Wafer overturning detection device

Abstract

The invention discloses a wafer overturning detection device. The wafer overturning detection device comprises a grabbing mechanism, an overturning mechanism and a detection mechanism. The grabbing mechanism comprises two mechanical arms. The turnover mechanism comprises a turnover platform and a turnover motor. The overturning platform is fixedly connected to an output shaft of the overturning motor, and the output shaft of the overturning motor extends in the first direction. The detection mechanism comprises a camera, a bearing assembly, a first light source assembly, a second light source assembly and a moving assembly; the detection mechanism is located on one side of the turnover mechanism in the second direction. The bearing assembly comprises a mounting plate and a plurality of bearing blocks; a through hole is formed in the mounting plate, and the multiple bearing blocks are arranged in the circumferential direction of the through hole at intervals; when the bearing block is located at the extending position, the minimum distance from the bearing block to the center of the through hole is smaller than the radius of the wafer to be detected; when one bearing block is located at the retraction position, at least three bearing blocks are located at the extension position; the moving assembly is connected with the mounting plate. According to the wafer overturning detection device, non-shielding detection can be realized, the detection efficiency can be improved, and over-high cost can be avoided.

Description

Technical Field

[0001] This specification relates to the technical field of wafer detection, and particularly to a wafer flipping detection device. Background Art

[0002] A wafer refers to a circular silicon wafer or substrate used in semiconductor processes, also known as a silicon wafer or substrate. It is the basic material for manufacturing integrated circuits. Wafers are generally made of single-crystalline silicon material and have a very flat surface. The process of manufacturing wafers is called wafer manufacturing or semiconductor manufacturing, which involves multiple process steps such as wafer growth, cutting, polishing, and cleaning. On the wafer, various components and layers of integrated circuits can be manufactured through process steps such as lithography, thin-film deposition, ion implantation, diffusion, and metal deposition. Multiple chips can be manufactured on one wafer, and each chip can be used as an independent IC product through cutting and packaging. Wafer manufacturing is a crucial step in the semiconductor industry, affecting the quality, efficiency, and cost of integrated circuits. After wafer manufacturing is completed, the wafers need to be inspected. Wafer inspection is the core link in semiconductor manufacturing to ensure chip quality and yield, involving multi-dimensional technologies such as physical defect identification, dimensional measurement, and electrical performance testing.

[0003] In the prior art, when inspecting wafers, it is often necessary to clamp or support the wafers, which results in at least partial occlusion of the wafers. The occluded parts cannot be accurately inspected, leading to a decrease in inspection efficiency and affecting the inspection effect, and may cause the outflow of defective products. In addition, due to different requirements, some wafers need to be inspected on both sides, while some wafers only need to be inspected on one side. The cameras required for high-precision inspection are expensive, and setting up cameras on both sides will cause too high costs. [[ID=1S]]Summary of the Invention

[0004] In view of the deficiencies of the prior art, an object of this specification is to provide a wafer flipping detection device that can achieve unobstructed inspection, improve inspection efficiency, and avoid excessive costs.

[0005] To achieve the above object, an embodiment of this specification provides a wafer flipping detection device, including: A grasping mechanism, including two robotic arms, which are used to grasp and move the wafer to be inspected; A flipping mechanism located on one side of the grasping mechanism in a first direction, including a flipping platform and a flipping motor; the flipping platform is fixedly connected to the output shaft of the flipping motor, and the output shaft of the flipping motor extends along the first direction; The detection mechanism on the same side of the flipping mechanism as the grasping mechanism includes a camera, a bearing assembly, a first light source assembly, a second light source assembly, and a moving assembly; the detection mechanism is located on one side of the flipping mechanism in the second direction, and the first direction is perpendicular to the second direction; the camera is fixedly arranged; the bearing assembly is arranged below the camera and includes a horizontally arranged mounting plate and a plurality of bearing blocks movably arranged on the mounting plate; the mounting plate is provided with a through hole, and the plurality of bearing blocks are arranged at intervals in the circumferential direction of the through hole; the moving direction of the bearing block is parallel to the radial direction of the through hole; the bearing block has an extended position and a retracted position; when the bearing block is in the extended position, the minimum distance from the bearing block to the center of the through hole is less than the radius of the wafer to be measured; when the bearing block is in the retracted position, the minimum distance from the bearing block to the center of the through hole is greater than the radius of the wafer to be measured; the plurality of bearing blocks are configured such that when there is a bearing block in the retracted position, at least three bearing blocks are in the extended position; the first light source assembly and the second light source assembly are respectively arranged above and below the bearing assembly; the moving assembly is connected to the mounting plate and can drive the bearing assembly to move in the first direction and the second direction.

[0006] As a preferred embodiment, a connecting block is fixedly connected to the surface of the bearing block facing away from the center of the through hole, a fixing block and a guiding member are fixedly connected to the mounting plate, and the guiding member extends along the radial direction of the through hole; the connecting block is slidably connected to the guiding member; a spring is arranged between the connecting block and the fixing block; a limiting member is fixedly arranged on the connecting block and extends in a direction perpendicular to the radial direction of the through hole; a vertically extending rotating shaft is fixedly connected to the mounting plate; a connecting rod is rotatably connected to the rotating shaft, one end of the connecting rod abuts against one side of the limiting member close to the bearing block, and the other end is fixedly connected to the output end of the first driving member.

[0007] As a preferred embodiment, the number of the bearing blocks is six; the six bearing blocks are evenly distributed at intervals in the circumferential direction of the through hole and are symmetrically arranged in both the first direction and the second direction; the moving directions of the output ends of the plurality of first driving members are all parallel to the second direction.

[0008] As a preferred embodiment, an opening is arranged on one side of the mounting plate in the first direction, and the opening is communicated with the through hole.

[0009] As a preferred embodiment, the detection mechanism further includes a horizontally arranged first fixing plate and a support frame fixedly connected above the first fixing plate; the camera is fixedly connected to the support frame; the bearing assembly is slidably connected to the first fixing plate through the moving assembly; the moving assembly includes: Two first slide rails fixedly connected to the upper surface of the first fixed plate, the first slide rails extending along the first direction; the two first slide rails are spaced apart in the second direction; A connecting plate slidably connected to the two first slide rails; A second driving member connected to the connecting plate for driving the connecting plate to move along the first direction; A second slide rail fixedly connected to the upper surface of the connecting plate, the second slide rail extending along the second direction; the mounting plate is slidably connected to the second slide rail; A third driving member connected to the mounting plate for driving the mounting plate to move along the second direction.

[0010] As a preferred embodiment, the first light source assembly is connected to the support frame through a first adjustable bracket; the second light source assembly is connected to the first fixed plate through a second adjustable bracket; the light rays of the first light source assembly illuminating the upper surface of the wafer to be measured are offset from the light rays of the second light source assembly illuminating the lower surface of the wafer to be measured.

[0011] As a preferred embodiment, the flipping mechanism further includes a horizontally arranged second fixed plate, the second fixed plate being aligned with the first fixed plate; the fixed end of the flipping motor is fixedly connected to the upper surface of the second fixed plate.

[0012] As a preferred embodiment, the second fixed plate is further provided with a position correction assembly, including a turntable for carrying the wafer to be measured and a rotating motor connected to the turntable, the turntable being horizontally arranged, and the rotating motor being used for driving the turntable to rotate around the vertical direction.

[0013] As a preferred embodiment, the position correction assembly is located below the flipping platform; a plurality of support columns are fixedly provided on the second fixed plate, and the top of the support columns is connected with a horizontally arranged protection plate, and the protection plate is located between the flipping platform and the position correction assembly.

[0014] As a preferred embodiment, the bottom of the grasping mechanism is connected to a third slide rail, the third slide rail extending along the second direction; the grasping planes of the two robotic arms are at different heights. Beneficial effects

[0015] The wafer flipping detection device provided by this embodiment is provided with a detection mechanism including a camera, a carrier assembly, a first light source assembly, a second light source assembly, and a moving assembly. By means of the first light source assembly above the carrier assembly and the second light source assembly below the carrier assembly, both the upper and lower sides of the wafer to be detected on the carrier assembly can be illuminated, so that the image captured by the camera can be clearer and the detection accuracy can be improved. By driving the carrier assembly to move in the first direction and the second direction through the moving assembly, different parts of the wafer to be detected can pass through the bottom of the camera in sequence, so as to realize the photographing detection of all positions on one side of the wafer to be detected.

[0016] When the position where the wafer to be detected contacts the carrier block is moved directly below the camera, the carrier block moves from the extended position to the retracted position along the radial direction, so that the contact and bearing state with the wafer to be detected changes to a separated state, and the bearing part will not block the second light source assembly. The camera can capture a clear image of the wafer to be detected without occlusion under the illumination of the first light source assembly and the second light source assembly, so as to realize occlusion-free detection and improve the detection accuracy.

[0017] At the same time, since multiple carrier blocks are configured such that when there is a carrier block in the retracted position, at least three carrier blocks are in the extended position. Even if some carrier blocks are in the retracted position in order to capture an unobstructed image, the other at least three carrier blocks in the extended position can stably carry the wafer to be detected, ensuring the sustainable progress of the detection process and improving the detection efficiency.

[0018] In addition, the wafer flipping detection device is provided with a grasping mechanism and a flipping mechanism. The wafer to be detected that needs to be flipped on the other side can be flipped through the flipping mechanism according to requirements, and the wafer to be detected can be moved to the flipping mechanism or the detection mechanism through the grasping mechanism, avoiding the high cost caused by setting two cameras. The grasping mechanism includes two robotic arms, which can greatly shorten the waiting time of the detection mechanism. When the detection of one wafer is completed, one robotic arm takes it out, and the other robotic arm can immediately place the next wafer to be detected on the carrier assembly, improving the detection efficiency.

[0019] Referring to the following description and the drawings, specific embodiments of the present invention are disclosed in detail, indicating the ways in which the principles of the present invention can be adopted. It should be understood that the embodiments of the present invention are not limited in scope thereby.

[0020] Features described and / or illustrated for one embodiment can be used in the same or similar way in one or more other embodiments, combined with the features in other embodiments, or replace the features in other embodiments.

[0021] It should be emphasized that the term "comprising / including" as used herein refers to the presence of features, whole parts, steps or components, but does not exclude the presence or addition of one or more other features, whole parts, steps or components. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0023] Figure 1 Schematic perspective view of a wafer flipping detection device provided in this embodiment; Figure 2 Schematic structural view of a grasping mechanism provided in this embodiment; Figure 3 Schematic structural view of a flipping mechanism provided in this embodiment; Figure 4 Schematic structural view of a detection mechanism provided in this embodiment; Figure 5 Schematic structural view of a carrier component provided in this embodiment; Figure 6 Top view of a carrier component provided in this embodiment; Figure 7 Schematic structural view between a carrier block and a first driving member provided in this embodiment; Figure 8 Schematic structural view of a moving component provided in this embodiment.

[0024] Description of the reference numerals: 1. Grasping mechanism; 11. Robot arm; 12. Third slide rail; 2. Flipping mechanism; 21. Flipping platform; 22. Flipping motor; 23. Second fixing plate; 24. Position correction component; 241. Turntable; 25. Support column; 26. Protective plate; 3. Detection mechanism; 31. Camera; 32. Carrying component; 321. Mounting plate; 3211. Through hole; 3212. Opening; 322. Carrying block; 3221. Carrying surface; 3222. Inclined surface; 323. Connecting block; 324. Fixed block; 325. Guide; 326. Spring; 327. Limiting member; 328. Rotating shaft; 329. Link; 3210. First driving member; 33. First light source assembly; 331. First adjustable bracket; 34. Second light source assembly; 341. Second adjustable bracket; 35. Moving component; 351. First slide rail; 352. Connecting plate; 353. Second driving member; 354. Second slide rail; 355. Third driving member; 356. Intermediate plate; 36. First fixing plate; 37. Support frame; 10. Wafer to be measured; F. Radial direction; X. First direction; Y. Second direction; Z. Vertical direction. Detailed implementation manners

[0025] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0026] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation manners.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this invention belongs. The terms used herein in the description of the present invention are only for the purpose of describing specific implementation manners and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items.

[0028] Please refer to Figures 1 to 8 This application embodiment provides a wafer flipping and detecting device, including: a grasping mechanism 1, a flipping mechanism 2 and a detecting mechanism 3.

[0029] Among them, as Figure 1As shown, the grasping mechanism 1 includes two robotic arms 11, which are used to grasp and move the wafer 10 to be measured. The flipping mechanism 2 is located on one side of the grasping mechanism 1 in the first direction X and includes a flipping platform 21 and a flipping motor 22. The flipping platform 21 is fixedly connected to the output shaft of the flipping motor 22, and the output shaft of the flipping motor 22 extends along the first direction X. The flipping platform 21 is horizontally arranged, and the flipping motor 22 is used to drive the flipping platform 21 to rotate 180° so that the front side or the back side of the wafer 10 to be measured faces upward. The detection mechanism 3 is located on the same side of the grasping mechanism 1 as the flipping mechanism 2. The detection mechanism 3 is located on one side of the flipping mechanism 2 in the second direction Y. The first direction X and the second direction Y are two mutually perpendicular directions in the horizontal plane, and both the first direction X and the second direction Y are perpendicular to the vertical direction Z.

[0030] As Figures 4 to 8 shown, the detection mechanism 3 includes a camera 31, a bearing assembly 32, a first light source assembly 33, a second light source assembly 34, and a moving assembly 35. The camera 31 is fixedly arranged. The bearing assembly 32 is used to bear the wafer 10 to be measured. The bearing assembly 32 is arranged below the camera 31. As Figure 5 shown, the bearing assembly 32 includes a horizontally arranged mounting plate 321 and a plurality of bearing blocks 322 movably arranged on the mounting plate 321. The mounting plate 321 is provided with a through hole 3211, and the plurality of bearing blocks 322 are arranged at intervals in the circumferential direction of the through hole 3211. The moving direction of the bearing blocks 322 is parallel to the radial direction F of the through hole 3211. The bearing blocks 322 have an extended position and a retracted position. When the bearing blocks 322 are in the extended position, the minimum distance from the bearing blocks 322 to the center of the through hole 3211 is less than the radius of the wafer 10 to be measured, and at this time, the bearing blocks 322 can bear the wafer 10 to be measured. When the bearing blocks 322 are in the retracted position, the minimum distance from the bearing blocks 322 to the center of the through hole 3211 is greater than the radius of the wafer 10 to be measured, and at this time, the bearing blocks 322 are separated from the wafer 10 to be measured. The plurality of bearing blocks 322 are configured such that when there is a bearing block 322 in the retracted position, at least three bearing blocks 322 are in the extended position. The first light source assembly 33 and the second light source assembly 34 are respectively arranged above and below the bearing assembly 32. The moving assembly 35 is connected to the mounting plate 321 and can drive the bearing assembly 32 to move in the first direction X and the second direction Y.

[0031] The wafer flipping detection device provided in this embodiment is provided with a detection mechanism 3 including a camera 31, a carrying component 32, a first light source component 33, a second light source component 34, and a moving component 35. By means of the first light source component 33 above the carrying component 32 and the second light source component 34 below the carrying component 32, both the upper and lower sides of the wafer 10 to be measured on the carrying component 32 can be illuminated, so that the image captured by the camera 31 can be clearer and the detection accuracy can be improved. By driving the carrying component 32 to move in the first direction X and the second direction Y through the moving component 35, different parts of the wafer 10 to be measured can pass through the bottom of the camera 31 in sequence, so as to realize the photographing detection of all positions on one side of the wafer 10 to be measured.

[0032] When the position where the wafer 10 to be measured contacts the carrying block 322 is moved to directly below the camera 31, the carrying block 322 moves from the extended position to the retracted position along the radial direction F, so that the contact state with the wafer 10 to be measured changes from the contact carrying state to the separated state, and the carrying part will not block the second light source component 34. The camera 31 can capture a clear image of the wafer 10 to be measured without obstruction under the illumination of the first light source component 33 and the second light source component 34, so as to realize unobstructed detection and improve the detection accuracy.

[0033] At the same time, since multiple carrying blocks 322 are configured such that when there is a carrying block 322 in the retracted position, at least three carrying blocks 322 are in the extended position. Even if some carrying blocks 322 are in the retracted position for taking unobstructed images, at least three other carrying blocks 322 in the extended position can realize the stable carrying of the wafer 10 to be measured, ensure the sustainable progress of the detection process, and improve the detection efficiency.

[0034] In addition, the wafer flipping detection device is provided with a grasping mechanism 1 and a flipping mechanism 2. The wafer 10 to be measured that needs to be detected on the other side can be flipped by the flipping mechanism 2 according to requirements, and the wafer 10 to be measured can be moved to the flipping mechanism 2 or the detection mechanism 3 by the grasping mechanism 1, avoiding the high cost caused by setting two cameras 31. The grasping mechanism 1 includes two robotic arms 11, which can greatly shorten the waiting time of the detection mechanism 3. When the detection of one wafer is completed, one of the robotic arms 11 takes it out, and the other robotic arm 11 can immediately place the next wafer 10 to be measured on the carrying component 32, improving the detection efficiency.

[0035] In this embodiment, as Figure 7As shown, a connecting block 323 is fixedly connected to the side of the supporting block 322 facing away from the center of the through hole 3211, and a fixing block 324 and a guide member 325 are fixedly connected to the mounting plate 321. The guide member 325 extends along the radial direction F of the through hole 3211. The connecting block 323 is slidably connected to the guide member 325. A spring 326 is provided between the connecting block 323 and the fixing block 324. Under the action of the spring 326, the supporting block 322 is in the extended position. By driving the connecting block 323 by an external force, the connecting block 323 moves along the guide member 325 away from the center of the through hole 3211, compressing the spring 326, and the supporting block 322 can be placed in the retracted position. When the external force is removed, the compressed spring 326 will reset, and under the push of the spring 326, the supporting block 322 returns to the extended position.

[0036] Specifically, a limit member 327 is fixedly provided on the connecting block 323, and the limit member 327 extends in a direction perpendicular to the radial direction F of the through hole 3211. A vertically extending rotating shaft 328 is fixedly connected to the mounting plate 321. The rotating shaft 328 is rotatably connected to a connecting rod 329, and the rotating shaft 328 is roughly located at the center of the connecting rod 329. The connecting rod 329 can rotate around the rotating shaft 328. One end of the connecting rod 329 abuts against the side of the limit member 327 close to the supporting block 322, and the other end is fixedly connected to the output end of the first driving member 3210. The first driving member 3210 is used to drive one end of the connecting rod 329 to move, so that the connecting rod 329 rotates, and the end of the connecting rod 329 abutting against the limit member 327 moves accordingly, thereby applying an external force to the connecting block 323, thereby moving the supporting block 322 from the extended position to the retracted position. By driving the bearing block 322 by means of the first driving member 3210 and the connecting rod 329, the space on the mounting plate 321 can be reasonably utilized. Preferably, the first driving member 3210 is a cylinder.

[0037] Multiple first driving members 3210 can all be electrically connected to the controller, and the controller is electrically connected to the moving component 35. In the process of the moving component 35 driving the supporting component 32 to move, when the position where the wafer to be tested 10 contacts the supporting block 322 is directly below the camera 31, the first driving member 3210 corresponding to the supporting block 322 is started, causing the supporting block 322 to retract and separate from the wafer to be tested 10; when the position where the wafer to be tested 10 contacts the supporting block 322 is not directly below the camera 31, the first driving member 3210 is reset, releasing the force of the connecting rod 329 on the limit member 327, and under the reset force of the spring 326, the supporting block 322 returns to the extended position.

[0038] In this embodiment, an opening 3212 is provided on one side of the mounting plate 321 in the first direction X. The opening 3212 communicates with the through hole 3211. This opening 3212 can reserve sufficient feeding space for the robotic arm 11, facilitating the robotic arm 11 to move the wafer 10 to be measured to the position of the through hole 3211 and place it on a plurality of carrier blocks 322.

[0039] Specifically, the number of carrier blocks 322 is at least four. In a preferred embodiment, the number of carrier blocks 322 is six. When one of the carrier blocks 322 moves to the position directly below the camera 31 and switches to the retracted position, the remaining five carrier blocks 322 can stably support the wafer 10 to be measured.

[0040] As Figure 6 shown, the six carrier blocks 322 are evenly spaced in the circumferential direction of the through hole 3211 and are symmetrically arranged in both the first direction X and the second direction Y. Since the opening 3212 is located on one side of the mounting plate 321 in the first direction X, two carrier blocks 322 are respectively located at both ends of the diameter of the through hole 3211 extending in the second direction Y, and two carrier blocks 322 are located on both sides of the opening 3212. The included angle between the center lines connecting adjacent two carrier blocks 322 and the center of the through hole 3211 is 60°.

[0041] Preferably, the moving directions of the output ends of the plurality of first driving members 3210 are all parallel to the second direction Y, which is convenient for the layout and control of the plurality of first driving members 3210.

[0042] As Figure 7 shown, a bearing surface 3221 for bearing the wafer 10 to be measured is provided at the bottom of the carrier block 322. The bearing surface 3221 is horizontally arranged, and the bearing surfaces 3221 of the plurality of carrier blocks 322 are located in the same plane. One end of the bearing surface 3221 facing the center of the through hole 3211 is connected with an inclined surface 3222. The inclined surface 3222 is not higher than the bearing surface 3221. This inclined surface 3222 can prevent the right-angle edge of the bearing surface 3221 from scratching and damaging the wafer 10 to be measured.

[0043] In this embodiment, as Figure 4 shown, the detection mechanism 3 further includes a horizontally arranged first fixing plate 36 and a support frame 37 fixedly connected above the first fixing plate 36. The detection mechanism 3 can be installed on a specific working surface through the first fixing plate 36. The camera 31 is fixedly connected to the support frame 37, which can avoid the vibration caused by movement and ensure the accuracy of detection. The carrier assembly 32 is slidably connected to the first fixing plate 36 through the moving assembly 35.

[0044] Specifically, as Figure 8As shown, the moving assembly 35 includes two first slide rails 351, a connecting plate 352, a second driving member 353, a second slide rail 354, and a third driving member 355. The two first slide rails 351 are fixedly connected to the upper surface of the first fixed plate 36. The first slide rails 351 extend along the first direction X. The two first slide rails 351 are spaced apart in the second direction Y. The connecting plate 352 is slidably connected to the two first slide rails 351. The second driving member 353 is connected to the connecting plate 352 and is used to drive the connecting plate 352 to move along the first direction X. The second slide rail 354 is fixedly connected to the upper surface of the connecting plate 352. The second slide rail 354 extends along the second direction Y. The mounting plate 321 is slidably connected to the second slide rail 354 via the intermediate plate 356. The third driving member 355 is connected to the mounting plate 321 and is used to drive the intermediate plate 356 to cause the mounting plate 321 to move along the second direction Y.

[0045] In this embodiment, the first light source assembly 33 is connected to the support frame 37 via a first adjustable bracket 331. By adjusting the angle between the first adjustable bracket 331 and the horizontal plane, the angle of the first light source assembly 33 can be adjusted. The second light source assembly 34 is connected to the first fixing plate 36 via a second adjustable bracket 341. By adjusting the angle between the second adjustable bracket 341 and the horizontal plane, the angle of the second light source assembly 34 can be adjusted.

[0046] Preferably, the light irradiated by the first light source component 33 on the upper surface of the wafer 10 to be tested is staggered with the light irradiated by the second light source component 34 on the lower surface of the wafer 10 to be tested, that is, the two are located in different vertical planes, so that the irradiated light of the two light source components will not interfere with each other, which can ensure the clarity of the image taken by the camera 31, thereby improving the accuracy of the inspection.

[0047] In this embodiment, if Figure 3 As shown, the flip mechanism 2 also includes a horizontally disposed second fixing plate 23, which is aligned with the first fixing plate 36. Preferably, the second fixing plate 23 is fixedly connected to the first fixing plate 36, which makes the entire device more compact and shortens the travel distance of the robotic arm 11. The fixed end of the flip motor 22 is fixedly connected to the upper surface of the second fixing plate 23.

[0048] Preferably, a position correction assembly 24 is further provided on the second fixing plate 23, comprising a turntable 241 for supporting the wafer 10 to be tested and a rotary motor connected to the turntable 241. The turntable 241 is arranged horizontally, and the rotary motor is used to drive the turntable 241 to rotate about the vertical direction Z, thereby adjusting the wafer 10 to be tested to a desired position within the horizontal plane.

[0049] Specifically, the position correction component 24 is located below the flipping platform 21, making the device structure more compact and shortening the moving distance of the robotic arm 11. A plurality of support columns 25 are fixedly arranged on the second fixing plate 23, and the top of the support column 25 is connected with a horizontally arranged protective plate 26. The protective plate 26 is located between the flipping platform 21 and the position correction component 24, which can prevent the wafer from falling onto the position correction component 24 in case the flipping platform 21 fails.

[0050] As Figure 2 shown, the bottom of the grasping mechanism 1 is connected to the third slide rail 12, and the third slide rail 12 extends along the second direction Y, so that the grasping mechanism 1 can move back and forth between the flipping mechanism 2 and the detection mechanism 3. The two robotic arms 11 can be connected to the same vertical rail or different vertical rails to achieve lifting. The grasping planes of the two robotic arms 11 are at different heights to avoid interference.

[0051] In a specific application scenario, if only the front side of the wafer needs to be detected, the robotic arm 11 first moves the wafer 10 to be measured to the position correction component 24. After completing the position correction, the robotic arm 11 moves the wafer 10 to be measured to the bearing component 32 for wafer detection. After the detection is completed, the robotic arm 11 takes away the wafer.

[0052] If only the back side of the wafer needs to be detected, the robotic arm 11 first moves the wafer 10 to be measured to the flipping platform 21. After completing the flipping of the wafer, the robotic arm 11 moves the wafer 10 to be measured to the position correction component 24. After completing the position correction, the robotic arm 11 moves the wafer 10 to be measured to the bearing component 32 for wafer detection. After the detection is completed, the robotic arm 11 takes away the wafer.

[0053] If both the front and back sides of the wafer need to be detected, the robotic arm 11 first moves the wafer 10 to be measured to the position correction component 24. After completing the position correction, the robotic arm 11 moves the wafer 10 to be measured to the bearing component 32 for wafer detection. After the detection is completed, the robotic arm 11 moves the wafer to the flipping platform 21. After completing the flipping of the wafer, the robotic arm 11 moves the wafer 10 to be measured to the bearing component 32 for wafer detection. After the detection is completed, the robotic arm 11 takes away the wafer.

[0054] It should be noted that in the description of this specification, the terms "first", "second", etc. are only used for descriptive purposes and to distinguish similar objects, and there is no sequence between them, nor can they be understood as indicating or implying relative importance. In addition, in the description of this specification, unless otherwise stated, the meaning of "a plurality" is two or more.

[0055] Any numerical values recited herein include all values from the lower value to the upper value incremented by one unit therebetween, provided that there is a separation of at least two units between any lower value and any higher value. For example, if a value for the number of components or for a process variable (such as temperature, pressure, time, etc.) is recited as being from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, it is intended that values such as 15 to 85, 22 to 68, 43 to 51, 30 to 32, etc. are also expressly recited in this specification. For values less than 1, one unit is suitably considered to be 0.0001, 0.001, 0.01, 0.1. These are merely examples of what is intended to be clear, and all possible combinations of numerical values recited between the lowest value and the highest value are to be considered to be expressly stated in this specification in a similar manner.

[0056] Unless otherwise indicated, all ranges include the endpoints and all numbers therebetween. The term “about” or “approximate” when used in connection with a range is to be construed as appropriate for the two endpoints of that range. Thus, “about 20 to 30” is intended to cover “about 20 to about 30”, inclusive of the recited endpoints.

[0057] All articles and references, including patent applications and publications, are incorporated herein by reference for various purposes. The term “consisting essentially of” in describing a combination shall include the recited elements, ingredients, components, or steps and other elements, ingredients, components, or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms “comprising” or “including” to describe the combinations of elements, ingredients, components, or steps herein also contemplates embodiments consisting essentially of these elements, ingredients, components, or steps. By using the term “may” herein, it is intended to indicate that any of the attributes so-described as “may” include are optional.

[0058] A plurality of elements, ingredients, components, or steps can be provided by a single integrated element, ingredient, component, or step. Alternatively, a single integrated element, ingredient, component, or step can be divided into separate plural elements, ingredients, components, or steps. The disclosure of the term “a” or “an” to describe an element, ingredient, component, or step is not intended to foreclose other elements, ingredients, components, or steps.

[0059] It should be understood that the above description is for illustrative purposes and not for limitation. Upon reading the above description, many embodiments and many applications other than the examples provided will be apparent to those skilled in the art. Accordingly, the scope of the present teachings should not be determined with reference to the above description, but should be determined with reference to the appended claims and the full scope of equivalents to which such claims are entitled. For the purposes of completeness, all articles and references, including patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein from the foregoing claims is not a waiver of that subject matter, nor should it be considered that the inventors did not consider that subject matter to be part of the disclosed inventive subject matter.

Claims

1. A wafer flipping detection device, characterized in that, Including: A grasping mechanism, including two robotic arms for grasping and moving a wafer to be measured; A flipping mechanism located on one side of the grasping mechanism in a first direction, including a flipping platform and a flipping motor; the flipping platform is fixedly connected to the output shaft of the flipping motor, and the output shaft of the flipping motor extends along the first direction; A detection mechanism on the same side of the grasping mechanism as the flipping mechanism, including a camera, a bearing assembly, a first light source assembly, a second light source assembly, and a moving assembly; the detection mechanism is located on one side of the flipping mechanism in a second direction, and the first direction is perpendicular to the second direction; the camera is fixedly arranged; the bearing assembly is arranged below the camera and includes a horizontally arranged mounting plate and a plurality of bearing blocks movably arranged on the mounting plate; the mounting plate is provided with a through hole, and the plurality of bearing blocks are arranged at intervals in the circumferential direction of the through hole; the moving direction of the bearing block is parallel to the radial direction of the through hole; the bearing block has an extended position and a retracted position; when the bearing block is in the extended position, the minimum distance from the bearing block to the center of the through hole is less than the radius of the wafer to be measured; when the bearing block is in the retracted position, the minimum distance from the bearing block to the center of the through hole is greater than the radius of the wafer to be measured; the plurality of bearing blocks are configured such that when there is a bearing block in the retracted position, at least three bearing blocks are in the extended position; the first light source assembly and the second light source assembly are respectively arranged above and below the bearing assembly; the moving assembly is connected to the mounting plate and can drive the bearing assembly to move in the first direction and the second direction.

2. The wafer flipping detection device according to claim 1, wherein A connecting block is fixedly connected to the surface of the bearing block facing away from the center of the through hole, a fixed block and a guiding member are fixedly connected to the mounting plate, and the guiding member extends along the radial direction of the through hole; the connecting block is slidably connected to the guiding member; a spring is arranged between the connecting block and the fixed block; a limiting member is fixedly arranged on the connecting block and extends in a direction perpendicular to the radial direction of the through hole; a vertically extending rotating shaft is fixedly connected to the mounting plate; a connecting rod is rotatably connected to the rotating shaft, one end of the connecting rod abuts against the side of the limiting member close to the bearing block, and the other end is fixedly connected to the output end of the first driving member.

3. The wafer flipping detection device according to claim 2, wherein The number of the bearing blocks is six; the six bearing blocks are evenly distributed at intervals in the circumferential direction of the through hole and are symmetrically arranged in both the first direction and the second direction; the moving directions of the output ends of the plurality of first driving members are all parallel to the second direction.

4. The wafer flipping detection device according to claim 1, characterized in that, An opening is arranged on one side of the mounting plate in the first direction, and the opening is communicated with the through hole.

5. The wafer flipping detection device according to claim 1, wherein The detection mechanism further includes a horizontally arranged first fixing plate and a support frame fixedly connected above the first fixing plate; the camera is fixedly connected to the support frame; The bearing assembly is slidably connected to the first fixing plate through the moving assembly; The moving assembly includes: Two first sliding rails fixedly connected to the upper surface of the first fixing plate, and the first sliding rails extend along the first direction; the two first sliding rails are arranged at intervals in the second direction; A connecting plate slidably connected to the two first slide rails; A second driving member connected to the connecting plate for driving the connecting plate to move in the first direction; A second slide rail fixedly connected to the upper surface of the connecting plate, the second slide rail extending in the second direction; the mounting plate is slidably connected to the second slide rail; A third driving member connected to the mounting plate for driving the mounting plate to move in the second direction.

6. The wafer flipping detection device according to claim 5, wherein The first light source assembly is connected to the support frame through a first adjustable bracket; the second light source assembly is connected to the first fixing plate through a second adjustable bracket; the light from the first light source assembly illuminating the upper surface of the wafer to be measured is offset from the light from the second light source assembly illuminating the lower surface of the wafer to be measured.

7. The wafer flipping detection device according to claim 5, wherein The flipping mechanism further includes a horizontally arranged second fixing plate, the second fixing plate being aligned with the first fixing plate; the fixed end of the flipping motor is fixedly connected to the upper surface of the second fixing plate.

8. The wafer flipping detection device according to claim 7, wherein, A position correction assembly is further provided on the second fixing plate, including a turntable for carrying the wafer to be measured and a rotating motor connected to the turntable, the turntable being horizontally arranged, and the rotating motor being used for driving the turntable to rotate around the vertical direction.

9. The wafer flipping detection device according to claim 8, wherein The position correction assembly is located below the flipping platform; a plurality of support columns are fixedly provided on the second fixing plate, and the top of the support columns is connected with a horizontally arranged protective plate, and the protective plate is located between the flipping platform and the position correction assembly.

10. The wafer flipping detection device according to claim 1, wherein, The bottom of the grasping mechanism is connected to a third slide rail, the third slide rail extending in the second direction; the grasping planes of the two robotic arms are at different heights.

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