Measured value detection device for inductive sensor assembly

Abstract

The invention relates to a measured value detection device for an inductive sensor assembly. The invention relates to a measured value detection device, comprising a circuit carrier which comprises a receiving structure which comprises at least one receiving coil having at least two turns, each receiving coil having two ring structures having a plurality of ring sections and being formed in at least two planes of the circuit carrier, the sections of the individual ring structures, which are arranged in different planes, are electrically connected to one another via plated through-holes, the ring sections of two ring structures having opposite flow directions, and the ring structures of at least two electrically serially connected turns are arranged offset from one another by a predetermined distance, the ends of the respective ring structures of the at least two turns are connected to each other at the end region of the respective receiving structure by means of at least one connecting structure in order to form a series circuit of the at least two turns and / or a reversal of the flow direction in one of the at least two turns.

Description

FIELD OF THE INVENTION

[0001] The present invention relates to a measuring value detection device for an inductive sensor assembly. The present invention also relates to an inductive sensor assembly having at least one such measuring value detection device. BACKGROUND OF THE INVENTION

[0002] Inductive sensor assemblies are known from the prior art, which have a measuring value detection device with at least one excitation structure and at least one receiving structure and at least one coupling device, also referred to as a target. In addition, at least one excitation structure includes at least one excitation coil. At least one coupling device includes at least one conductive coupling element. At least one receiving structure has at least one, but usually two, receiving coils. At least one excitation coil is flowed through by a high-frequency current, which generates an alternating magnetic field that induces eddy currents in at least one coupling device. Here, the inductive coupling of at least one excitation coil and at least one receiving coil is related to the position of the corresponding coupling device. From the induced voltage signal in at least one receiving coil, the current position of the coupling device can be inferred and thus the current position of the body whose movement is to be detected.

[0003] An inductive angle sensor is known from DE 10 2020 206 396 A1, which includes an inductive target assembly having k-fold symmetry, a first pick-up coil assembly having k-fold symmetry, and a second pick-up coil assembly having k-fold symmetry. The combination device is designed to combine the signals of the first pick-up coil assembly and the signals of the second pick-up coil assembly and to determine the rotation angle compensated for angular error based thereon. The pick-up single coils of the first and second pick-up coil assemblies are each rotationally offset relative to one another about the axis of rotation by a geometric offset angle. Additionally, the entire first pick-up coil assembly is rotationally offset relative to the entire second pick-up coil assembly about the axis of rotation by a geometric offset angle. In a possible embodiment, the first and second pick-up coil assemblies are electrically coupled to each other and form one or more pairs of pick-up single coils, wherein in each pair of pick-up single coils, one of the pick-up single coils of the first pick-up coil assembly is respectively connected to the corresponding pick-up single coil of the second pick-up coil assembly that is offset therefrom by a geometric offset angle in a series circuit or a parallel circuit. The combination device is designed to determine the rotation angle compensated for angular error between the stator and the rotor based on the combination of the signals of the respectively connected pick-up single coils of one or more pairs of pick-up single coils. SUMMARY OF THE INVENTION

[0004] The measuring value detection device for an inductive sensor assembly according to the present invention has the following advantages, namely, by effectively placing the connection structure between multiple turns of the receiving coil within the corresponding receiving structure, space can be saved, the amplitude of the induced voltage can be increased, and at the same time, the angular error of the measuring value detection device can be reduced. By such an early termination of the loop structure of the receiving coil, a series circuit of at least two turns of the receiving coil and / or a reversal of the flow direction of one turn can be achieved. In addition, compared with using a series circuit outside the receiving structure, a higher effective voltage can be induced in the receiving coil through the series circuit within the receiving structure. A higher induced voltage results in a better signal-to-noise ratio and higher EMV robustness (EMV: electromagnetic compatibility). In addition, this enables the use of a cheaper semiconductor amplifier with a smaller amplification factor. Here, the term "within the receiving structure" is understood to mean that the connection structure is arranged within the surface spanned by the receiving structure. For example, if the receiving structure extends from y_min to y_max in the first direction y and from x_min to x_max in the second direction x, then the connection structure is arranged between y_min and y_max or between x_min and x_max. Here, the shape and implementation of the connection structure are related to the corresponding parameters.

[0005] An embodiment of the present invention provides a measuring value detection device for an inductive sensor assembly, the measuring value detection device having a circuit carrier, the circuit carrier including at least one receiving structure. The at least one receiving structure includes at least one receiving coil having at least two turns. Each single turn of the at least one receiving coil correspondingly has two loop structures with multiple loop segments and is constructed in at least two planes of the circuit carrier. The segments of the respective loop structures arranged in different planes of the circuit carrier are electrically connected to each other via plated through holes. The loop segments of the two loop structures of each turn have opposite flow directions. The loop structures of at least two electrically serially connected turns of the at least one receiving coil are arranged offset by a preset distance from each other. Here, the ends of the respective loop structures of at least two turns of the at least one receiving coil are respectively connected to each other via at least one connection structure in the end region of the corresponding receiving structure, thereby forming a series circuit of at least two turns and / or a reversal of the flow direction within one of the at least two turns.

[0006] Furthermore, an inductive sensor assembly for detecting the movement of a movable body is proposed, which inductive sensor assembly has at least one coupling device and such a measurement value detection device. Here, at least one coupling device or measurement value detection device is coupled to the movable body, the movement of which is to be detected. At least one excitation structure is arranged on the circuit carrier of the measurement value detection device. At least one excitation structure is coupled to at least one evaluation and control circuit, which during operation couples a periodic alternating signal into at least one excitation structure. At least one coupling device is configured to affect the inductive coupling between at least one excitation structure and at least one receiving structure of the measurement value detection device. At least one evaluation and control unit is configured to receive and evaluate the signal induced in at least one receiving structure and to determine the current relative position of the movable coupling device and at least one receiving structure and / or the current position of the movable body.

[0007] The inductive sensor assembly can for example be implemented as a linear path sensor or a rotational angle sensor or a rotor position sensor, in the linear path sensor, the movable body performs a translational movement to be detected along the movement axis; in the rotational angle sensor or rotor position sensor, the movable body performs a rotational movement to be detected about the rotational axis. In the inductive rotary sensor, the measurement value detection device can preferably have a space-saving "C" shape, which can be plugged onto the shaft. Thereby, the manufacturing concept for integrating the inductive sensor assembly can be simplified. With appropriate selection of the origin (0, 0), the coil layout of such a measurement value detection device can be obtained by converting the polar coordinates of the coil layout of the measurement value detection device of the inductive linear path sensor into Cartesian coordinates.

[0008] Currently, the evaluation and control unit can be understood as an electrical structural component or circuit, which prepares or processes or evaluates the detected sensor signals. Preferably, the evaluation and control unit can be implemented as an ASIC structure group (ASIC: Application Specific Integrated Circuit). The evaluation and control unit can have at least one interface, which can be constructed based on hardware and / or software. In the hardware-based construction, the interface can for example be part of the ASIC structure group. However, it is also possible that the interface is its own integrated circuit or consists at least partially of discrete structural elements. In the software-based construction, the interface can be a software module, which exists for example beside other software modules on a microcontroller.

[0009] Subsequently, the "excitation structure" can be understood as an excitation coil having a preset number of turns, which transmits the alternating signal coupled in by the evaluation and control unit.

[0010] By means of the measures and improvement solutions listed in the description, it is possible to advantageously improve the measuring value detection device according to the invention of the inductive sensor assembly and the inductive sensor assembly according to the invention.

[0011] Particularly advantageously, the number of connection structures can be based on the number of turns of at least one receiving coil. Thereby, a series circuit of the turns of at least one receiving coil can be systematically realized.

[0012] In an advantageous design of the measuring value detection device, at least one connection structure can include a plated-through hole that interconnects two turns or two separate loop structures of a common turn in at least two turns that are arranged in different planes. Here, the two separate loop structures can terminate at the plated-through hole before the corresponding ends of the receiving structure. Thereby, the two loop structures "terminate early", i.e., before reaching the end of the receiving structure. Preferably, the plated-through hole can be arranged in the region of the intersection of two separate loop structures arranged in different planes. Alternatively, at least one connection structure can include a conductor trace that is connected to and interconnects the ends of two separate loop structures of two turns or a common turn in at least two turns that are arranged in the same plane at the contact points. If the turns to be connected "terminate" in the same plane of the circuit board, then a plated-through hole is not required, but a conductor trace is sufficient. Here, the two loop structures to be connected can "terminate early", i.e., before reaching the end of the receiving structure, in order to provide space within the receiving structure for the conductor trace of the connection structure to be applied. As a further alternative, at least one connection structure can include a plated-through hole and at least one conductor trace in one of the two planes or in both planes and interconnects two turns or two separate loop structures of a common turn in at least two turns that are arranged in different planes. By the alternative implementation possibilities of the connection structure, the connection structure can be simply adapted to the structural conditions of the receiving structure. If the connection structure connects the loop structures of two different turns of the receiving coil, then a series circuit of the two turns can be realized, which preferably also results in the flow direction of the loop structures of the two turns thus connected. If the connection structure connects the loop structures of a common or identical turn of the receiving coil, then a reversal of the flow direction within the turn can be realized. The clear definition of the overall flow direction of the receiving coil is related to the polarity of the measured induced signal. Therefore, all reversals of the flow direction should be considered equivalent and only related to the definition.

[0013] In a further advantageous design of the measured value detection device, the plated-through hole can be connected to the end of one of the two loop structures in one plane and to at least one conductor trace in another plane, which conductor trace can be connected to the end of the other of the two loop structures at the contact point. Here, the position of the plated-through hole can be moved along the corresponding loop structure in order to terminate the loop structure before reaching the end of the receiving structure, provided that no short circuit or design rule violation occurs thereby. For example, a design rule violation can be understood as being below the minimum distance between the conductor trace and the plated-through hole and / or between conductor traces. Alternatively, the first conductor trace can be connected to the plated-through hole in one plane and to the end of one of the loop structures at the contact point, and the second conductor trace can be connected to the plated-through hole in another plane and to the end of the other of the two loop structures at the contact point.

[0014] In a further advantageous design of the measured value detection device, the loop segments of the two loop structures can each be periodically repeated. Here, the complete period of the loop segment can correspond to a sine profile or a rectangular profile or a triangular profile, and the number of periodically repeated loop segments can define the periodicity of the receiving structure. Of course, the periodically repeated loop segments can also have other suitable shapes or mixed shapes. Due to the premature termination, the shape of the loop segment of the loop structure at the end of the receiving structure can be different from the shape of the repeated loop segments of the loop structure in the remaining area of the receiving structure.

[0015] In a further advantageous design of the measured value detection device, the segments of the respective loop structures arranged in different planes of the circuit carrier can, for example, correspond to half or a quarter or an eighth period of the repeated loop segment.

[0016] In a further advantageous design of the measured value detection device, the distance between adjacent loop structures of at least one receiving structure can be based on the number of receiving structures and the number of receiving coils and the number of turns of at least one receiving coil and the periodicity of at least one receiving structure. Here, the distance between the loop structures of the turns of at least one receiving coil of the same receiving structure can be the same. The same distance can optimally utilize the existing structural space in view of the maximization of the number of turns in order to avoid design rule violations at the same time. Preferably, the loop structures of the respective turns of at least one receiving coil can be implemented substantially identically. Alternatively, the distances between the loop structures of the turns of at least one receiving coil can be different, especially when at least one receiving coil has more than two turns.

[0017] In a further advantageous embodiment of the measurement value detection device, the loop structures of the turns of the plurality of receiving coils can be arranged alternately along the receiving structure. This means that in two receiving coils, the loop structure of the first receiving coil is arranged, and then the loop structure of the second receiving coil is arranged, then the loop structure of the first receiving coil is arranged, and so on. Alternatively, the loop structures of the turns of the plurality of receiving coils can be arranged along the receiving structure in groups according to the receiving coils. This means that in three turns of each receiving coil, first the three loop structures of the respective turns of the first receiving coil can be arranged, and then the three loop structures of the respective turns of the second receiving coil can be arranged, then the three loop structures of the respective turns of the first receiving coil can be arranged, and so on. Description of the Drawings

[0018] Embodiments of the present invention are shown in the drawings and are explained in detail in the following description. In the drawings, the same reference numerals denote components or elements that perform the same or similar functions.

[0019] Figure 1 A schematic top view of a first embodiment of an inductive sensor assembly according to the present invention is shown, which inductive sensor assembly has a first embodiment of a measurement value detection device according to the present invention, wherein the circuit carrier of the measurement value detection device is shown transparently.

[0020] Figure 2 Shows Figure 1 A schematic top view of a first end region of a measurement value detection device according to the present invention.

[0021] Figure 3 Shows Figure 2 A schematic perspective view of a first end region of a measurement value detection device according to the present invention.

[0022] Figure 4 Shows Figure 1 A schematic top view of a second end region of a measurement value detection device according to the present invention.

[0023] Figure 5 Shows Figure 4 A schematic perspective view of a second end region of a measurement value detection device according to the present invention.

[0024] Figure 6 A schematic top view of a second embodiment of an inductive sensor assembly according to the present invention is shown, which inductive sensor assembly has a second embodiment of a measurement value detection device according to the present invention, wherein the circuit carrier of the measurement value detection device is shown transparently.

[0025] Figure 7 Shows Figure 6Schematic top view of the first end region of the measurement value detection device according to the invention.

[0026] Figure 8 shows Figure 7 Schematic perspective view of the first end region of the measurement value detection device according to the invention.

[0027] Figure 9 shows Figure 6 Schematic top view of the second end region of the measurement value detection device according to the invention.

[0028] Figure 10 shows Figure 9 Schematic perspective view of the second end region of the measurement value detection device according to the invention.

[0029] Figure 11 Shows a schematic top view of a third embodiment of an inductive sensor assembly according to the invention, which has a third embodiment of a measurement value detection device according to the invention. Detailed description

[0030] As can be seen from Figures 1 to 11As can be seen, the shown embodiment of the measurement value detection device 10 according to the invention for an inductive sensor assembly 1 includes a circuit carrier 11 which comprises at least one receiving structure 14, which receiving structure comprises at least one receiving coil 16 having at least two turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3. Each turn 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of the at least one receiving coil 16 respectively has two loop structures 18A, 18B with a plurality of loop segments SA and is constructed in at least two planes of the circuit carrier 11. The segments of the respective loop structures 18A, 18B arranged in different planes of the circuit carrier 11 are electrically connected to one another via plated-through holes DK. The loop segments SA of the two loop structures 18A, 18B of each turn 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 have opposite flow directions. The loop structures 18A, 18B of at least two electrically serially connected turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of the at least one receiving coil 16 are arranged offset from one another by a preset distance. Here, the ends of the respective loop structures 18A, 18B of at least two turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of the at least one receiving coil 16 are respectively connected to one another via at least one connecting structure 20 on the end regions 14.1, 14.2 of the corresponding receiving structure 14, thereby forming a series circuit of at least two turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 and / or a reversal of the flow direction within one turn of at least two turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3.

[0031] The number of connecting structures 20 is based on the number of turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of the at least one receiving coil 16. As can be seen from Figures 1 to 10As can further be seen, in the illustrated embodiment, the loop segments SA of the two loop structures 18A, 18B are each periodically repeated. Here, the complete periods of the periodically repeated loop segments SA each correspond to a sine or cosine trend. Alternatively, the periodically repeated loop segments SA can also correspond to a rectangular or triangular trend. Furthermore, the segments of the respective loop structures 18A, 18B arranged in different planes of the circuit carrier 11 correspond to half a period of the repeated loop segments SA. Here, the plating-through holes DK connecting the segments of the respective loop structures 18A, 18B arranged on the lower plane in the drawing of the circuit carrier 11 to the segments of the respective loop structures 18A, 18B arranged on the upper plane in the drawing of the circuit carrier 11 are each arranged on the upper edge in the drawing of the receiving structure 14 and on the lower edge in the drawing of the receiving structure 14. In the illustrated embodiment of the measured value detection device 10, the two loop structures 18A, 18B of at least one receiving coil 16 are arranged offset from each other by 180°, and the flow direction extends in the positive x-direction (here from left to right) in the first loop structure 18A of at least two electrically serially connected turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of at least one receiving coil 16, and extends in the negative x-direction (here from right to left) in the second loop structure 18B of at least two electrically serially connected turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of at least one receiving coil 16. By means of two loop structures 18A, 18B arranged offset from each other by half a period or 180° along the movement path BB and having opposite flow directions, surfaces with different surface normals are each enclosed between the first loop structure 18A and the second loop structure 18B of at least two turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of at least one receiving coil 16. Depending on the periodicity of the turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of at least one receiving coil 16, a corresponding number of surface pairs are enclosed between the two loop structures 18A, 18B of at least two electrically serially connected turns W1, W2. Alternatively, the segments of the respective loop structures 18A, 18B arranged in different planes of the circuit carrier 11 can correspond to a quarter or an eighth of a period. By early termination, the shape of the loop segment SA of the loop structures 18A, 18B at the end of the receiving structure 14 can be different from the shape of the repeated loop segments SA of the loop structures 18A, 18B in the remaining area of the receiving structure 14.

[0032] As can be seen from Figures 1 to 11As can be further seen, the distance between adjacent loop structures 18A, 18B of at least one receiving structure 14 is based on the number of receiving structures 14, the number of receiving coils 16, and the number of turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of at least one receiving coil 16, as well as the periodicity of at least one receiving structure 14, and thus varies in the different illustrated embodiments of the measured value detection device 10. In the illustrated embodiments of the measured value detection device 10, the distance between the loop structures 18A, 18B of the turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of the same receiving structure 14 is the same. In addition, the loop structures 18A, 18B of the turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of the plurality of receiving coils 16 are arranged along the receiving structure 14 in groups according to the receiving coils 16.

[0033] As can be seen from Figure 1 and Figure 6 As can be further seen, in the illustrated embodiments, the inductive sensor assembly 1 is respectively implemented as an inductive linear path sensor and includes at least one coupling device 3 and the measured value detection device 10 according to the invention for detecting the movement of a linearly movable body (not shown). Here, at least one coupling device 3 or the measured value detection device 10 is coupled to the movable body (not shown), the linear movement of which along the movement path BB is to be detected. At least one excitation structure 13 is arranged on the circuit carrier 11 of the measured value detection device 10. At least one excitation structure 13 is coupled to at least one evaluation and control circuit 12, which couples a periodic alternating signal into at least one excitation structure 13 during operation. At least one coupling device 3 includes a conductive coupling element 3.1 and is implemented to influence the inductive coupling between at least one excitation structure 13 and at least one receiving structure 14 of the measured value detection device 10. At least one evaluation and control unit 12 is implemented to receive and evaluate the signals induced in at least one receiving structure 14 and to determine the current relative position of the movable coupling device 3 and at least one receiving structure 14 and / or the current position of the movable body. As can be seen from Figure 1 and Figure 6 As can be further seen, the receiving structure 14 extends in a first direction y from y_min to y_max and in a second direction x along the movement path BB of the coupling device 3 from x_min to x_max, and spans a corresponding plane between (y_max - y_min) and (x_max - x_min).

[0034] For the sake of clarity, Figures 1 to 11The electrical connection of at least one receiving coil 16 of at least one receiving structure 14 to the evaluation and control unit 12 is not shown. This does not mean a short circuit of at least one receiving coil 16. Of course, at least one receiving coil 16 can be separated at a suitable location, for example at the plated through hole DK, and guided to the evaluation and control unit 12 via additional conductor traces, so that the induced signal can be evaluated there.

[0035] As can be seen from Figures 1 to 5 Furthermore, as can be seen, a first embodiment of the inductive sensor assembly 1A according to the invention includes a first embodiment of the measured value detection means 10A and an excitation structure 13, the measured value detection means including a receiving structure 14A; the excitation structure in the first embodiment shown of the inductive sensor assembly 1A includes an excitation coil 13A having four turns arranged in two planes of the circuit carrier 11. This means that two turns are arranged in each plane of the circuit carrier 11. The receiving structure 14A includes two receiving coils 16A, 16B, which each have three turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 and are constructed in two planes of the circuit carrier 11. Here, the first receiving coil 16A forms a sine channel, and the second receiving coil 16B forms a cosine channel. Each of the turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of the two receiving coils 16A, 16B respectively has two ring structures 18A, 18B, and the ring structures respectively have five ring segments SA. In the embodiment shown, the ring segments SA of the two ring structures 18A, 18B of each of the turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 have a sine shape and opposite flow directions. The ring structures 18A, 18B of the three electrically serially connected turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of the two receiving coils 16A, 16B are arranged offset from each other by a preset distance. Here, the ends of the respective ring structures 18A, 18B of the three turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of the two receiving coils 16A, 16B are respectively connected to each other via three connection structures 20A1, 20B1, 20C1, 20D1, 20E1, 20F1, 20A2, 20B2, 20C2, 20D2, 20E2, 20F2 in the end regions 14.1, 14.2 of the receiving structure 14A, so as to respectively form a series circuit of the three turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3 of the two receiving coils 16A, 16B and / or a reversal of the flow direction within one of the three turns 1W1, 1W2, 1W3, 2W1, 2W2, 2W3.

[0036] As can be seen from Figures 1 to 3As can be seen further, the first connection structure 20A1, the second connection structure 20B1, and the third connection structure 20C1 of the first receiving coil 16A each include a plated through-hole DK and two straight conductor traces 22 in two planes of the circuit carrier 11 on the first end 14.1 of the receiving structure 14A. Here, the first connection structure 20A1 connects the second loop structure 18B of the third turn 1W3 of the first receiving coil 16A to the first loop structure 18A of the first turn 1W1 of the first receiving coil 16A. For this purpose, the straight conductor trace 22 extending in the y direction and arranged on the upper plane of the circuit carrier 11 in the drawing is connected to the leading end of the second loop structure 18B of the third turn 1W3 at the contact point 24 by the first end, and is connected to the plated through-hole DK by the second end. The straight conductor trace 22 extending in the y direction and arranged on the lower plane of the circuit carrier 11 in the drawing is connected to the leading end of the first loop structure 18A of the first turn 1W1 at the contact point 24 by the first end, and is connected to the plated through-hole DK by the second end. The second connection structure 20B1 of the first receiving coil 16A connects the second loop structure 18B of the second turn 1W2 to the first loop structure 18A of the second turn 1W2. For this purpose, the straight conductor trace 22 extending in the y direction and arranged on the upper plane of the circuit carrier 11 in the drawing is connected to the leading end of the second loop structure 18B of the second turn 1W2 at the contact point 24 by the first end, and is connected to the plated through-hole DK by the second end. The straight conductor trace 22 extending in the y direction and arranged on the lower plane of the circuit carrier 11 in the drawing is connected to the leading end of the first loop structure 18A of the second turn 1W2 at the contact point 24 by the first end, and is connected to the plated through-hole DK by the second end. The third connection structure 20C1 of the first receiving coil 16A connects the second loop structure 18B of the first turn 1W1 to the first loop structure 18A of the third turn 1W3. For this purpose, the straight conductor trace 22 extending in the y direction and arranged on the upper plane of the circuit carrier 11 in the drawing is connected to the leading end of the second loop structure 18B of the first turn 1W1 at the contact point 24 by the first end, and is connected to the plated through-hole DK by the second end. The straight conductor trace 22 extending in the y direction and arranged on the lower plane of the circuit carrier 11 in the drawing is connected to the leading end of the first loop structure 18A of the third turn 1W3 at the contact point 24 by the first end, and is connected to the plated through-hole DK by the second end.

[0037] As can be seen from Figures 1 to 3As can further be seen, the first connection structure 20A2 of the second receiving coil 16B includes a plated through-hole DK on the first end 14.1 of the receiving structure 14A, which connects the respective loop structures 18A, 18B of the first turn 2W1 of the second receiving coil 16B that are arranged in different planes of the circuit carrier 11 to each other. Here, the second loop structure 18B of the first turn 2W1 of the second receiving coil 16B terminates at the plated through-hole DK before the first end 14.1 of the receiving structure 14A. The first loop structure 18A of the first turn 2W1 of the second receiving coil 16B also terminates at the plated through-hole DK before the first end 14.1 of the receiving structure 14A. The second connection structure 20B2 and the third connection structure 20C2 of the second receiving coil 16A each include a straight conductor trace 22 extending in the y direction, and the conductor traces are respectively connected to the ends of the respective loop structures 18A, 18B arranged in the same plane of the circuit carrier 11 at the contact points 24. For this purpose, the straight conductor trace 22 extending in the y direction of the second connection structure 20B2 is connected to the end of the second loop structure 18B of the second turn 2W2 of the second receiving coil 16B at the contact point 24 (which replaces the plated through-hole DK) with the first end in the lower plane of the circuit carrier 11, and is connected to the end of the first loop structure 18A of the third turn 2W3 of the second receiving coil 16B at the contact point 24 with the second end. The straight conductor trace 22 extending in the y direction of the third connection structure 20C2 is connected to the end of the second loop structure 18B of the third turn 2W3 of the second receiving coil 16B at the contact point 24 with the first end in the upper plane of the circuit carrier 11, and is connected to the end of the first loop structure 18A of the second turn 2W2 of the second receiving coil 16B at the contact point 24 (which replaces the plated through-hole) with the second end.

[0038] As can be seen from Figure 1 , Figure 4 and Figure 5As can further be seen, the fourth connection structure 20D1 of the first receiving coil 16A includes a plated through-hole DK on the second end 14.2 of the receiving structure 14A, which connects the second loop structure 18B of the first turn 1W1 of the first receiving coil 16A arranged in the upper plane of the circuit carrier 11 to the first loop structure 18A of the first turn 1W1 of the first receiving coil 16A arranged in the lower plane of the circuit carrier 11. Here, the first loop structure 18A and the second loop structure 18B of the first turn 1W1 of the first receiving coil 16A respectively terminate prematurely at the plated through-hole DK before the second end 14.2 of the receiving structure 14A. The fifth connection structure 20E1 and the sixth connection structure 20F1 of the first receiving coil 16A respectively include a plated through-hole DK and a conductor trace 22 on the second end 14.2 of the receiving structure 14A. Here, the fifth connection structure 20E1 connects the second loop structure 18B of the third turn 1W3 of the first receiving coil 16A to the first loop structure 18A of the third turn 1W3 of the first receiving coil 16A. For this purpose, the end of the second loop structure 18B arranged in the upper plane of the circuit carrier 11 is connected to the plated through-hole and terminates prematurely at the plated through-hole DK. The straight conductor trace 22 extending in the y direction arranged in the lower plane of the circuit carrier 11 is connected to the premature end of the first loop structure 18A of the third turn 1W3 of the first receiving coil 16A at the contact point 24 using the first end, and is connected to the plated through-hole DK using the second end. The sixth connection structure 20F1 of the first receiving coil 16A connects the second loop structure 18B of the second turn 1W2 to the first loop structure 18A of the third turn 1W3. For this purpose, the straight conductor trace 22 extending in the y direction arranged in the upper plane of the circuit carrier 11 is connected to the premature end of the second loop structure 18B of the second turn 1W2 at the contact point 24 using the first end, and is connected to the plated through-hole DK using the second end. The end of the first loop structure 18A of the third turn 1W3 arranged in the lower plane of the circuit carrier 11 is connected to the plated through-hole DK and terminates prematurely at the plated through-hole.

[0039] As can be seen from Figure 1 , Figure 4 and Figure 5As can further be seen, the fourth connection structure 20D2 of the second receiving coil 16B includes a plated through-hole DK on the second end portion 14.2 of the receiving structure 14A, which connects the second loop structure 18B of the third turn 2W3 of the second receiving coil 16B arranged in the upper plane of the circuit carrier 11 to the first loop structure 18A of the third turn 2W3 of the second receiving coil 16B arranged in the lower plane of the circuit carrier 11. Here, the first loop structure 18A and the second loop structure 18B of the third turn 2W3 of the second receiving coil 16B respectively terminate prematurely at the plated through-hole DK before the second end portion 14.2 of the receiving structure 14A. The fifth connection structure 20E2 and the sixth connection structure 20F2 of the second receiving coil 16B respectively include straight conductor traces 22 extending in the y direction on the second end portion 14.2 of the receiving structure 14A, and the conductor traces are respectively connected to the ends of two separate loop structures 18A, 18B arranged in the same plane of the circuit carrier 11 at the contact points 24. For this purpose, the straight conductor trace 22 extending in the y direction of the fifth connection structure 20E2 is connected to the end of the first loop structure 18A of the first turn 2W1 of the second receiving coil 16B at the contact point 24 using the first end portion in the upper plane of the circuit carrier 11, and is connected to the end of the second loop structure 18B of the second turn 2W2 of the second receiving coil 16B at the contact point 24 (which replaces the plated through-hole DK) using the second end portion. The straight conductor trace 22 extending in the y direction of the sixth connection structure 20F2 is connected to the end of the first loop structure 18A of the second turn 2W2 of the second receiving coil 16B at the contact point 24 (which replaces the plated through-hole DK) using the first end portion in the lower plane of the circuit carrier 11, and is connected to the end of the second loop structure 18B of the first turn 2W1 of the second receiving coil 16B at the contact point 24 using the second end portion.

[0040] As can be seen from Figures 6 to 10As can be seen further, a second embodiment of the inductive sensor assembly 1B according to the invention comprises a second embodiment of the measured value detection means 10B and an excitation structure 13, the measured value detection means comprising a receiving structure 14B; the excitation structure also comprises an excitation coil 13B in the second embodiment shown of the inductive sensor assembly 1B, the excitation coil having two turns arranged in two planes of the circuit carrier 11. The receiving structure 14B comprises two receiving coils 16A, 16B, the receiving coils each having two turns 1W1, 1W2, 2W1, 2W2 and being constructed in two planes of the circuit carrier 11. Here, the first receiving coil 16A forms a sine channel, and the second receiving coil 16B forms a cosine channel. Each of the turns 1W1, 1W2, 2W1, 2W2 of the two receiving coils 16A, 16B respectively has two loop structures 18A, 18B, the loop structures each having ten loop segments SA. In the embodiment shown, the loop segments SA of the two loop structures 18A, 18B of each of the turns 1W1, 1W2, 2W1, 2W2 have a sine shape and opposite flow directions. The loop structures 18A, 18B of the two electrically serially connected turns 1W1, 1W2, 2W1, 2W2 of the two receiving coils 16A, 16B are arranged offset from one another by a preset distance. Here, the ends of the respective loop structures 18A, 18B of the two turns 1W1, 1W2, 2W1, 2W2 of the two receiving coils 16A, 16B are connected to one another via two connecting structures 20A1, 20B1, 20C1, 20D1, 20A2, 20B2, 20C2, 20D2 in the end regions 14.1, 14.2 of the receiving structure 14B, thereby respectively forming series circuits of the two turns 1W1, 1W2, 2W1, 2W2 of the two receiving coils 16A, 16B and / or reversal of the flow direction within one of the two turns 1W1, 1W2, 2W1, 2W2.

[0041] As can be seen from Figures 6 to 8As can further be seen, the first connection structure 20A1 and the second connection structure 20B1 of the first receiving coil 16A each include a plated through-hole DK on the first end portion 14.1 of the receiving structure 14B. Here, the first connection structure 20A1 connects the second loop structure 18B of the second turn 1W2 of the first receiving coil 16A to the first loop structure 18A of the first turn 1W1 of the first receiving coil 16A. Accordingly, the second loop structure 18B of the second turn 1W2 and the first loop structure 18A of the first turn 1W1 of the first receiving coil 16A each terminate prematurely at the plated through-hole DK before the first end portion 14.1 of the receiving structure 14A. The second connection structure 20B1 connects the second loop structure 18B of the first turn 1W1 of the first receiving coil 16A to the first loop structure 18A of the second turn 1W2 of the first receiving coil 16A. Accordingly, the second loop structure 18B of the first turn 1W1 and the first loop structure 18A of the second turn 1W2 of the first receiving coil 16A each terminate prematurely at the plated through-hole DK before the first end portion 14.1 of the receiving structure 14A.

[0042] As can be seen from Figures 6 to 8 As can further be seen, the first connection structure 20A2 and the second connection structure 20B2 of the second receiving coil 16B each include a straight conductor trace 22 extending in the y direction on the first end portion 14.1 of the receiving structure 14B, and the conductor trace connects to the ends of two separate loop structures 18A, 18B arranged in the same plane of the circuit carrier 11 at the contact points 24. To this end, the straight conductor trace 22 extending in the y direction of the first connection structure 20A2 connects to the end of the first loop structure 18A of the first turn 2W1 of the second receiving coil 16B at the contact point 24 (which replaces the plated through-hole DK) with the first end in the upper plane of the circuit carrier 11, and connects to the end of the second loop structure 18B of the second turn 2W2 of the second receiving coil 16B at the contact point 24 with the second end. The straight conductor trace 22 extending in the y direction of the second connection structure 20B2 connects to the end of the first loop structure 18A of the second turn 2W2 of the second receiving coil 16B at the contact point 24 with the first end in the lower plane of the circuit carrier 11, and connects to the end of the second loop structure 18B of the first turn 2W1 of the second receiving coil 16B at the contact point 24 (which replaces the plated through-hole DK) with the second end.

[0043] As can be seen from Figure 6 、 9As can be further seen from and

[0044] , the third connection structure 20C1 of the first receiving coil 16A includes a plated through-hole DK and a straight guide track member 22 extending in the y direction on the second end portion 14.2 of the receiving structure 14B. Here, the third connection structure 20C1 connects the second loop structure 18B of the first turn 1W1 of the first receiving coil 16A to the first loop structure 18A of the first turn 1W1 of the first receiving coil 16A. For this purpose, the end portion of the first loop structure 18A arranged on the lower plane of the circuit carrier 11 is connected to the plated through-hole DK and terminates in advance at the plated through-hole DK. The straight conductor trace member 22 extending in the y direction on the upper plane of the circuit carrier 11 is connected to the advance end portion of the second loop structure 18B of the first turn 1W1 of the first receiving coil 16A at the contact point 24 by means of the first end portion, and is connected to the plated through-hole DK by means of the second end portion. In addition, the plated through-hole DK of the second loop structure 18B of the second turn 1W2 of the first receiving coil 16A is replaced by the contact point 24, so that the section of the second loop structure 18B actually extending in the upper plane of the circuit carrier 11 further extends in the lower plane of the circuit carrier 11. Therefore, the fourth connection structure 20D1 of the first receiving coil 16A only includes a straight conductor trace member 22 extending in the y direction on the second end portion 14.2 of the receiving structure 14B and connects the second loop structure 18B of the second turn 1W2 of the first receiving coil 16A to the first loop structure 18A of the second turn 1W2 of the first receiving coil 16A. For this purpose, the straight conductor trace member 22 extending in the y direction on the lower plane of the circuit carrier 11 is connected to the end portion of the second loop structure 18B of the second turn 1W2 of the first receiving coil 16A at the contact point 24 by means of the first end portion, and is connected to the end portion of the first loop structure 18A of the second turn 1W2 of the first receiving coil 16A at the contact point 24 by means of the second end portion.

[0044] As can be seen from Figure 6 , 9As can be further seen from FIGS. 10, the third connection structure 20C2 of the second receiving coil 16B includes a plated through-hole DK on the second end portion 14.2 of the receiving structure 14B, which connects two separate loop structures 18A, 18B of the second turn 2W2 of the second receiving coil 16B arranged in different planes of the circuit carrier 11. Here, the second loop structure 18B and the first loop structure 18A of the second turn 2W2 of the second receiving coil 16B terminate in advance at the plated through-hole DK before the second end portion 14.2 of the receiving structure 14B. In addition, the plated through-hole DK of the first loop structure 18A of the first turn 1W1 of the second receiving coil 16B is offset from the upper edge of the receiving structure 14B along the first loop structure 18A in the negative x direction and in the negative y direction, so that a section of the first loop structure 18A is arranged in the upper plane of the circuit carrier 11 instead of the lower plane of the circuit carrier 11, where the contact point 24 replaces the plated through-hole on the upper edge of the receiving structure 14B. In addition, the plated through-hole DK on the lower edge of the receiving structure 14B of the second loop structure 18B of the first turn 2W1 of the second receiving coil 16B is replaced by the contact point 24. Therefore, the fourth connection structure 20D2 of the second receiving coil 16B includes only a straight conductor trace 22 extending in the y direction on the second end portion 14.2 of the receiving structure 14B, and connects the second loop structure 18B of the first turn 2W1 of the second receiving coil 16B to the first loop structure 18A of the first turn 2W1 of the second receiving coil 16B. For this purpose, the straight conductor trace 22 extending in the y direction on the upper plane of the circuit carrier 11 has a first end connected to the end of the first loop structure 18A of the first turn 2W1 of the second receiving coil 16B at the contact point 24 on the upper edge of the receiving structure 14B, and a second end connected to the end of the second loop structure 18B of the first turn 2W1 of the second receiving coil 16B at the contact point 24 on the lower edge of the receiving structure 14B.

[0045] As can be seen from Figure 11As can further be seen, in the third embodiment shown, the inductive sensor assembly 1C is implemented as an inductive rotation angle sensor or a rotor position sensor, wherein a movable body (not shown) performs a rotational movement to be detected about a rotational axis. Similar to the above-described embodiments, the inductive sensor assembly 1C for detecting the movement of a rotatable movable body (not shown) includes at least one coupling device (not shown in detail) and a measurement value detection device 10C according to the invention. In the third embodiment shown of the inductive sensor assembly 1C, the measurement value detection device has a space-saving "C" shape and can be plugged onto a shaft. Here, at least one coupling device 3 or the measurement value detection device 10C is coupled to a movable body (not shown), the rotational movement of which is to be detected. At least one excitation structure 13 is arranged on the circuit carrier 11 of the measurement value detection device 10C. At least one excitation structure 13 is coupled to an evaluation and control circuit 12, which during operation couples a periodic alternating signal into at least one excitation structure 13. At least one coupling device includes a conductive coupling element and is configured to influence the inductive coupling between at least one excitation structure 13 of the measurement value detection device 10C and at least one receiving structure 14. At least one evaluation and control unit 12 is configured to receive and evaluate the signal induced in at least one receiving structure 14 and to determine the current relative position of the movable coupling device with respect to at least one receiving structure 14 and / or the current position of the movable body.

[0046] As can be seen from Figure 11As can be seen further, the shown third embodiment of the measurement value detection device 10C includes a receiving structure 14C and an excitation structure 13, which in the shown third embodiment of the inductive sensor assembly 1C includes an excitation coil 13C having six turns arranged in two planes of the circuit carrier 11. This means that three turns are arranged in each plane of the circuit carrier 11. The receiving structure 14C includes two receiving coils 16A, 16B, which respectively have two turns 1W1, 1W2, 2W1, 2W2 and are constructed in two planes of the circuit carrier 11. Here, the first receiving coil 16A forms a sine channel, and the second receiving coil 16B forms a cosine channel. Each of the turns 1W1, 1W2, 2W1, 2W2 of the two receiving coils 16A, 16B respectively has two ring structures 18A, 18B, which respectively form ring sections SA. In the shown embodiment, the ring sections SA of each of the turns 1W1, 1W2, 2W1, 2W2 or the two ring structures 18A, 18B respectively have a sine shape and opposite flow directions. The ring structures 18A, 18B of the two electrically serially connected turns 1W1, 1W2, 2W1, 2W2 of the two receiving coils 16A, 16B are arranged offset from each other by a preset distance. Here, the ends of the respective ring structures 18A, 18B of the two turns 1W1, 1W2, 2W1, 2W2 of the two receiving coils 16A, 16B are respectively connected to each other via two connecting structures 20A1, 20B1, 20C1, 20D1, 20A2, 20B2, 20C2, 20D2 in the end regions 14.1, 14.2 of the receiving structure 14B, so as to respectively form series circuits of the two turns 1W1, 1W2, 2W1, 2W2 of the two receiving coils 16A, 16B and / or reverse the flow direction within one of the two turns 1W1, 1W2, 2W1, 2W2.

[0047] As can be seen from Figure 11As can further be seen, the first connection structure 20A1 of the first receiving coil 16A includes a straight conductor trace 22 and a plated through-hole DK on the first end 14.1 of the receiving structure 14C. Here, the first connection structure 20A1 of the first receiving coil 16A connects the second loop structure 18B of the second turn 1W2 to the first loop structure 18A of the second turn 1W2 of the first receiving coil 16A. For this purpose, the straight conductor trace 22 of the first connection structure 20A1 is connected to the leading end of the second loop structure 18B of the second turn 1W2 of the first receiving coil 16A at the contact point 24 in the lower plane of the circuit carrier 11 using the first end, and is connected to the plated through-hole DK using the second end. The end of the first loop structure 18A of the second turn 1W2 of the first receiving coil 16A arranged in the upper plane of the circuit carrier 11 is connected to the plated through-hole DK and terminates prematurely there before the first end 14.1 of the receiving structure 14C. The second connection structure 20B1 of the first receiving coil 16A includes a straight conductor trace 22 on the first end 14.1 of the receiving structure 14C. Here, the second connection structure 20B1 of the first receiving coil 16A connects the second loop structure 18B of the first turn 1W1 to the first loop structure 18A of the first turn 1W1 of the first receiving coil 16A. For this purpose, the straight conductor trace 22 of the second connection structure 20B1 is connected to the end of the second loop structure 18B of the first turn 1W1 of the first receiving coil 16A at the contact point 24 in the lower plane of the circuit carrier 11 using the first end, and is connected to the end of the first loop structure 18A of the first turn at the contact point 24 using the second end. Here, at the upper edge of the receiving structure 14C, the plated through-hole DK at the first loop structure 18A of the first turn 1W1 of the first receiving coil 16A is omitted, so that the end of the first loop structure 18A is not in the upper plane of the circuit carrier 11, but is further guided in the lower plane of the circuit carrier 11.

[0048] As can be seen from Figure 11As can further be seen, the first connection structure 20A2 of the second receiving coil 16B includes a plated through-hole DK on the first end portion 14.1 of the receiving structure 14C. Here, the first connection structure 20A2 of the second receiving coil 16B connects the second loop structure 18B of the first turn 2W1 of the second receiving coil 16B to the first loop structure 18A of the first turn 2W1 of the second receiving coil 16B. For this purpose, the end portion of the first loop structure 18A of the first turn 2W1 of the second receiving coil 16B that is guided in the lower plane of the circuit carrier 11 is connected to the plated through-hole DK and terminates there in front of the first end portion 14.1 of the receiving structure 14C. The end portion of the second loop structure 18B of the first turn 2W1 of the second receiving coil 16B that is arranged in the upper plane of the circuit carrier 11 is connected to the plated through-hole DK and terminates there in front of the first end portion 14.1 of the receiving structure 14C. The second connection structure 20B2 of the first receiving coil 16A includes a straight conductor trace 22 on the first end portion 14.1 of the receiving structure 14C. Here, the second connection structure 20B2 of the second receiving coil 16B connects the first loop structure 18A of the second turn 2W2 to the second loop structure 18B of the second turn 2W2 of the second receiving coil 16B. For this purpose, the straight conductor trace 22 of the second connection structure 20B2 is connected at its first end to the end portion of the first loop structure 18A of the second turn 2W2 of the second receiving coil 16B at a contact point 24 (which replaces the plated through-hole DK) in the upper plane of the circuit carrier 11, and is connected at its second end to the end portion of the second loop structure 18B of the second turn at a contact point 24 (which also replaces the plated through-hole DK). Here, the plated through-hole DK at the first loop structure 18A of the second turn 2W2 that is arranged on the upper edge of the receiving structure 14C is shifted to the right in the direction of the first loop structure 18A, so that the end portion of the first loop structure 18A is not in the lower plane of the circuit carrier 11 but is further guided in the upper plane of the circuit carrier 11.

[0049] As can be seen from Figure 11As can be seen further, the third connection structure 20C1 and the fourth connection structure 20D1 of the first receiving coil 16A each include a plated through-hole DK on the second end 14.2 of the receiving structure 14C. Here, the third connection structure 20C1 of the first receiving coil 16A connects the first loop structure 18A of the first turn 1W1 of the first receiving coil 16A to the second loop structure 18B of the second turn 1W2 of the first receiving coil 16A. For this purpose, the end of the second loop structure 18B of the second turn 1W2 of the first receiving coil 16A that is guided in the lower plane of the circuit carrier 11 is connected to the plated through-hole DK and terminates prematurely there on the second end 14.2 of the receiving structure 14C. The end of the first loop structure 18A of the first turn 1W1 of the first receiving coil 16A that is arranged in the upper plane of the circuit carrier 11 is connected to the plated through-hole DK and terminates prematurely there before the second end 14.2 of the receiving structure 14C. The fourth connection structure 20D1 of the first receiving coil 16A connects the first loop structure 18A of the second turn 1W2 of the first receiving coil 16A to the second loop structure 18B of the first turn 1W1 of the first receiving coil 16A. For this purpose, the end of the second loop structure 18B of the first turn 1W1 of the first receiving coil 16A that is guided in the lower plane of the circuit carrier 11 is connected to the plated through-hole DK and terminates prematurely there before the second end 14.2 of the receiving structure 14C. The end of the first loop structure 18A of the second turn 1W2 of the first receiving coil 16A that is arranged in the upper plane of the circuit carrier 11 is connected to the plated through-hole DK and terminates prematurely there before the second end 14.2 of the receiving structure 14C.

[0050] As can be seen from Figure 11As can further be seen, the third connection structure 20C2 and the fourth connection structure 20D2 of the second receiving coil 16B each include a straight conductor trace 22 on the second end 14.2 of the receiving structure 14C. Here, the third connection structure 20C2 of the second receiving coil 16B connects the first loop structure 18A of the second turn 2W2 to the second loop structure 18B of the first turn 2W1 of the second receiving coil 16B. For this purpose, the straight conductor trace 22 of the third connection structure 20C2 is connected at its first end to the end of the first loop structure 18A of the second turn 2W2 of the second receiving coil 16B at a contact point 24 (which replaces the plated through hole DK) in the upper plane of the circuit carrier 11, and is connected at its second end to the end of the second loop structure 18B of the first turn 2W1 of the second receiving coil 16B at the contact point 24. The fourth connection structure 20D2 of the second receiving coil 16B connects the first loop structure 18A of the first turn 2W1 to the second loop structure 18B of the second turn 2W2 of the second receiving coil 16B. For this purpose, the straight conductor trace 22 of the fourth connection structure 20D2 is connected at its first end to the end of the first loop structure 18A of the first turn 2W1 of the second receiving coil 16B at the contact point 24, and is connected at its second end to the end of the second loop structure 18B of the second turn 2W2 of the second receiving coil 16B at a contact point 24 (which replaces the plated through hole DK).

Claims

1. A measuring value detection device (10) for an inductive sensor assembly (1), the measuring value detection device having a circuit carrier (11), the circuit carrier including at least one receiving structure (14), the receiving structure including at least one receiving coil (16) having at least two turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3), wherein, Each turn (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) of the at least one receiving coil (16) has two loop structures (18A, 18B) each with a plurality of loop segments (SA) and is constructed in at least two planes of the circuit carrier (11), wherein the segments of the respective loop structures (18A, 18B) arranged in different planes of the circuit carrier (11) are electrically connected to each other via plated-through holes (DK), wherein the loop segments (SA) of the two loop structures (18A, 18B) of each of the turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) have opposite flow directions, wherein the loop structures (18A, 18B) of at least two electrically serially connected turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) of the at least one receiving coil (16) are arranged offset from each other by a preset distance, and wherein the ends of the respective loop structures (18A, 18B) of at least two turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) of the at least one receiving coil (16) are respectively connected to each other via at least one connecting structure (20) in the end regions (14.1, 14.2) of the corresponding receiving structure (14), thereby forming a series circuit of at least two turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) and / or a reversal of the flow direction within one of the at least two turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3).

2. The measurement value detection device (10) according to claim 1, characterized in that, The number of the connecting structures (20) is based on the number of turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) of the at least one receiving coil (16).

3. The measurement value detection device (10) according to claim 1 or 2, characterized in that, The at least one connecting structure (20) includes plated-through holes (DK) that connect two turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) or two separate loop structures (18A, 18B) of a common turn among the at least two turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) arranged in different planes to each other, wherein the two separate loop structures (18A, 18B) terminate at the plated-through holes (DK) before the corresponding ends (14.1, 14.2) of the receiving structure (14).

4. The measurement value detection device (10) according to claim 3, characterized in that, The plated-through holes (DK) are arranged in the region of the intersection of two separate loop structures (18A, 18B) arranged in different planes.

5. The measurement value detection device (10) according to claim 1 or 2, characterized in that, The at least one connecting structure (20) includes conductor trace elements (22) that are respectively connected to the ends of two separate loop structures (18A, 18B) of two turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) or a common turn among the at least two turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) arranged in the same plane at contact points (24) and connect the loop structures to each other.

6. The measured value detection device (10) according to claim 1 or 2, characterized in that, The at least one connecting structure (20) includes plated-through holes (DK) and at least one conductor trace (22) in one or both of two planes, and connects two turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) or two separate loop structures (18A, 18B) of a common turn among the at least two turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) arranged in different planes to each other.

7. The measured value detection device (10) according to claim 6, characterized in that, The plated-through hole (DK) is connected to an end of one of the two loop structures (18A, 18B) in one plane and is connected to the at least one conductor trace (22) in the other plane, and the conductor trace is connected to an end of the other of the two loop structures (18A, 18B) at a contact point (24).

8. The measurement value detection device (10) according to claim 6, characterized in that, A first conductor trace (22) is connected to the plated-through hole (DK) in one plane and is connected to an end of one of the loop structures (18A, 18B) at the contact point (24), and a second conductor trace (22) is connected to the plated-through hole (DK) in the other plane and is connected to an end of the other of the two loop structures (18A, 18B) at the contact point (24).

9. The measurement value detection device (10) according to any one of claims 1 to 8, characterized in that, The loop sections (SA) of the two loop structures (18A, 18B) are periodically repeated respectively, wherein a complete period of the loop section (SA) corresponds to a sinusoidal trend or a rectangular trend or a triangular trend, and the number of the periodically repeated loop sections (SA) defines the periodicity of the receiving structure (14).

10. The measurement value detection device (10) according to claim 9, characterized in that, The sections of the respective loop structures (18A, 18B) arranged in different planes of the circuit carrier (11) correspond to half or a quarter or an eighth period of the repeated loop section (SA).

11. The measurement value detection device (10) according to any one of claims 1 to 10, characterized in that, The distance between adjacent loop structures (18A, 18B) of the at least one receiving structure (14) is based on the number of receiving structures (14) and the number of receiving coils (16) and the number of turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) of the at least one receiving coil (16) and the periodicity of the at least one receiving structure (14).

12. The measured value detection device (10) according to any one of claims 1 to 11, characterized in that, The distances of the loop structures (18A, 18B) of the turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) of at least one receiving coil (16) of the same receiving structure (14) are of the same magnitude.

13. The measured value detection device (10) according to any one of claims 1 to 12, characterized in that, The loop structures (18A, 18B) of the turns (1W1, 1W2, 1W3, 2W1, 2W2, 2W3) of multiple receiving coils (16) are arranged alternately or are arranged along the receiving structure (14) grouped according to the receiving coils (16).

14. An inductive sensor assembly (1) for detecting the movement of a movable body, the inductive sensor assembly having at least one coupling device (3) and a measured value detection device (10) according to any one of claims 1 to 13, wherein the at least one coupling device (3) or the measured value detection device (10) is coupled to the movable body, the movement of which is to be detected, wherein at least one excitation structure (13) is arranged on a circuit carrier (11) of the measured value detection device (10), wherein the at least one excitation structure (13) is coupled to at least one evaluation and control circuit (12), which during operation couples a periodic alternating signal into the at least one excitation structure (13), wherein the at least one coupling device (3) is configured to influence the inductive coupling between the at least one excitation structure (13) and at least one receiving structure (14) of the measured value detection device (10), and wherein the at least one evaluation and control unit (12) is configured to receive and evaluate the signal induced in the at least one receiving structure (14) and to determine the current relative position of the movable coupling device (3) and the at least one receiving structure (14) and / or the current position of the movable body.

15. The inductive sensor assembly (1) according to claim 14, characterized in that, The movable body performs a rotational movement or a linear movement about a rotational axis (DA).

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