Probe card horizontal calibration method and device

Abstract

The invention provides a horizontal calibration method for a probe card, which comprises the following steps: placing a large cover plate at an initial position, and enabling the planeness of the large cover plate relative to a working disc to be smaller than a first preset value; a probe card is loaded on the large cover plate, and a wafer to be tested is loaded on the working disc; selecting a reference point on the wafer to be tested; collecting three-dimensional position information of a probe corresponding to the reference point and calculating the flatness of the probe card; and when the flatness is greater than a second preset value, fitting a plane equation formed by the probe corresponding to the reference point, calculating height adjustment values of the plurality of adjustable sites, and further executing height adjustment. According to the method and the device provided by the invention, rapid and high-precision horizontal calibration of the probe card can be realized.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor technologies, and in particular, to a method and device for horizontal calibration of a probe card. Background Art

[0002] During the semiconductor wafer-level testing process, a prober needs to establish electrical contact with the metal pads (pads) of the chips on the wafer through a probe card to complete functional testing and parameter detection. To ensure the accuracy and consistency of the testing, all the probe tips on the probe card should form an ideal plane approximating the surface of the wafer, that is, it is necessary to make the plane formed by all the probes on the probe card parallel to the plane where the wafer is located or the difference within a certain range. Otherwise, some probes may not be able to make contact, contact too deeply, or the contact may be unstable, thus affecting the yield and data reliability. Currently, the common method for leveling the probe card mainly relies on manually adjusting the level of the large cover plate (head stage) to make the probe surface tend to be parallel to the wafer surface. However, manual leveling has low efficiency, limited accuracy, and requires multiple repeated measurements and confirmations, with cumbersome operations. Especially when the prober is equipped with a large-sized test head, the structure of the test head often blocks the large cover plate, and there is no space to install a manual adjustment mechanism, making it difficult to perform manual leveling.

[0003] Therefore, there is an urgent need for an effective method and device for horizontal calibration of a probe card, which can achieve automatic high-precision leveling, thereby ensuring the stability and yield of wafer testing. Summary of the Invention

[0004] The purpose of the present disclosure is to provide a method and device for horizontal calibration of a probe card, which can automatically detect and adjust the flatness of the probe card, avoid test errors caused by inconsistent contact between the probes and the wafer pads, and improve the test stability and efficiency of the semiconductor prober.

[0005] In a first aspect, an embodiment of the present disclosure provides a method for horizontal calibration of a probe card, including the following steps:

[0006] Place the large cover plate at the initial position, at this time, the flatness of the large cover plate relative to the working plate is less than a first preset value, and the large cover plate is provided with a plurality of adjustable sites and at least one fixed reference point;

[0007] Load the probe card on the large cover plate and load the wafer to be tested on the working plate; select at least five chip units on the wafer to be tested, and select at least one pad in each selected chip unit as a reference point;

[0008] Collect the three-dimensional position information of the probes corresponding to the reference points through a probe camera, and calculate the flatness of the probe card according to the three-dimensional position information of the probes corresponding to the reference points;

[0009] When the flatness is greater than a second preset value, fit a plane equation formed by the probes corresponding to the reference points, and calculate height adjustment values of the plurality of adjustable positions according to the plane equation; and

[0010] Perform height adjustment of the adjustable positions according to the height adjustment values.

[0011] Optionally, the large cover plate is provided with three adjustable positions and a fixed reference point, the large cover plate has a rectangular structure, and the adjustable positions and the fixed reference point are respectively arranged in areas where the four top corners of the large cover plate are located.

[0012] Optionally, the plurality of adjustable positions are respectively connected to adjustment motors, and the adjustment motors are used to drive the large cover plate to perform attitude adjustment in the vertical direction.

[0013] Optionally, when the flatness is less than or equal to the second preset value, end the calibration process.

[0014] Optionally, in the step of placing the large cover plate at the initial position, at this time the flatness of the large cover plate relative to the workbench is less than a first preset value, the flatness of the large cover plate relative to the workbench is detected by means of mechanical dial indicator.

[0015] Optionally, in the step of selecting at least five chip units on the wafer to be measured and selecting at least one pad in each selected chip unit as a reference point, the at least five selected chip units are distributed in the edge area of the wafer to be measured.

[0016] Optionally, when the wafer to be measured has a rectangular layout, the at least five selected chip units include chip units located at the four corners of the rectangle;

[0017] When the wafer to be measured has a circular layout, the at least five selected chip units include equally spaced chip units located on the circumference.

[0018] Optionally, the first preset value is 100 microns, and the second preset value is 20 microns.

[0019] Optionally, after the step of performing height adjustment of the adjustable positions according to the height adjustment values, it further includes:

[0020] Re-execute the step of acquiring three-dimensional position information of the probes corresponding to the reference points through the probe camera.

[0021] In a second aspect, an embodiment of the present disclosure provides a probe card horizontal calibration device, including:

[0022] A processor; and

[0023] A memory for storing executable instructions of the processor;

[0024] Wherein, the processor is configured to execute the probe card horizontal calibration method by executing the executable instructions.

[0025] Compared with the related art, the embodiments of the present disclosure at least have the following technical effects:

[0026] The probe card horizontal calibration method and device provided by the present disclosure are based on image recognition and three-dimensional space fitting technologies, can automatically obtain the probe positions, quickly determine the flatness of the probe card, and achieve rapid leveling through automatic control, thereby improving the consistency of the contact between the probe card and the wafer pads, and significantly improving the test accuracy and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure. Obviously, the accompanying drawings in the following description are only some embodiments of the present disclosure, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts. In the drawings:

[0028] Figure 1 is a schematic flowchart of a probe card horizontal calibration method provided by some embodiments of the present disclosure;

[0029] Figure 2 is a schematic structural diagram of a test device involved in a probe card horizontal calibration method provided by some embodiments of the present disclosure;

[0030] Figure 3 is a schematic structural diagram of a large cover plate involved in a probe card horizontal calibration method provided by some embodiments of the present disclosure;

[0031] Figure 4 is a schematic diagram of a wafer chip unit selected for a probe card horizontal calibration method provided by some embodiments of the present disclosure;

[0032] Figure 5 is a schematic structural diagram of a probe card horizontal calibration device provided by some embodiments of the present disclosure.

[0033] In the drawings: test head 10, large cover plate 20, adjustable position points 21-23, fixed reference point 24, probe card 30, probe 31, wafer to be tested 40, chip units 41-45, workbench 50, test machine 60. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0034] To make the objectives, technical solutions, and advantages of the present disclosure clearer, the present disclosure will be further described in detail below with reference to the accompanying drawings. Apparently, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0035] The terms used in the embodiments of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The singular forms "a", "the", and "said" used in the embodiments of the present disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. "Plural" generally includes at least two.

[0036] It should be understood that the term "and / or" used herein is only a description of the associated relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0037] It should be understood that although the terms first, second, third, etc. may be used in the embodiments of the present disclosure for description, these should not be limited to these terms. These terms are only used to make distinctions. For example, without departing from the scope of the embodiments of the present disclosure, the first can also be called the second, and similarly, the second can also be called the first. <{

[0038] It should also be noted that the term "comprising", "including" or any other variant thereof is intended to cover a non-exclusive inclusion, so that a commodity or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such a commodity or device. Without further limitations, the element defined by the statement "including one" does not exclude the existence of another identical element in the commodity or device including the said element.

[0039] As described in the background art, the existing probe card leveling methods have problems such as relying on manual labor, low efficiency, poor accuracy, and being inapplicable to large-size test heads, and it is difficult to meet the requirements of modern semiconductor wafer testing.

[0040] To solve or at least alleviate the above technical problems, in one aspect of the embodiments of the present disclosure, a method for horizontal calibration of a probe card is provided, including the following steps:

[0041] S100, place the large cover plate at the initial position, at this time, the flatness of the large cover plate relative to the working plate is less than the first preset value, and the large cover plate is provided with a plurality of adjustable points and at least one fixed reference point;

[0042] S200. Load a probe card on the large cover plate and load a wafer under test on the work table. Select at least five chip units on the wafer under test, and select at least one pad in each selected chip unit as a reference point.

[0043] S300. Collect three-dimensional position information of the probes corresponding to the reference points through a probe camera, and calculate the flatness of the probe card according to the three-dimensional position information of the probes corresponding to the reference points.

[0044] S400. When the flatness is greater than a second preset value, fit the plane equation formed by the probes corresponding to the reference points, and calculate the height adjustment values of the multiple adjustable positions according to this plane equation; and

[0045] S500. Perform height adjustment of the adjustable positions according to the height adjustment values.

[0046] It can be seen that the probe card horizontal calibration method provided by the present disclosure, based on image recognition and three-dimensional space fitting technologies, can automatically obtain the probe positions, quickly determine the flatness of the probe card, and achieve rapid leveling through automatic control, thereby improving the consistency of the contact between the probe card and the wafer pads, and significantly improving the test accuracy and efficiency.

[0047] The optional embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0048] Some embodiments of the present disclosure provide a probe card horizontal calibration method. Figure 2 Part of the wafer test structure involved in the above probe card horizontal calibration process is shown.

[0049] Specifically, as Figure 2 shown, the structure involved includes a test head 10, a large cover plate 20, a probe card 30, a work table 50, and a tester 60.

[0050] The test head 10 is an electrical signal output / input interface component of the tester 60, and is used to transmit the test signals sent by the tester 60 to the probe card 30, and at the same time receive the electrical signals returned from the chips on the wafer under test 40 and transmit them back to the tester 60.

[0051] The large cover plate 20 is used to install and position the probe card 30. The large cover plate 20 is provided with a plurality of adjustable positions and at least one fixed reference point. The plurality of adjustable positions can be used to finely adjust the probe card 30 in the Z direction, so as to achieve horizontal calibration of the probe card 30.

[0052] The probe card 30 is detachably installed below the large cover plate 20. A plurality of probes 31 are provided on the lower surface of the probe card 30. The probes 31 are used to contact the chip electrodes on the wafer 40 to be tested during the test, forming a path for the test signal. The probes 31 can form a corresponding array structure according to the arrangement of the chip electrodes.

[0053] The working plate 50 is arranged directly below the probe card 30 and is used to carry the wafer 40 to be tested. The working plate 50 generally has a vacuum adsorption function to fix the position of the wafer and ensure that the wafer does not displace during the test. The working plate 50 has a lifting function and can rise to a predetermined height before the test to make the wafer 40 to be tested contact the probes 31, and descend after the test is completed to complete the wafer replacement.

[0054] The wafer 40 to be tested is usually a semiconductor wafer containing a plurality of chip units (die). Each chip unit further includes a plurality of pads for electrical contact for the probes 31 to contact and test.

[0055] The tester 60 serves as the main control device of the entire system and is used to control the operation process of each part of the probe station, send test signals, and collect and analyze the data transmitted back. The tester 60 is connected to the test head 10 through a connecting wire to achieve signal transmission.

[0056] Reference Figure 1 , in some embodiments, the method for horizontally calibrating the probe card specifically includes the following steps:

[0057] S100, place the large cover plate 20 at the initial position, at this time the flatness of the large cover plate 20 relative to the working plate 50 is less than the first preset value.

[0058] In this step, the large cover plate 20 is installed in the probe station structure and adjusted to the initial reference height. There are a plurality of adjustable points and at least one fixed reference point on the large cover plate 20. In some embodiments, as Figure 3 shown, the large cover plate 20 has a rectangular structure, and is provided with three adjustable points 21, 22, 23 and a fixed reference point 24. The adjustable points and the fixed reference point are respectively located in the areas where the four top corners of the large cover plate are located, and are used to support and adjust the spatial attitude of the large cover plate 20.

[0059] The plurality of adjustable points are respectively connected to adjustment motors. The adjustment motors are used to drive each adjustable point to lift along the vertical direction (Z-axis) to achieve precise attitude adjustment of the large cover plate 20 in space. Before the adjustment starts, it is necessary to calibrate the positions of the adjustable points and the fixed reference point in the machine coordinate system. The machine coordinate system is a three-dimensional rectangular coordinate system (XYZ coordinate system), and its origin O is set at the geometric center position of the large cover plate 20.

[0060] The upper surface of the working plate 50 can be regarded as a calibration reference plane, which usually has high flatness and a known calibrated height. By measuring the coordinates of the adjustable points and fixed reference points (such as 21, 22, 23, 24) on the large cover plate 20 in the Z-axis direction respectively and comparing them with the reference surface of the working plate 50, the maximum height difference is obtained, and this maximum value is the flatness of the large cover plate 20 relative to the working plate 50. If this maximum height difference is less than the first preset value (for example, 100 micrometers), it means that the current installation state of the large cover plate 20 meets the requirements of the initial horizontal adjustment, and the next calibration step can be entered.

[0061] In practical applications, the mechanical dial indicator method can be used to detect the above flatness. Specifically, a dial indicator or a displacement sensor is set at each adjustment point to measure its height change relative to the working plate 50, and the flatness is calculated by combining the readings of each point to ensure that the flatness of the large cover plate 20 relative to the working plate 50 in the initial installation state is less than the first preset value.

[0062] S200, load the probe card 30 on the large cover plate 20 and load the wafer under test 40 on the working plate 50; select at least five chip units (die) on the wafer under test 40, and select at least one pad as a reference point in each selected chip unit.

[0063] In this step, the probe card 30 is installed in the lower installation area of the large cover plate 20 and can be fixed by a mechanical fixture. The probe card 30 and the large cover plate 20 cooperate to form a test module, and the probes 31 of the probe card 30 point downward to the area of the working plate 50.

[0064] The wafer under test 40 is loaded onto the working plate 50 through a wafer transfer mechanism and is stably fixed on the surface of the working plate 50 by vacuum adsorption. The wafer under test 40 is usually a semiconductor wafer containing multiple chip units (die), and a pad array for testing is arranged on its surface.

[0065] In this step, at least five chip units are selected from the wafer under test 40. Preferably, the selected chip units are distributed in the edge area of the wafer to improve the judgment coverage of the overall flatness. As a specific example, refer to Figure 4 , when the wafer under test 40 has a circular layout, the at least five selected chip units may include equally spaced chip units evenly distributed on the circumference; in addition, when the wafer under test 40 has a rectangular layout, the at least five selected chip units may include chip units located in the four corner areas of the rectangle.

[0066] For each selected chip unit, at least one pad is further selected inside it as a three-dimensional position reference point. Preferably, pads at the same structural position in the chip unit (such as the first pad in the upper right corner uniformly) can be selected to ensure the consistency of the collected data. In this step, the coordinates of the selected chip unit need to be recorded, and the internal position of the selected pad in the chip unit needs to be recorded.

[0067] S300, collect the three-dimensional position information of the probe corresponding to the reference point through a probe camera, and calculate the flatness of the probe card according to the three-dimensional position information of the probe corresponding to the reference point.

[0068] In this step, control the probe camera in the probe station to detect the probes corresponding to each reference point in turn. According to the one-to-one correspondence relationship between the pad arrangement and the probe card design, the layout position of the probe corresponding to each reference point on the probe card is predetermined, so the position of each target probe can be directly located and detected.

[0069] The probe camera can obtain the three-dimensional position information of each target probe in the machine coordinate system, especially the height value in the Z-axis direction. After the probe camera completes the acquisition of the three-dimensional position information of all probes, the flatness of the probe card 30 at the current position is evaluated by analyzing the height difference of each probe in the vertical direction. In some embodiments, the flatness of the probe card 30 can be calculated by calculating the Z-axis coordinate difference between the highest point and the lowest point among the measured probes, and the unit is usually micrometers.

[0070] After collecting the probe height information corresponding to all reference points, perform plane fitting based on the Z-axis coordinates to calculate the current flatness of the probe card. The calculation method of the flatness can be: fit a reference plane to all probe Z coordinate points (such as fitting a plane equation by the least squares method), and then use the height difference between the highest point and the lowest point on this plane as the flatness evaluation value.

[0071] If the calculated flatness is less than or equal to the second preset value (such as 20 micrometers), it is considered that the attitude of the probe card 30 meets the calibration requirements, and the calibration process can be ended; otherwise, go to step S400 to perform adjustment operations.

[0072] S400, when the flatness is greater than the second preset value, fit the plane equation formed by the probes corresponding to the reference points, and calculate the height adjustment values of the multiple adjustable sites according to this plane equation.

[0073] In this step, when the calculated flatness of the probe card 30 is greater than the second preset value, the reference plane where the tip of the current probe card is located will be fitted according to the previously collected three-dimensional position information of the probes.

[0074] Specifically, the least squares method can be used to fit the three-dimensional coordinate data of the probes corresponding to all reference points, and a plane equation z = Ax + By + C describing the current distribution state of the tip is obtained, where A and B respectively represent the slopes of the fitting plane in the X and Y directions, and C is the height offset. The coordinate data is derived from the spatial measurement results of the probes corresponding to the aforementioned reference points.

[0075] After the fitting is completed, according to this plane equation, the adjustment amounts of each adjustable site on the large cover plate 20 are calculated. As a specific example, if the large cover plate 20 is provided with three adjustable sites 21, 22, 23 and a fixed reference point 24, the specific calculation method is as follows: Substitute the known coordinates of the fixed reference point 24 and the three adjustable sites 21, 22, 23 in the X and Y directions into the fitted plane equation respectively to obtain the theoretical Z-axis height values corresponding to each point. Taking the Z-axis value at the fixed reference point 24 as the reference benchmark, compare it with the Z values calculated for the three adjustable sites to obtain the height differences between the current adjustable sites and the reference point, that is, the required height adjustment values. These height differences are the theoretical targets for the subsequent lifting actions of the adjustment mechanism.

[0076] S500, perform the height adjustment of the adjustable sites according to the height adjustment value.

[0077] In this step, the height adjustment values of each adjustable site obtained in step S400 are converted into corresponding control signals to perform the height adjustment of the adjustable sites.

[0078] In some embodiments, each adjustable site is connected to an independent adjustment motor, and the target height adjustment value can be converted into the corresponding pulse equivalent according to the step resolution of the motor to control the movement of the corresponding motor.

[0079] It can be understood that after the height adjustment of the adjustable sites is completed in step S500, in order to ensure that the actual attitude of the probe card 30 reaches the expected state, it is necessary to check the adjustment effect. Therefore, after step S500 is executed, it may further include: re-collecting the three-dimensional position information of the probes corresponding to the reference points and comparing it with a second preset value.

[0080] If the flatness of the current probe card 30 is less than or equal to the second preset value, it indicates that the attitude adjustment of the probe card 30 has reached the standard, and the horizontal calibration process can be terminated; if the flatness of the probe card 30 is greater than the second preset value, steps S400 - S500 can be selected to be executed again for further adjustment until the calibration accuracy requirements are met.

[0081] Compared with the prior art, the probe card horizontal calibration method provided by the present disclosure is based on image recognition and three-dimensional space fitting technologies, can automatically obtain the probe positions, quickly determine the flatness of the probe card, and achieve quick leveling through automatic control, thereby improving the consistency of the contact between the probe card and the wafer pads and significantly enhancing the test accuracy and efficiency.

[0082] As Figure 5 shown, in one aspect of the embodiments of the present disclosure, there is provided a probe card horizontal calibration device, the device including: at least one processor; and a memory communicatively connected to the at least one processor; wherein, the memory stores instructions executable by the one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the method steps as described in the above embodiments.

[0083] The embodiments of the present disclosure provide a non-volatile computer storage medium, the computer storage medium storing computer-executable instructions, and the computer-executable instructions can execute the method steps as described in the above embodiments.

[0084] The transmission device may include a processing device (such as a central processing unit) 401, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 402 or a program loaded from a storage device 408 into a random access memory (RAM) 403. In the RAM 403, various programs and data required for the operation of the transmission device are also stored. The processing device 401, the ROM 402, and the RAM 403 are connected to each other through a bus 404. An input / output (I / O) interface 405 is also connected to the bus 404.

[0085] Generally, the following devices may be connected to the I / O interface 406: an input device 406 including, for example, a touch screen, a touchpad, a keyboard, a mouse, a camera, a microphone, etc.; an output device 407 including, for example, a liquid crystal display (LCD), a speaker, etc.; a storage device 408 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 409.

[0086] Finally, it should be noted that: the various embodiments in this specification are described in a progressive manner, and the key points of each embodiment are the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other. For the systems or devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the descriptions of the method part.

[0087] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit it; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A method for horizontal calibration of a probe card, characterized in that, Including the following steps: Place the large cover plate at the initial position, at this time the flatness of the large cover plate relative to the working plate is less than the first preset value, and the large cover plate is provided with a plurality of adjustable points and at least one fixed reference point; Load the probe card on the large cover plate, and load the wafer to be tested on the working plate; Select at least five chip units on the wafer to be tested, and select at least one pad in each selected chip unit as a reference point; Collect the three-dimensional position information of the probe corresponding to the reference point through the probe camera, and calculate the flatness of the probe card according to the three-dimensional position information of the probe corresponding to the reference point; When the flatness is greater than the second preset value, fit the plane equation formed by the probes corresponding to the reference points, and calculate the height adjustment values of the plurality of adjustable points according to this plane equation; And Execute the height adjustment of the adjustable points according to the height adjustment values.

2. The probe card horizontal calibration method according to claim 1, wherein The large cover plate is provided with three adjustable points and one fixed reference point, the large cover plate has a rectangular structure, and the adjustable points and the fixed reference point are respectively arranged in the areas where the four top corners of the large cover plate are located.

3. The probe card horizontal calibration method according to claim 1, characterized in that The plurality of adjustable points are respectively connected to adjustment motors, and the adjustment motors are used to drive the large cover plate to perform attitude adjustment in the vertical direction.

4. The probe card horizontal calibration method according to claim 1, wherein When the flatness is less than or equal to the second preset value, end the calibration process.

5. The probe card horizontal calibration method according to claim 1, characterized in that In the step of placing the large cover plate at the initial position, at this time the flatness of the large cover plate relative to the working plate is less than the first preset value, the flatness of the large cover plate relative to the working plate is detected by means of mechanical dial indicator.

6. The probe card horizontal calibration method according to claim 1, wherein In the step of selecting at least five chip units on the wafer to be tested and selecting at least one pad in each selected chip unit as a reference point, the at least five selected chip units are distributed in the edge area of the wafer to be tested.

7. The probe card horizontal calibration method according to claim 6, wherein When the wafer to be tested has a rectangular layout, at least five selected chip units include the chip units located at the four corners of the rectangle; When the wafer to be tested has a circular layout, at least five selected chip units include the equally spaced chip units located on the circumference.

8. The probe card horizontal calibration method according to claim 1, wherein The first preset value is 100 microns, and the second preset value is 20 microns.

9. The probe card horizontal calibration method according to claim 1, characterized in that After the step of executing the height adjustment of the adjustable points according to the height adjustment values, it further includes: Re-execute the step of collecting the three-dimensional position information of the probe corresponding to the reference point through the probe camera.

10. A probe card horizontal calibration device, characterized in that, Including: A processor; And A memory for storing the executable instructions of the processor; Wherein, the processor is configured to execute the probe card horizontal calibration method according to any one of claims 1-9 by executing the executable instructions.

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