Photoelectric element overload test device under high-speed impact and damage evaluation method thereof

Abstract

The invention provides a photoelectric element overload testing device under high-speed impact and a damage evaluation method thereof. The testing device comprises a testing body with a first shell body, the first shell body is internally provided with a separation assembly, a photoelectric element and a first load measuring assembly, and the photoelectric element and the first load measuring assembly are arranged on the two sides of the separation assembly; the load acquisition assembly is electrically connected with the first load measurement assembly; during use, high-speed impact force acts on the first shell body, then the impact force is conducted to the photoelectric component and the first load measurement assembly through the separation assembly, and the load obtaining assembly obtains the magnitude of the load acting on the photoelectric component and measured by the first load measurement assembly. And after impact, the photoelectric component is taken out, the damage condition is detected on the damage detection assembly, the corresponding relation between the load and the damage is obtained according to the size of the load acting on the photoelectric component obtained by the first load measurement assembly, and reference is provided for model selection and anti-overload design implementation of the photoelectric component of the guidance system.

Description

[0001] This application is a divisional application of the Chinese patent application with application number 2023105980857, application date May 24, 2023, and invention name “Overload test device for photoelectric components under high-speed impact and damage assessment method thereof”. Technical Field

[0002] The present application relates to the technical field of optoelectronic components, and in particular to an overload testing device for optoelectronic components under high-speed impact and a damage assessment method thereof. Background Art

[0003] The advancement of science and technology, especially the rapid development of microelectronics and optoelectronics, has greatly advanced the guidance process of ammunition. However, during ammunition firing, there are extremely large impact loads. Under such extreme conditions, if load reduction measures are not taken for the guidance system, it will have adverse effects on various optoelectronic components of the guidance system, and in severe cases, it will cause optoelectronic components to fail and not work properly. Therefore, the establishment of an optoelectronic component damage assessment device provides a very important reference for selecting appropriate optoelectronic components for the guidance system and implementing overload resistance design. Summary of the Invention

[0004] In view of the above-mentioned defects or deficiencies in the prior art, the present application aims to provide a photoelectric element overload testing device under high-speed impact and a damage assessment method thereof.

[0005] In a first aspect, the present application provides a device for testing an overload of a photoelectric element under high-speed impact, comprising a test body, a load acquisition component, and a damage detection component; The test body includes: a first housing body, wherein the first housing body has a first space therein and a first opening at one end thereof; a partition assembly disposed in the middle of the first space, with both ends connected to the inner wall of the first housing body, the partition assembly dividing the first space into a second space communicating with the first opening and a third space; the second space is used to house the optoelectronic components, which are disposed in the middle of the partition assembly; a first load measuring assembly disposed in the third space, arranged at an end of the partition assembly away from the optoelectronic component, and coaxially arranged with the optoelectronic component; when the outer wall of the first housing body near the first load measuring assembly is subjected to a high-speed impact, the first load measuring assembly is used to measure the impact load transmitted to the optoelectronic component; The load acquisition component is disposed outside the first housing body and is electrically connected to the first load measurement component. The load acquisition component is used to acquire the load measured by the first load measurement component. The damage detection component is used to obtain the damage condition of the optoelectronic component after being impacted.

[0006] According to the technical solution provided by the embodiment of the present application, it further includes: A test cavity, and a first cavity is provided in the test cavity; An end cover body, the end cover body is arranged in the first cavity, and includes a left end cover and a right end cover arranged along the first direction; first grooves are provided on the sides where the left end cover and the right end cover are close to each other, and a fourth space is formed between the two first grooves; A second housing body, the second housing body is placed in the fourth space, and its two ends are respectively connected to the left end cover and the right end cover. A fifth space and a sixth space are arranged in the second housing body along the first direction; the test body is arranged in the fifth space, and its outer wall is closely attached to the inner wall of the second housing body; A second load measurement component, the second load measurement component is arranged in the sixth space, is arranged in the middle of the left end cover, and is coaxially arranged with the test body; An impact shell, the impact shell is arranged on the side of the left end cover away from the right end cover, and its outer wall is closely attached to the inner wall of the test cavity; A pneumatic driving component, the pneumatic driving component is used to drive a high-speed impact force to be applied to the end of the left end cover where the impact shell is located away from the right end cover.

[0007] According to the technical solution provided by the embodiment of the present application, a first buffer component is provided between the left end cover and the impact shell.

[0008] According to the technical solution provided by the embodiment of the present application, a second buffer component is provided between the outer wall of the first housing body and the inner wall of the second housing body.

[0009] According to the technical solution provided by the embodiment of the present application, a sound absorption component is sleeved outside the test cavity.

[0010] According to the technical solution provided by the embodiment of the present application, a third buffer component is provided between the end of the right end cover away from the left end cover and the inner wall of the first cavity.

[0011] According to the technical solution provided by the embodiment of the present application, it further includes: A dropping body, the test body is provided on the dropping body, the axis direction of the test body is the second direction, and the first opening is arranged on the side away from the dropping body; An electric driving component, the electric driving component is used to drive the dropping body to rise to a preset height along the second direction; after reaching the preset height, under the action of gravity, the dropping body drives the test body to drop.

[0012] According to the technical solution provided by the embodiment of the present application, a load amplification component is provided on the dropping body, and the test body is provided on the side of the load amplification component away from the dropping body.

[0013] According to the technical solution provided by the embodiment of the present application, a mounting block is provided on the load amplification component, the test body is mounted on the side of the mounting block away from the load amplification component, and a third load measurement component is further provided on the mounting block, and the third load measurement component is arranged on one side of the test body.

[0014] Second, the present application proposes a damage assessment method for the high-speed impact optoelectronic component overload test device as described above, including the following steps: S100: Install the optoelectronic component into the test body; S101: Apply a high-speed impact force to the test body; S102: Obtain the load value measured by the first load measurement component through the load acquisition component, which is the first load value; S103: Take out the optoelectronic component and observe the damage condition of the optoelectronic component; S104: Repeat steps S100 - S103 to obtain a damage correspondence table; the damage correspondence table includes the first load value and the corresponding damage condition.

[0015] In summary, the present application proposes a high-speed impact optoelectronic component overload test device. By setting a test body with a first outer shell body, a partition component is provided inside the first outer shell body, and an optoelectronic component and a first load measurement component are arranged on both sides of the partition component. After the first outer shell body is subjected to a high-speed impact, the first load measurement component is used to measure the impact load conducted to the optoelectronic component; it also includes a load acquisition component electrically connected to the first load measurement component for acquiring the load measured by the first load measurement component; during use, a high-speed impact force acts on the first outer shell body, and then the impact force is conducted to the optoelectronic component and the first load measurement component through the partition component, and the load acquisition component is used to obtain the magnitude of the load acting on the optoelectronic component measured by the first load measurement component.

[0016] After the impact, take out the optoelectronic component and detect the damage condition on the damage detection component, and obtain the corresponding relationship between the load and the damage according to the first load measurement component to provide a reference for the selection of optoelectronic components in the guidance system and the implementation of anti-overload design. In addition, the present application avoids directly applying a high-speed impact force to the optoelectronic component by setting a shell outside the optoelectronic component and applying a high-speed impact force to the shell, avoiding multiple damages to the optoelectronic component during the test process and avoiding waste. Description of the Drawings

[0017] Figure 1 A structural schematic diagram of the test body provided by the embodiment of the present application; Figure 2 A structural schematic diagram of the test device provided by Embodiment 1 of the application; Figure 3 For Figure 2 A partial enlarged view of A in Figure 4 A structural schematic diagram of the test device provided by Embodiment 2 of the present application; Figure 5 A flowchart of the damage assessment method of the test device provided by Embodiment 3 of the present application.

[0018] 1. Test body; 11. First housing body; 12. First opening; 13. Partition component; 14. Second space; 15. Third space; 16. First load measurement component; 17. Lens base; 18. Buffer pad; 2. Photoelectric component; 3. Test cavity; 31. First cavity; 41. Left end cover; 42. Right end cover; 43. Fourth space; 44. Second housing body; 441. Fifth space; 442. Sixth space; 5. Second load measurement component; 6. Impact shell; 61. Piston; 62. Gas source; 63. Inflation valve; 71. First buffer component; 72. Second buffer component; 73. Third buffer component; 8. Sound absorption component; 9. Drop body; 91. Lower pressing plate; 92. Upper pressing plate; 100. Test base; 101. Driving rod; 102. Pneumatic fixture; 103. Guide rod; 200. Load amplification component; 300. Mounting block; 400. Third load measurement component. Detailed implementation manners

[0019] The present application will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the related invention, rather than limiting the invention. Additionally, it should be noted that for the convenience of description, only the parts related to the invention are shown in the drawings.

[0020] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the drawings and embodiments.

[0021] Embodiment 1 In response to the technical problems mentioned in the background art, the present application proposes a high-speed impact photoelectric element overload test device, including a test body 1, a load acquisition component, and a damage detection component; The test body 1 includes: A first housing body 11, which has a first space inside, and one end thereof has a first opening 12; A separating component 13 is arranged in the middle of the first space, and both ends thereof are connected to the inner wall of the first housing body 11. The separating component 13 divides the first space into a second space 14 communicating with the first opening 12 and a third space 15. The second space 14 is used for placing the optoelectronic component 2, and the optoelectronic component 2 is arranged in the middle of the separating component 13. A first load measuring component 16 is placed in the third space 15, arranged at one end of the separating component away from the optoelectronic component 2, and is coaxially arranged with the optoelectronic component 2. When the outer wall of the first housing body 11 on the side close to the first load measuring component 16 is subjected to a high-speed impact, the first load measuring component 16 is used to measure the impact load conducted to the optoelectronic component 2. The load acquisition component is arranged outside the first housing body 11 and is electrically connected to the first load measuring component 16. The load acquisition component is used to acquire the load measured by the first load measuring component 16. The damage detection component is used to acquire the damage condition of the optoelectronic component 2 after being impacted.

[0022] Please refer to Figure 1 As shown, the first housing body 11 is a hollow cylinder, and the separating component 13 is a circular baffle. Optionally, the separating component 13 and the inner wall of the first housing body 11 are connected by screwing. A lens base 17 is arranged on the side of the separating component 13 close to the first opening 12. The optoelectronic component 2 is arranged in the middle of the lens base 17. Optionally, the size of the optoelectronic component 2 is 32*32*21 mm, and the size of the lens base 17 is Φ46*10 mm. The first load measuring component 16 is an acceleration sensor, and the load acquisition component is an oscilloscope. A wire passing hole is arranged on the test body 1. The wire of the acceleration sensor is connected to the oscilloscope arranged outside the test body 1 through the wire passing hole. When the first housing body 11 is subjected to a high-speed impact force, the impact force is transmitted from the first housing body 11, the separating component 13 to the first load measuring component 16. Since the first load measuring component 16 and the optoelectronic component 2 are coaxially arranged on both sides of the separating component 13, the load measured by the first load measuring component 16 can be used to characterize the load received by the optoelectronic component 2.

[0023] In addition, buffer pads 18 are provided on the inner walls of the second space 14 and the third space 15. The buffer pads 18 are sleeved on the ring and outside the partition assembly 13. The outer diameter of the buffer pad 18 is Φ46mm, its inner diameter is Φ26mm, and its thickness is 23mm. According to the dimensions of the optoelectronic component 2, the lens base 17, the buffer pad 18, etc., the dimensions of the first housing body 11 are designed to be Φ52mm*66mm, and the wall thickness is 3mm. The buffer pad 18 is used to prevent excessive loads from being transmitted to the first load measurement assembly 16 and the optoelectronic component 2, which may cause damage to the first load measurement assembly 16 and the optoelectronic component 2.

[0024] When the acceleration sensor transmits the received load to the oscilloscope, the operator can obtain the amplitude and pulse width of the load by operating the oscilloscope, and take out the impacted optoelectronic component 2 from the first opening 12 to the damage detection assembly for damage inspection. Optionally, the damage detection assembly is a metallurgical analysis microscope. Through the metallurgical analysis microscope, the microscopic image of the optoelectronic component 2 can be viewed, and whether there are micro-cracks inside the optoelectronic component 2, the direction of crack propagation, and the port characteristics, etc. can be analyzed. Therefore, according to the load magnitude obtained by the load acquisition component and the damage situation obtained by the damage detection component, the corresponding relationship between the load and the damage can be obtained, providing a reference for the guidance system to implement load reduction. In addition, in this application, the first housing body 11 is provided outside the optoelectronic component 2, and a high-speed impact force is applied to the first housing body 11 instead of directly applying a high-speed impact force to the optoelectronic component 2, avoiding multiple damages to the optoelectronic component 2 during the test process and avoiding waste.

[0025] In a preferred embodiment, the test device further includes: A test cavity 3, which has a first cavity 31 inside; An end cap body, which is disposed in the first cavity 31 and includes a left end cap 41 and a right end cap 42 distributed along the first direction; first grooves are provided on the sides of the left end cap 41 and the right end cap 42 that are close to each other, and a fourth space 43 is formed between the two first grooves; A second housing body 44, which is placed in the fourth space 43, and its two ends are respectively connected to the left end cap 41 and the right end cap 43. A fifth space 441 and a sixth space 442 are distributed along the first direction inside the second housing body 44; the test body 1 is disposed in the fifth space 441, and its outer wall is in close contact with the inner wall of the second housing body 44; The second load measurement component 5 is disposed in the sixth space 442 and is electrically connected to the load acquisition component. The second load measurement component 5 is disposed in the middle of the left end cover 41 and is coaxially arranged with the test body 1. The impact shell 6 is disposed on the side of the left end cover 41 away from the right end cover 42, and its outer wall is in close contact with the inner wall of the first cavity 31. The pneumatic drive component is used to drive the left end cover 41 where the impact shell 6 is located to apply a high-speed impact force to the end away from the right end cover 42.

[0026] Please refer to Figure 1-3 As shown, the test cavity 3 is a hollow cylindrical gun barrel, and the first direction is the axial direction of the gun barrel, such as Figure 3 the left-right direction shown. The right end of the test cavity 3 is closed, and the end cover body is disposed near the right end of the test cavity 3. Optionally, the left end cover 41 and the right end cover 42 have the same structure and are symmetrically arranged. The left end cover 41 and the right end cover 42 are frustum structures, and the bottom surfaces with larger radii are close to each other. The outer walls of the mutually approaching ends of the left end cover 41 and the right end cover 42 are in close contact with the inner wall of the test cavity 3. The cross-section of the first groove is circular, and the outer shape 44 of the second housing body is cylindrical.

[0027] In this embodiment, an air cannon is used to apply a high-speed impact force to the test body 1. The test cavity 3 includes a first part with an extension direction of the left-right direction and a second part with an extension direction of the vertical direction. A piston 61 is disposed in the second part, and the outer wall of the piston 61 is in close contact with the inner wall of the second part. A first air chamber is formed between the piston 61 and the side of the impact shell 6 away from the left end cover, and a second air chamber is formed between the side of the piston 61 away from the impact shell 6 and the inner wall of the second part. A gas source 62 is disposed outside the test cavity 3, and an inflation valve 63 communicated with the gas source 62. The inflation valve 63 is communicated with the second air chamber. The second air chamber is inflated through the inflation valve 63. The air pressure in the second air chamber is greater than the air pressure in the first air chamber, driving the piston 61 to move toward the side close to the impact shell 6, so that the impact shell 6 moves at a high speed in the first direction toward the direction close to the left end cover 41 under the action of the air pressure in the first air chamber.

[0028] Optionally, the second load measurement component 5 is the same as the first load measurement component 16, which is an acceleration sensor, and both are connected to the oscilloscope. The magnitude of the load measured by the second load measurement component 5 can be obtained through the oscilloscope. When the impact shell 6 is subjected to a high-speed impact force, it first acts on the left end cover 41. The second load measurement component 5 provided on the left end cover 41 can measure the magnitude of the load. The impact force is transmitted to the first load measurement component 16 and the optoelectronic component 2 through the second housing body 44, the first housing body 11, and the partition component 13.

[0029] During the test, the optoelectronic component 2 can be not placed in for impact first. By setting the pressure of the pneumatic drive component, the impact force applied to the left end cover 41 can be changed. Until the load amplitude and pulse width transmitted by the second load measurement component 5 obtained by the oscilloscope are approximately the expected set values, then install the optoelectronic component 2 and conduct the impact test again. In this way, the magnitude of the load obtained by the second load measurement component 5 is first used to adjust the pressure magnitude, so as to determine the test scheme with the optoelectronic component 2 installed, avoiding damage to the optoelectronic component 2 and the acceleration sensor caused by directly applying an impact force of unfounded magnitude on the test body 1, and improving the utilization rate of the optoelectronic component 2.

[0030] In a preferred embodiment, a first buffer component 71 is provided between the left end cover 41 and the impact shell 6.

[0031] Please refer to Figure 1 As shown, optionally, the first buffer component 71 is a wool felt pad. When the pneumatic drive component drives the impact shell 6 to move, it first acts on the first buffer component 71 and then acts on the left end cover 41. By setting the thickness of the first buffer component 71, the magnitude of the impact load measured by the second load measurement component 5 on the left end cover 41 can also be adjusted. Therefore, in this application, the magnitude of the load acting on the left end cover 41 can be adjusted in two ways: by adjusting the pressure and the thickness of the wool felt pad. The greater the pressure, the greater the load amplitude and the narrower the pulse width. The thicker the wool felt pad, the smaller the load amplitude and the wider the pulse width. Generally, if the amplitude of the load measured by the second load measurement component 5 has a large difference from the expectation, first adjust the pressure, and then adjust the thickness of the wool felt pad. When the difference is small, adjust by changing the thickness of the wool felt pad.

[0032] In addition, the inner wall of the test cavity 3 is mirror-treated. Therefore, when the impact shell 6, the end cover body, and the first buffer component 71 move in the first cavity 31, the frictional force with the inner wall of the test cavity 3 will not affect the magnitude of the load.

[0033] In a preferred embodiment, a second buffer assembly 72 is provided between the outer wall of the first housing body 1 and the inner wall of the second housing body 44.

[0034] Please refer to Figure 2-3 As shown, the second housing body 44 is a hollow cylinder, with a circular partition plate in the middle. The partition plate divides the interior of the second housing body into a sixth space 442 on the left and a fifth space 441 on the right. There is a ring of bosses inside the second housing body 44 in the fifth space 441. A seventh space is formed between the bosses and the right end cap 42. The test body 1 is arranged in the seventh space. The first housing body 11 of the test body 1 has a first side wall corresponding to the first opening 12, and a second side wall connecting the first side wall and the first opening 12. The first side wall abuts against the side of the boss close to the right end cap 42, and the second side wall abuts against the inner wall of the second housing body ;The second buffer assembly 72 is a rubber pad, which includes a horizontal part arranged between the second side wall and the inner wall of the second housing body 44, and a vertical part arranged between the boss and the first side wall;The second buffer assembly 72 can prevent a rigid collision between the second housing body 44 and the first housing body 11 under high-speed impact, and at the same time play a fastening role, reducing vibration.

[0035] In a preferred embodiment, a third buffer assembly 73 is provided between the end of the right end cap 43 away from the left end cap 42 and the inner wall of the first cavity 31. Optionally, the third buffer assembly 73 is a buffer felt pad, which is used to prevent a rigid collision between the right end cap 43 and the inner wall of the first cavity 31.

[0036] In a preferred embodiment, a sound-absorbing assembly 8 is sleeved outside the test cavity 3.

[0037] Please refer to Figure 1 As shown, the sound-absorbing assembly 8 is placed on the side of the first buffer assembly 71 close to the impact shell 6. Optionally, the sound-absorbing assembly 8 is a resistive muffler, which is internally provided with porous sound-absorbing materials. The sound energy is converted into heat energy through friction in the pores of the porous materials and consumed, so that the sound wave passing through the muffler is weakened.

[0038] Embodiment 2 The same parts as those in Embodiment 1 will not be described in detail. The differences are as follows: The test device further includes: A dropping body 9, on which the test body 1 is provided. The axial direction of the test body 1 is the second direction, and the first opening 12 is placed on the side away from the dropping body 9; An electric drive assembly for driving the drop body 9 to rise along the second direction to a preset height; after reaching the preset height, under the action of gravity, the drop body 9 drives the test body 1 to drop.

[0039] Please refer to Figure 4 As shown, this embodiment is different from Embodiment 1. Embodiment 1 is an air cannon test device, while this embodiment is a drop test device. The second direction is the vertical direction, the first opening is at the upper side, a lower pressing plate 91 is provided below the first housing body 11, and an upper pressing plate 92 is provided above to close the first opening. The upper pressing plate 92 and the lower pressing plate 91 are connected by bolts provided at the four corners.

[0040] The test device further includes a test base 100 provided on the test bench. The electric drive assembly includes two drive rods 101 arranged horizontally on the test base. A lifting slider is provided on the drive rod 101. Optionally, the lifting slider can be lifted and lowered through a lead screw structure or can be achieved by other means, which will not be elaborated here; the drop body 9 is placed between the two drive rods 101, and pneumatic clamps 102 are provided at both ends thereof close to the drive rods 101. A second groove is provided at the bottom of the pneumatic clamp 102, and the lifting slider can be embedded in the second groove; in addition, first through holes are respectively provided on the drop body 9 close to the pneumatic clamps 102, and two guide rods 103 passing through the first through holes are provided on the test base 100.

[0041] When the lifting slider rises, the lifting slider is embedded in the second groove and drives the drop body 9 to drive the test body 1 to rise. When it rises to the preset height, after the pneumatic clamp 102 clamps the drive rod 101, the lifting slider descends to the initial position, the pneumatic clamp 102 releases the drive rod 101, and it falls freely to the test base 100. The test base 100 applies an upward impact force to the test body 1; the impact force is conducted to the separation assembly 13 through the drop body 9 and the lower pressing plate 91, and then conducted to the optoelectronic component 2 and the first load measuring assembly 16. The first load measuring assembly 16 is electrically connected to the load obtaining assembly and transmits the impact load value received on the optoelectronic component 2 to the load obtaining assembly; after the impact test, the upper pressing plate 92 is disassembled, and the optoelectronic component 2 is taken out of the test body 1 and observed on the damage detection assembly to obtain the damage condition after the drop test. By changing the height of the lifting slider rising, the load magnitude on the optoelectronic component 2 can be changed.

[0042] In a preferred embodiment, a load amplification assembly 200 is provided on the dropping body 9, and the test body 1 is provided on the side of the load amplification assembly 200 away from the dropping body 9.

[0043] Please refer to Figure 4 As shown, in certain specific scenarios, due to the limited heights of the driving rod 101 and the guiding rod 103, the impact force of free fall on the dropping body 9 is limited. By providing the load amplification assembly 200, the impact force is amplified. Optionally, the load amplification assembly 200 can be an impact amplifier.

[0044] In a preferred embodiment, a mounting block 300 is provided on the load amplification assembly 200. The test body 1 is mounted on the side of the mounting block 200 away from the load amplification assembly 200. A third load measurement assembly 400 is further provided on the mounting block 300, and the third load measurement assembly 400 is provided on one side of the test body 1.

[0045] Please refer to Figure 4 As shown, the 200 load amplification assembly is provided on the dropping body 9, the mounting block 300 is provided on the load amplification assembly 200, and the lower pressing plate 91 is provided on the mounting block 300. Optionally, the third load measurement assembly 400 is the same as the first load measurement assembly 16 and the second load measurement assembly 5, and they are all acceleration sensors. The third load measurement assembly 400 is electrically connected to an oscilloscope. When the dropping body 9 drives the test body 1 to drop and is impacted, the magnitude of the load received on the mounting block 300 can be obtained through the oscilloscope.

[0046] During the test, first, the optoelectronic component 2 is not placed. By setting the rising height of the lifting slider, the magnitudes of the loads measured by the third load measurement assembly 400 at different heights are obtained. The lifting height is changed according to the expected load magnitude. When the test height is determined, the optoelectronic component 2 is installed in the test body 1 for testing; this test method first obtains the expected load magnitude through the third load measurement assembly 400, and then installs the optoelectronic component 2 for the drop test, avoiding damage to the optoelectronic component 2 caused by excessive impact and avoiding waste.

[0047] Generally, when the pulse width before load reduction, that is, the pulse width measured by the second load measurement assembly or the third load measurement assembly, is greater than 100 us, the air cannon device of Embodiment 1 is used for testing. When the pulse width is less than or equal to 100 us, the drop test device of this embodiment is used for testing.

[0048] Embodiment 3 Based on Embodiment 1, the present application provides a method for evaluating damage to an optoelectronic component overload test device under high-speed impact, asFigure 5 As shown in the figure, it includes the following steps: S100. Install the optoelectronic component 2 into the test body 1; S101. Apply a high-speed impact force to the test body 1; S102. Obtain the load value measured by the first load measurement component 16 through the load acquisition component, which is the first load value; S103. Take out the optoelectronic component 2 and observe the damage condition of the optoelectronic component 2; observe the damage condition of the optoelectronic component after impact through the metallographic analysis microscope. Generally, the damage condition is shown in Table 1: Table - 1

[0049] S104. Repeat steps S100 - S103 to obtain a damage correspondence table; the damage correspondence table includes the first load value and the corresponding damage condition.

[0050] Among them, the above steps can be respectively implemented by the air cannon test device described in Embodiment 1 and the drop test device described in Embodiment 2; When the test device is the air cannon test device described in Embodiment 1, the following steps are further included before step S100: S200. Set a first expected load sequence, the first expected load sequence includes a plurality of first expected load information, and the first expected load information includes an expected load value and the corresponding preset pressure value and preset thickness value; S201. Assemble the measuring device, wherein the thickness value of the first buffer component 71 is the preset thickness value; S202. Drive the impact shell 6 with the preset pressure value, and the impact shell 6 impacts the left end cover 41 through the first buffer component 71; S203. Obtain the load value measured by the second load measurement component 16 through the load acquisition component, denoted as the second load value; S204. Determine whether the difference between the second load value and the expected load value corresponding to the preset pressure value and the preset thickness value is less than the first threshold. If not, execute steps S205 - S207; if so, execute step S208. The first threshold includes an amplitude threshold and a pulse width threshold. When adjusting the pressure value of the pneumatic drive component and the thickness value of the first buffer component, it is necessary to ensure that the difference between the amplitude measured by the second load measurement component and the expected amplitude is less than the amplitude threshold, and the difference between the measured pulse width and the expected pulse width is less than the pulse width threshold. The greater the pressure, the greater the load amplitude and the narrower the pulse width. The thicker the wool felt pad, the smaller the load amplitude and the wider the pulse width. Generally, if the difference between the amplitude of the load measured by the second load measurement component 5 and the expected value is large, first adjust the pressure, and then adjust the thickness of the wool felt pad. If the difference is small, adjust by changing the thickness of the wool felt pad. S205. Modify the preset pressure value to the first pressure value and the preset thickness value to the first thickness value. S206. Assemble the test device without installing the optoelectronic components. The thickness value of the first buffer component 71 is the first thickness value. S207. Execute steps S202 - S204 with the first pressure value until the difference between the second load value and the expected load value is less than the first threshold, and then obtain the target pressure value and the target thickness value. S208. Set the preset pressure value as the target pressure value and the preset thickness value as the target thickness value. S209. Traverse the first expected load sequence and repeat steps S201 - S204 to obtain the first load reduction test sequence. The first load reduction test sequence includes the expected load value, and the target pressure value and the target thickness value corresponding to the expected load value.

[0051] Part of the data of the first load reduction test sequence is shown in Table 2 as follows: Table - 2

[0052] Execute steps S100 - S104 with the target pressure value and the target thickness value, that is, conduct an impact test on the test body 1 equipped with the optoelectronic component 2 according to Table 1 to obtain the first damage correspondence table when using the air cannon test device.

[0053] Among them, part of the data of the correspondence table of the expected load value, the load value before load reduction, and the load value after load reduction is shown in Table 3. The expected load value before load reduction is the value received by the load acquisition component from the second load measurement component 5, and the load value after load reduction is the value received by the load acquisition component from the first load measurement component 16.

[0054] Table - 3

[0055] Part of the data of the first damage table obtained by the air cannon test device is shown in Table 4, where the first load value is the load value after load reduction, which is measured by the first load measurement component 16.

[0056] Table - 4

[0057] Furthermore, since when the impact shell 6 impacts the left end cover 41, axial vibrations will occur in the left end cover 41 and the second housing body 44, and the axial vibrations will affect the load actually acting on the optoelectronic component 2, it is necessary to filter the measured value of the first load measurement component 16 to eliminate the influence of axial vibrations. The method for eliminating the influence of axial vibrations is as follows: S301. Establish a housing model, which includes the end cover body and the second housing body 44; S302. Conduct a modal analysis on the housing model; S303. Obtain the first natural frequency that generates axial vibrations; S304. Select a frequency far from the natural frequency as the second natural frequency; S305. Filter the load measured by the first load measurement component 16 at the second natural frequency.

[0058] Among them, a geometric model consistent with the test device is established on the simulation software as the housing model, and corresponding material models and their parameters are selected for each component, and corresponding contact surfaces and contact methods are set for the housing model; the geometric model is subjected to modal analysis on the simulation software, and when it is observed that the geometric model undergoes axial torsion, the natural frequency at this time is obtained by the simulation software, that is, the first natural frequency. The first natural frequency read in this embodiment is 8.3KHZ; a frequency far from 8.3KHZ is selected as 500KHZ, which is the second natural frequency; optionally, the measured value of the first load measurement component obtained by the oscilloscope is filtered by MATLAB software. When filtering, the natural frequency is selected as the second natural frequency. Since the difference between the second natural frequency and the first natural frequency is large, the risk of generating axial vibrations is avoided. The first peak value of the filtered curve is obtained. The abscissa of this filtered curve is time, and the ordinate is acceleration. The first peak value is the acceleration when initially contacting the optoelectronic component, and the first peak value is the final reference value provided by the guidance system.

[0059] When the test device is the drop test device described in Embodiment 2, the following steps are further included before step S100: S400. Set a second expected load sequence, where the second expected load sequence includes multiple pieces of second expected load information, and the second expected load information includes an expected load value and a corresponding preset height value; S401. Assemble the test device, and at this time, do not install the optoelectronic component 2; S402. Drive the drop body 9 to drive the test body 1 to rise at the preset height value, and the pneumatic clamp 102 holds the drive rod; S403. The pneumatic clamp 102 releases the drive rod 101, and the drop body 9 drives the test body 1 to free fall; S404. Obtain the load magnitude of the third load measurement component 400, denoted as the third load value; S405. Determine whether the difference between the third load value and the expected load value is less than a second threshold. If so, execute steps S406 - 410; if not, execute step S411; S406. Modify the preset height value to a first height value; S407. Repeat steps S402 - S405 with the first height value until the difference between the third load value and the expected load value is less than the second threshold, and obtain the target height value; S408. Traverse the second expected load sequence, and repeat steps S401 - S405 to obtain a second load reduction test sequence, where the second load reduction test sequence includes the expected load value and the target height value corresponding to the expected load value.

[0060] Partial data of the second load reduction test sequence is shown in Table 5 as follows: Table - 5

[0061] Execute steps S100 - S104 with the target height value, that is, perform an impact test on the test body 1 installed with the optoelectronic component 2 according to Table 3 to obtain a second damage correspondence table when using the drop test device; similarly, the data obtained through the drop test device needs to be filtered, and the processing method is the same as that of the air cannon test device, which will not be elaborated here.

[0062] Among them, partial data of the correspondence table of the expected load value, the load value before load reduction, and the load value after load reduction is shown in Table 6. The expected load value before load reduction is the value received by the load acquisition component from the third load measurement component 400, and the load value after load reduction is the value received by the load acquisition component from the first load measurement component 16.

[0063] Table - 6

[0064] Part of the data of the second damage table obtained by the described drop test device is shown in Table 7, where the first load value is the load value after load reduction and is measured by the first load measurement component 16.

[0065] Table - 7

[0066] In summary, part of the data of the partial damage correspondence table of the described air cannon test device and the described drop test device is shown in Table 8: Table - 8

[0067] Among them, the amplitude after load reduction and the amplitude before load reduction in Table 8 are obtained by the first load measurement component 16. The damage correspondence table can provide a reference for implementing anti - overload design for the guidance system in front of the optoelectronic components and selecting the type of optoelectronic components for the guidance system.

[0068] The above description is only the preferred embodiment of the present application and the explanation of the applied technical principles. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by the specific combination of the above - mentioned technical features, but also covers other technical solutions formed by any combination of the above - mentioned technical features or their equivalent features without departing from the inventive concept. For example, the technical solutions formed by mutually replacing the above - mentioned features with the (but not limited to) technical features with similar functions disclosed in the present application.

Claims

1. An overload test device for optoelectronic components under high-speed impact, characterized in that It includes a test body, a load acquisition component, and a damage detection component; The test body (1) includes: A first housing body (11), within which there is a first space, and one end thereof has a first opening (12); A partitioning component (13), which is disposed in the middle of the first space, and both ends thereof are connected to the inner wall of the first housing body (11). The partitioning component (13) divides the first space into a second space (14) communicating with the first opening (12) and a third space (15); the second space (14) is used to place the optoelectronic component (2), and the optoelectronic component (2) is disposed in the middle of the partitioning component (13); A first load measurement component (16), which is placed in the third space (15), is disposed at one end of the partitioning component (13) away from the optoelectronic component (2), and is coaxially arranged with the optoelectronic component (2); when the outer wall of the first housing body (11) on the side close to the first load measurement component (16) is subjected to a high-speed impact, the first load measurement component (16) is used to measure the impact load conducted to the optoelectronic component (2); The load acquisition component is disposed outside the first housing body (11) and is electrically connected to the first load measurement component. The load acquisition component is used to acquire the load measured by the first load measurement component (16); The damage detection component is used to acquire the damage condition of the optoelectronic component (2) after being impacted; It further includes: A drop body (9), on which the test body (1) is provided. The axis direction of the test body (1) is the second direction, and the first opening (12) is placed on the side away from the drop body (9); An electric drive component, which is used to drive the drop body (9) to rise to a preset height along the second direction; after reaching the preset height, under the action of gravity, the drop body (9) drives the test body (1) to drop.

2. The optoelectronic component overload test device under high-speed impact according to claim 1, wherein It further includes: A test cavity (3), within which there is a first cavity (31); An end cover body, which is disposed in the first cavity (31) and includes a left end cover (41) and a right end cover (42) distributed along the first direction; on the side where the left end cover (41) and the right end cover (42) are close to each other, there is a first groove, and a fourth space (43) is formed between the two first grooves; A second housing body (44), which is placed in the fourth space (43), and both ends thereof are respectively connected to the left end cover (41) and the right end cover (42). Inside the second housing body (44), a fifth space (441) and a sixth space (442) are distributed along the first direction; the test body (1) is disposed in the fifth space (441), and its outer wall is closely attached to the inner wall of the second housing body (44); The second load measurement component (5) is arranged in the sixth space (442), in the middle of the left end cover (41), and is coaxially arranged with the test body (1); The impact shell (6) is arranged on the left end cover (41) away from the right end cover (42), and its outer wall is closely attached to the inner wall of the first cavity (31); The pneumatic driving component is used to drive the left end cover (41) where the impact shell (6) is located to apply a high-speed impact force to the end away from the right end cover (42).

3. The high-speed impact optoelectronic component overload test device according to claim 2, characterized in that, A first buffer component (71) is arranged between the left end cover (41) and the impact shell (6).

4. The high-speed impact optoelectronic component overload test device according to claim 2, characterized in that, A second buffer component (72) is arranged between the outer wall of the first housing body (11) and the inner wall of the second housing body (44).

5. The high-speed impact optoelectronic component overload test device according to claim 2, characterized in that, A sound absorption component (8) is sleeved outside the test cavity (3).

6. The optoelectronic component overload test device under high - altitude impact according to claim 2, characterized in that, A third buffer component (73) is arranged between the end of the right end cover (43) away from the left end cover (42) and the inner wall of the first cavity (31).

7. The optoelectronic component overload test device under high-speed impact according to claim 1, wherein A load amplification component (200) is arranged on the dropping body (9), and the test body (1) is arranged on the side of the load amplification component (200) away from the dropping body (9).

8. The optoelectronic component overload test device under high-speed impact according to claim 7, characterized in that An installation block (300) is arranged on the load amplification component (200). The test body (1) is installed on the side of the installation block (300) away from the load amplification component (200). A third load measurement component (400) is also arranged on the installation block (300), and the third load measurement component (400) is arranged on one side of the test body (1).

9. A damage assessment method for an overload test device of an optoelectronic component under high-speed impact as described in any one of claims 1-8, characterized in that, It includes the following steps: S100: Install the optoelectronic component (2) into the test body (1); S101: Apply a high-speed impact force to the test body (1); S102: Obtain the load value measured by the first load measurement component (16) through the load acquisition component, which is the first load value; S103: Take out the optoelectronic component (2) and observe the damage condition of the optoelectronic component (2); S104: Repeat steps S100 - S103 to obtain a damage correspondence table; the damage correspondence table includes the first load value and the corresponding damage condition.

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