High heat dissipation LED lighting device and processing technology thereof

Abstract

The application relates to the technical field of LED lighting devices, in particular to a high-heat-dissipation LED lighting device and a processing technology thereof. The application comprises the following steps: step 1: uniformly mixing modified heat-conducting fillers, bisphenol A type epoxy resin, fluorine-containing POSS and a curing agent, high-speed stirring, extruding and granulating, injection molding, post-treatment and obtaining heat-conducting plastics, namely light-transmitting plastics; step 2: assembling an LED light source, a circuit board, heat-dissipation silicon paper, a heat-dissipater, a power supply, a light-reflecting cover and the light-transmitting plastics to obtain the high-heat-dissipation LED lighting device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED lighting devices, in particular to a high-heat-dissipation LED lighting device and a processing technology thereof. BACKGROUND

[0002] With the rapid development of LED lighting technology, the high brightness advantage makes it the primary choice in the field of lighting today.

[0003] However, the electric energy of the traditional LED lighting device is not all converted into light energy, but part of the electric energy is converted into heat energy in the form of release, and with the increase of use time, the heat energy cannot be released in time, which will cause the temperature of the LED internal chip to rise, and even damage, which seriously affects the service life and luminous efficiency of the LED lighting device.

[0004] In the prior art, the shell of the LED is generally made of plastic material, and the raw material is generally epoxy resin, which has higher durability compared to transparent glass, but the heat resistance of ordinary epoxy resin is limited, and it is easy to appear performance degradation in high temperature environment for a long time; in order to increase the heat resistance, heat-conducting fillers are added in actual production, but during use, the following problems may occur: first, the heat-conducting fillers are prone to agglomeration in the epoxy resin, in order to solve this problem, acid modification is generally used, but too much acid will reduce the performance; second, some heat-conducting fillers such as graphene have conductivity, which may cause short circuit risk in actual application, and even endanger safety.

[0005] In addition, in actual use, when the traditional LED lighting device encounters a large accidental impact, the plastic shell may crack or even break, which cannot effectively protect the internal components of the LED.

[0006] In summary, it is of great significance to solve the above problems and prepare a high-heat-dissipation LED lighting device. SUMMARY

[0007] The present application aims to provide a high-heat-dissipation LED lighting device and a processing technology thereof to solve the problems raised in the background.

[0008] In order to solve the above technical problems, the present application provides the following technical solutions:

[0009] A processing technology of a high-heat-dissipation LED lighting device, comprising the following steps:

[0010] Step 1: mix the modified heat-conducting filler, bisphenol A type epoxy resin, fluorine-containing POSS and curing agent uniformly, high-speed stirring, extrusion granulation, injection molding, post-treatment, and obtain the heat-conducting plastic, i.e. light-transmitting plastic;

[0011] Step 2: Assemble the LED light source, circuit board, heat-dissipating silicon paper, heat sink, power supply, light reflector, and light-transmitting plastic to obtain a high-heat-dissipating LED lighting device.

[0012] More preferably, the heat-conductive plastic comprises the following components: 50-60 parts of modified heat-conductive filler, 100 parts of bisphenol A type epoxy resin, 5-15 parts of fluorine-containing POSS, and 10-20 parts of curing agent.

[0013] More preferably, the preparation process of the modified heat-conductive filler is as follows:

[0014] S1-1: Add graphene particles and fluorine-containing silane coupling agent to 40-50 wt% ethanol aqueous solution, and react at 60-80°C for 1-2 hours to obtain modified graphene;

[0015] S1-2: Add alumina particles A, alumina particles B, and phosphorus-containing silane coupling agent to 40-50 wt% ethanol aqueous solution, and react at 60-80°C for 1-2 hours to obtain modified alumina;

[0016] S1-3: Add the modified graphene and modified alumina to 5-10 wt% phosphoric acid solution, ultrasonically disperse for 30-40 minutes, then stir at 50-70°C for 1-2 hours, centrifugal wash, and vacuum dry at 50-70°C for 10-12 hours to obtain the modified heat-conductive filler.

[0017] In a further aspect, the fluorine-containing silane coupling agent is trifluoropropylmethylcyclotrisiloxane.

[0018] In a further aspect, the preparation process of the phosphorus-containing silane coupling agent is as follows: under a protective atmosphere, add 3-mercaptopropyl triethoxysilane, vinyl phosphonic acid dimethyl ester, and azobisisobutyronitrile to xylene, and react at 50-60°C for 3-4 hours to obtain the phosphorus-containing silane coupling agent.

[0019] The phosphorus-containing silane coupling agent comprises the following components: 3-5 parts of 3-mercaptopropyl triethoxysilane, 2-4 parts of vinyl phosphonic acid dimethyl ester, 0.5-1 part of azobisisobutyronitrile, and 50-60 parts of xylene.

[0020] More preferably, in the raw materials of the modified heat-conductive filler, the mass ratio of modified graphene, modified alumina, and 5-10 wt% phosphoric acid solution is 1-1.5:1-2:3-5.

[0021] Further, the modified graphene comprises the following components: 3-4 parts of graphene particles, 1-3 parts of fluorine-containing silane coupling agent, 30-40 parts of 40-50 wt% ethanol aqueous solution; the modified alumina comprises the following components: 1.2-2.5 parts of alumina particles A, 0.6-1 part of alumina particles B, 1-2 parts of phosphorus-containing silane coupling agent, 40-50 parts of 40-50 wt% ethanol aqueous solution.

[0022] More preferably, the preparation process of the fluorine-containing POSS is as follows:

[0023] S2-1: hydrolyze the fluorine-containing silane coupling agent, ethanol, methanol, deionized water, and acetic acid at 50-60℃ for 3-4 hours, then react at 60-80℃ for 3-4 hours, purify, dry, and obtain the fluorine-containing POSS.

[0024] Further, the fluorine-containing POSS has a cage structure formed by hydrolysis and polycondensation.

[0025] More preferably, the fluorine-containing POSS comprises the following components: 3-4 parts of fluorine-containing silane coupling agent, 3-4 parts of ethanol, 8-12 parts of methanol, 10-15 parts of deionized water, and 0.5-1.5 parts of acetic acid.

[0026] More preferably, the curing agent comprises one of methyl hexahydrophthalic anhydride and 593 curing agent.

[0027] More preferably, the specific parameters of the injection molding are as follows: the injection molding temperature is 180-200℃, the injection molding pressure is 80-100 MPa, and the holding time is 20-40 seconds.

[0028] More preferably, the specific parameters of the post-treatment are as follows: the curing temperature is 110-130℃, the curing time is 2-3 hours; the annealing temperature is 50-60℃, and the annealing time is 2-3 hours.

[0029] Further, the specific parameters of the high-speed stirring are as follows: the rotation speed is 450-550 rpm, and the time is 10-20 minutes.

[0030] Further, the extrusion granulation adopts a double-screw extruder, and the specific parameters are as follows: the screw rotation speed is 55-65 rpm, and the residence time is 3-6 minutes.

[0031] In the scheme, the mechanical properties and thermal stability of the epoxy resin are enhanced by modifying the epoxy resin with the fluorine-containing POSS; and the heat dissipation performance is improved by the synergistic effect of the phosphoric acid-modified heat-conducting filler (containing fluorine and phosphorus) with a specific content.

[0032] Wherein, since the graphene has good heat conduction performance, but it has electrical conductivity which exists safety hidden trouble in actual use, in order to reduce the electrical conductivity, the fluorine-containing silane coupling agent is modified, the electrical conductivity is reduced, the agglomeration phenomenon is reduced, and the strength is further improved; by using different sizes of alumina and using the phosphorus-containing silane coupling agent for modification, the agglomeration phenomenon is reduced, and the heat dissipation performance is further improved; the specific content of phosphoric acid is used for secondary modification, on the one hand, a phosphate layer is formed on the surface of the heat conduction filler, the thermal stability is improved, and on the other hand, the subsequent reaction of the epoxy resin and the fluorine-containing POSS is promoted; finally, a three-dimensional network structure is formed, in which 50 mu m alumina is used as a main heat conduction channel, 0.3 mu m alumina is used to fill the gap, and graphene is used to link the alumina.

[0033] Wherein, the fluorine-containing POSS has a cage structure, and the thermal stability and mechanical strength of the epoxy resin are improved through the dual effects of physical embedding and chemical compatibility. Meanwhile, on the one hand, the fluorine-containing group forms a hydrogen bond with the hydroxyl group of the epoxy resin, enhancing the interfacial bonding force, and on the other hand, it can improve the interfacial compatibility with the modified conductive filler (containing fluorine), further improving the mechanical strength and heat dissipation performance.

[0034] Compared with the prior art, the beneficial effects of the present application are:

[0035] By modifying the epoxy resin with fluorine-containing POSS, the mechanical properties and thermal stability are enhanced; and the heat conduction filler (containing fluorine and phosphorus) is modified with a specific content of phosphoric acid, further improving the interfacial compatibility, producing a synergistic effect, and improving the heat dissipation performance. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be described below in a clear and complete manner. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0037] It should be noted that the following parts are mass parts, and there is no special restriction on the purchase of all raw materials involved in the present application. Exemplary raw materials include: in the following embodiments, the size of alumina particles A is 50 mu m; the size of alumina particles B is 0.3 mu m; the size of graphene powder is 5 mu m; the CAS number of trifluoropropylmethylcyclotrisiloxane is 2374-14-3, and the article number is 1000040; the CAS number of 3-mercapto propyl triethoxysilane is 14814-09-6, the CAS number of vinyl phosphonic acid dimethyl ester is 4645-32-3; the CAS number of methyl hexahydrophthalic anhydride is 25550-51-0.

[0038] In the following embodiments, the following is particularly stated:

[0039] Preparation of phosphorus-containing silane coupling agent: under a protective atmosphere, 4 parts of 3-mercaptopropyl triethoxysilane, 3 parts of dimethyl vinylphosphonate, and 0.6 parts of azobisisobutyronitrile were added to 55 parts of xylene, and reacted at 55°C for 3.5 hours to obtain the phosphorus-containing silane coupling agent.

[0040] Example 1: a processing technology of a high-heat-dissipation LED lighting device, comprising the following steps:

[0041] Step 1: S1: 3.5 parts of graphene particles and 2 parts of trifluoropropylmethylcyclotrisiloxane were added to 35 parts of 45wt% aqueous ethanol solution, and reacted at 70°C for 1.5 hours to obtain modified graphene; S2: 2 parts of alumina particles A, 0.8 parts of alumina particles B, and 1.5 parts of phosphorus-containing silane coupling agent were added to 45 parts of 45wt% aqueous ethanol solution, and reacted at 70°C for 1.5 hours to obtain modified alumina; S3: the modified graphene and the modified alumina were added to 8wt% phosphoric acid solution in a mass ratio of 1.2:1.5:4, ultrasonically dispersed for 35 minutes, then stirred at 60°C for 1.5 hours, centrifuged and washed, and vacuum dried at 60°C for 12 hours to obtain a modified heat-conducting filler;

[0042] Step 2: 3.5 parts of trifluoropropylmethylcyclotrisiloxane, 3.5 parts of ethanol, 10 parts of methanol, 12.5 parts of deionized water, and 1 part of acetic acid were hydrolyzed at 50°C for 3 hours, then reacted at 70°C for 3 hours, purified, dried, and obtained a fluorine-containing POSS;

[0043] Step 3: 55 parts of the modified heat-conducting filler, 100 parts of bisphenol A type epoxy resin, 10 parts of fluorine-containing POSS, and 15 parts of methylhexahydrophthalic anhydride were uniformly mixed, high-speed stirred at a speed of 500 rpm for 15 minutes, extruded and granulated by a twin-screw extruder with a screw rotation speed of 60 rpm and a residence time of 5 minutes, then injection molded at 90 MPa and 190°C for 30 seconds, and cured at 120°C for 2.5 hours, then annealed at 55°C for 2.5 hours to obtain a heat-conducting plastic, i.e., a light-transmitting plastic;

[0044] Step 4: the LED light source, the circuit board, the heat-dissipation silicone paper, the heat sink, the power supply, the reflector, and the light-transmitting plastic were assembled to obtain a high-heat-dissipation LED lighting device.

[0045] Example 2: a processing technology of a high-heat-dissipation LED lighting device, comprising the following steps:

[0046] Step 1: S1 adds 3.5 parts of graphene particles, 2 parts of trifluoropropylmethylcyclotrisiloxane into 35 parts of 45wt% ethanol aqueous solution, and reacts at 70°C for 1.5 hours to obtain modified graphene; S2: adds 2 parts of alumina particles A, 0.8 parts of alumina particles B, 1.5 parts of phosphorus-containing silane coupling agent into 45 parts of 45wt% ethanol aqueous solution, and reacts at 70°C for 1.5 hours to obtain modified alumina; S3: adds the modified graphene and the modified alumina into 5wt% phosphoric acid solution according to a mass ratio of 1:1:3, ultrasonically disperses for 35 minutes, then stirs at 60°C for 1.5 hours, centrifugally washes, and vacuum dries at 60°C for 12 hours to obtain a modified heat-conductive filler;

[0047] Step 2: adds 3.5 parts of trifluoropropylmethylcyclotrisiloxane, 3.5 parts of ethanol, 10 parts of methanol, 12.5 parts of deionized water, and 1 part of acetic acid, and hydrolyzes at 50°C for 3 hours; then reacts at 70°C for 3 hours, purifies, dries, and obtains fluorine-containing POSS;

[0048] Step 3: uniformly mixes 50 parts of the modified heat-conductive filler, 100 parts of bisphenol A type epoxy resin, 5 parts of fluorine-containing POSS, and 10 parts of methylhexahydrophthalic anhydride, high-speed stirs at a rotating speed of 500 rpm for 15 minutes, uses a double-screw extruder, sets the screw rotating speed to 60 rpm, and extrusion granulates with a residence time of 5 minutes, then performs injection molding at 90 MPa and at 190°C for 30 seconds, solidifies at 120°C for 2.5 hours, then anneals at 55°C for 2.5 hours to obtain a heat-conductive plastic, i.e., a light-transmitting plastic;

[0049] Step 4: assembles an LED light source, a circuit board, a heat-dissipating silicone paper, a heat sink, a power supply, a light-reflecting cover, and the light-transmitting plastic to obtain a high-heat-dissipating LED lighting device.

[0050] Embodiment 3: a processing technology of a high-heat-dissipating LED lighting device, including the following steps:

[0051] Step 1: S1 adds 3.5 parts of graphene particles, 2 parts of trifluoropropylmethylcyclotrisiloxane into 35 parts of 45wt% ethanol aqueous solution, and reacts at 70°C for 1.5 hours to obtain modified graphene; S2: adds 2 parts of alumina particles A, 0.8 parts of alumina particles B, 1.5 parts of phosphorus-containing silane coupling agent into 45 parts of 45wt% ethanol aqueous solution, and reacts at 70°C for 1.5 hours to obtain modified alumina; S3: adds the modified graphene and the modified alumina into 10wt% phosphoric acid solution according to a mass ratio of 1.5:2:5, ultrasonically disperses for 35 minutes, then stirs at 60°C for 1.5 hours, centrifugally washes, and vacuum dries at 60°C for 12 hours to obtain a modified heat-conductive filler;

[0052] Step 2: 3.5 parts of trifluoropropylmethylcyclotrisiloxane, 3.5 parts of ethanol, 10 parts of methanol, 12.5 parts of deionized water, 1 part of acetic acid, hydrolysis at 50°C for 3 hours; then reaction at 70°C for 3 hours, purification, drying to obtain fluorine-containing POSS;

[0053] Step 3: 60 parts of modified heat-conducting filler, 100 parts of bisphenol A type epoxy resin, 15 parts of fluorine-containing POSS, 20 parts of methylhexahydrophthalic anhydride are uniformly mixed, high-speed stirring at a speed of 500 rpm for 15 minutes, using a double-screw extruder, setting the screw speed to 60 rpm, the residence time is 5 minutes for extrusion granulation, then injection molding at 90 MPa at 190°C for 30 seconds, curing at 120°C for 2.5 hours, then annealing at 55°C for 2.5 hours to obtain a heat-conducting plastic, i.e. a light-transmitting plastic;

[0054] Step 4: Assemble the LED light source, circuit board, heat-dissipating silicone paper, heat sink, power supply, reflector, and light-transmitting plastic to obtain a high-heat-dissipating LED lighting device.

[0055] Comparative Example 1: Based on Example 1, the modified graphene is adjusted to graphene, and the rest of the process remains unchanged, specifically:

[0056] Step 1: S1: 2 parts of alumina particles A, 0.8 parts of alumina particles B, and 1.5 parts of phosphorus-containing silane coupling agent are added to 45 parts of 45 wt% ethanol aqueous solution, and reacted at 70°C for 1.5 hours to obtain modified alumina; S2: graphene and modified alumina are added to 8 wt% phosphoric acid solution in a mass ratio of 1.2:1.5:4, ultrasonic dispersion for 35 minutes, then stirring at 60°C for 1.5 hours, centrifugal washing, and vacuum drying at 60°C for 12 hours to obtain a modified heat-conducting filler;

[0057] Step 2: 3.5 parts of trifluoropropylmethylcyclotrisiloxane, 3.5 parts of ethanol, 10 parts of methanol, 12.5 parts of deionized water, 1 part of acetic acid, hydrolysis at 50°C for 3 hours; then reaction at 70°C for 3 hours, purification, drying to obtain fluorine-containing POSS;

[0058] Step 3: 55 parts of modified heat-conducting filler, 100 parts of bisphenol A type epoxy resin, 10 parts of fluorine-containing POSS, 15 parts of methylhexahydrophthalic anhydride are uniformly mixed, high-speed stirring at a speed of 500 rpm for 15 minutes, using a double-screw extruder, setting the screw speed to 60 rpm, the residence time is 5 minutes for extrusion granulation, then injection molding at 90 MPa at 190°C for 30 seconds, curing at 120°C for 2.5 hours, then annealing at 55°C for 2.5 hours to obtain a heat-conducting plastic, i.e. a light-transmitting plastic;

[0059] Step 4: Assemble the LED light source, circuit board, heat dissipation silicon paper, heat sink, power supply, light reflector, and light transmission plastic to obtain a high-heat-dissipation LED lighting device.

[0060] Comparative Example 2: Based on Example 1, the modified alumina was adjusted to alumina, and the rest of the process remained unchanged, specifically:

[0061] Step 1: S1: 3.5 parts of graphene particles and 2 parts of trifluoropropylmethylcyclotrisiloxane were added to 35 parts of a 45wt% ethanol aqueous solution and reacted at 70°C for 1.5 hours to obtain modified graphene; S2: The modified graphene and alumina were added to an 8wt% phosphoric acid solution in a mass ratio of 1.2:1.5:4, ultrasonically dispersed for 35 minutes, then stirred at 60°C for 1.5 hours, centrifuged and washed, and vacuum dried at 60°C for 12 hours to obtain a modified heat-conductive filler;

[0062] Step 2: 3.5 parts of trifluoropropylmethylcyclotrisiloxane, 3.5 parts of ethanol, 10 parts of methanol, 12.5 parts of deionized water, and 1 part of acetic acid were hydrolyzed at 50°C for 3 hours; then reacted at 70°C for 3 hours, purified, dried, and obtained fluorine-containing POSS;

[0063] Step 3: 55 parts of the modified heat-conductive filler, 100 parts of bisphenol A type epoxy resin, 10 parts of fluorine-containing POSS, and 15 parts of methylhexahydrophthalic anhydride were uniformly mixed, high-speed stirring was performed at a speed of 500 rpm for 15 minutes, an extrusion granulation was performed using a double-screw extruder with a screw speed of 60 rpm and a residence time of 5 minutes, then injection molding was performed at 90 MPa and 190°C for 30 seconds, and curing was performed at 120°C for 2.5 hours, followed by annealing at 55°C for 2.5 hours to obtain a heat-conductive plastic, i.e., a light transmission plastic;

[0064] Step 4: Assemble the LED light source, circuit board, heat dissipation silicon paper, heat sink, power supply, light reflector, and light transmission plastic to obtain a high-heat-dissipation LED lighting device.

[0065] Comparative Example 3: Based on Example 1, the modified heat-conductive filler was adjusted to a heat-conductive filler (without adding phosphoric acid for secondary modification), and the rest of the process remained unchanged, specifically:

[0066] Step 1: S1: 3.5 parts of graphene particles and 2 parts of trifluoropropylmethylcyclotrisiloxane were added to 35 parts of a 45wt% ethanol aqueous solution and reacted at 70°C for 1.5 hours to obtain modified graphene; S2: 2 parts of alumina particles A, 0.8 parts of alumina particles B, and 1.5 parts of phosphorus-containing silane coupling agent were added to 45 parts of a 45wt% ethanol aqueous solution and reacted at 70°C for 1.5 hours to obtain modified alumina; S3: The modified graphene and modified alumina were mixed in a mass ratio of 1.2:1.5 to obtain a heat-conductive filler;

[0067] Step 2: 3.5 parts of trifluoropropylmethylcyclotrisiloxane, 3.5 parts of ethanol, 10 parts of methanol, 12.5 parts of deionized water, 1 part of acetic acid, hydrolysis at 50°C for 3 hours; then reaction at 70°C for 3 hours, purification, drying to obtain fluorine-containing POSS;

[0068] Step 3: 55 parts of modified heat-conducting filler, 100 parts of bisphenol A type epoxy resin, 10 parts of fluorine-containing POSS, 15 parts of methylhexahydrophthalic anhydride are uniformly mixed, high-speed stirring at a speed of 500 rpm for 15 minutes, using a double-screw extruder, setting the screw speed to 60 rpm, the residence time is 5 minutes for extrusion granulation, then injection molding at 90 MPa, 190°C for 30 seconds, curing at 120°C for 2.5 hours, then annealing at 55°C for 2.5 hours to obtain a heat-conducting plastic, i.e. a light-transmitting plastic;

[0069] Step 4: Assemble the LED light source, circuit board, heat-dissipating silicon paper, heat sink, power supply, reflector, and light-transmitting plastic to obtain a high-heat-dissipating LED lighting device.

[0070] Comparative Example 4: Based on Example 1, adjust the secondary modification to be performed with excess phosphoric acid, and the rest of the process remains unchanged, which is as follows:

[0071] Step 1: S1: 3.5 parts of graphene particles, 2 parts of trifluoropropylmethylcyclotrisiloxane are added to 35 parts of 45wt% ethanol aqueous solution, reaction at 70°C for 1.5 hours to obtain modified graphene; S2: 2 parts of alumina particles A, 0.8 parts of alumina particles B, 1.5 parts of phosphorus-containing silane coupling agent are added to 45 parts of 45wt% ethanol aqueous solution, reaction at 70°C for 1.5 hours to obtain modified alumina; S3: according to the mass ratio of 1.2:1.5:10, the modified graphene and the modified alumina are added to 30wt% phosphoric acid solution, ultrasonic dispersion for 35 minutes, then stirring at 60°C for 1.5 hours, centrifugal washing, vacuum drying at 60°C for 12 hours to obtain a modified heat-conducting filler;

[0072] Step 2: 3.5 parts of trifluoropropylmethylcyclotrisiloxane, 3.5 parts of ethanol, 10 parts of methanol, 12.5 parts of deionized water, 1 part of acetic acid, hydrolysis at 50°C for 3 hours; then reaction at 70°C for 3 hours, purification, drying to obtain fluorine-containing POSS;

[0073] Step 3: 55 parts of modified heat-conducting filler, 100 parts of bisphenol A type epoxy resin, 10 parts of fluorine-containing POSS, and 15 parts of methylhexahydrophthalic anhydride were mixed uniformly, high-speed stirring was performed at a speed of 500 rpm for 15 minutes, an extrusion granulation was performed by using a double-screw extruder, the screw rotation speed was set to 60 rpm, and the residence time was 5 minutes, then injection molding was performed at 90 MPa and 190 °C for 30 seconds, curing was performed at 120 °C for 2.5 hours, then annealing was performed at 55 °C for 2.5 hours, and a heat-conducting plastic, i.e., a light-transmitting plastic, was obtained;

[0074] Step 4: An LED light source, a circuit board, a heat-dissipating silicon paper, a heat sink, a power supply, a light reflector, and the light-transmitting plastic were assembled to obtain a high-heat-dissipating LED lighting device.

[0075] Detection experiment: The high-heat-dissipating LED lighting devices prepared in Examples 1-3 and Comparative Examples 1-4 were detected for performance: (1) thermal conductivity test: the high-heat-dissipating LED lighting devices prepared in Examples 1-3 and Comparative Examples 1-4 were tested for thermal conductivity, and the results are shown in Table 1; (2) compression strength test: the high-heat-dissipating LED lighting devices prepared in Examples 1-3 and Comparative Examples 1-4 were tested for compression strength according to GBT 1041-2008, and the results are shown in Table 1;

[0076]

[0077] Table 1

[0078] Result analysis: According to the data analysis in Table 1, in terms of heat dissipation performance, it can be seen from the data of Comparative Example 1 that the graphene is not modified by fluorine-containing silane, which is easy to cause aggregation, has electrical conductivity, and has weak interface combination with the epoxy resin, high interface thermal resistance; it can be seen from the data of Comparative Example 2 that the surface hydroxyl groups of aluminum oxide are not modified by a coupling agent, which has poor compatibility with the epoxy resin, increased porosity, and decreased thermal conductivity; it can be seen from the data of Comparative Example 3 that the filler surface does not form a phosphate layer after secondary modification by phosphoric acid solution, which has decreased high-temperature stability, slightly poor dispersibility of graphene and aluminum oxide, and insufficient continuity of the heat conduction path, resulting in decreased thermal conductivity; it can be seen from the data of Comparative Example 4 that an excessive amount of phosphoric acid can cause the formation of an excessively thick phosphate layer on the surface of the heat-conducting filler, which blocks the heat conduction path, resulting in decreased thermal conductivity and compression strength.

[0079] In terms of strength, according to the data of Comparative Example 1, graphene is not modified, and is prone to agglomeration, and the compressive strength decreases; according to the data of Comparative Example 2, alumina is not modified, and is prone to agglomeration, and the interface bonding force and the compressive strength decrease; according to the data of Comparative Example 3, no secondary modification with phosphoric acid is performed, and the cross-linking reaction between the epoxy resin and the fluorine-containing POSS is not promoted, the interface bonding force decreases, and the compressive strength decreases; according to the data of Comparative Example 4, excessive phosphoric acid destroys the curing network of the epoxy resin, reduces the interface bonding force, and decreases the compressive strength, and excessive phosphoric acid also generates an excessively thick phosphate layer, increases the brittleness, and further decreases the compressive strength.

[0080] It will be apparent to those skilled in the art that the application is not limited to the details of the above-exemplified embodiments and can be implemented in other concrete forms without departing from the spirit or essential characteristics of the application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, the scope of the application being defined by the appended claims rather than the above description, and it is intended to embrace all changes and modifications that fall within the meaning and scope of equivalents of the claims.

Claims

1. A processing technology for a high heat dissipation LED lighting device, characterized in that: Includes the following steps: Step 1: Mix the modified thermally conductive filler, bisphenol A type epoxy resin, fluorinated POSS and curing agent evenly, stir at high speed, extrude and granulate, injection mold, and post-process to obtain thermally conductive plastic, i.e. light-transmitting plastic. Step 2: Assemble the LED light source, circuit board, thermal paper, heat sink, power supply, reflector, and light-transmitting plastic to obtain a high heat dissipation LED lighting device; The thermally conductive plastic comprises the following components: by weight, 50-60 parts modified thermally conductive filler, 100 parts bisphenol A type epoxy resin, 5-15 parts fluorinated POSS, and 10-20 parts curing agent. The preparation process of the modified thermally conductive filler is as follows: S1-1: Graphene particles and fluorinated silane coupling agent are added to a 40-50 wt% ethanol aqueous solution and reacted at 60-80℃ for 1-2 hours to obtain modified graphene. S1-2: Add alumina particles A, alumina particles B, and phosphorus-containing silane coupling agent to a 40-50 wt% ethanol aqueous solution and react at 60-80℃ for 1-2 hours to obtain modified alumina; S1-3: Add modified graphene and modified alumina to a 5-10 wt% phosphoric acid solution, ultrasonically disperse for 30-40 minutes, then stir at 50-70℃ for 1-2 hours, centrifuge and wash, and vacuum dry at 50-70℃ for 10-12 hours to obtain the modified thermally conductive filler. In the post-treatment, the curing temperature is 110~130℃ and the curing time is 2~3 hours.

2. The processing technology of a high heat dissipation LED lighting device according to claim 1, characterized in that: In the raw materials of the modified thermally conductive filler, the mass ratio of modified graphene, modified alumina, and 5-10 wt% phosphoric acid solution is 1-1.5:1-2:3-5.

3. The processing technology of a high heat dissipation LED lighting device according to claim 1, characterized in that: The preparation process of the fluorine-containing POSS is as follows: S2-1: Hydrolyze the fluorinated silane coupling agent, ethanol, methanol, deionized water, and acetic acid at 50-60℃ for 3-4 hours; then react at 60-80℃ for 3-4 hours, purify, and dry to obtain fluorinated POSS.

4. The processing technology of a high heat dissipation LED lighting device according to claim 3, characterized in that: The fluorinated POSS comprises the following components: by mass, 3-4 parts of fluorinated silane coupling agent, 3-4 parts of ethanol, 8-12 parts of methanol, 10-15 parts of deionized water, and 0.5-1.5 parts of acetic acid.

5. The processing technology of a high heat dissipation LED lighting device according to claim 1, characterized in that: The curing agent includes one of methylhexahydrophthalic anhydride and 593 curing agent.

6. The processing technology of a high heat dissipation LED lighting device according to claim 1, characterized in that: The specific parameters for injection molding are: injection temperature of 180~200℃, injection pressure of 80~100MPa, and holding time of 20~40 seconds.

7. The processing technology of a high heat dissipation LED lighting device according to claim 1, characterized in that: The specific parameters for the post-processing are: annealing temperature of 50~60℃ and annealing time of 2~3 hours.

8. A high-heat-dissipation LED lighting device prepared by the processing technology of a high-heat-dissipation LED lighting device according to any one of claims 1 to 7.

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