley 2221, and the other end is movably connected to the mounting seat 102 to realize the swing of the second wire winding pulley 2221 in the vertical direction. The second wire winding pulley 2221 is used for receiving the copper wire from the first wire winding pulley 2211. The wire winding motor 224 is connected to the wire winding cylinder 223 and is used for driving the wire winding cylinder 223 to rotate. The wire winding cylinder 223 is used for receiving the copper wire from the second wire winding pulley 2221 to realize the storage of the copper wire.

[0098] It can be understood that since the second wire winding pulley 2221 of the counterweight rod 222 can swing in the vertical direction, when the second wire winding pulley 2221 receives the copper wire from the first wire winding pulley 2211, the second wire winding pulley 2221 will swing downward under the action of gravity, thereby applying a force to the copper wire to keep the copper wire always in a straight state, preventing the copper wire from becoming loose and knotted, and facilitating the storage of the copper wire by the wire winding cylinder 223.

[0099] The above is one or more implementation manners provided in combination with specific contents, and it is not determined that the specific implementation of the present invention is only limited to these descriptions. Any implementation similar or identical to the method and structure of the present invention, or any technical deduction or substitution made under the premise of the inventive concept of the present invention, should be regarded as the protection scope of the present invention.

Claims

1. A production process for super-soft copper wire lamp strings, characterized in that, It includes the following steps: Flatten and shape the "copper wire parallel connection", and remove the surface insulation layer of the "copper wire parallel connection" to form a number of equally spaced or unequally spaced "welding points"; Move the "copper wire parallel connection" forward so that the "welding points" are placed on the mounting table, and perform the mounting and welding of the LED chip and the "welding points" on the mounting table; Move the "copper wire parallel connection" forward so that the next "welding point" is placed on the mounting table, and repeat the above-mentioned mounting and welding operations of the LED chip and the "welding points"; Use encapsulating glue to perform single-color or multi-color encapsulation on the mounted LED chips, and cure the encapsulating glue through a curing lamp.

2. The production process of a super-flexible copper wire light string according to claim 1, wherein, It further includes the following steps: Set up a driving mechanism, and the driving mechanism includes a clamping device for "grabbing" the "copper wire parallel connection"; Set up two groups of clamping devices, and make the two groups of clamping devices move forward and backward alternately along the processing direction of the "copper wire parallel connection"; When the clamping device moves forward, make it clamp the "copper wire parallel connection" to drive the "copper wire parallel connection" to continue moving forward.

3. The production process of a super-flexible copper wire lamp string according to claim 2, characterized in that, It further includes the following steps: Control the forward and backward moving speeds of the two groups of clamping devices to control the forward moving speed of the "copper wire parallel connection"; Control the forward moving speed of the "copper wire parallel connection" to move the equally spaced or unequally spaced "welding points" adjacent to each other to the mounting table.

4. The production process of a super-flexible copper wire lamp string according to claim 2, characterized in that, It further includes the following steps: Set up a front-back driving cylinder, a first connecting plate, a left-right driving cylinder, a second connecting plate, a clamping part and a clamping cylinder on the clamping device; Connect the front-back driving cylinder with the first connecting plate, and drive the first connecting plate to move forward and backward along the processing direction of the "copper wire parallel connection" through the front-back driving cylinder; Connect the left-right driving cylinders with the second connecting plate and the first connecting plate respectively, and drive the second connecting plate to move relative to the first connecting plate in the left-right direction through the left-right driving cylinders; Set the clamping part on the second connecting plate, and at the same time connect the clamping cylinder with the clamping part, and drive the opening and closing of the clamping part through the clamping cylinder to realize the clamping of the "copper wire parallel connection".

5. A production process of a super-flexible copper wire lamp string according to claim 1, characterized in that, The step of "flattening and shaping the 'copper wire parallel connection', removing the surface insulation layer of the 'copper wire parallel connection' to form a number of equally spaced or unequally spaced 'welding points'" further includes the following steps: Set up a shaping mechanism and a laser. The shaping mechanism includes a pressing part and a pressing platform; Set the pressing part above the pressing platform; Set a first guiding hole and a second guiding hole at the front and rear ends of the pressing platform respectively; Thread the "copper wire parallel connection" through the first guiding hole, make it pass under the pressing part, and pass out through the second guiding hole; Control the pressing part to move downward. The pressing part can apply pressure to the "copper wire parallel connection" to flatten and shape the "copper wire parallel connection"; Use a laser to remove the surface insulation layer of the "copper wire parallel connection" to form a number of equally spaced or unequally spaced "welding points".

6. The production process of a super-flexible copper wire lamp string according to claim 1, characterized in that, The step of "moving the 'copper wire parallel connection' forward so that the 'welding points' are placed on the mounting table, and performing the mounting and welding of the LED chip and the 'welding points' on the mounting table" further includes the following steps: Set up a mounting groove and a heating element on the mounting table: Move the "copper wire parallel connection" so that the "welding points" are placed in the mounting groove; Apply solder paste to the "welding points", and heat the solder paste through the heating element to make it melt. Mount the LED chip at the "soldering point" and achieve electrical connection between the LED chip and the "soldering point" through solder paste.

7. The production process of a super-flexible copper wire light string according to claim 6, characterized in that, The step of "applying solder paste to the'soldering point' and heating the solder paste to melt it by a heating element" further includes the following steps: Set up a glue-taking mechanism, which includes a solder paste tray and a first robotic arm; Set up a solder-pointing head at one end of the first robotic arm and a first robotic arm driving device at the other end; Place the solder paste in the solder paste tray; Through the first robotic arm driving device, move the solder-pointing head into the solder paste tray to achieve automatic glue-taking of the solder paste by the solder-pointing head; Through the first robotic arm driving device, move the solder-pointing head to the mounting groove and apply the solder paste to the "soldering point" to achieve automatic glue application to the "soldering point".

8. The production process of a super-flexible copper wire lamp string according to claim 6, characterized in that, The step of "mounting the LED chip at the'soldering point' and achieving electrical connection between the LED chip and the'soldering point' through solder paste" further includes the following steps: Set up a mounting mechanism, which includes an expansion ring and a second robotic arm; Set up a pick-up head at one end of the second robotic arm and a second robotic arm driving device at the other end; Place the blue film carrying the LED chip at the expansion ring; Through the second robotic arm driving device, move the pick-up head to the expansion ring to achieve "grasping" of the LED chip; Through the second robotic arm driving device, move the pick-up head to the mounting groove and place the LED chip at the "soldering point" to achieve automatic mounting and soldering of the LED chip.

9. The production process of a super-soft copper wire lamp string according to claim 1, characterized in that, The step of "using encapsulation glue to perform single-color or multi-color encapsulation on the mounted LED chip and curing the encapsulation glue through a curing lamp" further includes the following steps: Set up an encapsulation mechanism, which includes a glue-applying device and a three-way driving device. The glue-applying device includes several glue-applying pens; Connect the three-way driving device to the glue-applying device. The three-way driving device can drive the glue-applying device to move in the X-axis direction, Y-axis direction, and Z-axis direction; Control the "copper wire parallel connection" to move forward, so that the mounted LED chip leaves the mounting table and moves to the encapsulation mechanism; Control the movement of the glue-applying device through the three-way driving device, select a glue-applying pen to achieve encapsulation of the LED chip, so as to perform single-color or multi-color encapsulation on the LED chip.

10. The production process of a super-flexible copper wire lamp string according to claim 9, characterized in that, The step of "using encapsulation glue to perform single-color or multi-color encapsulation on the mounted LED chip and curing the encapsulation glue through a curing lamp" further includes the following steps: Set up several curing lamps in the processing direction of the "copper wire parallel connection"; Control the "copper wire parallel connection" to move forward, so that the encapsulated LED chip passes through the above-mentioned curing lamps to achieve curing of the encapsulation glue.

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